JP2804084B2 - Blind wiring board and manufacturing method thereof - Google Patents
Blind wiring board and manufacturing method thereofInfo
- Publication number
- JP2804084B2 JP2804084B2 JP1141013A JP14101389A JP2804084B2 JP 2804084 B2 JP2804084 B2 JP 2804084B2 JP 1141013 A JP1141013 A JP 1141013A JP 14101389 A JP14101389 A JP 14101389A JP 2804084 B2 JP2804084 B2 JP 2804084B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- hole
- wiring board
- covered
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はプリント配線板に関するものであり、特に面
付部品及び挿入部品が混在したプリント配線板及びその
製造方法に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly to a printed wiring board in which imposed components and insertion components are mixed, and a method of manufacturing the same.
（従来技術１） 従来、面付部品と挿入部品とが混在するプリント配線
板は、第４図に示す様にスルーホール部３と面付ランド
部17とが備えられている。ここで、面付部品18と挿入部
品19（第８図Ｉ参照）とは同時にはんだ付けできないた
め、第５図Ａ〜Ｃに示す工程で行なわれる。第５図Ａは
第４図の正面図であり、まず第５図Ｂの工程では、面付
ランド部17においてはんだペースト20により面付部品18
のはんだ付を行なう。しかし、この第５図Ｂの工程にお
ける過熱により、スルーホール部３の銅箔表面が酸化す
るため、第５図Ｃに示す工程の挿入部品19のはんだ付け
において、はんだ５のフローアップ不足21やブローホー
ル22等のはんだ付不良が発生しやすかった。(Prior Art 1) Conventionally, a printed wiring board in which surface-mounted components and insertion components are mixed has a through-hole portion 3 and a surface-mounted land portion 17 as shown in FIG. Here, since the surface-attached component 18 and the insertion component 19 (see FIG. 8I) cannot be soldered at the same time, they are performed in the steps shown in FIGS. FIG. 5A is a front view of FIG. 4. First, in the step of FIG.
Soldering. However, since the copper foil surface of the through-hole portion 3 is oxidized due to overheating in the step of FIG. 5B, in the soldering of the insert 19 in the step of FIG. Soldering defects such as blow holes 22 were likely to occur.
（従来技術２） また第６図及び第７図Ａに示す様に、予めパターン全
体にはんだめっきあるいははんだコーティング５を行な
い、スルーホール部３のむかえはんだとなる構造もあ
る。しかし、面付ランド部17にはんだ５が予め付いてい
る状態では、第７図Ｂに示す様に、はんだがはじかれて
接続不良となる現象（ウィッキング25）が発生しやすく
なる。(Prior Art 2) As shown in FIG. 6 and FIG. 7A, there is also a structure in which solder plating or solder coating 5 is previously performed on the entire pattern to form a solder for the through hole portion 3. However, in a state where the solder 5 is attached to the land portion 17 with the surface in advance, as shown in FIG. 7B, a phenomenon that the solder is repelled and a connection failure occurs (wicking 25) is likely to occur.
基板表面の銅箔パターンの上に設けられた半田めっき
層の一部を除去した構造が特開昭61−125196号公報に記
載されているが、前記問題を解決するものでない。JP-A-61-125196 discloses a structure in which a part of a solder plating layer provided on a copper foil pattern on a substrate surface is removed, but does not solve the above problem.
以上のように、従来技術１においては、面付実装の加
熱工程により銅表面が酸化し、次のはんだ付きフローア
ップ工程でスルーホールのはんだ付け性が劣化し、また
従来技術２においては、面付実装の際にはんだペースト
のはじきが発生し接続不良となる問題があった。As described above, in the prior art 1, the copper surface is oxidized by the surface mounting heating step, and the solderability of the through-holes is degraded in the subsequent soldering flow-up step. At the time of mounting, there is a problem that repelling of the solder paste occurs and a connection failure occurs.
本発明は、このような問題点を同時に解決するプリン
ト配線板及びその製造方法を提供することを目的とす
る。An object of the present invention is to provide a printed wiring board and a method for manufacturing the same, which simultaneously solve such problems.
上記目的は、スルーホール部ははんだで被覆し、面付
ランド部ははんだで被覆しないことによって達成され
る。The above object is achieved by covering the through hole with solder and not covering the land with surface with solder.
上記プリント配線板の構造は、スルーホール部のみは
んだで被覆されているため、面付部品実装の加熱工程に
より銅表面が酸化し、次のはんだ付けフローアップ工程
でスルーホールのはんだ付け性が劣化するという問題を
解決できる。また、面付ランド部ははんだで被覆されて
いないため、面付実装の際にはんだペーストのはじきが
発生し接続不良となる問題を解決できる。In the above printed wiring board structure, only the through-holes are covered with solder, so the copper surface is oxidized by the heating process for mounting the surface-mounted components, and the solderability of the through-holes deteriorates in the next soldering flow-up process Problem can be solved. In addition, since the land portion with the surface is not covered with the solder, it is possible to solve the problem that the solder paste is repelled during the surface mounting and the connection is poor.
以下本発明の一実施例を第１図Ｉにより説明する。第
１図Ｉは本発明によるプリント配線板の概略図であり、
以下その内容を説明する。An embodiment of the present invention will be described below with reference to FIG. FIG. 1 is a schematic view of a printed wiring board according to the present invention;
The contents will be described below.
銅張り積層板あるいはすでに内層回路を積層プレスさ
れた多層板に穴あけした後、スルーホール内を含む全表
面に化学銅めっきのみでまたは化学銅めっき上へ電気銅
めっきを１μｍ以土析出させ、フィルム状感光性レジス
トでスルーホールをおおう形状で露光，現像，エッチン
グ，剥離を行ない回路を形成した後、ソルダーレジスト
で必要部をコーティングし、はんだ不要部分をマスキン
グテープあるいは耐薬品性インクを印刷した後、露出し
ているランド部，スルーホール部に溶融はんだを0.1μ
ｍ以上付着させ、その後マスキングテープあるいは耐薬
品性インクを除去する。これによって、表面回路は銅
で、またランド部，スルーホール部ははんだが被された
第１図Ｉの構造を有するプリント配線板を得ることがで
きる。After drilling holes in a copper-clad laminate or a multilayer board that has already been press-laminated with an inner layer circuit, electrolytic copper plating is deposited on the entire surface including the inside of the through-hole by chemical copper plating alone or 1 μm or more of electrolytic copper plating on chemical copper plating. After forming a circuit by exposing, developing, etching, and stripping in a shape covering the through-holes with a photosensitive resist, coating the required parts with solder resist, and printing the masking tape or chemical resistant ink on the solder unnecessary parts 0.1μm of molten solder on exposed land and through hole
m or more, and then the masking tape or the chemical resistant ink is removed. This makes it possible to obtain a printed wiring board having the structure shown in FIG. 1 in which the surface circuit is made of copper, and the lands and through-holes are covered with solder.
本構造は、スルーホール部３にはんだめっき５が設け
られ、面付ランド部17は銅箔２が露出している。In this structure, the solder plating 5 is provided in the through-hole portion 3, and the copper foil 2 is exposed in the surface land portion 17.
この後の部品の実装工程としては、第１図Ｊに示すよ
うに、面付部品18を面付ランド部17にはんだ付けし、ま
た挿入部品19をスルーホール部３に挿入した後はんだ付
けする。よって挿入部品，面付部品のはんだ付け時に
は、面付ランド部47には銅箔２がまたスルーホール部３
にははんだめっき５が露出しているため、第５図C,第７
図Ｂに示す様なフローアップ不足21,ウィッキング25が
発生しなくなり、部品との接続信頼性が著しく向上でき
る。In the subsequent component mounting process, as shown in FIG. 1J, the surface-attached component 18 is soldered to the surface-attached land portion 17, and the insertion component 19 is inserted into the through-hole portion 3 and then soldered. . Therefore, at the time of soldering of the insertion component and the surface-mounted component, the copper foil 2 is further placed on the surface-mounted land portion 47 and the through-hole portion 3 is formed.
FIG. 5C, FIG.
Insufficient flow-up 21 and wicking 25 as shown in FIG. B do not occur, and connection reliability with components can be significantly improved.
以上詳しく説明したように本発明によれば、従来技術
において問題となっていたフローアップ不足（第５図
Ｃ）及びウィッキング（第７図Ｂ）が一挙に解消でき、
面付部品及び挿入部品を混載するプリント配線板におい
て両部品の接続信頼性を著しく向上せしめることができ
る。As described above in detail, according to the present invention, insufficient flow-up (FIG. 5C) and wicking (FIG. 7B), which are problems in the prior art, can be eliminated at once.
In a printed wiring board on which surface-mounted components and insertion components are mixed, the connection reliability of both components can be significantly improved.
第１図は本発明のプリント配線板の一実施例の回路形成
工程図であって、特に第１図I,Jはその外観図及び部品
実装図である。 第２図は基板とポジマスクの合わせ状態を示す外観図、
第３図は電着によるエッチングレジスト形成後の状態を
示す外観図である。 第４図は従来の銅箔露出プリント配線板の外観図、第５
図Ａ〜Ｃは第４図のプリント配線板のはんだ付けプロセ
ス概略図を示し、第５図Ａはプリント配線板の断面図、
第５図Ｂは面付部品のはんだ付けを示す断面図、第５図
Ｃは挿入部品のはんだ付けを示す断面図である。 第６図は従来のはんだ付着プリント配線板の外観図、第
７図A,Bは第６図のプリント配線板のはんだ付けプロセ
ス概略図を示し、第７図Ａはプリント配線板の断面図、
第７図Ｂは面付部品のはんだ付けを示す断面図である。 第８図は従来のプリント配線板の回路形成工程図であっ
て、特に第８図Ｉは理想的な部品実装図である。第９図
A,Bは各々フィルム型，電着型レジストによるパターン
の形成状態を示す外観図、第10図A,Bは電着型レジスト
を用いた場合の穴内露光を示す概略断面図で、第10図Ａ
は露光時，第10図Ｂは現像，エッチング後の状態を示す
断面図である。 （符号の説明） １……銅張り積層板、３……スルーホール、５……はん
だ、17……面付ランド部、18……面付部品、19……挿入
部品、20……はんだペースト、21……フローアップ不
足、22……ブローホール、25……ウィッキング、26……
ソルダーレジスト。FIG. 1 is a circuit forming process diagram of an embodiment of the printed wiring board of the present invention. In particular, FIGS. 1I and 1J are an external view and a component mounting diagram. FIG. 2 is an external view showing a state where the substrate and the positive mask are aligned,
FIG. 3 is an external view showing a state after forming an etching resist by electrodeposition. FIG. 4 is an external view of a conventional copper foil exposed printed wiring board, and FIG.
5A to 5C show schematic views of a soldering process of the printed wiring board of FIG. 4, and FIG.
FIG. 5B is a cross-sectional view showing soldering of the surface-mounted component, and FIG. 5C is a cross-sectional view showing soldering of the inserted component. FIG. 6 is an external view of a conventional solder-attached printed wiring board, FIGS. 7A and 7B are schematic views of a soldering process of the printed wiring board of FIG. 6, FIG. 7A is a cross-sectional view of the printed wiring board,
FIG. 7B is a cross-sectional view showing the soldering of the surface-mounted component. FIG. 8 is a diagram showing a circuit forming process of a conventional printed wiring board, and FIG. 8I is an ideal component mounting diagram. Fig. 9
A and B are external views showing the state of pattern formation by a film type and an electrodeposition type resist, respectively. FIGS. 10A and B are schematic sectional views showing exposure in a hole when an electrodeposition type resist is used. A
FIG. 10B is a sectional view showing a state after exposure and after development and etching. (Explanation of reference numerals) 1... Copper-clad laminate, 3... Through-hole, 5... Solder, 17... Land with surface, 18... Surface-mounted component, 19. , 21 ... low flow-up, 22 ... blowhole, 25 ... wicking, 26 ...
Solder resist.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 谷口 幸弘 神奈川県横浜市戸塚区戸塚町216番地 株式会社日立製作所戸塚工場内 (72)発明者 角屋 明由 神奈川県横浜市戸塚区戸塚町216番地 株式会社日立製作所戸塚工場内 (72)発明者 千野 貴之 神奈川県横浜市戸塚区戸塚町216番地 株式会社日立製作所戸塚工場内 (72)発明者 古川 正弘 神奈川県横浜市戸塚区戸塚町216番地 株式会社日立製作所戸塚工場内 (56)参考文献 特開 昭54−120866（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 1/11,3/42 H05K 3/34,3/24──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yukihiro Taniguchi 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the Totsuka Plant of Hitachi, Ltd. (72) Inventor Akiyoshi Tsunoya 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Stock (72) Inventor Takayuki Chino 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside Hitachi Hitachi, Ltd.Mitsuhiro Furukawa 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture (56) References JP-A-54-120866 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) H05K 1 / 11,3 / 42 H05K 3 / 34,3 /twenty four
Claims (2)
されてなるスルーホール部と、一部がはんだ被覆されて
いない表面回路部とを備えてなるプリント配線板におい
て、 前記はんだ被覆されていない表面回路部が面付部品実装
用の面付ランドを含むことを特徴とするプリント配線
板。1. A printed wiring board comprising: a through-hole portion in which copper on the inner surface of a through-hole is covered with solder; and a surface circuit portion in which a part is not covered with solder. A printed wiring board, wherein a circuit portion includes a land with a surface for mounting a surface-mounted component.
層プレスされた多層板に穴あけした後、スルーホール内
を含む全表面に化学銅めっきをまたは化学銅めっき上へ
電気銅めっきを１μｍ以上析出させ、フィルム状感光性
レジストでスルーホールをおおう形状で露光，現像，エ
ッチング，剥離を行ない回路を形成した後、ソルダーレ
ジストで必要部をコーティングし、はんだ不要部分をマ
スキングテープあるいは耐薬品性インクを印刷した後、
露出しているランド部，スルーホール部に溶融はんだを
0.1μｍ以上付着させ、その後マスキングテープあるい
は耐薬品性インクを除去することにより、スルーホール
部ははんだで被覆され、面付けランドを含む表面回路は
被覆されていないことを特徴とするプリント配線板の製
造方法。2. After drilling a hole in a copper-clad laminate or a multilayer board in which an internal circuit has already been laminated and pressed, 1 μm or more of electrolytic copper plating is deposited on the entire surface including the inside of the through-hole or on the chemical copper plating. After forming a circuit by exposing, developing, etching and stripping the film in a shape covering the through-hole with a photosensitive resist in the form of a film, coating the required parts with solder resist, and using masking tape or chemical resistant ink on the unnecessary parts After printing,
Apply molten solder to exposed lands and through holes
By attaching 0.1 μm or more and then removing the masking tape or the chemical resistant ink, the through-hole portion is covered with solder, and the surface circuit including the imposition land is not covered. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1141013A JP2804084B2 (en) | 1989-06-05 | 1989-06-05 | Blind wiring board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1141013A JP2804084B2 (en) | 1989-06-05 | 1989-06-05 | Blind wiring board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH036880A JPH036880A (en) | 1991-01-14 |
| JP2804084B2 true JP2804084B2 (en) | 1998-09-24 |
Family
ID=15282167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1141013A Expired - Fee Related JP2804084B2 (en) | 1989-06-05 | 1989-06-05 | Blind wiring board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2804084B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017213333A1 (en) * | 2016-06-07 | 2017-12-14 | 주식회사 엘지화학 | High-current transmission method using general printed circuit board |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04348916A (en) * | 1991-04-17 | 1992-12-03 | Komatsu Ltd | Mold clamping device with aligning device |
| JP2778323B2 (en) * | 1992-01-23 | 1998-07-23 | 株式会社日立製作所 | Printed wiring board and method of manufacturing the same |
| US5370518A (en) * | 1992-01-29 | 1994-12-06 | Kabushiki Kaisha Komatsu Seisakusho | Apparatus for injection and compression molding |
| SE509938C2 (en) * | 1996-07-09 | 1999-03-29 | Ericsson Telefon Ab L M | Process and device for PCBs |
| CN102970833B (en) * | 2012-11-05 | 2016-08-03 | 杭州华三通信技术有限公司 | The processing method of a kind of pcb board jack and jack structure thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54120866A (en) * | 1978-03-10 | 1979-09-19 | Anritsu Electric Co Ltd | Method of producing through hole printed board |
-
1989
- 1989-06-05 JP JP1141013A patent/JP2804084B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017213333A1 (en) * | 2016-06-07 | 2017-12-14 | 주식회사 엘지화학 | High-current transmission method using general printed circuit board |
| US10462911B2 (en) | 2016-06-07 | 2019-10-29 | Lg Chem, Ltd. | High-current transmitting method utilizing printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH036880A (en) | 1991-01-14 |
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| JPS613494A (en) | Method of producing printed board | |
| JPH01217994A (en) | Printed wiring board | |
| JPH04355994A (en) | Manufacture of printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |