JPH034595A - Manufacture of blind through-hole multilayered board - Google Patents
Manufacture of blind through-hole multilayered boardInfo
- Publication number
- JPH034595A JPH034595A JP13992289A JP13992289A JPH034595A JP H034595 A JPH034595 A JP H034595A JP 13992289 A JP13992289 A JP 13992289A JP 13992289 A JP13992289 A JP 13992289A JP H034595 A JPH034595 A JP H034595A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- board
- sides
- blind
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 229910000679 solder Inorganic materials 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims abstract description 7
- 238000005530 etching Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 239000011889 copper foil Substances 0.000 abstract description 3
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract 2
- 238000000926 separation method Methods 0.000 abstract 2
- 238000001035 drying Methods 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、ブラインドスルホール多層基板の製造方法の
改良に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an improvement in a method for manufacturing a blind through-hole multilayer substrate.
（従来の技術）
従来、ブラインドスルホール多層基板、例えばブライン
ド四層基板を作るには、第１図に示す如く両面に銅箔１
ａの接合された基板ｌに穴明けして貫通孔２を形成した
後、第２図に示す如く両面及び貫通孔２に銅めっき３を
施してスルホール２′を形成し、次に第３図に示す如く
一面にエツチングによりパターン４を形成すると共にス
ルホール２′の開口縁にランド５を形成し、次いでこの
基板を二枚第４図に示す如くパターン４側を対向させて
ガラスエポキシ、ＢＴレジン、ポリイミド、その他いず
れかの樹脂６を介して積層し且つスルホール２′に樹脂
６を充填し、次にこの積層板７に第５図に示す如（穴明
けして貫通孔８を形成した後、第６図に示す如く両面及
び貫通孔８に銅めっき９を施してスルホール８′を形成
し、次に第７図に示す如く両面にエツチングによりパタ
ーン１０を形成すると共に銅めっきしたブラインドスル
ホール２′の開口縁にランド１１を形成し、然る後積層
板７の両面に第８図に示す如く熱硬化型エポキシ樹脂又
は光硬化型エポキシ樹脂のいずれかより成るソルダーレ
ジスト１２を塗布して、ブラインドスルホール四層基板
１３を作っていた。(Prior Art) Conventionally, in order to make a blind through-hole multilayer board, for example, a blind four-layer board, a layer of copper foil was placed on both sides as shown in Figure 1.
After forming a through hole 2 by drilling a hole in the bonded substrate l of a, copper plating 3 is applied to both sides and the through hole 2 as shown in FIG. 2 to form a through hole 2', and then as shown in FIG. As shown in FIG. 4, a pattern 4 is formed on one side by etching, and a land 5 is formed on the opening edge of the through hole 2'. Next, two of these substrates are placed with the pattern 4 sides facing each other as shown in FIG. , polyimide, or any other resin 6, and the through holes 2' are filled with the resin 6, and then the laminated plate 7 is as shown in FIG. As shown in FIG. 6, copper plating 9 is applied to both surfaces and the through hole 8 to form a through hole 8', and then, as shown in FIG. A land 11 is formed at the opening edge of the laminate 7, and then a solder resist 12 made of either a thermosetting epoxy resin or a photocuring epoxy resin is applied to both sides of the laminate 7 as shown in FIG. I was making a blind through-hole four-layer board 13.
（発明が解決しようとする課題）
ところで、上記の製造方法では、銅めっき９を施した積
層板７に第７図に示す如くパターン１０゜ランド１１を
形成した後、直ちに第８図に示す如（ソルダーレジス）
１２を塗布しているので、その後ソルダーコーター、部
品を載せた後の半田フロー半田リフロー等の熱を加える
工程があると、ブラインドスルホール２′の中にある水
分、揮発分がガス化したり、基板中の水分がガス化した
りする為、ソルダーレジスト１２が剥がれたり、ふくれ
たりするものである。(Problem to be Solved by the Invention) In the above manufacturing method, immediately after forming the pattern 10° land 11 as shown in FIG. 7 on the copper-plated laminate 7, as shown in FIG. (Solder Regis)
12, if there is a heat application process such as a solder coater or solder reflow after parts are placed, the moisture and volatile matter in the blind through holes 2' will gasify and the board will be damaged. Since the moisture inside gasifies, the solder resist 12 may peel off or swell.
そこで本発明は、ソルダーレジストの塗布後熱を加える
工程があっても、ソルダーレジストが剥がれたりふくれ
たりしないようにしたブラインドスルホール多層基板の
製造方法を提供しようとするものである。Therefore, the present invention aims to provide a method for manufacturing a blind through-hole multilayer board in which the solder resist does not peel off or swell even if there is a step of applying heat after applying the solder resist.
（課題を解決するだめの手段）
上記課題を解決するための本発明のブラインドスルホー
ル多層基板の製造方法は、前記従来のブラインドスルホ
ール基板の製造方法に於いて、最終工程である積層板の
両面にソルダーレジストを塗布する工程の前にベーキン
グ（乾ｉ！＞を行うことを特徴とするものである。(Means for Solving the Problems) In order to solve the above problems, the method for manufacturing a blind through-hole multilayer board of the present invention is characterized in that, in the conventional method for manufacturing a blind through-hole board, both sides of the laminate, which is the final step, are This method is characterized by performing baking (drying!) before the process of applying the solder resist.
（作用）
上述の如く本発明のブラインドスルホール多層基板の製
造方法は、積層板の両面にソルダーレジストを塗布する
工程の前にベーキング（乾燥）を行うので、ブラインド
スルホールの水分、その他の揮発分及び基板中の水分が
蒸発する。従って、積層板の表面にソルダーレジストを
塗布した後、ソルダーコーター、部品を載せた後の半田
フロー半田リフロー等の熱を加える工程があっても、ソ
ルダーレジストが剥がれたり、ふくれたりすることが無
いものである。(Function) As described above, in the method for manufacturing a blind through-hole multilayer board of the present invention, baking (drying) is performed before the step of applying solder resist to both sides of the laminate, so moisture in the blind through-holes, other volatile matters, and Moisture in the substrate evaporates. Therefore, after applying solder resist to the surface of the laminate, even if there is a heat application process such as solder coater or solder reflow after parts are placed, the solder resist will not peel off or bulge. It is something.
（実施例）
本発明のブラインドスルホール多層基板の製造方法の実
施例を説明する。本発明のブラインドスルホール多層基
板の製造方法は、第１図に示す如く両面に銅箔１ａの接
合された基板１に穴明けして貫通孔２を形成してから第
７図に示す如く積層板７の両面の銅めっき９にエツチン
グによりパターン１０を形成すると共に銅めっきしたブ
ラインドスルホール２′の開口縁にランド１１を形成す
る迄の工程が従来の製造方法と等しいのでその説明を省
略する。(Example) An example of the method for manufacturing a blind through-hole multilayer substrate of the present invention will be described. The manufacturing method of the blind through-hole multilayer board of the present invention is as follows: As shown in FIG. 1, holes are formed in a board 1 having copper foils 1a bonded on both sides to form through holes 2, and then a laminated board is formed as shown in FIG. The steps up to forming a pattern 10 on the copper plating 9 on both sides of the copper plating 9 by etching and forming a land 11 on the opening edge of the copper-plated blind through hole 2' are the same as those in the conventional manufacturing method, so a description thereof will be omitted.
さて本発明のブラインドスルホール多層基板の製造方法
の実施例は、前述の第７図に示す工程を終えた後、積層
板７を９０〜１５０℃で３０〜９０分間、本例では１３
０℃、６０分間ベーキング（乾燥）を行って、ブライン
ドスルホール２′の水分、その他の揮発分及び基板中の
水分を蒸発させる。然る後第８図に示す如く熱硬化型エ
ポキシ樹脂（又は光硬化型エポキシ樹脂）より成るソル
ダーレジスト１２を積層板７の両面に塗布して、ブライ
ンドスルホール四層基板１３を作った。Now, in an embodiment of the method for manufacturing a blind through-hole multilayer substrate of the present invention, after completing the steps shown in FIG.
Baking (drying) is performed at 0° C. for 60 minutes to evaporate the moisture in the blind through holes 2', other volatile matter, and the moisture in the substrate. Thereafter, as shown in FIG. 8, a solder resist 12 made of a thermosetting epoxy resin (or a photocuring epoxy resin) was applied to both sides of the laminated plate 7, thereby producing a blind through-hole four-layer board 13.
こうして作ったブラインドスルホール四層基板１３を、
その後ソルダーコーターの為熱を加え、さらに部品を載
せた後半田フローのため熱を加えたが、ソルダーレジス
ト１２は剥がれたり、ふくれたりすることが無かった。The blind through-hole four-layer board 13 made in this way is
After that, heat was applied for the solder coater, and then heat was applied for the solder flow after the parts were placed, but the solder resist 12 did not peel off or bulge.
（発明の効果）
以上の説明で判るように本発明のブラインドスルホール
多層基板の製造方法によれば、ソルダーレジストの塗布
前にブラインドスルホールの水分や揮発分及び基板中の
水分等が除去されるので、ソルダーレジストを塗布して
ブラインドスルホール多層基板を作った後で、熱の加わ
る工程があってもソルダーレジストが剥がれたり、ふく
れたりすることが無いものである。(Effects of the Invention) As can be seen from the above explanation, according to the method for manufacturing a blind through-hole multilayer board of the present invention, water and volatile matter in the blind through-holes and moisture in the board are removed before applying the solder resist. After applying a solder resist to produce a blind through-hole multilayer board, the solder resist will not peel off or bulge even if there is a step in which heat is applied.
第１図乃至第８図はブラインドスルホール四層基板の製
造方法の工程を示す図である。FIGS. 1 to 8 are diagrams showing the steps of a method for manufacturing a blind through-hole four-layer board.
Claims (1)
通孔に銅めっきを施してスルホールを形成し、次に一面
にエッチングによりパターンを形成すると共にスルホー
ルの開口縁にランドを形成し、次いでこの基板のパター
ン側を対向させ樹脂を介して積層し且つスルホールに樹
脂を充填し、次にこの積層板に穴明けして貫通孔を形成
した後両面及び貫通孔に銅めっきを施してスルホールを
形成し、次に両面にエッチングによりパターンを形成す
ると共に銅めっきしたブラインドスルホールの開口縁に
ランドを形成し、然る後積層板の両面にソルダーレジス
トを塗布乾燥するブラインドスルホール多層基板の製造
方法に於いて、前記積層板の両面にソルダーレジストを
塗布する最終工程の前にベーキングを行うことを特徴と
するブラインドスルホール多層基板の製造方法。1. After drilling a hole in the substrate and forming a through hole, copper plating is applied to both sides and the through hole to form a through hole. Next, a pattern is formed on one side by etching and a land is formed on the opening edge of the through hole. Laminate the substrates with the pattern sides facing each other via resin, fill the through holes with resin, then drill holes in this laminate to form through holes, and then apply copper plating to both sides and the through holes to form through holes. Next, a pattern is formed on both sides by etching, and a land is formed on the opening edge of the copper-plated blind through-hole, and then a solder resist is applied to both sides of the laminate and dried. A method for manufacturing a blind through-hole multilayer board, characterized in that baking is performed before the final step of applying solder resist to both sides of the laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13992289A JP2662440B2 (en) | 1989-06-01 | 1989-06-01 | Method of manufacturing blind through hole multilayer substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13992289A JP2662440B2 (en) | 1989-06-01 | 1989-06-01 | Method of manufacturing blind through hole multilayer substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH034595A true JPH034595A (en) | 1991-01-10 |
| JP2662440B2 JP2662440B2 (en) | 1997-10-15 |
Family
ID=15256783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13992289A Expired - Lifetime JP2662440B2 (en) | 1989-06-01 | 1989-06-01 | Method of manufacturing blind through hole multilayer substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2662440B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| JP2003090391A (en) * | 2001-09-17 | 2003-03-28 | Keihin Corp | Rotatively driven shaft driving device |
| US6793852B2 (en) | 2000-05-31 | 2004-09-21 | Ttm Advanced Circuits, Inc. | Scavenging method |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| US6832714B2 (en) | 2000-05-31 | 2004-12-21 | Ttm Advanced Circuits, Inc. | Heated filling device |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| JP2010153721A (en) * | 2008-12-26 | 2010-07-08 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board with built-in parts |
| JP2010199221A (en) * | 2009-02-24 | 2010-09-09 | Autonetworks Technologies Ltd | Circuit unit, circuit structure, and method of manufacturing the circuit unit |
-
1989
- 1989-06-01 JP JP13992289A patent/JP2662440B2/en not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6840425B2 (en) | 2000-05-31 | 2005-01-11 | Ttm Advanced Circuits, Inc. | Scavenging system |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| US6793852B2 (en) | 2000-05-31 | 2004-09-21 | Ttm Advanced Circuits, Inc. | Scavenging method |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| US6832714B2 (en) | 2000-05-31 | 2004-12-21 | Ttm Advanced Circuits, Inc. | Heated filling device |
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| US6921505B2 (en) | 2000-05-31 | 2005-07-26 | Ttm Advanced Circuits, Inc. | Hole filling using an etched hole-fill stand-off |
| US6995321B2 (en) | 2000-05-31 | 2006-02-07 | Honeywell Advanced Circuits | Etched hole-fill stand-off |
| US7066378B2 (en) | 2000-05-31 | 2006-06-27 | Ttm Advanced Circuits, Inc. | Filling device |
| JP2003090391A (en) * | 2001-09-17 | 2003-03-28 | Keihin Corp | Rotatively driven shaft driving device |
| JP2010153721A (en) * | 2008-12-26 | 2010-07-08 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board with built-in parts |
| JP2010199221A (en) * | 2009-02-24 | 2010-09-09 | Autonetworks Technologies Ltd | Circuit unit, circuit structure, and method of manufacturing the circuit unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2662440B2 (en) | 1997-10-15 |
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