JP2613282B2 - Method for producing silver-platinum composite fine powder - Google Patents

Method for producing silver-platinum composite fine powder

Info

Publication number
JP2613282B2
JP2613282B2 JP29436288A JP29436288A JP2613282B2 JP 2613282 B2 JP2613282 B2 JP 2613282B2 JP 29436288 A JP29436288 A JP 29436288A JP 29436288 A JP29436288 A JP 29436288A JP 2613282 B2 JP2613282 B2 JP 2613282B2
Authority
JP
Japan
Prior art keywords
platinum
silver
fine powder
composite fine
platinum composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP29436288A
Other languages
Japanese (ja)
Other versions
JPH02141508A (en
Inventor
博史 為政
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP29436288A priority Critical patent/JP2613282B2/en
Publication of JPH02141508A publication Critical patent/JPH02141508A/en
Application granted granted Critical
Publication of JP2613282B2 publication Critical patent/JP2613282B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は微細な銀−白金複合微粉末の製造方法に関す
るものである。
Description: TECHNICAL FIELD The present invention relates to a method for producing a fine silver-platinum composite fine powder.

(従来の技術とその問題点) 電子工業の分野では、厚膜回路を作製するのに導電性
ペーストが利用されていて現在使われているのは銀と白
金の微粉末を混合したペーストである。このAg-Ptペー
ストにおいて白金を混合する理由は、マイグレーション
とハンダクワレを防止するためであり、このためには数
%〜10%の白金を加える必要がある。
(Conventional technology and its problems) In the field of the electronics industry, a conductive paste is used to make a thick film circuit, and the paste currently used is a mixture of fine powders of silver and platinum. . The reason why platinum is mixed in the Ag-Pt paste is to prevent migration and solder cracking, and it is necessary to add several percent to 10% of platinum for this purpose.

白金の添加は上記2点で優れた効果があるが、銀と白
金の微粉末を混合する方法では、白金を均一に分散する
ことが困難なためその効果を十分に生かせないという欠
点を有していた。
Although the addition of platinum has an excellent effect in the above two points, the method of mixing fine powder of silver and platinum has a drawback that the effect cannot be fully utilized because it is difficult to uniformly disperse platinum. I was

(発明の目的) 本発明は上記の欠点を解消せんがためになされたもの
であり、Ag-Ptペーストの特性を改善するために銀微粉
末中に白金を均一に分散させた銀−白金複合微粉末の製
造方法を提供せんとするものである。
(Object of the Invention) The present invention has been made in order to solve the above-mentioned drawbacks, and in order to improve the characteristics of Ag-Pt paste, a silver-platinum composite in which platinum is uniformly dispersed in silver fine powder. It is intended to provide a method for producing fine powder.

(問題点を解決するための手段) 本発明の銀−白金複合微粉末の製造方法は、白金化合
物水溶液に水素化ホウ素ナトリウムを加えて白金コロイ
ド液とし、このコロイド液にL−アスコルビン酸又はL
−アスコルビン酸塩を加え、更に銀化合物水溶液を加え
て銀を還元することを特徴とするものである。
(Means for Solving the Problems) In the method for producing a silver-platinum composite fine powder of the present invention, sodium borohydride is added to an aqueous solution of a platinum compound to form a colloidal platinum solution, and L-ascorbic acid or L-ascorbic acid is added to the colloidal solution.
-It is characterized in that silver is reduced by adding ascorbate and further adding an aqueous silver compound solution.

(作用) 銀微粉末中に白金を均一に分散させるのにL−アスコ
ルビン酸又はL−アスコルビン酸塩による還元を利用す
る理由は、銀微粉末中に白金を均一に分散させるのにL
−アスコルビン酸又はL−アスコルビン酸塩の還元力が
最適であるためである。
(Action) The reason for utilizing the reduction with L-ascorbic acid or L-ascorbate to uniformly disperse platinum in silver fine powder is that L is used for uniformly dispersing platinum in silver fine powder.
-The reducing power of ascorbic acid or L-ascorbate is optimal.

ここで本発明の実施例について説明する。 Here, an embodiment of the present invention will be described.

(実施例) 塩化白金酸水溶液(50g/l)40mlを攪拌しながら水素
化ホウ素ナトリウムを加えて白金(粒径100〜500Å)が
均一に分散したコロイド液を作った。
(Example) Sodium borohydride was added to 40 ml of an aqueous solution of chloroplatinic acid (50 g / l) while stirring to prepare a colloid liquid in which platinum (particle diameter: 100 to 500 mm) was uniformly dispersed.

このコロイド液にL−アスコルビン酸水溶液(100g/
l)150mlを加え、攪拌しながらアンモニア性硝酸銀錯体
水溶液(50g/l)700mlを加え還元した。濾過、水洗後、
得られた粉末は銀微粉末中に白金が均一微細に分散した
ものであった。また得られた微粉末を走査電子顕微鏡観
察、X線回折、及び化学分析を行った結果、平均粒径0.
4μmのほぼ球状のAg-Pt5%複合微粉末となっていた。
An aqueous solution of L-ascorbic acid (100 g /
l) 150 ml was added, and while stirring, 700 ml of an ammoniacal silver nitrate complex aqueous solution (50 g / l) was added for reduction. After filtration and washing with water,
The obtained powder was obtained by uniformly and finely dispersing platinum in fine silver powder. Further, the obtained fine powder was observed by a scanning electron microscope, X-ray diffraction, and chemically analyzed.
It was an approximately spherical Ag-Pt 5% composite fine powder of 4 μm.

実施例で作ったAg-Pt5%複合及び合金粉末をペースト
化し、アルミナ基板上にスクリーン印刷後、900℃で30
分間焼成してAg-Pt厚膜回路を形成した。この回路を使
ってAgのマイグレーション及びハンダクワレテストを行
った結果、マイグレーションが発生するまでの平均時間
は、Ag-Pt5%複合微粉末で10分30秒でハンダ浸漬テスト
を10回行った後のハンダクワレはほとんど見られなかっ
た。
Paste the Ag-Pt 5% composite and alloy powder made in the example, screen print on an alumina substrate,
After baking for minutes, an Ag-Pt thick film circuit was formed. Using this circuit, Ag migration and solder swarf tests were performed. The average time until migration occurred was 10 minutes 30 seconds of Ag-Pt 5% composite fine powder, after 10 times of solder immersion tests. Hardly any solder cracking was seen.

尚、本発明における銀微粉末中に分散された白金の大
きさは限定するものではないが、ペーストとして使用し
たときの特性上、粒径1000Å以下がより好ましい。
The size of the platinum dispersed in the fine silver powder in the present invention is not limited, but the particle size is preferably 1000 mm or less in view of characteristics when used as a paste.

(従来例) 平均粒径1.0μmのAg微粉末と平均粒径1.2μmのPt微
粉末をAg-Pt5%の割合に混合、ペースト化し、アルミナ
基板上にスクリーン印刷後、900℃で30分間焼成してAg-
Pt厚膜回路を使ってマイグレーション及びハンダクワレ
テストを行った結果、マイグレーションが発生するまで
の平均時間が3分10秒でハンダ浸漬テストを5回行った
後、かなりのハンダクワレが見られた。
(Conventional example) Ag fine powder with an average particle size of 1.0 μm and Pt fine powder with an average particle size of 1.2 μm are mixed and pasted in a ratio of 5% Ag-Pt, screen printed on an alumina substrate, and baked at 900 ° C. for 30 minutes. Ag-
As a result of performing a migration and a solder cracking test using a Pt thick film circuit, considerable solder cracking was observed after performing a solder immersion test five times with an average time until migration occurred of 3 minutes and 10 seconds.

尚、本発明で得られた銀−白金複合微粉末を200〜500
℃で熱処理した後、ペースト化すれば、Agのマイグレー
ションが発生するまでの時間を一層長くすることができ
るものである。
Incidentally, the silver-platinum composite fine powder obtained in the present invention is 200 to 500
If the paste is formed after the heat treatment at a temperature of ° C., the time until Ag migration occurs can be further lengthened.

また上記実施例では白金化合物水溶液として塩化白金
酸水溶液、銀化合物水溶液としてアンモニア性硝酸銀錯
体水溶液を用いたが、本発明はこれに限るものではな
い。
In the above embodiment, an aqueous solution of chloroplatinic acid was used as an aqueous solution of a platinum compound, and an aqueous solution of an ammoniacal silver nitrate complex was used as an aqueous solution of a silver compound. However, the present invention is not limited to this.

(発明の効果) 上記の説明で明らかなように本発明の銀−白金複合粉
末は銀微粉末中に白金を均一に分散させた銀−白金複合
微粉末であるので、ペーストに利用すると、従来得られ
なかった白金が均一に分散した銀−白金膜を形成できる
ので、従来の粉末にとって代わることのできる画期的な
ものと言える。
(Effect of the Invention) As is clear from the above description, the silver-platinum composite powder of the present invention is a silver-platinum composite fine powder in which platinum is uniformly dispersed in silver fine powder. Since it is possible to form a silver-platinum film in which platinum not obtained is uniformly dispersed, it can be said that this is an epoch-making one that can replace conventional powders.

また本発明の製造方法は、銀−白金複合粉末を容易に
製造できるものである。
Further, the production method of the present invention can easily produce a silver-platinum composite powder.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】白金化合物水溶液に水素化ホウ素ナトリウ
ムを加えて白金コロイド液とし、このコロイド液にL−
アスコルビン酸又はL−アスコルビン酸塩を加え、更に
銀化合物水溶液を加えて銀を還元することを特徴とする
銀−白金複合微粉末の製造方法。
1. A colloidal platinum solution obtained by adding sodium borohydride to an aqueous solution of a platinum compound.
A method for producing a silver-platinum composite fine powder, comprising adding ascorbic acid or L-ascorbate, and further adding an aqueous silver compound solution to reduce silver.
JP29436288A 1988-11-21 1988-11-21 Method for producing silver-platinum composite fine powder Expired - Lifetime JP2613282B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29436288A JP2613282B2 (en) 1988-11-21 1988-11-21 Method for producing silver-platinum composite fine powder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29436288A JP2613282B2 (en) 1988-11-21 1988-11-21 Method for producing silver-platinum composite fine powder

Publications (2)

Publication Number Publication Date
JPH02141508A JPH02141508A (en) 1990-05-30
JP2613282B2 true JP2613282B2 (en) 1997-05-21

Family

ID=17806730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29436288A Expired - Lifetime JP2613282B2 (en) 1988-11-21 1988-11-21 Method for producing silver-platinum composite fine powder

Country Status (1)

Country Link
JP (1) JP2613282B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110033353A1 (en) * 2009-08-05 2011-02-10 Basf Corporation Preparation of Diesel Oxidation Catalyst Via Deposition of Colloidal Nanoparticles
CN104416164B (en) * 2013-09-04 2017-01-04 中国科学院苏州纳米技术与纳米仿生研究所 Platinum black and preparation method thereof

Also Published As

Publication number Publication date
JPH02141508A (en) 1990-05-30

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