JP2505172B2 - IC card - Google Patents
IC cardInfo
- Publication number
- JP2505172B2 JP2505172B2 JP61234129A JP23412986A JP2505172B2 JP 2505172 B2 JP2505172 B2 JP 2505172B2 JP 61234129 A JP61234129 A JP 61234129A JP 23412986 A JP23412986 A JP 23412986A JP 2505172 B2 JP2505172 B2 JP 2505172B2
- Authority
- JP
- Japan
- Prior art keywords
- area
- contact
- card
- external terminal
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000006870 function Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011111 cardboard Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はICカードに係わり、さらに詳しくはICカード
の構成要素であるICカードモジュールの改良に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC card, and more particularly to improvement of an IC card module which is a component of the IC card.
一般にICカードは記憶容量が大きく、データの読み出
し書き込みが出来る等の優れた利点があるので種々の分
野に使われるようになって来た。このICカード１は第６
図に示すようにICカードモジュール２が塩化ビニール薄
板より成るカード基板３に外部端子４が露出するように
埋めこまれたものである。Generally, the IC card has been used in various fields because it has a large memory capacity and excellent advantages such as reading and writing of data. This IC card 1 is the 6th
As shown in the figure, the IC card module 2 is embedded in a card substrate 3 made of a vinyl chloride thin plate so that the external terminals 4 are exposed.
ICカードモジュール２は第８図に示すように端子基板
５の片面（表面）に外部端子４・４…を形成し、他の片
面（裏面）側に配線導体６を形成した配線基板７を装着
層７′によって接着し、外部端子４と配線導体６との必
要箇所を基板５・７を貫通する穴８′内内面に形成した
スルーホールメッキ８で以て電気的に接続して所定の回
路を構成する。この端子基板５の裏面上にICチップ９を
接着し、ボンディングワイヤ10でICチップと配線基板上
の配線導体６とを電気的に接続した後、補強用封止枠11
をICチップ上面の周囲を囲繞するように基板７上に設
け、この囲繞領域内部を補強用樹脂12で充填して形成し
たものである。ここで外部端子４はICカードを端末機に
装着したときに、この端末機内蔵のコンタクトピン（図
示せず）と接触しこのコンタクトピンを介してICチップ
９に電源電圧印加、接地、データの授受などを行うため
のものである。この端末機内蔵のコンタクトピンがICカ
ード外部端子に接触する位置と接触領域の大きさ及び機
能はISO規格で定められている。As shown in FIG. 8, the IC card module 2 is equipped with a wiring board 7 in which external terminals 4, 4, ... Are formed on one surface (front surface) of a terminal board 5 and wiring conductors 6 are formed on the other one surface (back surface) side. A predetermined circuit is formed by bonding with a layer 7'and electrically connecting the necessary portions of the external terminals 4 and the wiring conductors 6 with through-hole plating 8 formed on the inner surface of the holes 8'through the substrates 5 and 7. Make up. The IC chip 9 is adhered on the back surface of the terminal board 5, and the bonding wire 10 electrically connects the IC chip to the wiring conductor 6 on the wiring board.
Is formed on the substrate 7 so as to surround the upper surface of the IC chip, and the inside of the surrounding area is filled with the reinforcing resin 12. Here, the external terminal 4 comes into contact with a contact pin (not shown) built in the terminal when the IC card is attached to the terminal, and the power supply voltage is applied to the IC chip 9 via this contact pin, grounding, and data transfer. It is for giving and receiving. The position where the contact pin built in the terminal contacts the external terminal of the IC card and the size and function of the contact area are defined by the ISO standard.
第７図は従来のICカードモジュール２の拡大正面図
で、表面は８個の外部端子41、42…48が設けられてい
る。端子間はエッチング工法などで形成された絶縁用細
隙で隔てられていて底部に端子基板面５が露出してい
る。８個の外部端子41、42…の各々の面に点線枠で示し
た四角形領域13が前記ISO規格で定められている端末機
内蔵のコンタクトピンが外部端子に接続する範囲であり
以後接触範囲枠と呼ぶ。外部端子41は電源電圧印加用端
子であり又外部端子45は接地機能をもつ。44、48は現在
使用していない。この両外部接点にスルーホールメッキ
用穴が穿たれていない理由である。他の外部端子の機能
は説明省略する。８個所ある接触範囲枠13で囲まれたほ
ぼ正方形の部分領域14をISO規格枠と名づけ、二点鎖線
で示す。この接触範囲枠寸法を規定したISO規格を参考
として第９図第10図に示す。２列に並んだ接触範囲枠８
個のうち左側端より10.25mmより12.25mmの間の４個131
〜134を電源電圧印加側の列と呼び右側の４個135〜138
をアース側の列と呼ぶことにする。FIG. 7 is an enlarged front view of the conventional IC card module 2, on the surface of which eight external terminals 4 1 , 4 2 ... 4 8 are provided. The terminals are separated by an insulating gap formed by an etching method or the like, and the terminal substrate surface 5 is exposed at the bottom. Eight external terminals 4 1, 4 2 ... each terminal internal contact pins rectangular region 13 shown by a dotted frame is defined in the ISO standard on the surface of the is in the range to be connected to the external terminal further contact It is called a range frame. The external terminal 4 1 is a terminal for applying a power supply voltage, and the external terminal 4 5 has a grounding function. 4 4 and 4 8 are not currently used. This is the reason why the through-hole plating holes are not formed in the both external contacts. Descriptions of functions of other external terminals are omitted. A substantially square partial area 14 surrounded by eight contact area frames 13 is named an ISO standard frame and is indicated by a chain double-dashed line. It is shown in FIG. 9 and FIG. 10 with reference to the ISO standard that defines the dimensions of the contact area frame. Contact area frame 8 arranged in two rows
4 pieces from 10.25mm to 12.25mm from the left end 13 1
~ 13 4 is called the row on the side where the power supply voltage is applied, and 4 on the right side 13 5 ~ 13 8
Will be called the row on the ground side.
ここでスルーホールメッキは第８図に示すように、端
子基板と配線基板を接着後両基板を貫通する直径約0.4m
mの穴８′をあけ、化学メッキ及び電気メッキで両基板
を電気的に接続するもので、一般にスルーホールメッキ
８と呼ばれている。スルーホールは放置状態では極めて
良好な信頼性を示すが、弱点は機械的繰返し荷重に弱い
ことで、外部端子面上でスルーホールを施した場所は力
を加えない方がよい。従って第７図のようにスルーホー
ル８は接触範囲枠13を避けて設けられる。更に第８図か
ら明らかなようにスルーホール８はICチップ９の占め範
囲には設けられ得ない。Here, the through-hole plating is, as shown in FIG. 8, a diameter of about 0.4 m that penetrates both terminals after adhering the terminal board and the wiring board.
A hole 8'of m is drilled and both substrates are electrically connected by chemical plating and electroplating, which is generally called through-hole plating 8. The through hole shows extremely good reliability when left unattended, but the weak point is that it is weak against mechanical repeated load, so it is better not to apply force to the place where the through hole is formed on the external terminal surface. Therefore, as shown in FIG. 7, the through hole 8 is provided so as to avoid the contact range frame 13. Further, as is apparent from FIG. 8, the through hole 8 cannot be provided in the area occupied by the IC chip 9.
さて、一般にICカードは薄形携帯に便利なため使用状
態は苛酷であり加えてICチップ及びその周囲配線は脆弱
なためその強度保持には非常に注意しているが尚充分と
は言い難い。従ってICカードモジュール２の面積は可能
な限り小さい方が曲げ応力に対して有利であることは自
明で、従来もその方針で設計されて来た。しかし従来は
例えばICチップ９の寸法が大きかったり又はICチップが
２枚必要であったりしてICカードモジュール２の面積縮
減努力にも拘らず自ら限度があって、その面積は到底IS
O規格枠（第７図14）には収まらなかった。従って外部
端子をその一部がISO規格枠14の外に延びる如く形成
し、スルーホールは前述の制約によって当然の如くISO
規格枠14の外部に延在する外部端子に設けられていた。
ところがICチップの集積化が進むに従ってICチップ９は
小型化して来たため設計によってはすべての機能をISO
規格枠14内に収められるようになったが、スルーホール
８の設置位置を従来通りISO規格枠外に置く限りICカー
ドモジュールの寸法は第７図に示す面積以下にはなら
ず、スルーホールの位置が妨げとなってICカードモジュ
ール面積縮減即ち強度増加が図れない憾みがあった。In general, since IC cards are convenient for thin portable use, the usage condition is severe, and since the IC chip and its peripheral wiring are fragile, it is extremely careful to maintain its strength, but it cannot be said to be sufficient. Therefore, it is obvious that the smaller the area of the IC card module 2 is, the more advantageous it is to the bending stress, and the IC card module 2 has been designed according to the policy. However, in the past, for example, the size of the IC chip 9 was large, or two IC chips were required, so that despite the efforts to reduce the area of the IC card module 2, there was a limit on its own, and the area was very small.
It did not fit in the O standard frame (Fig. 7, 14). Therefore, the external terminals are formed so that a part thereof extends outside the ISO standard frame 14, and the through holes are, as a matter of course, due to the above-mentioned restrictions.
It was provided on an external terminal extending outside the standard frame 14.
However, as IC chips have become more integrated, IC chip 9 has become smaller.
Although it can be accommodated in the standard frame 14, as long as the installation position of the through hole 8 is kept outside the ISO standard frame, the size of the IC card module does not become less than the area shown in Fig. 7, and the position of the through hole This hinders the reduction of the IC card module area, that is, the increase in strength.
この発明は上記ICカードモジュールの面積縮減を妨げ
るスルーホールの位置の問題を解決し、強度の改良され
たICカードを提供することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to solve the problem of the position of the through hole that prevents the reduction of the area of the IC card module, and to provide an IC card with improved strength.
前記目的を達成するため、本発明は、一方の面に外部
装置のコンタクトピンと接触する外部端子が設けられ、
他方の面にICチップを搭載するとともにICチップと接触
する配線導体が設けられ、前記外部端子と前記配線導体
とをスルーホールにて電気的に結合してなる回線基板が
一体となりICモジュールとして前記外部端子を外部に露
出するようにしてカード本体に埋め込まれてなるICカー
ドを対象とするものである。In order to achieve the above-mentioned object, the present invention provides an external terminal on one surface for contact with a contact pin of an external device,
On the other side, an IC chip is mounted and a wiring conductor that comes into contact with the IC chip is provided, and a circuit board formed by electrically coupling the external terminal and the wiring conductor through a through hole is integrated to form an IC module. It is intended for IC cards that are embedded in the card body with the external terminals exposed to the outside.
そして前記ICモジュールの面積は、コンタクトピンの
接触領域により囲まれる領域の面積とほぼ同一であり、
前記コンタクトピンの接触領域により囲まれる領域の内
側で、かつそのコンタクトピンの接触領域ならびにICチ
ップ実装領域を除く部分に外部端子の延伸部を設け、そ
の延伸部にスルーホールを形成したことを特徴とするも
のである。The area of the IC module is almost the same as the area of the region surrounded by the contact regions of the contact pins,
Inside the area surrounded by the contact area of the contact pin, and outside the contact area of the contact pin and the IC chip mounting area, the extension portion of the external terminal is provided, and the through hole is formed in the extension portion. It is what
第１図に本発明による一実施例のICカードモジュール
平面図を示す。８個の外部端子41〜48のうち第１図では
41〜43及び45〜47の計６個所しか必要ないため２個所の
スルーホールは図示していない。６個所のスルーホール
８は各々ISO規格枠14の内側において、接触範囲枠13とI
Cチップ９以外の領域に設けられ、そのスルーホールに
対応するため、外部端子のうち42、43、46、47の形状を
図示のように延伸させ、他方41、44、45、48の端子を小
さく形成する。これによって各々対応するスルーホール
と接触範囲枠が電気的に接続されて所定の機能を果すと
共にICカードモジュールの大きさは第７図在来例よりも
ISO規格枠14の外側に延伸したスルーホールを設けた外
部端子周辺部だけ不要となり小さくなって強度増加を計
ることができる。FIG. 1 shows a plan view of an IC card module according to an embodiment of the present invention. In the first drawing of the eight external terminals 41 to 8
41 to 3 and 4 5-4 7 2 places of through holes for a total of 6 points only required are not shown. The six through-holes 8 are located inside the ISO standard frame 14, respectively, and contact range frame 13 and I
The external terminals 4 2 , 4 3 , 4 6 and 4 7 are extended as shown in the drawing to correspond to the through holes provided in areas other than the C chip 9, and the other terminals 4 1 , 4 4 and Make the terminals of 4 5 and 4 8 small. As a result, the corresponding through holes and the contact range frame are electrically connected to perform a predetermined function, and the size of the IC card module is larger than that of the conventional example shown in FIG.
Only the peripheral portion of the external terminal provided with a through hole extending to the outside of the ISO standard frame 14 becomes unnecessary, and the strength can be increased by reducing the size.
第２図は本発明の別の実施例で外部端子形状は第１図
と同じである。その外部端子の外観を美的にすっきり見
せるため表面に露出している端子基板面５と類似した黒
色で外部端子面に印刷15を施こしたものである。（図中
９はICチップ領域を示す） 第３図から第５図までは本発明の別の実施例でそれぞ
れICカードモジュール平面図を示している。第３図は６
個所のスルーホール８をすべてISO規格枠14内で且つIC
チップ９と接触範囲枠13以外の領域に設け、各々のスル
ーホールに対応する外部端子形状42、43、46、47を延伸
させると共に中央部に装飾端子を設けたものである。こ
れによってICカードモジュールの面積が縮減されて強度
が増している。又中央装飾端子に例えばシンボルマーク
を印刷、エッチングする等の利用もできる。この装飾端
子は電気的には中性である。尚この端子形状を直線とし
中央装飾端子を菱形とする類似例も容易に着想できる。
第４図は６個のスルーホール８と接触範囲枠13との対応
が第３図と異なる例である。第５図は外部端子を５個所
しか使用しない場合の例で、41、42、43、45、47の接触
範囲枠と対応するスルーホール８とを電気的に接続する
ため42、43、47端子を延伸せしめ、41、45端子は小さく
形成することによって所定の機能を果すと共にスルーホ
ール８がすべてISO規格枠14内で且つ接触範囲枠13の外
に設けたのでICカードモジュールの面積が縮減されて強
度が増している。FIG. 2 shows another embodiment of the present invention, which has the same external terminal shape as that of FIG. In order to make the appearance of the external terminal look aesthetically clear, the external terminal surface is printed with a black color 15 similar to that of the terminal substrate surface 5 exposed on the surface. (Indicated by 9 in the figure is an IC chip area.) FIGS. 3 to 5 are plan views of IC card modules according to other embodiments of the present invention. Figure 3 shows 6
All of the through holes 8 are in the ISO standard frame 14 and IC
Provided in a region other than the contact area frame 13 and chip 9, it is provided with a decorative pin in the center together with stretching the external terminal shape 4 2, 4 3, 4 6, 4 7 corresponding to each of the through-hole. As a result, the area of the IC card module is reduced and the strength is increased. It is also possible to use, for example, printing or etching a symbol mark on the central decorative terminal. This decorative terminal is electrically neutral. A similar example in which the terminal shape is a straight line and the central decoration terminal is a rhombus can be easily conceived.
FIG. 4 is an example in which the correspondence between the six through holes 8 and the contact range frame 13 is different from that in FIG. Figure 5 is an example of when not using the external terminal only 5 points, 4 1, 4 2, 4 3, 4 5, 4 7 4 for electrically connecting the through holes 8 and corresponding contact matchboxes By extending the terminals 2 , 4, 3 and 4 7 and forming the terminals 4 1 and 4 5 small, the through holes 8 are all provided within the ISO standard frame 14 and outside the contact range frame 13. Therefore, the area of the IC card module is reduced and the strength is increased.
以上説明したように本発明は、ICモジュールの面積を
コンタクトピンの接触領域により囲まれる領域の面積と
ほぼ同一にして、前記コンタクトピンの接触領域により
囲まれる領域の内側で、かつそのコンタクトピンの接触
領域ならびにICチップ実装領域を除く部分に外部端子の
延伸部を設け、その延伸部にスルーホールを形成するこ
とにより、ICもジュールの面積を小さくできて強度増加
を計ることができる。そのほか外部端子の形状を変化さ
せ或は印刷やエッチングを施こして美観を増すこともで
きる。INDUSTRIAL APPLICABILITY As described above, the present invention makes the area of the IC module approximately the same as the area of the region surrounded by the contact region of the contact pin, and the inside of the region surrounded by the contact region of the contact pin and the contact pin By providing the extension part of the external terminal in the part excluding the contact region and the IC chip mounting region and forming the through hole in the extension part, the area of the joule of the IC can be reduced and the strength can be increased. In addition, the shape of the external terminal can be changed, or printing or etching can be applied to enhance the appearance.
第１図は本発明によるICカードモジュールの平面図、第
２図は他の実施例のICカードモジュールの平面図、第３
図から第５図は更に他の実施例によるICカードモジュー
ルの平面図、第６図はICカードの平面図、第７図は従来
のICカードモジュールの平面図、第８図はICカードモジ
ュールの断面図、第９図、第10図はISO規格による接触
範囲 １……ICカード、２……ICカードモジュール、３……カ
ード基板、４……外部端子、５……端子基板、６……配
線導体、７……配線基板、８……スルーホールメッキ９
……ICチップ、13……接触範囲枠、14……ISO規格枠、1
5……印刷面FIG. 1 is a plan view of an IC card module according to the present invention, FIG. 2 is a plan view of an IC card module of another embodiment, and FIG.
5 to 5 are plan views of an IC card module according to still another embodiment, FIG. 6 is a plan view of an IC card, FIG. 7 is a plan view of a conventional IC card module, and FIG. 8 is a plan view of an IC card module. Cross-sectional views, Fig. 9 and Fig. 10 show the contact area according to the ISO standard 1 …… IC card, 2 …… IC card module, 3 …… Card board, 4 …… External terminals, 5 …… Terminal board, 6 …… Wiring conductor, 7 ... Wiring board, 8 ... Through-hole plating 9
…… IC chip, 13 …… Contact area frame, 14 …… ISO standard frame, 1
5: Printing surface
Claims (1)
触する外部端子が設けられ、他方に面にICチップを搭載
するとともにICチップと接続する配線導体が設けられ、
前記外部端子と前記配線導体とをスルーホールにて電気
的に結合したICモジュールが、前記外部端子を外部に露
出するようにしてカード本体に埋め込まれてなるICカー
ドにおいて、 前記ICモジュールの面積は、コンタクトピンの接触領域
により囲まれる領域の面積とほぼ同一であり、 前記コンタクトピンの接触領域により囲まれる領域の内
側で、かつそのコンタクトピンの接触領域ならびにICチ
ップ実装領域を除く部分に外部端子の延伸部を設け、そ
の延伸部にスルーホールを形成したことを特徴とするIC
カード。1. An external terminal for contacting a contact pin of an external device is provided on one surface, and an IC chip is mounted on the other surface and a wiring conductor for connecting to the IC chip is provided on the other surface.
An IC module in which the external terminal and the wiring conductor are electrically coupled through a through hole is embedded in a card body so that the external terminal is exposed to the outside, and the area of the IC module is , The area of the area surrounded by the contact area of the contact pin is almost the same, and the external terminal is inside the area surrounded by the contact area of the contact pin and in the area excluding the contact area of the contact pin and the IC chip mounting area. The IC is characterized in that a stretched portion is provided and a through hole is formed in the stretched portion.
card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61234129A JP2505172B2 (en) | 1986-09-30 | 1986-09-30 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61234129A JP2505172B2 (en) | 1986-09-30 | 1986-09-30 | IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6387293A JPS6387293A (en) | 1988-04-18 |
| JP2505172B2 true JP2505172B2 (en) | 1996-06-05 |
Family
ID=16966089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61234129A Expired - Fee Related JP2505172B2 (en) | 1986-09-30 | 1986-09-30 | IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2505172B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2510669B2 (en) * | 1988-04-15 | 1996-06-26 | 大日本印刷株式会社 | IC card |
| JPH0531983U (en) * | 1991-10-02 | 1993-04-27 | 東芝ケミカル株式会社 | IC card |
| CH686325A5 (en) * | 1992-11-27 | 1996-02-29 | Esec Sempac Sa | Electronic module and chip card. |
| ATE524266T1 (en) * | 2006-04-05 | 2011-09-15 | Senju Metal Industry Co | WAVE SOLDERING TANK |
| JP4962197B2 (en) * | 2007-08-06 | 2012-06-27 | 千住金属工業株式会社 | Jet solder bath |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61125689A (en) * | 1984-11-21 | 1986-06-13 | Dainippon Printing Co Ltd | Ic card |
| JPS61217298A (en) * | 1985-03-25 | 1986-09-26 | 日立マイクロコンピユ−タエンジニアリング株式会社 | Integrated circuit card |
| JPS62199367U (en) * | 1986-06-10 | 1987-12-18 |
-
1986
- 1986-09-30 JP JP61234129A patent/JP2505172B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6387293A (en) | 1988-04-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |