JP2023140142A - 基板処理装置、半導体装置の製造方法及びプログラム - Google Patents
基板処理装置、半導体装置の製造方法及びプログラム Download PDFInfo
- Publication number
- JP2023140142A JP2023140142A JP2022046022A JP2022046022A JP2023140142A JP 2023140142 A JP2023140142 A JP 2023140142A JP 2022046022 A JP2022046022 A JP 2022046022A JP 2022046022 A JP2022046022 A JP 2022046022A JP 2023140142 A JP2023140142 A JP 2023140142A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- support
- transfer
- chamber
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 242
- 238000012545 processing Methods 0.000 title claims abstract description 140
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 238000012546 transfer Methods 0.000 claims abstract description 205
- 230000007246 mechanism Effects 0.000 claims description 40
- 238000003860 storage Methods 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 26
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000032258 transport Effects 0.000 description 77
- 230000008569 process Effects 0.000 description 15
- 239000007789 gas Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 10
- 230000003028 elevating effect Effects 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 238000004904 shortening Methods 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
基板の処理が可能な少なくとも一つの処理室と、
前記基板を支持可能な支持具と、
前記支持具を搬送可能な搬送ユニットと、
前記基板の移載が可能な移載室と、
前記移載室と前記処理室に隣接し、前記搬送ユニットの移動が可能な搬送室と、
前記搬送室に配され、複数の前記支持具の授受が可能な授受室と、
を備える技術が提供される。
本実施形態の基板処理装置20は、縦型反応炉を備える基板処理装置である。
基板処理装置20は、図1~図3に示されるように、少なくとも一つの処理室30を備えている。本実施形態では、一例として、基板処理装置20が6つの処理室30を備えているが、これに限定されない。
支持具90は、図6及び図8Aに示されるように、少なくとも一枚の基板Wを支持可能に構成されている。本実施形態では、一例として支持具90が9枚の基板Wを支持可能に構成されているが、本開示はこの構成に限定されない。例えば、支持具90は、基板Wを10枚以上支持可能でもよいし、8枚以下支持可能でもよい。
基板処理装置20は、図1及び図9に示されるように、搬送ユニット60を有する搬送室50を備えている。搬送室50は、6つの処理室30が並べられた方向に延びている。また、搬送室50は、各処理室30及び移載室86に隣接している。搬送室50は、各処理室30の出入口を介して各処理室30と連通する。搬送室50を構成する筐体51は、処理室30を構成する筐体31にそれぞれ固定されている。また、搬送室50には、搬送室50内を真空雰囲気とする排気装置等が接続されている。
基板処理装置20は、図1に示されるように、基板処理装置20の平面視で、基板搬送方向と直交する方向に延びる移載室86を備えている。なお、基板搬送方向と直交する方向については、適宜、基板移載方向という。図1では、基板移載方向を矢印Yで示している。
基板処理装置20は、搬送室50に配され、複数の支持具90の授受が可能な授受室70を備えている。授受室70は、図1に示されるように、基板処理装置20の平面視で、搬送室50において移載室86との間で基板Wの移載を行う部分に配されている。
基板処理装置20は、図21に示すように、制御部の一例としてのコントローラ100を備えている。このコントローラ100は、CPU(Central Processing Unit)101A、RAM(Random Access Memory)101B、記憶部101C、I/Oポート101Dを備えたコンピュータとして構成されている。
次に、本開示の一実施形態に係る基板処理装置20を用いた半導体装置の製造方法、すなわち、基板Wの処理手順について説明する。以下の説明において、基板処理装置20を構成する各部の動作はコントローラ100により制御される。
まず、図12に示されるように、第二支持部77Bで支持されている空の支持具90を授受機構72で保持する。次に、回転伸縮軸74を回転させて支持具90を待機位置から移載位置へと回転移動させて、支持具90を第一支持部77Aで支持させる。
次に、図13に示されるように、移載機84を稼働させて収容容器80から支持具90へ、一例として9枚の基板Wを移載する。
搬送ユニット60には空の支持具90が載置されており、6つの処理室30のうちいずれかの処理室30による基板Wの処理が完了すると、空の支持具90を載置した搬送ユニット60が基板Wの処理が完了した処理室30に向けて移動する。
搬送ユニット60が目的の処理室30の前に到着すると、目的の処理室30のゲートバルブ35が開かれる。このとき、準備室36には反応炉32から取り出された基板支持台40が昇降装置37の昇降台37Aと共に下降している。その後、移載機66を用いて基板支持台40から処理済みの基板Wを取り出し、空の支持具90に支持させる。
基板支持台40から処理済みの基板Wを支持具90に移載したあとは、図14に示されるように、支持具90が載置台64に載せられた搬送ユニット60を授受室70に向けて移動させる。
次に、図15に示されるように、授受機構72によって搬送ユニット60から支持具90が待機位置へと移動させられる。そして、処理済みの基板Wを支持する支持具90が第二支持部77Bで支持される。
次に、図16に示されるように、授受機構72によって第一支持部77Aから支持具90が搬送位置へと移動させられる。そして、未処理の基板Wを支持する支持具90が載置台64で支持される。
支持具90が載置台64に載置されると、搬送ユニット60は、図17に示されるように、目的の処理室30へと移動する。すなわち、支持具90が目的の処理室30へと、搬送ユニット60によって搬送される。
そして、目的の処理室30に搬送ユニット60が到着すると、搬入目的の処理室30のゲートバルブ35が開かれる。
ゲートバルブ35が開いた後、搬送ユニット60の移載機66を用いて支持具90の未処理の基板Wを基板支持台40に移載する(図9参照)。搬送ユニット60から基板支持台40へ基板Wの移載が完了すると、ゲートバルブ35を閉じ、昇降装置37の昇降台37Aと共に基板支持台40を上昇させ、反応炉32内に基板支持台40を装入する(図10参照)。
本実施形態では、搬送ユニット60の移動が可能な搬送室50に複数の支持具90の授受が可能な授受室70を配していることから、複数の支持具90を同時に扱うことで、生産効率の向上に貢献できる。また、授受室70において、複数の支持具90を授受することで、基板Wの搬送律速の回避を行うことができる。また、支持具90に複数枚の基板Wを支持させた場合には、一度に複数枚の基板Wの搬送を行えるため、基板Wの搬送時間の短縮に貢献できる。すなわち、本実施形態では、基板Wの搬送効率を向上させることができる。
基板Wのズレを防止することにより、基板Wの移載時において、移載機66及び移載機84と基板Wとの接触を防ぐことができる
本開示は上述の実施形態に限定されるものではなく、その要旨を逸脱しない範囲で種々変更可能である。例えば、授受機構72では、支持具90を下から支持したが、支持具90を上から吊り下げてもよい。
30 処理室
40 基板支持台
50 搬送室
60 搬送ユニット
64 載置台
66 移載機(第2の移載機構の一例)
84 移載機(第1の移載機構の一例)
100 コントローラ(制御部の一例)
Claims (15)
- 基板の処理が可能な少なくとも一つの処理室と、
前記基板を支持可能な支持具と、
前記支持具を搬送可能な搬送ユニットと、
前記基板の移載が可能な移載室と、
前記移載室と前記処理室に隣接し、前記搬送ユニットの移動が可能な搬送室と、
前記搬送室に配され、複数の前記支持具の授受が可能な授受室と、
を備える基板処理装置。 - 前記基板の処理の制御を可能な制御部と、
前記搬送ユニットを制御可能な搬送制御部と、
前記授受室の制御が可能な授受制御部と、
を備え、
前記制御部は、前記基板の処理に合わせて前記搬送制御部と前記授受制御部の制御を行うことが可能なよう構成されている、請求項1に記載の基板処理装置。 - 前記搬送制御部は、前記搬送ユニットへの前記支持具の載置の有無の検知と、前記基板の移載制御とが可能なよう構成されている、請求項2に記載の基板処理装置。
- 前記授受制御部は、前記支持具の載置の有無の管理と、前記支持具の配置制御とが可能なよう構成される、請求項2に記載の基板処理装置。
- 外部配送可能で且つ前記基板を収容可能な収容容器を載置可能なロードポートと、
前記移載室に配し、前記基板の移載が可能な第1の移載機構と、
を備え、
前記第1の移載機構は、前記ロードポートに載置された前記収容容器と前記支持具との間で、少なくとも1つの前記基板を移載可能なよう構成されている、請求項1に記載の基板処理装置。 - 前記基板は複数の種類を有し、
前記支持具は、少なくとも1つの種類の前記基板を支持可能である、請求項1に記載の基板処理装置。 - 前記搬送ユニットは、前記支持具を載置する載置台を備え、前記支持具を前記載置台に載置して前記支持具の搬送が可能である、請求項1に記載の基板処理装置。
- 前記搬送ユニットは、前記基板の移載が可能な第2の移載機構を備え、
前記第2の移載機構は、前記支持具に支持された前記基板を少なくとも1つ前記処理室に移載可能である、請求項1に記載の基板処理装置。 - 前記授受室は、処理済みの前記基板を支持する前記支持具と、未処理の前記基板を支持する前記支持具の授受が可能である、請求項1に記載の基板処理装置。
- 前記授受室は、少なくとも二つの支持部を備え、
一方には前記搬送ユニットから授受した前記支持具が支持され、
他方には前記基板の移載が可能なように前記支持具を支持するよう構成されている、
請求項1に記載の基板処理装置。 - 前記授受室は、前記支持具を待機可能な待機部を有する、請求項1に記載の基板処理装置。
- 前記授受室は、前記支持具を授受する場合に、前記基板の移載が可能なように基板移載面の向きを調整可能な授受機構を有する、請求項1に記載の基板処理装置。
- 前記支持具は、前記基板の位置ズレを防止可能な位置合わせ機構を有する、請求項1に記載の基板処理装置。
- 基板を支持する複数の支持具の授受を行う工程と、
前記基板を処理する処理室に前記支持具を搬送する工程と、
前記支持具から前記処理室に搬入される基板支持台へ基板を移載する工程と、
前記処理室で前記基板の処理を行う工程と、
を有する半導体装置の製造方法。 - 基板を支持する複数の支持具の授受を行う手順と、
前記基板を処理する処理室に前記支持具を搬送する手順と、
前記支持具から前記処理室に搬入される基板支持台へ基板を移載する手順と、
前記処理室で前記基板の処理を行う手順と、
をコンピュータによって基板処理装置に実行させるプログラム。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022046022A JP2023140142A (ja) | 2022-03-22 | 2022-03-22 | 基板処理装置、半導体装置の製造方法及びプログラム |
TW111132187A TWI830346B (zh) | 2022-03-22 | 2022-08-26 | 基板處理裝置、半導體裝置之製造方法及程式 |
CN202211115057.7A CN116825690A (zh) | 2022-03-22 | 2022-09-14 | 基板处理装置、半导体器件的制造方法以及记录介质 |
US17/957,048 US11869790B2 (en) | 2022-03-22 | 2022-09-30 | Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium |
KR1020220125566A KR20230137805A (ko) | 2022-03-22 | 2022-09-30 | 기판 처리 장치, 반도체 장치의 제조 방법 및 프로그램 |
US18/406,516 US20240145287A1 (en) | 2022-03-22 | 2024-01-08 | Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022046022A JP2023140142A (ja) | 2022-03-22 | 2022-03-22 | 基板処理装置、半導体装置の製造方法及びプログラム |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2023140142A true JP2023140142A (ja) | 2023-10-04 |
Family
ID=88096338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022046022A Pending JP2023140142A (ja) | 2022-03-22 | 2022-03-22 | 基板処理装置、半導体装置の製造方法及びプログラム |
Country Status (5)
Country | Link |
---|---|
US (2) | US11869790B2 (ja) |
JP (1) | JP2023140142A (ja) |
KR (1) | KR20230137805A (ja) |
CN (1) | CN116825690A (ja) |
TW (1) | TWI830346B (ja) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0616206A (ja) | 1992-07-03 | 1994-01-25 | Shinko Electric Co Ltd | クリーンルーム内搬送システム |
KR100221983B1 (ko) * | 1993-04-13 | 1999-09-15 | 히가시 데쓰로 | 처리장치 |
JPH09199459A (ja) * | 1996-01-22 | 1997-07-31 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US6942738B1 (en) * | 1996-07-15 | 2005-09-13 | Semitool, Inc. | Automated semiconductor processing system |
JP3934503B2 (ja) * | 2002-08-01 | 2007-06-20 | 株式会社日立国際電気 | 基板処理装置及び基板の処理方法 |
JP5977729B2 (ja) * | 2013-11-14 | 2016-08-24 | 東京エレクトロン株式会社 | 基板処理システム |
JP6949511B2 (ja) | 2017-03-02 | 2021-10-13 | 株式会社Screenホールディングス | 基板処理システムおよび基板処理装置 |
JP2019036634A (ja) * | 2017-08-15 | 2019-03-07 | 東京エレクトロン株式会社 | 基板処理装置 |
CN109560010B (zh) * | 2017-09-26 | 2022-12-16 | 株式会社国际电气 | 基板处理装置、半导体装置的制造方法以及存储介质 |
JP7185461B2 (ja) * | 2018-09-21 | 2022-12-07 | 株式会社Screenホールディングス | 基板処理装置および、基板処理装置の制御方法 |
JP2022090272A (ja) * | 2020-12-07 | 2022-06-17 | 株式会社ディスコ | ウエーハ生成装置 |
-
2022
- 2022-03-22 JP JP2022046022A patent/JP2023140142A/ja active Pending
- 2022-08-26 TW TW111132187A patent/TWI830346B/zh active
- 2022-09-14 CN CN202211115057.7A patent/CN116825690A/zh active Pending
- 2022-09-30 US US17/957,048 patent/US11869790B2/en active Active
- 2022-09-30 KR KR1020220125566A patent/KR20230137805A/ko not_active Application Discontinuation
-
2024
- 2024-01-08 US US18/406,516 patent/US20240145287A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US11869790B2 (en) | 2024-01-09 |
KR20230137805A (ko) | 2023-10-05 |
CN116825690A (zh) | 2023-09-29 |
US20230307279A1 (en) | 2023-09-28 |
TW202339049A (zh) | 2023-10-01 |
US20240145287A1 (en) | 2024-05-02 |
TWI830346B (zh) | 2024-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI820256B (zh) | 基板處理設備 | |
JP4464993B2 (ja) | 基板の処理システム | |
JP3258748B2 (ja) | 熱処理装置 | |
TWI253115B (en) | Substrate processing apparatus and substrate processing method | |
JP2905857B2 (ja) | 縦型処理装置 | |
KR101295494B1 (ko) | 기판 처리 장치 및 기판 처리 방법 | |
US11869785B2 (en) | Method of manufacturing semiconductor device and non-transitory computer-readable recording medium | |
KR20180108737A (ko) | 기판 처리 장치 | |
JP2013222949A (ja) | 基板処理装置、基板処理方法及び記憶媒体 | |
JP4080405B2 (ja) | 基板処理装置 | |
JP6204226B2 (ja) | 基板処理装置、基板処理方法 | |
JP2002043395A (ja) | ウエハ搬送システム及びその搬送方法 | |
JP2023140142A (ja) | 基板処理装置、半導体装置の製造方法及びプログラム | |
JP3380570B2 (ja) | 搬送装置 | |
JP7429252B2 (ja) | 基板処理装置、半導体装置の製造方法、基板処理方法及びプログラム | |
JP6704423B2 (ja) | 基板処理装置、半導体装置の製造方法およびプログラム | |
JP4255791B2 (ja) | 基板処理装置 | |
JP4262037B2 (ja) | 基板処理装置 | |
JP2011198957A (ja) | 基板処理装置及び基板保持体及び半導体装置の製造方法 | |
JP4456727B2 (ja) | 半導体装置の製造方法および基板処理装置 | |
JP2002009000A (ja) | 半導体製造装置 | |
JP2007242764A (ja) | 基板処理装置 | |
JP2005093491A (ja) | 基板処理装置 | |
JP2004128003A (ja) | 半導体製造装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230323 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20240202 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240206 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240408 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240521 |