JP2022537523A - 半導体ウェハを研磨するための設備および方法 - Google Patents
半導体ウェハを研磨するための設備および方法 Download PDFInfo
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- 235000012431 wafers Nutrition 0.000 title claims abstract description 206
- 239000004065 semiconductor Substances 0.000 title claims abstract description 146
- 238000005498 polishing Methods 0.000 title claims abstract description 111
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000012546 transfer Methods 0.000 claims abstract description 29
- 238000004140 cleaning Methods 0.000 claims abstract description 8
- 239000000969 carrier Substances 0.000 claims abstract description 5
- 239000012636 effector Substances 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 6
- 230000032258 transport Effects 0.000 description 36
- 239000007788 liquid Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003251 chemically resistant material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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- B24—GRINDING; POLISHING
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- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B24—GRINDING; POLISHING
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- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B24—GRINDING; POLISHING
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- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
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- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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Abstract
Description
半導体ウェハの同時両面研磨のための研磨機は、この明細書ではDSP(double-sided polishing)研磨機とも呼ばれるが、上方および下方研磨プレートを含み、それらは各々、研磨パッドと並んでいる。半導体ウェハは、それらがキャリアの凹部にあるとき、研磨スラリーの存在下で研磨プレート間で研磨される。
半導体ウェハの同時両面研磨のための少なくとも2台の研磨機と、
研磨機のそれぞれの下方研磨プレートの研磨パッド上にあり、半導体ウェハを受けるための凹部を有する、1つ以上のキャリアと、
研磨用半導体ウェハを収容するカセットを送出するための頭上搭載搬送システムと、
頭上搭載搬送システムから送出されたカセットを受け取るための、研磨機の各々に割り当てられた垂直搬送システムとを含み、垂直搬送システムは、研磨用半導体ウェハをカセットから持ち上げるための一体型のウェハ持ち上げ器を含み、設備はさらに、
少なくとも2台の研磨機まで自律的に移動し、マニピュレータを有するロボットを含み、マニピュレータは、ウェハ持ち上げ器から研磨用半導体ウェハを受け取り、研磨用半導体ウェハを凹部のうちの1つに挿入し、研磨動作の終わりに研磨された半導体ウェハを凹部から持ち上げるためのものであり、設備はさらに、
自律的に移動するロボットのマニピュレータから研磨された半導体ウェハを受け取り、研磨された半導体ウェハを、一体型のウェハ受けを有する湿式搬送コンテナに入れるためのウェハ把持器を有する、研磨機の各々に割り当てられたx/yリニアユニットと、
湿式搬送コンテナを研磨された半導体ウェハのためのクリーニングユニットへ搬送するための無人搬送車両とを含む、設備によって達成される。
半導体ウェハの同時両面研磨のための研磨機を少なくとも2台提供するステップと、
カセットに入った研磨用半導体ウェハを頭上搭載搬送システムによって送出するステップと、
垂直搬送システムのウェハ持ち上げ器によって、センタリングされた研磨用半導体ウェハをカセットから持ち上げるステップと、
自律移動ロボットのマニピュレータによって、研磨用半導体ウェハのうちの1つを、垂直搬送システムのウェハ持ち上げ器から、またはセンタリングステーションから受け取るステップと、
自律移動ロボットのマニピュレータによって、研磨用半導体ウェハを少なくとも2台の研磨機のキャリアの凹部に挿入するステップと、
自律移動ロボットのマニピュレータによって、研磨された半導体ウェハをキャリアの凹部のうちの1つから除去するステップと、
x/yリニアユニットのウェハ把持器によって、研磨された半導体ウェハを自律移動ロボットのマニピュレータから受け取るステップと、
ウェハ把持器によって、研磨された半導体ウェハを湿式搬送コンテナのウェハ受けに入れるステップと、
湿式搬送コンテナをx/yリニアユニットから無人搬送車両へ移送するステップと、
無人搬送車両によって、湿式搬送コンテナを研磨された半導体ウェハのためのクリーニングユニットへ搬送するステップとを含む、方法である。
一例として理解されるべき、半導体ウェハの研磨のための、図1に示すこの発明に従った設備1は、3台のDSP研磨機2を含み、それらの下方研磨プレート3が平面図に示されている。下方研磨プレート上にあるのは、半導体ウェハ6用の凹部5を有するキャリア4である。左側に配置されたDSP研磨機は動作中であり、キャリア4の凹部5のすべてに研磨用の半導体ウェハ6が装着されている。このDSP研磨機の閉鎖された上方研磨プレートと、他の2台のDSP研磨機の開放された上方研磨プレートとは、図示されていない。中央のDSP研磨機2には研磨用半導体ウェハ6が部分的に装填され、一方、右側に配置されたDSP研磨機2は無装填状態である。
1:半導体ウェハを研磨するための設備、2:DSP研磨機、3:下方研磨プレート、4:キャリア、5:凹部、6:半導体ウェハ、7:自律移動ロボット、8:OHT、9:x/yリニアユニット、10:湿式搬送コンテナ、11:AGV、12:クリーニングユニット、13:垂直搬送システム、14:カセット受け、15:ウェハ持ち上げ器、16:ガイド、17:ウェハ把持器、18:エンドエフェクタ、19:バー、20:センタリングステーション。
Claims (6)
- 半導体ウェハを研磨するための設備であって、
半導体ウェハの同時両面研磨のための少なくとも2台の研磨機と、
前記研磨機のそれぞれの下方研磨プレートの研磨パッド上にあり、半導体ウェハを受けるための凹部を有する、1つ以上のキャリアと、
研磨用半導体ウェハを収容するカセットを送出するための頭上搭載搬送システムと、
前記頭上搭載搬送システムから送出された前記カセットを受け取るための、前記研磨機の各々に割り当てられた垂直搬送システムとを含み、前記垂直搬送システムは、前記研磨用半導体ウェハを前記カセットから持ち上げるための一体型のウェハ持ち上げ器を含み、前記設備はさらに、
前記少なくとも2台の研磨機まで自律的に移動し、マニピュレータを有するロボットを含み、前記マニピュレータは、前記ウェハ持ち上げ器から前記研磨用半導体ウェハを受け取り、前記研磨用半導体ウェハを前記凹部のうちの1つに挿入し、研磨動作の終わりに研磨された半導体ウェハを前記凹部から持ち上げるためのものであり、前記設備はさらに、
自律的に移動する前記ロボットの前記マニピュレータから前記研磨された半導体ウェハを受け取り、前記研磨された半導体ウェハを、一体型のウェハ受けを有する湿式搬送コンテナに入れるためのウェハ把持器を有する、前記研磨機の各々に割り当てられたx/yリニアユニットと、
前記湿式搬送コンテナを研磨された半導体ウェハのためのクリーニングユニットへ搬送するための無人搬送車両とを含む、設備。 - 前記カセットは開放されていることを特徴とする、請求項1に記載の設備。
- 3~10台の研磨機を特徴とする、請求項1または2に記載の設備。
- 前記ウェハ把持器はエンドエフェクタを有し、前記エンドエフェクタは前記半導体ウェハをウェハの縁で保持し、前記湿式搬送コンテナの前記ウェハ受けのスロット間で漬かることを特徴とする、請求項1~3のいずれか1項に記載の設備。
- 半導体ウェハを研磨するための方法であって、
半導体ウェハの同時両面研磨のための研磨機を少なくとも2台提供するステップと、
カセットに入った研磨用半導体ウェハを頭上搭載搬送システムによって送出するステップと、
垂直搬送システムのウェハ持ち上げ器によって、研磨用半導体ウェハを前記カセットから持ち上げるステップと、
自律移動ロボットのマニピュレータによって、前記研磨用半導体ウェハのうちの1つを、前記垂直搬送システムの前記ウェハ持ち上げ器から、またはセンタリングステーションから受け取るステップと、
前記自律移動ロボットの前記マニピュレータによって、前記研磨用半導体ウェハを少なくとも2台の前記研磨機のキャリアの凹部に挿入するステップと、
前記自律移動ロボットの前記マニピュレータによって、研磨された半導体ウェハを前記キャリアの前記凹部のうちの1つから除去するステップと、
x/yリニアユニットのウェハ把持器によって、前記研磨された半導体ウェハを前記自律移動ロボットの前記マニピュレータから受け取るステップと、
前記ウェハ把持器によって、前記研磨された半導体ウェハを湿式搬送コンテナのウェハ受けに入れるステップと、
前記湿式搬送コンテナを前記x/yリニアユニットから無人搬送車両へ移送するステップと、
前記無人搬送車両によって、前記湿式搬送コンテナを研磨された半導体ウェハのためのクリーニングユニットへ搬送するステップとを含む、方法。 - 前記研磨機のうちの少なくとも1台上の前記半導体ウェハのうちのいくつかを、前記自律移動ロボットが前記半導体ウェハのうちの他のいくつかの半導体ウェハのうちの1つを受け取り、それを前記凹部のうちの1つに挿入し、または、それを前記凹部のうちの1つから除去する間に、研磨するステップをさらに含む、請求項5に記載の方法。
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