JP2022514400A - 耐食性カーボンコーティング - Google Patents
耐食性カーボンコーティング Download PDFInfo
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- JP2022514400A JP2022514400A JP2021535714A JP2021535714A JP2022514400A JP 2022514400 A JP2022514400 A JP 2022514400A JP 2021535714 A JP2021535714 A JP 2021535714A JP 2021535714 A JP2021535714 A JP 2021535714A JP 2022514400 A JP2022514400 A JP 2022514400A
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/40—Coatings including alternating layers following a pattern, a periodic or defined repetition
- C23C28/44—Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by a measurable physical property of the alternating layer or system, e.g. thickness, density, hardness
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Abstract
Description
i)基材;
ii)シード層;
iii)CVD法を介して析出されたバリア層;および
iv)PVD法を介して析出された機能層;
を含む。
i)基材;
ii)シード層;
iii)CVD法を介して析出されたDLCを含むバリア層;および
iv)ta-Cを含む機能層;
を含む。
i)シード層;
ii)CVD法を介して析出されたバリア層;および
iii)PVD法を介して析出された機能層;
を含む。
i)シード層;
ii)CVD法を介して析出されたDLCを含むバリア層;および
iii)ta-Cを含む機能層;
を含み得る。
i)シード層;
ii)ta-Cを含む中間層;
iii)CVD法を介して析出されたDLCを含むバリア層;および
iv)ta-Cを含む機能層;
を含み得る。
i)基材を提供する工程;
ii)基材上にシード層を析出させる工程;
iii)CVD法を介して基材上に層を析出させる工程;および
iv)PVD法を介して層の基材上に析出させる工程;
を含む。
i)基材;
ii)シード層;
iii)CVD法を介して析出されたバリア層;および
iv)PVD法を介して析出された機能層;
を含む。
i)鋼基材;
ii)0.05μmから2μmの厚さを有するシード層;
iii)CVD法により析出されたバリア層であって、DLCを含みかつ10nmまたはそれ以下の厚さを有する、バリア層;および
iv)CVAによって析出され、0.1μmから3μmの厚さを有する、ta-Cを含む層;
を含む。
i)鋼基材;
ii)0.05μmから2μmの厚さを有するシード層;
iii)CVD法により析出されたバリア層であって、DLCを含みかつ2μmまたはそれ以下の厚さを有する、バリア層;および
iv)CVAによって析出されかつ0.1μmから3μmの厚さを有する、ta-Cを含む層;
を含む。
i)鋼基材;
ii)0.05μmから2μmの厚さを有するシード層;
iii)0.1μmから1.0μmの厚さを有する、ta-Cを含む中間層;
iv)CVD法により析出されたバリア層であって、DLCを含みかつ2μmまたはそれ以下の厚さを有する、バリア層;および
v)CVAによって析出されかつ0.1μmから3μmの厚さを有する、ta-Cを含む層;
を含む。
本発明による耐食性フィルムを作製するためのプロトコルを以下に提供する:
a.高速度鋼(HSS)基材を、洗剤を使用した超音波洗浄によるコーティングのため、まず調製する。次に、この基材を、(真空業界で使用される標準的な洗浄プロセスに従って)脱イオン水ですすぎ、次いで乾燥させる。
b.洗浄されたHSS基材を、スパッタリング、CVD、およびFCVAターゲット/ソースを有する真空チャンバー内に配置する。
c.チャンバーをポンプダウンして圧力を1×10-5Torr(0.00133Pa)未満に下げ、そして150℃と200℃との間に加熱する。
d.基材の表面を活性化して接着を促進するために、チャンバー内でイオン洗浄を行う。
e.シード層の析出:スパッタリング、100℃~150℃、NiCrターゲット、層厚さ=1.0μm。
f.バリア層の析出:プラズマ支援CVD、C2H2(流速=100sccm)およびAr(流速=200sccm)、バイアス電圧=600V、バイアス電流=8A、バイアスデューティサイクル=50%;層の厚さ=0.2μm。
g.機能層析出:FCVA、<100℃、固体グラファイトターゲット、コーティング厚=1.3μm。
塩水噴霧試験を使用して、コーティングなしの基材およびDLCでコーティングされた基材と比較した本発明のコーティング(実施例1で製造されたもの)の耐食性を測定した。
a.コーティングなしの高速度鋼W6Mo5Cr4V2基材(表面処理なし)。硬さ=746.9HV
b.ta-Cコーティング高速度鋼W6Mo5Cr4V2。コーティングの厚さ=2.3μm。硬さ=2212HV。コーティングは、バリア層析出ステップ(f)を省略して、実施例1の方法に従って調製した。
c.本発明のta-Cコーティングでコーティングされた高速度鋼W6Mo5Cr4V2(実施例1を参照)。コーティングの厚さ=2.5μm。硬さ=2317HV
d.DLCのみでコーティングされた高速度鋼W6Mo5Cr4V2基材。コーティングの厚さ=2.5μm。硬さ=1540HV。
・塩溶液濃度:(5±1)%NaCl
・pH=6.5~7.2
・塩水噴霧の沈降速度:(1~2mL)/80cm2;
・塩水噴霧ボックス内の温度:35±2℃;
・10分ごとに1分間噴霧する。
a)コーティングなし-10分後、表面に明らかな錆あり(図1Aを参照)
b)ta-Cコーティング-18時間後に目に見える、消去可能な錆あり(図1Bを参照)。スクラッチ試験に供したとき、このコーティングは38.66Nの臨界荷重を示した。
c)本発明-100時間後、明らかな錆なし(図1Cを参照)。スクラッチ試験に供したとき、このコーティングは30.60Nの臨界荷重を示した。
d)DLCコーティング-100時間後、明らかな錆なし(図1Dを参照)。スクラッチ試験に供したとき、このコーティングは20.22Nの臨界荷重を示した。
・機器:テーバーリニアアブレイザーTLA 5700
・アブラダント:CS-17Wearaser(登録商標)
・テスト荷重:1kg重
・サイクル速度:60サイクル/分
・ストローク長:15mm
高速度鋼基材を本発明のコーティングでコーティングするためのプロトコルを以下に説明する。
本発明のさらなるコーティングされた基材を、実施例3に記載されたプロトコルを使用して、以下の構造で調製した。
・高速度鋼基材
・NiCr(1.0μm)
・Ti(0.2μm)
・ta-C(1.0μm)
・DLC(1.0μm)
・ta-C(0.5μm)
・高速度鋼基材
・NiCr(1.0μm)
・Ti(0.2μm)
・ta-C(0.4μm)
・DLC(1.0μm)
・ta-C(1.0μm)
・高速度鋼基材
・NiCr(1.0μm)
・Ti(0.2μm)
・ta-C(0.5μm)
・DLC(0.2μm)
・ta-C(0.5μm)
・DLC(0.2μm)
・ta-C(0.5μm)
Claims (20)
- 多層コーティングを有する金属製基材であって、順に:
i)金属製基材;
ii)シード層;
iii)CVD法を介して析出されたDLCを含むバリア層;および
iv)PVD法を介して析出されたta-Cを含む機能層
を含み、
該コーティングの全体の厚さが5μmまたはそれ以下である、基材。 - 複数の交互のバリア層および機能層を含む、請求項1に記載のコーティングされた基材。
- 最大10個のバリア層および最大10個の機能層の交互の層を含む、請求項2に記載のコーティングされた基材。
- 前記シード層ii)と前記バリア層iii)との間に中間層をさらに含む、請求項1から3のいずれかに記載のコーティングされた基材。
- 前記中間層がta-Cを含む、請求項4に記載のコーティングされた基材。
- 前記基材内の全てのバリア層の総厚さが最大1.0μmである、請求項1から5のいずれかに記載のコーティングされた基材。
- 前記基材内の全てのバリア層の総厚さが0.05μmから0.5μmである、請求項1から6のいずれかに記載のコーティングされた基材。
- 前記機能層の厚さが0.1μmから3μmである、請求項1から7のいずれかに記載のコーティングされた基材。
- 前記シード層の厚さが0.05μmから2μmである、請求項1から8のいずれかに記載のコーティングされた基材。
- 前記機能層がFCVAによって析出される、請求項1から9のいずれかに記載のコーティングされた基材。
- 前記シード層が、Cr、W、Ti、NiCr、Siまたはそれらの混合物から形成される、請求項1から10のいずれかに記載のコーティングされた基材。
- 前記基材が鋼基材である、請求項1から11のいずれかに記載のコーティングされた基材。
- 前記基材が、ステンレス鋼、HSS、工具鋼または合金鋼を含む、請求項12に記載のコーティングされた基材。
- 前記基材が、Ti、Tiの合金、Al、またはAlの合金を含む、請求項1から11のいずれかに記載のコーティングされた基材。
- 少なくとも2つのバリア層および少なくとも2つの機能層を含む、請求項1から14のいずれかに記載のコーティングされた基材。
- 少なくとも3つのバリア層および少なくとも2つの機能層を含む、請求項1から15のいずれかに記載のコーティングされた基材。
- 順に:
i)鋼基材;
ii)0.05μmから2μmの厚さを有するシード層;
iii)CVD法により析出されたバリア層であって、DLCを含みかつ3μmまたはそれ以下の厚さを有する、バリア層;および
iv)CVAによって析出されかつ0.1μmから3μmの厚さを有する、ta-Cを含む層;
を含む、請求項1に記載の基材。 - 順に:
i)鋼基材;
ii)0.05μmから2μmの厚さを有するシード層;
iii)0.1μmから1.0μmの厚さを有する、ta-Cを含む中間層;
iv)CVD法により析出されたバリア層であって、DLCを含みかつ2μmまたはそれ以下の厚さを有する、バリア層;および
v)CVAによって析出されかつ0.1μmから3μmの厚さを有する、ta-Cを含む層;
を含む、請求項1に記載の基材。 - 基材をコーティングする方法であって、
i)金属製基材を提供する工程;
ii)該基材上にシード層を析出させる工程;
iii)CVD法を介して5μmまたはそれ以下の厚さを有するDLCの層を該基材上に析出させる工程;および
iv)PVD法を介して該基材上にta-Cの層を析出させる工程;
を含む、方法。 - 請求項1から18のいずれかに記載のコーティングされた基材を作製するための、請求項19に記載の方法。
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PCT/EP2019/085617 WO2020127240A1 (en) | 2018-12-21 | 2019-12-17 | Corrosion resistant carbon coatings |
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CN113151826B (zh) * | 2021-04-23 | 2022-06-17 | 艾瑞森表面技术(苏州)股份有限公司 | 一种耐腐蚀镀膜工艺及其制得的耐腐蚀镀膜涂层 |
CN115433901A (zh) * | 2021-06-04 | 2022-12-06 | 纳峰真空镀膜(上海)有限公司 | 防静电涂层 |
KR102653658B1 (ko) * | 2021-11-17 | 2024-04-02 | (주)제이 앤 엘 테크 | 연료전지용 금속분리판 및 그 제조방법 |
EP4281601B1 (en) | 2022-01-20 | 2024-01-03 | Nanofilm Technologies International Limited | Carbon coated electrodes |
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WO2024008903A1 (en) * | 2022-07-06 | 2024-01-11 | Oerlikon Surface Solutions Ag, Pfäffikon | Metal free coating comprising tetrahedral hydrogen-free amorphous carbon |
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