JP2021508956A - ファクトリインターフェースチャンバのフィルタパージを用いた基板処理装置及び方法 - Google Patents
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Abstract
【選択図】図2
Description
[001]本出願は、2018年2月27日に出願された「ファクトリインターフェースチャンバのフィルタパージを用いた基板処理装置及び方法」(代理人整理番号第44014871US01号)と題する米国非仮出願第15/905,959号の優先権を主張するものであり、あらゆる目的のためにその全体が参照することにより本書に組み込まれる。
ファクトリインターフェースチャンバへの作業員のアクセスを提供するように構成されたアクセスドアを有するファクトリインターフェースチャンバを提供することと、ファクトリインターフェースチャンバに供給されるパージガスの流れをフィルタ処理するように構成されたチャンバフィルタを提供することと、周囲空気によるチャンバフィルタの水分汚染を最小限に抑えるために、アクセスドアが開いているときにチャンバフィルタにフラッシングガスを供給することとを含む。
1)相対湿度レベル(室温における%RH)、
2)温度(T)、
3)O2の量、
4)不活性ガスの量、
5)クリーンドライエアの量、又は
6)汚染化学物質の量(例えば、アミン、塩基、1又は複数の揮発性有機化合物(VOC)等の量)。
本開示の範囲内にある上記で開示された装置及び方法の修正は、当業者には容易に明らかであろう。したがって、他の実施形態は、特許請求の範囲によって定義されるように、本開示の範囲内に含まれ得ることを理解されたい。
Claims (15)
- ファクトリインターフェース装置であって、
1又は複数の基板キャリアをドッキングするように構成された1又は複数のロードポートを有する第1の壁と、
ファクトリインターフェースチャンバを形成する追加の壁であって、前記壁の少なくとも1つは、前記ファクトリインターフェースチャンバへの作業員のアクセスを容易にするように構成されたアクセスドアを含む、追加の壁と、
前記ファクトリインターフェースチャンバに連結され、前記ファクトリインターフェースチャンバを介した基板の移送中に、前記ファクトリインターフェースチャンバ内の1又は複数の環境条件を制御するためにパージガスを供給するように構成された環境制御システムと、
前記ファクトリインターフェースチャンバに提供されるパージガスをフィルタ処理するように構成されたチャンバフィルタと、
周囲空気による前記チャンバフィルタの水分汚染を最小限に抑えるために、前記アクセスドアが開いているときに前記チャンバフィルタにフラッシングガスを供給するように構成されたフィルタパージ装置と
を備える装置。 - 前記フラッシングガスがクリーンドライエアである、請求項1に記載のファクトリインターフェース装置。
- 前記パージガスが不活性ガスであり、前記フラッシングガスがクリーンドライエアである、請求項1に記載のファクトリインターフェース装置。
- 前記フィルタパージ装置が、前記チャンバフィルタの上流に位置する前記ファクトリインターフェースチャンバのプレナムチャンバに連結された、前記フラッシングガスを提供するクリーンドライエア供給源を備える、請求項1に記載のファクトリインターフェース装置。
- 前記フラッシングガスが、20℃において10%未満の相対湿度レベルを有するクリーンドライエアを含む、請求項1に記載のファクトリインターフェース装置。
- 前記フィルタパージ装置は、クリーンドライエア供給源と、前記クリーンドライエア供給源とプレナムチャンバとの間に連結されたバルブとを備え、前記バルブは、前記チャンバフィルタへの前記フラッシングガスの流れを制御するように構成される、請求項1に記載のファクトリインターフェース装置。
- 前記アクセスドアが開かれる前に、前記チャンバフィルタの上流に位置するプレナムチャンバへの前記フラッシングガスの流れを開くための制御信号を提供するように構成されたコントローラを備える、請求項1に記載のファクトリインターフェース装置。
- 前記環境制御システムは、
前記ファクトリインターフェースチャンバ内の
相対湿度レベル、
O2の量、
温度、
不活性ガスの量、
クリーンドライエアの量、又は
汚染化学物質の量、
を含む、前記ファクトリインターフェースチャンバ内の1又は複数の環境条件を制御するように構成される、請求項1に記載のファクトリインターフェース装置。 - 前記パージガスが、アルゴンガス、N2ガス、及びヘリウムガスの群から選択される不活性ガスを含む、請求項1に記載のファクトリインターフェース装置。
- 前記パージガスがクリーンドライエアを含む、請求項1に記載のファクトリインターフェース装置。
- チャンバフィルタパージ装置であって、
アクセスドアを含むファクトリインターフェースチャンバと
前記ファクトリインターフェースチャンバに提供されるパージガスをフィルタ処理するように構成されたチャンバフィルタと
周囲空気からの前記チャンバフィルタの水分汚染を最小限に抑えるために、前記アクセスドアが開いているときに前記チャンバフィルタにフラッシングガスを供給するように構成されたフィルタパージ装置と
を備える装置。 - 前記フラッシングガスが、室温において10%未満の相対湿度レベルを有するクリーンドライエアを含む、請求項11に記載のチャンバフィルタパージ装置。
- 前記フィルタパージ装置は、
前記フラッシングガスの供給源を提供するクリーンドライエア供給源と、
前記チャンバフィルタの上流に位置し、前記フラッシングガスを受け入れるように構成されたプレナムチャンバと
を備える、請求項11に記載のチャンバフィルタパージ装置。 - パージ制御方法であって、
ファクトリインターフェースチャンバへの作業員のアクセスを提供するように構成されたアクセスドアを有する前記ファクトリインターフェースチャンバを提供することと、
前記ファクトリインターフェースチャンバに供給されるパージガスの流れをフィルタ処理するように構成されたチャンバフィルタを提供することと、
周囲空気による前記チャンバフィルタの水分汚染を最小限に抑えるために、前記アクセスドアが開いているときに前記チャンバフィルタにフラッシングガスを供給することと
を含む方法。 - 前記アクセスドアが開いているときは、前記チャンバフィルタを通して前記フラッシングガスを常に流すことを含む、請求項14に記載のパージ制御方法。
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US15/905,959 | 2018-02-27 | ||
US15/905,959 US10763134B2 (en) | 2018-02-27 | 2018-02-27 | Substrate processing apparatus and methods with factory interface chamber filter purge |
PCT/US2019/017637 WO2019168662A1 (en) | 2018-02-27 | 2019-02-12 | Substrate processing apparatus and methods with factory interface chamber filter purge |
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KR (2) | KR102269564B1 (ja) |
CN (1) | CN111788667A (ja) |
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WO2022239538A1 (ja) * | 2021-05-13 | 2022-11-17 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法およびプログラム |
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KR102297447B1 (ko) | 2013-08-12 | 2021-09-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 팩토리 인터페이스 환경 제어들을 갖는 기판 프로세싱 시스템들, 장치, 및 방법들 |
JP6822953B2 (ja) | 2014-11-25 | 2021-01-27 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板キャリア及びパージチャンバの環境制御を伴う基板処理のシステム、装置、及び方法 |
WO2018236544A1 (en) | 2017-06-23 | 2018-12-27 | Applied Materials, Inc. | DETACHABLE SIDE STORAGE NACELLE APPARATUS, HEATED SIDE STORAGE NACELLE APPARATUS, SYSTEMS AND METHODS |
US10763134B2 (en) * | 2018-02-27 | 2020-09-01 | Applied Materials, Inc. | Substrate processing apparatus and methods with factory interface chamber filter purge |
JP6963179B2 (ja) * | 2018-03-15 | 2021-11-05 | シンフォニアテクノロジー株式会社 | Efem |
JP6876020B2 (ja) * | 2018-07-27 | 2021-05-26 | 株式会社Kokusai Electric | 基板処理装置および半導体装置の製造方法並びにプログラム |
JP7206678B2 (ja) * | 2018-07-30 | 2023-01-18 | Tdk株式会社 | ロードポート装置、半導体製造装置及びポッド内雰囲気の制御方法 |
US11244844B2 (en) * | 2018-10-26 | 2022-02-08 | Applied Materials, Inc. | High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods |
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US11373891B2 (en) | 2018-10-26 | 2022-06-28 | Applied Materials, Inc. | Front-ducted equipment front end modules, side storage pods, and methods of operating the same |
CN113838767B (zh) * | 2020-06-08 | 2023-12-12 | 长鑫存储技术有限公司 | 显影装置及显影方法 |
US11810805B2 (en) * | 2020-07-09 | 2023-11-07 | Applied Materials, Inc. | Prevention of contamination of substrates during gas purging |
US20240096671A1 (en) * | 2022-09-19 | 2024-03-21 | Entegris, Inc. | Substrate container systems and methods of purging a substrate container |
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