JP2021012941A - 光電気複合伝送モジュール - Google Patents
光電気複合伝送モジュール Download PDFInfo
- Publication number
- JP2021012941A JP2021012941A JP2019126116A JP2019126116A JP2021012941A JP 2021012941 A JP2021012941 A JP 2021012941A JP 2019126116 A JP2019126116 A JP 2019126116A JP 2019126116 A JP2019126116 A JP 2019126116A JP 2021012941 A JP2021012941 A JP 2021012941A
- Authority
- JP
- Japan
- Prior art keywords
- thickness direction
- photoelectric conversion
- transfer member
- heat transfer
- conversion unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005540 biological transmission Effects 0.000 title claims abstract description 83
- 239000002131 composite material Substances 0.000 title claims abstract description 78
- 238000006243 chemical reaction Methods 0.000 claims abstract description 152
- 230000003287 optical effect Effects 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- 239000004020 conductor Substances 0.000 claims description 20
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 230000005622 photoelectricity Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 97
- 230000017525 heat dissipation Effects 0.000 description 23
- 230000005611 electricity Effects 0.000 description 18
- 239000000463 material Substances 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 239000013307 optical fiber Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000012792 core layer Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- -1 stainless steel Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
- Optical Integrated Circuits (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
以下の各変形例において、上記した一実施形態と同様の部材および工程については、同一の参照符号を付し、その詳細な説明を省略する。また、各変形例は、特記する以外、一実施形態と同様の作用効果を奏することができる。さらに、一実施形態およびその変形例を適宜組み合わせることができる。
2 光電気複合伝送モジュール
3 光電気混載基板
4 プリント配線板
5 光電変換部
6 筐体
7 光導波路
14 金属支持層
18 放熱部
23 放熱開口部
26 第1部分
27 第2部分
28 連結部分
41 第1壁
42 第2壁
46 第1伝熱部材
47 第2伝熱部材
48 第1重複領域
50 開口部
63 第1放熱層
64 第2放熱層
65 弾性部材
Claims (10)
- 光電気混載基板と、
前記光電気混載基板と電気的に接続されるプリント配線板と、
前記光電気混載基板と光学的および電気的に接続される光電変換部と、
前記光電変換部に対して厚み方向に隣接する伝熱部材と、
前記光電気混載基板、前記プリント配線板、前記光電変換部および前記伝熱部材を収容する金属製の筐体であって、第1壁を含む前記筐体とを備え、
前記光電気混載基板と、前記光電変換部と、前記伝熱部材と、前記第1壁とが、厚み方向一方側に向かって順に配置され、
前記プリント配線板は、平面視で、
互いに間隔が隔てられる第1部分および第2部分と、
前記第1部分および前記第2部分を連結する連結部分とを一体的に有し、
前記第1部分、前記第2部分および前記連結部分は、
前記厚み方向に投影したときに、前記光電変換部と重ならず、前記光電気混載基板と重なり、前記厚み方向に直交する直交方向に投影したときに、前記光電変換部と重なる領域を含むことを特徴とする、光電気複合伝送モジュール。 - 前記伝熱部材が、前記第1壁と一体であることを特徴とする、請求項1に記載の光電気複合伝送モジュール。
- 前記光電変換部の前記厚み方向一方面と、前記伝熱部材の前記厚み方向他方面とに接触する放熱層をさらに備えることを特徴とする、請求項1または2に記載の光電気複合伝送モジュール。
- 前記光電気混載基板に対して、前記厚み方向において前記光電変換部の反対側に隣接する第2伝熱部材をさらに備え、
前記筐体が、前記第2伝熱部材に対して、前記厚み方向において前記光電気混載基板の反対側に配置される第2壁をさらに備えることにより、
前記光電気混載基板と、前記第2伝熱部材と、前記第2壁とが、前記厚み方向他方側に向かって順に配置されていることを特徴とする、請求項1〜3のいずれか一項に記載の光電気複合伝送モジュール。 - 前記第2伝熱部材が、前記第2壁と一体であることを特徴とする、請求項4に記載の光電気複合伝送モジュール。
- 前記光電気混載基板の前記厚み方向他方面と、前記第2伝熱部材の前記厚み方向一方面とに接触する第2放熱層をさらに備えることを特徴とする、請求項5に記載の光電気複合伝送モジュール。
- 前記伝熱部材の前記厚み方向他方面が、前記光電変換部の前記厚み方向一方面に接触し、
前記第2伝熱部材が、弾性部材であることを特徴とする、請求項4に記載の光電気複合伝送モジュール。 - 前記光電気混載基板は、電気回路基板を含み、
前記電気回路基板は、金属支持層、絶縁層および導体層を前記厚み方向に順に備えることを特徴とする、請求項1〜7のいずれか一項に記載の光電気複合伝送モジュール。 - 前記絶縁層が、前記厚み方向を貫通し、前記金属支持層の前記厚み方向一方面を露出する貫通孔を有し、
前記絶縁層における前記貫通孔の内周面、および、前記金属支持層の前記厚み方向一方面に接触する放熱部をさらに備えることを特徴とする、請求項8に記載の光電気複合伝送モジュール。 - 前記プリント配線板は、前記領域に囲まれる開口部を有し、
前記光電変換部が、前記開口部内に配置されていることを特徴とする、請求項1〜9のいずれか一項に記載の光電気複合伝送モジュール。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019126116A JP7359579B2 (ja) | 2019-07-05 | 2019-07-05 | 光電気複合伝送モジュール |
US17/624,488 US20220357535A1 (en) | 2019-07-05 | 2020-07-03 | Opto-electric composite transmission module |
CN202080047585.6A CN114051588A (zh) | 2019-07-05 | 2020-07-03 | 光电复合传输模块 |
TW109122657A TW202109107A (zh) | 2019-07-05 | 2020-07-03 | 光電複合傳送模組 |
KR1020217043119A KR20220027088A (ko) | 2019-07-05 | 2020-07-03 | 광전기 복합 전송 모듈 |
PCT/JP2020/026231 WO2021006214A1 (ja) | 2019-07-05 | 2020-07-03 | 光電気複合伝送モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019126116A JP7359579B2 (ja) | 2019-07-05 | 2019-07-05 | 光電気複合伝送モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021012941A true JP2021012941A (ja) | 2021-02-04 |
JP7359579B2 JP7359579B2 (ja) | 2023-10-11 |
Family
ID=74114216
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019126116A Active JP7359579B2 (ja) | 2019-07-05 | 2019-07-05 | 光電気複合伝送モジュール |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220357535A1 (ja) |
JP (1) | JP7359579B2 (ja) |
KR (1) | KR20220027088A (ja) |
CN (1) | CN114051588A (ja) |
TW (1) | TW202109107A (ja) |
WO (1) | WO2021006214A1 (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009049333A (ja) * | 2007-08-23 | 2009-03-05 | Sumitomo Electric Ind Ltd | 放熱装置及びその放熱装置を備えた光トランシーバ |
JP2009192818A (ja) * | 2008-02-14 | 2009-08-27 | Nitto Denko Corp | 光電気混載基板の製法およびそれによって得られる光電気混載基板 |
JP2011107206A (ja) * | 2009-11-12 | 2011-06-02 | Fujitsu Ltd | 光電気混載基板、および、光電気混載基板の製造方法 |
JP2012150223A (ja) * | 2011-01-18 | 2012-08-09 | Hitachi Cable Ltd | 光電変換モジュール |
JP2014092653A (ja) * | 2012-11-02 | 2014-05-19 | Hitachi Metals Ltd | 光モジュール |
JP2015022129A (ja) * | 2013-07-18 | 2015-02-02 | 富士通コンポーネント株式会社 | 光モジュール |
JP2016100426A (ja) * | 2014-11-20 | 2016-05-30 | 日立金属株式会社 | 通信モジュール |
US20170023751A1 (en) * | 2015-07-21 | 2017-01-26 | Tyco Electronics Svenska Holdings Ab | Optoelectronic Module With Improved Heat Management |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1248128B1 (en) * | 2001-04-03 | 2007-08-15 | Autonetworks Technologies, Ltd. | Optical connector, optical element holding structure, and structure of a mount section of an optical connector |
WO2012076986A1 (en) * | 2010-12-08 | 2012-06-14 | Fci | Printed circuit board assembly and a method for manufacturing the printed circuit board assembly |
JP5879810B2 (ja) * | 2011-08-12 | 2016-03-08 | 日立金属株式会社 | 光モジュール及び光モジュール付きケーブル |
US9110248B2 (en) * | 2011-09-30 | 2015-08-18 | Sumitomo Electric Industries, Ltd. | Connector assembly |
JP6251989B2 (ja) * | 2012-06-19 | 2017-12-27 | 住友ベークライト株式会社 | 光電気混載基板および電子機器 |
JP6045829B2 (ja) * | 2012-07-13 | 2016-12-14 | 日東電工株式会社 | 光電気混載基板 |
JP6245569B2 (ja) * | 2013-06-06 | 2017-12-13 | 日東電工株式会社 | 光電気混載基板 |
JP2017198950A (ja) * | 2016-04-28 | 2017-11-02 | APRESIA Systems株式会社 | 光通信モジュール |
JP6880777B2 (ja) * | 2017-01-27 | 2021-06-02 | 富士通株式会社 | 光モジュール |
JP6941460B2 (ja) * | 2017-03-31 | 2021-09-29 | 日東電工株式会社 | 光電気混載基板および光電気混載基板アセンブリ |
JP7477306B2 (ja) * | 2020-01-17 | 2024-05-01 | 日東電工株式会社 | 光電気伝送複合モジュールおよび光電気混載基板 |
JP7477310B2 (ja) * | 2020-01-23 | 2024-05-01 | 日東電工株式会社 | 光電変換モジュール |
JPWO2021187535A1 (ja) * | 2020-03-19 | 2021-09-23 |
-
2019
- 2019-07-05 JP JP2019126116A patent/JP7359579B2/ja active Active
-
2020
- 2020-07-03 KR KR1020217043119A patent/KR20220027088A/ko unknown
- 2020-07-03 WO PCT/JP2020/026231 patent/WO2021006214A1/ja active Application Filing
- 2020-07-03 CN CN202080047585.6A patent/CN114051588A/zh active Pending
- 2020-07-03 US US17/624,488 patent/US20220357535A1/en active Pending
- 2020-07-03 TW TW109122657A patent/TW202109107A/zh unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009049333A (ja) * | 2007-08-23 | 2009-03-05 | Sumitomo Electric Ind Ltd | 放熱装置及びその放熱装置を備えた光トランシーバ |
JP2009192818A (ja) * | 2008-02-14 | 2009-08-27 | Nitto Denko Corp | 光電気混載基板の製法およびそれによって得られる光電気混載基板 |
JP2011107206A (ja) * | 2009-11-12 | 2011-06-02 | Fujitsu Ltd | 光電気混載基板、および、光電気混載基板の製造方法 |
JP2012150223A (ja) * | 2011-01-18 | 2012-08-09 | Hitachi Cable Ltd | 光電変換モジュール |
JP2014092653A (ja) * | 2012-11-02 | 2014-05-19 | Hitachi Metals Ltd | 光モジュール |
JP2015022129A (ja) * | 2013-07-18 | 2015-02-02 | 富士通コンポーネント株式会社 | 光モジュール |
JP2016100426A (ja) * | 2014-11-20 | 2016-05-30 | 日立金属株式会社 | 通信モジュール |
US20170023751A1 (en) * | 2015-07-21 | 2017-01-26 | Tyco Electronics Svenska Holdings Ab | Optoelectronic Module With Improved Heat Management |
Also Published As
Publication number | Publication date |
---|---|
US20220357535A1 (en) | 2022-11-10 |
TW202109107A (zh) | 2021-03-01 |
WO2021006214A1 (ja) | 2021-01-14 |
JP7359579B2 (ja) | 2023-10-11 |
CN114051588A (zh) | 2022-02-15 |
KR20220027088A (ko) | 2022-03-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106371176B (zh) | 具有改善的热管理的光电模块 | |
JP4743107B2 (ja) | 光電気配線部材 | |
JP6880777B2 (ja) | 光モジュール | |
JP2007019411A (ja) | 光−電気変換装置 | |
JP2017198950A (ja) | 光通信モジュール | |
US20230046449A1 (en) | Photoelectric conversion module | |
JP2018097263A (ja) | 光モジュール | |
WO2021145376A1 (ja) | 光電気伝送複合モジュールおよび光電気混載基板 | |
WO2021187535A1 (ja) | 光電気伝送複合モジュール | |
JP2020021805A (ja) | 光モジュール | |
JP2009170674A (ja) | 光モジュール | |
WO2021006214A1 (ja) | 光電気複合伝送モジュール | |
CN114815087A (zh) | 光收发模块及光收发器 | |
WO2021161915A1 (ja) | 光電気混載基板および光電気複合伝送モジュール | |
JP2021162721A (ja) | 光電変換モジュール | |
JP4935936B2 (ja) | 光電気配線部材 | |
KR100575639B1 (ko) | 방열판 및 피씨비 일체형 광저장 장치용 모듈 | |
JP2021149045A (ja) | 光モジュール | |
JP2021052024A (ja) | 光電気複合伝送モジュール | |
JP2013073062A (ja) | 光モジュール | |
JP2020166188A (ja) | 光電気混載基板 | |
JP2009054654A (ja) | 光モジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220623 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230418 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230613 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230905 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230928 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7359579 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |