JP2021000712A - 保持装置 - Google Patents
保持装置 Download PDFInfo
- Publication number
- JP2021000712A JP2021000712A JP2019116601A JP2019116601A JP2021000712A JP 2021000712 A JP2021000712 A JP 2021000712A JP 2019116601 A JP2019116601 A JP 2019116601A JP 2019116601 A JP2019116601 A JP 2019116601A JP 2021000712 A JP2021000712 A JP 2021000712A
- Authority
- JP
- Japan
- Prior art keywords
- holding
- holding surface
- workpiece
- work piece
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims abstract description 44
- 239000012530 fluid Substances 0.000 claims abstract description 28
- 238000002347 injection Methods 0.000 claims description 24
- 239000007924 injection Substances 0.000 claims description 24
- 230000007246 mechanism Effects 0.000 description 12
- 239000007788 liquid Substances 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 238000003754 machining Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
- B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Jigs For Machine Tools (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
11a 表面
11b 裏面
13 分割予定ライン(ストリート)
15 デバイス
2 保持装置(保持機構、保持ユニット)
4 保持テーブル(保持手段)
4a 保持面
4b 吸引溝(凹部)
6 吸引路
8 バルブ
10 吸引源
12 バルブ
14 流体供給源
16 圧力測定器
18 気体供給手段(気体供給機構、気体供給ユニット)
18a 噴射口
20 流体
22 気体
30 移動手段(移動機構、移動ユニット)
32 支持アーム
34 接続部材
40 気体供給手段(気体供給機構、気体供給ユニット)
42 配管
42a 流路
42b,42c 噴射口
44 気体
Claims (4)
- 被加工物を保持する保持面を備え、該保持面に該被加工物の外周部を吸引する環状の吸引溝が形成された保持テーブルと、
該保持面の外周縁の外側に配置され、該保持面と該保持面で保持された該被加工物との間に向かって気体を供給する気体供給手段と、を備え、
該吸引溝は、該吸引溝に負圧を作用させる吸引源、及び、該吸引溝に流体を供給する流体供給源に接続されていることを特徴とする保持装置。 - 該保持テーブルを、該保持面と垂直な方向に沿う回転軸を中心として回転させる回転手段を更に備えることを特徴とする請求項1記載の保持装置。
- 該気体供給手段を、該保持面の外周縁に沿って移動させる移動手段を更に備えることを特徴とする請求項1又は請求項2記載の保持装置。
- 該気体供給手段は、該保持面の外周縁の外側に、該保持面の外周縁に沿って配置される環状の配管を備え、
該配管は、該被加工物と該保持面との間に向かって該気体を噴射させる噴射口を備えることを特徴とする請求項1又は請求項2記載の保持装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019116601A JP2021000712A (ja) | 2019-06-24 | 2019-06-24 | 保持装置 |
KR1020200063371A KR20210000267A (ko) | 2019-06-24 | 2020-05-27 | 유지 장치 |
TW109120957A TW202101703A (zh) | 2019-06-24 | 2020-06-20 | 保持裝置 |
CN202010577890.8A CN112133663A (zh) | 2019-06-24 | 2020-06-23 | 保持装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019116601A JP2021000712A (ja) | 2019-06-24 | 2019-06-24 | 保持装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2021000712A true JP2021000712A (ja) | 2021-01-07 |
Family
ID=73850661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019116601A Pending JP2021000712A (ja) | 2019-06-24 | 2019-06-24 | 保持装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2021000712A (ja) |
KR (1) | KR20210000267A (ja) |
CN (1) | CN112133663A (ja) |
TW (1) | TW202101703A (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5227266A (en) * | 1975-08-25 | 1977-03-01 | Hitachi Ltd | Wafer support |
JPH0547910A (ja) * | 1991-08-19 | 1993-02-26 | Tadahiro Omi | 静電吸着装置 |
JP2006135157A (ja) * | 2004-11-08 | 2006-05-25 | Matsushita Electric Ind Co Ltd | 基板保持装置及び基板の取り出し方法 |
JP2008147591A (ja) * | 2006-12-13 | 2008-06-26 | Nec Electronics Corp | 半導体製造装置及び半導体製造方法 |
JP2015198221A (ja) * | 2014-04-03 | 2015-11-09 | 旭硝子株式会社 | 板状体の剥離装置及びその方法並びに板状体の製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1406250A1 (en) | 2001-06-29 | 2004-04-07 | Sony Corporation | DATA RECORDING MEDIUM, RECORDING MEDIUM RECORDING AND/REPRODUCING APPARATUS, AND RECORDING OR REPRODUCING METHOD |
-
2019
- 2019-06-24 JP JP2019116601A patent/JP2021000712A/ja active Pending
-
2020
- 2020-05-27 KR KR1020200063371A patent/KR20210000267A/ko active Search and Examination
- 2020-06-20 TW TW109120957A patent/TW202101703A/zh unknown
- 2020-06-23 CN CN202010577890.8A patent/CN112133663A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5227266A (en) * | 1975-08-25 | 1977-03-01 | Hitachi Ltd | Wafer support |
JPH0547910A (ja) * | 1991-08-19 | 1993-02-26 | Tadahiro Omi | 静電吸着装置 |
JP2006135157A (ja) * | 2004-11-08 | 2006-05-25 | Matsushita Electric Ind Co Ltd | 基板保持装置及び基板の取り出し方法 |
JP2008147591A (ja) * | 2006-12-13 | 2008-06-26 | Nec Electronics Corp | 半導体製造装置及び半導体製造方法 |
JP2015198221A (ja) * | 2014-04-03 | 2015-11-09 | 旭硝子株式会社 | 板状体の剥離装置及びその方法並びに板状体の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20210000267A (ko) | 2021-01-04 |
TW202101703A (zh) | 2021-01-01 |
CN112133663A (zh) | 2020-12-25 |
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