JP2020178058A - Splitting method of layered material - Google Patents
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- JP2020178058A JP2020178058A JP2019079849A JP2019079849A JP2020178058A JP 2020178058 A JP2020178058 A JP 2020178058A JP 2019079849 A JP2019079849 A JP 2019079849A JP 2019079849 A JP2019079849 A JP 2019079849A JP 2020178058 A JP2020178058 A JP 2020178058A
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000000463 material Substances 0.000 title claims description 15
- 239000000126 substance Substances 0.000 claims abstract description 69
- 238000003776 cleavage reaction Methods 0.000 claims abstract description 31
- 230000007017 scission Effects 0.000 claims abstract description 31
- 150000001875 compounds Chemical class 0.000 claims abstract description 22
- 239000004065 semiconductor Substances 0.000 claims abstract description 14
- 238000003780 insertion Methods 0.000 claims abstract description 8
- 230000037431 insertion Effects 0.000 claims abstract description 8
- DDJAGKOCVFYQOV-UHFFFAOYSA-N tellanylideneantimony Chemical compound [Te]=[Sb] DDJAGKOCVFYQOV-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052714 tellurium Inorganic materials 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- -1 bismuth tellurium compound Chemical class 0.000 abstract 1
- 229940125773 compound 10 Drugs 0.000 abstract 1
- ZLVXBBHTMQJRSX-VMGNSXQWSA-N jdtic Chemical compound C1([C@]2(C)CCN(C[C@@H]2C)C[C@H](C(C)C)NC(=O)[C@@H]2NCC3=CC(O)=CC=C3C2)=CC=CC(O)=C1 ZLVXBBHTMQJRSX-VMGNSXQWSA-N 0.000 abstract 1
- 239000002390 adhesive tape Substances 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 239000002932 luster Substances 0.000 description 3
- 238000005411 Van der Waals force Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Abstract
Description
本発明は、層状物質劈開方法に関する。 The present invention relates to a method for cleavage of layered substances.
シート状物質（例えば、グラフェン）が多数積層された層状物質（例えば、グラファイト、黒鉛）から単層のシート状物質を剥離する方法が知られている。例えば、特許文献１には、グラファイトの表層面に粘着テープを貼り付け、その後、粘着テープを剥離する作業を実行することで、グラフェンシートを形成する、ことが開示されている。 A method of peeling a single-layer sheet-like substance from a layered substance (for example, graphite or graphite) in which a large number of sheet-like substances (for example, graphene) are laminated is known. For example, Patent Document 1 discloses that a graphene sheet is formed by attaching an adhesive tape to the surface layer surface of graphite and then performing an operation of peeling off the adhesive tape.
ところで、熱電変換素子には、例えば、ビスマス・テルル系（Ｂｉ−Ｔｅ系）やアンチモン・テルル系（Ｓｂ−Ｔｅ系）の結晶が使用される。これらの結晶は、グラファイトと同様に、シート状物質が積層された積層構造をしており、面状に劈開することができる。このようなシート状物質の特性評価を行う場合、特許文献１に記載の技術を適用して、粘着テープで剥離することが考えられる。 By the way, for the thermoelectric conversion element, for example, bismuth-tellurium (Bi-Te) or antimony-tellurium (Sb-Te) crystals are used. Similar to graphite, these crystals have a laminated structure in which sheet-like substances are laminated, and can be cleaved in a planar shape. When evaluating the characteristics of such a sheet-like substance, it is conceivable to apply the technique described in Patent Document 1 and peel it off with an adhesive tape.
しかしながら、粘着テープを用いて層状物質を劈開すると、シート状物質と隣接するシート層物質との結合強度が小さい層で劈開してしまう。そのため、必ずしも所望の積層面で劈開できるとは限らない。 However, when the layered substance is cleaved using the adhesive tape, the sheet-like substance and the adjacent sheet layer material are cleaved in a layer having a small bond strength. Therefore, it is not always possible to cleave at a desired laminated surface.
本発明は、このような事情に鑑みてなされたものであり、所望の積層面で劈開することができる層状物質劈開方法を提供することを目的とする。 The present invention has been made in view of such circumstances, and an object of the present invention is to provide a method for cleaving a layered substance that can be cleaved on a desired laminated surface.
前記目的を達成するために、本発明は、シート状物質が多数積層された熱電半導体化合物（例えば、ビスマス・テルル系化合物又はアンチモン・テルル系化合物）を劈開する層状物質劈開方法であって、前記熱電半導体化合物の何れかの積層面に刃（例えば、片刃）を挿入する挿入ステップと、前記熱電半導体化合物が前記積層面で劈開される劈開ステップとを備えることを特徴とする。 In order to achieve the above object, the present invention is a method for opening a layered substance for opening a thermoelectric semiconductor compound (for example, a bismuth-tellurium compound or an antimony-tellurium compound) in which a large number of sheet-like substances are laminated. It is characterized by comprising an insertion step of inserting a blade (for example, a single-edged blade) into any laminated surface of the thermoelectric semiconductor compound, and a opening step of opening the thermoelectric semiconductor compound on the laminated surface.
本発明によれば、所望の積層面で劈開することができる。 According to the present invention, cleavage can be performed at a desired laminated surface.
以下、図面を参照して、本発明の実施の形態（以下、「本実施形態」と称する）につき詳細に説明する。なお、各図は、本実施形態を十分に理解できる程度に、概略的に示してあるに過ぎない。また、各図において、共通する構成要素や同様な構成要素については、同一の符号を付し、それらの重複する説明を省略する。 Hereinafter, embodiments of the present invention (hereinafter, referred to as “the present embodiment”) will be described in detail with reference to the drawings. In addition, each figure is only shown schematicly to the extent that the present embodiment can be fully understood. Further, in each figure, common components and similar components are designated by the same reference numerals, and duplicate description thereof will be omitted.
（第１実施形態）
図１は、本発明の第１実施形態として、層状物質をシート状に劈開する劈開方法を説明する説明図である。
まず、作業者は、特性評価サンプルとしての層状物質１０を両面テープ４５で載置台４０に固定する（ＳＰ１）。このとき、両面テープ４５でなく、ゲルや真空吸着等で層状物質１０を載置台４０に固定しても構わない。層状物質１０は、シート状物質１１が多数積層して構成された熱電半導体化合物であり、例えば、ビスマス・テルル（Ｂｉ−Ｔｅ）系化合物やアンチモン・テルル（Ｓｂ−Ｔｅ）系化合物の結晶である。
(First Embodiment)
FIG. 1 is an explanatory diagram illustrating a cleavage method for cleaving a layered substance in a sheet shape as a first embodiment of the present invention.
First, the operator fixes the layered substance 10 as the characteristic evaluation sample to the mounting table 40 with the double-sided tape 45 (SP1). At this time, instead of the double-sided tape 45, the layered substance 10 may be fixed to the mounting table 40 by gel, vacuum adsorption, or the like. The layered substance 10 is a thermoelectric semiconductor compound composed of a large number of sheet-like substances 11 laminated, and is, for example, a crystal of a bismuth-tellurium (Bi-Te) -based compound or an antimony-tellurium (Sb-Te) -based compound. ..
例えば、図２に示すＢｉ２Ｔｅ３系化合物は、六方晶の層状構造を有する層状化合物であり、ｃ軸方向に、２層のＢｉ（黒丸）と、３層のＴｅ（白丸）とが積層したものである。ここで、中間のＴｅをＴｅ（２）と表記し、両側のＴｅをＴｅ（１）と表記している。隣接するＴｅ（１）層間は、弱いファン・デル・ワールス力で結合しており、ｃ軸に垂直な面（ａｂ面：積層面）で容易に劈開する。なお、Ｔｅ（１）−Ｂｉ間は、共有結合で強く結合しており、Ｂｉ−Ｔｅ（２）間は、（共有結合＋イオン結合）で強く結合している。また、Ｂｉ２Ｔｅ３系化合物は、熱電特性も異方性を示し、ファン・デル・ワールス結合を横切らないａｂ面方向で電気伝導率が向上し、高い熱電性能を奏する。 For example, the Bi 2 Te 3 system compound shown in FIG. 2 is a layered compound having a hexagonal layered structure, and two layers of Bi (black circles) and three layers of Te (white circles) are laminated in the c-axis direction. It was done. Here, the middle Te is referred to as Te (2), and the Te on both sides is referred to as Te (1). The adjacent Te (1) layers are connected by a weak van der Waals force, and are easily cleaved on a plane perpendicular to the c-axis (ab plane: laminated plane). The Te (1) -Bi is strongly bonded by a covalent bond, and the Bi-Te (2) is strongly bonded by a (covalent bond + ionic bond). In addition, the Bi 2 Te 3 system compound also exhibits anisotropy in thermoelectric characteristics, and the electric conductivity is improved in the ab plane direction that does not cross the van der Waals bond, and high thermoelectric performance is exhibited.
図１の説明に戻り、作業者は、ＸＹＺθステージ３０を用い、超硬カッター２０の刃を層状物質１０の壁面まで移動させる（ＳＰ２）。さらに、作業者は、超硬カッター２０の片刃部２２を層状物質１０の任意のシート状物質１１の積層面に略平行に挿入する（ＳＰ３）。これにより、シート状物質１１が劈開（剥離）される。なお、層状物質１２は、層状物質１０からシート状物質１１が剥離された残存物質を意味する。また、図１では、片刃部２２を最上層に挿入し、シート状物質１１と層状物質１２とに劈開しているが、片刃部２２を他の積層面（所望の積層面）に挿入すれば、層状物質と層状物質とに劈開される。さらに作業者は、劈開したシート状物質１１及び層状物質１２の何れか一方又は双方を用いて、熱電特性や電気抵抗等の特性評価を行う。 Returning to the description of FIG. 1, the operator uses the XYZθ stage 30 to move the blade of the cemented carbide cutter 20 to the wall surface of the layered substance 10 (SP2). Further, the operator inserts the single-edged portion 22 of the cemented carbide cutter 20 substantially parallel to the laminated surface of any sheet-like substance 11 of the layered substance 10 (SP3). As a result, the sheet-like substance 11 is cleaved (peeled). The layered substance 12 means a residual substance from which the sheet-like substance 11 is peeled off from the layered substance 10. Further, in FIG. 1, the single-edged portion 22 is inserted into the uppermost layer and cleaved into the sheet-like substance 11 and the layered substance 12, but if the single-edged portion 22 is inserted into another laminated surface (desired laminated surface), , Cleavage between layered material and layered material. Further, the operator evaluates characteristics such as thermoelectric characteristics and electrical resistance using either one or both of the cleaved sheet-like substance 11 and the layered substance 12.
図３は、層状物質の劈開に使用する刃の構造図である。図３（ａ）は、平面図であり、図３（ｂ）は、正面図であり、図３（ｃ）は、側面図である。
超硬カッター２０は、軸部２１と片刃部２２とを有し、軸部２１と片刃部２２とが接着（接合）されている。軸部２１は、直径φ（例えば、φ＝１．５８ｍｍ）、長さＬ（例えば、Ｌ＝１６ｍｍ）の軸体であり、ＸＹＺθステージ３０に固定される。
FIG. 3 is a structural diagram of a blade used for cleavage of a layered substance. 3 (a) is a plan view, FIG. 3 (b) is a front view, and FIG. 3 (c) is a side view.
The cemented carbide cutter 20 has a shaft portion 21 and a single-edged portion 22, and the shaft portion 21 and the single-edged portion 22 are bonded (joined) to each other. The shaft portion 21 is a shaft body having a diameter of φ (for example, φ = 1.58 mm) and a length of L (for example, L = 16 mm), and is fixed to the XYZθ stage 30.
片刃部２２は、例えば、平面視で直角二等辺三角形状の超硬スチールで形成されており、頂点の近傍に軸部２１が接合される。片刃部２２の平面形状である二等辺三角形の底角θ４がθ４＝４５°であり、頂角は９０°である。片刃部２２の厚みＴは、例えば、Ｔ＝０．５ｍｍであり、幅Ｄ（例えば、Ｄ＝７．２３４ｍｍ）の片刃が底辺の領域に形成されている。片刃部２２のすくい面２２ａと逃げ面２２ｂとは、刃角θ１（例えば、θ１＝２０°）、逃げ角θ２（例えば、θ２＝５°）、すくい角θ３（例えば、θ３＝１５５°）で形成されている。 The single-edged portion 22 is, for example, formed of cemented carbide having a right-angled isosceles triangle shape in a plan view, and the shaft portion 21 is joined in the vicinity of the apex. The base angle θ4 of the isosceles triangle, which is the planar shape of the single-edged portion 22, is θ4 = 45 °, and the apex angle is 90 °. The thickness T of the single-edged portion 22 is, for example, T = 0.5 mm, and a single-edged blade having a width D (for example, D = 7.234 mm) is formed in the bottom region. The rake face 22a and the flank surface 22b of the single-edged portion 22 have a blade angle θ1 (for example, θ1 = 20 °), a flank angle θ2 (for example, θ2 = 5 °), and a rake angle θ3 (for example, θ3 = 155 °). It is formed.
すくい面２２ａは、台形形状であり（図３（ｂ））、底辺の両端にはシャープエッジ２２ｃが形成されている。このシャープエッジ２２ｃは、例えば、サンプルとしての層状物質１０が小さいときに使用される。シャープエッジ２２ｃを使うことによって、作業者が容易に片刃部２２を積層面に挿入することができる。なお、片刃部２２は、平面視直角二等辺三角形でなくても、平面視二等辺三角形でもよく、非対称な三角形状でもよい。また、超硬カッター２０は、片刃に限らず両刃であっても構わない。 The rake face 22a has a trapezoidal shape (FIG. 3B), and sharp edges 22c are formed at both ends of the base. The sharp edge 22c is used, for example, when the layered substance 10 as a sample is small. By using the sharp edge 22c, the operator can easily insert the single-edged portion 22 into the laminated surface. The single-edged portion 22 does not have to be an isosceles right triangle in a plan view, but may be an isosceles triangle in a plan view, or may have an asymmetric triangular shape. Further, the cemented carbide cutter 20 is not limited to a single-edged cutter 20 and may be a double-edged cutter.
図４は、劈開前の層状物質を示す写真であり、図５は、層状物質を劈開した劈開面を示す写真である。図４に示す層状物質１０はＢｉ２Ｔｅ３系化合物の結晶であり、図５で示すシート状物質１１の劈開面は、金属光沢を放っている。 FIG. 4 is a photograph showing a cleaved material before cleavage, and FIG. 5 is a photograph showing a cleaved surface in which the layered material is cleaved. The layered substance 10 shown in FIG. 4 is a crystal of a Bi 2 Te 3 system compound, and the cleaved surface of the sheet-like substance 11 shown in FIG. 5 has a metallic luster.
（第２実施形態）
前記第１実施形態では、層状物質１０を劈開してシート状物質１１を作成した。本第２実施形態では、劈開したシート状物質１１をさらに微細形状に細分化する。
(Second Embodiment)
In the first embodiment, the layered substance 10 is cleaved to prepare the sheet-like substance 11. In the second embodiment, the cleaved sheet-like substance 11 is further subdivided into fine shapes.
図６は、シート状物質を細分化する細分化方法を説明する説明図である。
作業者は、シート状物質１１の上面の端部を超硬カッター２０の逃げ面２２ｂで押圧する（ＳＰ１）。逃げ面２２ｂは、逃げ角θ２を有しているので、逃げ面２２ｂの先端部がシート状物質１１を線状に押圧する。これにより、シート状物質１１が押圧された線状領域（例えば、端部）で割れる。このとき、作業者は、シャープエッジ２２ｃ（図３（ｂ））の部分でシート状物質１１を押圧しても構わない。そして、作業者は、超硬カッター２０を移動させつつ、シート状物質１１の上面を逃げ面２２ｂで押圧する（ＳＰ２）。これにより、シート状物質１１がＳＰ１と異なる他の部位で割れ、微細形状の多数の細片１１ｂに細分化される。
FIG. 6 is an explanatory diagram illustrating a subdivision method for subdividing the sheet-like substance.
The operator presses the edge of the upper surface of the sheet-like substance 11 with the flank 22b of the cemented carbide cutter 20 (SP1). Since the flank surface 22b has a flank angle θ2, the tip end portion of the flank surface 22b linearly presses the sheet-like substance 11. As a result, the sheet-like substance 11 is split at the pressed linear region (for example, the end portion). At this time, the operator may press the sheet-like substance 11 at the portion of the sharp edge 22c (FIG. 3B). Then, the operator presses the upper surface of the sheet-like substance 11 with the flank 22b while moving the carbide cutter 20 (SP2). As a result, the sheet-like substance 11 is cracked at a site different from SP1 and is subdivided into a large number of finely shaped pieces 11b.
図７は、シート状物質を細分化した細片を示す写真である。
シート状物質１１が大きさ０．１ｍｍ程度の複数の細片１１ｂに細分化されている。また、それぞれの細片１１ｂの表面は、金属光沢を放っている。なお、サイズ比較のために、φ２５μｍの金線１５が載置されている。
FIG. 7 is a photograph showing subdivided pieces of a sheet-like substance.
The sheet-like substance 11 is subdivided into a plurality of small pieces 11b having a size of about 0.1 mm. The surface of each of the strips 11b has a metallic luster. A gold wire 15 having a diameter of 25 μm is placed for size comparison.
（比較例）
前記実施形態の層状物質劈開方法では、片刃部２２を積層面に平行に挿入したが、層状物質１０の両面に粘着テープを貼付して、両側から引き離すことにより剥離することもできる。
(Comparison example)
In the layered substance cleavage method of the above embodiment, the single-edged portion 22 is inserted parallel to the laminated surface, but it can also be peeled off by attaching adhesive tapes to both sides of the layered substance 10 and pulling them apart from both sides.
図８は、本発明の比較例である劈開方法を説明する説明図である。
まず、作業者は、層状物質１０の両面に粘着テープ４６を貼付する（ＳＰ２１）。ＳＰ２１の後、作業者は、２枚の粘着テープ４６を互いに反対方向に引き離す（ＳＰ２２）。これにより、層状物質１０の何れかの積層面で剥離する。具体的には、隣接するシート状物質１１同士の密着力（ファンデルワールス力）が小さい積層面で剥離する。そのため、何れの積層面で剥離されるか予測困難である。
FIG. 8 is an explanatory diagram illustrating a cleavage method which is a comparative example of the present invention.
First, the operator attaches the adhesive tape 46 to both sides of the layered substance 10 (SP21). After SP21, the operator pulls the two adhesive tapes 46 apart from each other in opposite directions (SP22). As a result, the layered substance 10 is peeled off at any of the laminated surfaces. Specifically, the adjacent sheet-like substances 11 are peeled off on a laminated surface having a small adhesive force (Van der Waals force). Therefore, it is difficult to predict which laminated surface will be peeled off.
しかしながら、前記第１実施形態のように、超硬カッター２０を用いた層状物質劈開方法であれば、片刃部２２を所望の積層面に挿入することができる。つまり、所望の積層面の劈開面１１ａを露出することができる。 However, in the layered material cleavage method using the cemented carbide cutter 20 as in the first embodiment, the single-edged portion 22 can be inserted into a desired laminated surface. That is, the cleavage surface 11a of the desired laminated surface can be exposed.
図９は、粘着テープを用いて層状物質を劈開した劈開面を示す写真である。
劈開面１１ａには、細かい傷が発生している。この傷は、２枚の粘着テープ４６の引き離しを手作業で行った際、劈開面同士が擦り合わせられて生じたと考えられる。この傷は、特性評価の評価結果が変わる原因となり、好ましいものではない。
FIG. 9 is a photograph showing a cleaved surface in which a layered substance is cleaved using an adhesive tape.
Fine scratches are generated on the cleavage surface 11a. It is probable that this scratch was caused by the cleaved surfaces being rubbed against each other when the two adhesive tapes 46 were manually separated from each other. This scratch causes a change in the evaluation result of the characteristic evaluation, which is not preferable.
一方、前記第１実施形態の層状物質劈開方法によれば、超硬カッター２０を用いて、金属光沢を放つ劈開面１１ａが露出するので、安定な評価結果を得ることができる。 On the other hand, according to the layered material cleavage method of the first embodiment, the cleavage surface 11a that gives off metallic luster is exposed by using the cemented carbide cutter 20, so that a stable evaluation result can be obtained.
（第２実施形態）
前記実施形態の層状物質劈開方法は、ＸＹＺθステージ３０が超硬カッター２０を移動させたが、ＸＹＺθステージ３０の代わりに３軸マニュピレータを用いることもできる。
(Second Embodiment)
In the layered material cleavage method of the above embodiment, the XYZθ stage 30 moves the carbide cutter 20, but a triaxial manipulator can be used instead of the XYZθ stage 30.
図１０は、本発明の第２実施形態で使用されるダイボンダの外観図であり、図１０（ａ）は、実体顕微鏡を除いた平面図であり、図１０（ｂ）は、実体顕微鏡を２点鎖線で示した側面図である。
ダイボンダ１００は、実体顕微鏡５０と、ステージ５２と、ワークホルダ５３と、３軸マニュピレータ６０とを備える。３軸マニュピレータ６０は、ヘッド部６１と操作部６２とを備える。ヘッド部６１には、超硬カッター２０が取り付けられ、ワークホルダ５３には、層状物質１０が固定される。３軸マニュピレータ６０は、操作部６２をＸＹＺ方向に動かすことにより、ヘッド部６１をＸＹＺ方向に１／Ｎ（例えば、Ｎ＝８）の変位量で移動させるものである（米国特許第５８７１１３６号明細書、米国特許第５９３１３７２号明細書参照）。回転ノブ６６は、超硬カッター２０を１対１の回転量で回転させるノブである。
10A and 10B are external views of a die bonder used in the second embodiment of the present invention, FIG. 10A is a plan view excluding a stereomicroscope, and FIG. 10B is a stereomicroscope of 2. It is a side view shown by the dotted line.
The die bonder 100 includes a stereomicroscope 50, a stage 52, a work holder 53, and a 3-axis manipulator 60. The 3-axis manipulator 60 includes a head portion 61 and an operation portion 62. A cemented carbide cutter 20 is attached to the head portion 61, and a layered substance 10 is fixed to the work holder 53. The 3-axis manipulator 60 moves the operation unit 62 in the XYZ direction to move the head unit 61 in the XYZ direction with a displacement amount of 1 / N (for example, N = 8) (US Pat. No. 5,871,136). See US Pat. No. 5,931,372). The rotary knob 66 is a knob that rotates the carbide cutter 20 at a rotation amount of 1: 1.
この第２実施形態の層状物質劈開方法によれば、ヘッド部６１に取り付けられている超硬カッター２０が操作部６２の１／Ｎの変位量で移動させられる。このため、作業者は、実体顕微鏡５０で確認しながら、層状物質１０の積層面への片刃部２２の挿入速度を、操作部６２の操作速度よりも低減させることができる。 According to the layered material cleavage method of the second embodiment, the cemented carbide cutter 20 attached to the head portion 61 is moved by a displacement amount of 1 / N of the operation portion 62. Therefore, the operator can reduce the insertion speed of the single-edged portion 22 into the laminated surface of the layered substance 10 to be lower than the operating speed of the operating portion 62 while checking with the stereomicroscope 50.
１０，１２ 層状物質
１１ シート状物質
１１ａ 劈開面
２０ 超硬カッター
２２ 片刃部
２２ａ すくい面
３０ ＸＹＺθステージ
４５ 両面テープ
４６ 粘着テープ
６０ ３軸マニュピレータ
６２ 操作部
１００ ダイボンダ
10, 12 Layered material 11 Sheet-like material 11a Cleavage surface 20 Carbide cutter 22 Single-edged part 22a Scooping surface 30 XYZθ stage 45 Double-sided tape 46 Adhesive tape 60 3-axis manipulator 62 Operation part 100 Die bonder
前記目的を達成するために、本発明は、シート状物質が多数積層された熱電半導体化合物（例えば、ビスマス・テルル系化合物又はアンチモン・テルル系化合物）を劈開する層状物質劈開方法であって、前記熱電半導体化合物の何れかの積層面に、すくい面が台形形状の片刃を挿入する挿入ステップと、前記熱電半導体化合物が前記積層面で劈開される劈開ステップとを備えることを特徴とする。 In order to achieve the above object, the present invention is a method for opening a layered substance for opening a thermoelectric semiconductor compound (for example, a bismuth-tellurium compound or an antimony tellurium-based compound) in which a large number of sheet-like substances are laminated. It is characterized by comprising an insertion step of inserting a single-edged blade having a trapezoidal rake face into any of the laminated surfaces of the thermoelectric semiconductor compound, and a opening step of opening the thermoelectric semiconductor compound on the laminated surface.
Claims (4)
前記熱電半導体化合物の何れかの積層面に刃を挿入する挿入ステップと、
前記熱電半導体化合物が前記積層面で劈開される劈開ステップと
を備えることを特徴とする層状物質劈開方法。 It is a method for cleaving a layered material that cleaves a thermoelectric semiconductor compound in which a large number of sheet-like materials are laminated.
An insertion step of inserting a blade into the laminated surface of any of the thermoelectric semiconductor compounds,
A method for cleaving a layered substance, which comprises a cleavage step in which the thermoelectric semiconductor compound is cleaved on the laminated surface.
前記熱電半導体化合物は、ビスマス・テルル系化合物又はアンチモン・テルル系化合物である
ことを特徴とする層状物質劈開方法。 The layered substance cleavage method according to claim 1.
A method for cleaving a layered substance, wherein the thermoelectric semiconductor compound is a bismuth-tellurium-based compound or an antimony-tellurium-based compound.
前記刃は、すくい面が台形形状の片刃である
ことを特徴とする層状物質劈開方法。 The layered substance cleavage method according to claim 1 or 2.
The blade is a layered material cleavage method characterized in that the rake face is a trapezoidal single-edged blade.
前記挿入ステップは、操作部の操作速度よりも低減させた挿入速度で前記刃を挿入する
ことを特徴とする層状物質劈開方法。 The layered substance cleavage method according to any one of claims 1 to 3.
The insertion step is a method for cleaving a layered substance, which comprises inserting the blade at an insertion speed lower than the operation speed of the operation unit.
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