JP2020167224A - Wiring board and manufacturing method of wiring board - Google Patents
Wiring board and manufacturing method of wiring board Download PDFInfo
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Abstract
Description
本開示の実施形態は、基材と、基材の第１面側に位置する電子部品及び配線とを備える配線基板に関する。また、本開示の実施形態は、配線基板の製造方法に関する。 An embodiment of the present disclosure relates to a wiring board including a base material and electronic components and wiring located on the first surface side of the base material. Moreover, the embodiment of this disclosure relates to the manufacturing method of the wiring board.
近年、伸縮性などの変形性を有する電子デバイスの研究がおこなわれている。例えば特許文献１は、基材と、基材に設けられた配線と、を備え、伸縮性を有する配線基板を開示している。特許文献１においては、予め伸長させた状態の基材に回路を設け、回路を形成した後に基材を弛緩させる、という製造方法を採用している。特許文献１は、基材の伸長状態及び弛緩状態のいずれにおいても基材上の薄膜トランジスタを良好に動作させることを意図している。 In recent years, research has been conducted on electronic devices having deformability such as elasticity. For example, Patent Document 1 discloses a wiring board having a base material and wiring provided on the base material and having elasticity. Patent Document 1 employs a manufacturing method in which a circuit is provided on a base material in a pre-stretched state, and the base material is relaxed after the circuit is formed. Patent Document 1 intends to operate the thin film transistor on the base material well in both the stretched state and the relaxed state of the base material.
配線基板は、伸縮などの変形に対する耐性を有する部分だけでなく、変形に起因して破損し易い部分も含む。このため、予め伸長させた状態の基材に回路を設けると、配線基板に破損などの不具合が生じ易くなってしまう。 The wiring board includes not only a part having resistance to deformation such as expansion and contraction but also a part easily damaged due to deformation. Therefore, if the circuit is provided on the base material that has been stretched in advance, problems such as damage to the wiring board are likely to occur.
また、このような配線基板は、例えば、部品や電極の周辺の領域では応力が発生しやすく、当該応力により、部品や電極の周辺の領域に位置する配線に断線が発生して、当該配線基板が所定の機能を発揮できない場合がある。また、配線基板の高い伸張率が求められる領域においても、当該領域に位置する配線に断線が発生して、当該配線基板が所定の機能を発揮できない場合がある。 Further, in such a wiring board, for example, stress is likely to be generated in the region around the component or the electrode, and the stress causes a disconnection in the wiring located in the region around the component or the electrode, and the wiring board is concerned. May not be able to perform its intended function. Further, even in a region where a high elongation rate of the wiring board is required, the wiring located in the region may be broken and the wiring board may not be able to perform a predetermined function.
本開示の実施形態は、このような課題を効果的に解決し得る配線基板及び配線基板の製造方法を提供することを目的とする。 An object of the present disclosure is to provide a wiring board and a method for manufacturing a wiring board that can effectively solve such a problem.
本開示の一実施形態は、配線基板であって、
第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材と、
前記基材の前記第１面側に位置し、配線基板に搭載される電子部品の電極に接続される配線と、
前記基材の前記第１面側に位置するとともに、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む、追加配線と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に前記電子部品の周囲と重なる部分において、前記配線の前記蛇腹形状部上に位置して前記配線と前記電極との間を電気的に接続している、配線基板である。
One embodiment of the present disclosure is a wiring board.
A base material containing a first surface and a second surface located on the opposite side of the first surface and having a first elastic modulus, and
Wiring that is located on the first surface side of the base material and is connected to the electrodes of electronic components mounted on the wiring board.
It is provided with additional wiring located on the first surface side of the base material and containing a conductive paste containing conductive particles and having elasticity.
The wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material.
At least a part of the additional wiring is located on the bellows-shaped portion of the wiring at a portion overlapping the periphery of the electronic component when viewed along the normal direction of the first surface of the base material. A wiring board that electrically connects the wiring and the electrodes.
本開示の一実施形態は、配線基板であって、
第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材と、
前記基材の前記第１面側に位置し、配線基板に搭載される電子部品の電極に接続される配線と、
前記基材の前記第１面側に位置するとともに、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む、追加配線と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に２つの前記配線の交点又は前記配線の屈曲している部分を含む領域において、前記配線の蛇腹形状部上に連続的に位置して、前記領域の蛇腹形状部に電気的に接続されている、配線基板である。
One embodiment of the present disclosure is a wiring board.
A base material containing a first surface and a second surface located on the opposite side of the first surface and having a first elastic modulus, and
Wiring that is located on the first surface side of the base material and is connected to the electrodes of electronic components mounted on the wiring board.
It is provided with additional wiring located on the first surface side of the base material and containing a conductive paste containing conductive particles and having elasticity.
The wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material.
At least a part of the additional wiring is the wiring in a region including an intersection of two wirings or a bent portion of the wiring when viewed along the normal direction of the first surface of the substrate. It is a wiring board that is continuously located on the bellows-shaped portion of the above and is electrically connected to the bellows-shaped portion of the region.
本開示の一実施形態は、配線基板であって、
第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材と、
前記基材の前記第１面側に位置し、配線基板に搭載される電子部品の電極に接続される配線と、
前記基材の前記第１面側に位置するとともに、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む、追加配線と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記配線基板は、前記基材の前記第１面側において、第１配線領域と、前記第１配線領域よりも伸縮率が大きい第２配線領域を含み、
前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板の前記第２配線領域において、前記配線の蛇腹形状部上に連続的に位置して、前記第２配線領域の蛇腹形状部に電気的に接続されている、配線基板である。
One embodiment of the present disclosure is a wiring board.
A base material containing a first surface and a second surface located on the opposite side of the first surface and having a first elastic modulus, and
Wiring that is located on the first surface side of the base material and is connected to the electrodes of electronic components mounted on the wiring board.
It is provided with additional wiring located on the first surface side of the base material and containing a conductive paste containing conductive particles and having elasticity.
The wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material.
The wiring board includes a first wiring region and a second wiring region having a larger expansion / contraction ratio than the first wiring region on the first surface side of the base material.
At least a part of the additional wiring is continuously formed on the bellows-shaped portion of the wiring in the second wiring region of the wiring board when viewed along the normal direction of the first surface of the base material. A wiring board that is located and electrically connected to the bellows-shaped portion of the second wiring region.
本開示の一実施形態は、配線基板であって、
第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材と、
前記基材の前記第１面側に位置し、配線基板に搭載される電子部品の電極に接続される配線と、
前記基材の前記第１面側に位置するとともに、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む、追加配線と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に前記配線の前記蛇腹形状部と重なる部分であって、前記配線基板が被実装体に実装された場合に局所的に押し込まれる領域において、前記配線の前記蛇腹形状部上に位置して、前記配線と前記電極との間を電気的に接続している、配線基板である。
One embodiment of the present disclosure is a wiring board.
A base material containing a first surface and a second surface located on the opposite side of the first surface and having a first elastic modulus, and
Wiring that is located on the first surface side of the base material and is connected to the electrodes of electronic components mounted on the wiring board.
It is provided with additional wiring located on the first surface side of the base material and containing a conductive paste containing conductive particles and having elasticity.
The wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material.
At least a part of the additional wiring is a portion that overlaps with the bellows-shaped portion of the wiring when viewed along the normal direction of the first surface of the base material, and the wiring substrate is attached to the mounted body. A wiring board that is located on the bellows-shaped portion of the wiring in a region that is locally pushed when mounted and electrically connects the wiring and the electrodes.
本開示の一実施形態による配線基板において、前記追加配線は、前記配線の前記蛇腹形状部の一部を被覆しているようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the additional wiring may cover a part of the bellows-shaped portion of the wiring.
本開示の一実施形態による配線基板において、前記追加配線は、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板の前記第１配線領域において、前記配線の前記蛇腹形状部上に位置していないようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the additional wiring is the wiring of the wiring in the first wiring area of the wiring board when viewed along the normal direction of the first surface of the base material. It may not be located on the bellows shape.
本開示の一実施形態による配線基板において、前記追加配線は、前記基材の前記第１面の法線方向に沿って見た場合に、少なくとも前記配線の前記蛇腹形状部の表面上に位置しているようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the additional wiring is located at least on the surface of the bellows-shaped portion of the wiring when viewed along the normal direction of the first surface of the base material. You may make it.
本開示の一実施形態による配線基板において、前記追加配線は、前記基材の前記第１面の法線方向に沿って見た場合に前記配線の前記蛇腹形状部の周囲まで延在しているようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the additional wiring extends to the periphery of the bellows-shaped portion of the wiring when viewed along the normal direction of the first surface of the base material. You may do so.
本開示の一実施形態による配線基板において、前記追加配線は、前記基材の前記第１面の法線方向に沿って見た場合に前記配線の前記蛇腹形状部の少なくとも一部を迂回するように延在しているようにしてもよい。 In the wiring board according to one embodiment of the present disclosure, the additional wiring bypasses at least a part of the bellows-shaped portion of the wiring when viewed along the normal direction of the first surface of the base material. It may be extended to.
本開示の一実施形態による配線基板において、前記追加配線は、前記基材の前記第１面側において、前記蛇腹形状部の全体を被覆するように、位置しているようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the additional wiring may be located on the first surface side of the base material so as to cover the entire bellows-shaped portion.
本開示の一実施形態による配線基板において、前記蛇腹形状部は、前記基材の前記第１面側において、前記基材の前記第１面の法線方向に沿って見た場合に、前記配線基板に搭載される前記電子部品の端部と前記配線との境界近傍における、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部を含み、前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に、第１蛇腹形状部と重なる部分に、配置されているようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the bellows-shaped portion is the wiring when viewed along the normal direction of the first surface of the base material on the first surface side of the base material. A first bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material in the vicinity of the boundary between the end of the electronic component mounted on the substrate and the wiring. Even if at least a part of the additional wiring is arranged in a portion overlapping the first bellows-shaped portion when viewed along the normal direction of the first surface of the base material. Good.
本開示の一実施形態による配線基板において、前記蛇腹形状部は、前記基材の前記第１面側において、前記基材の前記第１面の法線方向に沿って見た場合に、前記配線基板に搭載される前記電子部品から前記境界近傍よりも離れた領域における前記配線の第２蛇腹形状部をさらに含み、前記追加配線は、前記基材の前記第１面の法線方向に沿って見た場合に、 前記第２蛇腹形状部と重なる部分に、配置されていないようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the bellows-shaped portion is the wiring when viewed along the normal direction of the first surface of the base material on the first surface side of the base material. Further including a second bellows-shaped portion of the wiring in a region away from the electronic component mounted on the substrate than near the boundary, the additional wiring is along the normal direction of the first surface of the substrate. When viewed, it may not be arranged at a portion overlapping the second bellows-shaped portion.
本開示の一実施形態による配線基板において、前記蛇腹形状部は、前記基材の前記第１面側において、前記基材の前記第１面の法線方向に沿って見た場合に、前記配線基板に搭載される前記電子部品から前記境界近傍よりも離れた領域における前記配線の第２蛇腹形状部を含み、前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に前記電子部品の周囲と重なる部分において、前記基材の前記第１面上に位置して前記第２蛇腹形状部と前記電極との間を電気的に接続しているようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the bellows-shaped portion is the wiring when viewed along the normal direction of the first surface of the base material on the first surface side of the base material. At least a part of the additional wiring includes the second bellows-shaped portion of the wiring in a region farther from the electronic component mounted on the substrate than the vicinity of the boundary, and the normal direction of the first surface of the base material is used. In a portion that overlaps with the periphery of the electronic component when viewed along the above, the second bellows-shaped portion is located on the first surface of the base material and electrically connects between the second bellows-shaped portion and the electrode. You may do so.
本開示の一実施形態による配線基板において、前記境界近傍における前記配線の前記第１蛇腹形状部の山部と谷部の周期は、前記配線の前記蛇腹形状部のうち、前記第２蛇腹形状部の山部と谷部の周期よりも、小さく若しくは大きくなっているようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the period of the peaks and valleys of the first bellows-shaped portion of the wiring in the vicinity of the boundary is the second bellows-shaped portion of the bellows-shaped portions of the wiring. It may be smaller or larger than the period of the peaks and valleys of.
本開示の一実施形態による配線基板において、前記境界近傍における前記配線の前記第１蛇腹形状部の山部と谷部の振幅は、前記配線の前記第２蛇腹形状部の山部と谷部の振幅よりも、大きく若しくは小さくなっているようにしてもよい。 In the wiring substrate according to the embodiment of the present disclosure, the amplitudes of the peaks and valleys of the first bellows-shaped portion of the wiring in the vicinity of the boundary are the peaks and valleys of the second bellows-shaped portion of the wiring. It may be larger or smaller than the amplitude.
本開示の一実施形態による配線基板において、前記追加配線は、前記基材の前記第１面の法線方向に沿って見た場合に前記第１蛇腹形状部と重なる部分において、前記第１蛇腹形状部の表面上に位置しているようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the additional wiring is the first bellows at a portion overlapping the first bellows shape portion when viewed along the normal direction of the first surface of the base material. It may be located on the surface of the shape portion.
本開示の一実施形態による配線基板において、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板に搭載される電子部品に少なくとも部分的に重なり、前記第１の弾性係数よりも大きい第２の弾性係数を有する補強部材を備えるようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, when viewed along the normal direction of the first surface of the base material, it overlaps at least partially with the electronic components mounted on the wiring board, and the first A reinforcing member having a second elastic modulus larger than the elastic modulus may be provided.
本開示の一実施形態による配線基板において、前記配線のうち前記第１面の法線方向に沿って見た場合に前記補強部材と重ならない部分は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む前記蛇腹形状部を有するようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the portion of the wiring that does not overlap with the reinforcing member when viewed along the normal direction of the first surface is in the plane of the first surface of the base material. It may have the bellows-shaped portion including a plurality of peaks and valleys arranged along the direction.
本開示の一実施形態による配線基板において、前記補強部材は、前記基材の前記第１面側、前記基材の前記第２面側、又は、前記基材の中に位置しているようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the reinforcing member is located on the first surface side of the base material, the second surface side of the base material, or in the base material. You may.
本開示の一実施形態による配線基板において、前記配線の前記蛇腹形状部の振幅が１μｍ以上であるようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the amplitude of the bellows-shaped portion of the wiring may be 1 μm or more.
本開示の一実施形態による配線基板において、前記基材の前記第１面の面内方向に沿う引張応力が前記基材に加えられていない第１状態における前記配線の抵抗値を第１抵抗値と称し、前記基材に引張応力を加えて前記基材を前記第１面の面内方向において前記第１状態に比べて３０％伸長させた第２状態における前記配線の抵抗値を第２抵抗値と称する場合、前記第１抵抗値に対する、前記第１抵抗値と前記第２抵抗値の差の絶対値の比率が、２０％以下であるようにしてもよい。 In the wiring substrate according to the embodiment of the present disclosure, the resistance value of the wiring in the first state in which the tensile stress along the in-plane direction of the first surface of the base material is not applied to the base material is the first resistance value. The resistance value of the wiring in the second state in which a tensile stress is applied to the base material to extend the base material by 30% in the in-plane direction of the first surface as compared with the first state is the second resistance. When referred to as a value, the ratio of the absolute value of the difference between the first resistance value and the second resistance value to the first resistance value may be 20% or less.
本開示の一実施形態による配線基板において前記基材は、シリコーンゴムを含むようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the base material may contain silicone rubber.
本開示の一実施形態による配線基板において、前記補強部材は、金属層を含むようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the reinforcing member may include a metal layer.
本開示の一実施形態による配線基板において、前記配線は、金属膜であるようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the wiring may be a metal film.
本開示の一実施形態による配線基板において、前記配線を構成する金属膜は、銅で構成されており、前記導電性ペーストの前記導電性粒子は、銀粒子であるようにしてもよい。 In the wiring board according to the embodiment of the present disclosure, the metal film constituting the wiring may be made of copper, and the conductive particles of the conductive paste may be silver particles.
本開示の一実施形態は、配線基板の製造方法であって、第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、前記基材から前記引張応力を取り除く第３工程と、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線を、前記基材の前記第１面側に設ける、追加配線形成工程と、を備え、前記配線基板は、前記第１の弾性係数よりも大きい第２の弾性係数を有する補強部材を備え、前記基材から前記引張応力が取り除かれた後、前記配線のうち前記第１面の法線方向に沿って見た場合に前記補強部材と重ならない部分は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に前記電子部品の周囲と重なる部分において、前記配線の前記蛇腹形状部上に位置して前記配線と前記電極との間を電気的に接続している、配線基板の製造方法である。 One embodiment of the present disclosure is a method of manufacturing a wiring substrate, which comprises applying tensile stress to a substrate having a first elastic coefficient, including a first surface and a second surface located on the opposite side of the first surface. In addition, a first step of stretching the base material, a second step of providing wiring on the first surface side of the stretched base material, and a third step of removing the tensile stress from the base material. The wiring substrate comprises an additional wiring forming step of providing an additional wiring containing a conductive paste containing conductive particles and having elasticity on the first surface side of the base material, and the wiring substrate is the first surface. A reinforcing member having a second elastic coefficient larger than the elastic coefficient is provided, and after the tensile stress is removed from the base material, the wiring is viewed along the normal direction of the first surface of the wiring. The portion that does not overlap with the reinforcing member has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material, and at least a part of the additional wiring is said. A portion of the base material that overlaps the periphery of the electronic component when viewed along the normal direction of the first surface is located on the bellows-shaped portion of the wiring and is electrically connected between the wiring and the electrode. This is a method of manufacturing a wiring board that is specifically connected.
本開示の一実施形態は、配線基板の製造方法であって、第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、前記基材から前記引張応力を取り除く第３工程と、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線を、前記基材の前記第１面側に設ける、追加配線形成工程と、を備え、前記配線基板は、前記第１の弾性係数よりも大きい第２の弾性係数を有する補強部材を備え、前記基材から前記引張応力が取り除かれた後、前記配線のうち前記第１面の法線方向に沿って見た場合に前記補強部材と重ならない部分は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に２つの前記配線の交点又は前記配線の屈曲している部分を含む領域において、前記配線の蛇腹形状部上に連続的に位置して、前記領域の蛇腹形状部に電気的に接続されている、配線基板の製造方法である。 One embodiment of the present disclosure is a method for manufacturing a wiring substrate, which comprises applying tensile stress to a substrate having a first elastic coefficient, including a first surface and a second surface located on the opposite side of the first surface. In addition, a first step of stretching the base material, a second step of providing wiring on the first surface side of the stretched base material, and a third step of removing the tensile stress from the base material. The wiring substrate comprises an additional wiring forming step of providing an additional wiring containing a conductive paste containing conductive particles and having elasticity on the first surface side of the base material, and the wiring substrate is the first. A reinforcing member having a second elastic coefficient larger than the elastic coefficient is provided, and after the tensile stress is removed from the base material, the wiring is viewed along the normal direction of the first surface of the wiring. The portion that does not overlap with the reinforcing member has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material, and at least a part of the additional wiring is said. Continuously located on the bellows-shaped portion of the wiring in the region including the intersection of the two wirings or the bent portion of the wiring when viewed along the normal direction of the first surface of the base material. This is a method for manufacturing a wiring substrate, which is electrically connected to the bellows-shaped portion of the region.
本開示の一実施形態は、配線基板の製造方法であって、第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、前記基材から前記引張応力を取り除く第３工程と、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線を、前記基材の前記第１面側に設ける、追加配線形成工程と、を備え、前記配線基板は、前記第１の弾性係数よりも大きい第２の弾性係数を有する補強部材を備え、前記基材から前記引張応力が取り除かれた後、前記配線のうち前記第１面の法線方向に沿って見た場合に前記補強部材と重ならない部分は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、前記配線基板は、前記基材の前記第１面側において、第１配線領域と、前記第１配線領域よりも、伸縮率が大きい第２配線領域とを含み、前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板の前記第２配線領域において、前記配線の蛇腹形状部上に連続的に位置して、前記第２配線領域の蛇腹形状部に電気的に接続されている、配線基板の製造方法である。 One embodiment of the present disclosure is a method for manufacturing a wiring substrate, which comprises applying tensile stress to a substrate having a first elastic coefficient, including a first surface and a second surface located on the opposite side of the first surface. In addition, a first step of stretching the base material, a second step of providing wiring on the first surface side of the stretched base material, and a third step of removing the tensile stress from the base material. The wiring substrate comprises an additional wiring forming step of providing an additional wiring containing a conductive paste containing conductive particles and having elasticity on the first surface side of the base material, and the wiring substrate is the first. A reinforcing member having a second elastic coefficient larger than the elastic coefficient is provided, and after the tensile stress is removed from the base material, the wiring is viewed along the normal direction of the first surface of the wiring. The portion that does not overlap with the reinforcing member has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material, and the wiring substrate is the said base material. On the first surface side, the first wiring area and the second wiring area having a larger expansion / contraction rate than the first wiring area are included, and at least a part of the additional wiring is made of the first surface of the base material. When viewed along the normal direction, in the second wiring region of the wiring board, the wiring is continuously located on the bellows-shaped portion of the wiring and electrically connected to the bellows-shaped portion of the second wiring region. This is a method for manufacturing a wiring board.
本開示の一実施形態は、配線基板の製造方法であって、第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、前記基材から前記引張応力を取り除く第３工程と、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線を、前記基材の前記第１面側に設ける、追加配線形成工程と、を備え、前記配線基板は、前記第１の弾性係数よりも大きい第２の弾性係数を有する補強部材を備え、前記基材から前記引張応力が取り除かれた後、前記配線のうち前記第１面の法線方向に沿って見た場合に前記補強部材と重ならない部分は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に前記配線の前記蛇腹形状部と重なる部分であって、前記配線基板が被実装体に実装された場合に局所的に押し込まれる領域において、前記配線の前記蛇腹形状部上に位置して、前記配線と前記電極との間を電気的に接続している、配線基板の製造方法である。 One embodiment of the present disclosure is a method of manufacturing a wiring substrate, which comprises applying tensile stress to a substrate having a first elastic coefficient, including a first surface and a second surface located on the opposite side of the first surface. In addition, a first step of stretching the base material, a second step of providing wiring on the first surface side of the stretched base material, and a third step of removing the tensile stress from the base material. The wiring substrate comprises an additional wiring forming step of providing an additional wiring containing a conductive paste containing conductive particles and having elasticity on the first surface side of the base material, and the wiring substrate is the first surface. A reinforcing member having a second elastic coefficient larger than the elastic coefficient is provided, and after the tensile stress is removed from the base material, the wiring is viewed along the normal direction of the first surface of the wiring. The portion that does not overlap with the reinforcing member has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material, and at least a part of the additional wiring is said. A portion of the base material that overlaps the bellows-shaped portion of the wiring when viewed along the normal direction of the first surface, and is locally pushed in when the wiring substrate is mounted on the mounted body. A method for manufacturing a wiring substrate, which is located on the bellows-shaped portion of the wiring in a region and electrically connects the wiring and the electrode.
本開示の一実施形態による配線基板の製造方法において、前記追加配線形成工程は、伸長した状態の前記基材の前記第１面側に前記配線を設けた後に、実施されるようにしてもよい。 In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the additional wiring forming step may be performed after the wiring is provided on the first surface side of the base material in an elongated state. ..
本開示の一実施形態による配線基板の製造方法において、前記追加配線形成工程は、伸長した状態の前記基材の前記第１面側に前記配線を設けた後であって前記基材から前記引張応力を取り除く前、又は、前記基材から前記引張応力を取り除いた後に、実施されるようにしてもよい。 In the method for manufacturing a wiring substrate according to an embodiment of the present disclosure, the additional wiring forming step is performed after the wiring is provided on the first surface side of the stretched base material and then pulled from the base material. It may be carried out before removing the stress or after removing the tensile stress from the base material.
本開示の一実施形態は、第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材と、前記基材の前記第１面側に位置し、配線基板に搭載される電子部品の電極に接続される配線と、前記基材の前記第１面側に位置するとともに、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む、追加配線と、を備え、前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、前記追加配線は、前記基材の前記第１面の法線方向に沿って見た場合に前記配線の前記蛇腹形状部の少なくとも一部を迂回するように延在している、配線基板である。 One embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, a substrate having a first elastic coefficient, and a substrate located on the first surface side of the substrate. A wiring connected to an electrode of an electronic component mounted on a wiring board, and a conductive paste located on the first surface side of the base material and containing conductive particles and having elasticity. The additional wiring includes a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material, and the additional wiring is the base. It is a wiring board extending so as to bypass at least a part of the bellows-shaped portion of the wiring when viewed along the normal direction of the first surface of the material.
本開示の一実施形態は、配線基板の製造方法であって、第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、前記基材から前記引張応力を取り除く第３工程と、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線を、前記基材の前記第１面側に設ける、追加配線形成工程と、を備え、前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、前記追加配線は、前記基材の前記第１面の法線方向に沿って見た場合に前記配線の前記蛇腹形状部の少なくとも一部を迂回するように延在している、配線基板の製造方法である。 One embodiment of the present disclosure is a method of manufacturing a wiring substrate, which comprises applying tensile stress to a substrate having a first elastic coefficient, including a first surface and a second surface located on the opposite side of the first surface. In addition, a first step of stretching the base material, a second step of providing wiring on the first surface side of the stretched base material, and a third step of removing the tensile stress from the base material. The wiring comprises an additional wiring forming step of providing an additional wiring containing a conductive paste containing conductive particles and having elasticity on the first surface side of the base material, and the wiring is the said of the base material. When it has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface, and the additional wiring is viewed along the normal direction of the first surface of the base material. This is a method for manufacturing a wiring substrate, which extends so as to bypass at least a part of the bellows-shaped portion of the wiring.
本開示の実施形態によれば、基材の伸縮に起因して配線基板に不具合が生じることを抑制することができる。 According to the embodiment of the present disclosure, it is possible to suppress the occurrence of defects in the wiring board due to the expansion and contraction of the base material.
以下、本開示の実施形態に係る配線基板の構成及びその製造方法について、図面を参照しながら詳細に説明する。なお、以下に示す実施形態は本開示の実施形態の一例であって、本開示はこれらの実施形態に限定して解釈されるものではない。また、本明細書において、「基板」、「基材」、「シート」や「フィルム」など用語は、呼称の違いのみに基づいて、互いから区別されるものではない。例えば、「基材」は、基板、シートやフィルムと呼ばれ得るような部材も含む概念である。更に、本明細書において用いる、形状や幾何学的条件並びにそれらの程度を特定する、例えば、「平行」や「直交」等の用語や長さや角度の値等については、厳密な意味に縛られることなく、同様の機能を期待し得る程度の範囲を含めて解釈することとする。また、本実施形態で参照する図面において、同一部分または同様な機能を有する部分には同一の符号または類似の符号を付し、その繰り返しの説明は省略する場合がある。また、図面の寸法比率は説明の都合上実際の比率とは異なる場合や、構成の一部が図面から省略される場合がある。 Hereinafter, the configuration of the wiring board and the manufacturing method thereof according to the embodiment of the present disclosure will be described in detail with reference to the drawings. It should be noted that the embodiments shown below are examples of the embodiments of the present disclosure, and the present disclosure is not construed as being limited to these embodiments. Further, in the present specification, terms such as "base material", "base material", "sheet" and "film" are not distinguished from each other based only on the difference in designation. For example, "base material" is a concept that includes members that may be called substrates, sheets, or films. Furthermore, the terms used in this specification, such as "parallel" and "orthogonal", and the values of length and angle, which specify the shape and geometric conditions and their degrees, are bound by strict meanings. Instead, the interpretation will include the range in which similar functions can be expected. Further, in the drawings referred to in the present embodiment, the same parts or parts having similar functions may be designated by the same reference numerals or similar reference numerals, and the repeated description thereof may be omitted. In addition, the dimensional ratio of the drawing may differ from the actual ratio for convenience of explanation, or a part of the configuration may be omitted from the drawing.
以下、図１乃至図２０を参照して、本開示の一実施の形態について説明する。 Hereinafter, an embodiment of the present disclosure will be described with reference to FIGS. 1 to 20.
（配線基板）
まず、本実施の形態に係る配線基板１０について説明する。図１及び図２はそれぞれ、配線基板１０を示す断面図及び平面図である。図１に示す断面図は、図２の配線基板１０を線Ａ−Ａに沿って切断した場合の図である。
(Wiring board)
First, the wiring board 10 according to the present embodiment will be described. 1 and 2 are a cross-sectional view and a plan view showing the wiring board 10, respectively. The cross-sectional view shown in FIG. 1 is a view when the wiring board 10 of FIG. 2 is cut along the lines AA.
図１に示す配線基板１０は、基材２０、補強部材３１、支持基板４０、電子部品５１、配線５２、追加配線Ｑを備える。以下、配線基板１０の各構成要素について説明する。 The wiring board 10 shown in FIG. 1 includes a base material 20, a reinforcing member 31, a support board 40, an electronic component 51, a wiring 52, and an additional wiring Q. Hereinafter, each component of the wiring board 10 will be described.
〔基材〕
基材２０は、伸縮性を有するよう構成された部材である。基材２０は、電子部品５１及び配線５２側に位置する第１面２１と、第１面２１の反対側に位置する第２面２２と、を含む。基材２０の厚みは、例えば１０μｍ以上１０ｍｍ以下であり、より好ましくは２０μｍ以上３ｍｍ以下である。基材２０の厚みを１０μｍ以上にすることにより、基材２０の耐久性を確保することができる。基材２０の厚みを１０ｍｍ以下にすることにより、基材２０の伸縮に要する力を低減することができる。また、基材２０の厚みを小さくすることにより、配線基板１０を用いた製品全体の厚みを小さくすることができる。これにより、例えば、配線基板１０を用いた製品が、人の腕などの身体の一部に取り付けるセンサである場合に、装着快適性を確保することができる。なお、基材２０の厚みを小さくしすぎると、基材２０の伸縮性が損なわれる場合がある
〔Base material〕
The base material 20 is a member configured to have elasticity. The base material 20 includes a first surface 21 located on the side of the electronic component 51 and the wiring 52, and a second surface 22 located on the opposite side of the first surface 21. The thickness of the base material 20 is, for example, 10 μm or more and 10 mm or less, and more preferably 20 μm or more and 3 mm or less. By setting the thickness of the base material 20 to 10 μm or more, the durability of the base material 20 can be ensured. By reducing the thickness of the base material 20 to 10 mm or less, the force required for expansion and contraction of the base material 20 can be reduced. Further, by reducing the thickness of the base material 20, the thickness of the entire product using the wiring board 10 can be reduced. Thereby, for example, when the product using the wiring board 10 is a sensor attached to a part of the body such as a human arm, the wearing comfort can be ensured. If the thickness of the base material 20 is made too small, the elasticity of the base material 20 may be impaired.
基材２０の伸縮性を表すパラメータの例として、基材２０の弾性係数を挙げることができる。基材２０の弾性係数は、例えば１０ＭＰａ以下であり、より好ましくは１ＭＰａ以下である。このような弾性係数を有する基材２０を用いることにより、配線基板１０全体に伸縮性を持たせることができる。以下の説明において、基材２０の弾性係数のことを、第１の弾性係数とも称する。基材２０の第１の弾性係数は、１ｋＰａ以上であってもよい。 An example of a parameter representing the elasticity of the base material 20 is the elastic modulus of the base material 20. The elastic modulus of the base material 20 is, for example, 10 MPa or less, more preferably 1 MPa or less. By using the base material 20 having such an elastic modulus, the entire wiring board 10 can be made elastic. In the following description, the elastic modulus of the base material 20 is also referred to as a first elastic modulus. The first elastic modulus of the base material 20 may be 1 kPa or more.
基材２０の第１の弾性係数を算出する方法としては、基材２０のサンプルを用いて、ＪＩＳ Ｋ６２５１に準拠して引張試験を実施するという方法を採用することができる。また、基材２０のサンプルの弾性係数を、ＩＳＯ１４５７７に準拠してナノインデンテーション法によって測定するという方法を採用することもできる。ナノインデンテーション法において用いる測定器としては、ナノインデンターを用いることができる。基材２０のサンプルを準備する方法としては、配線基板１０から基材２０の一部をサンプルとして取り出す方法や、配線基板１０を構成する前の基材２０の一部をサンプルとして取り出す方法が考えられる。その他にも、基材２０の第１の弾性係数を算出する方法として、基材２０を構成する材料を分析し、材料の既存のデータベースに基づいて基材２０の第１の弾性係数を算出するという方法を採用することもできる。なお、本願における弾性係数は、２５℃の環境下における弾性係数である。 As a method for calculating the first elastic modulus of the base material 20, a method of carrying out a tensile test in accordance with JIS K6251 using a sample of the base material 20 can be adopted. It is also possible to adopt a method in which the elastic modulus of the sample of the base material 20 is measured by the nanoindentation method in accordance with ISO14577. A nanoindenter can be used as the measuring instrument used in the nanoindentation method. As a method of preparing a sample of the base material 20, a method of taking out a part of the base material 20 from the wiring board 10 as a sample and a method of taking out a part of the base material 20 before forming the wiring board 10 as a sample can be considered. Be done. In addition, as a method of calculating the first elastic modulus of the base material 20, the materials constituting the base material 20 are analyzed, and the first elastic modulus of the base material 20 is calculated based on the existing database of the materials. It is also possible to adopt the method. The elastic modulus in the present application is an elastic modulus in an environment of 25 ° C.
基材２０の伸縮性を表すパラメータのその他の例として、基材２０の曲げ剛性を挙げることができる。曲げ剛性は、対象となる部材の断面二次モーメントと、対象となる部材を構成する材料の弾性係数との積であり、単位はＮ・ｍ２又はＰａ・ｍ４である。基材２０の断面二次モーメントは、配線基板１０の伸縮方向に直交する平面によって、基材２０のうち配線５２と重なっている部分を切断した場合の断面に基づいて算出される。以下の説明において、基材２０の曲げ剛性のことを、第１の曲げ剛性とも称する。 Another example of a parameter representing the elasticity of the base material 20 is the flexural rigidity of the base material 20. The flexural rigidity is the product of the moment of inertia of area of the target member and the elastic modulus of the material constituting the target member, and the unit is N · m 2 or Pa · m 4 . The moment of inertia of area of the base material 20 is calculated based on the cross section when the portion of the base material 20 that overlaps with the wiring 52 is cut by a plane orthogonal to the expansion / contraction direction of the wiring substrate 10. In the following description, the flexural rigidity of the base material 20 is also referred to as the first flexural rigidity.
基材２０を構成する材料の例としては、熱可塑性エラストマー、熱硬化性エラストマー、シリコーンゴム、ウレタンゲル、シリコンゲル等を挙げることができる。また、基材２０の材料として、例えば、織物、編物、不織布などの布を用いることもできる。熱可塑性エラストマーとしては、ポリウレタン系エラストマー、スチレン系熱可塑性エラストマー、オレフィン系熱可塑性エラストマー、塩ビ系熱可塑性エラストマー、エステル系熱可塑性エラストマー、アミド系熱可塑性エラストマー、１，２−ＢＲ系熱可塑性エラストマー、フッ素系熱可塑性エラストマー、シリコーンゴム、ウレタンゴム、フッ素ゴム、ポリブタジエン、ポリイソブチレン、ポリスチレンブタジエン、ポリクロロプレン等を用いることができる。機械的強度や耐磨耗性を考慮すると、ウレタン系エラストマーを用いることが好ましい。さらに、シリコーンゴムは、耐熱性・耐薬品性・難燃性に優れており、基材２０の材料として好ましい。 Examples of the material constituting the base material 20 include a thermoplastic elastomer, a thermosetting elastomer, a silicone rubber, a urethane gel, and a silicon gel. Further, as the material of the base material 20, for example, a cloth such as a woven fabric, a knitted fabric, or a non-woven fabric can be used. Examples of the thermoplastic elastomer include polyurethane-based elastomers, styrene-based thermoplastic elastomers, olefin-based thermoplastic elastomers, vinyl chloride-based thermoplastic elastomers, ester-based thermoplastic elastomers, amide-based thermoplastic elastomers, and 1,2-BR-based thermoplastic elastomers. Fluoroplastic elastomers, silicone rubbers, urethane rubbers, fluororubbers, polybutadienes, polyisobutylenes, polystyrene butadienes, polychloroprenes and the like can be used. Considering mechanical strength and abrasion resistance, it is preferable to use a urethane-based elastomer. Further, silicone rubber is excellent in heat resistance, chemical resistance, and flame retardancy, and is preferable as a material for the base material 20.
〔補強部材〕
補強部材３１は、基材２０を補強することで、基材２０の変形を制御、緩和するために配線基板１０に設けられた機構である。例えば、配線５２における電子部品５１の周囲に位置する部分は、伸縮時に大きい応力が生じ易く、また、電子部品５１の下方に巻き込まれ易くなり、破損のリスクが高くなり得る。ここで本実施形態によれば、基材２０に補強部材３０を設けることにより、基材２０における電子部品５１の周囲の部分の変形を制御、特に緩和することが可能となる。これにより、配線５２に局所的に大きい応力が生じることや、配線５２が電子部品５１の下方に巻き込まれることを抑制することができ、配線５２と電子部品５１との断線を抑制することができる。図１、図４、図５に示す例において、補強部材３１は、基材２０の中に位置している。なお、例えば、図６、図７、図８に示すように、補強部材３１は、基材２０の第２面２２側に位置していてもよく、また、図９に示すように、補強部材３１は、基材２０の第１面２１側に位置していてもよい。
[Reinforcing member]
The reinforcing member 31 is a mechanism provided on the wiring board 10 in order to control and alleviate the deformation of the base material 20 by reinforcing the base material 20. For example, a portion of the wiring 52 located around the electronic component 51 is likely to generate a large stress during expansion and contraction, and is likely to be caught under the electronic component 51, which may increase the risk of breakage. Here, according to the present embodiment, by providing the reinforcing member 30 on the base material 20, it is possible to control, particularly alleviate, the deformation of the peripheral portion of the electronic component 51 on the base material 20. As a result, it is possible to prevent the wiring 52 from being locally generated with a large stress and to prevent the wiring 52 from being caught under the electronic component 51, and it is possible to suppress disconnection between the wiring 52 and the electronic component 51. .. In the examples shown in FIGS. 1, 4, and 5, the reinforcing member 31 is located in the base material 20. For example, as shown in FIGS. 6, 7, and 8, the reinforcing member 31 may be located on the second surface 22 side of the base material 20, and as shown in FIG. 9, the reinforcing member 31 may be located. Reference numeral 31 may be located on the first surface 21 side of the base material 20.
この補強部材３１は、基材２０の第１の弾性係数よりも大きい弾性係数を有する。補強部材３１の弾性係数は、例えば０．１ＧＰａ以上で、好ましくは１ＧＰａ以上であり、より好ましくは１０ＧＰａ以上である。補強部材３１の弾性係数は、基材２０の第１の弾性係数の１００倍以上であってもよく、１０００倍以上であってもよい。このような補強部材３１を基材２０に設けることにより、基材２０のうち補強部材３１と重なる部分が伸縮することを抑制することができる。これにより、基材２０を、伸縮が生じやすい部分と、伸縮が生じにくい部分とに区画することができる。補強部材３０の弾性係数が低すぎると、伸縮の制御がしにくい場合がある。また、補強部材３０の弾性係数が高すぎると、基材２０が伸縮した際に、割れやひびなど構造の破壊が補強部材３０に起こる場合がある。以下の説明において、補強部材３１の弾性係数のことを、第２の弾性係数とも称する。補強部材３１の第２の弾性係数は、５００ＧＰａ以下であってもよい。また、補強部材３１の第２の弾性係数は、基材２０の第１の弾性係数の１．１倍以上１００００００倍以下であってもよく、より好ましくは１０００００倍以下である。なお、「重なる」とは、基材２０の第１面２１の法線方向に沿って見た場合に２つの構成要素が重なることを意味している。 The reinforcing member 31 has an elastic modulus larger than that of the first elastic modulus of the base material 20. The elastic modulus of the reinforcing member 31 is, for example, 0.1 GPa or more, preferably 1 GPa or more, and more preferably 10 GPa or more. The elastic modulus of the reinforcing member 31 may be 100 times or more, or 1000 times or more, the first elastic modulus of the base material 20. By providing such a reinforcing member 31 on the base material 20, it is possible to prevent the portion of the base material 20 that overlaps with the reinforcing member 31 from expanding and contracting. As a result, the base material 20 can be divided into a portion where expansion and contraction are likely to occur and a portion where expansion and contraction is unlikely to occur. If the elastic modulus of the reinforcing member 30 is too low, it may be difficult to control expansion and contraction. Further, if the elastic modulus of the reinforcing member 30 is too high, when the base material 20 expands and contracts, structural destruction such as cracks and cracks may occur in the reinforcing member 30. In the following description, the elastic modulus of the reinforcing member 31 is also referred to as a second elastic modulus. The second elastic modulus of the reinforcing member 31 may be 500 GPa or less. Further, the second elastic modulus of the reinforcing member 31 may be 1.1 times or more and 1,000,000 times or less of the first elastic modulus of the base material 20, and more preferably 100,000 times or less. In addition, "overlapping" means that the two components overlap when viewed along the normal direction of the first surface 21 of the base material 20.
補強部材３１の第２の弾性係数を算出する方法は、補強部材３１の形態に応じて適宜定められる。例えば、補強部材３１の第２の弾性係数を算出する方法は、上述の基材２０の弾性係数を算出する方法と同様であってもよく、異なっていてもよい。後述する支持基板４０の弾性係数も同様である。例えば、補強部材３１又は支持基板４０の弾性係数を算出する方法として、補強部材３１又は支持基板４０のサンプルを用いて、ＡＳＴＭ Ｄ８８２に準拠して引張試験を実施するという方法を採用することができる。 The method for calculating the second elastic modulus of the reinforcing member 31 is appropriately determined according to the form of the reinforcing member 31. For example, the method of calculating the second elastic modulus of the reinforcing member 31 may be the same as or different from the method of calculating the elastic modulus of the base material 20 described above. The elastic modulus of the support substrate 40 described later is also the same. For example, as a method of calculating the elastic modulus of the reinforcing member 31 or the supporting substrate 40, a method of performing a tensile test in accordance with ASTM D882 using a sample of the reinforcing member 31 or the supporting substrate 40 can be adopted. ..
また、補強部材３１は、基材２０の第１の曲げ剛性よりも大きい曲げ剛性を有する。補強部材３１の曲げ剛性は、基材２０の第１の曲げ剛性の１．１倍以上であってもよく、２倍以上、より好ましくは10倍以上である。以下の説明において、補強部材３１の曲げ剛性のことを、第２の曲げ剛性とも称する。 Further, the reinforcing member 31 has a bending rigidity larger than that of the first bending rigidity of the base material 20. The flexural rigidity of the reinforcing member 31 may be 1.1 times or more, more preferably 10 times or more, the first bending rigidity of the base material 20. In the following description, the bending rigidity of the reinforcing member 31 is also referred to as a second bending rigidity.
補強部材３１を構成する材料の例としては、金属材料を含む金属層や、一般的な熱可塑性エラストマー、アクリル系、ウレタン系、エポキシ系、ポリエステル系、エポキシ系、ビニルエーテル系、ポリエン・チオール系、シリコーン系等のオリゴマー、ポリマー等を挙げることができる。金属材料の例としては、銅、アルミニウム、ステンレス鋼、半田材料等を挙げることができる。補強部材３１の厚みは、例えば１μｍ以上１００μｍ以下であるが、特に限定されるものではない。 Examples of the material constituting the reinforcing member 31 include a metal layer containing a metal material, a general thermoplastic elastomer, an acrylic type, a urethane type, an epoxy type, a polyester type, an epoxy type, a vinyl ether type, a polyene / thiol type, and the like. Examples thereof include oligomers such as silicones and polymers. Examples of metal materials include copper, aluminum, stainless steel, solder materials and the like. The thickness of the reinforcing member 31 is, for example, 1 μm or more and 100 μm or less, but is not particularly limited.
補強部材３１を構成する材料として、オリゴマー又はポリマーを用いる場合、補強部材３１は、透明性を有していてもよい。また、補強部材３１は、遮光性、例えば紫外線を遮蔽する特性を有していてもよい。例えば、補強部材３１は黒色であってもよい。また、補強部材３１の色と基材２０の色とが同一であってもよい。 When an oligomer or a polymer is used as the material constituting the reinforcing member 31, the reinforcing member 31 may have transparency. Further, the reinforcing member 31 may have a light-shielding property, for example, a property of shielding ultraviolet rays. For example, the reinforcing member 31 may be black. Further, the color of the reinforcing member 31 and the color of the base material 20 may be the same.
図３は、図２の配線基板１０を線Ｂ−Ｂに沿って切断した場合を示す断面図である。補強部材３１については、電子部品５１及び配線５２との位置関係に基づいて後に詳細に説明する。なお、図２は、配線基板１０を基材２０の第１面２１側から見た場合を示す平面図であるので、基材２０の中に位置する補強部材３１は点線で表されている。 FIG. 3 is a cross-sectional view showing a case where the wiring board 10 of FIG. 2 is cut along the line BB. The reinforcing member 31 will be described in detail later based on the positional relationship with the electronic component 51 and the wiring 52. Since FIG. 2 is a plan view showing the case where the wiring board 10 is viewed from the first surface 21 side of the base material 20, the reinforcing member 31 located in the base material 20 is represented by a dotted line.
〔支持基板〕
支持基板４０は、基材２０よりも低い伸縮性を有するよう構成された板状の部材である。支持基板４０は、基材２０側に位置する第２面４２と、第２面４２の反対側に位置する第１面４１と、を含む。図１に示す例において、支持基板４０は、その第１面４１側において電子部品５１及び配線５２を支持している。また、支持基板４０は、その第２面４２側において基材２０の第１面に接合されている。例えば、基材２０と支持基板４０との間に、接着剤を含む接着層６０が設けられていてもよい。接着層６０を構成する材料としては、例えばアクリル系接着剤、シリコーン系接着剤等を用いることができる。接着層６０の厚みは、例えば５μｍ以上且つ２００μｍ以下である。また、図１０に示すように、常温接合又は非接着表面を分子修飾させて、分子接着結合させる方法によって支持基板４０の第２面４２が基材２０の第１面２１に接合されていてもよい。この場合、基材２０と支持基板４０との間に接着層が設けられていなくてもよい。また、基材２０の第１面２１又は支持基板４０の第２面４２の一方又は両方に、常温接合、分子接着の接着性を向上させるプライマー層を設けてもよい。常温接合又は分子接着によって支持基板４０の第２面４２が基材２０の第１面２１に接合される場合、図１０に示すように、補強部材３１は、基材２０の第１面２１又は第２面２２に露出しないよう基材２０に埋め込まれていることが好ましい。
[Support board]
The support substrate 40 is a plate-shaped member configured to have lower elasticity than the substrate 20. The support substrate 40 includes a second surface 42 located on the base material 20 side and a first surface 41 located on the opposite side of the second surface 42. In the example shown in FIG. 1, the support substrate 40 supports the electronic component 51 and the wiring 52 on the first surface 41 side thereof. Further, the support substrate 40 is joined to the first surface of the base material 20 on the second surface 42 side thereof. For example, an adhesive layer 60 containing an adhesive may be provided between the base material 20 and the support substrate 40. As the material constituting the adhesive layer 60, for example, an acrylic adhesive, a silicone adhesive, or the like can be used. The thickness of the adhesive layer 60 is, for example, 5 μm or more and 200 μm or less. Further, as shown in FIG. 10, even if the second surface 42 of the support substrate 40 is bonded to the first surface 21 of the base material 20 by a method of molecularly modifying the room temperature bonded or non-adherensed surface to bond the molecules. Good. In this case, the adhesive layer may not be provided between the base material 20 and the support substrate 40. Further, a primer layer for improving the adhesiveness of room temperature bonding and molecular adhesion may be provided on one or both of the first surface 21 of the base material 20 and the second surface 42 of the support substrate 40. When the second surface 42 of the support substrate 40 is bonded to the first surface 21 of the base material 20 by room temperature bonding or molecular adhesion, the reinforcing member 31 is the first surface 21 or the first surface 21 of the base material 20 as shown in FIG. It is preferably embedded in the base material 20 so as not to be exposed on the second surface 22.
後述するように、支持基板４０に接合された基材２０から引張応力が取り除かれて基材２０が収縮するとき、支持基板４０には蛇腹形状部が形成される。支持基板４０の特性や寸法は、このような蛇腹形状部が形成され易くなるよう設定されている。例えば、支持基板４０は、基材２０の第１の弾性係数よりも大きい弾性係数を有する。以下の説明において、支持基板４０の弾性係数のことを、第３の弾性係数とも称する。 As will be described later, when the tensile stress is removed from the base material 20 bonded to the support substrate 40 and the base material 20 contracts, a bellows-shaped portion is formed on the support substrate 40. The characteristics and dimensions of the support substrate 40 are set so that such a bellows-shaped portion can be easily formed. For example, the support substrate 40 has an elastic modulus larger than the first elastic modulus of the substrate 20. In the following description, the elastic modulus of the support substrate 40 is also referred to as a third elastic modulus.
支持基板４０の第３の弾性係数は、例えば１００ＭＰａ以上であり、より好ましくは１ＧＰａ以上である。支持基板４０の第３の弾性係数は、基材２０の第１の弾性係数の１００倍以上１０００００倍以下であってもよく、１０００倍以上５００００倍以下であってもよい。なお、支持基板４０の弾性係数が低すぎると、補強部材３０の形成工程中に支持基板４０が変形し易く、この結果、電子部品５１及び配線５２に対する補強部材３０の位置合わせが難しくなる。また、支持基板４０の弾性係数が高すぎると、弛緩時の基材２０の復元が難しくなり、また基材２０の割れや折れが発生し易くなる。支持基板４０を構成する材料としては、例えば、ポリエチレンナフタレート、ポリイミド、ポリカーボネート、アクリル樹脂、ポリエチレンテレフタラート等を用いることができる。支持基板４０を構成する材料としては、その中でも、耐久性や耐熱性がよいポリエチレンナフタレートかポリイミドが好ましく用いられ得る。 The third elastic modulus of the support substrate 40 is, for example, 100 MPa or more, more preferably 1 GPa or more. The third elastic modulus of the support substrate 40 may be 100 times or more and 100,000 times or less, or 1000 times or more and 50,000 times or less of the first elastic modulus of the base material 20. If the elastic modulus of the support substrate 40 is too low, the support substrate 40 is likely to be deformed during the process of forming the reinforcing member 30, and as a result, it becomes difficult to align the reinforcing member 30 with respect to the electronic component 51 and the wiring 52. Further, if the elastic modulus of the support substrate 40 is too high, it becomes difficult to restore the base material 20 at the time of relaxation, and the base material 20 is likely to be cracked or broken. As the material constituting the support substrate 40, for example, polyethylene naphthalate, polyimide, polycarbonate, acrylic resin, polyethylene terephthalate and the like can be used. Among them, polyethylene naphthalate or polyimide having good durability and heat resistance can be preferably used as the material constituting the support substrate 40.
支持基板４０の第３の弾性係数は、基材２０の第１の弾性係数の１００倍以下であってもよい。支持基板４０の第３の弾性係数を算出する方法は、基材２０の場合と同様である。また、支持基板４０の厚みは、５００ｎｍ以上１０μｍ以下であり、より好ましくは１μｍ以上５μｍ以下である。支持基板４０の厚みが小さすぎると、支持基板４０の製造工程や、支持基板４０上に部材を形成する工程における、支持基板４０のハンドリングが難しくなる。支持基板４０の厚みが大きすぎると、弛緩時の基材２０の復元が難しくなり、目標の基材２０の伸縮が得られなくなる。 The third elastic modulus of the support substrate 40 may be 100 times or less of the first elastic modulus of the base material 20. The method of calculating the third elastic modulus of the support substrate 40 is the same as that of the base material 20. The thickness of the support substrate 40 is 500 nm or more and 10 μm or less, more preferably 1 μm or more and 5 μm or less. If the thickness of the support substrate 40 is too small, it becomes difficult to handle the support substrate 40 in the manufacturing process of the support substrate 40 and the process of forming a member on the support substrate 40. If the thickness of the support substrate 40 is too large, it becomes difficult to restore the base material 20 at the time of relaxation, and the target base material 20 cannot be expanded or contracted.
〔電子部品〕
図１に示す例において、電子部品５１は、配線５２に接続される電極を少なくとも有する。電子部品５１は、能動部品であってもよく、受動部品であってもよく、機構部品であってもよい。
電子部品５１の例としては、トランジスタ、ＬＳＩ(Large-Scale Integration)、ＭＥＭＳ(Micro Electro Mechanical Systems)、リレー、ＬＥＤ、ＯＬＥＤ、ＬＣＤなどの発光素子、センサ、ブザー等の発音部品、振動を発する振動部品、冷却発熱をコントロールするペルチェ素子や電熱線などの冷発熱部品、抵抗器、キャパシタ、インダクタ、圧電素子、スイッチ、コネクタなどを挙げることができる。電子部品５１の上述の例のうち、センサが好ましく用いられる。センサとしては、例えば、温度センサ、圧力センサ、光センサ、光電センサ、近接センサ、せん断力センサ、生体センサ、レーザーセンサ、マイクロ波センサ、湿度センサ、歪みセンサ、ジャイロセンサ、加速度センサ、変位センサ、磁気センサ、ガスセンサ、GPSセンサ、超音波センサ、臭いセンサ、脳波センサ、電流センサ、振動センサ、脈波センサ、心電センサ、光度センサ等を挙げることができる。これらのセンサのうち、生体センサが特に好ましい。生体センサは、心拍や脈拍、心電、血圧、体温、血中酸素濃度等の生体情報を測定することができる。
[Electronic components]
In the example shown in FIG. 1, the electronic component 51 has at least an electrode connected to the wiring 52. The electronic component 51 may be an active component, a passive component, or a mechanical component.
Examples of electronic components 51 include transistors, LSI (Large-Scale Integration), MEMS (Micro Electro Mechanical Systems), relays, light emitting elements such as LEDs, OLEDs, and LCDs, sound components such as sensors and buzzers, and vibrations that generate vibrations. Examples thereof include parts, cold and heat-generating parts such as Perche elements and heating wires that control cooling heat generation, resistors, capacitors, inductors, piezoelectric elements, switches, and connectors. Of the above examples of the electronic component 51, the sensor is preferably used. Examples of sensors include temperature sensors, pressure sensors, optical sensors, photoelectric sensors, proximity sensors, shear force sensors, biosensors, laser sensors, microwave sensors, humidity sensors, strain sensors, gyro sensors, acceleration sensors, displacement sensors, etc. Examples thereof include magnetic sensors, gas sensors, GPS sensors, ultrasonic sensors, odor sensors, brain wave sensors, current sensors, vibration sensors, pulse wave sensors, electrocardiographic sensors, and photometric sensors. Of these sensors, biosensors are particularly preferred. The biosensor can measure biometric information such as heartbeat, pulse, electrocardiogram, blood pressure, body temperature, and blood oxygen concentration.
〔配線〕
配線５２は、電子部品５１の電極に接続された、導電性を有する部材である。例えば図２に示すように、配線５２の一端及び他端が、２つの電子部品５１の電極にそれぞれ接続されている。図２に示すように、複数の配線５２が２つの電子部品５１の間に設けられていてもよい。
〔wiring〕
The wiring 52 is a conductive member connected to the electrodes of the electronic component 51. For example, as shown in FIG. 2, one end and the other end of the wiring 52 are connected to the electrodes of the two electronic components 51, respectively. As shown in FIG. 2, a plurality of wirings 52 may be provided between the two electronic components 51.
後述するように、支持基板４０に接合された基材２０から引張応力が取り除かれて基材２０が収縮するとき、配線５２は蛇腹状に変形する。この点を考慮し、好ましくは、配線５２は、変形に対する耐性を有する構造を備える。例えば、配線５２は、ベース材と、ベース材の中に分散された複数の導電性粒子とを有する。この場合、ベース材として、樹脂などの変形可能な材料を用いることにより、基材２０の伸縮に応じて配線５２も変形することができる。また、変形が生じた場合であっても複数の導電性粒子の間の接触が維持されるように導電性粒子の分布や形状を設定することにより、配線５２の導電性を維持することができる。 As will be described later, when the tensile stress is removed from the base material 20 bonded to the support substrate 40 and the base material 20 contracts, the wiring 52 is deformed in a bellows shape. In consideration of this point, preferably, the wiring 52 has a structure having resistance to deformation. For example, the wiring 52 has a base material and a plurality of conductive particles dispersed in the base material. In this case, by using a deformable material such as resin as the base material, the wiring 52 can also be deformed according to the expansion and contraction of the base material 20. Further, the conductivity of the wiring 52 can be maintained by setting the distribution and shape of the conductive particles so that the contact between the plurality of conductive particles is maintained even when the deformation occurs. ..
配線５２のベース材を構成する材料としては、例えば、一般的な熱可塑性エラストマーおよび熱硬化性エラストマーを用いることができ、例えば、スチレン系エラストマー、アクリル系エラストマー、オレフィン系エラストマー、ウレタン系エラストマー、シリコーンゴム、ウレタンゴム、フッ素ゴム、ニトリルゴム、ポリブタジエン、ポリクロロプレン等を用いることができる。中でも、ウレタン系、シリコーン系構造を含む樹脂やゴムが、その伸縮性や耐久性などの面から好ましく用いられる。また、配線５２の導電性粒子を構成する材料としては、例えば銀、銅、金、ニッケル、パラジウム、白金、カーボン等の粒子を用いることができる。中でも、銀粒子が、価格と導電性の観点から好ましく用いられる。 As a material constituting the base material of the wiring 52, for example, a general thermoplastic elastomer and a thermosetting elastomer can be used, and for example, a styrene elastomer, an acrylic elastomer, an olefin elastomer, a urethane elastomer, and a silicone. Rubber, urethane rubber, fluororubber, nitrile rubber, polybutadiene, polychloroprene and the like can be used. Among them, resins and rubbers containing urethane-based and silicone-based structures are preferably used in terms of their elasticity and durability. Further, as a material constituting the conductive particles of the wiring 52, for example, particles such as silver, copper, gold, nickel, palladium, platinum, and carbon can be used. Among them, silver particles are preferably used from the viewpoint of price and conductivity.
なお、配線５２に求められることは、蛇腹形状部の解消及び生成を利用して基材２０の伸張及び収縮に追従することである。この点を考慮すると、配線５２の材料としては、上述のようにそれ自体が変形性や伸縮性を有しているものだけでなく、それ自体は変形性や伸縮性を有していないものも採用可能である。
配線５２に用いられ得る、それ自体は伸縮性を有さない材料としては、例えば、金、銀、銅、アルミニウム、白金、クロム等の金属や、これらの金属を含む合金が挙げられる。配線５２の材料自体が伸縮性を有さない場合、配線５２としては、金属膜を用いることができる。
What is required of the wiring 52 is to follow the expansion and contraction of the base material 20 by utilizing the elimination and formation of the bellows-shaped portion. Considering this point, as the material of the wiring 52, not only the material itself having deformability and elasticity as described above, but also the material itself having no deformability and elasticity. It can be adopted.
Examples of the material that can be used for the wiring 52 and does not have elasticity by itself include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. When the material of the wiring 52 itself does not have elasticity, a metal film can be used as the wiring 52.
配線５２の厚みは、基材２０の伸縮に耐え得る厚みであればよく、配線５２の材料等に応じて適宜選択される。例えば、配線５２の材料が伸縮性を有さない場合、配線５２の厚みは、２５ｎｍ以上５０μｍ以下の範囲内とすることができ、５０ｎｍ以上１０μｍ以下の範囲内であることが好ましく、１００ｎｍ以上５μｍ以下の範囲内であることがより好ましい。 The thickness of the wiring 52 may be any thickness as long as it can withstand the expansion and contraction of the base material 20, and is appropriately selected depending on the material of the wiring 52 and the like. For example, when the material of the wiring 52 does not have elasticity, the thickness of the wiring 52 can be in the range of 25 nm or more and 50 μm or less, preferably in the range of 50 nm or more and 10 μm or less, and preferably 100 nm or more and 5 μm. It is more preferably within the following range.
また、配線５２の材料が伸縮性を有する場合、配線５２の厚みは、５μｍ以上６０μｍ以下の範囲内とすることができ、１０μｍ以上５０μｍ以下の範囲内であることが好ましく、２０μｍ以上４０μｍ以下の範囲内であることがより好ましい。配線５２の幅は、例えば５０μｍ以上且つ１０ｍｍ以下である。 When the material of the wiring 52 has elasticity, the thickness of the wiring 52 can be in the range of 5 μm or more and 60 μm or less, preferably in the range of 10 μm or more and 50 μm or less, and 20 μm or more and 40 μm or less. It is more preferable that it is within the range. The width of the wiring 52 is, for example, 50 μm or more and 10 mm or less.
また、基材２０上または後述する支持基板４０上及びこれら基材２０または支持基板４０に設けられた配線５２には、基材２０または支持基板４０と配線５２とを一体的に覆う絶縁膜が設けられてもよい。ただし、絶縁膜は、配線５２における電子部品５１との接続部分上には設けられない。このような絶縁膜は、熱硬化性の絶縁樹脂等を加熱硬化することで構成され得る。あるいは、絶縁膜は、紫外線によるＵＶ硬化樹脂、または樹脂を含んだ溶液の塗布後に、熱乾燥により溶液中の溶剤を揮発させて得られる溶剤乾燥樹脂にて構成されてもよい。絶縁膜の厚さは、例えば１０μｍ以上５００μｍ以下でもよい。また、絶縁膜の形成は、スクリーン印刷等で行われてもよい。また、接続部５１ａは、例えば導電性接着剤から構成されてもよいし、半田材料で形成されてもよいし、電子部品５１と一体の端子であってもよい。 Further, an insulating film that integrally covers the base material 20 or the support substrate 40 and the wiring 52 is provided on the base material 20 or the support substrate 40 described later and the wiring 52 provided on the base material 20 or the support substrate 40. It may be provided. However, the insulating film is not provided on the connection portion of the wiring 52 with the electronic component 51. Such an insulating film can be formed by heat-curing a thermosetting insulating resin or the like. Alternatively, the insulating film may be composed of a UV curable resin by ultraviolet rays or a solvent-dried resin obtained by volatilizing the solvent in the solution by heat drying after applying the solution containing the resin. The thickness of the insulating film may be, for example, 10 μm or more and 500 μm or less. Further, the insulating film may be formed by screen printing or the like. Further, the connecting portion 51a may be made of, for example, a conductive adhesive, may be formed of a solder material, or may be a terminal integrated with the electronic component 51.
配線５２の形成方法は、材料等に応じて適宜選択される。例えば、基材２０上または後述する支持基板４０上に蒸着法やスパッタリング法、メッキ法、特にＣｕメッキ法等により金属膜を形成した後、フォトリソグラフィ法により金属膜をパターニングする方法が挙げられる。あるいは、基材２０上または後述する支持基板４０上に金属箔を接着積層した後、フォトリソグラフィ法により金属膜をパターニングする方法が挙げられる。また、配線５２の材料自体が伸縮性を有する場合、例えば、基材２０上または支持基板４０上に一般的な印刷法により上記の導電性粒子およびエラストマーを含有する導電性組成物をパターン状に印刷する方法が挙げられる。これらの方法のうち、材料効率がよく安価に製作できる印刷法が好ましく用いられ得る。 The method for forming the wiring 52 is appropriately selected depending on the material and the like. For example, a method of forming a metal film on a base material 20 or a support substrate 40 described later by a vapor deposition method, a sputtering method, a plating method, particularly a Cu plating method, or the like, and then patterning the metal film by a photolithography method can be mentioned. Alternatively, a method of patterning a metal film by a photolithography method after adhering and laminating a metal foil on a base material 20 or a support substrate 40 described later can be mentioned. When the material of the wiring 52 itself has elasticity, for example, the conductive composition containing the above-mentioned conductive particles and elastomer is patterned on the base material 20 or the support substrate 40 by a general printing method. There is a method of printing. Of these methods, a printing method that has good material efficiency and can be manufactured at low cost can be preferably used.
〔補強部材と、電子部品５１及び配線５２との位置関係〕
次に、既述の補強部材３１について、電子部品５１及び配線５２との位置関係に基づいて説明する。
[Positional relationship between the reinforcing member and the electronic component 51 and the wiring 52]
Next, the reinforcing member 31 described above will be described based on the positional relationship between the electronic component 51 and the wiring 52.
図１及び図２に示すように、補強部材３１は、基材２０の第１面２１の法線方向に沿って見た場合に電子部品５１と少なくとも部分的に重なるように配置されている。好ましくは、補強部材３１は、基材２０の第１面２１の法線方向に沿って見た場合に電子部品５１の全域にわたって電子部品５１に重なっている。このため、基材２０のうち電子部品５１と重なる部分は、すなわち補強部材３１と重なる部分は、基材２０のうち補強部材３１と重ならない部分に比べて変形しにくい。これにより、基材２０に引張応力などの力を加えたときや、基材２０から引張応力などの力を取り除いたときなどに、基材２０のうち電子部品５１と重なる部分に変形が生じることを抑制することができる。このことにより、基材２０の変形に起因する応力が電子部品５１に加わることを抑制することができ、電子部品５１が変形したり破損したりしてしまうことを抑制することができる。また、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。 As shown in FIGS. 1 and 2, the reinforcing member 31 is arranged so as to at least partially overlap the electronic component 51 when viewed along the normal direction of the first surface 21 of the base material 20. Preferably, the reinforcing member 31 overlaps the electronic component 51 over the entire area of the electronic component 51 when viewed along the normal direction of the first surface 21 of the base material 20. Therefore, the portion of the base material 20 that overlaps with the electronic component 51, that is, the portion that overlaps with the reinforcing member 31, is less likely to be deformed than the portion of the base material 20 that does not overlap with the reinforcing member 31. As a result, when a force such as tensile stress is applied to the base material 20, or when a force such as tensile stress is removed from the base material 20, the portion of the base material 20 that overlaps with the electronic component 51 is deformed. Can be suppressed. As a result, it is possible to suppress the stress caused by the deformation of the base material 20 from being applied to the electronic component 51, and it is possible to prevent the electronic component 51 from being deformed or damaged. In addition, it is possible to prevent the electrical joint between the electronic component 51 and the wiring 52 from being damaged.
なお、既述のように、図１においては、基材２０の中に補強部材３１が位置する例が示されているが、補強部材３１の位置は任意である。すなわち、既述のように、補強部材３１は、基材２０の第１面２１側、基材２０の第２面２２側、又は、基材２０の中に位置するようにしてもよい。 As described above, FIG. 1 shows an example in which the reinforcing member 31 is located in the base material 20, but the position of the reinforcing member 31 is arbitrary. That is, as described above, the reinforcing member 31 may be located on the first surface 21 side of the base material 20, the second surface 22 side of the base material 20, or in the base material 20.
〔配線の構造〕
続いて、配線５２の断面構造について、図４を参照して詳細に説明する。図４は、図１に示す配線基板１０の配線５２及びその周辺の構成要素の一例を拡大して示す断面図である。
[Wiring structure]
Subsequently, the cross-sectional structure of the wiring 52 will be described in detail with reference to FIG. FIG. 4 is an enlarged cross-sectional view showing an example of the wiring 52 of the wiring board 10 shown in FIG. 1 and its peripheral components.
図１乃至図３に示すように、配線５２の大部分は、補強部材３１と重ならないように配置されている。このため、基材２０に収縮などの変形が生じたとき、配線５２は、基材２０の変形に伴って変形し易い。例えば、伸長させた状態の基材２０に配線５２を設けた後、基材２０を弛緩させると、図４に示すように、蛇腹形状部が生じる。この蛇腹形状部のうち、第１蛇腹形状部５７１は、基材２０の第１面２１の法線方向に沿って見た場合に配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚに生じるものである。一方、第２蛇腹形状部５７２は、電子部品５１から境界近傍Ｚよりも離れた領域における、配線５２のうち補強部材３１と重なっていない部分に生じる規則的な形状のものである。 As shown in FIGS. 1 to 3, most of the wiring 52 is arranged so as not to overlap with the reinforcing member 31. Therefore, when the base material 20 is deformed such as shrinkage, the wiring 52 is easily deformed with the deformation of the base material 20. For example, when the wiring 52 is provided on the stretched base material 20 and then the base material 20 is relaxed, a bellows-shaped portion is formed as shown in FIG. Of the bellows-shaped portions, the first bellows-shaped portion 571 is the end portion of the electronic component 51 mounted on the wiring board 10 and the wiring 52 when viewed along the normal direction of the first surface 21 of the base material 20. It occurs in the vicinity Z near the boundary with. On the other hand, the second bellows-shaped portion 572 has a regular shape that occurs in a portion of the wiring 52 that does not overlap with the reinforcing member 31 in a region far from the boundary vicinity Z from the electronic component 51.
上述のように、配線５２は、例えば、図４に示すように、基材２０の第１面２１の面内方向に沿って並ぶ複数の山部及び谷部を含む第１及び第２蛇腹形状部５７１、５７２を有する。なお、例えば、図４に示すように、配線５２の蛇腹形状部は、第１面２１の法線方向に沿って見た場合に電子部品５１と基材２０との間に、設けられていない。 As described above, for example, as shown in FIG. 4, the wiring 52 has a first and second bellows shape including a plurality of peaks and valleys arranged along the in-plane direction of the first surface 21 of the base material 20. It has parts 571 and 572. For example, as shown in FIG. 4, the bellows-shaped portion of the wiring 52 is not provided between the electronic component 51 and the base material 20 when viewed along the normal direction of the first surface 21. ..
また、第１及び第２蛇腹形状部５７１、５７２は、基材２０の第１面２１の法線方向における山部５３１、５３２及び谷部５５１、５５２を含む。 Further, the first and second bellows-shaped portions 571 and 572 include peak portions 531 and 532 and valley portions 551 and 552 in the normal direction of the first surface 21 of the base material 20.
図４において、符号５３１、５３２は、配線５２の表面に現れる山部を表し、符号５４１、５４２は、配線５２の裏面に現れる山部を表す。また、符号５５１、５５２は、配線５２の表面に現れる谷部を表し、符号５６１、５６２は、配線５２の裏面に現れる谷部を表す。表面とは、配線５２の面のうち基材２０から遠い側に位置する面であり、裏面とは、配線５２の面のうち基材２０に近い側に位置する面である。 In FIG. 4, reference numerals 531 and 532 represent mountain portions appearing on the front surface of the wiring 52, and reference numerals 541 and 542 represent mountain portions appearing on the back surface of the wiring 52. Further, reference numerals 551 and 552 represent valley portions appearing on the front surface of the wiring 52, and reference numerals 561 and 562 represent valley portions appearing on the back surface of the wiring 52. The front surface is a surface of the wiring 52 located on the side farther from the base material 20, and the back surface is a surface of the wiring 52 located on the side closer to the base material 20.
また、図４において、符号２６１、２６２及び２７１、２７２は、基材２０の第１面２１に現れる山部及び谷部を表す。第１面２１に山部２６１、２６２及び谷部２７１、２７２が現れるように基材２０が変形することにより、配線５２が蛇腹状に変形して蛇腹形状部を有するようになる。基材２０の第１面２１の山部２６１、２６２が、配線５２の第１及び第２蛇腹形状部５７１、５７２の山部５３１、５３２、５４１、５４２に対応し、基材２０の第１面２１の谷部２７１、２７２が、配線５２の第１及び第２蛇腹形状部５７１、５７２の谷部５５１、５５２、５６１、５６２に対応している。 Further, in FIG. 4, reference numerals 261 and 262 and 271 and 272 represent peaks and valleys appearing on the first surface 21 of the base material 20. By deforming the base material 20 so that the peaks 261 and 262 and the valleys 271 and 272 appear on the first surface 21, the wiring 52 is deformed in a bellows shape to have a bellows-shaped portion. The ridges 261 and 262 of the first surface 21 of the base material 20 correspond to the ridges 531, 532, 541 and 542 of the first and second bellows-shaped portions 571 and 572 of the wiring 52, and the first of the base material 20. The valleys 271 and 272 of the surface 21 correspond to the valleys 551, 552, 561 and 562 of the first and second bellows-shaped portions 571 and 572 of the wiring 52.
第２蛇腹形状部５７２の山部５３２、５４２及び谷部５５２、５６２は、基材２０の第１面２１の面内方向に沿って繰り返し現れる。山部５３２、５４２及び谷部５５２、５６２が繰り返し現れる周期は、例えば１０μｍ以上且つ１００ｍｍ以下である。なお、図４では、第２蛇腹形状部５７２の複数の山部及び谷部が一定の周期で並ぶ例が示されているが、第２蛇腹形状部５７２の複数の山部及び谷部は、第１面２１の面内方向に沿って不規則に並んでいてもよい。 The peaks 532 and 542 and the valleys 552 and 562 of the second bellows-shaped portion 572 repeatedly appear along the in-plane direction of the first surface 21 of the base material 20. The period in which the peaks 532 and 542 and the valleys 552 and 562 repeatedly appear is, for example, 10 μm or more and 100 mm or less. Note that FIG. 4 shows an example in which a plurality of peaks and valleys of the second bellows-shaped portion 572 are lined up at regular intervals, but the plurality of peaks and valleys of the second bellows-shaped portion 572 are shown. The first surface 21 may be arranged irregularly along the in-plane direction.
図４において、符号Ｓ１は、配線５２の表面における第２蛇腹形状部５７２の振幅を表す。
振幅Ｓ１は、例えば１μｍ以上であり、より好ましくは１０μｍ以上である。振幅Ｓ１を１０μｍ以上とすることにより、基材２０の伸張に追従して配線５２が変形し易くなる。また、振幅Ｓ１は、例えば５００μｍ以下であってもよい。
In FIG. 4, reference numeral S1 represents the amplitude of the second bellows-shaped portion 572 on the surface of the wiring 52.
The amplitude S1 is, for example, 1 μm or more, more preferably 10 μm or more. By setting the amplitude S1 to 10 μm or more, the wiring 52 is easily deformed following the elongation of the base material 20. Further, the amplitude S1 may be, for example, 500 μm or less.
振幅Ｓ１は、例えば、配線５２の長さ方向における一定の範囲にわたって、第２蛇腹形状部５７２の隣り合う山部５３２と谷部５５２との間の、第１面２１の法線方向における距離を測定し、それらの平均を求めることにより算出される。隣り合う山部５３２と谷部５５２との間の距離を測定する測定器としては、レーザー顕微鏡などを用いた非接触式の測定器を用いてもよく、接触式の測定器を用いてもよい。また、断面写真などの画像に基づいて、隣り合う山部５３２と谷部５５２との間の距離を測定してもよい。
なお、配線５２の表面における第１蛇腹形状部５７１の振幅の算出方法も同様である。また、後述する振幅Ｓ２、Ｓ３、Ｓ４の算出方法も同様である。
The amplitude S1 is, for example, the distance in the normal direction of the first surface 21 between the adjacent peaks 532 and valleys 552 of the second bellows-shaped portion 527 over a certain range in the length direction of the wiring 52. It is calculated by measuring and calculating the average of them. As a measuring instrument for measuring the distance between the adjacent peaks 532 and valleys 552, a non-contact measuring instrument using a laser microscope or the like may be used, or a contact measuring instrument may be used. .. Further, the distance between the adjacent mountain portion 532 and the valley portion 552 may be measured based on an image such as a cross-sectional photograph.
The method for calculating the amplitude of the first bellows-shaped portion 571 on the surface of the wiring 52 is also the same. Further, the calculation method of the amplitudes S2, S3, and S4 described later is also the same.
図４において、符号Ｓ２は、配線５２の裏面における第２蛇腹形状部５７２の振幅を表す。振幅Ｓ２は、振幅Ｓ１と同様に、例えば１μｍ以上であり、より好ましくは１０μｍ以上である。また、振幅Ｓ２は、例えば５００μｍ以下であってもよい。 In FIG. 4, reference numeral S2 represents the amplitude of the second bellows-shaped portion 572 on the back surface of the wiring 52. The amplitude S2 is, for example, 1 μm or more, more preferably 10 μm or more, like the amplitude S1. Further, the amplitude S2 may be, for example, 500 μm or less.
図４に示すように、支持基板４０、接着層６０や基材２０の第１面２１にも、配線５２と同様の蛇腹形状部が形成されていてもよい。図４において、符号Ｓ３は、基材２０の第１面２１における第２蛇腹形状部５７２の振幅を表す。第１面２１における第２蛇腹形状部５７２は、複数の山部２６２及び谷部２７２を含む。振幅Ｓ３は、例えば１μｍ以上であり、より好ましくは１０μｍ以上である。また、振幅Ｓ３は、例えば５００μｍ以下であってもよい。 As shown in FIG. 4, a bellows-shaped portion similar to the wiring 52 may be formed on the support substrate 40, the adhesive layer 60, and the first surface 21 of the base material 20. In FIG. 4, reference numeral S3 represents the amplitude of the second bellows-shaped portion 572 on the first surface 21 of the base material 20. The second bellows-shaped portion 572 on the first surface 21 includes a plurality of peaks 262 and valleys 272. The amplitude S3 is, for example, 1 μm or more, more preferably 10 μm or more. Further, the amplitude S3 may be, for example, 500 μm or less.
なお、例えば、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１の山部５３１と谷部５５１の周期は、配線５２の蛇腹形状部５７１、５７２のうち、配線基板１０に搭載される電子部品５１から境界近傍Ｚよりも離れた領域における配線５２の第２蛇腹形状部５７２の山部５３２と谷部５５２の周期よりも、小さく若しくは大きくなっている。なお、図４の例では、一例として、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１の周期は、配線基板１０に搭載される電子部品５１から境界近傍Ｚよりも離れた領域における配線５２の第２蛇腹形状部５７２の山部５３２と谷部５５２の周期よりも、小さい場合を示しているが、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１の周期が小さいものと大きいものとが混在して、不規則になっていてもよい。 For example, the period of the peak portion 531 and the valley portion 551 of the first bellows-shaped portion 571 of the wiring 52 in the vicinity Z of the boundary is the electronic component mounted on the wiring board 10 among the bellows-shaped portions 571 and 572 of the wiring 52. It is smaller or larger than the period of the peak portion 532 and the valley portion 552 of the second bellows-shaped portion 572 of the wiring 52 in the region away from the boundary Z near the boundary 51. In the example of FIG. 4, as an example, the period of the first bellows-shaped portion 571 of the wiring 52 in the boundary vicinity Z is the wiring 52 in a region farther from the boundary vicinity Z from the electronic component 51 mounted on the wiring board 10. The case is shown in which the period is smaller than the period of the peak portion 532 and the valley portion 552 of the second bellows-shaped portion 572, but the period of the first bellows-shaped portion 571 of the wiring 52 in the vicinity of the boundary Z is small and large. May be mixed and irregular.
また、例えば、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１の山部５３１と谷部５５１の振幅は、配線５２の第２蛇腹形状部５７２の山部５３２と谷部５５２の振幅よりも、小さく若しくは大きくなっている。なお、図４の例では、一例として、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１の振幅は、配線基板１０に搭載される電子部品５１から境界近傍Ｚよりも離れた領域における配線５２の第２蛇腹形状部５７２の山部５３２と谷部５５２の振幅よりも、大きい場合を示しているが、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１の振幅が小さいものと大きいものとが混在して、不規則になってもよい。 Further, for example, the amplitude of the peak portion 531 and the valley portion 551 of the first bellows-shaped portion 571 of the wiring 52 in the vicinity Z of the boundary is larger than the amplitude of the peak portion 532 and the valley portion 552 of the second bellows-shaped portion 57 2 of the wiring 52. , Smaller or larger. In the example of FIG. 4, as an example, the amplitude of the first bellows-shaped portion 571 of the wiring 52 in the boundary vicinity Z is the wiring 52 in a region farther from the boundary vicinity Z from the electronic component 51 mounted on the wiring board 10. Although the amplitude is larger than the amplitudes of the peaks 532 and the valleys 552 of the second bellows-shaped portion 572, the amplitudes of the first bellows-shaped portion 571 of the wiring 52 in the vicinity of the boundary Z are small and large. May be mixed and irregular.
この第１蛇腹形状部５７１は、第２蛇腹形状部５７２よりも、不規則な形状を有しているため、伸縮すると、当該第１蛇腹形状部５７１の配線５２が断線する可能性がある。 Since the first bellows-shaped portion 571 has a more irregular shape than the second bellows-shaped portion 572, the wiring 52 of the first bellows-shaped portion 571 may be broken when expanded or contracted.
なお、図５は、図１に示す配線基板１０の配線５２及びその周辺の構成要素のその他の例を拡大して示す断面図である。図５に示すように、基材２０の第１面２１には蛇腹形状部が形成されていなくてもよい。 Note that FIG. 5 is an enlarged cross-sectional view showing another example of the wiring 52 of the wiring board 10 shown in FIG. 1 and its peripheral components. As shown in FIG. 5, the bellows-shaped portion may not be formed on the first surface 21 of the base material 20.
次に、図４や図５に示す蛇腹形状部の第２蛇腹形状部５７２が配線５２に形成されていることの利点について説明する。上述のように、基材２０は、１０ＭＰａ以下の弾性係数を有する。このため、配線基板１０に引張応力を加えた場合、基材２０は、弾性変形によって伸長することができる。ここで、仮に配線５２も同様に弾性変形によって伸長すると、配線５２の全長が増加し、配線５２の断面積が減少するので、配線５２の抵抗値が増加してしまう。また、配線５２の弾性変形に起因して配線５２にクラックなどの破損が生じてしまうことも考えられる。 Next, the advantage that the second bellows-shaped portion 572 of the bellows-shaped portion shown in FIGS. 4 and 5 is formed in the wiring 52 will be described. As described above, the base material 20 has an elastic modulus of 10 MPa or less. Therefore, when tensile stress is applied to the wiring board 10, the base material 20 can be stretched by elastic deformation. Here, if the wiring 52 is also stretched by elastic deformation, the total length of the wiring 52 increases and the cross-sectional area of the wiring 52 decreases, so that the resistance value of the wiring 52 increases. Further, it is also conceivable that the wiring 52 may be damaged such as cracks due to the elastic deformation of the wiring 52.
これに対して、本実施の形態においては、配線５２が蛇腹形状部の第２蛇腹形状部５７２を有している。このため、基材２０が伸張する際、配線５２は、第２蛇腹形状部５７２の起伏を低減するように変形することによって、すなわち蛇腹形状を解消することによって、基材２０の伸張に追従することができる。このため、基材２０の伸張に伴って配線５２の全長が増加することや、配線５２の断面積が減少することを抑制することができる。このことにより、配線基板１０の伸張に起因して配線５２の抵抗値が増加することを抑制することができる。また、配線５２にクラックなどの破損が生じてしまうことを抑制することができる。 On the other hand, in the present embodiment, the wiring 52 has a second bellows-shaped portion 572 of the bellows-shaped portion. Therefore, when the base material 20 is stretched, the wiring 52 follows the stretch of the base material 20 by deforming the second bellows-shaped portion 572 so as to reduce the undulations, that is, by eliminating the bellows shape. be able to. Therefore, it is possible to prevent the total length of the wiring 52 from increasing and the cross-sectional area of the wiring 52 from decreasing as the base material 20 stretches. As a result, it is possible to suppress an increase in the resistance value of the wiring 52 due to the extension of the wiring board 10. Further, it is possible to prevent the wiring 52 from being damaged such as a crack.
なお、上述の実施の形態においては、電子部品５１及び配線５２が支持基板４０の第１面４１に位置する例を示した。しかしながら、これに限られることはなく、電子部品５１及び配線５２は、支持基板４０の第２面４２に位置していてもよい。この場合、補強部材３１は、基材２０の第２面２２に位置していてもよく、基材２０の第１面２１に位置していてもよく、又、支持基板の第１面４１に位置していてもよい。 In the above-described embodiment, an example is shown in which the electronic component 51 and the wiring 52 are located on the first surface 41 of the support substrate 40. However, the present invention is not limited to this, and the electronic component 51 and the wiring 52 may be located on the second surface 42 of the support substrate 40. In this case, the reinforcing member 31 may be located on the second surface 22 of the base material 20, may be located on the first surface 21 of the base material 20, or may be located on the first surface 41 of the support substrate. It may be located.
また、上述の実施の形態においては、補強部材３１が、基材２０の第１面２１又は第２面２２に露出しないよう基材２０に埋め込まれている例を示した。しかしながら、これに限られることはなく、例えば、補強部材３１は、基材２０の第１面２１に露出するよう基材２０に埋め込まれていてもよい。また、補強部材３１は、基材２０の第２面２２に露出するよう基材２０に埋め込まれていてもよい。また、補強部材３１は、接着層６０に埋め込まれていてもよい。 Further, in the above-described embodiment, an example is shown in which the reinforcing member 31 is embedded in the base material 20 so as not to be exposed on the first surface 21 or the second surface 22 of the base material 20. However, the present invention is not limited to this, and for example, the reinforcing member 31 may be embedded in the base material 20 so as to be exposed on the first surface 21 of the base material 20. Further, the reinforcing member 31 may be embedded in the base material 20 so as to be exposed on the second surface 22 of the base material 20. Further, the reinforcing member 31 may be embedded in the adhesive layer 60.
〔追加配線〕
追加配線Ｑは、例えば、図１に示すように、基材２０の第１面２１側に位置している。この追加配線Ｑは、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含んでいる。すなわち、この追加配線Ｑは、配線５２よりも、伸縮性が高く、断線しにくくなっているものが選択されている。
[Additional wiring]
The additional wiring Q is located on the first surface 21 side of the base material 20, for example, as shown in FIG. The additional wiring Q contains a conductive paste containing conductive particles and having elasticity. That is, the additional wiring Q is selected to have higher elasticity than the wiring 52 and to be less likely to be broken.
ここで、追加配線Ｑを構成する導電性ペーストの導電性粒子は、例えば、銀粒子である。この追加配線Ｑを設ける方法としては、例えば、ベース材及び導電性粒子を含む導電性ペーストを配線５２の蛇腹形状部上に印刷する方法等を採用することができる。印刷方法としてはスクリーン印刷、ディスペンサー、インクジェット法などが挙げられる。
この場合、特に、既述の配線５２には、追加配線Ｑよりも導電性が高い部材、例えば、金属膜が選択されてもよい。この場合、配線５２を構成する金属膜は、例えば、銅で構成されているようにしてもよい。すなわち、配線５２は、例えば、銅配線が選択されてもよい。
Here, the conductive particles of the conductive paste constituting the additional wiring Q are, for example, silver particles. As a method of providing the additional wiring Q, for example, a method of printing a conductive paste containing a base material and conductive particles on the bellows-shaped portion of the wiring 52 can be adopted. Examples of the printing method include screen printing, a dispenser, and an inkjet method.
In this case, in particular, for the wiring 52 described above, a member having higher conductivity than the additional wiring Q, for example, a metal film may be selected. In this case, the metal film constituting the wiring 52 may be made of, for example, copper. That is, for the wiring 52, for example, copper wiring may be selected.
そして、この追加配線Ｑの少なくとも一部は、例えば、図４、図５に示すように、基材２０の第１面２１の法線方向に沿って見た場合に電子部品５１の周囲と重なる部分において、配線５２の蛇腹形状部（ここでは、第１蛇腹形状部５７１）上に位置して配線５２と電子部品５１の電極との間を電気的に接続している。 Then, at least a part of the additional wiring Q overlaps with the periphery of the electronic component 51 when viewed along the normal direction of the first surface 21 of the base material 20, for example, as shown in FIGS. 4 and 5. In the portion, it is located on the bellows-shaped portion of the wiring 52 (here, the first bellows-shaped portion 571) and electrically connects the wiring 52 and the electrode of the electronic component 51.
そして、追加配線Ｑは、例えば、図４、図５に示すように、配線５２の蛇腹形状部の一部（ここでは第１蛇腹形状部５７１）を被覆している（すなわち、蛇腹形状部の全体を被覆していない）。
この場合、追加配線Ｑは、例えば、図４、図５に示すように、基材２０の第１面２１の法線方向に沿って見た場合に、少なくとも配線５２の蛇腹形状部の表面上に位置している。特に、追加配線Ｑは、例えば、図４、図５に示すように、基材２０の第１面２１の法線方向に沿って見た場合に第１蛇腹形状部５７１と重なる部分において、第１蛇腹形状部５７１の表面上に位置している。
Then, for example, as shown in FIGS. 4 and 5, the additional wiring Q covers a part of the bellows-shaped portion of the wiring 52 (here, the first bellows-shaped portion 571) (that is, the bellows-shaped portion). Does not cover the whole).
In this case, the additional wiring Q is at least on the surface of the bellows-shaped portion of the wiring 52 when viewed along the normal direction of the first surface 21 of the base material 20, as shown in FIGS. 4 and 5. Is located in. In particular, as shown in FIGS. 4 and 5, for example, the additional wiring Q has a position where it overlaps with the first bellows-shaped portion 571 when viewed along the normal direction of the first surface 21 of the base material 20. 1 It is located on the surface of the bellows-shaped portion 571.
これにより、例えば、配線基板１０の伸縮により、第1蛇腹形状部は第2蛇腹形状部に比べ、蛇腹形状が不規則なために伸縮に伴う断線が発生しやすいが、配線５２の蛇腹形状部の不規則な部分である第１蛇腹形状部５７１の一部が断線した場合にも、追加配線Ｑが配線５２と電子部品５１の電極との電気的な接続を維持するようになっている。 As a result, for example, due to the expansion and contraction of the wiring board 10, the first bellows-shaped portion has an irregular bellows shape as compared with the second bellows-shaped portion, so that disconnection due to expansion and contraction is likely to occur. Even if a part of the first bellows-shaped portion 571, which is an irregular portion of the above, is broken, the additional wiring Q maintains the electrical connection between the wiring 52 and the electrodes of the electronic component 51.
すなわち、配線５２の不規則な第１蛇腹形状部５７１に断線が発生した場合にも、配線５２と電子部品５１の電極との電気的な接続を維持して、当該配線基板が所定の機能を発揮させることができる。 That is, even when the irregular first bellows-shaped portion 571 of the wiring 52 is disconnected, the wiring board maintains the electrical connection between the wiring 52 and the electrodes of the electronic component 51, and the wiring board performs a predetermined function. It can be demonstrated.
なお、追加配線Ｑの少なくとも一部は、基材２０の第１面２１の法線方向に沿って見た場合に配線５２の蛇腹形状部と重なる部分であって、配線基板１０が被実装体に実装された場合に局所的に押し込まれる領域において、配線５２の蛇腹形状部上に位置して、配線５２と電子部品５１の電極との間を電気的に接続しているようにしてもよい。 At least a part of the additional wiring Q is a portion that overlaps the bellows-shaped portion of the wiring 52 when viewed along the normal direction of the first surface 21 of the base material 20, and the wiring substrate 10 is a mounted body. In the region where the wiring 52 is locally pushed in, the wiring 52 may be located on the bellows-shaped portion of the wiring 52 to electrically connect the wiring 52 and the electrodes of the electronic component 51. ..
これにより、配線基板１０が図示しない被実装体に実装された場合に何かと接触したりぶつかったりして局所的に押し込まれる際に、当該押し込まれる領域において配線５２の蛇腹形状部の一部が断線した場合にも、追加配線Ｑが配線５２と電子部品５１の電極との電気的な接続を維持するようになっている。なお、既述の被実装体は、例えば、人体や動物などの生体であるが、人体や動物などの生体以外の物体、例えば、ロボット、装置、機械や布、衣服、オムツ、ベルト、首輪、カバン、スポンジ等であってもよい。 As a result, when the wiring board 10 is mounted on a mounted body (not shown) and is locally pushed by contacting or colliding with something, a part of the bellows-shaped portion of the wiring 52 is broken in the pushed region. Even in such a case, the additional wiring Q maintains the electrical connection between the wiring 52 and the electrodes of the electronic component 51. The mounted object described above is, for example, a living body such as a human body or an animal, but a non-living object such as a human body or an animal, for example, a robot, a device, a machine or cloth, clothes, a diaper, a belt, a collar, or the like. It may be a bag, a sponge, or the like.
特に、被実装体としてロボット等の固いものに比べ、生体や衣服、オムツ、スポンジ等の柔らかいものを用いた場合は配線全体が押し込まれたときに、電子部品のような固いものが特に局所的に押し込まれやすく、電子部品周辺が断線しやすくなる傾向にあるが、当該押し込まれる領域において配線５２の蛇腹形状部の一部が断線した場合にも、配線５２と電子部品５１の電極との電気的な接続を維持して、当該配線基板が所定の機能を発揮させることができる。 In particular, when a soft object such as a living body, clothes, omelet, or sponge is used as the object to be mounted, a hard object such as an electronic component is particularly local when the entire wiring is pushed in. It tends to be easily pushed into the wire, and the periphery of the electronic component tends to be broken. However, even if a part of the bellows-shaped portion of the wiring 52 is broken in the pushed area, the electricity between the wiring 52 and the electrode of the electronic component 51 is electric. The wiring board can exert a predetermined function while maintaining a proper connection.
なお、追加配線Ｑは、図１の例では、基材２０の第１面２１の法線方向に沿って見た場合に配線５２の蛇腹形状部上のみに位置しているが、この追加配線Ｑは、基材２０の第１面２１の法線方向に沿って見た場合に配線５２の蛇腹形状部の周囲まで延在しているようにしてもよい。 In the example of FIG. 1, the additional wiring Q is located only on the bellows-shaped portion of the wiring 52 when viewed along the normal direction of the first surface 21 of the base material 20, but this additional wiring The Q may extend to the periphery of the bellows-shaped portion of the wiring 52 when viewed along the normal direction of the first surface 21 of the base material 20.
また、追加配線Ｑは、図１の例では、基材２０の第１面２１の法線方向に沿って見た場合に配線５２の蛇腹形状部上に沿って位置しているが、例えば、図３６に示すように、追加配線ＱＺは、基材２０の第１面２１の法線方向に沿って見た場合に配線５２の蛇腹形状部の少なくとも一部を迂回するように延在しているようにしてもよい。追加配線ＱＺはその少なくとも一部が配線５２上に電気的に接続されていればよく、例えば、図３６に示すように、迂回する追加配線Qすべてが配線５２上になくてもいい。また、配線５２の上に別の層、絶縁膜などが被覆されている場合、追加配線ＱＺはその少なくとも一部が配線５２上にあり、追加配線QＺの残りの一部が絶縁膜などの他の層の上にあってもよい。 Further, in the example of FIG. 1, the additional wiring Q is located along the bellows-shaped portion of the wiring 52 when viewed along the normal direction of the first surface 21 of the base material 20, but for example, As shown in FIG. 36, the additional wiring QZ extends so as to bypass at least a part of the bellows-shaped portion of the wiring 52 when viewed along the normal direction of the first surface 21 of the base material 20. You may want to be there. At least a part of the additional wiring QZ may be electrically connected on the wiring 52. For example, as shown in FIG. 36, all the additional wiring Q to be bypassed need not be on the wiring 52. When another layer, an insulating film, or the like is coated on the wiring 52, at least a part of the additional wiring QZ is on the wiring 52, and the remaining part of the additional wiring QZ is another such as the insulating film. May be on top of a layer of.
なお、追加配線Ｑの少なくとも一部は、例えば、図４、図５に示すように、基材２０の第１面２１の法線方向に沿って見た場合に、第１蛇腹形状部５７１と重なる部分に、配置されているが、追加配線Ｑの少なくも一部は、例えば、図４、図５に示すように、基材２０の第１面２１の法線方向に沿って見た場合に、第２蛇腹形状部５７２と重なる部分に、配置されているようにしてもよく、また、必要に応じて、追加配線Ｑは、基材２０の第１面２１の法線方向に沿って見た場合に、第２蛇腹形状部５７２と重なる部分に、配置されていないようにしてもよい。 In addition, at least a part of the additional wiring Q is, for example, as shown in FIGS. 4 and 5, when viewed along the normal direction of the first surface 21 of the base material 20, with the first bellows-shaped portion 571. Although it is arranged in the overlapping portion, at least a part of the additional wiring Q is viewed along the normal direction of the first surface 21 of the base material 20, as shown in FIGS. 4 and 5, for example. The additional wiring Q may be arranged at a portion overlapping the second bellows-shaped portion 572, and if necessary, the additional wiring Q may be provided along the normal direction of the first surface 21 of the base material 20. When viewed, it may not be arranged at a portion overlapping the second bellows-shaped portion 572.
また、追加配線Ｑは、例えば、図１２、図１３、図１４、図１５に示すように、基材２０の第１面２１側において、配線基板５２の蛇腹形状部の全体を被覆するように、位置しているようにしてもよい。 Further, as shown in FIGS. 12, 13, 14, and 15, for example, the additional wiring Q covers the entire bellows-shaped portion of the wiring board 52 on the first surface 21 side of the base material 20. , May be located.
また、追加配線Ｑの少なくとも一部は、例えば、図１６、図１７、図１８、図１９に示すように、基材２０の第１面２１の法線方向に沿って見た場合に電子部品５１の周囲と重なる部分において、接着層６０及び支持基板４０を介して基材２０の第１面２１上（すなわち、支持基板４０の第１面４１上）に位置して第２蛇腹形状部５７２と電子部品５１の電極との間を電気的に接続しているようにしてもよい。 Further, at least a part of the additional wiring Q is an electronic component when viewed along the normal direction of the first surface 21 of the base material 20, for example, as shown in FIGS. 16, 17, 18, and 19. A second bellows-shaped portion 572 located on the first surface 21 of the base material 20 (that is, on the first surface 41 of the support substrate 40) via the adhesive layer 60 and the support substrate 40 at a portion overlapping the periphery of the 51. And the electrode of the electronic component 51 may be electrically connected.
（配線基板の製造方法）
以下、図２０（ａ）〜（ｄ）を参照して、配線基板１０の製造方法について説明する。なお、 後で、レーザー加工するようにしてもよい。
(Manufacturing method of wiring board)
Hereinafter, a method of manufacturing the wiring board 10 will be described with reference to FIGS. 20 (a) to 20 (d). It should be noted that laser processing may be performed later.
まず、基材２０を準備する基材準備工程を実施する。本実施の形態においては、基材準備工程において、図２０（ａ）に示すように、補強部材３１が内部に埋め込まれた基材２０を準備する。 First, a base material preparation step for preparing the base material 20 is carried out. In the present embodiment, in the base material preparation step, as shown in FIG. 20A, the base material 20 in which the reinforcing member 31 is embedded is prepared.
なお、既述の図６ないし図８に示すように、基材２０の第２面２２に補強部材３１を設けるようにしてもよい。この場合、例えば、まず、基材２０の第２面２２の全域にわたって金属層を形成し、続いて、エッチングなどによって金属層を部分的に除去する。これによって、金属層を含む補強部材３１を形成することができる。 As shown in FIGS. 6 to 8 described above, the reinforcing member 31 may be provided on the second surface 22 of the base material 20. In this case, for example, first, a metal layer is formed over the entire second surface 22 of the base material 20, and then the metal layer is partially removed by etching or the like. As a result, the reinforcing member 31 including the metal layer can be formed.
また、支持基板４０を準備する支持基板準備工程を実施する。本実施の形態においては、支持基板準備工程において、図２０（ｂ）に示すように、支持基板４０の第１面４１に電子部品５１及び配線５２を設ける。配線５２を設ける方法としては、例えば、ベース材及び導電性粒子を含む導電性ペーストを支持基板４０の第１面４１に印刷する方法を採用することができる。 In addition, a support substrate preparation step for preparing the support substrate 40 is carried out. In the present embodiment, in the support substrate preparation step, as shown in FIG. 20B, the electronic component 51 and the wiring 52 are provided on the first surface 41 of the support substrate 40. As a method of providing the wiring 52, for example, a method of printing a conductive paste containing a base material and conductive particles on the first surface 41 of the support substrate 40 can be adopted.
続いて、基材２０に引張応力Ｔを加えて基材２０を伸長させる第１工程を実施する。基材２０の伸張率は、例えば１０％以上且つ２００％以下である。第１工程は、基材２０を加熱した状態で実施してもよく、常温で実施してもよい。基材２０を加熱する場合、基材２０の温度は例えば５０℃以上且つ１００℃以下である。 Subsequently, the first step of applying tensile stress T to the base material 20 to extend the base material 20 is carried out. The elongation rate of the base material 20 is, for example, 10% or more and 200% or less. The first step may be carried out in a state where the base material 20 is heated, or may be carried out at room temperature. When the base material 20 is heated, the temperature of the base material 20 is, for example, 50 ° C. or higher and 100 ° C. or lower.
続いて、引張応力Ｔによって伸長した状態の基材２０の第１面２１側に、電子部品５１及び配線５２を設ける第２工程を実施する。本実施の形態の第２工程においては、図２０（ｃ）に示すように、基材２０の第１面２１に、電子部品５１及び配線５２が設けられた支持基板４０を、支持基板４０の第２面４２側から接合させる。この際、基材２０と支持基板４０との間に接着層６０を設けてもよい。 Subsequently, a second step of providing the electronic component 51 and the wiring 52 on the first surface 21 side of the base material 20 stretched by the tensile stress T is carried out. In the second step of the present embodiment, as shown in FIG. 20 (c), the support substrate 40 provided with the electronic component 51 and the wiring 52 on the first surface 21 of the base material 20 is attached to the support substrate 40. Join from the second surface 42 side. At this time, the adhesive layer 60 may be provided between the base material 20 and the support substrate 40.
その後、基材２０から引張応力Ｔを取り除く第３工程を実施する。これにより、図２０（ｄ）において矢印Ｃで示すように、基材２０が収縮し、基材２０に接合されている支持基板４０及び配線５２にも変形が生じる。支持基板４０の第３の弾性係数は、基材２０の第１の弾性係数よりも大きい。このため、支持基板４０及び配線５２の変形を、蛇腹形状部の生成として生じさせることができる。 Then, a third step of removing the tensile stress T from the base material 20 is carried out. As a result, as shown by the arrow C in FIG. 20D, the base material 20 contracts, and the support substrate 40 and the wiring 52 joined to the base material 20 are also deformed. The third elastic modulus of the support substrate 40 is larger than the first elastic modulus of the base material 20. Therefore, the support substrate 40 and the wiring 52 can be deformed as the bellows-shaped portion is generated.
その後、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線Ｑを、基材２０の第１面２１側に設ける、追加配線形成工程を実施する。この追加配線Ｑを設ける方法としては、既述のように、例えば、ベース材及び導電性粒子を含む導電性ペーストを配線５２の蛇腹形状部上にインクジェット法などで印刷する方法等を採用することができる。 After that, an additional wiring forming step is carried out in which the additional wiring Q containing the conductive particles and containing the elastic paste is provided on the first surface 21 side of the base material 20. As a method of providing the additional wiring Q, for example, as described above, a method of printing a conductive paste containing a base material and conductive particles on the bellows-shaped portion of the wiring 52 by an inkjet method or the like is adopted. Can be done.
ここで、既述のように、追加配線Ｑの少なくとも一部は、基材２０の第１面２１の法線方向に沿って見た場合に電子部品５１の周囲と重なる部分において、配線５２の蛇腹形状部上に位置して配線５２と電子部品５１の電極との間を電気的に接続している。 Here, as described above, at least a part of the additional wiring Q is the portion of the wiring 52 that overlaps with the periphery of the electronic component 51 when viewed along the normal direction of the first surface 21 of the base material 20. It is located on the bellows-shaped portion and electrically connects the wiring 52 and the electrodes of the electronic component 51.
なお、既述のように、追加配線Ｑの少なくとも一部は、基材２０の第１面２１の法線方向に沿って見た場合に配線５２の蛇腹形状部と重なる部分であって、配線基板１０が被実装体に実装された場合に局所的に押し込まれる領域において、配線５２の蛇腹形状部上に位置して、配線５２と電子部品５１の電極との間を電気的に接続しているようにしてもよい。 As described above, at least a part of the additional wiring Q is a portion that overlaps with the bellows-shaped portion of the wiring 52 when viewed along the normal direction of the first surface 21 of the base material 20, and is a wiring. In the region where the substrate 10 is locally pushed when the substrate 10 is mounted on the mounted body, it is located on the bellows-shaped portion of the wiring 52 and electrically connects between the wiring 52 and the electrodes of the electronic component 51. You may want to be there.
なお、この追加配線形成工程は、伸長した状態の基材２０の第１面２１側に配線５２を設けた後（図２０（ｂ）〜（ｄ））に、実施されればよく、当該追加配線形成工程は、伸長した状態の基材２０の第１面２１側に配線５２を設けた後であって基材２０から引張応力を取り除く前（すなわち、蛇腹形状部が形成される前）、又は、基材２０から引張応力を取り除いた後（すなわち、蛇腹形状部が形成された後）に、実施されるものであればよい。 It should be noted that this additional wiring forming step may be performed after the wiring 52 is provided on the first surface 21 side of the stretched base material 20 (FIGS. 20B to 20d), and the additional wiring may be performed. The wiring forming step is performed after the wiring 52 is provided on the first surface 21 side of the stretched base material 20 and before the tensile stress is removed from the base material 20 (that is, before the bellows-shaped portion is formed). Alternatively, it may be performed after the tensile stress is removed from the base material 20 (that is, after the bellows-shaped portion is formed).
また、配線上に絶縁膜を設ける場合、この追加配線形成工程は絶縁膜を設けた後、配線上の絶縁膜の一部を削除したあと追加配線を形成してもよい。これにより、配線基板作製工程すべてを終えた後、断線が生じた場合、断線を囲むように少なくとも2か所の配線上の膜を削除し、その断線部分を迂回するように追加配線を形成してもよい。この場合、追加配線は少なくとも一部が配線表面に接続しており、当該一部が絶縁膜などの上の層にあってもよい。これにより、配線基板作製工程すべてを終えた後でも修正が可能となる。 Further, when an insulating film is provided on the wiring, in this additional wiring forming step, after the insulating film is provided, a part of the insulating film on the wiring may be deleted and then the additional wiring may be formed. As a result, if a disconnection occurs after completing all the wiring board manufacturing processes, at least two films on the wiring are removed so as to surround the disconnection, and additional wiring is formed so as to bypass the disconnection portion. You may. In this case, at least a part of the additional wiring is connected to the wiring surface, and the part may be in an upper layer such as an insulating film. This makes it possible to make corrections even after the entire wiring board manufacturing process has been completed.
また、本実施の形態においては、基材２０に、電子部品５１と重なるよう補強部材３１が配置されている。このため、第１工程において基材２０のうち電子部品５１と重なる部分が伸張することを抑制することができる。従って、第３工程において基材２０のうち電子部品５１と重なる部分が収縮することを抑制することができる。このことにより、基材２０の変形に起因する応力が電子部品５１に加わることを抑制することができ、電子部品５１が変形したり破損したりしてしまうことを抑制することができる。また、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。このように、本実施の形態によれば、基材２０に生じる変形を位置に応じて制御することにより、電子部品５１の実装のし易さや電子部品５１及び配線５２の信頼性を高めることができる。 Further, in the present embodiment, the reinforcing member 31 is arranged on the base material 20 so as to overlap with the electronic component 51. Therefore, it is possible to prevent the portion of the base material 20 that overlaps with the electronic component 51 from stretching in the first step. Therefore, it is possible to prevent the portion of the base material 20 that overlaps with the electronic component 51 from shrinking in the third step. As a result, it is possible to suppress the stress caused by the deformation of the base material 20 from being applied to the electronic component 51, and it is possible to prevent the electronic component 51 from being deformed or damaged. In addition, it is possible to prevent the electrical joint between the electronic component 51 and the wiring 52 from being damaged. As described above, according to the present embodiment, by controlling the deformation of the base material 20 according to the position, it is possible to improve the ease of mounting the electronic component 51 and the reliability of the electronic component 51 and the wiring 52. it can.
なお、基材２０が伸張する際、補強部材３１に反りなどの変形が生じる可能性はある。仮に補強部材３１に変形が生じたとしても、補強部材３１の変形量は、基材２０のうち補強部材３１と重ならない部分で生じる変形量に比べて小さい。従って、電子部品５１が変形したり破損したりしてしまうことを抑制することができる。また、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。 When the base material 20 is stretched, the reinforcing member 31 may be deformed such as warped. Even if the reinforcing member 31 is deformed, the amount of deformation of the reinforcing member 31 is smaller than the amount of deformation of the base material 20 that does not overlap with the reinforcing member 31. Therefore, it is possible to prevent the electronic component 51 from being deformed or damaged. In addition, it is possible to prevent the electrical joint between the electronic component 51 and the wiring 52 from being damaged.
配線５２の蛇腹形状部によって得られる、配線５２の抵抗値に関する効果の一例について説明する。ここでは、基材２０の第１面２１の面内方向に沿う引張応力が基材２０に加えられていない第１状態における配線５２の抵抗値を、第１抵抗値と称する。また、基材２０に引張応力を加えて基材２０を第１面２１の面内方向において第１状態に比べて３０％伸長させた第２状態における配線５２の抵抗値を、第２抵抗値と称する。本実施の形態によれば、配線５２に蛇腹形状部を形成することにより、第１抵抗値に対する、第１抵抗値と第２抵抗値の差の絶対値の比率を、２０％以下にすることができ、より好ましくは１０％以下にすることができ、更に好ましくは５％以下にすることができる。 An example of the effect on the resistance value of the wiring 52 obtained by the bellows-shaped portion of the wiring 52 will be described. Here, the resistance value of the wiring 52 in the first state in which the tensile stress along the in-plane direction of the first surface 21 of the base material 20 is not applied to the base material 20 is referred to as a first resistance value. Further, the resistance value of the wiring 52 in the second state in which tensile stress is applied to the base material 20 to extend the base material 20 by 30% in the in-plane direction of the first surface 21 as compared with the first state is set to the second resistance value. It is called. According to the present embodiment, the ratio of the absolute value of the difference between the first resistance value and the second resistance value to the first resistance value is set to 20% or less by forming the bellows-shaped portion in the wiring 52. It can be more preferably 10% or less, and even more preferably 5% or less.
配線基板１０の用途としては、ヘルスケア分野、医療分野、介護分野、エレクトロニクス分野、スポーツ・フィットネス分野、美容分野、モビリティ分野、畜産・ペット分野、アミューズメント分野、ファッション・アパレル分野、セキュリティ分野、ミリタリー分野、流通分野、教育分野、建材・家具・装飾分野、環境エネルギー分野、農林水産分野、ロボット分野などを挙げることができる。例えば、人の腕などの身体の一部に取り付ける製品を、本実施の形態による配線基板１０を用いて構成する。配線基板１０は伸張することができるので、例えば配線基板１０を伸長させた状態で身体に取り付けることにより、配線基板１０を身体の一部により密着させることができる。このため、良好な着用感を実現することができる。また、配線基板１０が伸張した場合に配線５２の抵抗値が低下することを抑制することができるので、配線基板１０の良好な電気特性を実現することができる。他にも配線基板１０は伸長することができるので、人などの生体に限らず曲面や立体形状に沿わせて設置や組込むことが可能である。それらの製品の一例としては、バイタルセンサ、マスク、補聴器、歯ブラシ、絆創膏、湿布、コンタクトレンズ、義手、義足、義眼、カテーテル、ガーゼ、薬液パック、包帯、ディスポーザブル生体電極、おむつ、リハビリ用機器、家電製品、ディスプレイ、サイネージ、パーソナルコンピューター、携帯電話、マウス、スピーカー、スポーツウェア、リストバンド、はちまき、手袋、水着、サポーター、ボール、グローブ、ラケット、クラブ、バット、釣竿、リレーのバトンや器械体操用具、またそのグリップ、身体トレーニング用機器、浮き輪、テント、水着、ゼッケン、ゴールネット、ゴールテープ、薬液浸透美容マスク、電気刺激ダイエット用品、懐炉、付け爪、タトゥー、自動車、飛行機、列車、船舶、自転車、ベビーカー、ドローン、車椅子、などの、シート、インパネ、タイヤ、内装、外装サドル、ハンドル、道路、レール、橋、トンネル、ガスや水道の管、電線、テトラポッド、ロープ、首輪、リード、ハーネス、動物用のタグ、ブレスレット、ベルトなど、ゲーム機器、コントローラなどのハプティクスデバイス、ランチョンマット、チケット、人形、ぬいぐるみ、応援グッズ、帽子、服、メガネ、靴、インソール、靴下、ストッキング、スリッパ、インナーウェア、マフラー、耳あて、鞄、アクセサリー、指輪、時計、ネクタイ、個人ID認識デバイス、ヘルメット、パッケージ、ICタグ、ペットボトル、文具、書籍、ペン、カーペット、ソファ、寝具、照明、ドアノブ、手すり、花瓶、ベッド、マットレス、座布団、カーテン、ドア、窓、天井、壁、床、ワイヤレス給電アンテナ、電池、ビニールハウス、ネット（網）、ロボットハンド、ロボット外装を挙げることができる。 Applications of the wiring board 10 include healthcare field, medical field, nursing care field, electronics field, sports / fitness field, beauty field, mobility field, livestock / pet field, amusement field, fashion / apparel field, security field, and military field. , Distribution field, education field, building materials / furniture / decoration field, environmental energy field, agriculture, forestry and fisheries field, robot field, etc. For example, a product to be attached to a part of the body such as a human arm is configured by using the wiring board 10 according to the present embodiment. Since the wiring board 10 can be stretched, for example, by attaching the wiring board 10 to the body in an stretched state, the wiring board 10 can be brought into close contact with a part of the body. Therefore, a good wearing feeling can be realized. Further, since it is possible to suppress a decrease in the resistance value of the wiring 52 when the wiring board 10 is stretched, it is possible to realize good electrical characteristics of the wiring board 10. In addition, since the wiring board 10 can be extended, it can be installed or incorporated not only in a living body such as a human being but also along a curved surface or a three-dimensional shape. Examples of these products include vital sensors, masks, hearing aids, toothbrushes, adhesive plasters, wetclothes, contact lenses, artificial hands, artificial legs, artificial eyes, catheters, gauze, chemical packs, bandages, disposable bioelectrodes, diapers, rehabilitation equipment, home appliances. Products, displays, signage, personal computers, mobile phones, mice, speakers, sportswear, wristbands, earmuffs, gloves, swimwear, supporters, balls, gloves, rackets, clubs, bats, fishing rods, relay batons and jewelry. In addition, its grips, physical training equipment, floats, tents, swimwear, bibs, goal nets, goal tapes, chemical penetration beauty masks, electrical stimulation diet supplies, pocket furnaces, claws, tattoos, automobiles, airplanes, trains, ships, bicycles , Strollers, drones, wheelchairs, etc., seats, instrument panels, tires, interior, exterior saddles, handles, roads, rails, bridges, tunnels, gas and water pipes, electric wires, tetrapods, ropes, collars, leads, harnesses, Animal tags, bracelets, belts, game equipment, haptics devices such as controllers, luncheon mats, tickets, dolls, stuffed animals, cheering goods, hats, clothes, glasses, shoes, insoles, socks, stockings, slippers, innerwear , Muffler, earmuffs, bag, accessories, ring, watch, tie, personal ID recognition device, helmet, package, IC tag, pet bottle, stationery, books, pens, carpet, sofa, bedding, lighting, door knob, handrail, vase , Beds, mattresses, cushions, curtains, doors, windows, ceilings, walls, floors, wireless power antennas, batteries, vinyl houses, nets, robot hands, robot exteriors.
なお、上述した実施の形態に対して様々な変更を加えることが可能である。以下、必要に応じて図面を参照しながら、変形例について説明する。以下の説明および以下の説明で用いる図面では、上述した実施の形態と同様に構成され得る部分について、上述の実施の形態における対応する部分に対して用いた符号と同一の符号を用いることとし、重複する説明を省略する。また、上述した実施の形態において得られる作用効果が変形例においても得られることが明らかである場合、その説明を省略することもある。 It is possible to make various changes to the above-described embodiment. Hereinafter, a modified example will be described with reference to the drawings as necessary. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding portions in the above-described embodiment will be used for the portions that can be configured in the same manner as in the above-described embodiment. Duplicate description is omitted. Further, when it is clear that the action and effect obtained in the above-described embodiment can be obtained in the modified example, the description thereof may be omitted.
（第１の変形例）
上述の実施の形態においては、補強部材３１が基材２０の中に位置する例を示したが、これに限られることはなく、補強部材３１が基材２０の第１面２１側に設けられていてもよい。例えば、図２１に示すように、補強部材３１は、基材２０の第１面２１と電子部品５１との間に位置していてもよい。図２１に示す例において、補強部材３１は、支持基板４０の第２面４２に位置している。
(First modification)
In the above-described embodiment, the example in which the reinforcing member 31 is located in the base material 20 is shown, but the present invention is not limited to this, and the reinforcing member 31 is provided on the first surface 21 side of the base material 20. You may be. For example, as shown in FIG. 21, the reinforcing member 31 may be located between the first surface 21 of the base material 20 and the electronic component 51. In the example shown in FIG. 21, the reinforcing member 31 is located on the second surface 42 of the support substrate 40.
本変形例においても、上述の実施の形態の場合と同様に、配線５２のうち補強部材３０と重なっていない部分には蛇腹形状部が形成されている。このため、基材２０の変形に伴って配線５２の全長が増加することや、配線５２の断面積が減少することを抑制することができる。 Also in this modified example, a bellows-shaped portion is formed in the portion of the wiring 52 that does not overlap with the reinforcing member 30, as in the case of the above-described embodiment. Therefore, it is possible to prevent the total length of the wiring 52 from increasing and the cross-sectional area of the wiring 52 from decreasing due to the deformation of the base material 20.
図２２（ａ）〜（ｄ）は、図２１に示す配線基板１０の製造方法を説明するための図である。 22 (a) to 22 (d) are diagrams for explaining the manufacturing method of the wiring board 10 shown in FIG. 21.
まず、図２２（ａ）に示すように、基材２０を準備する基材準備工程を実施する。 First, as shown in FIG. 22A, a base material preparation step for preparing the base material 20 is carried out.
続いて、図２２（ｂ）に示すように、支持基板４０を準備する支持基板準備工程を実施する。本変形例においては、支持基板準備工程において、図２２（ｂ）に示すように、支持基板４０の第１面４１に電子部品５１及び配線５２を設ける。また、支持基板４０の第２面４２に補強部材３１を設ける。支持基板４０に補強部材３１、電子部品５１、配線５２を設ける順序は任意である。 Subsequently, as shown in FIG. 22B, a support substrate preparation step for preparing the support substrate 40 is performed. In this modification, in the support substrate preparation step, as shown in FIG. 22B, the electronic component 51 and the wiring 52 are provided on the first surface 41 of the support substrate 40. Further, the reinforcing member 31 is provided on the second surface 42 of the support substrate 40. The order in which the reinforcing member 31, the electronic component 51, and the wiring 52 are provided on the support substrate 40 is arbitrary.
続いて、基材２０に引張応力Ｔを加えて基材２０を伸長させる第１工程を実施する。続いて、引張応力Ｔによって伸長した状態の基材２０の第１面２１側に、電子部品５１及び配線５２を設ける第２工程を実施する。本変形例においては、第２工程において、図２２（ｃ）に示すように、基材２０の第１面２１に、補強部材３１、電子部品５１及び配線５２が設けられた支持基板４０を、支持基板４０の第２面４２側から接合させる。 Subsequently, the first step of applying tensile stress T to the base material 20 to extend the base material 20 is carried out. Subsequently, a second step of providing the electronic component 51 and the wiring 52 on the first surface 21 side of the base material 20 stretched by the tensile stress T is carried out. In this modification, in the second step, as shown in FIG. 22 (c), the support substrate 40 provided with the reinforcing member 31, the electronic component 51, and the wiring 52 on the first surface 21 of the base material 20 is provided. The support substrate 40 is joined from the second surface 42 side.
その後、基材２０から引張応力Ｔを取り除く第３工程を実施する。これにより、図２２（ｄ）において矢印Ｃで示すように、基材２０が収縮し、基材２０に接合されている支持基板４０及び配線５２にも変形が生じる。支持基板４０の第３の弾性係数は、基材２０の第１の弾性係数よりも大きい。このため、支持基板４０及び配線５２の変形を、蛇腹形状部の生成として生じさせることができる。 Then, a third step of removing the tensile stress T from the base material 20 is carried out. As a result, as shown by the arrow C in FIG. 22D, the base material 20 contracts, and the support substrate 40 and the wiring 52 bonded to the base material 20 are also deformed. The third elastic modulus of the support substrate 40 is larger than the first elastic modulus of the base material 20. Therefore, the support substrate 40 and the wiring 52 can be deformed as the bellows-shaped portion is generated.
その後、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線Ｑを、基材２０の第１面２１側に設ける、追加配線形成工程を実施する。 After that, an additional wiring forming step is carried out in which the additional wiring Q containing the conductive particles and containing the elastic paste is provided on the first surface 21 side of the base material 20.
なお、この追加配線形成工程は、伸長した状態の基材２０の第１面２１側に配線５２を設けた後（図２２（ｂ）〜（ｄ））に、実施されればよく、当該追加配線形成工程は、伸長した状態の基材２０の第１面２１側に配線５２を設けた後であって基材２０から引張応力を取り除く前（すなわち、蛇腹形状部が形成される前）、又は、基材２０から引張応力を取り除いた後（すなわち、蛇腹形状部が形成された後）に、実施されるものであればよい。また、配線上に絶縁膜を設ける場合、この追加配線形成工程は絶縁膜を設けた後、配線上の絶縁膜の一部を削除したあと追加配線を形成してもよい。 It should be noted that this additional wiring forming step may be performed after the wiring 52 is provided on the first surface 21 side of the stretched base material 20 (FIGS. 22 (b) to 22 (d)), and the additional wiring may be performed. The wiring forming step is performed after the wiring 52 is provided on the first surface 21 side of the stretched base material 20 and before the tensile stress is removed from the base material 20 (that is, before the bellows-shaped portion is formed). Alternatively, it may be performed after the tensile stress is removed from the base material 20 (that is, after the bellows-shaped portion is formed). Further, when an insulating film is provided on the wiring, in this additional wiring forming step, after the insulating film is provided, a part of the insulating film on the wiring may be deleted and then the additional wiring may be formed.
また、本変形例においては、支持基板４０の第２面４２に、電子部品５１と重なるよう補強部材３１が配置されている。このため、第３工程において基材２０が収縮することの影響を電子部品５１が受けることを抑制することができる。これにより、電子部品５１が変形したり破損したりしてしまうことを抑制することができる。 Further, in this modification, the reinforcing member 31 is arranged on the second surface 42 of the support substrate 40 so as to overlap with the electronic component 51. Therefore, it is possible to suppress the influence of the shrinkage of the base material 20 in the third step on the electronic component 51. As a result, it is possible to prevent the electronic component 51 from being deformed or damaged.
（第２の変形例）
上述の実施の形態及び第１の変形例においては、補強部材３１が基材２０又は支持基板４０のいずれか一方に位置する例を示したが、これに限られることはない。図２３に示すように、補強部材３１は、基材２０の中、及び基材２０の第１面２１と電子部品５１との間のいずれにも位置していてもよい。図２３に示す例において、配線基板１０は、基材２０の中に位置する補強部材３１と、支持基板４０の第２面４２に位置する補強部材３１とを含む。
(Second modification)
In the above-described embodiment and the first modification, the reinforcing member 31 is located on either the base material 20 or the support substrate 40, but the present invention is not limited to this. As shown in FIG. 23, the reinforcing member 31 may be located in the base material 20 and between the first surface 21 of the base material 20 and the electronic component 51. In the example shown in FIG. 23, the wiring board 10 includes a reinforcing member 31 located in the base material 20 and a reinforcing member 31 located on the second surface 42 of the support board 40.
本変形例においても、上述の実施の形態の場合と同様に、配線５２のうち補強部材３０と重なっていない部分には蛇腹形状部が形成されている。このため、基材２０の変形に伴って配線５２の全長が増加することや、配線５２の断面積が減少することを抑制することができる。 Also in this modified example, a bellows-shaped portion is formed in the portion of the wiring 52 that does not overlap with the reinforcing member 30, as in the case of the above-described embodiment. Therefore, it is possible to prevent the total length of the wiring 52 from increasing and the cross-sectional area of the wiring 52 from decreasing due to the deformation of the base material 20.
図２４（ａ）〜（ｄ）は、図２３に示す配線基板１０の製造方法を説明するための図である。 24 (a) to 24 (d) are diagrams for explaining the manufacturing method of the wiring board 10 shown in FIG. 23.
まず、図２４（ａ）に示すように、基材２０を準備する基材準備工程を実施する。本変形例においては、基材準備工程において、図２４（ａ）に示すように、基材２０の中に補強部材３１を設ける。続いて、図２４（ｂ）に示すように、支持基板４０を準備する支持基板準備工程を実施する。本変形例においては、支持基板準備工程において、図２４（ｂ）に示すように、支持基板４０の第１面４１に電子部品５１及び配線５２を設ける。また、支持基板４０の第２面４２に補強部材３１を設ける。支持基板４０に補強部材３１、電子部品５１、配線５２を設ける順序は任意である。 First, as shown in FIG. 24A, a base material preparation step for preparing the base material 20 is carried out. In this modification, in the base material preparation step, as shown in FIG. 24A, the reinforcing member 31 is provided in the base material 20. Subsequently, as shown in FIG. 24B, a support substrate preparation step for preparing the support substrate 40 is performed. In this modification, in the support substrate preparation step, as shown in FIG. 24B, the electronic component 51 and the wiring 52 are provided on the first surface 41 of the support substrate 40. Further, the reinforcing member 31 is provided on the second surface 42 of the support substrate 40. The order in which the reinforcing member 31, the electronic component 51, and the wiring 52 are provided on the support substrate 40 is arbitrary.
続いて、基材２０に引張応力Ｔを加えて基材２０を伸長させる第１工程を実施する。続いて、引張応力Ｔによって伸長した状態の基材２０の第１面２１側に、電子部品５１及び配線５２を設ける第２工程を実施する。本変形例の第２工程においては、図２４（ｃ）に示すように、補強部材３１が設けられた基材２０の第１面２１に、補強部材３１、電子部品５１及び配線５２が設けられた支持基板４０を、支持基板４０の第２面４２側から接合させる。 Subsequently, the first step of applying tensile stress T to the base material 20 to extend the base material 20 is carried out. Subsequently, a second step of providing the electronic component 51 and the wiring 52 on the first surface 21 side of the base material 20 stretched by the tensile stress T is carried out. In the second step of this modification, as shown in FIG. 24C, the reinforcing member 31, the electronic component 51, and the wiring 52 are provided on the first surface 21 of the base material 20 provided with the reinforcing member 31. The support substrate 40 is joined from the second surface 42 side of the support substrate 40.
その後、基材２０から引張応力Ｔを取り除く第３工程を実施する。これにより、図２４（ｄ）において矢印Ｃで示すように、基材２０が収縮し、基材２０に接合されている支持基板４０及び配線５２にも変形が生じる。支持基板４０の第３の弾性係数は、基材２０の第１の弾性係数よりも大きい。このため、支持基板４０及び配線５２の変形を、蛇腹形状部の生成として生じさせることができる。 Then, a third step of removing the tensile stress T from the base material 20 is carried out. As a result, as shown by the arrow C in FIG. 24D, the base material 20 contracts, and the support substrate 40 and the wiring 52 joined to the base material 20 are also deformed. The third elastic modulus of the support substrate 40 is larger than the first elastic modulus of the base material 20. Therefore, the support substrate 40 and the wiring 52 can be deformed as the bellows-shaped portion is generated.
その後、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線Ｑを、基材２０の第１面２１側に設ける、追加配線形成工程を実施する。 After that, an additional wiring forming step is carried out in which the additional wiring Q containing the conductive particles and containing the elastic paste is provided on the first surface 21 side of the base material 20.
なお、この追加配線形成工程は、伸長した状態の基材２０の第１面２１側に配線５２を設けた後（図２４（ｂ）〜（ｄ））に、実施されればよく、当該追加配線形成工程は、伸長した状態の基材２０の第１面２１側に配線５２を設けた後であって基材２０から引張応力を取り除く前（すなわち、蛇腹形状部が形成される前）、又は、基材２０から引張応力を取り除いた後（すなわち、蛇腹形状部が形成された後）に、実施されるものであればよい。また、配線上に絶縁膜を設ける場合は、この追加配線形成工程は絶縁膜を設けた後、配線上の絶縁膜の一部を削除したあと追加配線を形成してもよい。 It should be noted that this additional wiring forming step may be performed after the wiring 52 is provided on the first surface 21 side of the stretched base material 20 (FIGS. 24 (b) to (d)), and the additional wiring may be performed. The wiring forming step is performed after the wiring 52 is provided on the first surface 21 side of the stretched base material 20 and before the tensile stress is removed from the base material 20 (that is, before the bellows-shaped portion is formed). Alternatively, it may be performed after the tensile stress is removed from the base material 20 (that is, after the bellows-shaped portion is formed). Further, when an insulating film is provided on the wiring, in this additional wiring forming step, after the insulating film is provided, a part of the insulating film on the wiring may be deleted and then the additional wiring may be formed.
また、本変形例においては、基材２０の第２面２２及び支持基板４０の第２面４２の両方に、電子部品５１と重なるよう補強部材３１が配置されている。このため、第１工程において基材２０のうち電子部品５１と重なる部分が伸張することをより抑制することができる。従って、第３工程において基材２０のうち電子部品５１と重なる部分が収縮することを抑制することができる。このことにより、基材２０の変形に起因する応力が電子部品５１に加わることを抑制することができ、電子部品５１が変形したり破損したりしてしまうことを抑制することができる。また、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。 Further, in this modification, the reinforcing member 31 is arranged on both the second surface 22 of the base material 20 and the second surface 42 of the support substrate 40 so as to overlap with the electronic component 51. Therefore, it is possible to further suppress the extension of the portion of the base material 20 that overlaps with the electronic component 51 in the first step. Therefore, it is possible to prevent the portion of the base material 20 that overlaps with the electronic component 51 from shrinking in the third step. As a result, it is possible to suppress the stress caused by the deformation of the base material 20 from being applied to the electronic component 51, and it is possible to prevent the electronic component 51 from being deformed or damaged. In addition, it is possible to prevent the electrical joint between the electronic component 51 and the wiring 52 from being damaged.
（第３の変形例）
上述の実施の形態及び各変形例においては、電子部品５１及び配線５２が、基材２０の第１の弾性係数よりも高い第３の弾性係数を有する支持基板４０によって支持される例を示したが、これに限られることはない。図２５に示すように、電子部品５１及び配線５２は、基材２０の第１面２１に設けられていてもよい。この場合、補強部材３１は、基材２０の中に位置している。
(Third variant)
In the above-described embodiment and each modification, an example is shown in which the electronic component 51 and the wiring 52 are supported by a support substrate 40 having a third elastic modulus higher than the first elastic modulus of the base material 20. However, it is not limited to this. As shown in FIG. 25, the electronic component 51 and the wiring 52 may be provided on the first surface 21 of the base material 20. In this case, the reinforcing member 31 is located in the base material 20.
本変形例においても、上述の実施の形態の場合と同様に、配線５２のうち補強部材３１と重なっていない部分には蛇腹形状部が形成されている。このため、基材２０の変形に伴って配線５２の全長が増加することや、配線５２の断面積が減少することを抑制することができる。 Also in this modified example, a bellows-shaped portion is formed in the portion of the wiring 52 that does not overlap with the reinforcing member 31, as in the case of the above-described embodiment. Therefore, it is possible to prevent the total length of the wiring 52 from increasing and the cross-sectional area of the wiring 52 from decreasing due to the deformation of the base material 20.
図２６（ａ）〜（ｄ）は、図２５に示す配線基板１０の製造方法を説明するための図である。 26 (a) to 26 (d) are diagrams for explaining the manufacturing method of the wiring board 10 shown in FIG. 25.
まず、図２６（ａ）に示すように、基材２０を準備する基材準備工程を実施する。本変形例においては、基材準備工程において、図２６（ａ）に示すように、基材２０の中に補強部材３１を設ける。 First, as shown in FIG. 26A, a base material preparation step for preparing the base material 20 is carried out. In this modification, in the base material preparation step, as shown in FIG. 26A, the reinforcing member 31 is provided in the base material 20.
続いて、図２６（ｂ）に示すように、基材２０に引張応力Ｔを加えて基材２０を伸長させる第１工程を実施する。続いて、図２６（ｃ）に示すように、引張応力Ｔによって伸長した状態の基材２０の第１面２１に、電子部品５１及び配線５２を設ける第２工程を実施する。 Subsequently, as shown in FIG. 26B, the first step of applying a tensile stress T to the base material 20 to extend the base material 20 is carried out. Subsequently, as shown in FIG. 26C, a second step of providing the electronic component 51 and the wiring 52 on the first surface 21 of the base material 20 stretched by the tensile stress T is carried out.
その後、基材２０から引張応力Ｔを取り除く第３工程を実施する。これにより、図２６（ｄ）において矢印Ｃで示すように、基材２０が収縮し、基材２０に設けられている配線５２にも変形が生じる。補強部材３１は、配線５２全体若しくは配線５２の大部分と重ならないように配置されている。このため、配線５２の変形は、蛇腹形状部の生成として生じる。 Then, a third step of removing the tensile stress T from the base material 20 is carried out. As a result, as shown by the arrow C in FIG. 26D, the base material 20 contracts, and the wiring 52 provided on the base material 20 is also deformed. The reinforcing member 31 is arranged so as not to overlap the entire wiring 52 or most of the wiring 52. Therefore, the deformation of the wiring 52 occurs as the formation of the bellows-shaped portion.
その後、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線Ｑを、基材２０の第１面２１側に設ける、追加配線形成工程を実施する。 After that, an additional wiring forming step is carried out in which the additional wiring Q containing the conductive particles and containing the elastic paste is provided on the first surface 21 side of the base material 20.
なお、この追加配線形成工程は、伸長した状態の基材２０の第１面２１側に配線５２を設けた後（図２６（ｂ）〜（ｄ））に、実施されればよく、当該追加配線形成工程は、伸長した状態の基材２０の第１面２１側に配線５２を設けた後であって基材２０から引張応力を取り除く前（すなわち、蛇腹形状部が形成される前）、又は、基材２０から引張応力を取り除いた後（すなわち、蛇腹形状部が形成された後）に、実施されるものであればよい。また、配線上に絶縁膜を設ける場合、この追加配線形成工程は絶縁膜を設けた後、配線上の絶縁膜の一部を削除したあと追加配線を形成してもよい。 It should be noted that this additional wiring forming step may be performed after the wiring 52 is provided on the first surface 21 side of the stretched base material 20 (FIGS. 26 (b) to (d)), and the additional wiring may be performed. The wiring forming step is performed after the wiring 52 is provided on the first surface 21 side of the stretched base material 20 and before the tensile stress is removed from the base material 20 (that is, before the bellows-shaped portion is formed). Alternatively, it may be performed after the tensile stress is removed from the base material 20 (that is, after the bellows-shaped portion is formed). Further, when an insulating film is provided on the wiring, in this additional wiring forming step, after the insulating film is provided, a part of the insulating film on the wiring may be deleted and then the additional wiring may be formed.
また、本変形例においては、基材２０の中に補強部材３１が配置されている。このため、第１工程において基材２０のうち電子部品５１と重なる予定の部分が伸張することを抑制することができる。従って、第３工程において基材２０のうち電子部品５１と重なる部分が収縮することを抑制することができる。このことにより、基材２０の変形に起因する応力が電子部品５１に加わることを抑制することができ、電子部品５１が変形したり破損したりしてしまうことを抑制することができる。 Further, in this modification, the reinforcing member 31 is arranged in the base material 20. Therefore, it is possible to prevent the portion of the base material 20 that is to overlap with the electronic component 51 from stretching in the first step. Therefore, it is possible to prevent the portion of the base material 20 that overlaps with the electronic component 51 from shrinking in the third step. As a result, it is possible to suppress the stress caused by the deformation of the base material 20 from being applied to the electronic component 51, and it is possible to prevent the electronic component 51 from being deformed or damaged.
（第４の変形例）
上述の実施の形態及び各変形例においては、電子部品５１が、配線基板１０に実装される前の段階で予めパッケージ化されたものである例を示した。しかしながら、これに限られることはなく、電子部品５１は、電子部品５１の構成要素の一部が配線基板１０に実装された後、一部の構成要素を封止することによって構成されるものであってもよい。例えば図２７に示すように、電子部品５１は、チップ５１３と、チップ５１３と配線５２とを接続するワイヤ５１４と、チップ５１３及びワイヤ５１４とを覆う樹脂５１５と、を有していてもよい。ワイヤ５１４が、配線５２に接続される電極として機能する。このような電子部品５１を設ける工程においては、まず、チップ５１３を配線基板１０の例えば支持基板４０上に載置する。この際、接着剤などを用いてチップ５１３を配線基板１０に固定してもよい。続いて、ワイヤ５１４をチップ５１３及び配線５２に接続する。ワイヤ５１４は、金、アルミニウム、銅などを含む。続いて、チップ５１３及びワイヤ５１４上に液状の樹脂を滴下して、チップ５１３及びワイヤ５１４を覆う樹脂５１５を形成する。この工程は、ポッティングとも称されるものである。樹脂５１５としては、ウレタン樹脂、エポキシ樹脂などを用いることができる。図２７に示すように電子部品５１が樹脂５１５を含む場合、樹脂５１５の端部が電子部品５１の外縁５１２となる。
(Fourth modification)
In the above-described embodiment and each modification, an example is shown in which the electronic component 51 is pre-packaged before being mounted on the wiring board 10. However, the present invention is not limited to this, and the electronic component 51 is configured by sealing some of the components after the components of the electronic component 51 are mounted on the wiring board 10. There may be. For example, as shown in FIG. 27, the electronic component 51 may have a chip 513, a wire 514 connecting the chip 513 and the wiring 52, and a resin 515 covering the chip 513 and the wire 514. The wire 514 functions as an electrode connected to the wiring 52. In the step of providing such an electronic component 51, first, the chip 513 is placed on the wiring board 10, for example, the support board 40. At this time, the chip 513 may be fixed to the wiring board 10 using an adhesive or the like. Subsequently, the wire 514 is connected to the chip 513 and the wiring 52. The wire 514 includes gold, aluminum, copper and the like. Subsequently, a liquid resin is dropped onto the tip 513 and the wire 514 to form the resin 515 covering the tip 513 and the wire 514. This process is also called potting. As the resin 515, urethane resin, epoxy resin and the like can be used. As shown in FIG. 27, when the electronic component 51 contains the resin 515, the end portion of the resin 515 becomes the outer edge 512 of the electronic component 51.
基材２０のうち樹脂５１５と重なる部分は、基材２０のうち樹脂５１５と重ならない部分に比べて変形しにくい。この場合、基材２０に伸縮が生じると、配線基板１０のうち樹脂５１５と重なる部分と、配線基板１０のうち樹脂５１５と重ならない部分との間の境界部に応力が集中する。この点を考慮し、図２７に示すように、補強部材３１は、電子部品５１の外縁５１２よりも外側にまで広がるよう設けられる。これにより、基材２０の変形に起因する応力が電子部品５１に加わることを抑制することができ、電子部品５１が変形したり破損したりしてしまうことを抑制することができる。また、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。 The portion of the base material 20 that overlaps with the resin 515 is less likely to be deformed than the portion of the base material 20 that does not overlap with the resin 515. In this case, when the base material 20 expands and contracts, stress is concentrated on the boundary between the portion of the wiring board 10 that overlaps with the resin 515 and the portion of the wiring board 10 that does not overlap with the resin 515. In consideration of this point, as shown in FIG. 27, the reinforcing member 31 is provided so as to extend outward from the outer edge 512 of the electronic component 51. As a result, it is possible to prevent the stress caused by the deformation of the base material 20 from being applied to the electronic component 51, and it is possible to prevent the electronic component 51 from being deformed or damaged. In addition, it is possible to prevent the electrical joint between the electronic component 51 and the wiring 52 from being damaged.
ここで、既述のように、追加配線Ｑの少なくとも一部は、例えば、図２７に示すように、基材２０の第１面２１の法線方向に沿って見た場合に電子部品５１の周囲と重なる部分において、配線５２の蛇腹形状部上に位置して配線５２と電子部品５１の電極との間を電気的に接続している。 Here, as described above, at least a part of the additional wiring Q is the electronic component 51 when viewed along the normal direction of the first surface 21 of the base material 20, for example, as shown in FIG. 27. In the portion overlapping the periphery, it is located on the bellows-shaped portion of the wiring 52 and electrically connects the wiring 52 and the electrodes of the electronic component 51.
これにより、例えば、配線基板１０の伸縮により、配線５２の蛇腹形状部の一部が断線した場合にも、追加配線Ｑが配線５２と電子部品５１の電極との電気的な接続を維持するようになっている。 As a result, for example, even if a part of the bellows-shaped portion of the wiring 52 is broken due to expansion and contraction of the wiring board 10, the additional wiring Q maintains the electrical connection between the wiring 52 and the electrodes of the electronic component 51. It has become.
すなわち、配線５２の蛇腹形状部に断線が発生した場合にも、配線５２と電子部品５１との電気的な接続を維持して、当該配線基板が所定の機能を発揮させることができる。 That is, even when a disconnection occurs in the bellows-shaped portion of the wiring 52, the electrical connection between the wiring 52 and the electronic component 51 can be maintained, and the wiring board can exhibit a predetermined function.
なお、図２７においては、ポッティング用の樹脂５１５がチップ５１３の全体を覆う例を示したが、これに限られることはない。パッケージ化された電子部品５１を補強するために、ポッティング用の樹脂５０を設けてもよい。この場合、樹脂５０は、電子部品５１の全体を覆っていてもよい。若しくは、樹脂５０は、電子部品５１の全体を覆っていなくてもよい。例えば、樹脂５０は、電子部品５１の周囲を補強するよう、電子部品５１の周囲で補強部材３１の端部と電子部品５１の端部との間に位置していてもよい。 Note that FIG. 27 shows an example in which the resin 515 for potting covers the entire chip 513, but the present invention is not limited to this. A resin 50 for potting may be provided to reinforce the packaged electronic component 51. In this case, the resin 50 may cover the entire electronic component 51. Alternatively, the resin 50 does not have to cover the entire electronic component 51. For example, the resin 50 may be located around the electronic component 51 between the end of the reinforcing member 31 and the end of the electronic component 51 so as to reinforce the periphery of the electronic component 51.
（第５の変形例）
上述の実施の形態及び各変形例においては、電子部品５１が、配線基板１０の各構成要素とは別の部材からなる部品である例を示した。下記の変形例においては、電子部品５１が、配線基板１０の複数の構成要素のうちの少なくとも１つの構成要素と一体的な部材を含む例について説明する。
(Fifth variant)
In the above-described embodiment and each modification, an example is shown in which the electronic component 51 is a component made of a member different from each component of the wiring board 10. In the following modification, an example will be described in which the electronic component 51 includes a member integrated with at least one component of the plurality of components of the wiring board 10.
例えば、電子部品５１は、配線基板１０の配線５２を構成する導電層と一体的な導電層を含むようにしてもよい。 For example, the electronic component 51 may include a conductive layer integrated with the conductive layer constituting the wiring 52 of the wiring board 10.
例えば、図２８は、電子部品５１の一例を示す平面図である。図２８に示す例において、電子部品５１を構成する導電層は、配線５２を構成する導電層よりも広い幅を有する。導電層の幅が変化する部分が、電子部品５１の外縁５１２である。図２８に示す電子部品５１は、例えばパッドとして機能することができる。パッドには、検査用のプローブ、ソフトウェア書き換え用の端子などが接続される。 For example, FIG. 28 is a plan view showing an example of the electronic component 51. In the example shown in FIG. 28, the conductive layer constituting the electronic component 51 has a wider width than the conductive layer constituting the wiring 52. The portion where the width of the conductive layer changes is the outer edge 512 of the electronic component 51. The electronic component 51 shown in FIG. 28 can function as, for example, a pad. A probe for inspection, a terminal for rewriting software, etc. are connected to the pad.
また、図２９は、電子部品５１のその他の例を示す平面図である。図２９に示す例において、電子部品５１を構成する導電層は、らせん状に延びる形状を有する。導電層がらせん状に延び始める部分が、電子部品５１の外縁５１２である。図２９に示すような、所定のパターンを有する導電層を含む電子部品５１は、アンテナや圧力センサとして機能することができる。 Further, FIG. 29 is a plan view showing another example of the electronic component 51. In the example shown in FIG. 29, the conductive layer constituting the electronic component 51 has a shape extending in a spiral shape. The portion where the conductive layer begins to extend spirally is the outer edge 512 of the electronic component 51. As shown in FIG. 29, the electronic component 51 including the conductive layer having a predetermined pattern can function as an antenna or a pressure sensor.
（第６の変形例）
上述の実施の形態においては、配線５２が直線状に配置されている例を説明したが、当該配線５２が屈曲している場合がある。この場合、当該配線５２が屈曲している領域では、蛇腹形状部に断線が発生しやすくなる傾向がある。
そこで、本第６の変形例では、当該配線５２が屈曲している領域で蛇腹形状部の断線の影響を低減する構成の一例について説明する。
(Sixth variant)
In the above-described embodiment, the example in which the wiring 52 is arranged in a straight line has been described, but the wiring 52 may be bent. In this case, in the region where the wiring 52 is bent, the bellows-shaped portion tends to be easily broken.
Therefore, in the sixth modification, an example of a configuration for reducing the influence of disconnection of the bellows-shaped portion in the region where the wiring 52 is bent will be described.
ここで、図３０は、第６の変形例に係る配線基板を示す平面図である。また、図３１は、第６の変形例に係る配線基板のその他の例を示す平面図である。なお、この図３０、図３１に示す配線基板１０は、例えば、既述の図４や図５と同様の断面構造を有する。
この図３０に示すように、追加配線Ｑ、ＱＫの少なくとも一部ＱＫは、基材２０の第１面２１の法線方向に沿って見た場合に配線５２の屈曲している部分５２Ｘを含む領域Ｋにおいて、配線５２の蛇腹形状部上に連続的に位置して、領域Ｋの蛇腹形状部に電気的に接続されているようにしてもよい。
Here, FIG. 30 is a plan view showing a wiring board according to a sixth modification. Further, FIG. 31 is a plan view showing another example of the wiring board according to the sixth modification. The wiring board 10 shown in FIGS. 30 and 31 has, for example, a cross-sectional structure similar to that of FIGS. 4 and 5 described above.
As shown in FIG. 30, at least a part QK of the additional wirings Q and QK includes a bent portion 52X of the wiring 52 when viewed along the normal direction of the first surface 21 of the base material 20. In the region K, the wiring 52 may be continuously located on the bellows-shaped portion of the wiring 52 so as to be electrically connected to the bellows-shaped portion of the region K.
なお、追加配線ＱＫは、例えば、図３１に示すように、基材２０の第１面２１の法線方向に沿って見た場合に、配線５２の屈曲している部分５２Ｘを含む領域Ｋにおいて、配線５２の蛇腹形状部の周囲まで延在しているようにしてもよい。 The additional wiring QK is, for example, in the region K including the bent portion 52X of the wiring 52 when viewed along the normal direction of the first surface 21 of the base material 20, as shown in FIG. , The wiring 52 may extend to the periphery of the bellows-shaped portion.
これにより、例えば、配線基板１０の伸縮により、配線５２の屈曲している部分５２Ｘを含む領域Ｋにおいて、配線５２の蛇腹形状部の一部が断線した場合にも、追加配線ＱＫが配線５２と電子部品５１の電極との電気的な接続を維持するようになっている。 As a result, for example, even if a part of the bellows-shaped portion of the wiring 52 is broken in the region K including the bent portion 52X of the wiring 52 due to the expansion and contraction of the wiring board 10, the additional wiring QK becomes the wiring 52. It is designed to maintain an electrical connection with the electrodes of the electronic component 51.
すなわち、配線５２の屈曲している部分５２Ｘを含む領域Ｋにおいて、配線５２の蛇腹形状部に断線が発生した場合にも、配線５２と電子部品５１との電気的な接続を維持して、当該配線基板が所定の機能を発揮させることができる。 That is, even if a disconnection occurs in the bellows-shaped portion of the wiring 52 in the region K including the bent portion 52X of the wiring 52, the electrical connection between the wiring 52 and the electronic component 51 is maintained. The wiring board can exert a predetermined function.
なお、本変形例に係る配線基板１０の製造方法は、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線Ｑ、ＱＫを、基材２０の第１面２１側に設ける、追加配線形成工程を備える点で、既述の実施形態と同様である。
特に、本変形例においては、この追加配線形成工程により、追加配線Ｑ、ＱＫの少なくとも一部ＱＫを、基材２０の第１面２１の法線方向に沿って見た場合に２つの配線５２の交点５２Ｘを含む領域Ｋにおいて、配線５２の蛇腹形状部上に位置するように設けるものである。
In the method of manufacturing the wiring board 10 according to this modification, additional wirings Q and QK containing conductive particles and containing a stretchable conductive paste are provided on the first surface 21 side of the base material 20. It is the same as the above-described embodiment in that it includes an additional wiring forming step.
In particular, in this modification, when the additional wiring Q and at least a part of the QK QK are viewed along the normal direction of the first surface 21 of the base material 20 by this additional wiring forming step, the two wirings 52 It is provided so as to be located on the bellows-shaped portion of the wiring 52 in the region K including the intersection 52X of the above.
そして、本変形例に係る配線基板１０の製造方法は、その他の配線基板１０の製造方法の工程は、既述の実施形態と同様である。 The method of manufacturing the wiring board 10 according to this modification is the same as that of the above-described embodiment in the steps of other methods of manufacturing the wiring board 10.
すなわち、この追加配線形成工程により、追加配線Ｑ、ＱＫの少なくとも一部ＱＫは、基材２０の第１面２１の法線方向に沿って見た場合に２つの配線５２の交点５２Ｘを含む領域Ｋにおいて、配線５２の蛇腹形状部上に位置して配線５２と電子部品５１の電極との間を電気的に接続することとなる。 That is, by this additional wiring forming step, at least a part QK of the additional wirings Q and QK is a region including the intersection 52X of the two wirings 52 when viewed along the normal direction of the first surface 21 of the base material 20. In K, it is located on the bellows-shaped portion of the wiring 52 and electrically connects the wiring 52 and the electrodes of the electronic component 51.
（第７の変形例）
上述の実施の形態においては、配線５２が直線状に並列に配置されている例を説明したが、２つの配線５２が交差している場合がある。この場合、２つの配線５２の交点を含む領域では、蛇腹形状部に断線が発生しやすくなる傾向がある。
そこで、本第７の変形例では、当該配線５２が屈曲している領域で蛇腹形状部の断線の影響を低減する構成の一例について説明する。
(7th variant)
In the above-described embodiment, the example in which the wirings 52 are arranged in parallel in a straight line has been described, but there are cases where the two wirings 52 intersect. In this case, in the region including the intersection of the two wirings 52, the bellows-shaped portion tends to be easily broken.
Therefore, in the seventh modification, an example of a configuration for reducing the influence of disconnection of the bellows-shaped portion in the region where the wiring 52 is bent will be described.
ここで、図３２は、第７の変形例に係る配線基板を示す平面図である。また、図３３は、第７の変形例に係る配線基板の他の例を示す平面図である。なお、この図３２、図３３に示す配線基板１０は、例えば、既述の図４や図５と同様の断面構造を有する。
この図３２に示すように、配線基板１０は、例えば、基材２０の第１面２１側に位置するとともに、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む、追加配線Ｑ、ＱＭを備える。
Here, FIG. 32 is a plan view showing a wiring board according to a seventh modification. Further, FIG. 33 is a plan view showing another example of the wiring board according to the seventh modification. The wiring board 10 shown in FIGS. 32 and 33 has, for example, a cross-sectional structure similar to that of FIGS. 4 and 5 described above.
As shown in FIG. 32, the wiring substrate 10 is located on the first surface 21 side of the base material 20, for example, and includes the additional wiring Q, which contains conductive particles and contains a conductive paste having elasticity. Equipped with QM.
そして、この図３２に示すように、追加配線Ｑ、ＱＭの少なくとも一部ＱＭは、基材２０の第１面２１の法線方向に沿って見た場合に２つの配線５２の交点Ｙを含む領域Ｍにおいて、配線５２の蛇腹形状部上に連続的に位置して、当該領域Ｍの蛇腹形状部に電気的に接続されているようにしてもよい。
なお、追加配線ＱＭは、例えば、図３３に示すように、基材２０の第１面２１の法線方向に沿って見た場合に配線５２の蛇腹形状部の周囲まで延在しているようにしてもよい。
Then, as shown in FIG. 32, at least a part QM of the additional wirings Q and QM includes the intersection Y of the two wirings 52 when viewed along the normal direction of the first surface 21 of the base material 20. In the region M, the wiring 52 may be continuously located on the bellows-shaped portion of the wiring 52 so as to be electrically connected to the bellows-shaped portion of the region M.
As shown in FIG. 33, the additional wiring QM seems to extend to the periphery of the bellows-shaped portion of the wiring 52 when viewed along the normal direction of the first surface 21 of the base material 20. It may be.
これにより、例えば、配線基板１０の伸縮により、２つの配線５２の交点Ｙを含む領域Ｍにおいて、配線５２の蛇腹形状部の一部が断線した場合にも、追加配線ＱＭが配線５２と電子部品５１の電極との電気的な接続を維持するようになっている。 As a result, for example, even if a part of the bellows-shaped portion of the wiring 52 is broken in the region M including the intersection Y of the two wirings 52 due to the expansion and contraction of the wiring board 10, the additional wiring QM is the wiring 52 and the electronic component. It is designed to maintain an electrical connection with the 51 electrodes.
すなわち、２つの配線５２の交点Ｙを含む領域Ｍにおいて、配線５２の蛇腹形状部に断線が発生した場合にも、配線５２と電子部品５１との電気的な接続を維持して、当該配線基板が所定の機能を発揮させることができる。 That is, even if a disconnection occurs in the bellows-shaped portion of the wiring 52 in the region M including the intersection Y of the two wirings 52, the electrical connection between the wiring 52 and the electronic component 51 is maintained and the wiring board is concerned. Can exert a predetermined function.
なお、本変形例に係る配線基板１０の製造方法は、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線Ｑ、ＱＭを、基材２０の第１面２１側に設ける、追加配線形成工程を備える点で、既述の実施形態と同様である。
特に、本変形例においては、この追加配線形成工程により、追加配線Ｑ、ＱＭの少なくとも一部ＱＭを、基材２０の第１面２１の法線方向に沿って見た場合に２つの配線５２の交点Ｙを含む領域Ｍにおいて、配線５２の蛇腹形状部上に位置するように設けるものである。
In the method of manufacturing the wiring board 10 according to this modification, additional wirings Q and QM containing conductive particles and containing a stretchable conductive paste are provided on the first surface 21 side of the base material 20. It is the same as the above-described embodiment in that it includes an additional wiring forming step.
In particular, in this modification, when the additional wiring Q and at least a part of the QM QM are viewed along the normal direction of the first surface 21 of the base material 20 by this additional wiring forming step, the two wirings 52 It is provided so as to be located on the bellows-shaped portion of the wiring 52 in the region M including the intersection Y of the above.
そして、本変形例に係る配線基板１０の製造方法は、その他の配線基板１０の製造方法の工程は、既述の実施形態と同様である。 The method of manufacturing the wiring board 10 according to this modification is the same as that of the above-described embodiment in the steps of other methods of manufacturing the wiring board 10.
すなわち、この追加配線形成工程により、追加配線Ｑ、ＱＭの少なくとも一部ＱＭは、基材２０の第１面２１の法線方向に沿って見た場合に２つの配線５２の交点Ｙを含む領域Ｍにおいて、配線５２の蛇腹形状部上に位置して配線５２と電子部品５１の電極との間を電気的に接続することとなる。 That is, by this additional wiring forming step, at least a part of the additional wiring Q and QM is a region including the intersection Y of the two wiring 52 when viewed along the normal direction of the first surface 21 of the base material 20. In M, the wiring 52 is located on the bellows-shaped portion of the wiring 52 and is electrically connected between the wiring 52 and the electrodes of the electronic component 51.
（第８の変形例）
上述の実施の形態においては、配線５２が直線状に並列に配置されている例を説明したが、配線基板の面内で伸縮率が異なる場合がある。この場合、伸縮率が大きい領域では、蛇腹形状部に断線が発生しやすくなる傾向がある。
そこで、本第８の変形例では、当該配線基板の伸縮率が大きい領域で蛇腹形状部の断線の影響を低減する構成の一例について説明する。
(8th variant)
In the above-described embodiment, the example in which the wirings 52 are arranged in parallel in a straight line has been described, but the expansion / contraction ratio may differ in the plane of the wiring board. In this case, in the region where the expansion / contraction ratio is large, the bellows-shaped portion tends to be easily broken.
Therefore, in the eighth modification, an example of a configuration for reducing the influence of disconnection of the bellows-shaped portion in a region where the expansion / contraction rate of the wiring board is large will be described.
ここで、図３４は、第８の変形例に係る配線基板を示す平面図である。また、図３５は、第８の変形例に係る配線基板の他の例を示す平面図である。なお、この図３４、図３５に示す配線基板１０は、例えば、既述の図４や図５と同様の断面構造を有する。 Here, FIG. 34 is a plan view showing a wiring board according to the eighth modification. Further, FIG. 35 is a plan view showing another example of the wiring board according to the eighth modification. The wiring board 10 shown in FIGS. 34 and 35 has, for example, a cross-sectional structure similar to that of FIGS. 4 and 5 described above.
この図３４に示すように、配線基板１０は、例えば、基材２０の第１面２１側に位置するとともに、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む、追加配線Ｑ、ＱＮを備える。 As shown in FIG. 34, the wiring substrate 10 is located on the first surface 21 side of the base material 20, for example, and includes the additional wiring Q, which contains conductive particles and contains a conductive paste having elasticity. Equipped with QN.
ここで、配線基板１０は、例えば、図３４に示すように、基材２０の第１面２１側において、第１配線領域Ｎ１と、この第１配線領域Ｎ１よりも伸縮率が大きい第２配線領域Ｎ２を含む。 Here, for example, as shown in FIG. 34, the wiring board 10 has a first wiring region N1 and a second wiring having a larger expansion / contraction ratio than the first wiring region N1 on the first surface 21 side of the base material 20. Includes region N2.
そして、追加配線Ｑ、ＱＮの少なくとも一部ＱＮは、この図３４に示すように、基材２０の第１面２１の法線方向に沿って見た場合に配線基板１０の第２配線領域Ｎ２において、配線５２の蛇腹形状部上に連続的に位置して、当該第２配線領域Ｎ２の蛇腹形状部に電気的に接続されている。 Then, as shown in FIG. 34, at least a part of the additional wirings Q and QN is the second wiring region N2 of the wiring board 10 when viewed along the normal direction of the first surface 21 of the base material 20. In, it is continuously located on the bellows-shaped portion of the wiring 52 and is electrically connected to the bellows-shaped portion of the second wiring region N2.
なお、追加配線ＱＮは、例えば、図３５に示すように、基材２０の第１面２１の法線方向に沿って見た場合に配線５２の蛇腹形状部の周囲まで延在しているようにしてもよい。 As shown in FIG. 35, the additional wiring QN seems to extend to the periphery of the bellows-shaped portion of the wiring 52 when viewed along the normal direction of the first surface 21 of the base material 20. It may be.
また、追加配線ＱＮは、図３４、図３５に示すように、基材２０の第１面２１の法線方向に沿って見た場合に配線基板１０の第１配線領域Ｎ１において、配線５２の蛇腹形状部上に位置しないようにしてもよい。 Further, as shown in FIGS. 34 and 35, the additional wiring QN is the wiring 52 in the first wiring region N1 of the wiring board 10 when viewed along the normal direction of the first surface 21 of the base material 20. It may not be located on the bellows shape.
これにより、例えば、配線基板１０の伸縮により、伸縮率が大きい第２配線領域Ｎ２において、配線５２の蛇腹形状部の一部が断線した場合にも、追加配線Ｑが配線５２と電子部品５１の電極との電気的な接続を維持するようになっている。 As a result, for example, even if a part of the bellows-shaped portion of the wiring 52 is broken in the second wiring region N2 having a large expansion / contraction rate due to the expansion / contraction of the wiring board 10, the additional wiring Q is the wiring 52 and the electronic component 51. It is designed to maintain an electrical connection to the electrodes.
すなわち、伸縮率が大きい第２配線領域Ｎ２において、配線５２の蛇腹形状部に断線が発生した場合にも、配線５２と電子部品５１との電気的な接続を維持して、当該配線基板が所定の機能を発揮させることができる。 That is, in the second wiring region N2 having a large expansion / contraction rate, even if a disconnection occurs in the bellows-shaped portion of the wiring 52, the electrical connection between the wiring 52 and the electronic component 51 is maintained, and the wiring board is predetermined. It is possible to exert the function of.
なお、本変形例に係る配線基板１０の製造方法は、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線Ｑ、ＱＮを、基材２０の第１面２１側に設ける、追加配線形成工程を備える点で、既述の実施形態と同様である。
特に、本変形例においては、この追加配線形成工程により、追加配線Ｑ、ＱＮの少なくとも一部ＱＮを、基材２０の第１面２１の法線方向に沿って見た場合に伸縮率が大きい第２配線領域Ｎ２において、配線５２の蛇腹形状部上に位置するように設けるものである。
In the method of manufacturing the wiring board 10 according to this modification, additional wirings Q and QN containing conductive particles and containing a stretchable conductive paste are provided on the first surface 21 side of the base material 20. It is the same as the above-described embodiment in that it includes an additional wiring forming step.
In particular, in this modification, the expansion / contraction rate is large when at least a part of the additional wiring Q and QN is viewed along the normal direction of the first surface 21 of the base material 20 by this additional wiring forming step. In the second wiring region N2, it is provided so as to be located on the bellows-shaped portion of the wiring 52.
そして、本変形例に係る配線基板１０の製造方法は、その他の配線基板１０の製造方法の工程は、既述の実施形態と同様である。 The method of manufacturing the wiring board 10 according to this modification is the same as that of the above-described embodiment in the steps of other methods of manufacturing the wiring board 10.
すなわち、この追加配線形成工程により、追加配線Ｑ、ＱＮの少なくとも一部ＱＮは、基材２０の第１面２１の法線方向に沿って見た場合に伸縮率が大きい第２配線領域Ｎ２において、配線５２の蛇腹形状部上に位置して配線５２と電子部品５１の電極との間を電気的に接続することとなる。 That is, by this additional wiring forming step, at least a part of the additional wiring Q and QN is in the second wiring region N2 having a large expansion / contraction ratio when viewed along the normal direction of the first surface 21 of the base material 20. , Located on the bellows-shaped portion of the wiring 52, the wiring 52 and the electrodes of the electronic component 51 are electrically connected.
（配線基板の変形例）
上述の実施の形態及び各変形例においては、配線基板１０が、基材２０の第１面２１側に搭載された電子部品５１を備える例を示した。しかしながら、これに限られることはなく、配線基板１０は、電子部品５１を備えていなくてもよい。例えば、電子部品５１が搭載されていない状態の基材２０に蛇腹形状部が生じていてもよい。また、電子部品５１が搭載されていない状態の支持基板４０が基材２０に貼り合されてもよい。また、配線基板１０は、電子部品５１が搭載されていない状態で出荷されてもよい。
(Modification example of wiring board)
In the above-described embodiment and each modification, an example is shown in which the wiring board 10 includes an electronic component 51 mounted on the first surface 21 side of the base material 20. However, the present invention is not limited to this, and the wiring board 10 may not include the electronic component 51. For example, a bellows-shaped portion may be formed on the base material 20 in which the electronic component 51 is not mounted. Further, the support substrate 40 in which the electronic component 51 is not mounted may be bonded to the base material 20. Further, the wiring board 10 may be shipped in a state where the electronic component 51 is not mounted.
なお、上述した実施の形態に対するいくつかの変形例を説明してきたが、当然に、複数の変形例を適宜組み合わせて適用することも可能である。 Although some modifications to the above-described embodiments have been described, it is naturally possible to apply a plurality of modifications in combination as appropriate.
１０ 配線基板
２０ 基材
２１ 第１面
２２ 第２面
３１ 補強部材
４０ 支持基板
４１ 第１面
４２ 第２面
５１ 電子部品
５２ 配線
６０ 接着層
Ｑ 追加配線
Ｚ 境界近傍
10 Wiring board 20 Base material 21 First surface 22 Second surface 31 Reinforcing member 40 Support substrate 41 First surface 42 Second surface 51 Electronic components 52 Wiring 60 Adhesive layer Q Additional wiring Z Near the boundary
Claims (33)
前記基材の前記第１面側に位置し、配線基板に搭載される電子部品の電極に接続される配線と、
前記基材の前記第１面側に位置するとともに、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む、追加配線と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に前記電子部品の周囲と重なる部分において、前記配線の前記蛇腹形状部上に位置して前記配線と前記電極との間を電気的に接続している、配線基板。 A base material containing a first surface and a second surface located on the opposite side of the first surface and having a first elastic modulus, and
Wiring that is located on the first surface side of the base material and is connected to the electrodes of electronic components mounted on the wiring board.
It is provided with additional wiring located on the first surface side of the base material and containing a conductive paste containing conductive particles and having elasticity.
The wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material.
At least a part of the additional wiring is located on the bellows-shaped portion of the wiring at a portion overlapping the periphery of the electronic component when viewed along the normal direction of the first surface of the base material. A wiring board that electrically connects the wiring and the electrodes.
前記基材の前記第１面側に位置し、配線基板に搭載される電子部品の電極に接続される配線と、
前記基材の前記第１面側に位置するとともに、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む、追加配線と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に２つの前記配線の交点又は前記配線の屈曲している部分を含む領域において、前記配線の蛇腹形状部上に連続的に位置して、前記領域の蛇腹形状部に電気的に接続されている、配線基板。 A base material containing a first surface and a second surface located on the opposite side of the first surface and having a first elastic modulus, and
Wiring that is located on the first surface side of the base material and is connected to the electrodes of electronic components mounted on the wiring board.
It is provided with additional wiring located on the first surface side of the base material and containing a conductive paste containing conductive particles and having elasticity.
The wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material.
At least a part of the additional wiring is the wiring in a region including an intersection of two wirings or a bent portion of the wiring when viewed along the normal direction of the first surface of the substrate. A wiring substrate that is continuously located on the bellows-shaped portion of the above and is electrically connected to the bellows-shaped portion of the region.
前記基材の前記第１面側に位置し、配線基板に搭載される電子部品の電極に接続される配線と、
前記基材の前記第１面側に位置するとともに、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む、追加配線と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記配線基板は、前記基材の前記第１面側において、第１配線領域と、前記第１配線領域よりも伸縮率が大きい第２配線領域を含み、
前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板の前記第２配線領域において、前記配線の蛇腹形状部上に連続的に位置して、前記第２配線領域の蛇腹形状部に電気的に接続されている、配線基板。 A base material containing a first surface and a second surface located on the opposite side of the first surface and having a first elastic modulus, and
Wiring that is located on the first surface side of the base material and is connected to the electrodes of electronic components mounted on the wiring board.
It is provided with additional wiring located on the first surface side of the base material and containing a conductive paste containing conductive particles and having elasticity.
The wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material.
The wiring board includes a first wiring region and a second wiring region having a larger expansion / contraction ratio than the first wiring region on the first surface side of the base material.
At least a part of the additional wiring is continuously formed on the bellows-shaped portion of the wiring in the second wiring region of the wiring board when viewed along the normal direction of the first surface of the base material. A wiring board that is located and electrically connected to the bellows-shaped portion of the second wiring region.
前記基材の前記第１面側に位置し、配線基板に搭載される電子部品の電極に接続される配線と、
前記基材の前記第１面側に位置するとともに、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む、追加配線と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に前記配線の前記蛇腹形状部と重なる部分であって、前記配線基板が被実装体に実装された場合に局所的に押し込まれる領域において、前記配線の前記蛇腹形状部上に位置して、前記配線と前記電極との間を電気的に接続している、配線基板。 A base material containing a first surface and a second surface located on the opposite side of the first surface and having a first elastic modulus, and
Wiring that is located on the first surface side of the base material and is connected to the electrodes of electronic components mounted on the wiring board.
It is provided with additional wiring located on the first surface side of the base material and containing a conductive paste containing conductive particles and having elasticity.
The wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material.
At least a part of the additional wiring is a portion that overlaps with the bellows-shaped portion of the wiring when viewed along the normal direction of the first surface of the base material, and the wiring substrate is attached to the mounted body. A wiring board that is located on the bellows-shaped portion of the wiring in a region that is locally pushed when mounted and electrically connects the wiring and the electrodes.
前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に、第１蛇腹形状部と重なる部分に、配置されている、請求項１に記載の配線基板。 The bellows-shaped portion is an end portion of the electronic component mounted on the wiring board on the first surface side of the base material when viewed along the normal direction of the first surface of the base material. A first bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material in the vicinity of the boundary between the substrate and the wiring.
The first aspect of the present invention, wherein at least a part of the additional wiring is arranged at a portion overlapping the first bellows-shaped portion when viewed along the normal direction of the first surface of the base material. Wiring board.
前記追加配線は、前記基材の前記第１面の法線方向に沿って見た場合に、 前記第２蛇腹形状部と重なる部分に、配置されていない、請求項１１に記載の配線基板。 The bellows-shaped portion is a boundary between the electronic component mounted on the wiring board and the boundary when viewed along the normal direction of the first surface of the base material on the first surface side of the base material. Further including a second bellows-shaped portion of the wiring in a region distant from the vicinity.
The wiring board according to claim 11, wherein the additional wiring is not arranged at a portion overlapping the second bellows-shaped portion when viewed along the normal direction of the first surface of the base material.
前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に前記電子部品の周囲と重なる部分において、前記基材の前記第１面上に位置して前記第２蛇腹形状部と前記電極との間を電気的に接続している、請求項１に記載の配線基板。 The bellows-shaped portion is a boundary between the electronic component mounted on the wiring board and the boundary when viewed along the normal direction of the first surface of the base material on the first surface side of the base material. Includes a second bellows-shaped portion of the wiring in a region farther away than in the vicinity
At least a part of the additional wiring is located on the first surface of the base material at a portion overlapping the periphery of the electronic component when viewed along the normal direction of the first surface of the base material. The wiring board according to claim 1, wherein the second bellows-shaped portion and the electrode are electrically connected to each other.
前記導電性ペーストの前記導電性粒子は、銀粒子である請求項２４に記載の配線基板。 The metal film constituting the wiring is made of copper.
The wiring board according to claim 24, wherein the conductive particles of the conductive paste are silver particles.
第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、
伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、
前記基材から前記引張応力を取り除く第３工程と、
導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線を、前記基材の前記第１面側に設ける、追加配線形成工程と、を備え、
前記配線基板は、前記第１の弾性係数よりも大きい第２の弾性係数を有する補強部材を備え、
前記基材から前記引張応力が取り除かれた後、前記配線のうち前記第１面の法線方向に沿って見た場合に前記補強部材と重ならない部分は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に前記電子部品の周囲と重なる部分において、前記配線の前記蛇腹形状部上に位置して前記配線と前記電極との間を電気的に接続している、配線基板の製造方法。 It is a method of manufacturing a wiring board.
The first step of extending the base material by applying tensile stress to the base material having the first surface and the second surface located on the opposite side of the first surface and having the first elastic modulus.
A second step of providing wiring on the first surface side of the stretched base material, and
The third step of removing the tensile stress from the base material and
An additional wiring forming step is provided in which an additional wiring containing conductive particles and containing a conductive paste having elasticity is provided on the first surface side of the base material.
The wiring board includes a reinforcing member having a second elastic modulus larger than the first elastic modulus.
After the tensile stress is removed from the base material, the portion of the wiring that does not overlap with the reinforcing member when viewed along the normal direction of the first surface is the first surface of the base material. It has a bellows-shaped part including a plurality of peaks and valleys arranged along the in-plane direction.
At least a part of the additional wiring is located on the bellows-shaped portion of the wiring at a portion overlapping the periphery of the electronic component when viewed along the normal direction of the first surface of the base material. A method for manufacturing a wiring board, which electrically connects the wiring and the electrodes.
第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、
伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、
前記基材から前記引張応力を取り除く第３工程と、
導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線を、前記基材の前記第１面側に設ける、追加配線形成工程と、を備え、
前記配線基板は、前記第１の弾性係数よりも大きい第２の弾性係数を有する補強部材を備え、
前記基材から前記引張応力が取り除かれた後、前記配線のうち前記第１面の法線方向に沿って見た場合に前記補強部材と重ならない部分は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に２つの前記配線の交点又は前記配線の屈曲している部分を含む領域において、前記配線の蛇腹形状部上に連続的に位置して、前記領域の蛇腹形状部に電気的に接続されている、配線基板の製造方法。 It is a method of manufacturing a wiring board.
The first step of extending the base material by applying tensile stress to the base material having the first surface and the second surface located on the opposite side of the first surface and having the first elastic modulus.
A second step of providing wiring on the first surface side of the stretched base material, and
The third step of removing the tensile stress from the base material and
An additional wiring forming step is provided in which an additional wiring containing conductive particles and containing a conductive paste having elasticity is provided on the first surface side of the base material.
The wiring board includes a reinforcing member having a second elastic modulus larger than the first elastic modulus.
After the tensile stress is removed from the base material, the portion of the wiring that does not overlap with the reinforcing member when viewed along the normal direction of the first surface is the first surface of the base material. It has a bellows-shaped part including a plurality of peaks and valleys arranged along the in-plane direction.
At least a part of the additional wiring is the wiring in a region including an intersection of two wirings or a bent portion of the wiring when viewed along the normal direction of the first surface of the substrate. A method for manufacturing a wiring substrate, which is continuously located on the bellows-shaped portion of the above and is electrically connected to the bellows-shaped portion in the region.
第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、
伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、
前記基材から前記引張応力を取り除く第３工程と、
導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線を、前記基材の前記第１面側に設ける、追加配線形成工程と、を備え、
前記配線基板は、前記第１の弾性係数よりも大きい第２の弾性係数を有する補強部材を備え、
前記基材から前記引張応力が取り除かれた後、前記配線のうち前記第１面の法線方向に沿って見た場合に前記補強部材と重ならない部分は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記配線基板は、前記基材の前記第１面側において、第１配線領域と、前記第１配線領域よりも、伸縮率が大きい第２配線領域とを含み、
前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板の前記第２配線領域において、前記配線の蛇腹形状部上に連続的に位置して、前記第２配線領域の蛇腹形状部に電気的に接続されている、配線基板の製造方法。 It is a method of manufacturing a wiring board.
The first step of extending the base material by applying tensile stress to the base material having the first surface and the second surface located on the opposite side of the first surface and having the first elastic modulus.
A second step of providing wiring on the first surface side of the stretched base material, and
The third step of removing the tensile stress from the base material and
An additional wiring forming step is provided in which an additional wiring containing conductive particles and containing a conductive paste having elasticity is provided on the first surface side of the base material.
The wiring board includes a reinforcing member having a second elastic modulus larger than the first elastic modulus.
After the tensile stress is removed from the base material, the portion of the wiring that does not overlap with the reinforcing member when viewed along the normal direction of the first surface is the first surface of the base material. It has a bellows-shaped part including a plurality of peaks and valleys arranged along the in-plane direction.
The wiring board includes a first wiring region and a second wiring region having a larger expansion / contraction ratio than the first wiring region on the first surface side of the base material.
At least a part of the additional wiring is continuously formed on the bellows-shaped portion of the wiring in the second wiring region of the wiring board when viewed along the normal direction of the first surface of the base material. A method of manufacturing a wiring board, which is located and electrically connected to a bellows-shaped portion of the second wiring region.
第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、
伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、
前記基材から前記引張応力を取り除く第３工程と、
導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線を、前記基材の前記第１面側に設ける、追加配線形成工程と、を備え、
前記配線基板は、前記第１の弾性係数よりも大きい第２の弾性係数を有する補強部材を備え、
前記基材から前記引張応力が取り除かれた後、前記配線のうち前記第１面の法線方向に沿って見た場合に前記補強部材と重ならない部分は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記追加配線の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に前記配線の前記蛇腹形状部と重なる部分であって、前記配線基板が被実装体に実装された場合に局所的に押し込まれる領域において、前記配線の前記蛇腹形状部上に位置して、前記配線と前記電極との間を電気的に接続している、配線基板の製造方法。 It is a method of manufacturing a wiring board.
The first step of extending the base material by applying tensile stress to the base material having the first surface and the second surface located on the opposite side of the first surface and having the first elastic modulus.
A second step of providing wiring on the first surface side of the stretched base material, and
The third step of removing the tensile stress from the base material and
An additional wiring forming step is provided in which an additional wiring containing conductive particles and containing a conductive paste having elasticity is provided on the first surface side of the base material.
The wiring board includes a reinforcing member having a second elastic modulus larger than the first elastic modulus.
After the tensile stress is removed from the base material, the portion of the wiring that does not overlap with the reinforcing member when viewed along the normal direction of the first surface is the first surface of the base material. It has a bellows-shaped part including a plurality of peaks and valleys arranged along the in-plane direction.
At least a part of the additional wiring is a portion that overlaps with the bellows-shaped portion of the wiring when viewed along the normal direction of the first surface of the base material, and the wiring substrate is attached to the mounted body. A method for manufacturing a wiring substrate, which is located on the bellows-shaped portion of the wiring and electrically connects the wiring and the electrodes in a region that is locally pushed when mounted.
前記基材の前記第１面側に位置し、配線基板に搭載される電子部品の電極に接続される配線と、
前記基材の前記第１面側に位置するとともに、導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む、追加配線と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記追加配線は、前記基材の前記第１面の法線方向に沿って見た場合に前記配線の前記蛇腹形状部の少なくとも一部を迂回するように延在している、配線基板。 A base material containing a first surface and a second surface located on the opposite side of the first surface and having a first elastic modulus, and
Wiring that is located on the first surface side of the base material and is connected to the electrodes of electronic components mounted on the wiring board.
It is provided with additional wiring located on the first surface side of the base material and containing a conductive paste containing conductive particles and having elasticity.
The wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material.
A wiring board in which the additional wiring extends so as to bypass at least a part of the bellows-shaped portion of the wiring when viewed along the normal direction of the first surface of the base material.
第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、
伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、
前記基材から前記引張応力を取り除く第３工程と、
導電性粒子を含有し且つ伸縮性を有する導電性ペーストを含む追加配線を、前記基材の前記第１面側に設ける、追加配線形成工程と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記追加配線は、前記基材の前記第１面の法線方向に沿って見た場合に前記配線の前記蛇腹形状部の少なくとも一部を迂回するように延在している、配線基板の製造方法。 It is a method of manufacturing a wiring board.
The first step of extending the base material by applying tensile stress to the base material having the first surface and the second surface located on the opposite side of the first surface and having the first elastic modulus.
A second step of providing wiring on the first surface side of the stretched base material, and
The third step of removing the tensile stress from the base material and
An additional wiring forming step is provided in which an additional wiring containing conductive particles and containing a conductive paste having elasticity is provided on the first surface side of the base material.
The wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material.
Manufacture of a wiring board in which the additional wiring extends so as to bypass at least a part of the bellows-shaped portion of the wiring when viewed along the normal direction of the first surface of the base material. Method.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022085464A1 (en) * | 2020-10-20 | 2022-04-28 | セーレン株式会社 | Conductive film having gold layer |
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