JP7251165B2 - Wiring board and method for manufacturing wiring board - Google Patents

Wiring board and method for manufacturing wiring board Download PDF

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JP7251165B2
JP7251165B2 JP2019010391A JP2019010391A JP7251165B2 JP 7251165 B2 JP7251165 B2 JP 7251165B2 JP 2019010391 A JP2019010391 A JP 2019010391A JP 2019010391 A JP2019010391 A JP 2019010391A JP 7251165 B2 JP7251165 B2 JP 7251165B2
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wiring
base material
bellows
wiring board
shaped portion
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JP2020120013A (en
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麻紀子 坂田
健一 小川
直子 沖本
充孝 永江
徹 三好
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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本開示の実施形態は、基材と、基材の第１面側に位置する電子部品及び配線とを備える配線基板に関する。また、本開示の実施形態は、配線基板の製造方法に関する。 An embodiment of the present disclosure relates to a wiring board including a base material and electronic components and wiring located on the first surface side of the base material. Further, embodiments of the present disclosure relate to a method for manufacturing a wiring board.

近年、伸縮性などの変形性を有する電子デバイスの研究がおこなわれている。例えば特許文献１は、基材と、基材に設けられた配線と、を備え、伸縮性を有する配線基板を開示している。特許文献１においては、予め伸長させた状態の基材に回路を設け、回路を形成した後に基材を弛緩させる、という製造方法を採用している。特許文献１は、基材の伸長状態及び弛緩状態のいずれにおいても基材上の薄膜トランジスタを良好に動作させることを意図している。 In recent years, research has been conducted on electronic devices having deformability such as stretchability. For example, Patent Literature 1 discloses a flexible wiring board that includes a base material and wiring provided on the base material. Patent Document 1 employs a manufacturing method in which a circuit is formed on a pre-stretched base material, and the base material is relaxed after the circuit is formed. Patent Document 1 intends to operate thin film transistors on a substrate well in both the stretched state and the relaxed state of the substrate.

特開２００７－２８１４０６号公報Japanese Patent Application Laid-Open No. 2007-281406

配線基板は、伸縮などの変形に対する耐性を有する部分だけでなく、変形に起因して破損し易い部分も含む。このため、予め伸長させた状態の基材に回路を設けると、配線基板に破損などの不具合が生じ易くなってしまう。 A wiring board includes not only a portion that is resistant to deformation such as expansion and contraction, but also a portion that is easily damaged due to deformation. For this reason, if a circuit is provided on the pre-stretched base material, the wiring board is likely to be damaged.

本開示の実施形態は、このような課題を効果的に解決し得る配線基板及び配線基板の製造方法を提供することを目的とする。 An object of the embodiments of the present disclosure is to provide a wiring board and a wiring board manufacturing method that can effectively solve such problems.

本開示の一実施形態に係る配線基板は、第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材と、前記基材の前記第１面側に位置し、配線基板に搭載される電子部品の電極に接続される配線と、前記基材の前記第１面側に位置し、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板に搭載される前記電子部品の端部と前記配線との境界近傍に少なくとも部分的に重なり、第２の弾性係数を有する保護部材と、を備え、前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、前記保護部材の少なくとも一部は、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品の端部と前記配線との前記境界近傍における、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部を、被覆している配線基板である。 A wiring board according to an embodiment of the present disclosure includes a base material having a first elastic modulus and a first surface and a second surface located opposite to the first surface, and the first elastic modulus of the base material. wiring located on the surface side and connected to electrodes of an electronic component mounted on a wiring board; and a protective member having a second elastic modulus, which at least partially overlaps near a boundary between the end of the electronic component mounted on the wiring board and the wiring when viewed from above, wherein the wiring: a bellows-shaped portion including a plurality of peaks and troughs arranged along the in-plane direction of the first surface of the base material, and at least part of the protective member is included in the bellows-shaped portion of the wiring; a plurality of ridges and troughs arranged along the in-plane direction of the first surface of the base material in the vicinity of the boundary between the end of the electronic component mounted on the wiring board and the wiring; 1 A wiring substrate covering a bellows-shaped portion.

本開示の一実施形態による配線基板において、前記境界近傍における前記配線の前記第１蛇腹形状部の山部と谷部の周期は、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品から前記境界近傍よりも離れた領域における前記配線の第２蛇腹形状部の山部と谷部の周期よりも、小さく若しくは大きくなっていてもよい。 In the wiring board according to one embodiment of the present disclosure, the period of peaks and valleys of the first bellows-shaped portion of the wiring in the vicinity of the boundary is the length of the bellows-shaped portion of the wiring mounted on the wiring board. may be smaller or larger than the period of peaks and valleys of the second bellows-shaped portion of the wiring in a region away from the electronic component near the boundary.

本開示の一実施形態による配線基板において、前記境界近傍における前記配線の前記第１蛇腹形状部の山部と谷部の振幅は、前記配線の前記第２蛇腹形状部の山部と谷部の振幅よりも、小さく若しくは大きくなっていてもよい。 In the wiring board according to one embodiment of the present disclosure, the amplitude of peaks and valleys of the first bellows-shaped portion of the wiring in the vicinity of the boundary is It may be smaller or larger than the amplitude.

本開示の一実施形態による配線基板において、前記配線の蛇腹形状部は、前記第１面の法線方向に沿って見た場合に前記電子部品と前記基材との間に、設けられていなくてもよい。 In the wiring board according to an embodiment of the present disclosure, the bellows-shaped portion of the wiring is not provided between the electronic component and the base material when viewed along the normal direction of the first surface. may

本開示の一実施形態による配線基板において、前記境界近傍における前記配線の前記第１蛇腹形状部の山部と谷部の周期は、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品から前記境界近傍よりも離れた領域における前記配線の第２蛇腹形状部の山部と谷部の周期と、同じであってもよい。 In the wiring board according to one embodiment of the present disclosure, the period of peaks and valleys of the first bellows-shaped portion of the wiring in the vicinity of the boundary is the length of the bellows-shaped portion of the wiring mounted on the wiring board. The period of peaks and valleys of the second bellows-shaped portion of the wiring may be the same in a region away from the electronic component near the boundary.

本開示の一実施形態による配線基板において、前記境界近傍における前記配線の前記第１蛇腹形状部の山部と谷部の振幅は、前記配線の前記第２蛇腹形状部の山部と谷部の振幅と、同じであってもよい。 In the wiring board according to one embodiment of the present disclosure, the amplitude of peaks and valleys of the first bellows-shaped portion of the wiring in the vicinity of the boundary is may be the same as the amplitude.

本開示の一実施形態による配線基板において、前記配線の蛇腹形状部は、前記基材と前記配線基板に搭載される前記電子部品との間に位置するとともに、前記第１面の法線方向に沿って見た場合に前記電子部品と前記配線と重なる部分に、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む第３蛇腹形状部を、含んでいてもよい。 In the wiring board according to one embodiment of the present disclosure, the bellows-shaped portion of the wiring is positioned between the base material and the electronic component mounted on the wiring board, and extends in the normal direction of the first surface. a third bellows-shaped portion including a plurality of peaks and valleys aligned along the in-plane direction of the first surface of the base material, in a portion overlapping the electronic component and the wiring when viewed along the You can stay.

本開示の一実施形態による配線基板において、前記第１、第２、及び第３蛇腹形状部の山部と谷部の周期は、同じであってもよい。 In the wiring board according to an embodiment of the present disclosure, the peaks and valleys of the first, second, and third bellows-shaped portions may have the same period.

本開示の一実施形態による配線基板において、前記第１、第２、及び第３蛇腹形状部の山部と谷部の振幅は、同じであってもよい。 In the wiring board according to one embodiment of the present disclosure, the peaks and valleys of the first, second, and third bellows-shaped portions may have the same amplitude.

本開示の一実施形態による配線基板において、前記保護部材の少なくとも一部は、前記基材と前記配線基板に搭載される前記電子部品との間の領域において、前記第３蛇腹形状部を、被覆していてもよい。 In the wiring board according to one embodiment of the present disclosure, at least part of the protective member covers the third bellows-shaped portion in a region between the base material and the electronic component mounted on the wiring board. You may have

本開示の一実施形態による配線基板において、前記保護部材の少なくとも一部は、前記境界近傍における前記配線の前記第１蛇腹形状部を、直接的に被覆していてもよい。 In the wiring board according to one embodiment of the present disclosure, at least part of the protective member may directly cover the first accordion-shaped portion of the wiring near the boundary.

本開示の一実施形態による配線基板において、前記保護部材は、前記境界近傍における前記配線の前記第１蛇腹形状部、及び、前記境界近傍から離れた領域における前記第２蛇腹形状部の少なくとも一部を、連続的に被覆していてもよい。 In the wiring board according to one embodiment of the present disclosure, the protective member includes at least part of the first bellows-shaped portion of the wiring near the boundary and the second bellows-shaped portion in a region away from the vicinity of the boundary. may be continuously coated.

本開示の一実施形態による配線基板において、前記保護部材の少なくとも一部は、前記第３蛇腹形状部を、直接的に被覆していてもよい。 In the wiring board according to one embodiment of the present disclosure, at least part of the protective member may directly cover the third bellows-shaped portion.

本開示の一実施形態による配線基板において、前記基材の前記第１面側に位置し、前記配線に電気的に接続される電極を有する電子部品を更に備えていてもよい。 The wiring board according to an embodiment of the present disclosure may further include an electronic component located on the first surface side of the base material and having an electrode electrically connected to the wiring.

本開示の一実施形態による配線基板において、前記電子部品は、前記基材の前記第１面側に位置し、第１面及び前記第１面の反対側に位置する第２面を含むチップと、前記チップの少なくとも一部を被覆する補強部材と、を有し、前記保護部材の少なくとも一部は、前記補強部材を介して前記チップを被覆していてもよい。 In the wiring board according to an embodiment of the present disclosure, the electronic component includes a chip located on the first surface side of the base material and including a first surface and a second surface located on the opposite side of the first surface. , and a reinforcing member covering at least a portion of the chip, and at least a portion of the protecting member may cover the chip via the reinforcing member.

本開示の一実施形態による配線基板において、前記電子部品は、前記基材の前記第１面側に位置し、第１面及び前記第１面の反対側に位置する第２面を含むチップと、前記チップと前記配線とを電気的に接続する接続端子と、を有し、前記保護部材の少なくとも一部は、前記基材の前記第１面と前記チップの前記第２面との間で、前記接続端子と前記配線との接続部分を、直接的に若しくは間接的に被覆していてもよい。 In the wiring board according to an embodiment of the present disclosure, the electronic component includes a chip located on the first surface side of the base material and including a first surface and a second surface located on the opposite side of the first surface. and connection terminals for electrically connecting the chip and the wiring, wherein at least part of the protective member is disposed between the first surface of the base material and the second surface of the chip. , the connection portion between the connection terminal and the wiring may be directly or indirectly covered.

本開示の一実施形態による配線基板において、前記保護部材の少なくとも一部は、前記電子部品の前記チップと前記接続端子との接続部分を、直接的に若しくは間接的に被覆していてもよい。 In the wiring board according to one embodiment of the present disclosure, at least part of the protection member may directly or indirectly cover connection portions between the chip of the electronic component and the connection terminals.

本開示の一実施形態による配線基板において、前記電子部品の前記チップのうち前記接続端子と接続されていない前記第１面は、前記保護部材から露出していてもよい。 In the wiring board according to one embodiment of the present disclosure, the first surface of the chip of the electronic component that is not connected to the connection terminal may be exposed from the protective member.

本開示の一実施形態による配線基板において、前記電子部品は、前記チップの少なくとも一部及び前記接続端子を被覆する補強部材をさらに有するようにしてもよい。 In the wiring board according to one embodiment of the present disclosure, the electronic component may further include a reinforcing member covering at least a portion of the chip and the connection terminals.

本開示の一実施形態による配線基板において、前記補強部材は、樹脂であるようにしてもよい。 In the wiring board according to one embodiment of the present disclosure, the reinforcing member may be resin.

本開示の一実施形態による配線基板において、前記配線と前記基材の前記第１面との間に位置し、前記第１の弾性係数よりも大きい第３の弾性係数を有し、前記配線を支持する支持基板を更に備えるようにしてもよい。 In the wiring board according to one embodiment of the present disclosure, the wiring is located between the wiring and the first surface of the base material, has a third elastic modulus larger than the first elastic modulus, and You may make it further provide the support substrate which supports.

本開示の一実施形態による配線基板において、前記配線は、複数の導電性粒子を含むようにしてもよい。 In the wiring board according to one embodiment of the present disclosure, the wiring may include a plurality of conductive particles.

本開示の一実施形態による配線基板において、前記基材は、シリコーンゴムを含むようにしてもよい。 In the wiring board according to one embodiment of the present disclosure, the base material may contain silicone rubber.

本開示の一実施形態による配線基板において、前記保護部材は、樹脂で構成されているようにしてもよい。 In the wiring board according to an embodiment of the present disclosure, the protective member may be made of resin.

本開示の一実施形態による配線基板において、前記保護部材は、前記電子部品を前記基材の前記第１面の面内方向に連続して被覆するとともに、前記配線の蛇腹形状部のうち、前記基材の前記第１面の面内方向における、前記電子部品の両方の端部近傍の前記第１蛇腹形状部を、被覆しているようにしてもよい。 In the wiring board according to one embodiment of the present disclosure, the protective member continuously covers the electronic component in the in-plane direction of the first surface of the base material, and the bellows-shaped portion of the wiring includes the The first accordion-shaped portion near both ends of the electronic component in the in-plane direction of the first surface of the base material may be covered.

本開示の一実施形態による配線基板において、前記配線の前記蛇腹形状部の振幅が１μｍ以上であるようにしてもよい。 In the wiring board according to one embodiment of the present disclosure, the amplitude of the bellows-shaped portion of the wiring may be 1 μm or more.

本開示の一実施形態による配線基板において、前記基材の前記第１面の面内方向に沿う引張応力が前記基材に加えられていない第１状態における前記配線の抵抗値を第１抵抗値と称し、前記基材に引張応力を加えて前記基材を前記第１面の面内方向において前記第１状態に比べて３０％伸長させた第２状態における前記配線の抵抗値を第２抵抗値と称する場合、前記第１抵抗値に対する、前記第１抵抗値と前記第２抵抗値の差の絶対値の比率が、２０％以下であるようにしてもよい。 In the wiring board according to one embodiment of the present disclosure, the resistance value of the wiring in a first state in which a tensile stress along the in-plane direction of the first surface of the base material is not applied to the base material is referred to as a first resistance value. A second resistance is the resistance value of the wiring in a second state in which a tensile stress is applied to the base material to extend the base material by 30% in the in-plane direction of the first surface compared to the first state. When referring to a value, the ratio of the absolute value of the difference between the first resistance value and the second resistance value to the first resistance value may be 20% or less.

本開示の一実施形態に係る配線基板の製造方法は、第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、前記配線が設けられた前記基材から前記引張応力を取り除く第３工程と、前記基材から前記引張応力を取り除いた後、前記基材の前記第１面側に位置し、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板に搭載される電子部品の端部と前記配線との境界近傍に少なくとも部分的に重なり、第２の弾性係数を有する保護部材を、設ける第４工程と、を備え、前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、前記保護部材の少なくとも一部は、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品の端部と前記配線との前記境界近傍における、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部を、被覆している、配線基板の製造方法である。 A wiring board manufacturing method according to an embodiment of the present disclosure includes a first surface and a second surface opposite to the first surface, and applies a tensile stress to a base material having a first elastic modulus. a first step of stretching the substrate; a second step of providing wiring on the first surface side of the substrate in the stretched state; and a second step of removing the tensile stress from the substrate provided with the wiring. and step 3, after removing the tensile stress from the substrate, the wiring located on the first surface side of the substrate and viewed along the normal direction of the first surface of the substrate. and a fourth step of providing a protective member having a second elastic modulus that at least partially overlaps near a boundary between an end portion of an electronic component mounted on a substrate and the wiring, wherein the wiring is connected to the substrate. The protection member has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the wiring, and at least part of the protection member includes the bellows-shaped portion of the wiring. A first bellows including a plurality of ridges and troughs arranged along the in-plane direction of the first surface of the base material in the vicinity of the boundary between the end of the electronic component mounted on the wiring board and the wiring. A method for manufacturing a wiring board, in which the shape portion is covered.

本開示の一実施形態による配線基板の製造方法において、前記基材の前記第１面側に前記配線を設けた後であって、前記基材の前記第１面側に前記保護部材を設ける前に、前記配線に電気的に接続される電極を有する電子部品を、前記基材の前記第１面側に設ける電子部品搭載工程を、さらに備えるようにしてもよい。 In the method for manufacturing a wiring board according to an embodiment of the present disclosure, after providing the wiring on the first surface side of the base material and before providing the protective member on the first surface side of the base material Further, the method may further include an electronic component mounting step of providing an electronic component having electrodes electrically connected to the wiring on the first surface side of the base material.

本開示の一実施形態による配線基板の製造方法において、第１面及び前記第１面の反対側に位置する第２面を含み、前記第１の弾性係数よりも大きい第３の弾性係数を有する支持基板を準備し、前記支持基板の前記第１面に前記配線を設ける支持基板準備工程をさらに備え、前記電子部品搭載工程においては、前記配線が設けられた前記支持基板の前記第１面に、前記配線に電気的に接続される電極を有する電子部品を設け、前記第２工程においては、伸長した状態の前記基材の前記第１面に、前記配線及び前記電子部品が設けられた前記支持基板を、前記支持基板の前記第２面側から接合させるようにしてもよい。 In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the wiring board includes a first surface and a second surface located on the opposite side of the first surface, and has a third elastic modulus larger than the first elastic modulus. a supporting substrate preparing step of preparing a supporting substrate and providing the wiring on the first surface of the supporting substrate; and providing an electronic component having an electrode electrically connected to the wiring; A support substrate may be bonded from the second surface side of the support substrate.

本開示の一実施形態に係る配線基板の製造方法は、第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、前記配線が設けられた伸長した状態の前記基材から前記引張応力を取り除く第３工程と、前記基材から前記引張応力を取り除いた後、前記基材の前記第１面側に位置し、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板に搭載される電子部品の端部と前記配線との境界近傍に少なくとも部分的に重なり、第２の弾性係数を有する保護部材を、設ける第４工程と、を備え、前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、前記保護部材の少なくとも一部は、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品の端部と前記配線との前記境界近傍における、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部を、被覆している、配線基板の製造方法である。 A wiring board manufacturing method according to an embodiment of the present disclosure includes a first surface and a second surface opposite to the first surface, and applies a tensile stress to a base material having a first elastic modulus. a first step of extending the base material; a second step of providing wiring on the first surface side of the base material in the extended state; a third step of removing the stress, and after removing the tensile stress from the substrate, the a fourth step of providing a protective member having a second elastic modulus at least partially in the vicinity of a boundary between an end of an electronic component mounted on the wiring board and the wiring, wherein the wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material, and at least part of the protective member is the bellows-shaped portion of the wiring. a plurality of ridges and troughs arranged along the in-plane direction of the first surface of the base material in the vicinity of the boundary between the end of the electronic component mounted on the wiring board and the wiring; It is a method of manufacturing a wiring board covering a first bellows-shaped portion including.

本開示の一実施形態による配線基板の製造方法において、前記基材から前記引張応力を取り除いた後であって、前記基材の前記第１面側に前記保護部材を設ける前に、前記配線に電気的に接続される電極を有する電子部品を、前記基材の前記第１面側に設ける電子部品搭載工程を、さらに備えるようにしてもよい。 In the method for manufacturing a wiring board according to an embodiment of the present disclosure, after removing the tensile stress from the base material and before providing the protective member on the first surface side of the base material, the wiring is An electronic component mounting step of providing an electronic component having electrodes to be electrically connected to the first surface side of the substrate may be further provided.

本開示の一実施形態による配線基板の製造方法において、第１面及び前記第１面の反対側に位置する第２面を含み、前記第１の弾性係数よりも大きい第３の弾性係数を有する支持基板を準備し、前記支持基板の前記第１面に前記配線を設ける支持基板準備工程をさらに備え、前記第２工程においては、伸長した状態の前記基材の前記第１面に、前記配線が設けられた前記支持基板を、前記支持基板の前記第２面側から接合させ、前記電子部品搭載工程においては、前記配線が設けられた前記支持基板の前記第１面に、前記配線に電気的に接続される電極を有する前記電子部品を設けるようにしてもよい。 In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the wiring board includes a first surface and a second surface located on the opposite side of the first surface, and has a third elastic modulus larger than the first elastic modulus. A support substrate preparation step of preparing a support substrate and providing the wiring on the first surface of the support substrate is further provided, and in the second step, the wiring is provided on the first surface of the base material in a stretched state. The supporting substrate provided with is joined from the second surface side of the supporting substrate, and in the electronic component mounting step, the first surface of the supporting substrate provided with the wiring is electrically connected to the wiring. The electronic component may be provided having electrodes which are electrically connected.

本開示の一実施形態による配線基板は、
第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材と、
前記基材の前記第１面側に位置し、配線基板に搭載される電子部品の電極に接続される配線と、
前記基材の前記第２面側に位置し、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板に搭載される前記電子部品の端部と前記配線との境界近傍に少なくとも部分的に重なり、第２の弾性係数を有する保護部材と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記保護部材の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品の端部と前記配線との前記境界近傍における、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部に、重なっている、配線基板。 A wiring board according to an embodiment of the present disclosure includes:
a substrate comprising a first surface and a second surface opposite the first surface and having a first modulus of elasticity;
wiring located on the first surface side of the base material and connected to electrodes of an electronic component mounted on a wiring substrate;
When viewed along the normal direction of the first surface of the base material located on the second surface side of the base material, the end portion of the electronic component mounted on the wiring board and the wiring a protective member at least partially overlapping near the boundary and having a second modulus of elasticity;
the wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base;
At least a part of the protective member is, when viewed along the normal direction of the first surface of the base material, part of the bellows-shaped portion of the wiring, the electronic component mounted on the wiring board. A wiring board overlapping a first bellows-shaped portion including a plurality of peaks and valleys arranged along an in-plane direction of the first surface of the base material in the vicinity of the boundary between the end portion and the wiring. .

本開示の一実施形態に係る配線基板の製造方法は、
第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、
伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、
前記配線が設けられた前記基材から前記引張応力を取り除く第３工程と、
前記基材から前記引張応力を取り除いた後、前記基材の前記第２面側に位置し、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板に搭載される電子部品の端部と前記配線との境界近傍に少なくとも部分的に重なり、第２の弾性係数を有する保護部材を、設ける第４工程と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記保護部材の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品の端部と前記配線との前記境界近傍における、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部に、重なっている、配線基板の製造方法。 A wiring board manufacturing method according to an embodiment of the present disclosure includes:
a first step of applying a tensile stress to a substrate comprising a first surface and a second surface opposite the first surface and having a first modulus of elasticity to elongate the substrate;
a second step of providing wiring on the first surface side of the base material in an extended state;
a third step of removing the tensile stress from the base material provided with the wiring;
After the tensile stress is removed from the base material, it is located on the second surface side of the base material and is mounted on the wiring board when viewed along the normal direction of the first surface of the base material. a fourth step of providing a protective member having a second elastic modulus at least partially overlapping near the boundary between the end of the electronic component and the wiring,
the wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base;
At least a part of the protective member is, when viewed along the normal direction of the first surface of the base material, part of the bellows-shaped portion of the wiring, the electronic component mounted on the wiring board. A wiring board overlapping a first bellows-shaped portion including a plurality of peaks and valleys arranged along an in-plane direction of the first surface of the base material in the vicinity of the boundary between the end portion and the wiring. manufacturing method.

本開示の実施形態によれば、基材の伸縮に起因して配線基板に不具合が生じることを抑制することができる。 According to the embodiments of the present disclosure, it is possible to suppress the occurrence of defects in the wiring board due to the expansion and contraction of the base material.

一実施の形態に係る配線基板を示す断面図である。1 is a cross-sectional view showing a wiring board according to one embodiment; FIG. 一実施の形態に係る配線基板を示す平面図である。1 is a plan view showing a wiring board according to one embodiment; FIG. 図２の配線基板を線Ｂ－Ｂに沿って切断した場合を示す断面図である。3 is a cross-sectional view showing a case where the wiring board in FIG. 2 is cut along line BB; FIG. 図１に示す配線基板の配線及びその周辺の構成要素の一例を拡大して示す断面図である。2 is an enlarged cross-sectional view showing an example of wiring of the wiring board shown in FIG. 1 and its surrounding components; FIG. 図１に示す配線基板の配線及びその周辺の構成要素のその他の例を拡大して示す断面図である。2 is an enlarged cross-sectional view showing another example of the wiring of the wiring board shown in FIG. 1 and its surrounding components; FIG. 図１に示す配線基板の製造方法を説明するための図である。1. It is a figure for demonstrating the manufacturing method of the wiring board shown in FIG. 第１の変形例に係る配線基板を示す断面図である。FIG. 10 is a cross-sectional view showing a wiring board according to a first modified example; 図７に示す配線基板の配線及びその周辺の構成要素の一例を拡大して示す断面図である。8 is an enlarged cross-sectional view showing an example of the wiring of the wiring board shown in FIG. 7 and its surrounding components; FIG. 図７に示す配線基板の製造方法を説明するための図である。8 is a diagram for explaining a method of manufacturing the wiring board shown in FIG. 7; FIG. 一変形例に係る配線基板を示す断面図である。FIG. 11 is a cross-sectional view showing a wiring board according to a modified example; 第２の変形例に係る配線基板の配線及びその周辺の構成要素の一例を拡大して示す断面図である。FIG. 11 is an enlarged cross-sectional view showing an example of wiring and peripheral components of a wiring board according to a second modification; 図１１に示す配線基板の製造方法を説明するための図である。12A and 12B are diagrams for explaining a method of manufacturing the wiring board shown in FIG. 11; FIG. 第３の変形例に係る配線基板の電子部品の一例を示す断面図である。FIG. 11 is a cross-sectional view showing an example of an electronic component of a wiring board according to a third modified example; 第４の変形例に係る配線基板の電子部品の一例を示す断面図である。FIG. 11 is a cross-sectional view showing an example of an electronic component of a wiring board according to a fourth modified example; 第５の変形例に係る配線基板の電子部品の一例を示す断面図である。FIG. 11 is a cross-sectional view showing an example of an electronic component on a wiring board according to a fifth modification; 第６の変形例に係る配線基板の電子部品の一例を示す断面図である。FIG. 11 is a cross-sectional view showing an example of an electronic component of a wiring board according to a sixth modification; 第７の変形例に係る配線基板の電子部品の一例を示す断面図である。FIG. 21 is a cross-sectional view showing an example of an electronic component on a wiring board according to a seventh modification; 第８の変形例に係る配線基板の電子部品の一例を示す断面図である。FIG. 21 is a cross-sectional view showing an example of an electronic component on a wiring board according to an eighth modification; 第９の変形例に係る配線基板の電子部品の一例を示す断面図である。FIG. 20 is a cross-sectional view showing an example of an electronic component on a wiring board according to a ninth modification; 第１０の変形例に係る配線基板の電子部品の一例を示す断面図である。FIG. 21 is a cross-sectional view showing an example of an electronic component on a wiring board according to a tenth modification; 第１１の変形例に係る配線基板の配線及びその周辺の構成要素の一例を拡大して示す断面図である。FIG. 21 is an enlarged cross-sectional view showing an example of wiring of a wiring board and its peripheral components according to an eleventh modification; 図２１に示す配線基板の製造方法を説明するための図である。22A and 22B are diagrams for explaining a method of manufacturing the wiring board shown in FIG. 21;

以下、本開示の実施形態に係る配線基板の構成及びその製造方法について、図面を参照しながら詳細に説明する。なお、以下に示す実施形態は本開示の実施形態の一例であって、本開示はこれらの実施形態に限定して解釈されるものではない。また、本明細書において、「基板」、「基材」、「シート」や「フィルム」など用語は、呼称の違いのみに基づいて、互いから区別されるものではない。例えば、「基材」は、基板、シートやフィルムと呼ばれ得るような部材も含む概念である。更に、本明細書において用いる、形状や幾何学的条件並びにそれらの程度を特定する、例えば、「平行」や「直交」等の用語や長さや角度の値等については、厳密な意味に縛られることなく、同様の機能を期待し得る程度の範囲を含めて解釈することとする。また、本実施形態で参照する図面において、同一部分または同様な機能を有する部分には同一の符号または類似の符号を付し、その繰り返しの説明は省略する場合がある。また、図面の寸法比率は説明の都合上実際の比率とは異なる場合や、構成の一部が図面から省略される場合がある。 Hereinafter, a configuration of a wiring board and a method for manufacturing the same according to embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments shown below are examples of the embodiments of the present disclosure, and the present disclosure should not be construed as being limited to these embodiments. Also, in this specification, terms such as "substrate", "base material", "sheet" and "film" are not to be distinguished from each other based only on the difference in designation. For example, "base material" is a concept that includes members that can be called substrates, sheets, and films. Furthermore, terms used herein to specify shapes and geometric conditions and their degrees, such as terms such as "parallel" and "perpendicular", length and angle values, etc., are bound by strict meanings. However, it is interpreted to include the extent to which similar functions can be expected. In addition, in the drawings referred to in this embodiment, the same reference numerals or similar reference numerals may be assigned to the same portions or portions having similar functions, and repeated description thereof may be omitted. Also, the dimensional ratios in the drawings may differ from the actual ratios for convenience of explanation, and some of the configurations may be omitted from the drawings.

以下、図１乃至図６を参照して、本開示の一実施の形態について説明する。 An embodiment of the present disclosure will be described below with reference to FIGS. 1 to 6. FIG.

（配線基板）
まず、本実施の形態に係る配線基板１０について説明する。図１は、配線基板１０を示す断面図である。この図１に示す断面図は、図２の配線基板１０を線Ａ－Ａに沿って切断した場合の図である。また、図２は、配線基板１０を基材２０の第１面２１側から見た場合を示す平面図であるが、基材２０の第２面２２側に位置する保護部材Ｘは点線で表されている。また、図３は、図２の配線基板１０を線Ｂ－Ｂに沿って切断した場合を示す断面図である。 (wiring board)
First, the wiring substrate 10 according to this embodiment will be described. FIG. 1 is a cross-sectional view showing a wiring board 10. As shown in FIG. The cross-sectional view shown in FIG. 1 is a view when the wiring board 10 in FIG. 2 is cut along the line AA. FIG. 2 is a plan view showing the wiring board 10 viewed from the side of the first surface 21 of the base material 20. The protective member X located on the side of the second surface 22 of the base material 20 is indicated by a dotted line. It is 3 is a cross-sectional view showing the wiring board 10 of FIG. 2 cut along the line BB.

図１に示す配線基板１０は、基材２０、支持基板４０、電子部品５１、配線５２、保護部材Ｘを備える。以下、配線基板１０の各構成要素について説明する。 A wiring board 10 shown in FIG. Each component of the wiring board 10 will be described below.

〔基材〕
基材２０は、伸縮性を有するよう構成された部材である。基材２０は、電子部品５１及び配線５２側に位置する第１面２１と、第１面２１の反対側に位置する第２面２２と、を含む。基材２０の厚みは、例えば１０ｍｍ以下であり、より好ましくは１ｍｍ以下である。基材２０の厚みを小さくすることにより、基材２０の伸縮に要する力を低減することができる。また、基材２０の厚みを小さくすることにより、配線基板１０を用いた製品全体の厚みを小さくすることができる。これにより、例えば、配線基板１０を用いた製品が、人の腕などの身体の一部に取り付けるセンサである場合に、装着感を低減することができる。基材２０の厚みは、１０μｍ以上であってもよい。 〔Base material〕
The base material 20 is a member configured to have elasticity. The base material 20 includes a first surface 21 located on the electronic component 51 and wiring 52 side, and a second surface 22 located on the opposite side of the first surface 21 . The thickness of the base material 20 is, for example, 10 mm or less, and more preferably 1 mm or less. By reducing the thickness of the base material 20, the force required for the expansion and contraction of the base material 20 can be reduced. Moreover, by reducing the thickness of the base material 20, the thickness of the entire product using the wiring board 10 can be reduced. As a result, for example, when the product using the wiring board 10 is a sensor attached to a part of the body such as an arm of a person, it is possible to reduce the wearing feeling. The thickness of the base material 20 may be 10 μm or more.

基材２０の伸縮性を表すパラメータの例として、基材２０の弾性係数を挙げることができる。基材２０の弾性係数は、例えば１０ＭＰａ以下であり、より好ましくは１ＭＰａ以下である。このような弾性係数を有する基材２０を用いることにより、配線基板１０全体に伸縮性を持たせることができる。以下の説明において、基材２０の弾性係数のことを、第１の弾性係数とも称する。基材２０の第１の弾性係数は、１ｋＰａ以上であってもよい。 An example of a parameter representing the stretchability of the base material 20 is the elastic modulus of the base material 20 . The elastic modulus of the base material 20 is, for example, 10 MPa or less, more preferably 1 MPa or less. By using the base material 20 having such an elastic modulus, the wiring board 10 as a whole can be made stretchable. In the following description, the elastic modulus of the base material 20 is also referred to as the first elastic modulus. The first elastic modulus of the base material 20 may be 1 kPa or more.

基材２０の第１の弾性係数を算出する方法としては、基材２０のサンプルを用いて、ＪＩＳ Ｋ６２５１に準拠して引張試験を実施するという方法を採用することができる。また、基材２０のサンプルの弾性係数を、ＩＳＯ１４５７７に準拠してナノインデンテーション法によって測定するという方法を採用することもできる。ナノインデンテーション法において用いる測定器としては、ナノインデンターを用いることができる。基材２０のサンプルを準備する方法としては、配線基板１０から基材２０の一部をサンプルとして取り出す方法や、配線基板１０を構成する前の基材２０の一部をサンプルとして取り出す方法が考えられる。その他にも、基材２０の第１の弾性係数を算出する方法として、基材２０を構成する材料を分析し、材料の既存のデータベースに基づいて基材２０の第１の弾性係数を算出するという方法を採用することもできる。なお、本願における弾性係数は、２５℃の環境下における弾性係数である。 As a method of calculating the first elastic modulus of the base material 20, a method of performing a tensile test in accordance with JIS K6251 using a sample of the base material 20 can be adopted. A method of measuring the elastic modulus of a sample of the base material 20 by a nanoindentation method in compliance with ISO14577 can also be adopted. A nanoindenter can be used as a measuring instrument used in the nanoindentation method. As a method of preparing a sample of the base material 20, a method of taking out a part of the base material 20 from the wiring board 10 as a sample and a method of taking out a part of the base material 20 before forming the wiring board 10 as a sample are considered. be done. In addition, as a method of calculating the first elastic modulus of the base material 20, the material constituting the base material 20 is analyzed, and the first elastic modulus of the base material 20 is calculated based on an existing material database. method can also be adopted. In addition, the elastic modulus in this application is an elastic modulus in a 25 degreeC environment.

基材２０の伸縮性を表すパラメータのその他の例として、基材２０の曲げ剛性を挙げることができる。曲げ剛性は、対象となる部材の断面二次モーメントと、対象となる部材を構成する材料の弾性係数との積であり、単位はＮ・ｍ２又はＰａ・ｍ４である。基材２０の断面二次モーメントは、配線基板１０の伸縮方向に直交する平面によって、基材２０のうち配線５２と重なっている部分を切断した場合の断面に基づいて算出される。以下の説明において、基材２０の曲げ剛性のことを、第１の曲げ剛性とも称する。 Another example of the parameter representing the stretchability of the base material 20 is the flexural rigidity of the base material 20 . The bending stiffness is the product of the area moment of inertia of the target member and the elastic modulus of the material constituting the target member, and the unit is N·m 2 or Pa·m 4 . The geometrical moment of inertia of the base material 20 is calculated based on a cross section obtained by cutting a portion of the base material 20 that overlaps the wiring 52 with a plane perpendicular to the expansion/contraction direction of the wiring board 10 . In the following description, the flexural rigidity of the base material 20 is also referred to as the first flexural rigidity.

基材２０を構成する材料の例としては、例えば、エラストマーを挙げることができる。また、基材２０の材料として、例えば、織物、編物、不織布などの布を用いることもできる。エラストマーとしては、一般的な熱可塑性エラストマーおよび熱硬化性エラストマーを用いることができ、具体的には、ポリウレタン系エラストマー、スチレン系エラストマー、ニトリル系エラストマー、オレフィン系エラストマー、塩ビ系エラストマー、エステル系エラストマー、アミド系エラストマー、１，２－ＢＲ系エラストマー、フッ素系エラストマー、シリコーンゴム、ウレタンゴム、フッ素ゴム、ポリブタジエン、ポリイソブチレン、ポリスチレンブタジエン、ポリクロロプレン等を用いることができる。機械的強度や耐磨耗性を考慮すると、ウレタン系エラストマーを用いることが好ましい。また、基材２０がシリコーンを含んでいてもよい。シリコーンは、耐熱性・耐薬品性・難燃性に優れており、基材２０の材料として好ましい。 Examples of materials that constitute the base material 20 include elastomers. As the material of the base material 20, for example, cloth such as woven fabric, knitted fabric, and non-woven fabric can also be used. As the elastomer, general thermoplastic elastomers and thermosetting elastomers can be used. Specifically, polyurethane-based elastomers, styrene-based elastomers, nitrile-based elastomers, olefin-based elastomers, vinyl chloride-based elastomers, ester-based elastomers, Amide elastomers, 1,2-BR elastomers, fluorine elastomers, silicone rubbers, urethane rubbers, fluorine rubbers, polybutadiene, polyisobutylene, polystyrene butadiene, polychloroprene and the like can be used. Considering mechanical strength and abrasion resistance, it is preferable to use a urethane-based elastomer. Moreover, the base material 20 may contain silicone. Silicone is excellent in heat resistance, chemical resistance, and flame resistance, and is preferable as a material for the base material 20 .

〔保護部材〕
保護部材Ｘは、基材２０の伸縮を制御するために配線基板１０に設けられた部材である。図１に示す例において、保護部材Ｘは、基材２０の第１面２１側に位置する。 [Protective material]
The protection member X is a member provided on the wiring board 10 to control expansion and contraction of the base material 20 . In the example shown in FIG. 1 , the protective member X is positioned on the first surface 21 side of the base material 20 .

保護部材Ｘは、例えば、基材２０の第１の弾性係数よりも大きい弾性係数を有する。保護部材Ｘの弾性係数は、例えば１ＧＰａ以上であり、より好ましくは１０ＧＰａ以上である。保護部材Ｘの弾性係数は、基材２０の第１の弾性係数の１００倍以上であってもよく、１０００倍以上であってもよい。このような保護部材Ｘを基材２０に設けることにより、基材２０のうち保護部材Ｘと重なる部分が伸縮することを抑制することができる。これにより、基材２０を、伸縮が生じやすい部分と、伸縮が生じにくい部分とに区画することができる。以下の説明において、保護部材Ｘの弾性係数のことを、第２の弾性係数とも称する。保護部材Ｘの第２の弾性係数は、５００ＧＰａ以下であってもよい。また、保護部材Ｘの第２の弾性係数は、基材２０の第１の弾性係数の５０００００倍以下であってもよい。なお、「重なる」とは、基材２０の第１面２１の法線方向に沿って見た場合に２つの構成要素が重なることを意味している。
なお、上述のように、保護部材Ｘは、基材２０の第１の弾性係数よりも大きい弾性係数を有する場合に限られず、伸縮を抑制できれば、基材２０の第１の弾性係数よりも、小さくても、若しくは、同じでもよい。保護部材Ｘの弾性係数が基材２０の第１の弾性係数よりも大きければ、当該保護部材Ｘを薄くでき、保護部材Ｘの弾性係数が基材２０の第１の弾性係数よりも小さければ、当該保護部材Ｘを厚くすることで、伸縮を抑制することができる。 The protective member X has, for example, an elastic modulus greater than the first elastic modulus of the base material 20 . The elastic modulus of the protective member X is, for example, 1 GPa or more, more preferably 10 GPa or more. The elastic modulus of the protection member X may be 100 times or more, or 1000 times or more, the first elastic modulus of the base material 20 . By providing such a protective member X on the base material 20, expansion and contraction of the portion of the base material 20 that overlaps the protective member X can be suppressed. As a result, the base material 20 can be divided into a portion that easily expands and contracts and a portion that does not easily expand and contract. In the following description, the elastic modulus of the protection member X is also referred to as the second elastic modulus. The second elastic modulus of the protection member X may be 500 GPa or less. Also, the second elastic modulus of the protective member X may be 500000 times or less the first elastic modulus of the base material 20 . Note that “overlapping” means that two components overlap when viewed along the normal direction of the first surface 21 of the base material 20 .
In addition, as described above, the protective member X is not limited to having an elastic modulus larger than the first elastic modulus of the base material 20, and as long as expansion and contraction can be suppressed, It can be smaller or the same. If the elastic modulus of the protective member X is greater than the first elastic modulus of the base material 20, the protective member X can be made thinner. By increasing the thickness of the protective member X, expansion and contraction can be suppressed.

保護部材Ｘの第２の弾性係数を算出する方法は、保護部材Ｘの形態に応じて適宜定められる。例えば、保護部材Ｘの第２の弾性係数を算出する方法は、上述の基材２０の弾性係数を算出する方法と同様であってもよく、異なっていてもよい。後述する支持基板４０の弾性係数も同様である。例えば、保護部材Ｘ又は支持基板４０の弾性係数を算出する方法として、保護部材Ｘ又は支持基板４０のサンプルを用いて、ＡＳＴＭ Ｄ８８２に準拠して引張試験を実施するという方法を採用することができる。 A method for calculating the second modulus of elasticity of the protective member X is appropriately determined according to the form of the protective member X. FIG. For example, the method of calculating the second elastic modulus of the protection member X may be the same as or different from the method of calculating the elastic modulus of the base material 20 described above. The same applies to the elastic modulus of the support substrate 40, which will be described later. For example, as a method of calculating the elastic modulus of the protective member X or the support substrate 40, a method of performing a tensile test according to ASTM D882 using a sample of the protective member X or the support substrate 40 can be adopted. .

また、保護部材Ｘは、基材２０の第１の曲げ剛性よりも大きい曲げ剛性を有する。保護部材Ｘの曲げ剛性は、基材２０の第１の曲げ剛性の１００倍以上であってもよく、１０００倍以上であってもよい。以下の説明において、保護部材Ｘの曲げ剛性のことを、第２の曲げ剛性とも称する。 In addition, the protection member X has bending rigidity greater than the first bending rigidity of the base material 20 . The bending rigidity of the protection member X may be 100 times or more, or may be 1000 times or more, the first bending rigidity of the base material 20 . In the following description, the flexural rigidity of the protective member X is also referred to as the second flexural rigidity.

保護部材Ｘは、例えば、硬化性樹脂で構成されている。そして、保護部材Ｘを構成する材料の具体例としては、一般的な熱可塑性及び熱硬化性のエラストマー、アクリル系、ウレタン系、エポキシ系、ポリエステル系、エポキシ系、ビニルエーテル系、ポリエン・チオール系、シリコーン系等のオリゴマー、ポリマー等を挙げることができる。また、保護部材Ｘを構成する材料の他の例としては、金属材料を含む金属層を用いてもよい。金属材料の例としては、銅、アルミニウム、ステンレス鋼等を挙げることができる。保護部材Ｘの厚みは、例えば１０μｍ以上である。 The protection member X is made of, for example, a curable resin. Specific examples of materials constituting the protective member X include general thermoplastic and thermosetting elastomers, acrylic, urethane, epoxy, polyester, epoxy, vinyl ether, polyene/thiol, Oligomers such as silicones, polymers, and the like can be mentioned. As another example of the material forming the protective member X, a metal layer containing a metal material may be used. Examples of metal materials include copper, aluminum, stainless steel, and the like. The thickness of the protective member X is, for example, 10 μm or more.

また、保護部材Ｘを構成する材料として、オリゴマー又はポリマーを用いる場合、保護部材Ｘは、透明性を有していてもよい。また、保護部材Ｘは、遮光性、例えば紫外線を遮蔽する特性を有していてもよい。例えば、保護部材Ｘは黒色であってもよい。また、保護部材Ｘの色と基材２０の色とが同一であってもよい。 Moreover, when using an oligomer or a polymer as a material constituting the protective member X, the protective member X may have transparency. In addition, the protective member X may have a light shielding property, for example, a property of shielding ultraviolet rays. For example, the protective member X may be black. Moreover, the color of the protective member X and the color of the base material 20 may be the same.

なお、保護部材Ｘと電子部品５１及び配線５２との位置関係については、後に詳細に説明する。 The positional relationship between the protective member X, the electronic component 51, and the wiring 52 will be described in detail later.

〔支持基板〕
支持基板４０は、基材２０よりも低い伸縮性を有するよう構成された板状の部材である。支持基板４０は、基材２０側に位置する第２面４２と、第２面４２の反対側に位置する第１面４１と、を含む。図１に示す例において、支持基板４０は、その第１面４１側において電子部品５１及び配線５２を支持している。また、支持基板４０は、その第２面４２側において基材２０の第１面に接合されている。例えば、基材２０と支持基板４０との間に、接着剤を含む接着層６０が設けられていてもよい。接着層６０を構成する材料としては、例えばアクリル系接着剤、シリコーン系接着剤等を用いることができる。接着層６０の厚みは、例えば５μｍ以上且つ２００μｍ以下である。また、図１０に示すように、常温接合又は分子接着によって支持基板４０の第２面４２が基材２０の第１面２１に接合されていてもよい。この場合、基材２０と支持基板４０との間に接着層が設けられていなくてもよい。また、基材２０の第１面２１又は支持基板４０の第２面４２の一方又は両方に、常温接合、分子接着の接着性を向上させるプライマー層を設けてもよい。 [Supporting substrate]
The support substrate 40 is a plate-like member configured to have lower stretchability than the base material 20 . The support substrate 40 includes a second surface 42 located on the substrate 20 side and a first surface 41 located on the opposite side of the second surface 42 . In the example shown in FIG. 1, the support substrate 40 supports the electronic component 51 and the wiring 52 on the first surface 41 side. Also, the support substrate 40 is bonded to the first surface of the base material 20 on the second surface 42 side thereof. For example, an adhesive layer 60 containing an adhesive may be provided between the base material 20 and the support substrate 40 . As a material forming the adhesive layer 60, for example, an acrylic adhesive, a silicone adhesive, or the like can be used. The thickness of the adhesive layer 60 is, for example, 5 μm or more and 200 μm or less. Alternatively, as shown in FIG. 10, the second surface 42 of the support substrate 40 may be bonded to the first surface 21 of the base material 20 by room temperature bonding or molecular bonding. In this case, an adhesive layer may not be provided between the base material 20 and the support substrate 40 . In addition, a primer layer that improves room-temperature bonding and molecular adhesion may be provided on one or both of the first surface 21 of the base material 20 and the second surface 42 of the support substrate 40 .

後述するように、支持基板４０に接合された基材２０から引張応力が取り除かれて基材２０が収縮するとき、支持基板４０には蛇腹形状部が形成される。支持基板４０の特性や寸法は、このような蛇腹形状部が形成され易くなるよう設定されている。例えば、支持基板４０は、基材２０の第１の弾性係数よりも大きい弾性係数を有する。以下の説明において、支持基板４０の弾性係数のことを、第３の弾性係数とも称する。 As will be described later, when the tensile stress is removed from the substrate 20 bonded to the support substrate 40 and the substrate 20 contracts, the support substrate 40 forms a bellows-shaped portion. The characteristics and dimensions of the support substrate 40 are set so as to facilitate the formation of such a bellows-shaped portion. For example, the support substrate 40 has an elastic modulus greater than the first elastic modulus of the substrate 20 . In the following description, the elastic modulus of the support substrate 40 is also referred to as the third elastic modulus.

支持基板４０の第３の弾性係数は、例えば１００ＭＰａ以上であり、より好ましくは１ＧＰａ以上である。支持基板４０の第３の弾性係数は、基材２０の第１の弾性係数の１００倍以上であってもよく、１０００倍以上であってもよい。また、支持基板４０の厚みは、例えば１０μｍ以下であり、より好ましくは５μｍ以下である。支持基板４０の弾性係数を高くしたり、支持基板４０の厚みを小さくしたりすることにより、基材２０の収縮に伴って支持基板４０に蛇腹形状部が形成され易くなる。支持基板４０を構成する材料としては、例えば、ポリエチレンナフタレート、ポリイミド、ポリカーボネート、アクリル樹脂、ポリエチレンテレフタラート等を用いることができる。 The third elastic modulus of the support substrate 40 is, for example, 100 MPa or more, more preferably 1 GPa or more. The third elastic modulus of the support substrate 40 may be 100 times or more, or 1000 times or more, the first elastic modulus of the base material 20 . Also, the thickness of the support substrate 40 is, for example, 10 μm or less, and more preferably 5 μm or less. By increasing the elastic modulus of the supporting substrate 40 or decreasing the thickness of the supporting substrate 40, the bellows-shaped portion is easily formed in the supporting substrate 40 as the base material 20 shrinks. Examples of materials that can be used for the support substrate 40 include polyethylene naphthalate, polyimide, polycarbonate, acrylic resin, and polyethylene terephthalate.

支持基板４０の第３の弾性係数は、基材２０の第１の弾性係数の１００倍以下であってもよい。支持基板４０の第３の弾性係数を算出する方法は、基材２０の場合と同様である。また、支持基板４０の厚みは、５００ｎｍ以上であってもよい。 The third modulus of elasticity of the support substrate 40 may be 100 times or less the first modulus of elasticity of the substrate 20 . The method for calculating the third elastic modulus of the support substrate 40 is the same as for the base material 20 . Moreover, the thickness of the support substrate 40 may be 500 nm or more.

〔電子部品〕
図１に示す例において、電子部品５１は、配線５２に接続される電極を少なくとも有する。電子部品５１は、能動部品であってもよく、受動部品であってもよく、機構部品であってもよい。 [Electronic parts]
In the example shown in FIG. 1 , electronic component 51 has at least electrodes connected to wiring 52 . The electronic component 51 may be an active component, a passive component, or a mechanical component.

電子部品５１の例としては、トランジスタ、ＬＳＩ(Large-Scale Integration)、ＭＥＭＳ(Micro Electro Mechanical Systems)、リレー、ＬＥＤ、ＯＬＥＤ、ＬＣＤなどの発光素子、センサ、ブザー等の発音部品、振動を発する振動部品、冷却発熱をコントロールするペルチェ素子や電熱線などの冷発熱部品、抵抗器、キャパシタ、インダクタ、圧電素子、スイッチ、コネクタなどを挙げることができる。電子部品５１の上述の例のうち、センサが好ましく用いられる。センサとしては、例えば、温度センサ、圧力センサ、光センサ、光電センサ、近接センサ、せん断力センサ、生体センサ、レーザーセンサ、マイクロ波センサ、湿度センサ、歪みセンサ、ジャイロセンサ、加速度センサ、変位センサ、磁気センサ、ガスセンサ、GPSセンサ、超音波センサ、臭いセンサ、脳波センサ、電流センサ、振動センサ、脈波センサ、心電センサ、光度センサ等を挙げることができる。これらのセンサのうち、生体センサが特に好ましい。生体センサは、心拍や脈拍、心電、血圧、体温、血中酸素濃度等の生体情報を測定することができる。 Examples of the electronic components 51 include transistors, LSIs (Large-Scale Integration), MEMS (Micro Electro Mechanical Systems), relays, LEDs, OLEDs, light-emitting elements such as LCDs, sensors, sound-generating components such as buzzers, and vibrations that generate vibrations. Components, cooling/heating components such as Peltier elements and heating wires for controlling cooling heat generation, resistors, capacitors, inductors, piezoelectric elements, switches, connectors, and the like can be mentioned. Of the above examples of electronic components 51, sensors are preferably used. Examples of sensors include temperature sensors, pressure sensors, optical sensors, photoelectric sensors, proximity sensors, shear force sensors, biological sensors, laser sensors, microwave sensors, humidity sensors, strain sensors, gyro sensors, acceleration sensors, displacement sensors, A magnetic sensor, a gas sensor, a GPS sensor, an ultrasonic sensor, an odor sensor, an electroencephalogram sensor, a current sensor, a vibration sensor, a pulse wave sensor, an electrocardiogram sensor, a light intensity sensor, and the like can be mentioned. Of these sensors, biosensors are particularly preferred. A biological sensor can measure biological information such as heartbeat, pulse, electrocardiogram, blood pressure, body temperature, and blood oxygen concentration.

〔配線〕
配線５２は、電子部品５１の電極に接続された、導電性を有する部材である。例えば図１に示すように、配線５２は、基材の第１面２１側に位置し、配線５２の一端及び他端が、２つの電子部品５１の電極にそれぞれ接続されている。図１に示すように、複数の配線５２が２つの電子部品５１の間に設けられていてもよい。 〔wiring〕
The wiring 52 is a conductive member connected to the electrodes of the electronic component 51 . For example, as shown in FIG. 1, the wiring 52 is located on the first surface 21 side of the substrate, and one end and the other end of the wiring 52 are connected to the electrodes of the two electronic components 51, respectively. As shown in FIG. 1, multiple wirings 52 may be provided between two electronic components 51 .

後述するように、支持基板４０に接合された基材２０から引張応力が取り除かれて基材２０が収縮するとき、配線５２は蛇腹状に変形する。この点を考慮し、好ましくは、配線５２は、変形に対する耐性を有する構造を備える。例えば、配線５２は、ベース材と、ベース材の中に分散された複数の導電性粒子とを有する。この場合、ベース材として、樹脂などの変形可能な材料を用いることにより、基材２０の伸縮に応じて配線５２も変形することができる。また、変形が生じた場合であっても複数の導電性粒子の間の接触が維持されるように導電性粒子の分布や形状を設定することにより、配線５２の導電性を維持することができる。 As will be described later, when the tensile stress is removed from the base material 20 joined to the support substrate 40 and the base material 20 contracts, the wiring 52 deforms into a bellows shape. With this in mind, the wiring 52 preferably has a structure that is resistant to deformation. For example, line 52 has a base material and a plurality of conductive particles dispersed within the base material. In this case, by using a deformable material such as resin as the base material, the wiring 52 can also be deformed according to the expansion and contraction of the base material 20 . In addition, the conductivity of the wiring 52 can be maintained by setting the distribution and shape of the conductive particles so that the contact between the plurality of conductive particles is maintained even when deformation occurs. .

配線５２のベース材を構成する材料としては、例えば、一般的な熱可塑性エラストマーおよび熱硬化性エラストマーを用いることができ、例えば、スチレン系エラストマー、アクリル系エラストマー、オレフィン系エラストマー、ウレタン系エラストマー、シリコーンゴム、ウレタンゴム、フッ素ゴム、ニトリルゴム、ポリブタジエン、ポリクロロプレン等を用いることができる。中でも、ウレタン系、シリコーン系構造を含む樹脂やゴムが、その伸縮性や耐久性などの面から好ましく用いられる。また、配線５２の導電性粒子を構成する材料としては、例えば銀、銅、金、ニッケル、パラジウム、白金、カーボン等の粒子を用いることができる。中でも、銀粒子が、価格と導電性の観点から好ましく用いられる。 As a material constituting the base material of the wiring 52, for example, general thermoplastic elastomers and thermosetting elastomers can be used. Rubber, urethane rubber, fluororubber, nitrile rubber, polybutadiene, polychloroprene, and the like can be used. Among them, resins and rubbers containing urethane-based or silicone-based structures are preferably used in terms of stretchability and durability. Also, as a material forming the conductive particles of the wiring 52, particles such as silver, copper, gold, nickel, palladium, platinum, and carbon can be used. Among them, silver particles are preferably used from the viewpoint of price and conductivity.

なお、配線５２に求められることは、蛇腹形状部５７の解消及び生成を利用して基材２０の伸張及び収縮に追従することである。この点を考慮すると、配線５２の材料としては、上述のようにそれ自体が変形性や伸縮性を有しているものだけでなく、それ自体は変形性や伸縮性を有していないものも採用可能である。 Note that the wiring 52 is required to follow the expansion and contraction of the base material 20 by utilizing the elimination and generation of the bellows-shaped portion 57 . Considering this point, the material of the wiring 52 is not limited to the material that itself has deformability and stretchability as described above, but also the material that itself does not have deformability and stretchability. Adoptable.

配線５２に用いられ得る、それ自体は伸縮性を有さない材料としては、例えば、金、銀、銅、アルミニウム、白金、クロム等の金属や、これらの金属を含む合金が挙げられる。配線５２の材料自体が伸縮性を有さない場合、配線５２としては、金属膜を用いることができる。 Examples of materials that can be used for the wiring 52 and that do not have elasticity per se include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. A metal film can be used as the wiring 52 when the material of the wiring 52 itself does not have elasticity.

配線５２の厚みは、基材２０の伸縮に耐え得る厚みであればよく、配線５２の材料等に応じて適宜選択される。
例えば、配線５２の材料が伸縮性を有さない場合、配線５２の厚みは、２５ｎｍ以上５０μｍ以下の範囲内とすることができ、５０ｎｍ以上１０μｍ以下の範囲内であることが好ましく、１００ｎｍ以上５μｍ以下の範囲内であることがより好ましい。
また、配線５２の材料が伸縮性を有する場合、配線５２の厚みは、５μｍ以上６０μｍ以下の範囲内とすることができ、１０μｍ以上５０μｍ以下の範囲内であることが好ましく、２０μｍ以上４０μｍ以下の範囲内であることがより好ましい。配線５２の幅は、例えば５０μｍ以上且つ１０ｍｍ以下である。 The thickness of the wiring 52 may be any thickness that can withstand expansion and contraction of the base material 20, and is appropriately selected according to the material of the wiring 52 and the like.
For example, when the material of the wiring 52 does not have stretchability, the thickness of the wiring 52 can be in the range of 25 nm or more and 50 μm or less, preferably 50 nm or more and 10 μm or less, and 100 nm or more and 5 μm. It is more preferable to be within the following range.
Further, when the material of the wiring 52 has elasticity, the thickness of the wiring 52 can be in the range of 5 μm or more and 60 μm or less, preferably in the range of 10 μm or more and 50 μm or less, and 20 μm or more and 40 μm or less. It is more preferable to be within the range. The width of the wiring 52 is, for example, 50 μm or more and 10 mm or less.

〔配線の構造〕
続いて、配線５２の断面構造について、図４を参照して詳細に説明する。図４は、図１に示す配線基板１０の配線５２及びその周辺の構成要素の一例を拡大して示す断面図である。 [Wiring structure]
Next, the cross-sectional structure of the wiring 52 will be described in detail with reference to FIG. FIG. 4 is a cross-sectional view showing an enlarged example of the wiring 52 of the wiring board 10 shown in FIG. 1 and its surrounding components.

図１乃至図３に示すように、配線５２の大部分は、保護部材Ｘと重ならないように配置されている。このため、基材２０に収縮などの変形が生じたとき、配線５２は、基材２０の変形に伴って変形し易い。例えば、伸長させた状態の基材２０に配線５２を設けた後、基材２０を弛緩させると、図４に示すように、蛇腹形状部が生じる。この蛇腹形状部のうち、第１蛇腹形状部５７１は、基材２０の第１面２１の法線方向に沿って見た場合に配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚに生じるものである。一方、第２蛇腹形状部５７２は、電子部品５１から境界近傍Ｚよりも離れた領域における、配線５２のうち保護部材Ｘと重なっていない部分に生じる規則的な形状のものである。 As shown in FIGS. 1 to 3, most of the wiring 52 is arranged so as not to overlap the protective member X. As shown in FIGS. Therefore, when deformation such as shrinkage occurs in the base material 20 , the wiring 52 is likely to be deformed along with the deformation of the base material 20 . For example, if the wiring 52 is provided on the stretched base material 20 and then the base material 20 is relaxed, a bellows-shaped portion is produced as shown in FIG. Of these bellows-shaped portions, the first bellows-shaped portion 571 is located between the end portion of the electronic component 51 mounted on the wiring board 10 and the wiring 52 when viewed along the normal line direction of the first surface 21 of the base material 20 . is generated near the boundary Z with . On the other hand, the second bellows-shaped portion 572 has a regular shape that occurs in a portion of the wiring 52 that does not overlap with the protective member X in a region away from the electronic component 51 by the vicinity Z of the boundary.

上述のように、配線５２は、例えば、図４に示すように、基材２０の第１面２１の面内方向に沿って並ぶ複数の山部及び谷部を含む第１及び第２蛇腹形状部５７１、５７２を有する。なお、例えば、図４に示すように、配線５２の蛇腹形状部は、第１面２１の法線方向に沿って見た場合に電子部品５１と基材２０との間に、設けられていない。 As described above, the wiring 52 has, for example, first and second bellows shapes including a plurality of peaks and valleys arranged along the in-plane direction of the first surface 21 of the base material 20, as shown in FIG. It has parts 571 and 572 . For example, as shown in FIG. 4, the bellows-shaped portion of the wiring 52 is not provided between the electronic component 51 and the base material 20 when viewed along the normal direction of the first surface 21. .

また、第１及び第２蛇腹形状部５７１、５７２は、基材２０の第１面２１の法線方向における山部５３１、５３２及び谷部５５１、５５２を含む。 Also, the first and second bellows-shaped portions 571 and 572 include peak portions 531 and 532 and valley portions 551 and 552 in the normal direction of the first surface 21 of the base material 20 .

図４において、符号５３１、５３２は、配線５２の表面に現れる山部を表し、符号５４１、５４２は、配線５２の裏面に現れる山部を表す。また、符号５５１、５５２は、配線５２の表面に現れる谷部を表し、符号５６１、５６２は、配線５２の裏面に現れる谷部を表す。表面とは、配線５２の面のうち基材２０から遠い側に位置する面であり、裏面とは、配線５２の面のうち基材２０に近い側に位置する面である。 In FIG. 4 , reference numerals 531 and 532 represent peaks appearing on the surface of the wiring 52 , and reference numerals 541 and 542 represent peaks appearing on the back surface of the wiring 52 . Reference numerals 551 and 552 denote valleys appearing on the surface of the wiring 52, and reference numerals 561 and 562 denote valleys appearing on the back surface of the wiring 52. FIG. The front surface is the surface of the wiring 52 that is farther from the substrate 20 , and the back surface is the surface of the wiring 52 that is closer to the substrate 20 .

また、図４において、符号２６１、２６２及び２７１、２７２は、基材２０の第１面２１に現れる山部及び谷部を表す。第１面２１に山部２６１、２６２及び谷部２７１、２７２が現れるように基材２０が変形することにより、配線５２が蛇腹状に変形して蛇腹形状部を有するようになる。基材２０の第１面２１の山部２６１、２６２が、配線５２の第１及び第２蛇腹形状部５７１、５７２の山部５３１、５３２、５４１、５４２に対応し、基材２０の第１面２１の谷部２７１、２７２が、配線５２の第１及び第２蛇腹形状部５７１、５７２の谷部５５１、５５２、５６１、５６２に対応している。 4, reference numerals 261, 262 and 271, 272 represent peaks and valleys appearing on the first surface 21 of the base material 20. As shown in FIG. By deforming the base material 20 so that the peaks 261 and 262 and the valleys 271 and 272 appear on the first surface 21, the wiring 52 is deformed into a bellows shape and has a bellows-shaped portion. The ridges 261 and 262 of the first surface 21 of the substrate 20 correspond to the ridges 531 , 532 , 541 and 542 of the first and second accordion-shaped portions 571 and 572 of the wiring 52 , and the first The troughs 271 and 272 of the surface 21 correspond to the troughs 551 , 552 , 561 and 562 of the first and second bellows-shaped portions 571 and 572 of the wiring 52 .

第２蛇腹形状部５７２の山部５３２、５４２及び谷部５５２、５６２は、基材２０の第１面２１の面内方向に沿って繰り返し現れる。山部５３２、５４２及び谷部５５２、５６２が繰り返し現れる周期は、例えば１０μｍ以上且つ１００ｍｍ以下である。なお、図４では、第２蛇腹形状部５７２の複数の山部及び谷部が一定の周期で並ぶ例が示されているが、第２蛇腹形状部５７２の複数の山部及び谷部は、第１面２１の面内方向に沿って不規則に並んでいてもよい。 The peaks 532 , 542 and valleys 552 , 562 of the second bellows-shaped portion 572 appear repeatedly along the in-plane direction of the first surface 21 of the base material 20 . The period at which the peaks 532, 542 and the valleys 552, 562 appear repeatedly is, for example, 10 μm or more and 100 mm or less. Note that FIG. 4 shows an example in which the plurality of peaks and valleys of the second accordion-shaped portion 572 are arranged at a constant cycle, but the plurality of peaks and valleys of the second accordion-shaped portion 572 are They may be arranged irregularly along the in-plane direction of the first surface 21 .

図４において、符号Ｓ１は、配線５２の表面における第２蛇腹形状部５７２の振幅を表す。
振幅Ｓ１は、例えば１μｍ以上であり、より好ましくは１０μｍ以上である。振幅Ｓ１を１０μｍ以上とすることにより、基材２０の伸張に追従して配線５２が変形し易くなる。また、振幅Ｓ１は、例えば５００μｍ以下であってもよい。 In FIG. 4 , symbol S1 represents the amplitude of the second bellows-shaped portion 572 on the surface of the wiring 52 .
The amplitude S1 is, for example, 1 μm or more, more preferably 10 μm or more. By setting the amplitude S1 to 10 μm or more, the wiring 52 is easily deformed following the extension of the base material 20 . Also, the amplitude S1 may be, for example, 500 μm or less.

振幅Ｓ１は、例えば、配線５２の長さ方向における一定の範囲にわたって、第２蛇腹形状部５７２の隣り合う山部５３２と谷部５５２との間の、第１面２１の法線方向における距離を測定し、それらの平均を求めることにより算出される。隣り合う山部５３２と谷部５５２との間の距離を測定する測定器としては、レーザー顕微鏡などを用いた非接触式の測定器を用いてもよく、接触式の測定器を用いてもよい。また、断面写真などの画像に基づいて、隣り合う山部５３２と谷部５５２との間の距離を測定してもよい。
なお、配線５２の表面における第１蛇腹形状部５７１の振幅の算出方法も同様である。また、後述する振幅Ｓ２、Ｓ３、Ｓ４の算出方法も同様である。 The amplitude S1 is, for example, the distance in the normal direction of the first surface 21 between the adjacent peaks 532 and valleys 552 of the second bellows-shaped portion 572 over a certain range in the length direction of the wiring 52. It is calculated by taking measurements and averaging them. As a measuring device for measuring the distance between adjacent peaks 532 and valleys 552, a non-contact measuring device using a laser microscope or the like may be used, or a contact measuring device may be used. . Alternatively, the distance between adjacent peaks 532 and valleys 552 may be measured based on an image such as a cross-sectional photograph.
The method of calculating the amplitude of the first bellows-shaped portion 571 on the surface of the wiring 52 is also the same. Further, the calculation method of amplitudes S2, S3, and S4, which will be described later, is the same.

図４において、符号Ｓ２は、配線５２の裏面における第２蛇腹形状部５７２の振幅を表す。振幅Ｓ２は、振幅Ｓ１と同様に、例えば１μｍ以上であり、より好ましくは１０μｍ以上である。また、振幅Ｓ２は、例えば５００μｍ以下であってもよい。 In FIG. 4, symbol S2 represents the amplitude of the second bellows-shaped portion 572 on the back surface of the wiring 52 . Similar to the amplitude S1, the amplitude S2 is, for example, 1 μm or more, more preferably 10 μm or more. Also, the amplitude S2 may be, for example, 500 μm or less.

図４に示すように、支持基板４０、接着層６０や基材２０の第１面２１にも、配線５２と同様の蛇腹形状部が形成されていてもよい。図４において、符号Ｓ３は、基材２０の第１面２１における第２蛇腹形状部５７２の振幅を表す。第１面２１における第２蛇腹形状部５７２は、複数の山部２６２及び谷部２７２を含む。振幅Ｓ３は、例えば１μｍ以上であり、より好ましくは１０μｍ以上である。また、振幅Ｓ３は、例えば５００μｍ以下であってもよい。 As shown in FIG. 4 , the support substrate 40 , the adhesive layer 60 and the first surface 21 of the base material 20 may also have a bellows-shaped portion similar to the wiring 52 . In FIG. 4 , symbol S3 represents the amplitude of the second bellows-shaped portion 572 on the first surface 21 of the base material 20 . The second bellows-shaped portion 572 on the first surface 21 includes a plurality of peaks 262 and valleys 272 . The amplitude S3 is, for example, 1 μm or more, more preferably 10 μm or more. Also, the amplitude S3 may be, for example, 500 μm or less.

なお、例えば、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１の山部５３１と谷部５５１の周期は、配線５２の蛇腹形状部５７１、５７２のうち、配線基板１０に搭載される電子部品５１から境界近傍Ｚよりも離れた領域における配線５２の第２蛇腹形状部５７２の山部５３２と谷部５５２の周期よりも、小さく若しくは大きくなっている。なお、図４の例では、一例として、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１の周期は、配線基板１０に搭載される電子部品５１から境界近傍Ｚよりも離れた領域における配線５２の第２蛇腹形状部５７２の山部５３２と谷部５５２の周期よりも、小さい場合を示しているが、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１の周期が小さいものと大きいものとが混在して、不規則になっていてもよい。 Note that, for example, the period of the peaks 531 and the valleys 551 of the first bellows-shaped portion 571 of the wiring 52 in the vicinity of the boundary Z is the electronic component mounted on the wiring board 10 among the bellows-shaped portions 571 and 572 of the wiring 52 . It is smaller or larger than the period of the peaks 532 and the valleys 552 of the second bellows-shaped portion 572 of the wiring 52 in the region away from the border vicinity Z from the wiring 51 . In the example of FIG. 4, as an example, the period of the first bellows-shaped portion 571 of the wiring 52 in the vicinity Z of the boundary is the same as that of the wiring 52 in the area away from the electronic component 51 mounted on the wiring board 10 from the vicinity Z of the boundary. , the period of the first bellows-shaped portion 571 of the wiring 52 in the vicinity of the boundary Z is smaller than the period of the peaks 532 and the valleys 552 of the second bellows-shaped portion 572. may be mixed and irregular.

また、例えば、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１の山部５３１と谷部５５１の振幅は、配線５２の第２蛇腹形状部５７２の山部５３２と谷部５５２の振幅よりも、小さく若しくは大きくなっている。なお、図４の例では、一例として、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１の振幅は、配線基板１０に搭載される電子部品５１から境界近傍Ｚよりも離れた領域における配線５２の第２蛇腹形状部５７２の山部５３２と谷部５５２の振幅よりも、大きい場合を示しているが、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１の振幅が小さいものと大きいものとが混在して、不規則になってもよい。 Further, for example, the amplitude of the peaks 531 and the valleys 551 of the first bellows-shaped portion 571 of the wiring 52 near the boundary Z is larger than the amplitude of the peaks 532 and the valleys 552 of the second bellows-shaped portion 572 of the wiring 52. , becoming smaller or larger. In the example of FIG. 4, as an example, the amplitude of the first bellows-shaped portion 571 of the wiring 52 in the vicinity Z of the boundary is the same as that of the wiring 52 in a region farther from the electronic component 51 mounted on the wiring board 10 than the vicinity Z of the boundary. shows a case where the amplitude of the peaks 532 and the valleys 552 of the second bellows-shaped portion 572 is larger than the amplitude of the first bellows-shaped portion 571 of the wiring 52 near the boundary Z may be mixed and irregular.

この第１蛇腹形状部５７１は、第２蛇腹形状部５７２よりも、不規則な形状を有しているため、伸縮すると、当該第１蛇腹形状部５７１の配線５２が断線する可能性がある。 Since the first bellows-shaped portion 571 has a more irregular shape than the second bellows-shaped portion 572, there is a possibility that the wiring 52 of the first bellows-shaped portion 571 is disconnected when it is stretched.

なお、図５は、図１に示す配線基板１０の配線５２及びその周辺の構成要素のその他の例を拡大して示す断面図である。図５に示すように、基材２０の第１面２１には蛇腹形状部が形成されていなくてもよい。 FIG. 5 is an enlarged cross-sectional view showing another example of the wiring 52 of the wiring board 10 shown in FIG. 1 and its surrounding components. As shown in FIG. 5, the first surface 21 of the base material 20 may not have the bellows-shaped portion.

次に、図４や図５に示す蛇腹形状部の第２蛇腹形状部５７２が配線５２に形成されていることの利点について説明する。上述のように、基材２０は、１０ＭＰａ以下の弾性係数を有する。このため、配線基板１０に引張応力を加えた場合、基材２０は、弾性変形によって伸長することができる。ここで、仮に配線５２も同様に弾性変形によって伸長すると、配線５２の全長が増加し、配線５２の断面積が減少するので、配線５２の抵抗値が増加してしまう。また、配線５２の弾性変形に起因して配線５２にクラックなどの破損が生じてしまうことも考えられる。 Next, the advantage of forming the second bellows-shaped portion 572 of the bellows-shaped portion shown in FIGS. 4 and 5 on the wiring 52 will be described. As described above, the base material 20 has an elastic modulus of 10 MPa or less. Therefore, when a tensile stress is applied to the wiring board 10, the base material 20 can be elongated by elastic deformation. Here, if the wiring 52 is similarly stretched by elastic deformation, the total length of the wiring 52 increases and the cross-sectional area of the wiring 52 decreases, so that the resistance value of the wiring 52 increases. Moreover, it is conceivable that damage such as cracks may occur in the wiring 52 due to elastic deformation of the wiring 52 .

これに対して、本実施の形態においては、配線５２が蛇腹形状部の第２蛇腹形状部５７２を有している。このため、基材２０が伸張する際、配線５２は、第２蛇腹形状部５７２の起伏を低減するように変形することによって、すなわち蛇腹形状を解消することによって、基材２０の伸張に追従することができる。このため、基材２０の伸張に伴って配線５２の全長が増加することや、配線５２の断面積が減少することを抑制することができる。このことにより、配線基板１０の伸張に起因して配線５２の抵抗値が増加することを抑制することができる。また、配線５２にクラックなどの破損が生じてしまうことを抑制することができる。 On the other hand, in the present embodiment, the wiring 52 has the second bellows-shaped portion 572 of the bellows-shaped portion. Therefore, when the base material 20 is stretched, the wiring 52 follows the expansion of the base material 20 by deforming to reduce the undulation of the second accordion-shaped portion 572, that is, by eliminating the accordion shape. be able to. Therefore, it is possible to suppress an increase in the total length of the wiring 52 and a decrease in the cross-sectional area of the wiring 52 due to the extension of the base material 20 . As a result, it is possible to suppress an increase in the resistance value of the wiring 52 due to the extension of the wiring board 10 . In addition, it is possible to suppress the occurrence of damage such as cracks in the wiring 52 .

〔保護部材Ｘの電子部品５１及び配線５２との位置関係〕
次に、保護部材Ｘについて、電子部品５１及び配線５２との位置関係に基づいて説明する。 [Positional relationship between protective member X and electronic component 51 and wiring 52]
Next, the protective member X will be described based on the positional relationship between the electronic component 51 and the wiring 52. FIG.

図１及び図２に示すように、保護部材Ｘは、基材２０の第１面２１側に位置する。そして、この保護部材Ｘは、基材２０の第１面２１の法線方向に沿って見た場合に電子部品５１と少なくとも部分的に重なるように配置されている。好ましくは、保護部材Ｘは、基材２０の第１面２１の法線方向に沿って見た場合に電子部品５１の全域にわたって電子部品５１に重なっている。 As shown in FIGS. 1 and 2 , the protective member X is positioned on the first surface 21 side of the base material 20 . The protection member X is arranged so as to at least partially overlap the electronic component 51 when viewed along the normal direction of the first surface 21 of the base material 20 . Preferably, the protective member X overlaps the electronic component 51 over the entire electronic component 51 when viewed along the normal direction of the first surface 21 of the base material 20 .

そして、保護部材Ｘの少なくとも一部は、例えば、図１に示すように、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１を、直接的に被覆している。なお、保護部材Ｘの少なくとも一部は、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１を、間接的に被覆しているようにしてもよい。そして、保護部材Ｘは、例えば、図１に示すように、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１、及び、境界近傍Ｚから離れた領域における第２蛇腹形状部５７２の少なくとも一部を、連続的に被覆している。 At least part of the protective member X, for example, directly covers the first accordion-shaped portion 571 of the wiring 52 in the vicinity of the boundary Z, as shown in FIG. At least part of the protective member X may indirectly cover the first accordion-shaped portion 571 of the wiring 52 in the vicinity of the boundary Z. The protective member X is, for example, as shown in FIG. are continuously coated.

特に、保護部材Ｘは、例えば、図１に示すように、電子部品５１を基材２０の第１面２１の面内方向に連続して被覆するとともに、配線５２の蛇腹形状部のうち、基材２０の第１面２１の面内方向における、電子部品５１の両方の端部近傍の第１蛇腹形状部５７１を、被覆している。
そして、この保護部材Ｘは、例えば、既述のように、第１の弾性係数よりも大きい第２の弾性係数を有する。 In particular, for example, as shown in FIG. 1, the protective member X continuously covers the electronic component 51 in the in-plane direction of the first surface 21 of the substrate 20, and also It covers the first bellows-shaped portions 571 near both ends of the electronic component 51 in the in-plane direction of the first surface 21 of the material 20 .
The protection member X has, for example, a second elastic modulus larger than the first elastic modulus, as described above.

このため、基材２０のうち電子部品５１と重なる部分、すなわち保護部材Ｘと重なる部分は、基材２０のうち保護部材Ｘと重ならない部分に比べて変形しにくい。これにより、基材２０に引張応力などの力を加えたときや、基材２０から引張応力などの力を取り除いたときなどに、基材２０のうち電子部品５１と重なる部分に変形が生じることを抑制することができる。このことにより、基材２０の変形に起因する応力が電子部品５１に加わることを抑制することができ、電子部品５１が変形したり破損したりしてしまうことを抑制することができる。また、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。 Therefore, the portion of the base material 20 that overlaps the electronic component 51 , that is, the portion that overlaps the protection member X is less likely to deform than the portion of the base material 20 that does not overlap the protection member X. Accordingly, when a force such as a tensile stress is applied to the base material 20 or when a force such as a tensile stress is removed from the base material 20, the portion of the base material 20 that overlaps the electronic component 51 is not deformed. can be suppressed. As a result, it is possible to suppress the application of stress to the electronic component 51 caused by the deformation of the base material 20 , thereby suppressing the deformation or breakage of the electronic component 51 . Moreover, it is possible to prevent damage to the electrical joint between the electronic component 51 and the wiring 52 .

特に、この保護部材Ｘは、既述のように、基材２０の第１面２１の法線方向に沿って見た場合に配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚに少なくとも部分的に重なっている。 In particular, as described above, the protective member X is designed so that when viewed along the normal direction of the first surface 21 of the base material 20, the ends of the electronic components 51 mounted on the wiring board 10 and the wiring 52 are separated from each other. at least partially overlaps Z near the boundary of .

より詳しくは、保護部材Ｘの少なくとも一部は、配線の蛇腹形状部のうち、配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚにおける、基材２０の第１面２１の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部５７１を、直接的に若しくは間接的に被覆している。 More specifically, at least a portion of the protective member X is formed in the bellows-shaped portion of the wiring, in the vicinity of the boundary Z between the end of the electronic component 51 mounted on the wiring substrate 10 and the wiring 52, of the base material 20. It directly or indirectly covers the first bellows-shaped portion 571 including a plurality of peaks and valleys arranged along the in-plane direction of the surface 21 .

このため、伸縮することを前提とする第２蛇腹形状部５７２よりも、振幅が大きく若しくは小さく、そして、周期が大きく若しくは小さい、すなわち、不規則な第１蛇腹形状部５７１が、保護部材Ｘにより被覆されて第１蛇腹形状部５７１の形状が固定されることとなる。この不規則な第１蛇腹形状部５７１は、第２蛇腹形状部５７２よりも、不規則な形状を有しているため、伸縮すると当該第１蛇腹形状部５７１の配線５２が断線する可能性があるが、このように保護部材Ｘにより被覆されて第１蛇腹形状部５７１の形状が固定されることにより、第１蛇腹形状部５７１における配線５２の断線を抑制することができ、配線５２の耐久性を向上することができる。 Therefore, the irregular first bellows-shaped portion 571, which has a larger or smaller amplitude and a larger or smaller period than the second bellows-shaped portion 572, which is supposed to expand and contract, is protected by the protective member X. The shape of the first bellows-shaped portion 571 is fixed by being covered. Since the irregular first bellows-shaped portion 571 has a more irregular shape than the second bellows-shaped portion 572, there is a possibility that the wiring 52 of the first bellows-shaped portion 571 will break when it expands and contracts. However, since the shape of the first bellows-shaped portion 571 is fixed by being covered with the protective member X in this way, disconnection of the wiring 52 in the first bellows-shaped portion 571 can be suppressed, and the durability of the wiring 52 can be improved. can improve sexuality.

（配線基板の製造方法）
以下、図６（ａ）～（ｄ）を参照して、配線基板１０の製造方法について説明する。 (Method for manufacturing wiring board)
A method of manufacturing the wiring board 10 will be described below with reference to FIGS.

まず、基材２０を準備する基材準備工程を実施する。本実施の形態においては、基材準備工程において、図６（ａ）に示すように、第１面２１及び第１面２１の反対側に位置する第２面２２を含み、第１の弾性係数を有する基材２０を準備する。 First, a substrate preparation step for preparing the substrate 20 is performed. In this embodiment, in the base material preparation step, as shown in FIG. A substrate 20 having is prepared.

また、第１面４１及び第１面４１の反対側に位置する第２面４２を含み、第１の弾性係数よりも大きい第３の弾性係数を有する支持基板４０を準備し、支持基板４０の第１面４１に配線を設ける支持基板４０を準備する支持基板準備工程を実施する。本実施の形態においては、支持基板準備工程において、図６（ｂ）に示すように、支持基板４０の第１面４１に電子部品５１及び配線５２を設ける。配線５２を設ける方法としては、例えば、ベース材及び導電性粒子を含む導電性ペーストを支持基板４０の第１面４１に印刷する方法を採用することができる。
このように、本実施形態においては、基材２０の第１面２１側に配線５２を設けた後であって、基材２０の第１面２１側に保護部材Ｘを設ける前に、配線５２が設けられた支持基板４０の第１面４１に、配線５２に電気的に接続される電極を有する電子部品５１を、基材２０の第１面側に設ける電子部品搭載工程を実施する。 Also, a support substrate 40 including a first surface 41 and a second surface 42 located on the opposite side of the first surface 41 and having a third elastic modulus larger than the first elastic modulus is prepared. A support substrate preparation step is performed to prepare the support substrate 40 in which the wiring is provided on the first surface 41 . In the present embodiment, in the support substrate preparation step, electronic components 51 and wiring 52 are provided on the first surface 41 of the support substrate 40 as shown in FIG. 6B. As a method of providing the wiring 52, for example, a method of printing a conductive paste containing a base material and conductive particles on the first surface 41 of the support substrate 40 can be adopted.
Thus, in the present embodiment, after the wiring 52 is provided on the first surface 21 side of the base material 20 and before the protection member X is provided on the first surface 21 side of the base material 20, the wiring 52 An electronic component mounting step is performed to provide electronic components 51 having electrodes electrically connected to wirings 52 on the first surface 41 of the support substrate 40 provided with the wirings 52 on the first surface side of the substrate 20 .

続いて、基材２０に引張応力Ｔを加えて基材２０を伸長させる第１工程を実施する。基材２０の伸張率は、例えば１０％以上且つ２００％以下である。第１工程は、基材２０を加熱した状態で実施してもよく、常温で実施してもよい。基材２０を加熱する場合、基材２０の温度は例えば５０℃以上且つ１５０℃以下である。 Subsequently, a first step of applying a tensile stress T to the base material 20 to elongate the base material 20 is performed. The elongation rate of the base material 20 is, for example, 10% or more and 200% or less. The first step may be performed while the substrate 20 is heated, or may be performed at room temperature. When heating the base material 20, the temperature of the base material 20 is, for example, 50° C. or higher and 150° C. or lower.

続いて、引張応力Ｔによって伸長した状態の基材２０の第１面２１側に、電子部品５１及び配線５２を設ける第２工程を実施する。本実施の形態の第２工程においては、図６（ｃ）に示すように、伸長した状態の基材２０の第１面２１に、電子部品５１及び配線５２が設けられた支持基板４０を、支持基板４０の第２面４２側から接合させる。この際、基材２０と支持基板４０との間に接着層６０を設けてもよい。 Subsequently, the second step of providing the electronic component 51 and the wiring 52 on the first surface 21 side of the base material 20 in a state of being stretched by the tensile stress T is performed. In the second step of the present embodiment, as shown in FIG. 6C, a support substrate 40 provided with electronic components 51 and wiring 52 is placed on the first surface 21 of the base material 20 in an extended state. Bonding is performed from the second surface 42 side of the support substrate 40 . At this time, an adhesive layer 60 may be provided between the base material 20 and the support substrate 40 .

その後、基材２０から引張応力Ｔを取り除く第３工程を実施する。これにより、図６（ｄ）において矢印Ｃで示すように、基材２０が収縮し、基材２０に接合されている支持基板４０及び配線５２にも変形が生じる。支持基板４０の第３の弾性係数は、基材２０の第１の弾性係数よりも大きい。このため、支持基板４０及び配線５２の変形を、蛇腹形状部の生成として生じさせることができる。 After that, the third step of removing the tensile stress T from the base material 20 is performed. As a result, the base material 20 contracts as indicated by arrow C in FIG. The third elastic modulus of support substrate 40 is greater than the first elastic modulus of base material 20 . Therefore, the deformation of the support substrate 40 and the wiring 52 can be generated as the generation of the bellows-shaped portion.

続いて、基材２０から引張応力Ｔを取り除いた後、基材２０の第１面２１側に位置し、基材２０の第１面２１の法線方向に沿って見た場合に配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚに少なくとも部分的に重なり、第２の弾性係数を有する保護部材Ｘを設ける、第４工程を実施する。 Subsequently, after the tensile stress T is removed from the base material 20, the wiring board 10 is positioned on the first surface 21 side of the base material 20 and viewed along the normal direction of the first surface 21 of the base material 20. A fourth step of providing a protective member X having a second elastic modulus and overlapping at least partially in the vicinity of the boundary Z between the end of the electronic component 51 mounted on the substrate and the wiring 52 is performed.

なお、既述のように、配線５２は、基材２０の第１面２１の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有する。
そして、既述の図４、図５に示すように、保護部材Ｘの少なくとも一部は、配線５２の蛇腹形状部のうち、配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚにおける、基材２０の第１面２１の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部５７１を、被覆している。 In addition, as described above, the wiring 52 has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface 21 of the base material 20 .
As shown in FIGS. 4 and 5, at least part of the protective member X is located between the ends of the electronic component 51 mounted on the wiring board 10 and the wiring 52 in the bellows-shaped portion of the wiring 52 . The first bellows-shaped portion 571 including a plurality of peaks and valleys arranged along the in-plane direction of the first surface 21 of the base material 20 in the vicinity of the boundary Z of the substrate 20 is covered.

ここで、配線５２の第２蛇腹形状部５７２によって得られる、配線５２の抵抗値に関する効果の一例について説明する。ここでは、基材２０の第１面２１の面内方向に沿う引張応力が基材２０に加えられていない第１状態における配線５２の抵抗値を、第１抵抗値と称する。また、基材２０に引張応力を加えて基材２０を第１面２１の面内方向において第１状態に比べて３０％伸長させた第２状態における配線５２の抵抗値を、第２抵抗値と称する。本実施の形態によれば、配線５２に第２蛇腹形状部５７２を形成することにより、第１抵抗値に対する、第１抵抗値と第２抵抗値の差の絶対値の比率を、２０％以下にすることができ、より好ましくは１０％以下にすることができ、更に好ましくは５％以下にすることができる。 Here, an example of the effect on the resistance value of the wiring 52 obtained by the second bellows-shaped portion 572 of the wiring 52 will be described. Here, the resistance value of the wiring 52 in the first state in which the tensile stress along the in-plane direction of the first surface 21 of the base material 20 is not applied to the base material 20 is referred to as the first resistance value. Further, the resistance value of the wiring 52 in the second state in which the base member 20 is stretched by 30% in the in-plane direction of the first surface 21 by applying a tensile stress to the base member 20 as compared with the first state is defined as the second resistance value. called. According to the present embodiment, by forming the second bellows-shaped portion 572 in the wiring 52, the ratio of the absolute value of the difference between the first resistance value and the second resistance value to the first resistance value is reduced to 20% or less. , more preferably 10% or less, and still more preferably 5% or less.

配線基板１０の用途としては、ヘルスケア分野、医療分野、介護分野、エレクトロニクス分野、スポーツ・フィットネス分野、美容分野、モビリティ分野、畜産・ペット分野、アミューズメント分野、ファッション・アパレル分野、セキュリティ分野、ミリタリー分野、流通分野、教育分野、建材・家具・装飾分野、環境エネルギー分野、農林水産分野、ロボット分野などを挙げることができる。例えば、人の腕などの身体の一部に取り付ける製品を、本実施の形態による配線基板１０を用いて構成する。配線基板１０は伸張することができるので、例えば配線基板１０を伸長させた状態で身体に取り付けることにより、配線基板１０を身体の一部により密着させることができる。このため、良好な着用感を実現することができる。また、配線基板１０が伸張した場合に配線５２の抵抗値が低下することを抑制することができるので、配線基板１０の良好な電気特性を実現することができる。他にも配線基板１０は伸長することができるので、人などの生体に限らず曲面や立体形状に沿わせて設置や組込むことが可能である。それらの製品の一例としては、バイタルセンサ、マスク、補聴器、歯ブラシ、絆創膏、湿布、コンタクトレンズ、義手、義足、義眼、カテーテル、ガーゼ、薬液パック、包帯、ディスポーザブル生体電極、おむつ、家電製品、スポーツウェア、リストバンド、はちまき、手袋、水着、サポーター、ボール、ラケット、薬液浸透美容マスク、電気刺激ダイエット用品、懐炉、自動車内装、シート、インパネ、ベビーカー、ドローン、車椅子、タイヤ、首輪、リード、ハプティクスデバイス、ランチョンマット、帽子、服、メガネ、靴、インソール、靴下、ストッキング、インナーウェア、マフラー、耳あて、鞄、アクセサリー、指輪、付け爪、時計、個人ID認識デバイス、ヘルメット、パッケージ、ICタグ、ペットボトル、文具、書籍、カーペット、ソファ、寝具、照明、ドアノブ、花瓶、ベッド、マットレス、座布団、ワイヤレス給電アンテナ、電池、ビニールハウス、ロボットハンド、ロボット外装を挙げることができる。 Applications of the wiring board 10 include the healthcare field, the medical field, the nursing care field, the electronics field, the sports/fitness field, the beauty field, the mobility field, the livestock/pet field, the amusement field, the fashion/apparel field, the security field, and the military field. , distribution, education, building materials/furniture/decoration, environmental energy, agriculture, forestry and fisheries, and robots. For example, a product to be attached to a part of the human body such as an arm is constructed using the wiring board 10 according to the present embodiment. Since the wiring board 10 can be stretched, for example, by attaching the wiring board 10 to the body in a stretched state, the wiring board 10 can be brought into closer contact with a part of the body. Therefore, it is possible to realize a good wearing feeling. Moreover, since it is possible to suppress a decrease in the resistance value of the wiring 52 when the wiring board 10 is stretched, good electrical characteristics of the wiring board 10 can be achieved. In addition, since the wiring board 10 can be stretched, it can be installed or incorporated along a curved surface or a three-dimensional shape as well as a living body such as a human being. Examples of such products include vital sensors, masks, hearing aids, toothbrushes, bandages, poultices, contact lenses, artificial hands, artificial legs, artificial eyes, catheters, gauze, drug packs, bandages, disposable bioelectrodes, diapers, home appliances, and sportswear. , Wristbands, Headbands, Gloves, Swimsuits, Supporters, Balls, Racket, Medical solution penetration beauty masks, Electric stimulation diet products, Pocket hearths, Automobile interiors, Seats, Instrument panels, Strollers, Drones, Wheelchairs, Tires, Collars, Leads, Haptic devices , luncheon mats, hats, clothes, glasses, shoes, insoles, socks, stockings, innerwear, mufflers, earmuffs, bags, accessories, rings, artificial nails, watches, personal ID recognition devices, helmets, packages, IC tags, pets Bottles, stationery, books, carpets, sofas, bedding, lighting, doorknobs, vases, beds, mattresses, cushions, wireless power supply antennas, batteries, vinyl houses, robot hands, and robot exteriors can be mentioned.

なお、上述した実施の形態に対して様々な変更を加えることが可能である。以下、必要に応じて図面を参照しながら、変形例について説明する。以下の説明および以下の説明で用いる図面では、上述した実施の形態と同様に構成され得る部分について、上述の実施の形態における対応する部分に対して用いた符号と同一の符号を用いることとし、重複する説明を省略する。また、上述した実施の形態において得られる作用効果が変形例においても得られることが明らかである場合、その説明を省略することもある。 Various modifications can be made to the above-described embodiment. Modifications will be described below with reference to the drawings as necessary. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding portions in the above-described embodiment are used for the portions that can be configured in the same manner as in the above-described embodiment, Duplicate explanations are omitted. Further, when it is clear that the effects obtained in the above-described embodiment can also be obtained in the modified example, the explanation thereof may be omitted.

（第１の変形例）
上述の実施の形態においては、電子部品５１及び配線５２が、基材２０の第１の弾性係数よりも高い第３の弾性係数を有する支持基板４０によって支持される例を示したが、これに限られることはない。
図７は、第１の変形例に係る配線基板を示す断面図である。この図７に示すように、電子部品５１及び配線５２は、基材２０の第１面２１に設けられていてもよい。 (First modification)
In the above-described embodiment, the electronic component 51 and the wiring 52 are supported by the support substrate 40 having the third elastic modulus higher than the first elastic modulus of the base material 20. never limited.
FIG. 7 is a cross-sectional view showing a wiring board according to a first modified example. As shown in FIG. 7 , the electronic component 51 and the wiring 52 may be provided on the first surface 21 of the base material 20 .

図８は、図７に示す配線基板１０の配線５２及びその周辺の構成要素の一例を拡大して示す断面図である。本変形例においても、上述の実施の形態の場合と同様に、保護部材Ｘの少なくとも一部は、配線の蛇腹形状部のうち、配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚにおける、基材２０の第１面２１の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部５７１を、被覆している。
このため、伸縮することを前提とする第２蛇腹形状部５７２よりも振幅が大きく周期が小さい第１蛇腹形状部５７１が、保護部材Ｘにより被覆されて第１蛇腹形状部５７１の形状が固定されることとなる。この振幅が大きく周期が小さい第１蛇腹形状部５７１は、第２蛇腹形状部５７２よりも、不規則な形状を有しているため、伸縮すると当該第１蛇腹形状部５７１の配線５２が断線する可能性があるが、このように保護部材Ｘにより被覆されて第１蛇腹形状部５７１の形状が固定されることにより、第１蛇腹形状部５７１における配線５２の断線を抑制することができ、配線５２の耐久性を向上することができる。
また、配線５２のうち保護部材Ｘと重なっていない部分には第２蛇腹形状部５７２が形成されている。このため、基材２０の変形に伴って配線５２の全長が増加することや、配線５２の断面積が減少することを抑制することができる。 FIG. 8 is an enlarged cross-sectional view showing an example of the wiring 52 of the wiring board 10 shown in FIG. 7 and its surrounding components. Also in this modification, as in the above-described embodiment, at least a portion of the protective member X is located between the end portion of the electronic component 51 mounted on the wiring board 10 and the wiring 52 among the bellows-shaped portions of the wiring. It covers the first bellows-shaped portion 571 including a plurality of peaks and valleys arranged along the in-plane direction of the first surface 21 of the base material 20 in the vicinity of the boundary Z between and.
Therefore, the first bellows-shaped portion 571, which has a larger amplitude and a smaller period than the second bellows-shaped portion 572, which is supposed to expand and contract, is covered with the protective member X, and the shape of the first bellows-shaped portion 571 is fixed. The Rukoto. The first bellows-shaped portion 571, which has a large amplitude and a small period, has a more irregular shape than the second bellows-shaped portion 572. Therefore, when the first bellows-shaped portion 571 expands and contracts, the wiring 52 of the first bellows-shaped portion 571 breaks. Although there is a possibility, since the shape of the first bellows-shaped portion 571 is fixed by being covered with the protective member X in this way, disconnection of the wiring 52 in the first bellows-shaped portion 571 can be suppressed, and the wiring can be prevented from breaking. The durability of 52 can be improved.
A second bellows-shaped portion 572 is formed in a portion of the wiring 52 that does not overlap with the protective member X. As shown in FIG. Therefore, it is possible to suppress an increase in the total length of the wiring 52 and a decrease in the cross-sectional area of the wiring 52 due to the deformation of the base material 20 .

図９（ａ）～（ｄ）は、図７に示す配線基板１０の製造方法を説明するための図である。 9A to 9D are diagrams for explaining a method of manufacturing the wiring board 10 shown in FIG.

まず、図９（ａ）に示すように、基材２０を準備する基材準備工程を実施する。本変形例においては、基材準備工程において、図９（ａ）に示すように、第１面２１及び第１面２１の反対側に位置する第２面２２を含み、第１の弾性係数を有する基材２０を準備する。 First, as shown in FIG. 9(a), a substrate preparation step for preparing the substrate 20 is performed. In this modification, in the base material preparation step, as shown in FIG. A base material 20 is prepared.

続いて、図９（ｂ）に示すように、基材２０に引張応力Ｔを加えて基材２０を伸長させる第１工程を実施する。続いて、図９（ｃ）に示すように、引張応力Ｔによって伸長した状態の基材２０の第１面２１に、電子部品５１及び配線５２を設ける第２工程を実施する。 Subsequently, as shown in FIG. 9(b), a first step of applying a tensile stress T to the base material 20 to elongate the base material 20 is performed. Subsequently, as shown in FIG. 9C, the second step of providing the electronic component 51 and the wiring 52 on the first surface 21 of the base material 20 in a state of being stretched by the tensile stress T is performed.

その後、基材２０から引張応力Ｔを取り除く第３工程を実施する。これにより、図９（ｄ）において矢印Ｃで示すように、基材２０が収縮し、基材２０に設けられている配線５２にも変形が生じる。
続いて、基材２０から引張応力Ｔを取り除いた後、基材２０の第１面２１側に位置し、基材２０の第１面２１の法線方向に沿って見た場合に配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚに少なくとも部分的に重なり、第２の弾性係数を有する保護部材Ｘを設ける、第４工程を実施する。 After that, the third step of removing the tensile stress T from the base material 20 is performed. As a result, the base material 20 contracts, and the wiring 52 provided on the base material 20 is also deformed, as indicated by arrow C in FIG. 9(d).
Subsequently, after the tensile stress T is removed from the base material 20, the wiring board 10 is positioned on the first surface 21 side of the base material 20 and viewed along the normal direction of the first surface 21 of the base material 20. A fourth step of providing a protective member X having a second elastic modulus and overlapping at least partially in the vicinity of the boundary Z between the end of the electronic component 51 mounted on the substrate and the wiring 52 is performed.

なお、本変形例においては、保護部材Ｘは、基材２０の第１面２１の法線方向に沿って見た場合に配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚに少なくとも部分的に重なっている。 In addition, in this modification, the protective member X is positioned between the end portion of the electronic component 51 mounted on the wiring board 10 and the wiring 52 when viewed along the normal direction of the first surface 21 of the base material 20 . It at least partially overlaps the border neighborhood Z.

より詳しくは、保護部材Ｘの少なくとも一部は、配線の蛇腹形状部のうち、配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚにおける、基材２０の第１面２１の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部５７１を、直接的に若しくは間接的に被覆している。 More specifically, at least a portion of the protective member X is formed in the bellows-shaped portion of the wiring, in the vicinity of the boundary Z between the end of the electronic component 51 mounted on the wiring substrate 10 and the wiring 52, of the base material 20. It directly or indirectly covers the first bellows-shaped portion 571 including a plurality of peaks and valleys arranged along the in-plane direction of the surface 21 .

このため、伸縮することを前提とする第２蛇腹形状部５７２よりも不規則な第１蛇腹形状部５７１が、保護部材Ｘにより被覆されて第１蛇腹形状部５７１の形状が固定されることとなる。 Therefore, the first bellows-shaped portion 571, which is more irregular than the second bellows-shaped portion 572, which is supposed to expand and contract, is covered with the protective member X, and the shape of the first bellows-shaped portion 571 is fixed. Become.

この不規則な第１蛇腹形状部５７１は、第２蛇腹形状部５７２よりも、不規則な形状を有しているため、伸縮すると当該第１蛇腹形状部５７１の配線５２が断線する可能性があるが、このように保護部材Ｘにより被覆されて第１蛇腹形状部５７１の形状が固定されることにより、第１蛇腹形状部５７１における配線５２の断線を抑制することができ、配線５２の耐久性を向上することができる。 Since the irregular first bellows-shaped portion 571 has a more irregular shape than the second bellows-shaped portion 572, there is a possibility that the wiring 52 of the first bellows-shaped portion 571 will break when it expands and contracts. However, since the shape of the first bellows-shaped portion 571 is fixed by being covered with the protective member X in this way, disconnection of the wiring 52 in the first bellows-shaped portion 571 can be suppressed, and the durability of the wiring 52 can be improved. can improve sexuality.

（第２の変形例）
上述の実施の形態及び第１の変形例においては、引張応力Ｔによって伸長した状態の基材２０の第１面２１側に、電子部品５１及び配線５２を設けることで、配線基板１０を構成する例を示した。この場合、電子部品５１の端部と配線５２との境界近傍Ｚでは、蛇腹形状部の形状が不規則になる。しかしながら、これに限られることはなく、引張応力Ｔによって伸長した状態の基材２０の第１面２１側に配線５２を設け、基材２０から引張応力Ｔを取り除いた後に基材２０の第１面２１側に電子部品５１を設けることで、配線基板１０を構成するもよい。この場合、電子部品５１の端部と配線５２との境界近傍Ｚでは、蛇腹形状部の形状が規則的になる。 (Second modification)
In the above-described embodiment and the first modification, the wiring board 10 is configured by providing the electronic components 51 and the wiring 52 on the first surface 21 side of the base material 20 that is stretched by the tensile stress T. I gave an example. In this case, in the vicinity Z of the boundary between the end of the electronic component 51 and the wiring 52, the shape of the accordion-shaped portion becomes irregular. However, it is not limited to this, and the wiring 52 is provided on the first surface 21 side of the base material 20 in a state of being stretched by the tensile stress T, and after the tensile stress T is removed from the base material 20, the first surface of the base material 20 The wiring substrate 10 may be configured by providing the electronic component 51 on the surface 21 side. In this case, in the vicinity Z of the boundary between the end of the electronic component 51 and the wiring 52, the shape of the accordion-shaped portion becomes regular.

図１１は、第２の変形例に係る配線基板１０の配線５２及びその周辺の構成要素の一例を拡大して示す断面図である。この図１１に示すように、引張応力Ｔによって伸長した状態の基材２０の第１面２１側に配線５２を設け、基材２０から引張応力Ｔを取り除いた後に基材２０の第１面２１側に電子部品５１を設けることで、配線基板１０が構成されている。 FIG. 11 is a cross-sectional view showing an enlarged example of the wiring 52 of the wiring board 10 and its peripheral components according to the second modification. As shown in FIG. 11 , the wiring 52 is provided on the first surface 21 side of the base material 20 stretched by the tensile stress T, and after the tensile stress T is removed from the base material 20 , the first surface 21 of the base material 20 is connected. The wiring board 10 is configured by providing the electronic component 51 on the side.

配線５２の蛇腹形状部は、第１及び第２蛇腹形状部５７１、５７２に加えて、基材２０と配線基板１０に搭載される電子部品５１との間に位置するとともに、第１面２１の法線方向に沿って見た場合に電子部品５１と配線５２と重なる部分に、基材２０の第１面２１の面内方向に沿って並ぶ複数の山部及び谷部を含む第３蛇腹形状部５７３を、さらに含む。
そして、保護部材Ｘの少なくとも一部は、基材２０と配線基板１０に搭載される電子部品５１との間の領域において、第３蛇腹形状部５７３を、被覆している。 In addition to the first and second bellows-shaped portions 571 and 572, the bellows-shaped portion of the wiring 52 is located between the base material 20 and the electronic component 51 mounted on the wiring board 10, and is located on the first surface 21. A third bellows shape including a plurality of peaks and valleys aligned along the in-plane direction of the first surface 21 of the base material 20 in a portion overlapping the electronic component 51 and the wiring 52 when viewed along the normal direction. A portion 573 is further included.
At least part of the protective member X covers the third bellows-shaped portion 573 in the region between the base material 20 and the electronic component 51 mounted on the wiring board 10 .

また、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１の山部と谷部の周期は、配線５２の蛇腹形状部のうち、配線基板１０に搭載される電子部品５１から境界近傍Ｚよりも離れた領域における配線５２の第２蛇腹形状部５７２の山部と谷部の周期と、同じになっている。
また、境界近傍Ｚにおける配線５２の第１蛇腹形状部５７１の山部と谷部の振幅は、配線５２の第２蛇腹形状部５７２の山部５３２と谷部５５２の振幅と、同じになっている。 Further, the period of peaks and valleys of the first bellows-shaped portion 571 of the wiring 52 in the vicinity of the boundary Z is greater than that of the vicinity of the boundary Z from the electronic component 51 mounted on the wiring board 10 in the bellows-shaped portion of the wiring 52 . The period of peaks and valleys of the second bellows-shaped portion 572 of the wiring 52 in the remote region is the same.
In addition, the amplitude of the peaks and valleys of the first bellows-shaped portion 571 of the wiring 52 near the boundary Z is the same as the amplitude of the peaks 532 and the valleys 552 of the second bellows-shaped portion 572 of the wiring 52 . there is

特に、第１、第２、及び第３蛇腹形状部５７１、５７２、５７３は、基材２０から引張応力Ｔを取り除くときに電子部品５１が基材２０に設けられていないため、それらの形状が同様になる。すなわち、例えば、図１１に示すように、第１、第２、及び第３蛇腹形状部５７１、５７２、５７３の山部と谷部の周期は、同じになっており、第１、第２、及び第３蛇腹形状部５７１、５７２、５７３の山部と谷部の振幅は、同じになっている。 In particular, the first, second, and third bellows-shaped portions 571, 572, 573 are not provided with the electronic component 51 when the tensile stress T is removed from the substrate 20, so their shapes are be the same. That is, for example, as shown in FIG. 11, the peaks and valleys of the first, second, and third bellows-shaped portions 571, 572, 573 have the same period. And the peaks and valleys of the third bellows-shaped portions 571, 572, and 573 have the same amplitude.

また、保護部材Ｘの少なくとも一部は、例えば、図１１に示すように、第１及び第３蛇腹形状部５７１、５７３を、直接的に被覆している。 Moreover, at least part of the protective member X directly covers the first and third bellows-shaped portions 571 and 573, as shown in FIG. 11, for example.

このように、本変形例においても、配線５２が蛇腹形状部の第２蛇腹形状部５７２を有している。このため、基材２０が伸張する際、配線５２は、第２蛇腹形状部５７２の起伏を低減するように変形することによって、すなわち蛇腹形状を解消することによって、基材２０の伸張に追従することができる。このため、基材２０の伸張に伴って配線５２の全長が増加することや、配線５２の断面積が減少することを抑制することができる。このことにより、配線基板１０の伸張に起因して配線５２の抵抗値が増加することを抑制することができる。また、配線５２にクラックなどの破損が生じてしまうことを抑制することができる。 Thus, in this modification, the wiring 52 also has the second bellows-shaped portion 572 of the bellows-shaped portion. Therefore, when the base material 20 is stretched, the wiring 52 follows the expansion of the base material 20 by deforming to reduce the undulation of the second accordion-shaped portion 572, that is, by eliminating the accordion shape. be able to. Therefore, it is possible to suppress an increase in the total length of the wiring 52 and a decrease in the cross-sectional area of the wiring 52 due to the extension of the base material 20 . As a result, it is possible to suppress an increase in the resistance value of the wiring 52 due to the extension of the wiring board 10 . In addition, it is possible to suppress the occurrence of damage such as cracks in the wiring 52 .

また、基材２０のうち電子部品５１と重なる部分、すなわち保護部材Ｘと重なる部分は、基材２０のうち保護部材Ｘと重ならない部分に比べて変形しにくい。これにより、基材２０に引張応力などの力を加えたときや、基材２０から引張応力などの力を取り除いたときなどに、基材２０のうち電子部品５１と重なる部分に変形が生じることを抑制することができる。このことにより、基材２０の変形に起因する応力が電子部品５１に加わることを抑制することができ、電子部品５１が変形したり破損したりしてしまうことを抑制することができる。また、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。 In addition, the portion of the base material 20 that overlaps the electronic component 51 , that is, the portion that overlaps the protection member X is less likely to deform than the portion of the base material 20 that does not overlap the protection member X. Accordingly, when a force such as a tensile stress is applied to the base material 20 or when a force such as a tensile stress is removed from the base material 20, the portion of the base material 20 that overlaps the electronic component 51 is not deformed. can be suppressed. As a result, it is possible to suppress the application of stress to the electronic component 51 caused by the deformation of the base material 20 , thereby suppressing the deformation or breakage of the electronic component 51 . Moreover, it is possible to prevent damage to the electrical joint between the electronic component 51 and the wiring 52 .

特に、第１及び第３蛇腹形状部５７１、５７３が、保護部材Ｘにより被覆されて第１及び第３蛇腹形状部５７１、５７３の形状が固定されることとなる。これにより、第１及び第３蛇腹形状部５７１、５７３における配線５２の断線を抑制することができ、配線５２の耐久性を向上することができる。 In particular, the first and third bellows-shaped portions 571 and 573 are covered with the protective member X so that the shapes of the first and third bellows-shaped portions 571 and 573 are fixed. As a result, disconnection of the wiring 52 at the first and third bellows-shaped portions 571 and 573 can be suppressed, and the durability of the wiring 52 can be improved.

（配線基板の製造方法）
以下、図１２（ａ）～（ｄ）を参照して、第２の変形例に係る配線基板１０の製造方法について説明する。 (Method for manufacturing wiring board)
A method of manufacturing the wiring board 10 according to the second modification will be described below with reference to FIGS.

まず、基材２０を準備する基材準備工程を実施する。本変形例においては、基材準備工程において、図１２（ａ）に示すように、第１面２１及び第１面２１の反対側に位置する第２面２２を含み、第１の弾性係数を有する基材２０を準備する。 First, a substrate preparation step for preparing the substrate 20 is performed. In this modification, in the base material preparation step, as shown in FIG. A base material 20 is prepared.

また、第１面４１及び第１面４１の反対側に位置する第２面４２を含み、第１の弾性係数よりも大きい第３の弾性係数を有する支持基板４０を準備し、支持基板４０の第１面４１に配線を設ける支持基板４０を準備する支持基板準備工程を実施する。本実施の形態においては、支持基板準備工程において、図１２（ｂ）に示すように、支持基板４０の第１面４１に配線５２を設ける。配線５２を設ける方法としては、例えば、ベース材及び導電性粒子を含む導電性ペーストを支持基板４０の第１面４１に印刷する方法を採用することができる。 Also, a support substrate 40 including a first surface 41 and a second surface 42 located on the opposite side of the first surface 41 and having a third elastic modulus larger than the first elastic modulus is prepared. A support substrate preparation step is performed to prepare the support substrate 40 in which the wiring is provided on the first surface 41 . In the present embodiment, in the supporting substrate preparation step, wirings 52 are provided on the first surface 41 of the supporting substrate 40, as shown in FIG. 12(b). As a method of providing the wiring 52, for example, a method of printing a conductive paste containing a base material and conductive particles on the first surface 41 of the support substrate 40 can be adopted.

続いて、基材２０に引張応力Ｔを加えて、基材２０を伸長させる第１工程を実施する。基材２０の伸張率は、例えば１０％以上且つ２００％以下である。第１工程は、基材２０を加熱した状態で実施してもよく、常温で実施してもよい。基材２０を加熱する場合、基材２０の温度は例えば５０℃以上且つ１５０℃以下である。 Subsequently, a first step of applying a tensile stress T to the base material 20 to elongate the base material 20 is performed. The elongation rate of the base material 20 is, for example, 10% or more and 200% or less. The first step may be performed while the substrate 20 is heated, or may be performed at room temperature. When heating the base material 20, the temperature of the base material 20 is, for example, 50° C. or higher and 150° C. or lower.

続いて、引張応力Ｔによって伸長した状態の基材２０の第１面２１側に、配線５２を設ける第２工程を実施する。本実施の形態の第２工程においては、図１２（ｃ）に示すように、伸長した状態の基材２０の第１面２１に、配線５２が設けられた支持基板４０を、支持基板４０の第２面４２側から接合させる。この際、基材２０と支持基板４０との間に接着層６０を設けてもよい。 Subsequently, a second step of providing the wiring 52 on the first surface 21 side of the base material 20 stretched by the tensile stress T is performed. In the second step of this embodiment, as shown in FIG. Join from the second surface 42 side. At this time, an adhesive layer 60 may be provided between the base material 20 and the support substrate 40 .

その後、配線５２が設けられた基材２０から引張応力Ｔを取り除く第３工程を実施する。これにより、図１２（ｄ）において矢印Ｃで示すように、基材２０が収縮し、基材２０に接合されている支持基板４０及び配線５２にも変形が生じる。支持基板４０の第３の弾性係数は、基材２０の第１の弾性係数よりも大きい。このため、支持基板４０及び配線５２の変形を、蛇腹形状部の生成として生じさせることができる。 After that, the third step of removing the tensile stress T from the base material 20 provided with the wiring 52 is performed. As a result, the base material 20 contracts as indicated by arrow C in FIG. The third elastic modulus of support substrate 40 is greater than the first elastic modulus of base material 20 . Therefore, the deformation of the support substrate 40 and the wiring 52 can be generated as the generation of the bellows-shaped portion.

続いて、基材２０から引張応力Ｔを取り除いた後、基材２０の第１面２１側に位置し、基材２０の第１面２１の法線方向に沿って見た場合に配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚに少なくとも部分的に重なり、第２の弾性係数を有する保護部材Ｘを設ける、第４工程を実施する。 Subsequently, after the tensile stress T is removed from the base material 20, the wiring board 10 is positioned on the first surface 21 side of the base material 20 and viewed along the normal direction of the first surface 21 of the base material 20. A fourth step of providing a protective member X having a second elastic modulus and overlapping at least partially in the vicinity of the boundary Z between the end of the electronic component 51 mounted on the substrate and the wiring 52 is performed.

特に、本実施形態においては、基材２０から引張応力Ｔを取り除いた後であって、基材２０の第１面２１側に保護部材Ｘを設ける前に、配線５２が設けられた支持基板４０の第１面４１に、配線５２に電気的に接続される電極を有する電子部品５１を、基材２０の第１面側に設ける電子部品搭載工程を実施する。 In particular, in the present embodiment, after the tensile stress T is removed from the base material 20 and before the protective member X is provided on the first surface 21 side of the base material 20, the support substrate 40 provided with the wiring 52 is removed. An electronic component mounting step is performed to provide an electronic component 51 having an electrode electrically connected to the wiring 52 on the first surface 41 of the substrate 20 on the first surface side of the substrate 20 .

なお、既述のように、配線５２は、基材２０の第１面２１の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有する。 In addition, as described above, the wiring 52 has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface 21 of the base material 20 .

そして、既述のように、保護部材Ｘの少なくとも一部は、配線５２の蛇腹形状部のうち、配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚにおける、基材２０の第１面２１の面内方向に沿って並ぶ複数の山部及び谷部を含む第１及び第３蛇腹形状部５７１、５７３を、被覆することとなる。
これにより、本変形例によっても、配線５２に第２蛇腹形状部５７２を形成することにより、応力が加えられたときの配線５２の抵抗値の変化を低減することができる。 As described above, at least part of the protective member X is formed in the bellows-shaped portion of the wiring 52 in the vicinity of the boundary Z between the end of the electronic component 51 mounted on the wiring board 10 and the wiring 52 . The first and third bellows-shaped portions 571 and 573 including a plurality of peaks and valleys arranged along the in-plane direction of the first surface 21 of the material 20 are covered.
Thus, even in this modification, by forming the second bellows-shaped portion 572 in the wiring 52, the change in the resistance value of the wiring 52 when stress is applied can be reduced.

特に、第１及び第３蛇腹形状部５７１、５７３が、保護部材Ｘにより被覆されて第１及び第３蛇腹形状部５７１、５７３の形状が固定されることとなる。これにより、第１及び第３蛇腹形状部５７１、５７３における配線５２の断線を抑制することができ、配線５２の耐久性を向上することができる。 In particular, the first and third bellows-shaped portions 571 and 573 are covered with the protective member X so that the shapes of the first and third bellows-shaped portions 571 and 573 are fixed. As a result, disconnection of the wiring 52 at the first and third bellows-shaped portions 571 and 573 can be suppressed, and the durability of the wiring 52 can be improved.

（第３の変形例）
上述の実施の形態及び第１の変形例においては、電子部品５１が、配線基板１０に実装される前の段階で予めパッケージ化されたものである例を示した。しかしながら、これに限られることはなく、電子部品５１は、電子部品５１の構成要素の一部が配線基板１０に実装された後、一部の構成要素を封止することによって構成されるものであってもよい。 (Third modification)
In the embodiment and the first modified example described above, the electronic component 51 is prepackaged before being mounted on the wiring board 10 . However, the present invention is not limited to this, and the electronic component 51 is configured by sealing some of the constituent elements after mounting some of the constituent elements of the electronic component 51 on the wiring board 10 . There may be.

例えば、図１３に示すように、電子部品５１は、チップ５１３と、補強部材５１５と、を有するようにしてもよい。そして、チップ５１３は、基材２０の第１面２１側に位置し、第１面５１３ａ及び第１面５１３ａの反対側に位置する第２面５１３ｂを含む。
また、補強部材５１５は、チップ５１３の少なくとも一部を被覆している。なお、補強部材５１５は、例えば、ポッティングにより、液状の樹脂を滴下して、チップ５１３を覆うように形成される。なお、補強部材５１５としては、ウレタン樹脂、エポキシ樹脂などの樹脂を用いることができる。 For example, the electronic component 51 may have a chip 513 and a reinforcing member 515, as shown in FIG. The chip 513 is located on the side of the first surface 21 of the substrate 20 and includes a first surface 513a and a second surface 513b located on the opposite side of the first surface 513a.
Also, the reinforcing member 515 covers at least a portion of the tip 513 . The reinforcing member 515 is formed to cover the chip 513 by dripping a liquid resin, for example, by potting. Note that resin such as urethane resin and epoxy resin can be used as the reinforcing member 515 .

図１３に示すように、補強部材５１５は、チップ５１３の外縁よりも外側にまで広がるよう設けられる。これにより、基材２０の変形に起因する応力がチップ５１３に加わることを抑制することができ、チップ５１３が変形したり破損したりしてしまうことを抑制することができる。 As shown in FIG. 13, the reinforcing member 515 is provided so as to extend beyond the outer edge of the chip 513 . As a result, stress caused by the deformation of the base material 20 can be suppressed from being applied to the tip 513, and deformation and breakage of the tip 513 can be suppressed.

そして、保護部材Ｘの少なくとも一部は、補強部材５１５を介してチップ５１３を被覆している。なお、保護部材Ｘは、例えば、ポッティングにより、液状の樹脂を滴下して、電子部品５１を覆うように形成される。
これにより、図１３に示すように、保護部材Ｘは、チップ５１３の外縁よりも外側にまで広がるよう設けられる。これにより、基材２０の変形に起因する応力が電子部品５１に加わることを抑制することができ、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。 At least part of the protection member X covers the tip 513 via the reinforcement member 515 . In addition, the protective member X is formed so as to cover the electronic component 51 by dripping a liquid resin by potting, for example.
Thereby, as shown in FIG. 13, the protective member X is provided so as to extend beyond the outer edge of the chip 513 . As a result, it is possible to suppress the application of stress to the electronic component 51 due to the deformation of the base material 20, and to suppress the breakage of the electrical joint between the electronic component 51 and the wiring 52. can.

（第４の変形例）
上述の第３の変形例では、電子部品５１は、チップ５１３と、補強部材５１５と、を有する例を説明したが、例えば、図１４に示すように、第３の変形例と比較して、接続端子Ｈをさらに有するようにしてもよい。そして、チップ５１３は、例えば、図１４に示すように、基材２０の第１面２１側に位置し、第１面５１３ａ及び第１面５１３ａの反対側に位置する第２面５１３ｂを含む。また、接続端子Ｈは、例えば、図１４に示すように、チップ５１３と配線５２とを電気的に接続するようになっている。この場合、この接続端子Ｈは、例えば、電子部品５１の電極として機能する。この接続端子Ｈは、はんだや、金、アルミニウム、銅などの導電性の金属を含む。 (Fourth modification)
In the third modification described above, an example in which the electronic component 51 has the chip 513 and the reinforcing member 515 has been described. A connection terminal H may be further provided. For example, as shown in FIG. 14, the chip 513 includes a first surface 513a located on the side of the first surface 21 of the substrate 20 and a second surface 513b located on the opposite side of the first surface 513a. Also, the connection terminal H electrically connects the chip 513 and the wiring 52 as shown in FIG. 14, for example. In this case, this connection terminal H functions as an electrode of the electronic component 51, for example. The connection terminal H contains solder or a conductive metal such as gold, aluminum or copper.

そして、保護部材Ｘの少なくとも一部は、基材２０の第１面２１とチップ５１３の第２面５１３ｂとの間で、接続端子Ｈと配線５２との接続部分を、補強部材５１５を介して、間接的に被覆している。
本変形例によっても、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。 At least a part of the protective member X is provided between the first surface 21 of the base material 20 and the second surface 513b of the chip 513, and the connection portion between the connection terminal H and the wiring 52 is protected through the reinforcing member 515. , indirectly covering
Also according to this modification, it is possible to suppress damage to the electrical joint between the electronic component 51 and the wiring 52 .

（第５の変形例）
上述の第４の変形例では、電子部品５１は、チップ５１３と、補強部材５１５と、接続端子Ｈと、を有し、保護部材Ｘが電子部品５１の全体を覆っている例を説明したが、例えば、図１５に示すように、第４の変形例と比較して、電子部品５１のチップ５１３のうち接続端子Ｈと接続されていない第１面５１３ａは、保護部材Ｘから露出しているようにしてもよい。
本変形例によっても、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。 (Fifth Modification)
In the fourth modification described above, the electronic component 51 has the chip 513, the reinforcing member 515, and the connection terminals H, and the protective member X covers the entire electronic component 51. For example, as shown in FIG. 15, the first surface 513a of the chip 513 of the electronic component 51, which is not connected to the connection terminal H, is exposed from the protective member X as compared with the fourth modification. You may do so.
Also according to this modification, it is possible to suppress damage to the electrical joint between the electronic component 51 and the wiring 52 .

（第６の変形例）
上述の第５の変形例では、電子部品５１は、チップ５１３と、補強部材５１５と、接続端子Ｈと、を有し、電子部品５１のチップ５１３のうち接続端子Ｈと接続されていない第１面５１３ａは、保護部材Ｘから露出している例を説明したが、例えば、図１６に示すように、保護部材Ｘの少なくとも一部は、電子部品５１のチップ５１３と接続端子Ｈとの接続部分を、補強部材５１５を介して、間接的に被覆しているようにしてもよい。なお、この図１６に示す例では、保護部材Ｘは、２つの部分に分離されている。
本変形例によっても、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。 (Sixth modification)
In the above-described fifth modification, the electronic component 51 has the chip 513, the reinforcing member 515, and the connection terminals H. Of the chips 513 of the electronic component 51, the first one that is not connected to the connection terminals H Although an example in which the surface 513a is exposed from the protective member X has been described, for example, as shown in FIG. may be covered indirectly via the reinforcing member 515 . In addition, in the example shown in FIG. 16, the protective member X is separated into two parts.
Also according to this modification, it is possible to suppress damage to the electrical joint between the electronic component 51 and the wiring 52 .

（第７の変形例）
上述の第６の変形例では、保護部材Ｘの少なくとも一部は、電子部品５１のチップ５１３と接続端子Ｈとの接続部分を、補強部材５１５を介して、間接的に被覆している例を説明したが、例えば、図１７に示すように、第６の変形例と比較して、補強部材５１５を形成せずに、保護部材Ｘの少なくとも一部は、電子部品５１のチップ５１３と接続端子Ｈとの接続部分を、直接的に被覆しているようにしてもよい。
本変形例によっても、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。 (Seventh Modification)
In the above-described sixth modification, at least part of the protective member X indirectly covers the connection portion between the chip 513 of the electronic component 51 and the connection terminal H via the reinforcing member 515. As described above, for example, as shown in FIG. 17, at least a part of the protective member X is connected to the chip 513 of the electronic component 51 and the connection terminal without forming the reinforcing member 515, compared to the sixth modification. The connection portion with H may be directly covered.
Also according to this modification, it is possible to suppress damage to the electrical joint between the electronic component 51 and the wiring 52 .

（第８の変形例）
既述の第２の変形例においては、引張応力Ｔによって伸長した状態の基材２０の第１面２１側に配線５２を設け、基材２０から引張応力Ｔを取り除いた後に基材２０の第１面２１側に電子部品５１を設ける例を示した。この変形例においても、電子部品５１は、電子部品５１の構成要素の一部が配線基板１０に実装された後、一部の構成要素を封止することによって構成されるものであってもよい。
本第８の変形例では、電子部品５１は、引張応力Ｔによって伸長した状態の基材２０の第１面２１側に配線５２を設け、基材２０から引張応力Ｔを取り除いた後に基材２０の第１面２１側に設けられる。そして、例えば、図１８に示すように、電子部品５１は、チップ５１３と、接続端子Ｈとを含む。そして、チップ５１３は、例えば、図１８に示すように、基材２０の第１面２１側に位置し、第１面５１３ａ及び第１面５１３ａの反対側に位置する第２面５１３ｂを含む。また、接続端子Ｈは、例えば、図１８に示すように、チップ５１３と配線５２とを電気的に接続するようになっている。この場合、この接続端子Ｈは、例えば、電子部品５１の電極として機能する。この接続端子Ｈは、はんだや、金、アルミニウム、銅などの導電性の金属を含む。
そして、保護部材Ｘの少なくとも一部は、基材２０の第１面２１とチップ５１３の第２面５１３ｂとの間で、接続端子Ｈと配線５２との接続部分を、直接的に被覆している。なお、保護部材Ｘは、例えば、ディスペンサーにより、液状の樹脂を滴下して、電子部品５１を覆うように形成される。
本変形例によっても、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。 (Eighth modification)
In the above-described second modification, the wiring 52 is provided on the first surface 21 side of the base material 20 in a state of being stretched by the tensile stress T, and after the tensile stress T is removed from the base material 20, the first surface of the base material 20 is connected. An example in which the electronic component 51 is provided on the one surface 21 side is shown. Also in this modification, the electronic component 51 may be configured by sealing some of the constituent elements after some of the constituent elements of the electronic component 51 are mounted on the wiring board 10. .
In the eighth modification, an electronic component 51 is provided with wiring 52 on the first surface 21 side of a base material 20 stretched by a tensile stress T, and after the tensile stress T is removed from the base material 20, the base material 20 is is provided on the first surface 21 side of the For example, the electronic component 51 includes a chip 513 and connection terminals H, as shown in FIG. For example, as shown in FIG. 18, the chip 513 includes a first surface 513a located on the side of the first surface 21 of the substrate 20 and a second surface 513b located on the opposite side of the first surface 513a. Also, the connection terminal H electrically connects the chip 513 and the wiring 52 as shown in FIG. 18, for example. In this case, this connection terminal H functions as an electrode of the electronic component 51, for example. The connection terminal H contains solder or a conductive metal such as gold, aluminum or copper.
At least a portion of the protective member X directly covers the connection portion between the connection terminal H and the wiring 52 between the first surface 21 of the base material 20 and the second surface 513b of the chip 513. there is In addition, the protective member X is formed so as to cover the electronic component 51 by dripping a liquid resin with a dispenser, for example.
Also according to this modification, it is possible to suppress damage to the electrical joint between the electronic component 51 and the wiring 52 .

（第９の変形例）
上述の第８の変形例では、電子部品５１は、チップ５１３と、接続端子Ｈと、を有し、保護部材Ｘが電子部品５１の全体を覆っている例を説明したが、例えば、図１９に示すように、第８の変形例と比較して、電子部品５１のチップ５１３のうち接続端子Ｈと接続されていない第１面５１３ａは、保護部材Ｘから露出しているようにしてもよい。
本変形例によっても、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。 (Ninth modification)
In the eighth modification described above, the electronic component 51 has the chip 513 and the connection terminals H, and the protective member X covers the entire electronic component 51. However, for example, FIG. , the first surface 513a of the chip 513 of the electronic component 51, which is not connected to the connection terminal H, may be exposed from the protective member X, as compared with the eighth modification. .
Also according to this modification, it is possible to suppress damage to the electrical joint between the electronic component 51 and the wiring 52 .

（第１０の変形例）
上述の第９の変形例では、電子部品５１のチップ５１３のうち接続端子Ｈと接続されていない第１面５１３ａは、保護部材Ｘから露出している例を説明したが、例えば、図２０に示すように、電子部品５１のチップ５１３のうち接続端子Ｈと接続されていない第１面５１３ａは、保護部材Ｘから露出するとともに、保護部材Ｘは、接続端子Ｈをそれぞれ被覆する部分に分離されているようにしてもよい。
本変形例によっても、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。 (Tenth Modification)
In the ninth modification described above, the first surface 513a of the chip 513 of the electronic component 51, which is not connected to the connection terminal H, is exposed from the protective member X. For example, FIG. As shown, the first surface 513a of the chip 513 of the electronic component 51, which is not connected to the connection terminals H, is exposed from the protection member X, and the protection member X is separated into portions covering the connection terminals H, respectively. You can make it look like
Also according to this modification, it is possible to suppress damage to the electrical joint between the electronic component 51 and the wiring 52 .

（第１１の変形例）
上述の実施の形態及び各変形例においては、保護部材Ｘが基材２０の第１面２１側に位置し、当該保護部材Ｘの少なくとも一部は、配線５２の蛇腹形状部のうち、配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚにおける第１蛇腹形状部５７１を、被覆する例を示した。しかしながら、これに限られることはなく、保護部材Ｘが基材２０の第２面２２側に位置し、当該保護部材Ｘの少なくとも一部は、基材２０の第１面２１の法線方向に沿って見た場合に、配線５２の蛇腹形状部のうち、配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚにおける、基材２０の第１面２１の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部５７１に、重なっているようにしてもよい。 (11th modification)
In the above-described embodiment and modifications, the protective member X is positioned on the first surface 21 side of the base material 20, and at least a portion of the protective member X is located on the wiring substrate in the bellows-shaped portion of the wiring 52. An example of covering the first bellows-shaped portion 571 in the vicinity of the boundary Z between the end portion of the electronic component 51 mounted on the electronic component 10 and the wiring 52 is shown. However, it is not limited to this, and the protective member X is positioned on the second surface 22 side of the base material 20, and at least part of the protective member X extends in the normal direction of the first surface 21 of the base material 20. In-plane of the first surface 21 of the base material 20 in the vicinity of the boundary Z between the end of the electronic component 51 mounted on the wiring board 10 and the wiring 52 among the accordion-shaped portions of the wiring 52 when viewed along the It may overlap with the first bellows-shaped portion 571 including a plurality of crests and troughs arranged along the direction.

図２１は、第１１の変形例に係る配線基板１０の配線５２及びその周辺の構成要素の一例を拡大して示す断面図である。
本変形例においては、既述のように、保護部材Ｘは、基材２０の第２面２２側に位置し、基材２０の第１面２１の法線方向に沿って見た場合に配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚに少なくとも部分的に重なっている。そして、当該保護部材Ｘの少なくとも一部は、基材２０の第１面２１の法線方向に沿って見た場合に、配線５２の蛇腹形状部のうち、配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚにおける、基材２０の第１面２１の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部５７１に、重なっている。第一蛇腹形状部５７１は振幅が小さくても大きくても、周期が大きくても小さくてもよい。 FIG. 21 is an enlarged cross-sectional view showing an example of the wiring 52 of the wiring board 10 and its peripheral components according to the eleventh modification.
In this modification, as described above, the protective member X is positioned on the second surface 22 side of the base material 20, and when viewed along the normal direction of the first surface 21 of the base material 20, the wiring It at least partially overlaps the border vicinity Z between the end of the electronic component 51 mounted on the substrate 10 and the wiring 52 . At least part of the protection member X is the electronic component mounted on the wiring substrate 10 among the bellows-shaped portions of the wiring 52 when viewed along the normal direction of the first surface 21 of the base material 20 . It overlaps with the first bellows-shaped portion 571 including a plurality of peaks and valleys arranged along the in-plane direction of the first surface 21 of the base material 20 in the vicinity Z of the boundary between the end portion of 51 and the wiring 52 . . The amplitude of the first bellows-shaped portion 571 may be small or large, and the period may be large or small.

また、基材２０のうち電子部品５１と重なる部分、すなわち保護部材Ｘと重なる部分は、基材２０のうち保護部材Ｘと重ならない部分に比べて変形しにくい。これにより、基材２０に引張応力などの力を加えたときや、基材２０から引張応力などの力を取り除いたときなどに、基材２０のうち電子部品５１と重なる部分に変形が生じることを抑制することができる。このことにより、基材２０の変形に起因する応力が電子部品５１に加わることを抑制することができ、電子部品５１が変形したり破損したりしてしまうことを抑制することができる。また、電子部品５１と配線５２との間の電気接合部が破損してしまうことを抑制することができる。 In addition, the portion of the base material 20 that overlaps the electronic component 51 , that is, the portion that overlaps the protection member X is less likely to deform than the portion of the base material 20 that does not overlap the protection member X. Accordingly, when a force such as a tensile stress is applied to the base material 20 or when a force such as a tensile stress is removed from the base material 20, the portion of the base material 20 that overlaps the electronic component 51 is not deformed. can be suppressed. As a result, it is possible to suppress the application of stress to the electronic component 51 due to the deformation of the base material 20 , thereby suppressing the deformation or breakage of the electronic component 51 . Moreover, it is possible to suppress damage to the electrical joints between the electronic component 51 and the wiring 52 .

特に、第１蛇腹形状部５７１が、保護部材Ｘにより第１蛇腹形状部５７１の形状が固定されることとなる。これにより、第１蛇腹形状部５７１における配線５２の断線を抑制することができ、配線５２の耐久性を向上することができる。 In particular, the shape of the first bellows-shaped portion 571 is fixed by the protective member X. As shown in FIG. As a result, disconnection of the wiring 52 in the first bellows-shaped portion 571 can be suppressed, and the durability of the wiring 52 can be improved.

（配線基板の製造方法）
以下、図２２（ａ）～（ｄ）を参照して、第１１の変形例に係る配線基板１０の製造方法について説明する。 (Method for manufacturing wiring board)
A method of manufacturing the wiring substrate 10 according to the eleventh modification will be described below with reference to FIGS.

まず、基材２０を準備する基材準備工程を実施する。本変形例においては、基材準備工程において、図２２（ａ）に示すように、第１面２１及び第１面２１の反対側に位置する第２面２２を含み、第１の弾性係数を有する基材２０を準備する。 First, a substrate preparation step for preparing the substrate 20 is performed. In this modification, in the base material preparation step, as shown in FIG. A base material 20 is prepared.

また、第１面４１及び第１面４１の反対側に位置する第２面４２を含み、第１の弾性係数よりも大きい第３の弾性係数を有する支持基板４０を準備し、支持基板４０の第１面４１に配線を設ける支持基板４０を準備する支持基板準備工程を実施する。本実施の形態においては、支持基板準備工程において、図２２（ｂ）に示すように、支持基板４０の第１面４１に電子部品５１及び配線５２を設ける。配線５２を設ける方法としては、例えば、ベース材及び導電性粒子を含む導電性ペーストを支持基板４０の第１面４１に印刷する方法を採用することができる。 Also, a support substrate 40 including a first surface 41 and a second surface 42 located on the opposite side of the first surface 41 and having a third elastic modulus larger than the first elastic modulus is prepared. A support substrate preparation step is performed to prepare the support substrate 40 in which the wiring is provided on the first surface 41 . In the present embodiment, in the support substrate preparation step, electronic components 51 and wiring 52 are provided on the first surface 41 of the support substrate 40 as shown in FIG. As a method of providing the wiring 52, for example, a method of printing a conductive paste containing a base material and conductive particles on the first surface 41 of the support substrate 40 can be adopted.

続いて、基材２０に引張応力Ｔを加えて基材２０を伸長させる第１工程を実施する。基材２０の伸張率は、例えば１０％以上且つ２００％以下である。第１工程は、基材２０を加熱した状態で実施してもよく、常温で実施してもよい。基材２０を加熱する場合、基材２０の温度は例えば５０℃以上且つ１５０℃以下である。 Subsequently, a first step of applying a tensile stress T to the base material 20 to elongate the base material 20 is performed. The elongation rate of the base material 20 is, for example, 10% or more and 200% or less. The first step may be performed while the substrate 20 is heated, or may be performed at room temperature. When heating the base material 20, the temperature of the base material 20 is, for example, 50° C. or higher and 150° C. or lower.

続いて、引張応力Ｔによって伸長した状態の基材２０の第１面２１側に、電子部品５１及び配線５２を設ける第２工程を実施する。本実施の形態の第２工程においては、図２２（ｃ）に示すように、伸長した状態の基材２０の第１面２１に、電子部品５１及び配線５２が設けられた支持基板４０を、支持基板４０の第２面４２側から接合させる。この際、基材２０と支持基板４０との間に接着層６０を設けてもよい。 Subsequently, the second step of providing the electronic component 51 and the wiring 52 on the first surface 21 side of the base material 20 in a state of being stretched by the tensile stress T is performed. In the second step of the present embodiment, as shown in FIG. 22(c), a support substrate 40 provided with electronic components 51 and wiring 52 is placed on the first surface 21 of the substrate 20 in an extended state. Bonding is performed from the second surface 42 side of the support substrate 40 . At this time, an adhesive layer 60 may be provided between the base material 20 and the support substrate 40 .

その後、基材２０から引張応力Ｔを取り除く第３工程を実施する。これにより、図２２（ｄ）において矢印Ｃで示すように、基材２０が収縮し、基材２０に接合されている支持基板４０及び配線５２にも変形が生じる。支持基板４０の第３の弾性係数は、基材２０の第１の弾性係数よりも大きい。このため、支持基板４０及び配線５２の変形を、蛇腹形状部の生成として生じさせることができる。 After that, the third step of removing the tensile stress T from the base material 20 is performed. 22(d), the base material 20 shrinks, and the supporting substrate 40 and the wiring 52 bonded to the base material 20 are also deformed. The third elastic modulus of support substrate 40 is greater than the first elastic modulus of base material 20 . Therefore, the deformation of the support substrate 40 and the wiring 52 can be generated as the generation of the bellows-shaped portion.

続いて、基材２０から引張応力Ｔを取り除いた後、基材２０の第２面２２側に位置し、基材２０の第１面２１の法線方向に沿って見た場合に配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚに少なくとも部分的に重なり、第２の弾性係数を有する保護部材Ｘを設ける、第４工程を実施する。 Subsequently, after the tensile stress T is removed from the base material 20, the wiring board 10 is located on the second surface 22 side of the base material 20 and viewed along the normal direction of the first surface 21 of the base material 20. A fourth step of providing a protective member X having a second elastic modulus and overlapping at least partially in the vicinity of the boundary Z between the end of the electronic component 51 mounted on the substrate and the wiring 52 is performed.

なお、既述のように、配線５２は、基材２０の第１面２１の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有する。 In addition, as described above, the wiring 52 has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface 21 of the base material 20 .

そして、既述のように、当該保護部材Ｘの少なくとも一部は、基材２０の第１面２１の法線方向に沿って見た場合に、配線５２の蛇腹形状部のうち、配線基板１０に搭載される電子部品５１の端部と配線５２との境界近傍Ｚにおける、基材２０の第１面２１の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部５７１に、重なることとなる。 Further, as described above, at least part of the protective member X is, when viewed along the normal direction of the first surface 21 of the base material 20, the wiring substrate 10 in the bellows-shaped portion of the wiring 52. A first bellows-shaped portion including a plurality of peaks and valleys aligned along the in-plane direction of the first surface 21 of the base material 20 in the vicinity of the boundary Z between the end of the electronic component 51 mounted on the substrate and the wiring 52 571.

これにより、保護部材Ｘにより、第１蛇腹形状部５７１の形状が固定されることとなる。これにより、第１蛇腹形状部５７１における配線５２の断線を抑制することができ、配線５２の耐久性を向上することができる。 As a result, the protective member X fixes the shape of the first bellows-shaped portion 571 . As a result, disconnection of the wiring 52 in the first bellows-shaped portion 571 can be suppressed, and the durability of the wiring 52 can be improved.

（配線基板の変形例）
上述の実施の形態及び各変形例においては、配線基板１０が、基材２０の第１面２１側に搭載された電子部品５１を備える例を示した。しかしながら、これに限られることはなく、配線基板１０は、電子部品５１を備えていなくてもよい。例えば、電子部品５１が搭載されていない状態の基材２０に蛇腹形状部５７が生じていてもよい。また、電子部品５１が搭載されていない状態の支持基板４０が基材２０に貼り合されてもよい。また、配線基板１０は、電子部品５１が搭載されていない状態で出荷されてもよい。 (Modified example of wiring board)
In the above-described embodiment and each modified example, an example in which the wiring board 10 includes the electronic component 51 mounted on the first surface 21 side of the base material 20 is shown. However, the present invention is not limited to this, and the wiring board 10 does not have to include the electronic component 51 . For example, the bellows-shaped portion 57 may be formed on the substrate 20 without the electronic component 51 mounted thereon. Alternatively, the support substrate 40 without the electronic component 51 mounted thereon may be attached to the base material 20 . Moreover, the wiring board 10 may be shipped without the electronic component 51 mounted thereon.

なお、上述した実施の形態に対するいくつかの変形例を説明してきたが、当然に、複数の変形例を適宜組み合わせて適用することも可能である。 Although several modifications of the above-described embodiment have been described, it is of course possible to apply a plurality of modifications in appropriate combination.

１０ 配線基板
２０ 基材
２１ 第１面
２２ 第２面
４０ 支持基板
４１ 第１面
４２ 第２面
５１ 電子部品
５２ 配線
５７１ 第１蛇腹形状部
５７２ 第２蛇腹形状部
５７３ 第３蛇腹形状部
６０ 接着層
Ｘ 保護部材 10 Wiring board 20 Base material 21 First surface 22 Second surface 40 Support substrate 41 First surface 42 Second surface 51 Electronic component 52 Wiring 571 First bellows-shaped portion 572 Second bellows-shaped portion 573 Third bellows-shaped portion 60 Adhesion Layer X protection member

Claims (37)

第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材と、
前記基材の前記第１面側に位置し、配線基板に搭載される電子部品の電極に接続される配線と、
前記基材の前記第１面側に位置し、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板に搭載される前記電子部品の端部と前記配線との境界近傍に重なり、前記第１の弾性係数より大きい第２の弾性係数を有する保護部材と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記保護部材の少なくとも一部は、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品の端部と前記配線との前記境界近傍における、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部を、被覆している、配線基板。 a substrate comprising a first surface and a second surface opposite the first surface and having a first modulus of elasticity;
wiring located on the first surface side of the base material and connected to electrodes of an electronic component mounted on a wiring substrate;
When viewed along the normal direction of the first surface of the base material and located on the first surface side of the base material, an end portion of the electronic component mounted on the wiring board and the wiring a protective member overlapping near the boundary and having a second elastic modulus larger than the first elastic modulus ;
the wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base;
At least a part of the protective member is provided on the first surface of the base material in the vicinity of the boundary between the wiring and the end of the electronic component mounted on the wiring board, in the bellows-shaped portion of the wiring. A wiring board covering a first bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the substrate. 第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材と、
前記基材の前記第１面側に位置し、配線基板に搭載される電子部品の電極に接続される配線と、
前記基材の前記第２面側に位置し、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板に搭載される前記電子部品の端部と前記配線との境界近傍に少なくとも部分的に重なり、第２の弾性係数を有する保護部材と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記保護部材の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品の端部と前記配線との前記境界近傍における、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部に、重なっており、
前記境界近傍における前記配線の前記第１蛇腹形状部の山部と谷部の周期は、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品から前記境界近傍よりも離れた領域における前記配線の第２蛇腹形状部の山部と谷部の周期よりも、小さく若しくは大きくなっている、配線基板。 a substrate comprising a first surface and a second surface opposite the first surface and having a first modulus of elasticity;
wiring located on the first surface side of the base material and connected to electrodes of an electronic component mounted on a wiring substrate;
When viewed along the normal direction of the first surface of the base material located on the second surface side of the base material, the end portion of the electronic component mounted on the wiring board and the wiring a protective member at least partially overlapping near the boundary and having a second modulus of elasticity;
the wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base;
At least a part of the protective member is, when viewed along the normal direction of the first surface of the base material, part of the bellows-shaped portion of the wiring, the electronic component mounted on the wiring board. overlaps with a first bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material in the vicinity of the boundary between the end portion and the wiring ;
The cycle of peaks and troughs of the first bellows-shaped portion of the wiring in the vicinity of the boundary is set such that the bellows-shaped portion of the wiring is farther away from the electronic component mounted on the wiring board than in the vicinity of the boundary. A wiring board that is smaller or larger than the period of peaks and valleys of the second bellows-shaped portion of the wiring in the region where the wiring is located . 第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材と、 a substrate comprising a first surface and a second surface opposite the first surface and having a first modulus of elasticity;
前記基材の前記第１面側に位置し、配線基板に搭載される電子部品の電極に接続される配線と、 wiring located on the first surface side of the base material and connected to electrodes of an electronic component mounted on a wiring substrate;
前記基材の前記第２面側に位置し、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板に搭載される前記電子部品の端部と前記配線との境界近傍に少なくとも部分的に重なり、第２の弾性係数を有する保護部材と、を備え、 When viewed along the normal direction of the first surface of the base material located on the second surface side of the base material, the end portion of the electronic component mounted on the wiring board and the wiring a protective member at least partially overlapping near the boundary and having a second modulus of elasticity;
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、 the wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base;
前記保護部材の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品の端部と前記配線との前記境界近傍における、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部に、重なっており、 At least a part of the protective member is, when viewed along the normal direction of the first surface of the base material, part of the bellows-shaped portion of the wiring, the electronic component mounted on the wiring board. overlaps with a first bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material in the vicinity of the boundary between the end portion and the wiring;
前記境界近傍における前記配線の前記第１蛇腹形状部の山部と谷部の振幅は、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品から前記境界近傍よりも離れた領域における前記配線の第２蛇腹形状部の山部と谷部の振幅よりも、大きく若しくは小さくなっている、配線基板。 The amplitude of peaks and valleys of the first bellows-shaped portion of the wiring in the vicinity of the boundary is greater than the vicinity of the boundary from the electronic component mounted on the wiring board in the bellows-shaped portion of the wiring. A wiring board, wherein the amplitude of peaks and troughs of the second bellows-shaped portion of the wiring is larger or smaller than the amplitude of the peaks and troughs of the wiring in the region where the wiring is formed. 前記配線の蛇腹形状部は、前記第１面の法線方向に沿って見た場合に前記電子部品と前記基材との間に、設けられていない、請求項１乃至３のいずれか一項に記載の配線基板。 4. The bellows-shaped portion of the wiring according to any one of claims 1 to 3 , wherein the bellows-shaped portion is not provided between the electronic component and the base material when viewed along the normal direction of the first surface. The wiring board according to . 前記境界近傍における前記配線の前記第１蛇腹形状部の山部と谷部の周期は、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品から前記境界近傍よりも離れた領域における前記配線の第２蛇腹形状部の山部と谷部の周期と、同じである、請求項1乃至３のいずれか一項に記載の配線基板。 The cycle of peaks and troughs of the first bellows-shaped portion of the wiring in the vicinity of the boundary is set such that the bellows-shaped portion of the wiring is farther away from the electronic component mounted on the wiring board than in the vicinity of the boundary. 4. The wiring board according to claim 1 , wherein the period of peaks and valleys of said second bellows-shaped portion of said wiring in said region is the same. 前記境界近傍における前記配線の前記第１蛇腹形状部の山部と谷部の振幅は、前記配線の前記第２蛇腹形状部の山部と谷部の振幅と、同じである、請求項５に記載の配線基板。 6. The method according to claim 5 , wherein the amplitude of peaks and valleys of said first accordion-shaped portion of said wiring in the vicinity of said boundary is the same as the amplitude of peaks and valleys of said second accordion-shaped portion of said wiring. A wiring board as described. 前記第１及び第２蛇腹形状部の山部と谷部の周期は、同じである、請求項５又は６に記載の配線基板。 7. The wiring board according to claim 5, wherein the pitches of peaks and valleys of said first and second bellows-shaped portions are the same. 前記第１及び第２蛇腹形状部の山部と谷部の振幅は、同じである、請求項５乃至７のいずれか一項に記載の配線基板。 8. The wiring board according to claim 5, wherein amplitudes of peaks and valleys of said first and second bellows-shaped portions are the same. 前記配線の蛇腹形状部は、前記基材と前記配線基板に搭載される前記電子部品との間に位置するとともに、前記第１面の法線方向に沿って見た場合に前記電子部品と前記配線と重なる部分に、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む第３蛇腹形状部を、含む、請求項５乃至８のいずれか一項に記載の配線基板。 The bellows-shaped portion of the wiring is positioned between the base material and the electronic component mounted on the wiring board, and is positioned between the electronic component and the electronic component when viewed along the normal direction of the first surface. 9. The third bellows-shaped portion including a plurality of ridges and troughs arranged along the in-plane direction of the first surface of the base material in a portion overlapping with the wiring according to any one of claims 5 to 8. The wiring board according to . 前記第１、第２、及び第３蛇腹形状部の山部と谷部の周期は、同じである、請求項９に記載の配線基板。 10. The wiring board according to claim 9 , wherein the peaks and valleys of said first, second and third bellows shaped portions have the same period. 前記第１、第２、及び第３蛇腹形状部の山部と谷部の振幅は、同じである、請求項９又は１０に記載の配線基板。 11. The wiring board according to claim 9 , wherein amplitudes of peaks and valleys of said first, second and third bellows-shaped portions are the same. 前記保護部材の少なくとも一部は、前記基材と前記配線基板に搭載される前記電子部品との間の領域において、前記第３蛇腹形状部を、被覆している、請求項９乃至１１のいずれか一項に記載の配線基板。 12. The protective member according to any one of claims 9 to 11, wherein at least part of said protective member covers said third bellows-shaped portion in a region between said base material and said electronic component mounted on said wiring board. 1. The wiring board according to claim 1. 前記保護部材の少なくとも一部は、前記境界近傍における前記配線の前記第１蛇腹形状部を、直接的に被覆している、請求項１に記載の配線基板。 2. The wiring board according to claim 1, wherein at least part of said protective member directly covers said first bellows-shaped portion of said wiring in the vicinity of said boundary. 前記境界近傍における前記配線の前記第１蛇腹形状部の山部と谷部の周期は、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品から前記境界近傍よりも離れた領域における前記配線の第２蛇腹形状部の山部と谷部の周期と、同じであり、
前記保護部材は、前記境界近傍における前記配線の前記第１蛇腹形状部、及び、前記境界近傍から離れた領域における前記第２蛇腹形状部の少なくとも一部を、連続的に被覆している、請求項１に記載の配線基板。 The cycle of peaks and troughs of the first bellows-shaped portion of the wiring in the vicinity of the boundary is set such that the bellows-shaped portion of the wiring is farther away from the electronic component mounted on the wiring board than in the vicinity of the boundary. is the same as the period of peaks and valleys of the second bellows-shaped portion of the wiring in the region where
The protective member continuously covers the first bellows-shaped portion of the wiring near the boundary and at least part of the second bellows-shaped portion in a region away from the vicinity of the boundary. Item 1. The wiring board according to item 1 . 前記境界近傍における前記配線の前記第１蛇腹形状部の山部と谷部の周期は、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品から前記境界近傍よりも離れた領域における前記配線の第２蛇腹形状部の山部と谷部の周期と、同じであり、 The cycle of peaks and troughs of the first bellows-shaped portion of the wiring in the vicinity of the boundary is set such that the bellows-shaped portion of the wiring is farther away from the electronic component mounted on the wiring board than in the vicinity of the boundary. is the same as the period of peaks and valleys of the second bellows-shaped portion of the wiring in the region where
前記保護部材は、前記基材の前記第１面の法線方向に沿って見た場合に、前記境界近傍における前記配線の前記第１蛇腹形状部、及び、前記境界近傍から離れた領域における前記第２蛇腹形状部の少なくとも一部に、連続的に重なっている、請求項２又は３に記載の配線基板。 When viewed along the normal direction of the first surface of the base material, the protective member includes the first bellows-shaped portion of the wiring in the vicinity of the boundary and the 4. The wiring board according to claim 2, wherein the wiring board continuously overlaps at least a portion of the second bellows-shaped portion. 前記保護部材の少なくとも一部は、前記第３蛇腹形状部を、直接的に被覆している、請求項１２に記載の配線基板。 13. The wiring board according to claim 12, wherein at least part of said protective member directly covers said third bellows-shaped portion. 前記基材の前記第１面側に位置し、前記配線に電気的に接続される電極を有する電子部品を更に備える、請求項１乃至１６のいずれか一項に記載の配線基板。 The wiring board according to any one of claims 1 to 16 , further comprising an electronic component located on the first surface side of the base material and having an electrode electrically connected to the wiring. 前記基材の前記第１面側に位置し、前記配線に電気的に接続される電極を有する電子部品を更に備え、
前記電子部品は、前記基材の前記第１面側に位置し、第１面及び前記第１面の反対側に位置する第２面を含むチップと、前記チップの少なくとも一部を被覆する補強部材と、を有し、
前記保護部材の少なくとも一部は、前記補強部材を介して前記チップを被覆している、請求項１又は４乃至１６に記載の配線基板。 An electronic component located on the first surface side of the base material and having an electrode electrically connected to the wiring,
The electronic component includes a chip located on the first surface side of the base material and including a first surface and a second surface located on the opposite side of the first surface, and a reinforcement covering at least a part of the chip. a member;
17. The wiring board according to claim 1 , wherein at least part of said protective member covers said chip via said reinforcing member. 前記電子部品は、前記基材の前記第１面側に位置し、第１面及び前記第１面の反対側に位置する第２面を含むチップと、前記チップと前記配線とを電気的に接続する接続端子と、を有し、
前記保護部材の少なくとも一部は、前記基材の前記第１面と前記チップの前記第２面との間で、前記接続端子と前記配線との接続部分を、直接的に若しくは間接的に被覆している、請求項１７に記載の配線基板。 The electronic component includes a chip located on the first surface side of the substrate and including a first surface and a second surface located on the opposite side of the first surface, and electrically connecting the chip and the wiring. and a connection terminal for connection,
At least part of the protective member directly or indirectly covers the connection portion between the connection terminal and the wiring between the first surface of the base material and the second surface of the chip. 18. The wiring board according to claim 17 , wherein: 前記保護部材の少なくとも一部は、前記電子部品の前記チップと前記接続端子との接続部分を、直接的に若しくは間接的に被覆する、請求項１９に記載の配線基板。 20. The wiring board according to claim 19 , wherein at least a portion of said protective member directly or indirectly covers a connection portion between said chip of said electronic component and said connection terminal. 前記電子部品の前記チップのうち前記接続端子と接続されていない前記第１面は、前記保護部材から露出している、請求項２０に記載の配線基板。 21. The wiring board according to claim 20 , wherein said first surface of said chip of said electronic component, which is not connected to said connection terminal, is exposed from said protective member. 前記電子部品は、前記チップの少なくとも一部及び前記接続端子を被覆する補強部材をさらに有する、請求項１乃至２０のいずれか一項に記載の配線基板。 21. The wiring board according to claim 1, wherein said electronic component further comprises a reinforcing member covering at least part of said chip and said connection terminals. 前記補強部材は、樹脂である請求項２１に記載の配線基板。 The wiring board according to claim 21 , wherein the reinforcing member is resin. 前記配線と前記基材の前記第１面との間に位置し、前記第１の弾性係数よりも大きい第３の弾性係数を有し、前記配線を支持する支持基板を更に備える、請求項１乃至２３のいずれか一項に記載の配線基板。 2. A supporting substrate positioned between said wiring and said first surface of said base material, having a third elastic modulus larger than said first elastic modulus, and supporting said wiring, further comprising a support substrate according to claim 1. 24. The wiring board according to any one of items 1 to 23 . 前記配線は、複数の導電性粒子を含む、請求項１乃至２４のいずれか一項に記載の配線基板。 25. The wiring board according to any one of claims 1 to 24 , wherein said wiring comprises a plurality of conductive particles. 前記基材は、シリコーンゴムを含む、請求項１乃至２５のいずれか一項に記載の配線基板。 The wiring board according to any one of claims 1 to 25 , wherein the base material contains silicone rubber. 前記保護部材は、樹脂で構成されている、請求項１乃至２６のいずれか一項に記載の配線基板。 27. The wiring board according to claim 1, wherein said protective member is made of resin. 前記保護部材は、前記電子部品を前記基材の前記第１面の面内方向に連続して被覆するとともに、前記配線の蛇腹形状部のうち、前記基材の前記第１面の面内方向における、前記電子部品の両方の端部近傍の前記第１蛇腹形状部を、被覆している、請求項１乃至２７のいずれか一項に配線基板。 The protective member continuously covers the electronic component in the in-plane direction of the first surface of the base material, and covers the bellows-shaped portion of the wiring in the in-plane direction of the first surface of the base material. 28. The wiring board according to any one of claims 1 to 27 , wherein said first accordion-shaped portion near both ends of said electronic component is covered. 前記配線の前記蛇腹形状部の振幅が１μｍ以上である、請求項１乃至２８のいずれか一項に記載の配線基板。 29. The wiring board according to claim 1, wherein the amplitude of said accordion-shaped portion of said wiring is 1 μm or more. 前記基材の前記第１面の面内方向に沿う引張応力が前記基材に加えられていない第１状態における前記配線の抵抗値を第１抵抗値と称し、前記基材に引張応力を加えて前記基材を前記第１面の面内方向において前記第１状態に比べて３０％伸長させた第２状態における前記配線の抵抗値を第２抵抗値と称する場合、前記第１抵抗値に対する、前記第１抵抗値と前記第２抵抗値の差の絶対値の比率が、２０％以下である、請求項１乃至２９のいずれか一項に記載の配線基板。 A resistance value of the wiring in a first state in which a tensile stress along the in-plane direction of the first surface of the base material is not applied to the base material is referred to as a first resistance value, and a tensile stress is applied to the base material. When the resistance value of the wiring in the second state in which the base material is stretched by 30% compared to the first state in the in-plane direction of the first surface is referred to as the second resistance value, 30. The wiring board according to claim 1, wherein the ratio of the absolute values of the difference between said first resistance value and said second resistance value is 20% or less. 配線基板の製造方法であって、
第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、
伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、
前記配線が設けられた前記基材から前記引張応力を取り除く第３工程と、
前記基材から前記引張応力を取り除いた後、前記基材の前記第１面側に位置し、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板に搭載される電子部品の端部と前記配線との境界近傍に少なくとも部分的に重なり、第２の弾性係数を有する保護部材を、設ける第４工程と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記保護部材の少なくとも一部は、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品の端部と前記配線との前記境界近傍における、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部を、被覆している、配線基板の製造方法。 A method for manufacturing a wiring board,
a first step of applying a tensile stress to a substrate comprising a first surface and a second surface opposite the first surface and having a first modulus of elasticity to elongate the substrate;
a second step of providing wiring on the first surface side of the base material in an extended state;
a third step of removing the tensile stress from the base material provided with the wiring;
After the tensile stress is removed from the base material, it is located on the first surface side of the base material and is mounted on the wiring board when viewed along the normal direction of the first surface of the base material. a fourth step of providing a protective member having a second elastic modulus at least partially overlapping near the boundary between the end of the electronic component and the wiring,
the wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base;
At least a part of the protective member is provided on the first surface of the base material in the vicinity of the boundary between the wiring and the end of the electronic component mounted on the wiring board, in the bellows-shaped portion of the wiring. A method of manufacturing a wiring board, which covers a first bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the substrate. 前記基材の前記第１面側に前記配線を設けた後であって、前記基材の前記第１面側に前記保護部材を設ける前に、前記配線に電気的に接続される電極を有する電子部品を、前記基材の前記第１面側に設ける電子部品搭載工程を、さらに備える、請求項３１に記載の配線基板の製造方法。 After providing the wiring on the first surface side of the base material and before providing the protective member on the first surface side of the base material, an electrode electrically connected to the wiring is provided. 32. The method of manufacturing a wiring board according to claim 31 , further comprising an electronic component mounting step of providing an electronic component on said first surface side of said base material. 第１面及び前記第１面の反対側に位置する第２面を含み、前記第１の弾性係数よりも大きい第３の弾性係数を有する支持基板を準備し、前記支持基板の前記第１面に前記配線を設ける支持基板準備工程をさらに備え、
前記電子部品搭載工程においては、前記配線が設けられた前記支持基板の前記第１面に、前記配線に電気的に接続される電極を有する電子部品を設け、
前記第２工程においては、伸長した状態の前記基材の前記第１面に、前記配線及び前記電子部品が設けられた前記支持基板を、前記支持基板の前記第２面側から接合させる、請求項３２に記載の配線基板の製造方法。 preparing a supporting substrate including a first surface and a second surface located opposite to the first surface and having a third elastic modulus larger than the first elastic modulus; and providing the first surface of the supporting substrate. further comprising a supporting substrate preparation step of providing the wiring in
In the electronic component mounting step, an electronic component having an electrode electrically connected to the wiring is provided on the first surface of the supporting substrate provided with the wiring,
In the second step, the support substrate provided with the wiring and the electronic component is bonded to the first surface of the base material in an extended state from the second surface side of the support substrate. 33. A method for manufacturing a wiring board according to Item 32 . 配線基板の製造方法であって、
第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、
伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、
前記配線が設けられた伸長した状態の前記基材から前記引張応力を取り除く第３工程と、
前記基材から前記引張応力を取り除いた後、前記基材の前記第１面側に位置し、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板に搭載される電子部品の端部と前記配線との境界近傍に少なくとも部分的に重なり、第２の弾性係数を有する保護部材を、設ける第４工程と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記保護部材の少なくとも一部は、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品の端部と前記配線との前記境界近傍における、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部を、被覆している、配線基板の製造方法。 A method for manufacturing a wiring board,
a first step of applying a tensile stress to a substrate comprising a first surface and a second surface opposite the first surface and having a first modulus of elasticity to elongate the substrate;
a second step of providing wiring on the first surface side of the base material in an extended state;
a third step of removing the tensile stress from the elongated base material provided with the wiring;
After the tensile stress is removed from the base material, it is located on the first surface side of the base material and is mounted on the wiring board when viewed along the normal direction of the first surface of the base material. a fourth step of providing a protective member having a second elastic modulus at least partially overlapping near the boundary between the end of the electronic component and the wiring,
the wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base;
At least a part of the protective member is provided on the first surface of the base material in the vicinity of the boundary between the wiring and the end of the electronic component mounted on the wiring board, in the bellows-shaped portion of the wiring. A method of manufacturing a wiring board, which covers a first bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the substrate. 前記基材から前記引張応力を取り除いた後であって、前記基材の前記第１面側に前記保護部材を設ける前に、前記配線に電気的に接続される電極を有する電子部品を、前記基材の前記第１面側に設ける電子部品搭載工程を、さらに備える、請求項３４に記載の配線基板の製造方法。 After removing the tensile stress from the base material and before providing the protective member on the first surface side of the base material, the electronic component having electrodes electrically connected to the wiring is 35. The method of manufacturing a wiring board according to claim 34 , further comprising an electronic component mounting step provided on the first surface side of the base material. 第１面及び前記第１面の反対側に位置する第２面を含み、前記第１の弾性係数よりも大きい第３の弾性係数を有する支持基板を準備し、前記支持基板の前記第１面に前記配線を設ける支持基板準備工程をさらに備え、
前記第２工程においては、伸長した状態の前記基材の前記第１面に、前記配線が設けられた前記支持基板を、前記支持基板の前記第２面側から接合させ、
前記電子部品搭載工程においては、前記配線が設けられた前記支持基板の前記第１面に、前記配線に電気的に接続される電極を有する前記電子部品を設ける、請求項３３に記載の配線基板の製造方法。 preparing a supporting substrate including a first surface and a second surface located opposite to the first surface and having a third elastic modulus larger than the first elastic modulus; and providing the first surface of the supporting substrate. further comprising a supporting substrate preparation step of providing the wiring in
In the second step, the support substrate provided with the wiring is bonded to the first surface of the base material in an extended state from the second surface side of the support substrate;
34. The wiring board according to claim 33, wherein in said electronic component mounting step, said electronic component having electrodes electrically connected to said wiring is provided on said first surface of said supporting substrate provided with said wiring. manufacturing method. 配線基板の製造方法であって、
第１面及び前記第１面の反対側に位置する第２面を含み、第１の弾性係数を有する基材に引張応力を加えて、前記基材を伸長させる第１工程と、
伸長した状態の前記基材の前記第１面側に配線を設ける第２工程と、
前記配線が設けられた前記基材から前記引張応力を取り除く第３工程と、
前記基材から前記引張応力を取り除いた後、前記基材の前記第２面側に位置し、前記基材の前記第１面の法線方向に沿って見た場合に前記配線基板に搭載される電子部品の端部と前記配線との境界近傍に少なくとも部分的に重なり、第２の弾性係数を有する保護部材を、設ける第４工程と、を備え、
前記配線は、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む蛇腹形状部を有し、
前記保護部材の少なくとも一部は、前記基材の前記第１面の法線方向に沿って見た場合に、前記配線の前記蛇腹形状部のうち、前記配線基板に搭載される前記電子部品の端部と前記配線との前記境界近傍における、前記基材の前記第１面の面内方向に沿って並ぶ複数の山部及び谷部を含む第１蛇腹形状部に、重なっている、配線基板の製造方法。 A method for manufacturing a wiring board,
a first step of applying a tensile stress to a substrate comprising a first surface and a second surface opposite the first surface and having a first modulus of elasticity to elongate the substrate;
a second step of providing wiring on the first surface side of the base material in an extended state;
a third step of removing the tensile stress from the base material provided with the wiring;
After the tensile stress is removed from the base material, it is located on the second surface side of the base material and is mounted on the wiring board when viewed along the normal direction of the first surface of the base material. a fourth step of providing a protective member having a second elastic modulus at least partially overlapping near the boundary between the end of the electronic component and the wiring,
the wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base;
At least a part of the protective member is, when viewed along the normal direction of the first surface of the base material, part of the bellows-shaped portion of the wiring, the electronic component mounted on the wiring board. A wiring board overlapping a first bellows-shaped portion including a plurality of peaks and valleys arranged along an in-plane direction of the first surface of the base material in the vicinity of the boundary between the end portion and the wiring. manufacturing method.
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