JP2020129580A - 洗浄ノズル及び被洗浄物の洗浄方法 - Google Patents
洗浄ノズル及び被洗浄物の洗浄方法 Download PDFInfo
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- JP2020129580A JP2020129580A JP2019020796A JP2019020796A JP2020129580A JP 2020129580 A JP2020129580 A JP 2020129580A JP 2019020796 A JP2019020796 A JP 2019020796A JP 2019020796 A JP2019020796 A JP 2019020796A JP 2020129580 A JP2020129580 A JP 2020129580A
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- Prior art keywords
- cleaning
- cutting
- water
- nozzle
- cleaning nozzle
- Prior art date
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- 238000004140 cleaning Methods 0.000 title claims abstract description 158
- 238000000034 method Methods 0.000 title claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 32
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 88
- 239000000463 material Substances 0.000 abstract description 33
- 238000005406 washing Methods 0.000 abstract description 7
- 238000011010 flushing procedure Methods 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 description 103
- 239000000758 substrate Substances 0.000 description 24
- 239000002699 waste material Substances 0.000 description 19
- 238000011144 upstream manufacturing Methods 0.000 description 10
- 230000007423 decrease Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
- B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0042—Devices for removing chips
- B23Q11/005—Devices for removing chips by blowing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02076—Cleaning after the substrates have been singulated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
11 第1チャックテーブル
12 第2チャックテーブル
13 ウォーターケース
15 底部
15A 第1側方領域
15B 中間領域
15C 第3側方領域
19 第1移動板
20 第2移動板
40 洗浄ユニット
42 洗浄ノズル
42A 先端部
43 洗浄水供給路
44 洗浄水バルブ
45 エア供給路
46 エアバルブ
47 混合器
50 端材処理装置
51 切削屑案内板
52 切削屑回収ボックス
60 制御ユニット
70 洗浄水
100 パッケージ基板
105 余剰連結部材
106 端材
200 洗浄水供給源
201 エア供給源
Claims (2)
- 被洗浄物を洗浄する洗浄ノズルであって、
洗浄液供給源と該洗浄ノズルとを連通する洗浄液供給路と、
エア供給源と該洗浄ノズルと連通するエア供給路と、
エア供給路を開閉するエアバルブと、
該エアバルブを間欠的に開閉する制御手段と、
を備えることを特徴とする洗浄ノズル。 - 洗浄ノズルに洗浄液を供給する洗浄液供給ステップと、
該洗浄ノズルにエアを供給し該洗浄ノズル内にたまった洗浄液を噴射する洗浄液噴射ステップと、を備え、
該洗浄液噴射ステップは、
該洗浄ノズル内に洗浄液が所定量たまるタイミングで間欠的に行う
ことを特徴とする被洗浄物の洗浄方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019020796A JP7300842B2 (ja) | 2019-02-07 | 2019-02-07 | 被洗浄物の洗浄方法 |
TW109103394A TWI811522B (zh) | 2019-02-07 | 2020-02-04 | 被洗淨物的洗淨方法 |
CN202010080346.2A CN111530649A (zh) | 2019-02-07 | 2020-02-05 | 清洗喷嘴以及被清洗物的清洗方法 |
KR1020200014302A KR20200097217A (ko) | 2019-02-07 | 2020-02-06 | 세정 노즐 및 피세정물의 세정 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019020796A JP7300842B2 (ja) | 2019-02-07 | 2019-02-07 | 被洗浄物の洗浄方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020129580A true JP2020129580A (ja) | 2020-08-27 |
JP7300842B2 JP7300842B2 (ja) | 2023-06-30 |
Family
ID=71969197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019020796A Active JP7300842B2 (ja) | 2019-02-07 | 2019-02-07 | 被洗浄物の洗浄方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7300842B2 (ja) |
KR (1) | KR20200097217A (ja) |
CN (1) | CN111530649A (ja) |
TW (1) | TWI811522B (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000157939A (ja) * | 1998-11-30 | 2000-06-13 | Isuzu Motors Ltd | 洗浄方法及び装置 |
JP2016159376A (ja) * | 2015-02-27 | 2016-09-05 | 株式会社ディスコ | 切削装置 |
JP2018113373A (ja) * | 2017-01-12 | 2018-07-19 | 株式会社ディスコ | 加工装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0984800A (ja) * | 1995-09-25 | 1997-03-31 | Toru Kikawada | 手術用アクアウォッシャー装置 |
JP2006187834A (ja) * | 2005-01-06 | 2006-07-20 | Disco Abrasive Syst Ltd | 切削装置 |
JP4535900B2 (ja) * | 2005-02-14 | 2010-09-01 | 花王株式会社 | 湿式電気掃除機 |
JP6118653B2 (ja) | 2013-06-19 | 2017-04-19 | 株式会社ディスコ | 切削装置 |
JP6317941B2 (ja) * | 2014-02-07 | 2018-04-25 | 株式会社ディスコ | 切削装置 |
JP6498020B2 (ja) * | 2015-04-14 | 2019-04-10 | 株式会社ディスコ | チャックテーブルの洗浄方法 |
JP6909621B2 (ja) * | 2017-04-24 | 2021-07-28 | 株式会社ディスコ | ウォータージェット加工装置 |
-
2019
- 2019-02-07 JP JP2019020796A patent/JP7300842B2/ja active Active
-
2020
- 2020-02-04 TW TW109103394A patent/TWI811522B/zh active
- 2020-02-05 CN CN202010080346.2A patent/CN111530649A/zh active Pending
- 2020-02-06 KR KR1020200014302A patent/KR20200097217A/ko not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000157939A (ja) * | 1998-11-30 | 2000-06-13 | Isuzu Motors Ltd | 洗浄方法及び装置 |
JP2016159376A (ja) * | 2015-02-27 | 2016-09-05 | 株式会社ディスコ | 切削装置 |
JP2018113373A (ja) * | 2017-01-12 | 2018-07-19 | 株式会社ディスコ | 加工装置 |
Also Published As
Publication number | Publication date |
---|---|
CN111530649A (zh) | 2020-08-14 |
KR20200097217A (ko) | 2020-08-18 |
JP7300842B2 (ja) | 2023-06-30 |
TW202030784A (zh) | 2020-08-16 |
TWI811522B (zh) | 2023-08-11 |
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