JP2020102567A - 基板処理装置及び基板処理方法 - Google Patents
基板処理装置及び基板処理方法 Download PDFInfo
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Abstract
Description
図1は、一実施形態に係る基板処理システムの概略構成を示す図である。以下では、位置関係を明確にするために、互いに直交するX軸、Y軸およびZ軸を規定し、Z軸正方向を鉛直上向き方向とする。
図2及び図3を参照して、基板処理システム1が含む基板処理装置10の構成を説明する。基板処理装置10は、基板処理システム1の処理ユニット16に含まれる。図2は、基板処理装置10の縦断面図であり、図3は、基板処理装置10に含まれる回転板及び支持板の構成を示す分解斜視図である。
まず、第1構成例として、可動部材とウエハWとの接触面積を変化させることにより、ウエハWと可動部材との間を流れる電流に対する抵抗値を変化させる構成を説明する。図5(A)に示すように、第1構成例では、可動部材51AがウエハWに対する接触面積Sを変化可能であるとする。図5(A)に示すように、複数(例えば、3つ)の可動部材51Aが設けられている場合には、複数の可動部材51Aに対応して、ウエハWとの接触面積を変化させるための抵抗値変更機構518が個別に設けられている。なお、抵抗値変更機構518は、複数の可動部材51Aの抵抗値を一体的に変更可能な構成であってもよい。なお、図5(B)及び図5(C)では、抵抗値変更機構518の記載を省略している。
第2構成例として、抵抗値が互いに異なる2種類の可動部材を組み合わせて使用することで、ウエハWと可動部材との間を流れる電流に対する抵抗値を変化させる構成を説明する。
第3構成例として、可動部材51自体が抵抗値を可変である場合について説明する。従来から用いられている可動部材51の材料は、一般的に抵抗値が一定値のものである。しかしながら、この抵抗値が可変である材料を可動部材51に用いることで、ウエハWと可動部材との間を流れる電流に対する抵抗値を変化させる構成としてもよい。
例1:一つの例示的実施形態において、基板処理装置は、基板を保持する保持部と、前記保持部により保持された前記基板に対して処理液を供給する処理液供給部と、前記基板に対して接触する前記保持部の電気抵抗を変更可能な抵抗値変更機構と、を有する。上記のように、保持部の電気抵抗を変更可能な構成とすることにより、例えば、処理液による液処理の段階に応じて保持部の電気抵抗を変更することができる。したがって、例えば、保持部の電気抵抗が低いために保持部と基板との間で電流が流れることを防ぐことで、基板の腐食等を防ぐことも可能となり、基板表面のエッチングを好適に行うことができる。
Claims (9)
- 基板を保持する保持部と、
前記保持部により保持された前記基板に対して処理液を供給する処理液供給部と、
前記基板に対して接触する前記保持部の電気抵抗を変更可能な抵抗値変更機構と、
を有する、基板処理装置。 - 前記保持部は、電気抵抗が小さい第1の保持部と、電気抵抗が大きい第2の保持部と、を有し、
前記抵抗値変更機構は、前記第1の保持部と前記第2の保持部との間で前記基板を保持する保持部を切り替えることで、前記基板に対して接触する前記保持部の電気抵抗を変更する、請求項1に記載の基板処理装置。 - 前記保持部は、基板との接触面積が互いに異なる保持面を有し、
前記抵抗値変更機構は、前記保持部と前記基板との接触面積を変更することで、前記基板に対して接触する前記保持部の電気抵抗を変更する、請求項1に記載の基板処理装置。 - 前記保持部は、複数設けられ、
前記抵抗値変更機構は、前記基板に接触する保持部の数を変更することで、前記基板に対して接触する前記保持部の電気抵抗を変更する、請求項1に記載の基板処理装置。 - 前記保持部は、感圧導電性材料により構成され、
前記抵抗値変更機構は、前記保持部が前記基板から受ける力を変更することで、前記基板に対して接触する前記保持部の電気抵抗を変更する、請求項1に記載の基板処理装置。 - 前記保持部は、PTCサーミスタにより構成され、
前記抵抗値変更機構は、前記保持部の周囲に流す処理液の温度を変更することで、前記基板に対して接触する前記保持部の電気抵抗を変更する、請求項1に記載の基板処理装置。 - 保持部により保持された基板に対して処理液を供給して処理を行う基板処理方法において、
処理中に前記基板に対して接触する前記保持部の電気抵抗を変更する、基板処理方法。 - エッチング処理を行う時に、前記基板に対して接触する前記保持部の電気抵抗を大きくする、請求項7に記載の基板処理方法。
- リンス処理を行う時に、前記基板に対して接触する前記保持部の電気抵抗を小さくする、請求項7または8に記載の基板処理方法。
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