JP2020087289A - フィールド機器 - Google Patents
フィールド機器 Download PDFInfo
- Publication number
- JP2020087289A JP2020087289A JP2018225187A JP2018225187A JP2020087289A JP 2020087289 A JP2020087289 A JP 2020087289A JP 2018225187 A JP2018225187 A JP 2018225187A JP 2018225187 A JP2018225187 A JP 2018225187A JP 2020087289 A JP2020087289 A JP 2020087289A
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- JP
- Japan
- Prior art keywords
- temperature
- field device
- switch
- heating element
- main unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
- G05B19/0423—Input/output
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0202—Switches
- H05B1/0213—Switches using bimetallic elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Control Of Temperature (AREA)
- Programmable Controllers (AREA)
Abstract
Description
図2は、第1実施形態に係るフィールド機器1の概略構成を示す機能ブロック図である。第1実施形態に係るフィールド機器1は、メインユニット200と、メインユニット200を収容するケース300とを備える。フィールド機器1が備えるメインユニット200の構成は、比較例で説明したメインユニット200と同様である。そのため、ここでは、メインユニット200の内部の詳細な機能ブロックの図示及びその説明については、省略する。
図4は、第2実施形態に係るフィールド機器2の概略構成を示す機能ブロック図である。第2実施形態に係るフィールド機器2は、第1実施形態に係るフィールド機器1と同様に、ケース300と、ケース300内に収容されたメインユニット200、第1の温度スイッチ400及び発熱素子500と、を備える。以下、第2実施形態に係るフィールド機器2について、第1実施形態に係るフィールド機器1と共通する点については、適宜説明を省略し、異なる点を中心に説明する。
図6は、第3実施形態に係るフィールド機器3の概略構成を示す機能ブロック図である。第3実施形態に係るフィールド機器3は、第1実施形態に係るフィールド機器1と同様に、ケース300と、ケース300内に収容されたメインユニット200及び第1の温度スイッチ400を備える。以下、第3実施形態に係るフィールド機器3について、第1実施形態に係るフィールド機器1と共通する点については、適宜説明を省略し、異なる点を中心に説明する。
100 電源
200 メインユニット(電子回路)
201 CPU
202 入力回路
203 コンバータ
204 プログラムメモリ
205 揮発性メモリ
206 不揮発性メモリ
207 表示器
208 出力回路
300 ケース(ハウジング)
400 第1の温度スイッチ
401 第2の温度スイッチ
500 発熱素子
600 センサ
700 切替スイッチ
Claims (5)
- センサ及びアクチュエータの少なくともいずれかに接続される電子回路と、
前記電子回路と直列に電源に接続され、第1温度への昇温により導通するバイメタル式の温度スイッチと、
前記電子回路及び前記温度スイッチと並列に前記電源に接続されうる発熱素子と、
前記電子回路、前記温度スイッチ及び前記発熱素子を収容するハウジングと、
を備える、フィールド機器。 - 前記温度スイッチは、前記電子回路を構成する回路基板に伝熱可能に連結されている、請求項1に記載のフィールド機器。
- 前記温度スイッチは、前記回路基板に樹脂ポッティングによって接着されている、請求項2に記載のフィールド機器。
- 前記発熱素子と直列に、且つ、前記電子回路及び前記温度スイッチと並列に、前記電源に接続され、前記第1温度よりも高い第2温度への昇温により導通を遮断するバイメタル式の他の温度スイッチをさらに備える、請求項1〜3のいずれか一項に記載のフィールド機器。
- 前記発熱素子と切替え可能な、発熱温度勾配が前記発熱素子と異なる他の発熱素子をさらに備える、請求項1〜4のいずれか一項に記載のフィールド機器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018225187A JP7063253B2 (ja) | 2018-11-30 | 2018-11-30 | フィールド機器 |
CN201911087413.7A CN111258245A (zh) | 2018-11-30 | 2019-11-08 | 现场设备 |
US16/696,362 US11212905B2 (en) | 2018-11-30 | 2019-11-26 | Field device capable of operating in extremely low-temperature environment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018225187A JP7063253B2 (ja) | 2018-11-30 | 2018-11-30 | フィールド機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020087289A true JP2020087289A (ja) | 2020-06-04 |
JP7063253B2 JP7063253B2 (ja) | 2022-05-09 |
Family
ID=70849576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018225187A Active JP7063253B2 (ja) | 2018-11-30 | 2018-11-30 | フィールド機器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11212905B2 (ja) |
JP (1) | JP7063253B2 (ja) |
CN (1) | CN111258245A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102020202607A1 (de) * | 2020-02-28 | 2021-09-02 | Siemens Aktiengesellschaft | Elektronikmodul, Verfahren zur Herstellung eines Elektronikmoduls und Industrieanlage |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002033134A (ja) * | 2000-07-17 | 2002-01-31 | Nec Mobile Energy Kk | 簡易保護式電池パック |
JP2002108460A (ja) * | 2000-09-27 | 2002-04-10 | Ando Electric Co Ltd | 温度制御装置 |
JP2017076487A (ja) * | 2015-10-14 | 2017-04-20 | ホシデン株式会社 | プラグコネクタ及びアダプタ |
Family Cites Families (18)
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DE3219517C2 (de) * | 1982-05-25 | 1986-09-25 | Thermostat- und Schaltgerätebau GmbH & Co KG, 8730 Bad Kissingen | Temperaturreglerschalter |
DE4411712A1 (de) * | 1994-04-05 | 1995-10-12 | Dieter Roegelein | Schutzeinrichtung gegen Wärmebelastung eines Elektrokleinmotors für hohe thermische Belastbarkeit |
US20020011915A1 (en) * | 1997-04-11 | 2002-01-31 | Masahiko Niino | Thermal Protector |
US6670587B1 (en) * | 2002-08-13 | 2003-12-30 | Leviton Manufacturing Co., Inc. | Self heating thermal protector |
US20100314381A1 (en) * | 2008-01-28 | 2010-12-16 | Ching Chuan Wang | Heating device |
US7784351B2 (en) | 2008-10-16 | 2010-08-31 | Rosemount Inc. | Field device with integrated temperature control |
JP2010232058A (ja) * | 2009-03-27 | 2010-10-14 | Fuji Electric Fa Components & Systems Co Ltd | 熱動形過負荷継電器 |
CN102109862B (zh) * | 2009-12-28 | 2014-03-26 | 鸿富锦精密工业(深圳)有限公司 | 温度控制电路及具有该温度控制电路的电子设备 |
JP6021645B2 (ja) * | 2010-12-16 | 2016-11-09 | Littelfuseジャパン合同会社 | 保護デバイス |
CN102507227A (zh) * | 2011-09-27 | 2012-06-20 | 中国科学院西安光学精密机械研究所 | 电子产品表面控温热真空试验方法 |
CN202735713U (zh) * | 2012-04-23 | 2013-02-13 | 北京昆仑纵横科技发展有限公司 | 嵌入式人机界面低温快速启动***及嵌入式人机界面设备 |
KR101444593B1 (ko) * | 2012-04-26 | 2014-09-24 | 칼소닉 칸세이 가부시끼가이샤 | 차량용 안전 장치 |
JP6062815B2 (ja) * | 2012-08-09 | 2017-01-18 | カルソニックカンセイ株式会社 | 温度スイッチ及び流体加熱装置 |
CN202916947U (zh) * | 2012-11-23 | 2013-05-01 | 沈阳普泰安科技有限公司 | 一种可检测并联双金属温度开关故障的线型感温探测器 |
KR101714228B1 (ko) * | 2015-09-23 | 2017-03-08 | 현대자동차주식회사 | 연료필터 가열장치 |
US9911557B2 (en) * | 2016-06-27 | 2018-03-06 | Abb Schweiz Ag | SF6 insultated circuit breaker system with heater |
DE102016219284A1 (de) * | 2016-10-05 | 2018-04-05 | Bayerische Motoren Werke Aktiengesellschaft | Elektrischer Energiespeicher mit einer Notkühleinrichtung |
CN206713239U (zh) * | 2017-04-11 | 2017-12-05 | 锋厚科技股份有限公司 | 具有温控功能的电子机箱 |
-
2018
- 2018-11-30 JP JP2018225187A patent/JP7063253B2/ja active Active
-
2019
- 2019-11-08 CN CN201911087413.7A patent/CN111258245A/zh active Pending
- 2019-11-26 US US16/696,362 patent/US11212905B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002033134A (ja) * | 2000-07-17 | 2002-01-31 | Nec Mobile Energy Kk | 簡易保護式電池パック |
JP2002108460A (ja) * | 2000-09-27 | 2002-04-10 | Ando Electric Co Ltd | 温度制御装置 |
JP2017076487A (ja) * | 2015-10-14 | 2017-04-20 | ホシデン株式会社 | プラグコネクタ及びアダプタ |
Also Published As
Publication number | Publication date |
---|---|
CN111258245A (zh) | 2020-06-09 |
JP7063253B2 (ja) | 2022-05-09 |
US11212905B2 (en) | 2021-12-28 |
US20200178382A1 (en) | 2020-06-04 |
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