JP2019220550A - ウエーハの加工方法 - Google Patents
ウエーハの加工方法 Download PDFInfo
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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Abstract
Description
ウエーハ10、及びシート20を用意したならば、図1(a)に示すように、ウエーハ10の裏面10bを上方に、すなわち、表面10aを下方に向け、支持テーブル40の上面に敷設されるシート20の上面20aに配設する(図1(b)を参照。)。支持テーブル40は、基台50上に配設されており、支持テーブル40の上面は平坦に形成され、フッ素樹脂で被覆されている。
上記したウエーハ配設工程が実施されたならば、図2に示すシート熱圧着工程を実施する。シート熱圧着工程は、シート20に配設されたウエーハ10を密閉環境内で減圧してシート20を加熱すると共にウエーハ10を押圧して、ウエーハ10とシート20とを熱圧着する工程である。なお、支持テーブル40の内部には、加熱手段として、電気ヒータ42、及び図示しない温度センサーが内蔵される。電気ヒータ42及び該温度センサーは、図示しない制御装置、及び電源に接続され、支持テーブル40を所望の温度に調整することが可能になっている。以下に具体的に説明する。
上記したシート熱圧着工程を実施したならば、一体化ユニットWとされたウエーハ10の裏面10bに研削加工を施す裏面加工工程を実施する。以下に、裏面加工工程について具体的に説明する。
上記した裏面加工工程が完了したならば、ウエーハ10をシート20から剥離する剥離工程を実施する。剥離工程の実施手順について、以下に説明する。
12:デバイス
14:分割予定ライン
16:バンプ
20:シート
22:盛り上がり部
40:支持テーブル
42:電気ヒータ
50:基台
52:吸引孔
60:熱圧着装置
62:密閉カバー部材
64:押圧部材
64a:押圧プレート
70:研削装置
71:保持手段
72:研削手段
74:回転スピンドル
78:研削ホイール
80:剥離用保持手段
100:フィルム状部材
110:ローラ
Claims (8)
- 複数のデバイスが分割予定ラインによって区画され表面に形成されたウエーハの裏面を加工するウエーハの加工方法であって、
上面が平坦に形成された支持テーブルの該上面にウエーハの形状と同等以上の大きさのポリオレフィン系シート、又はポリエステル系シートのいずれかを敷設し、該シートの上面にウエーハの表面を位置付けて配設するウエーハ配設工程と、
該シートを介して該支持テーブルに配設されたウエーハを密閉環境内で減圧して該シートを加熱しウエーハを押圧して該シートにウエーハを圧着すると共に、該ウエーハの外周に該ウエーハを囲繞する盛り上がり部を形成するシート熱圧着工程と、
ウエーハの裏面に加工を施す裏面加工工程と、
ウエーハを該シートから剥離する剥離工程と、
から少なくとも構成されるウエーハの加工方法。 - 該支持テーブルは加熱手段を含み、該シート熱圧着工程において、該支持テーブルが該加熱手段で加熱される請求項1に記載のウエーハの加工方法。
- 該支持テーブルの上面はフッ素樹脂で被覆されている請求項1、又は2に記載のウエーハの加工方法。
- 該裏面加工工程において、ウエーハの裏面を研削する研削加工が実施される請求項1乃至3のいずれかに記載のウエーハの加工方法。
- 該ポリオレフィン系のシートは、ポリエチレンシート、ポリプロピレンシート、ポリスチレンシートのいずれかで構成される請求項1乃至4のいずれかに記載のウエーハの加工方法。
- 該シートとしてポリオレフィン系のシートが選択された場合の該シート熱圧着工程における該シートの加熱温度は、該シートがポリエチレンシートで構成される場合は120〜140℃であり、該シートがポリプロピレンシートで構成される場合は160〜180℃であり、該シートがポリスチレンシートで構成される場合は220〜240℃である請求項5に記載のウエーハの加工方法。
- 該ポリエステル系のシートは、ポリエチレンテレフタレートシート、ポリエチレンナフタレートシート、のいずれかで構成される請求項1乃至4のいずれかに記載のウエーハの加工方法。
- 該シートとしてポリエステル系のシートが選択された場合の該シート熱圧着工程における該シートの加熱温度は、該シートがポリエチレンテレフタレートシートで構成される場合は250〜270℃であり、該シートがポリエチレンナフタレートシートで構成される場合は160〜180℃である請求項7に記載のウエーハの加工方法。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018116015A JP2019220550A (ja) | 2018-06-19 | 2018-06-19 | ウエーハの加工方法 |
KR1020190061723A KR20190143359A (ko) | 2018-06-19 | 2019-05-27 | 웨이퍼의 가공 방법 |
MYPI2019003082A MY194178A (en) | 2018-06-19 | 2019-05-29 | Wafer processing method |
CN201910499815.1A CN110620081B (zh) | 2018-06-19 | 2019-06-11 | 晶片的加工方法 |
SG10201905294RA SG10201905294RA (en) | 2018-06-19 | 2019-06-11 | Wafer processing method |
US16/438,766 US11088008B2 (en) | 2018-06-19 | 2019-06-12 | Wafer processing method |
DE102019208701.9A DE102019208701A1 (de) | 2018-06-19 | 2019-06-14 | Waferbearbeitungsverfahren |
TW108121003A TWI803650B (zh) | 2018-06-19 | 2019-06-18 | 晶圓的加工方法 |
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JP7408237B2 (ja) | 2020-01-16 | 2024-01-05 | 株式会社ディスコ | ウェーハの加工方法 |
JP7463036B2 (ja) | 2020-08-21 | 2024-04-08 | 株式会社ディスコ | シート貼着方法及びシート貼着装置 |
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US11515171B2 (en) * | 2020-06-08 | 2022-11-29 | Micron Technology, Inc. | Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices |
JP2023012964A (ja) * | 2021-07-14 | 2023-01-26 | 株式会社ディスコ | 貼着方法及び貼着装置 |
JP2023019193A (ja) * | 2021-07-28 | 2023-02-09 | 株式会社ディスコ | 被加工物の加工方法 |
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CN110620081A (zh) | 2019-12-27 |
MY194178A (en) | 2022-11-17 |
US20190385887A1 (en) | 2019-12-19 |
TWI803650B (zh) | 2023-06-01 |
CN110620081B (zh) | 2024-03-15 |
TW202002037A (zh) | 2020-01-01 |
SG10201905294RA (en) | 2020-01-30 |
KR20190143359A (ko) | 2019-12-30 |
DE102019208701A1 (de) | 2019-12-19 |
US11088008B2 (en) | 2021-08-10 |
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