JP2019194512A - 延伸毛細管層で複数のベイパーチャンバーを連絡する統合型ベイパーチャンバーモジュール - Google Patents

延伸毛細管層で複数のベイパーチャンバーを連絡する統合型ベイパーチャンバーモジュール Download PDF

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Publication number
JP2019194512A
JP2019194512A JP2018125930A JP2018125930A JP2019194512A JP 2019194512 A JP2019194512 A JP 2019194512A JP 2018125930 A JP2018125930 A JP 2018125930A JP 2018125930 A JP2018125930 A JP 2018125930A JP 2019194512 A JP2019194512 A JP 2019194512A
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Japan
Prior art keywords
capillary layer
concave groove
stretched
capillary
flow channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018125930A
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English (en)
Japanese (ja)
Inventor
曾惓祺
Quan Qi Ceng
廖文靖
wen jing Liao
崔明全
Ming Quan Cui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tai Sol Electronics Co Ltd
Original Assignee
Tai Sol Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tai Sol Electronics Co Ltd filed Critical Tai Sol Electronics Co Ltd
Publication of JP2019194512A publication Critical patent/JP2019194512A/ja
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2018125930A 2018-05-04 2018-07-02 延伸毛細管層で複数のベイパーチャンバーを連絡する統合型ベイパーチャンバーモジュール Pending JP2019194512A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW107115226A TW201948015A (zh) 2018-05-04 2018-05-04 以延伸毛細層連絡複數均溫板的聯合均溫板總成
TW107115226 2018-05-04

Publications (1)

Publication Number Publication Date
JP2019194512A true JP2019194512A (ja) 2019-11-07

Family

ID=68383842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018125930A Pending JP2019194512A (ja) 2018-05-04 2018-07-02 延伸毛細管層で複数のベイパーチャンバーを連絡する統合型ベイパーチャンバーモジュール

Country Status (3)

Country Link
US (1) US20190339021A1 (zh)
JP (1) JP2019194512A (zh)
TW (1) TW201948015A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11234344B2 (en) * 2019-04-29 2022-01-25 Motorola Mobility Llc Heat transfer apparatus for a mobile device
CN113099679A (zh) * 2019-12-23 2021-07-09 亚浩电子五金塑胶（惠州）有限公司 均温板

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3543839A (en) * 1969-05-14 1970-12-01 Trw Inc Multi-chamber controllable heat pipe
US20060283577A1 (en) * 2005-06-17 2006-12-21 Tay-Jian Liu Loop-type heat exchange device
JP2013072627A (ja) * 2011-09-29 2013-04-22 Fujitsu Ltd ループ型ヒートパイプ及び電子機器
JP3206206U (ja) * 2016-06-02 2016-09-01 泰碩電子股▲分▼有限公司 気液分離構造を有するベイパーチャンバー
WO2017037921A1 (ja) * 2015-09-03 2017-03-09 富士通株式会社 ループヒートパイプ及びその製造方法並びに電子機器
US20180066896A1 (en) * 2016-09-08 2018-03-08 Taiwan Microloops Corp. Vapor chamber and heat pipe combined structure
US20180106552A1 (en) * 2016-10-14 2018-04-19 Taiwan Microloops Corp. Vapor chamber and heat pipe combined structure and combining method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102469744A (zh) * 2010-11-09 2012-05-23 富准精密工业(深圳)有限公司 平板式热管
US9453688B2 (en) * 2013-09-24 2016-09-27 Asia Vital Components Co., Ltd. Heat dissipation unit
US10077945B2 (en) * 2016-05-27 2018-09-18 Asia Vital Components Co., Ltd. Heat dissipation device
US11320211B2 (en) * 2017-04-11 2022-05-03 Cooler Master Co., Ltd. Heat transfer device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3543839A (en) * 1969-05-14 1970-12-01 Trw Inc Multi-chamber controllable heat pipe
US20060283577A1 (en) * 2005-06-17 2006-12-21 Tay-Jian Liu Loop-type heat exchange device
JP2013072627A (ja) * 2011-09-29 2013-04-22 Fujitsu Ltd ループ型ヒートパイプ及び電子機器
WO2017037921A1 (ja) * 2015-09-03 2017-03-09 富士通株式会社 ループヒートパイプ及びその製造方法並びに電子機器
JP3206206U (ja) * 2016-06-02 2016-09-01 泰碩電子股▲分▼有限公司 気液分離構造を有するベイパーチャンバー
US20180066896A1 (en) * 2016-09-08 2018-03-08 Taiwan Microloops Corp. Vapor chamber and heat pipe combined structure
US20180106552A1 (en) * 2016-10-14 2018-04-19 Taiwan Microloops Corp. Vapor chamber and heat pipe combined structure and combining method thereof

Also Published As

Publication number Publication date
TW201948015A (zh) 2019-12-16
US20190339021A1 (en) 2019-11-07

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