JP2019181603A - 研磨装置 - Google Patents
研磨装置 Download PDFInfo
- Publication number
- JP2019181603A JP2019181603A JP2018073222A JP2018073222A JP2019181603A JP 2019181603 A JP2019181603 A JP 2019181603A JP 2018073222 A JP2018073222 A JP 2018073222A JP 2018073222 A JP2018073222 A JP 2018073222A JP 2019181603 A JP2019181603 A JP 2019181603A
- Authority
- JP
- Japan
- Prior art keywords
- slurry
- polishing
- port
- introduction
- cleaning water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 127
- 239000002002 slurry Substances 0.000 claims abstract description 154
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 66
- 230000000149 penetrating effect Effects 0.000 claims abstract description 6
- 238000004140 cleaning Methods 0.000 claims description 60
- 238000002347 injection Methods 0.000 claims description 30
- 239000007924 injection Substances 0.000 claims description 30
- 238000005406 washing Methods 0.000 claims description 10
- 238000007517 polishing process Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
- B08B9/027—Cleaning the internal surfaces; Removal of blockages
- B08B9/032—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Disintegrating Or Milling (AREA)
- Polarising Elements (AREA)
Abstract
Description
2:装置ハウジング
3:研磨手段
4:スピンドルユニット
41:ハウジング
42:回転軸
42a:中空部
43:サーボモータ
46:スラリー供給路
5:研磨パッド
52:研磨シート
53:開口部
10:スラリー供給管
10b:供給口
10c:導入口
10d:噴射口
10e:誘導体
12:スラリー導入手段
12b:スラリー圧送ポンプ
12c:スラリーコントロール弁
13:洗浄水導入手段
13b:洗浄水圧送ポンプ
13c:洗浄水コントロール弁
Claims (3)
- 被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を研磨する研磨手段とを備えた研磨装置であって、
該研磨手段は、研磨パッドを備えた回転軸と、該回転軸を回転可能に支持するハウジングと、から少なくとも構成され、
該回転軸は、軸心方向に貫通する中空部を備え、
該研磨パッドは、該中空部に連通する開口部を中央に備え、
該中空部には、該チャックテーブルに保持された被加工物にスラリーを供給する供給口と該供給口の反対側に形成された導入口とを備えたスラリー供給管が挿入され、
該導入口には、該導入口にスラリーを導入するスラリー導入手段と該導入口に洗浄水を導入する洗浄水導入手段とが接続され、
該スラリー供給管の該供給口の上部近傍の側壁には、該中空部の内壁に向けた噴射口が形成されていて、
該スラリー導入手段によって該スラリー供給管に導入されるスラリーの流量は、該噴射口から噴射されずに該供給口に達し、該研磨パッドの該開口部から被加工物にスラリーが供給されるように設定され、
該洗浄水導入手段により導入される洗浄水の流量は、該スラリー導入手段によって導入されるスラリーの流量よりも多く、該噴射口から該中空部の内壁に向けて噴射され該中空部の該内壁を洗浄する流量に設定される研磨装置。 - 該供給口の内径は、該供給口に至る該スラリー供給管の内径に対して小さく形成されていて、該洗浄水導入手段により導入される該洗浄水が該噴射口から噴出して該中空部の内壁を洗浄する請求項1に記載の研磨装置。
- 該スラリー供給管の内部に該噴射口に洗浄水を誘導する誘導体が形成され、該洗浄水が該噴射口から噴出して該中空部の内壁を洗浄する請求項1、又は2に記載の研磨装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018073222A JP7032217B2 (ja) | 2018-04-05 | 2018-04-05 | 研磨装置 |
SG10201902673Q SG10201902673QA (en) | 2018-04-05 | 2019-03-26 | Polishing apparatus |
TW108110964A TWI783136B (zh) | 2018-04-05 | 2019-03-28 | 研磨裝置 |
US16/371,326 US11279000B2 (en) | 2018-04-05 | 2019-04-01 | Polishing apparatus |
CN201910256116.4A CN110340800B (zh) | 2018-04-05 | 2019-04-01 | 研磨装置 |
KR1020190039518A KR102678971B1 (ko) | 2018-04-05 | 2019-04-04 | 연마 장치 |
DE102019204883.8A DE102019204883B4 (de) | 2018-04-05 | 2019-04-05 | Poliervorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018073222A JP7032217B2 (ja) | 2018-04-05 | 2018-04-05 | 研磨装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019181603A true JP2019181603A (ja) | 2019-10-24 |
JP7032217B2 JP7032217B2 (ja) | 2022-03-08 |
Family
ID=67991606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018073222A Active JP7032217B2 (ja) | 2018-04-05 | 2018-04-05 | 研磨装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11279000B2 (ja) |
JP (1) | JP7032217B2 (ja) |
KR (1) | KR102678971B1 (ja) |
CN (1) | CN110340800B (ja) |
DE (1) | DE102019204883B4 (ja) |
SG (1) | SG10201902673QA (ja) |
TW (1) | TWI783136B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7108450B2 (ja) | 2018-04-13 | 2022-07-28 | 株式会社ディスコ | 研磨装置 |
CN115229592B (zh) * | 2022-08-09 | 2024-04-05 | 武汉宏海科技股份有限公司 | 空调机底盘加工用不规则盘底去毛刺清理装置及方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10329002A (ja) * | 1997-05-26 | 1998-12-15 | Matsushita Electric Works Ltd | 磁気研磨装置 |
JP2006344878A (ja) * | 2005-06-10 | 2006-12-21 | Disco Abrasive Syst Ltd | 加工装置および加工方法 |
JP2008044063A (ja) * | 2006-08-14 | 2008-02-28 | Nikon Corp | 研磨装置 |
JP2016119333A (ja) * | 2014-12-18 | 2016-06-30 | 株式会社荏原製作所 | バフ処理装置、および、基板処理装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0899265A (ja) | 1994-09-30 | 1996-04-16 | Disco Abrasive Syst Ltd | 研磨装置 |
US5582540A (en) * | 1996-01-22 | 1996-12-10 | National Science Council Of R.O.C | Hydrostatic and hydrodynamic polishing tool |
JP2000288927A (ja) * | 1999-04-07 | 2000-10-17 | Sony Corp | 平坦化研磨装置及び平坦化研磨方法 |
US7059948B2 (en) * | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
US6722964B2 (en) * | 2000-04-04 | 2004-04-20 | Ebara Corporation | Polishing apparatus and method |
JP2003236752A (ja) * | 2002-02-18 | 2003-08-26 | Disco Abrasive Syst Ltd | 研磨装置 |
JP4163485B2 (ja) * | 2002-10-25 | 2008-10-08 | 不二越機械工業株式会社 | 両面研磨装置およびこれを用いた研磨加工方法 |
US20040176017A1 (en) * | 2003-02-25 | 2004-09-09 | Aleksander Zelenski | Apparatus and methods for abrading a work piece |
JP2006216895A (ja) * | 2005-02-07 | 2006-08-17 | Disco Abrasive Syst Ltd | 半導体ウエーハの研磨装置 |
JP2007234882A (ja) * | 2006-03-01 | 2007-09-13 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板取り扱い方法 |
US8524035B2 (en) * | 2009-11-30 | 2013-09-03 | Corning Incorporated | Method and apparatus for conformable polishing |
JP2016159376A (ja) * | 2015-02-27 | 2016-09-05 | 株式会社ディスコ | 切削装置 |
JP6454599B2 (ja) * | 2015-05-14 | 2019-01-16 | 株式会社ディスコ | 研磨装置 |
JP6489973B2 (ja) * | 2015-07-30 | 2019-03-27 | 株式会社ディスコ | 研削装置 |
JP6685707B2 (ja) * | 2015-12-01 | 2020-04-22 | 株式会社ディスコ | 研磨装置 |
CN206541804U (zh) * | 2016-05-03 | 2017-10-03 | K.C.科技股份有限公司 | 基板处理*** |
JP6792363B2 (ja) * | 2016-07-22 | 2020-11-25 | 株式会社ディスコ | 研削装置 |
JP6844970B2 (ja) * | 2016-08-18 | 2021-03-17 | 株式会社ディスコ | 研磨装置 |
US11135612B2 (en) * | 2019-03-19 | 2021-10-05 | The Boeing Company | Rotating applicators having fluid dispensers |
-
2018
- 2018-04-05 JP JP2018073222A patent/JP7032217B2/ja active Active
-
2019
- 2019-03-26 SG SG10201902673Q patent/SG10201902673QA/en unknown
- 2019-03-28 TW TW108110964A patent/TWI783136B/zh active
- 2019-04-01 US US16/371,326 patent/US11279000B2/en active Active
- 2019-04-01 CN CN201910256116.4A patent/CN110340800B/zh active Active
- 2019-04-04 KR KR1020190039518A patent/KR102678971B1/ko active IP Right Grant
- 2019-04-05 DE DE102019204883.8A patent/DE102019204883B4/de active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10329002A (ja) * | 1997-05-26 | 1998-12-15 | Matsushita Electric Works Ltd | 磁気研磨装置 |
JP2006344878A (ja) * | 2005-06-10 | 2006-12-21 | Disco Abrasive Syst Ltd | 加工装置および加工方法 |
JP2008044063A (ja) * | 2006-08-14 | 2008-02-28 | Nikon Corp | 研磨装置 |
JP2016119333A (ja) * | 2014-12-18 | 2016-06-30 | 株式会社荏原製作所 | バフ処理装置、および、基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201944480A (zh) | 2019-11-16 |
DE102019204883A1 (de) | 2019-10-10 |
US20190308296A1 (en) | 2019-10-10 |
SG10201902673QA (en) | 2019-11-28 |
CN110340800B (zh) | 2022-07-12 |
TWI783136B (zh) | 2022-11-11 |
DE102019204883B4 (de) | 2022-12-29 |
KR102678971B1 (ko) | 2024-06-26 |
JP7032217B2 (ja) | 2022-03-08 |
KR20190116932A (ko) | 2019-10-15 |
CN110340800A (zh) | 2019-10-18 |
US11279000B2 (en) | 2022-03-22 |
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