JP2019148575A - 圧力センサーパッケージ構造 - Google Patents
圧力センサーパッケージ構造 Download PDFInfo
- Publication number
- JP2019148575A JP2019148575A JP2018054196A JP2018054196A JP2019148575A JP 2019148575 A JP2019148575 A JP 2019148575A JP 2018054196 A JP2018054196 A JP 2018054196A JP 2018054196 A JP2018054196 A JP 2018054196A JP 2019148575 A JP2019148575 A JP 2019148575A
- Authority
- JP
- Japan
- Prior art keywords
- pressure sensor
- package structure
- sensor module
- lead frames
- sensor package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000084 colloidal system Substances 0.000 claims abstract description 12
- 239000003566 sealing material Substances 0.000 claims abstract description 12
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims description 28
- 238000000465 moulding Methods 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000015572 biosynthetic process Effects 0.000 abstract 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0069—Electrical connection means from the sensor to its support
- G01L19/0076—Electrical connection means from the sensor to its support using buried connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
- G01L19/143—Two part housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
Description
図1に示すように、本発明の第1実施形態による圧力センサーパッケージ構造10は、パッケージリードフレーム部材20、側壁面30、圧力センサーモジュール40およびシリコーン封止材料50を備える。
図2は第2実施形態を示す断面図である。第1実施形態との違いは次のとおりである。第2実施形態において、側壁面30は成形樹脂(molding compound)から形成され、成形装置によって膠質成形層22の頂面21に接着される。
20:パッケージリードフレーム部材、
21:頂面、
22:膠質成形層、
23:底面、
24:リードフレーム、
25:頂部、
26:底部、
30:側壁面、
32:格納空間、
33:底部、
34:内壁面、
40:圧力センサーモジュール、
42、42A、42B:チップ、
50:シリコーン封止材料
Claims (7)
- パッケージリードフレーム部材、側壁面、圧力センサーモジュールおよびシリコーン封止材料を備え、
前記パッケージリードフレーム部材は、膠質成形層および複数のリードフレームを有し、前記膠質成形層は頂面を有し、複数の前記リードフレームは前記膠質成形層内に配置され、
前記側壁面は、前記膠質成形層の前記頂面を囲んで格納空間を形成し、
前記圧力センサーモジュールは、前記膠質成形層の前記頂面に位置し、前記格納空間に格納され、
前記シリコーン封止材料は、前記圧力センサーモジュールを覆うように前記格納空間に配置されることを特徴とする圧力センサーパッケージ構造。 - 前記膠質成形層はさらに底面を有し、複数の前記リードフレームは頂部が前記膠質成形層の前記頂面に露出し、底部が前記膠質成形層の前記底面に露出することを特徴とする請求項1に記載の圧力センサーパッケージ構造。
- 前記側壁面は成形樹脂または金属材料から製作されることを特徴とする請求項1に記載の圧力センサーパッケージ構造。
- 前記圧力センサーモジュールは複数のチップを有し、複数の前記チップは前記膠質成形層の前記頂面に積み重なるように配置されることを特徴とする請求項1に記載の圧力センサーパッケージ構造。
- 前記圧力センサーモジュールは金属線によって複数の前記リードフレームに電気的に接続されるか、フリップチップ実装(Flip-chip)の製作工程によって複数の前記リードフレームに電気的に接続されることを特徴とする請求項1に記載の圧力センサーパッケージ構造。
- 前記膠質成形層はエポキシ樹脂から形成されることを特徴とする請求項1に記載の圧力センサーパッケージ構造。
- 複数の前記リードフレームは金属材料から製作されることを特徴とする請求項1に記載の圧力センサーパッケージ構造。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107106587A TWI663692B (zh) | 2018-02-27 | 2018-02-27 | Pressure sensor package structure |
TW107106587 | 2018-02-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6487584B1 JP6487584B1 (ja) | 2019-03-20 |
JP2019148575A true JP2019148575A (ja) | 2019-09-05 |
Family
ID=65802390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018054196A Active JP6487584B1 (ja) | 2018-02-27 | 2018-03-22 | 圧力センサーパッケージ構造 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11041774B2 (ja) |
JP (1) | JP6487584B1 (ja) |
TW (1) | TWI663692B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018222781A1 (de) * | 2018-12-21 | 2020-06-25 | Robert Bosch Gmbh | Drucksensoranordnung |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3596199B2 (ja) * | 1996-11-28 | 2004-12-02 | 株式会社デンソー | 半導体式圧力センサ |
DE102004043663B4 (de) * | 2004-09-07 | 2006-06-08 | Infineon Technologies Ag | Halbleitersensorbauteil mit Hohlraumgehäuse und Sensorchip und Verfahren zur Herstellung eines Halbleitersensorbauteils mit Hohlraumgehäuse und Sensorchip |
DE102004051468A1 (de) * | 2004-10-22 | 2006-04-27 | Robert Bosch Gmbh | Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung |
US8493748B2 (en) * | 2007-06-27 | 2013-07-23 | Stats Chippac Ltd. | Packaging system with hollow package and method for the same |
US8035210B2 (en) * | 2007-12-28 | 2011-10-11 | Stats Chippac Ltd. | Integrated circuit package system with interposer |
US20120106085A1 (en) * | 2009-02-19 | 2012-05-03 | Takao Yamazaki | Vacuum sealed package, printed circuit board having vacuum sealed package, electronic device, and method for manufacturing vacuum sealed package |
US8390083B2 (en) * | 2009-09-04 | 2013-03-05 | Analog Devices, Inc. | System with recessed sensing or processing elements |
CN102486427A (zh) * | 2010-12-06 | 2012-06-06 | 飞思卡尔半导体公司 | 压力传感器及其封装方法 |
WO2012124282A1 (ja) * | 2011-03-11 | 2012-09-20 | パナソニック株式会社 | センサ |
US20140374848A1 (en) * | 2013-06-24 | 2014-12-25 | Wen Shi Koh | Semiconductor sensor device with metal lid |
TWI546913B (zh) * | 2014-04-02 | 2016-08-21 | 精材科技股份有限公司 | 晶片封裝體及其製造方法 |
US9476788B2 (en) * | 2014-04-22 | 2016-10-25 | Freescale Semiconductor, Inc. | Semiconductor sensor with gel filled cavity |
US9362479B2 (en) * | 2014-07-22 | 2016-06-07 | Freescale Semiconductor, Inc. | Package-in-package semiconductor sensor device |
CN107290096A (zh) * | 2016-04-11 | 2017-10-24 | 飞思卡尔半导体公司 | 具有膜片的压力感测集成电路器件 |
-
2018
- 2018-02-27 TW TW107106587A patent/TWI663692B/zh active
- 2018-03-16 US US15/923,574 patent/US11041774B2/en active Active
- 2018-03-22 JP JP2018054196A patent/JP6487584B1/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US20190265118A1 (en) | 2019-08-29 |
JP6487584B1 (ja) | 2019-03-20 |
TWI663692B (zh) | 2019-06-21 |
US11041774B2 (en) | 2021-06-22 |
TW201937664A (zh) | 2019-09-16 |
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