JP2018536986A - 基板キャリアシステム - Google Patents
基板キャリアシステム Download PDFInfo
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- JP2018536986A JP2018536986A JP2018519317A JP2018519317A JP2018536986A JP 2018536986 A JP2018536986 A JP 2018536986A JP 2018519317 A JP2018519317 A JP 2018519317A JP 2018519317 A JP2018519317 A JP 2018519317A JP 2018536986 A JP2018536986 A JP 2018536986A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (15)
- エンクロージャを画定するチャンバ本体と、
前記エンクロージャ内に配置され、ガスクッションを備える基板位置決めアセンブリと、
前記エンクロージャ内で前記基板位置決めアセンブリの周りに配置された作動される基板位置合わせアセンブリと、
前記基板位置決めアセンブリに係合するように配置されたブレーキアセンブリと
を備えるロードロックチャンバ。 - 前記基板位置決めアセンブリが、ベアリングプレートと、前記ベアリングプレートに結合された複数の支持ピンであって、各支持ピンが、軟らかい先端部を有する、複数の支持ピンと、前記ベアリングプレートを支持するように配置されたガスクッション部材とを備える、請求項1に記載のロードロックチャンバ。
- 前記基板位置合わせアセンブリが、位置合わせ支持体と、前記位置合わせ支持体に接続された位置合わせ部材とを備える、請求項1に記載のロードロックチャンバ。
- 前記位置合わせ支持体が、第1の端部および第2の端部を有する軸方向部と、前記位置合わせ部材を前記位置合わせ支持体に接続する前記第1の端部からの延長部と、前記第2の端部から延びるシェルフとを含む、請求項3に記載のロードロックチャンバ。
- 前記シェルフ上に取り外し可能に配置されたキャリアをさらに備え、前記キャリアおよびシェルフが、マッチング位置合わせ機構を有する、請求項4に記載のロードロックチャンバ。
- 前記ブレーキアセンブリが、前記チャンバ本体の壁の複数の開口部を通って配置され、ブレーキ支持体に結合された複数のブレーキピンと、前記複数の開口部の周りに配置されたシール部材と、前記ブレーキ支持体に結合されたアクチュエータとを備える、請求項1に記載のロードロックチャンバ。
- 前記基板位置合わせアセンブリが、位置合わせ支持体と、前記位置合わせ支持体に接続された位置合わせ部材と、前記チャンバ本体の壁の開口部を通って配置され、前記位置合わせ支持体に結合されたポジショナと、前記ポジショナに結合されたアクチュエータとを備える、請求項1に記載のロードロックチャンバ。
- 前記位置合わせ部材が、リングの少なくとも一部であり、前記位置合わせ部材の内半径に配置された複数の位置合わせピンを含み、各位置合わせピンが、傾斜した内側エッジを有する、請求項7に記載のロードロックチャンバ。
- エンクロージャを画定するチャンバ本体と、
前記エンクロージャ内に配置され、ガスクッションを備える基板位置決めアセンブリと、
前記エンクロージャ内で前記基板位置決めアセンブリの周りに配置された作動される基板位置合わせアセンブリであって、
位置合わせ支持体と、
前記位置合わせ支持体に接続された位置合わせ部材であって、内半径と、前記内半径に配置された複数の位置合わせピンとを有する位置合わせ部材と
を備える基板位置合わせアセンブリと、
前記基板位置決めアセンブリに係合するように配置されたブレーキアセンブリと
を備えるロードロックチャンバ。 - 前記ブレーキアセンブリが、前記チャンバ本体の壁の複数の開口部を通って配置され、ブレーキ支持体に結合された複数のブレーキピンと、前記ブレーキ支持体に結合されたアクチュエータと、前記複数の開口部の周りに配置されたシール部材とを備える、請求項9に記載のロードロックチャンバ。
- 前記基板位置決めアセンブリが、ベアリングプレートと、前記ベアリングプレートに結合された複数の支持ピンであって、前記支持ピンの各々が、軟らかい先端部を有する、複数の支持ピンと、前記ベアリングプレートを支持するように配置されたガスクッション部材とを備える、請求項9に記載のロードロックチャンバ。
- 前記位置合わせアセンブリが、基板位置合わせ位置と基板搬送位置との間で移動するように作動される、請求項9に記載のロードロックチャンバ。
- 前記基板位置合わせアセンブリが、
前記位置合わせ支持体に結合されたポジショナと、
前記ポジショナに結合されたリニアアクチュエータと、
前記ポジショナに結合された横方向の力検出器と
をさらに備える、請求項9に記載のロードロックチャンバ。 - エンクロージャを画定するチャンバ本体と、
前記エンクロージャ内に配置された基板位置決めアセンブリであって、軟らかい先端部を有する複数の支持ピンと、前記複数のピンに結合されたベアリングプレートと、前記ベアリングプレートを支持するように配置されたガスクッションとを備える基板位置決めアセンブリと、
前記エンクロージャ内で前記基板位置決めアセンブリの周りに配置された作動される基板位置合わせアセンブリであって、
軸方向部と、前記軸方向部の第1の端部における第1の延長部と、前記軸方向部の第2の端部におけるシェルフとを有する位置合わせ支持体と、
前記第1の延長部によって前記位置合わせ支持体に接続された位置合わせ部材であって、内半径と、前記内半径に配置された複数の位置合わせピンとを有し、各位置合わせピンが、傾斜した内側エッジを有する、位置合わせ部材と、
前記位置合わせ支持体に結合されたポジショナと、
前記ポジショナに結合されたアクチュエータと
を備える基板位置合わせアセンブリと、
前記基板位置決めアセンブリに係合するように配置されたブレーキアセンブリであって、前記チャンバ本体の壁の複数の開口部を通って配置され、ブレーキ支持体に結合された複数のブレーキピンと、前記ブレーキ支持体に結合されたアクチュエータと、前記複数の開口部の周りに配置されたシール部材とを備えるブレーキアセンブリと
を備えるロードロックチャンバ。 - 前記シェルフ上に取り外し可能に配置されたキャリアをさらに備える、請求項14に記載のロードロックチャンバ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562242174P | 2015-10-15 | 2015-10-15 | |
US62/242,174 | 2015-10-15 | ||
PCT/US2016/056798 WO2017066418A1 (en) | 2015-10-15 | 2016-10-13 | Substrate carrier system |
Publications (3)
Publication Number | Publication Date |
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JP2018536986A true JP2018536986A (ja) | 2018-12-13 |
JP2018536986A5 JP2018536986A5 (ja) | 2019-11-28 |
JP6942121B2 JP6942121B2 (ja) | 2021-09-29 |
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JP2018519317A Active JP6942121B2 (ja) | 2015-10-15 | 2016-10-13 | 基板キャリアシステム |
Country Status (6)
Country | Link |
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US (1) | US9929029B2 (ja) |
EP (1) | EP3363044B1 (ja) |
JP (1) | JP6942121B2 (ja) |
KR (1) | KR102615853B1 (ja) |
TW (1) | TWI691006B (ja) |
WO (1) | WO2017066418A1 (ja) |
Cited By (5)
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WO2020137169A1 (ja) * | 2018-12-27 | 2020-07-02 | 株式会社Sumco | 気相成長装置 |
WO2020208923A1 (ja) * | 2019-04-11 | 2020-10-15 | 株式会社Sumco | 気相成長装置及びこれに用いられるキャリア |
WO2020213236A1 (ja) * | 2019-04-18 | 2020-10-22 | 株式会社Sumco | 気相成長方法及び気相成長装置 |
WO2021124756A1 (ja) * | 2019-12-19 | 2021-06-24 | 株式会社Sumco | 気相成長装置及び気相成長方法 |
JP2021097180A (ja) * | 2019-12-19 | 2021-06-24 | 株式会社Sumco | 気相成長装置及び気相成長処理方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102615853B1 (ko) * | 2015-10-15 | 2023-12-21 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 캐리어 시스템 |
DE102015223807A1 (de) * | 2015-12-01 | 2017-06-01 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe mit epitaktischer Schicht in einer Abscheidekammer, Vorrichtung zur Herstellung einer Halbleiterscheibe mit epitaktischer Schicht und Halbleiterscheibe mit epitaktischer Schicht |
US10872804B2 (en) * | 2017-11-03 | 2020-12-22 | Asm Ip Holding B.V. | Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination |
US10872803B2 (en) | 2017-11-03 | 2020-12-22 | Asm Ip Holding B.V. | Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination |
US10755955B2 (en) | 2018-02-12 | 2020-08-25 | Applied Materials, Inc. | Substrate transfer mechanism to reduce back-side substrate contact |
CN112005356B (zh) * | 2018-05-03 | 2024-06-14 | 应用材料公司 | 高速旋转分类器中的基板倾斜控制 |
US11499666B2 (en) * | 2018-05-25 | 2022-11-15 | Applied Materials, Inc. | Precision dynamic leveling mechanism with long motion capability |
JP7003905B2 (ja) | 2018-12-27 | 2022-01-21 | 株式会社Sumco | 気相成長装置 |
JP7147551B2 (ja) * | 2018-12-27 | 2022-10-05 | 株式会社Sumco | 気相成長装置及びこれに用いられるキャリア |
JP7245071B2 (ja) * | 2019-02-21 | 2023-03-23 | 株式会社ジェイテクトサーモシステム | 基板支持装置 |
JP7188256B2 (ja) | 2019-04-18 | 2022-12-13 | 株式会社Sumco | 気相成長方法及び気相成長装置 |
EP3999912A4 (en) * | 2019-07-17 | 2023-08-02 | Applied Materials, Inc. | POST-EXPOSURE TREATMENT METHODS AND APPARATUS |
JP6999614B2 (ja) * | 2019-07-26 | 2022-01-18 | 株式会社バルカー | 支持部材 |
JP7205458B2 (ja) | 2019-12-25 | 2023-01-17 | 株式会社Sumco | 気相成長装置 |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09278179A (ja) * | 1996-04-16 | 1997-10-28 | Hitachi Ltd | 搬送機 |
JPH1180950A (ja) * | 1997-07-11 | 1999-03-26 | Applied Materials Inc | ウェハをアラインメントさせる装置および方法 |
JP2003017545A (ja) * | 2001-07-04 | 2003-01-17 | Matsushita Electric Ind Co Ltd | 基板の位置決め方法と装置 |
JP2003124293A (ja) * | 2001-10-16 | 2003-04-25 | Hitachi Kiden Kogyo Ltd | 薄板物品の位置決め装置 |
JP2005518674A (ja) * | 2002-02-22 | 2005-06-23 | アプライド マテリアルズ インコーポレイテッド | 基板支持体 |
JP2006066747A (ja) * | 2004-08-30 | 2006-03-09 | Hitachi High-Tech Electronics Engineering Co Ltd | 基板の位置決め装置及び位置決め方法 |
JP2006216982A (ja) * | 1995-12-12 | 2006-08-17 | Tokyo Electron Ltd | 半導体処理装置 |
JP2007073646A (ja) * | 2005-09-05 | 2007-03-22 | Tokyo Electron Ltd | 基板位置合わせ装置および基板収容ユニット |
JP2008182127A (ja) * | 2007-01-25 | 2008-08-07 | Tokyo Ohka Kogyo Co Ltd | 重ね合わせユニット及び貼り合わせ装置 |
US20090181553A1 (en) * | 2008-01-11 | 2009-07-16 | Blake Koelmel | Apparatus and method of aligning and positioning a cold substrate on a hot surface |
CN101840880A (zh) * | 2010-03-24 | 2010-09-22 | 友达光电(苏州)有限公司 | 基板夹取装置 |
JP2010267894A (ja) * | 2009-05-18 | 2010-11-25 | Panasonic Corp | プラズマ処理装置及びプラズマ処理装置におけるトレイの載置方法 |
US20110318142A1 (en) * | 2008-12-11 | 2011-12-29 | Christopher Gage | Minimum contact area wafer clamping with gas flow for rapid wafer cooling |
JP2012195427A (ja) * | 2011-03-16 | 2012-10-11 | Ulvac Japan Ltd | 基板処理装置及び基板処理方法 |
US20150243542A1 (en) * | 2014-02-27 | 2015-08-27 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method |
JP2015167159A (ja) * | 2014-03-03 | 2015-09-24 | 東京エレクトロン株式会社 | 基板載置装置及び基板処理装置 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5800686A (en) * | 1993-04-05 | 1998-09-01 | Applied Materials, Inc. | Chemical vapor deposition chamber with substrate edge protection |
JP3082624B2 (ja) * | 1994-12-28 | 2000-08-28 | 住友金属工業株式会社 | 静電チャックの使用方法 |
US6120609A (en) * | 1996-10-25 | 2000-09-19 | Applied Materials, Inc. | Self-aligning lift mechanism |
KR100434790B1 (ko) * | 1997-05-20 | 2004-06-07 | 동경 엘렉트론 주식회사 | 처리 장치 |
US6197117B1 (en) * | 1997-07-23 | 2001-03-06 | Applied Materials, Inc. | Wafer out-of-pocket detector and susceptor leveling tool |
US5974681A (en) * | 1997-09-10 | 1999-11-02 | Speedfam-Ipec Corp. | Apparatus for spin drying a workpiece |
US6146463A (en) * | 1998-06-12 | 2000-11-14 | Applied Materials, Inc. | Apparatus and method for aligning a substrate on a support member |
US6063196A (en) * | 1998-10-30 | 2000-05-16 | Applied Materials, Inc. | Semiconductor processing chamber calibration tool |
US6168668B1 (en) * | 1998-11-25 | 2001-01-02 | Applied Materials, Inc. | Shadow ring and guide for supporting the shadow ring in a chamber |
DE19901291C2 (de) * | 1999-01-15 | 2002-04-18 | Sez Semiconduct Equip Zubehoer | Vorrichtung zur Ätzbehandlung eines scheibenförmigen Gegenstandes |
US6695546B2 (en) * | 2000-03-28 | 2004-02-24 | Mirae Corporation | Single drive aligner elevation apparatus for an integrated circuit handler |
US6743296B2 (en) * | 2001-10-12 | 2004-06-01 | Taiwan Semiconductor Manufacturing Co., Ltd | Apparatus and method for self-centering a wafer in a sputter chamber |
JP4244555B2 (ja) * | 2002-02-25 | 2009-03-25 | 東京エレクトロン株式会社 | 被処理体の支持機構 |
WO2005055312A1 (ja) * | 2003-12-04 | 2005-06-16 | Hirata Corporation | 基板位置決めシステム |
JP2006005177A (ja) * | 2004-06-17 | 2006-01-05 | Tokyo Electron Ltd | 熱処理装置 |
KR100574058B1 (ko) * | 2004-08-20 | 2006-04-27 | 삼성전자주식회사 | 웨이퍼 베이크 장치 |
JP4619854B2 (ja) * | 2005-04-18 | 2011-01-26 | 東京エレクトロン株式会社 | ロードロック装置及び処理方法 |
JP4781802B2 (ja) * | 2005-12-06 | 2011-09-28 | 東京応化工業株式会社 | サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法 |
JP2008192840A (ja) * | 2007-02-05 | 2008-08-21 | Tokyo Electron Ltd | 真空処理装置及び真空処理方法並びに記憶媒体 |
JP2008300414A (ja) * | 2007-05-29 | 2008-12-11 | Dainippon Screen Mfg Co Ltd | 薄膜形成装置および薄膜形成方法 |
JP4616873B2 (ja) * | 2007-09-28 | 2011-01-19 | 東京エレクトロン株式会社 | 半導体製造装置、基板保持方法及びプログラム |
JP2009182235A (ja) * | 2008-01-31 | 2009-08-13 | Tokyo Electron Ltd | ロードロック装置および基板冷却方法 |
EP2321846A4 (en) | 2008-08-12 | 2012-03-14 | Applied Materials Inc | ELECTROSTATIC FODDER ASSEMBLY |
JP2010087342A (ja) * | 2008-10-01 | 2010-04-15 | Toray Eng Co Ltd | リフトピン |
US8314371B2 (en) * | 2008-11-06 | 2012-11-20 | Applied Materials, Inc. | Rapid thermal processing chamber with micro-positioning system |
US8388853B2 (en) * | 2009-02-11 | 2013-03-05 | Applied Materials, Inc. | Non-contact substrate processing |
US10167554B2 (en) * | 2010-12-30 | 2019-01-01 | Veeco Instruments Inc. | Wafer processing with carrier extension |
JP6114698B2 (ja) * | 2011-03-01 | 2017-04-12 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | デュアルロードロック構成内の除害及びストリップ処理チャンバ |
CN110610894B (zh) * | 2012-11-27 | 2023-08-04 | 盛美半导体设备(上海)股份有限公司 | 使用基板支撑装置清洗基板背面的方法 |
US9355876B2 (en) * | 2013-03-15 | 2016-05-31 | Applied Materials, Inc. | Process load lock apparatus, lift assemblies, electronic device processing systems, and methods of processing substrates in load lock locations |
JP6181438B2 (ja) * | 2013-06-24 | 2017-08-16 | 株式会社荏原製作所 | 基板保持装置および基板洗浄装置 |
CN106133873B (zh) * | 2014-03-12 | 2019-07-05 | 应用材料公司 | 在半导体腔室中的晶片旋转 |
JP6270270B2 (ja) * | 2014-03-17 | 2018-01-31 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
US20160314997A1 (en) * | 2015-04-22 | 2016-10-27 | Applied Materials, Inc. | Loadlock apparatus, cooling plate assembly, and electronic device processing systems and methods |
KR102615853B1 (ko) * | 2015-10-15 | 2023-12-21 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 캐리어 시스템 |
-
2016
- 2016-10-13 KR KR1020187013702A patent/KR102615853B1/ko active IP Right Grant
- 2016-10-13 WO PCT/US2016/056798 patent/WO2017066418A1/en active Application Filing
- 2016-10-13 EP EP16856168.6A patent/EP3363044B1/en active Active
- 2016-10-13 US US15/292,680 patent/US9929029B2/en active Active
- 2016-10-13 JP JP2018519317A patent/JP6942121B2/ja active Active
- 2016-10-14 TW TW105133136A patent/TWI691006B/zh active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006216982A (ja) * | 1995-12-12 | 2006-08-17 | Tokyo Electron Ltd | 半導体処理装置 |
JPH09278179A (ja) * | 1996-04-16 | 1997-10-28 | Hitachi Ltd | 搬送機 |
JPH1180950A (ja) * | 1997-07-11 | 1999-03-26 | Applied Materials Inc | ウェハをアラインメントさせる装置および方法 |
JP2003017545A (ja) * | 2001-07-04 | 2003-01-17 | Matsushita Electric Ind Co Ltd | 基板の位置決め方法と装置 |
JP2003124293A (ja) * | 2001-10-16 | 2003-04-25 | Hitachi Kiden Kogyo Ltd | 薄板物品の位置決め装置 |
JP2005518674A (ja) * | 2002-02-22 | 2005-06-23 | アプライド マテリアルズ インコーポレイテッド | 基板支持体 |
JP2006066747A (ja) * | 2004-08-30 | 2006-03-09 | Hitachi High-Tech Electronics Engineering Co Ltd | 基板の位置決め装置及び位置決め方法 |
JP2007073646A (ja) * | 2005-09-05 | 2007-03-22 | Tokyo Electron Ltd | 基板位置合わせ装置および基板収容ユニット |
JP2008182127A (ja) * | 2007-01-25 | 2008-08-07 | Tokyo Ohka Kogyo Co Ltd | 重ね合わせユニット及び貼り合わせ装置 |
US20090181553A1 (en) * | 2008-01-11 | 2009-07-16 | Blake Koelmel | Apparatus and method of aligning and positioning a cold substrate on a hot surface |
US20110318142A1 (en) * | 2008-12-11 | 2011-12-29 | Christopher Gage | Minimum contact area wafer clamping with gas flow for rapid wafer cooling |
JP2010267894A (ja) * | 2009-05-18 | 2010-11-25 | Panasonic Corp | プラズマ処理装置及びプラズマ処理装置におけるトレイの載置方法 |
CN101840880A (zh) * | 2010-03-24 | 2010-09-22 | 友达光电(苏州)有限公司 | 基板夹取装置 |
JP2012195427A (ja) * | 2011-03-16 | 2012-10-11 | Ulvac Japan Ltd | 基板処理装置及び基板処理方法 |
US20150243542A1 (en) * | 2014-02-27 | 2015-08-27 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method |
JP2015167159A (ja) * | 2014-03-03 | 2015-09-24 | 東京エレクトロン株式会社 | 基板載置装置及び基板処理装置 |
Cited By (23)
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JP2020107718A (ja) * | 2018-12-27 | 2020-07-09 | 株式会社Sumco | 気相成長装置 |
US11898246B2 (en) | 2018-12-27 | 2024-02-13 | Sumco Corporation | Vapor deposition device |
WO2020137169A1 (ja) * | 2018-12-27 | 2020-07-02 | 株式会社Sumco | 気相成長装置 |
JP7188250B2 (ja) | 2019-04-11 | 2022-12-13 | 株式会社Sumco | 気相成長装置及びこれに用いられるキャリア |
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JP6942121B2 (ja) | 2021-09-29 |
EP3363044A4 (en) | 2019-06-12 |
EP3363044B1 (en) | 2021-12-15 |
TW201725645A (zh) | 2017-07-16 |
KR102615853B1 (ko) | 2023-12-21 |
US9929029B2 (en) | 2018-03-27 |
WO2017066418A1 (en) | 2017-04-20 |
US20170110352A1 (en) | 2017-04-20 |
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