JP2018196920A - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP2018196920A JP2018196920A JP2017102601A JP2017102601A JP2018196920A JP 2018196920 A JP2018196920 A JP 2018196920A JP 2017102601 A JP2017102601 A JP 2017102601A JP 2017102601 A JP2017102601 A JP 2017102601A JP 2018196920 A JP2018196920 A JP 2018196920A
- Authority
- JP
- Japan
- Prior art keywords
- light
- unit
- cutting
- blade
- edge detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 337
- 238000003708 edge detection Methods 0.000 claims description 137
- 238000006243 chemical reaction Methods 0.000 claims description 37
- 238000007689 inspection Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 26
- 238000001514 detection method Methods 0.000 abstract description 9
- 238000004140 cleaning Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000003384 imaging method Methods 0.000 description 5
- 239000013307 optical fiber Substances 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 208000033748 Device issues Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mining & Mineral Resources (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Dicing (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Confectionery (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Description
4 装置基台
6 X軸移動テーブル
8 チャックテーブル
8a 保持面
10 クランプ
12 X軸ガイドレール
14 X軸ボールねじ
16 X軸パルスモータ
18 切削ユニット
18a 切削ブレード
18b 刃先の下端
20 排水路
22 支持構造
24 Y軸ガイドレール
26 Y軸移動プレート
28 Y軸ボールねじ
28a Y軸パルスモータ
30 Z軸ガイドレール
32 Z軸移動プレート
34 Z軸ボールねじ
36 Z軸パルスモータ
38 撮像ユニット(カメラ)
40 刃先検出ユニット
42 表示モニタ
42a 受光量ゲージ
42b 警告
44 警報ランプ
46 制御ユニット
48 本体
48a 切削ブレード進入溝
48b カバー
50 発光部
50a 光源
50b 調光器
52 受光部
52a 光電変換部
54 受光量判定部
54a 閾値登録部
54b 閾値
56 刃先検出可否判定部
56a 関係登録部
58 刃先検出部
60 補正部
62 報知ユニット
64a,64b,64c 切削ブレードの下降時間と出力される電圧との関係
66 基準電圧
68 汚れ
Claims (2)
- 被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を切削する切削ブレードが装着された切削ユニットと、該切削ユニットを該チャックテーブルに対して切り込み送り方向に移動させる切り込み送りユニットと、該切削ユニットの該切り込み送り方向における位置を認識する位置認識ユニットと、発光部及び受光部を有し該切削ブレードの刃先の下端の該切り込み送り方向における位置を検出する刃先検出ユニットと、警告を発する報知ユニットと、各構成要素を制御する制御ユニットと、を備える切削装置であって、
該刃先検出ユニットは、該発光部及び該受光部の間に切削ブレードが進入した状態で該発光部から光を放射し、該光のうち該切削ブレードにより遮蔽されずに該受光部に到達した光を受光し、該光の受光量から該切削ブレードの刃先の下端の該切り込み方向における位置を検出する刃先検出機能を有し、
該制御ユニットは、
該発光部及び該受光部の間に該切削ブレードが進入していない状態で、該発光部から放射され該受光部に到達して受光された光の受光量が閾値に達しているか否かを判定する受光量判定部と、
該発光部及び該受光部の間に進入する該切削ブレードの該切り込み送り方向における位置と、該発光部から放射され該切削ブレードに遮られずに該受光部に到達する光の受光量と、の基準となる関係が登録される関係登録部と、
該発光部及び該受光部の間に該切削ブレードが進入していない状態で、受光される光の受光量が該閾値に達していないと該受光量判定部が判定する場合に、該切削ブレードを該発光部と該受光部との間に進入させ、該切削ブレードの該切り込み送り方向における位置と、該発光部から放射され該切削ブレードに遮られずに該受光部に到達する光の受光量と、の関係を検出し、検出した該関係と、該関係登録部に登録された該基準となる関係と、を比較し、該刃先検出ユニットが該刃先検出機能を発揮できるか否かを判定する刃先検出可否判定部と、を備え、
該刃先検出ユニットが該刃先検出機能を発揮できないと該刃先検出可否判定部が判定する場合に該報知ユニットから該刃先検出ユニットの点検を促す警告を発することを特徴とする切削装置。 - 該刃先検出ユニットは、
該受光部に到達した光を受光し、該光の受光量に応じた電気信号を出力する光電変換部と、
該発光部が放射する光の強度を調節する調光器と、を備え、
該制御ユニットは、該刃先検出ユニットが該刃先検出機能を発揮できると該刃先検出可否判定部が判定する場合、該調光器により該発光部から放射される光の強度を増大させ、該発光部及び該受光部の間に該切削ブレードが進入していない状態で該発光部から放射され該受光部に到達し該光電変換部で受光された光の受光量を該閾値以上となるように調整することを特徴とする請求項1記載の切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017102601A JP6932436B2 (ja) | 2017-05-24 | 2017-05-24 | 切削装置 |
KR1020180053514A KR102388222B1 (ko) | 2017-05-24 | 2018-05-10 | 절삭 장치 |
TW107117330A TWI774771B (zh) | 2017-05-24 | 2018-05-22 | 切割裝置 |
CN201810493357.6A CN108943444B (zh) | 2017-05-24 | 2018-05-22 | 切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017102601A JP6932436B2 (ja) | 2017-05-24 | 2017-05-24 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018196920A true JP2018196920A (ja) | 2018-12-13 |
JP6932436B2 JP6932436B2 (ja) | 2021-09-08 |
Family
ID=64499348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017102601A Active JP6932436B2 (ja) | 2017-05-24 | 2017-05-24 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6932436B2 (ja) |
KR (1) | KR102388222B1 (ja) |
CN (1) | CN108943444B (ja) |
TW (1) | TWI774771B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114102718A (zh) * | 2020-08-26 | 2022-03-01 | Towa株式会社 | 切割装置以及切割品的制造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7325203B2 (ja) * | 2019-03-25 | 2023-08-14 | 株式会社ディスコ | 加工装置 |
JP7325904B2 (ja) * | 2019-07-26 | 2023-08-15 | 株式会社ディスコ | 切削ユニットの位置検出方法、及び切削装置 |
CN110744731B (zh) * | 2019-10-30 | 2021-07-27 | 许昌学院 | 一种基于光电控制的晶片切片设备 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03261219A (ja) * | 1990-03-09 | 1991-11-21 | Omron Corp | 光電スイッチ |
JPH0550363A (ja) * | 1991-08-21 | 1993-03-02 | Tokyo Seimitsu Co Ltd | ブレード位置検出装置及びその信頼性の判定方法 |
JPH0947943A (ja) * | 1995-08-10 | 1997-02-18 | Disco Abrasive Syst Ltd | ブレードの非接触セットアップ手段 |
JP2002343745A (ja) * | 2001-05-14 | 2002-11-29 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
US20030082995A1 (en) * | 2001-11-01 | 2003-05-01 | Motty Cohen | In-situ wear measurement apparatus for dicing saw blades |
JP2007158641A (ja) * | 2005-12-05 | 2007-06-21 | Keyence Corp | 光電センサ |
JP2009083076A (ja) * | 2007-10-03 | 2009-04-23 | Disco Abrasive Syst Ltd | 切削装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4590058B2 (ja) | 2000-04-12 | 2010-12-01 | 株式会社ディスコ | 切削装置の切削ブレード検出機構 |
JP2009083077A (ja) * | 2007-10-03 | 2009-04-23 | Disco Abrasive Syst Ltd | 切削ブレード検出機構 |
JP6294748B2 (ja) * | 2014-04-23 | 2018-03-14 | 株式会社ディスコ | 切削装置 |
JP6491044B2 (ja) * | 2015-05-29 | 2019-03-27 | Towa株式会社 | 製造装置及び製造方法 |
-
2017
- 2017-05-24 JP JP2017102601A patent/JP6932436B2/ja active Active
-
2018
- 2018-05-10 KR KR1020180053514A patent/KR102388222B1/ko active IP Right Grant
- 2018-05-22 CN CN201810493357.6A patent/CN108943444B/zh active Active
- 2018-05-22 TW TW107117330A patent/TWI774771B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03261219A (ja) * | 1990-03-09 | 1991-11-21 | Omron Corp | 光電スイッチ |
JPH0550363A (ja) * | 1991-08-21 | 1993-03-02 | Tokyo Seimitsu Co Ltd | ブレード位置検出装置及びその信頼性の判定方法 |
JPH0947943A (ja) * | 1995-08-10 | 1997-02-18 | Disco Abrasive Syst Ltd | ブレードの非接触セットアップ手段 |
JP2002343745A (ja) * | 2001-05-14 | 2002-11-29 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
US20030082995A1 (en) * | 2001-11-01 | 2003-05-01 | Motty Cohen | In-situ wear measurement apparatus for dicing saw blades |
JP2007158641A (ja) * | 2005-12-05 | 2007-06-21 | Keyence Corp | 光電センサ |
JP2009083076A (ja) * | 2007-10-03 | 2009-04-23 | Disco Abrasive Syst Ltd | 切削装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114102718A (zh) * | 2020-08-26 | 2022-03-01 | Towa株式会社 | 切割装置以及切割品的制造方法 |
CN114102718B (zh) * | 2020-08-26 | 2024-01-30 | Towa株式会社 | 切割装置以及切割品的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN108943444A (zh) | 2018-12-07 |
KR102388222B1 (ko) | 2022-04-18 |
TWI774771B (zh) | 2022-08-21 |
JP6932436B2 (ja) | 2021-09-08 |
CN108943444B (zh) | 2021-11-19 |
KR20180128834A (ko) | 2018-12-04 |
TW201901787A (zh) | 2019-01-01 |
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