JP2018179758A - 電気的接続装置 - Google Patents
電気的接続装置 Download PDFInfo
- Publication number
- JP2018179758A JP2018179758A JP2017079748A JP2017079748A JP2018179758A JP 2018179758 A JP2018179758 A JP 2018179758A JP 2017079748 A JP2017079748 A JP 2017079748A JP 2017079748 A JP2017079748 A JP 2017079748A JP 2018179758 A JP2018179758 A JP 2018179758A
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- Prior art keywords
- electrical connection
- probes
- connection device
- main surface
- space transformer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
Description
上記のように本発明は実施形態によって記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。この開示から当業者には様々な代替実施形態、実施例及び運用技術が明らかとなろう。
2…被検査体
10…プローブ
20…プローブヘッド
30…スペーストランスフォーマ
31…支持基板
32…樹脂層
33…接続配線
34…配線パターン
40…電極基板
41…電極パッド
42…接続パッド
50…電子部品
Claims (8)
- 被検査体の電気的特性の測定に使用される電気的接続装置であって、
測定時に先端部が前記被検査体と接触する複数のプローブと、
前記複数のプローブのいずれかの基端部と電気的に接続される第1の端子が第1主面に配置されるとともに第2の端子が第2主面に露出する接続配線を複数有し、前記複数のプローブのうちで測定時に同一電位に設定される複数の同一電位プローブの基端部を同一の前記接続配線と電気的に接続する短絡配線パターンが前記第1主面に形成されたスペーストランスフォーマと
を備えることを特徴とする電気的接続装置。 - 前記短絡配線パターンが、隣接する複数の前記同一電位プローブを接続することを特徴とする請求項1に記載の電気的接続装置。
- 1つの前記短絡配線パターンと電気的に接続する前記接続配線が複数あることを特徴とする請求項1又は2に記載の電気的接続装置。
- 前記第2の端子の間隔が前記第1の端子の間隔よりも広いことを特徴とする請求項1乃至3のいずれか1項に記載の電気的接続装置。
- 複数の前記第2の端子のそれぞれと電気的に接続される複数の電極パッドが配置された電極基板を更に備えることを特徴とする請求項1乃至4のいずれか1項に記載の電気的接続装置。
- 前記接続配線の前記第2主面から延伸する部分によって、前記プローブの基端部と前記電極パッドとが電気的に接続されていることを特徴とする請求項5に記載の電気的接続装置。
- 前記接続配線が柔軟性を有する導電性ワイヤであることを特徴とする請求項1乃至6のいずれか1項に記載の電気的接続装置。
- 前記スペーストランスフォーマが支持基板の上に樹脂層を配置した構成であり、前記第2主面で前記樹脂層によって前記接続配線の位置が固定されていることを特徴とする請求項1乃至7のいずれか1項に記載の電気的接続装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017079748A JP7101457B2 (ja) | 2017-04-13 | 2017-04-13 | 電気的接続装置 |
CN201880024849.9A CN110506212B (zh) | 2017-04-13 | 2018-04-03 | 电连接装置 |
KR1020197030275A KR102195561B1 (ko) | 2017-04-13 | 2018-04-03 | 전기적 접속 장치 |
US16/604,544 US11209460B2 (en) | 2017-04-13 | 2018-04-03 | Electrical connection device with a short-circuit wiring pattern that reduces connection wirings |
PCT/JP2018/014249 WO2018190195A1 (ja) | 2017-04-13 | 2018-04-03 | 電気的接続装置 |
TW107112563A TWI703328B (zh) | 2017-04-13 | 2018-04-12 | 電性連接裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017079748A JP7101457B2 (ja) | 2017-04-13 | 2017-04-13 | 電気的接続装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018179758A true JP2018179758A (ja) | 2018-11-15 |
JP7101457B2 JP7101457B2 (ja) | 2022-07-15 |
Family
ID=63792608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017079748A Active JP7101457B2 (ja) | 2017-04-13 | 2017-04-13 | 電気的接続装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11209460B2 (ja) |
JP (1) | JP7101457B2 (ja) |
KR (1) | KR102195561B1 (ja) |
CN (1) | CN110506212B (ja) |
TW (1) | TWI703328B (ja) |
WO (1) | WO2018190195A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220045885A (ko) * | 2020-10-06 | 2022-04-13 | 니혼 고꾸 덴시 고교 가부시끼가이샤 | 전기 부품 검사 기구 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116087574A (zh) * | 2021-11-05 | 2023-05-09 | 思达尔科技(武汉)有限公司 | 探针卡装置及其测试设备 |
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2017
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-
2018
- 2018-04-03 KR KR1020197030275A patent/KR102195561B1/ko active IP Right Grant
- 2018-04-03 WO PCT/JP2018/014249 patent/WO2018190195A1/ja active Application Filing
- 2018-04-03 US US16/604,544 patent/US11209460B2/en active Active
- 2018-04-03 CN CN201880024849.9A patent/CN110506212B/zh active Active
- 2018-04-12 TW TW107112563A patent/TWI703328B/zh active
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JP2005134285A (ja) * | 2003-10-31 | 2005-05-26 | Toppan Printing Co Ltd | ワイヤプローブを用いたピッチ可変検査治具及びピッチ変換治具 |
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US20100117673A1 (en) * | 2008-11-11 | 2010-05-13 | Samsung Electronics Co., Ltd. | Interface structure of wafer test equipment |
JP2012112771A (ja) * | 2010-11-24 | 2012-06-14 | Japan Electronic Materials Corp | プローブカードの検査方法及びこれに用いる検査用ボード |
JP2013080888A (ja) * | 2011-09-30 | 2013-05-02 | Hermes Testing Solutions Inc | 回路試験の探針カードと探針基板構造 |
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KR20220045885A (ko) * | 2020-10-06 | 2022-04-13 | 니혼 고꾸 덴시 고교 가부시끼가이샤 | 전기 부품 검사 기구 |
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Also Published As
Publication number | Publication date |
---|---|
CN110506212A (zh) | 2019-11-26 |
CN110506212B (zh) | 2021-12-14 |
KR20190130603A (ko) | 2019-11-22 |
JP7101457B2 (ja) | 2022-07-15 |
US11209460B2 (en) | 2021-12-28 |
US20200124640A1 (en) | 2020-04-23 |
TW201842339A (zh) | 2018-12-01 |
TWI703328B (zh) | 2020-09-01 |
WO2018190195A1 (ja) | 2018-10-18 |
KR102195561B1 (ko) | 2020-12-28 |
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