JP2018176052A - Pcb pollutant volume reduction method - Google Patents

Pcb pollutant volume reduction method Download PDF

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JP2018176052A
JP2018176052A JP2017078075A JP2017078075A JP2018176052A JP 2018176052 A JP2018176052 A JP 2018176052A JP 2017078075 A JP2017078075 A JP 2017078075A JP 2017078075 A JP2017078075 A JP 2017078075A JP 2018176052 A JP2018176052 A JP 2018176052A
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pcb
concentration
transformer
ballast
area
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JP6618501B2 (en
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清水　由章
Yoshiaki Shimizu
由章 清水
加藤　治
Osamu Kato
治 加藤
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Shinko Pantec Co Ltd
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Kobelco Eco Solutions Co Ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
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Abstract

PROBLEM TO BE SOLVED: To provide a PCB pollutant volume reduction method capable of enhancing the efficiency of carrying a PCB pollutant into a plasma treatment facility, and enhancing treatment efficiency of plasma treatment.SOLUTION: A method for volume-reducing a stabilizer 2 contaminated with PCB preserved in a preservation container H at a preservation station X before being carried into a PCB treatment facility Z comprises: a cutting step for cutting the stabilizer 2 in a hermetic chamber Y provided at a place different from the preservation station X and the PCB treatment facility Z, and for separating into a capacitor region 2A that includes a capacitor that contains PCB; and a refilling step for refilling, into a refilling container C, the capacitor region 2A separated in the cutting step before being carried into the PCB treatment facility Z.SELECTED DRAWING: Figure 1

Description

本発明は、ＰＣＢ処理施設に設けられるプラズマ溶融炉で処理されるＰＣＢ汚染物の前処理に関する。   The present invention relates to the pretreatment of PCB contaminants processed in a plasma melting furnace provided in a PCB processing facility.

従来、不燃性の絶縁体であるＰＣＢ（ポリ塩化ビフェニル）の処理方法として、ＰＣＢ処理施設に設けられるプラズマ溶融炉にＰＣＢ汚染物を投入し、ＰＣＢ汚染物を溶融分解する方法が知られている（例えば、特許文献１参照）。   Conventionally, as a processing method of PCB (polychlorinated biphenyl) which is a noncombustible insulator, a method is known in which PCB contaminants are introduced into a plasma melting furnace provided in a PCB processing facility to melt and decompose the PCB contaminants. (See, for example, Patent Document 1).

特許文献１には、ＰＣＢ処理施設に搬入された搬入保管容器に入っているＰＣＢ汚染物をプラズマ溶融炉に投入する投入用詰替容器に詰替えるＰＣＢ汚染物の前処理方法が開示されている。投入用詰替容器に詰替える際、ＰＣＢ汚染物の種類等に応じて分類することで、投入用詰替容器単位のバッチ投入が可能となりプラズマ溶融炉の安定した運転を可能とすると記載されている。   Patent Document 1 discloses a method of pre-treating PCB contaminants which is refilled into a refilling container for throwing in PCB contaminants contained in a loading storage container carried into a PCB processing facility into a plasma melting furnace. . When repacking into a refilling container for input, classification according to the type of PCB contamination etc. makes it possible to batch input the refill container unit for input, and it is stated that stable operation of the plasma melting furnace is enabled. There is.

特開２０１０−１７９２３９号公報JP, 2010-179239, A

従来のＰＣＢ汚染物の前処理方法は、プラズマ溶融炉に投入されるＰＣＢ汚染物の総投入量が、投入用詰替容器に詰替えられる前のＰＣＢ汚染物の総量と同等である。つまり、プラズマ溶融炉において単位時間当たりに処理できるＰＣＢ汚染物の処理量は、投入用詰替容器に詰替える前と変わらず、処理効率の観点から改善の余地がある。   In the conventional method for pretreatment of PCB contaminants, the total amount of PCB contaminants introduced into the plasma melting furnace is equal to the total amount of PCB contaminants before being refilled into the input refill container. That is, the throughput of PCB contaminants that can be treated per unit time in the plasma melting furnace is the same as that before refilling into the input refill container, and there is room for improvement from the viewpoint of processing efficiency.

また、ＰＣＢ処理施設に搬入される搬入保管容器には、本来ＰＣＢ処理施設で処理する必要のないＰＣＢ濃度の低い部材も含まれているため、搬入保管容器の容積や数量が大きくなってしまい、ＰＣＢ処理施設へのＰＣＢ汚染物の搬入効率が悪い。そこで、プラズマ処理施設へのＰＣＢ汚染物の搬入効率を高めると共にプラズマ処理の処理効率を高めることのできるＰＣＢ汚染物の減容化方法が望まれている。   In addition, since the storage container transported to the PCB processing facility includes a member with a low concentration of PCB which is not required to be processed in the PCB processing facility, the volume and number of the transport storage container increase. Poor transfer efficiency of PCB contamination to PCB processing facility. Therefore, there is a need for a method for reducing the volume of PCB contaminants that can increase the efficiency of carrying PCB contaminants into the plasma processing facility and can also enhance the processing efficiency of plasma processing.

ＰＣＢ汚染物の減容化方法は、保管所で保管容器に保管されているＰＣＢで汚染された安定器をＰＣＢ処理施設に搬入する前に減容化する方法であって、前記保管所および前記ＰＣＢ処理施設とは異なる場所に設けられた密閉室の内部で前記安定器を切断し、ＰＣＢを含有したコンデンサが含まれるコンデンサ領域と変圧部が含まれる変圧部領域とに分離する切断工程と、前記ＰＣＢ処理施設に搬入する前に、前記切断工程で分離された前記コンデンサ領域を、詰替容器に詰替える詰替工程と、を備えた点にある。   The method for reducing the volume of PCB contamination is a method of reducing the volume of a PCB-contaminated stabilizer stored in a storage container at a storage location before being carried into a PCB processing facility, which comprises: Cutting the ballast within a closed chamber provided at a location different from the PCB processing facility and separating it into a capacitor area including a capacitor containing a PCB and a transformer area including a transformer; And a re-filling step of re-filling the capacitor area separated in the cutting step into a re-filling container before being carried into the PCB processing facility.

安定器は、ＰＣＢが含まれるコンデンサと変圧部との間にアスファルト等の充填材が充填されており、コンデンサ領域と変圧部領域とを容易に分離することができる。そこで、本方法では、安定器を、ＰＣＢ濃度が高いコンデンサ領域と、ＰＣＢ濃度が低い変圧部領域とを切断工程で切断して分離している。そして、ＰＣＢ濃度が高いコンデンサ領域を詰替容器に詰替えている。その結果、この詰替容器をプラズマ処理施設に搬入すれば、プラズマ処理する安定器の総容積が低減されるので、プラズマ処理の処理効率を高めることができる。   The ballast is filled with a filler such as asphalt between the capacitor including the PCB and the transformer, so that the capacitor area and the transformer area can be easily separated. Therefore, in the present method, the ballast is cut and separated in the cutting step from the capacitor area having a high PCB concentration and the transformer area having a low PCB concentration. And the capacitor area with high PCB concentration is refilled into the refill container. As a result, if the refill container is carried into the plasma processing facility, the total volume of the ballast for plasma processing is reduced, and the processing efficiency of the plasma processing can be enhanced.

しかも、プラズマ処理する安定器の総容積を小さくすれば、ＰＣＢ処理施設に搬入される詰替容器の重量や数量も小さくすることが可能となり、搬入効率を高めることができる。このように、プラズマ処理施設へのＰＣＢ汚染物の搬入効率を高めると共にプラズマ処理の処理効率を高めることのできるＰＣＢ汚染物の減容化方法が提供できた。   Moreover, if the total volume of the plasma processing ballast is reduced, the weight and number of refill containers carried into the PCB processing facility can be reduced, and the loading efficiency can be enhanced. Thus, it has been possible to provide a method for reducing the volume of PCB contamination that can increase the efficiency of carrying PCB contamination into the plasma processing facility and enhance the processing efficiency of plasma processing.

他の方法は、前記密閉室は、前記保管所の外部に配置された車両に備えられている点にある。   Another method is that the enclosed room is provided in a vehicle located outside the storage.

本方法では、密閉室を保管所の外部に配置された車両に備えている。つまり、車両を保管所に近接した場所に移動させれば、保管容器を密閉室まで速やかに搬出することが可能となるので、保管容器から取り出された安定器の減容化処理効率を高めることができる。また、密閉室を備えた車両であればあらゆる場所に移動できるので、全国に散在する保管所ごとに密閉室を別途設ける必要が無く、利便性が高い。   In the method, the enclosed room is provided to a vehicle located outside the storage. That is, if the vehicle is moved to a place close to the storage, the storage container can be quickly taken out to the closed chamber, so that the volume reduction processing efficiency of the ballast taken out of the storage container can be increased. Can. In addition, since a vehicle provided with an enclosed room can be moved to any place, it is not necessary to separately provide an enclosed room for every storage scattered throughout the country, which is highly convenient.

他の特徴構成は、前記詰替容器は、塩基度調整剤が投入されており、前記ＰＣＢ処理施設のプラズマ溶融炉に投入可能な形状で構成されている点にある。   Another characteristic configuration is that the refill container is charged with a basicity adjusting agent, and is configured to be able to be charged into a plasma melting furnace of the PCB processing facility.

ところで、プラズマ処理で不燃性物質がスラグ化されるが、融点の高い酸化第二鉄がスラグの流動性を低下させることが知られている。このため、ＰＣＢ汚染物に塩基度調整剤を添加してスラグの流動性を高める処理が行われる。このとき、プラズマ処理される安定器を減少させているので、塩基度調整剤の添加量も節約することができる。よって、プラズマ溶融すべき総量（安定器＋塩基度調整剤）が削減されるので、プラズマ処理で無害化される安定器の処理効率をさらに高めることができる。しかも、詰替容器をプラズマ溶融炉に投入可能な形状で構成すれば、プラズマ処理施設で再度詰替える必要が無く、利便性が高まる。   By the way, although a nonflammable substance is slagged by plasma treatment, it is known that ferric oxide having a high melting point lowers the fluidity of the slag. For this reason, the processing which improves the fluidity of slag is performed by adding a basicity regulator to PCB contaminants. At this time, since the plasma-treated stabilizer is reduced, the amount of addition of the basicity modifier can also be saved. Therefore, the total amount to be plasma-melted (stabilizer + basicity adjusting agent) is reduced, so that the processing efficiency of the detoxified ballast can be further enhanced. Moreover, if the refill container is configured to be able to be charged into the plasma melting furnace, there is no need to refill the plasma processing facility again, and the convenience is enhanced.

他の方法は、前記安定器または前記変圧部領域のＰＣＢ濃度を臭気で判定する判定工程をさらに備えている点にある。   Another method is that the method further comprises the step of determining the PCB concentration of the ballast or the transformer area by the odor.

切断する前の安定器や比較的ＰＣＢ濃度の低い変圧部領域でも、コンデンサに含まれるＰＣＢが漏れ出しているおそれがある。そこで、本方法では、変圧部領域のＰＣＢ濃度を臭気で判定している。その結果、安定器や変圧部領域のＰＣＢ濃度を速やかに判定することが可能となり、ＰＣＢ濃度の高い安定器の不必要な切断工程を省略したり、変圧部領域のうちＰＣＢ濃度の高い変圧部領域のみをプラズマ処理したりすることで、安定器の減容化処理効率を高めることができる。   The PCB contained in the capacitor may be leaking even in the ballast before cutting and the transformer area relatively low in PCB concentration. Therefore, in the present method, the PCB concentration in the transformer area is determined by the odor. As a result, it is possible to quickly determine the concentration of PCB in the ballast or transformer area, omit unnecessary cutting steps of the ballast with high PCB concentration, or use a transformer with high PCB concentration in the transformer area. Plasma treatment of only the region can increase the volume reduction processing efficiency of the ballast.

他の方法は、前記判定工程でＰＣＢ濃度が基準濃度を超過すると判定された前記安定器または前記変圧部領域を前記詰替容器に投入する点にある。   Another method is that the ballast or transformer area, in which it is determined in the determination step that the PCB concentration exceeds the reference concentration, is introduced into the refill container.

本方法では、ＰＣＢ濃度が基準濃度を超過したと判定された安定器または変圧部領域を詰替容器に投入しているので、高濃度のＰＣＢを漏洩させること無く、適正にプラズマ処理することができる。   In this method, since the ballast or transformer area in which the PCB concentration is judged to have exceeded the reference concentration is put into the refill container, it is possible to perform plasma processing properly without leaking high concentration PCB. it can.

他の方法は、前記判定工程でＰＣＢ濃度が基準濃度以下であると判定された前記変圧部領域のＰＣＢ濃度を再分析する再分析工程をさらに備え、前記再分析工程においてＰＣＢ濃度が基準値を超過した前記変圧部領域を前記詰替容器に投入する点にある。   Another method further comprises a re-analysis step of re-analyzing the PCB concentration of the transformer area in which the PCB concentration is determined to be lower than the reference concentration in the determination step, and the PCB concentration in the re-analysis step The excess transformer area is to be introduced into the refill container.

本方法では、ＰＣＢ濃度が基準濃度以下であると判定された変圧部領域について、さらにＰＣＢ濃度を再分析し、ＰＣＢ濃度が基準値を超過した変圧部領域を詰替容器に投入している。その結果、高濃度のＰＣＢを確実に漏洩させること無く、適正にプラズマ処理することができる。しかも、臭気でＰＣＢ濃度が基準濃度以下であると判定された変圧部領域のみ再分析するので、減容化処理効率の低下を抑制することができる。   In this method, the PCB concentration is further re-analyzed for the transformer area where the PCB concentration is determined to be lower than the reference concentration, and the transformer area where the PCB concentration exceeds the reference value is introduced into the refill container. As a result, the plasma processing can be properly performed without surely leaking the high concentration PCB. In addition, only the transformer area where the PCB concentration is determined to be less than the reference concentration due to odor is re-analyzed, so that it is possible to suppress a decrease in the volume reduction processing efficiency.

ＰＣＢ汚染物の前処理方法を説明する概念図である。It is a conceptual diagram explaining the pretreatment method of a PCB contamination. 安定器を示す概略図である。FIG. 2 is a schematic view of a ballast. 第一実施形態に係るＰＣＢ汚染物の減容化方法を示す図である。It is a figure which shows the volume reduction method of the PCB contamination concerning 1st embodiment. 第一実施形態の別実施例１に係るＰＣＢ処理方法を示す図である。It is a figure which shows the PCB processing method which concerns on another Example 1 of 1st embodiment. 第一実施形態の別実施例２に係るＰＣＢ処理方法を示す図である。It is a figure which shows the PCB processing method which concerns on another Example 2 of 1st embodiment. 第一実施形態の別実施例３に係るＰＣＢ処理方法を示す図である。It is a figure which shows the PCB processing method which concerns on other Example 3 of 1st embodiment. 第二実施形態に係るＰＣＢ汚染物の減容化方法を示す図である。It is a figure which shows the volume reduction method of the PCB contamination concerning 2nd embodiment.

以下に、本発明に係るＰＣＢ汚染物の減容化方法の実施形態について、図面に基づいて説明する。本実施形態では、ＰＣＢ汚染物の減容化方法の一例として、プラズマ溶融炉１を用いて安定器２を溶融分解する例を説明する。ただし、以下の実施形態に限定されることなく、その要旨を逸脱しない範囲内で種々の変形が可能である。   Hereinafter, an embodiment of a method for reducing PCB contamination according to the present invention will be described based on the drawings. In the present embodiment, as an example of a method of reducing the volume of PCB contamination, an example in which the ballast 2 is melted and decomposed using the plasma melting furnace 1 will be described. However, without being limited to the following embodiments, various modifications can be made without departing from the scope of the invention.

［プラズマ溶融炉の基本構成］
ＰＣＢ処理施設Ｚは、プラズマ溶融炉１を備えている。プラズマ溶融炉１は、ＰＣＢ汚染物である電気機器（安定器２、トランス、コンデンサ等）、運転廃棄物（作業服、ゴム手袋、ウエス等）、感圧複写紙、汚泥、絶縁油などを、無害化する装置である。 [Basic configuration of plasma melting furnace]
The PCB processing facility Z includes a plasma melting furnace 1. The plasma melting furnace 1 is an electrical device (stabilizer 2, transformer, capacitor, etc.), operation waste (work clothes, rubber gloves, waste, etc.), pressure-sensitive copying paper, sludge, insulating oil, etc. which are PCB contaminants. It is a detoxifying device.

図１に示すように、プラズマ溶融炉１は、ＰＣＢ汚染物を収容した詰替容器Ｃ（例えば、ドラム缶やぺール缶）を投入する投入口１１と、ＰＣＢ汚染物をプラズマ処理して溶融分解する処理部１２と、を備えている。投入口１１には、室１１ａ内部に転動方向に横置きした詰替容器Ｃを処理部１２に移送する押圧部１１ｂ（プッシャー）が形成され、ＰＣＢ汚染物が溶融分解される時間（例えば３０分）が経過した後に、次の詰替容器Ｃが処理部１２に投入される。   As shown in FIG. 1, the plasma melting furnace 1 has a charging port 11 for charging a refill container C (for example, drum cans and pails) containing PCB contaminants, and plasma decomposition of the PCB contaminants for melting and decomposition. And the processing unit 12. A pressure portion 11b (pusher) for transferring the refilling container C placed horizontally in the rolling direction inside the chamber 11a to the processing unit 12 is formed in the inlet 11 and the time during which the PCB contamination is melted and decomposed (for example, 30) After the lapse of a minute), the next refilling container C is put into the processing unit 12.

処理部１２はプラズマトーチ１２ａを有しており、このプラズマトーチ１２ａに連続的に空気などを送り、電気エネルギーを加えることで、中心温度が１５，０００度以上であるプラズマアークを発生させる。このとき、炉内温度は約１，４００度に維持され、ＰＣＢが分解されると共に、金属等の不燃物が溶融してスラグＳが生成される。詰替容器ＣやＰＣＢ汚染物が溶融分解された時点で、傾倒部１２ｂによって処理部１２を傾倒させ、スラグＳがスラグ収容容器１３に排出される。   The processing unit 12 has a plasma torch 12a. Air and the like are continuously sent to the plasma torch 12a, and electric energy is applied to generate a plasma arc having a center temperature of 15,000 degrees or more. At this time, the temperature in the furnace is maintained at about 1,400 ° C., the PCB is decomposed, and the non-combustible material such as metal is melted to form slag S. When the refill container C and the PCB contaminants are melted and decomposed, the processing unit 12 is tilted by the tilting unit 12 b and the slag S is discharged to the slag container 13.

なお、ＰＣＢ処理施設Ｚのプラズマ溶融炉１の下流側には、恒温チャンバ、バグフィルタ、触媒反応塔、および活性炭槽がこの順で設けられているが、図示を省略する。恒温チャンバは、プラズマ溶融炉１からの発生ガスを処理するに含まれるダイオキシン類を分解するものである。バグフィルタは、微量の有害有機物質や排気中に含まれるＨＣｌ等の酸性ガスを吸着または反応除去するものである。触媒反応塔は、酸化チタン等の触媒によって排気中のダイオキシン類を分解すると共に、アンモニアガスを加えることでＮＯｘを分解するものである。活性炭槽は、排気中に有害有機物質が残存していた場合に該有害有機物質を吸着するものである。   Although a constant temperature chamber, a bag filter, a catalytic reaction tower, and an activated carbon tank are provided in this order on the downstream side of the plasma melting furnace 1 of the PCB processing facility Z, the illustration is omitted. The constant temperature chamber is for decomposing dioxins contained in processing the gas generated from the plasma melting furnace 1. The bag filter adsorbs or reacts off a small amount of harmful organic substances and acid gases such as HCl contained in exhaust gas. The catalytic reaction tower decomposes dioxins in the exhaust gas with a catalyst such as titanium oxide and decomposes NOx by adding ammonia gas. The activated carbon tank adsorbs the harmful organic substance when the harmful organic substance remains in the exhaust gas.

［第一実施形態］
以下、第一実施形態について説明する。図１〜図３に示すように、本実施形態に係るＰＣＢ汚染物の減容化方法は、保管所Ｘ（保管事業所）で保管容器Ｈに保管されているＰＣＢで汚染された安定器２をＰＣＢ処理施設Ｚに搬入する前に減容化する前処理方法である。このＰＣＢ汚染物の減容化方法は、保管所ＸおよびＰＣＢ処理施設Ｚとは異なる場所に設けられた密閉室Ｙの内部で安定器２を切断し、ＰＣＢを含有したコンデンサ２２が含まれるコンデンサ領域２Ａと変圧部２１が含まれる変圧部領域２Ｂ（コンデンサ領域２Ａ以外の領域）とに分離する切断工程と、ＰＣＢ処理施設Ｚに搬入する前に、切断工程で分離されたコンデンサ領域２Ａを、詰替容器Ｃに詰替える詰替工程と、を備えている。また、切断前の安定器２または変圧部領域２ＢのＰＣＢ濃度を臭気で判定する判定工程を備えている。なお、本実施形態では保管容器Ｈと詰替容器Ｃとが異なる容器で構成されているが、保管容器Ｈが詰替容器Ｃと同様の形状である場合は、本実施形態における詰替容器Ｃとしての保管容器Ｈにコンデンサ領域２Ａを詰替えても良い。 First Embodiment
The first embodiment will be described below. As shown in FIGS. 1 to 3, the method for reducing the volume of PCB contamination according to this embodiment is a ballast 2 contaminated with PCB stored in storage container H at storage location X (storage office). Before carrying it into the PCB processing facility Z. The method for reducing the volume of the PCB contamination is to cut the ballast 2 inside the enclosed room Y provided at a location different from the storage location X and the PCB processing facility Z, and to use a capacitor including the capacitor 22 containing the PCB. The cutting process of separating into the area 2A and the transformation part area 2B (the area other than the capacitor area 2A) including the transformation part 21 and the capacitor area 2A separated in the cutting process before being carried into the PCB processing facility Z And a refilling process for refilling the refill container C. Moreover, the determination process which determines the PCB density | concentration of the ballast 2 before the cutting | disconnection or the transformation part area | region 2B by odor is provided. In the present embodiment, the storage container H and the refilling container C are configured by different containers, but when the storage container H has the same shape as the refilling container C, the refilling container C in the present embodiment is As a storage container H, the condenser area 2A may be refilled.

図１に示すように、保管所Ｘには、ＰＣＢ汚染物が入った複数の保管容器Ｈが保管されている。この保管容器Ｈには、安定器２、トランス、コンデンサ等の電気機器が主として収容されている。本実施形態では、ＰＣＢ処理施設Ｚに搬入する前に、保管容器Ｈに保管された安定器２を減容化することとしている。これは、プラズマ溶融炉１におけるプラズマ処理効率を高めるために、ＰＣＢ処理施設Ｚで処理される安定器２を減容化することが求められているためである。   As shown in FIG. 1, a plurality of storage containers H containing PCB contaminants are stored in the storage location X. The storage container H mainly accommodates an electric device such as a ballast 2, a transformer, and a capacitor. In the present embodiment, the volume of the ballast 2 stored in the storage container H is reduced before being carried into the PCB processing facility Z. This is because, in order to enhance the plasma processing efficiency in the plasma melting furnace 1, it is required to reduce the volume of the ballast 2 processed in the PCB processing facility Z.

図１および図３に示すように、保管容器Ｈを保管所Ｘから搬出し、密閉室Ｙに移動させる。本実施形態における密閉室Ｙは、保管所Ｘの外部に配置された車両に固定された密閉コンテナで構成されている。これによって、車両を保管所Ｘに近接した場所に移動させれば、保管容器Ｈを密閉室Ｙまで速やかに搬出することが可能となるので、保管容器Ｈから取り出された安定器２の減容化処理効率を高めることができる。また、密閉室Ｙを備えた車両であればあらゆる場所に移動できるので、全国に散在する保管所Ｘごとに密閉室Ｙを別途設ける必要が無く、利便性が高い。なお、密閉室Ｙを固定式に構成して、全国に散在する保管所Ｘごとに密閉室Ｙを設けても良い。   As shown in FIGS. 1 and 3, the storage container H is taken out of the storage X and moved to the closed chamber Y. The sealed room Y in the present embodiment is configured of a sealed container fixed to a vehicle disposed outside the storage room X. By this, if the vehicle is moved to a location close to the storage location X, the storage container H can be quickly taken out to the closed chamber Y, so the volume reduction of the ballast 2 taken out from the storage container H Process efficiency can be improved. In addition, since the vehicle provided with the sealed room Y can be moved to any place, there is no need to separately provide the sealed room Y for each storage location X scattered throughout the country, and the convenience is high. The closed chamber Y may be fixed, and the closed chamber Y may be provided for each storage location X scattered throughout the country.

次いで、密閉室Ｙに移動した保管容器Ｈから安定器２を取り出して、安定器２をコンデンサ領域２Ａと変圧部領域２Ｂとに区分した上で切断する。このとき、本実施形態では、安定器２の切断位置を特定するために重量差判定を行っても良い。   Then, the ballast 2 is taken out from the storage container H moved to the closed chamber Y, and the ballast 2 is divided into a condenser area 2A and a transformer area 2B and then cut. At this time, in the present embodiment, weight difference determination may be performed to specify the cut position of the ballast 2.

以下に、安定器２の切断工程について説明する。   Below, the cutting process of the ballast 2 is demonstrated.

図２に示すように、安定器２は、磁性物である鉄心やコイルを含む変圧部２１と、ＰＣＢを絶縁油として含むコンデンサ２２とを有している。この安定器２は、変圧部２１とコンデンサ２２との間に、樹脂やアスファルトといった充填材２３が充填されている充填型である。なお、安定器２は、変圧部２１が含まれる変圧部領域２Ｂに、コンデンサ２２が含まれるコンデンサ領域２Ａが取付けられた外付型であっても良い。   As shown in FIG. 2, the ballast 2 includes a transformer 21 including an iron core and a coil, which are magnetic materials, and a capacitor 22 including a PCB as an insulating oil. The stabilizer 2 is a filling type in which a filler 23 such as resin or asphalt is filled between the transformer 21 and the condenser 22. The ballast 2 may be an external type in which a capacitor area 2A including the capacitor 22 is attached to a transformer area 2B including the transformer 21.

安定器２は、変圧部２１とコンデンサ２２とが長手方向に沿った両側領域に配置され、変圧部２１とコンデンサ２２との隙間には、充填材２３が充填されている。また、鉄心が含まれる変圧部２１はコンデンサ２２に比べて大きな重量を有しており、コンデンサ２２は、平面視における占有面積が変圧部２１に比べて小さく、長手方向に対する中央線Ｔより一方側に偏って配置されている。   In the ballast 2, the transformer 21 and the capacitor 22 are disposed in both side regions along the longitudinal direction, and the gap between the transformer 21 and the capacitor 22 is filled with the filler 23. Further, transformer 21 including an iron core has a large weight compared to capacitor 22, and capacitor 22 has a smaller occupied area in plan view than transformer 21 and is closer to one side than central line T in the longitudinal direction. It is arranged biased.

そこで、安定器２を密閉室Ｙに受入れた後、安定器２の中央線Ｔを境界とした両側領域の重量差に基づいて、コンデンサ領域２Ａを区分する重量差判定を行う。具体的には、安定器２の中央線Ｔに沿った支持部材３１（例えば、棒状部材）を配置すれば、重力によって変圧部領域２Ｂが下降し、これに伴いコンデンサ領域２Ａが上昇する。この上昇した領域（重量の小さい側）をコンデンサ領域２Ａとして判定する。次いで、変圧部領域２Ｂとコンデンサ領域２Ａとを所定の比率（例えば、１：１や３：２）に設定し、中央線Ｔまたは中央線Ｔとコンデンサ２２との間の位置で安定器２を切断して、コンデンサ領域２Ａと変圧部領域２Ｂとを仕分けする。これによって、コンデンサ２２を誤って切断することが無いので、ＰＣＢの漏洩を確実に防止することができる。なお、重量差判定や切断工程は、手動で実施しても良いし、自動で実施しても良い。また、重量差判定は、中央線Ｔで切断した後に、コンデンサ領域２Ａと変圧部領域２Ｂとの重量を測定し、重量の軽い方をコンデンサ領域２Ａと特定しても良く、特に限定されない。   Therefore, after the ballast 2 is received in the closed chamber Y, the weight difference judgment for dividing the capacitor area 2A is performed on the basis of the weight difference between the two side areas bounded by the center line T of the ballast 2. Specifically, if the support member 31 (for example, a rod-like member) is disposed along the center line T of the ballast 2, the transformer portion area 2B descends due to gravity, and the capacitor area 2A rises accordingly. This raised area (the side with a smaller weight) is determined as the capacitor area 2A. Then, transformer portion region 2B and capacitor region 2A are set to a predetermined ratio (for example, 1: 1 or 3: 2), and center line T or ballast 2 is positioned between center line T and capacitor 22. Then, the capacitor area 2A and the transformer area 2B are separated. By this, since the capacitor 22 is not accidentally cut, it is possible to reliably prevent the leakage of the PCB. The weight difference determination and the cutting process may be performed manually or automatically. The weight difference determination may be performed by measuring the weight of the capacitor area 2A and the transformer area 2B after cutting along the center line T, and may identify the lighter one as the capacitor area 2A, and is not particularly limited.

図１および図３に戻って、安定器２のコンデンサ領域２Ａを、プラズマ溶融炉１に投入可能な形状（大きさ）で構成された詰替容器Ｃに詰替え、ＰＣＢ処理施設Ｚに搬入する。このとき、詰替容器Ｃに珪砂（ＳｉＯ２）、生石灰（ＣａＯ）、炭酸カルシウム（ＣａＣＯ３）などの塩基度調整剤を加えるのが好ましい。これによって、プラズマ溶融炉１で生成されるスラグＳの流動性を高めることができる。また、切断工程によってプラズマ処理される安定器２の重量を減少させているので、塩基度調整剤の添加量も節約することができる。よって、プラズマ溶融すべき総量（安定器２＋塩基度調整剤）が削減されるので、プラズマ処理で無害化される安定器２の処理量をさらに高めることができる。なお、密閉室Ｙで詰替容器Ｃに塩基度調整剤を添加せずに、ＰＣＢ処理施設Ｚで詰替容器Ｃに塩基度調整剤を添加しても良く、特に限定されない。 Referring back to FIGS. 1 and 3, the condenser region 2A of the ballast 2 is refilled into the refilling container C having a shape (size) that can be introduced into the plasma melting furnace 1, and carried into the PCB processing facility Z . At this time, it is preferable to add a basicity regulator such as silica sand (SiO 2 ), quick lime (CaO), calcium carbonate (CaCO 3 ) to the refill container C. By this, the fluidity of the slag S generated in the plasma melting furnace 1 can be enhanced. Moreover, since the weight of the stabilizer 2 plasma-treated by the cutting process is reduced, the amount of addition of the basicity regulator can be saved. Therefore, the total amount to be plasma-melted (stabilizer 2 + basicity adjusting agent) is reduced, so that the throughput of the stabilizer 2 to be harmlessized by plasma processing can be further increased. The basicity modifier may be added to the refilling container C at the PCB processing facility Z without adding the basicity modifier to the refilling container C in the closed chamber Y, and is not particularly limited.

次いで、ＰＣＢ処理施設Ｚにおいて、コンデンサ領域２Ａが塩基度調整剤と共に詰込まれた詰替容器Ｃを、プラズマ溶融炉１でプラズマ処理する。このとき、詰替容器Ｃをプラズマ溶融炉１に投入可能な形状で構成しているので、ＰＣＢ処理施設Ｚで再度詰替える必要が無く、利便性が高い。プラズマ処理で発生したスラグＳは、ＰＣＢ濃度が基準値以下か否かの卒業判定が実行され、無害であると判定されたものは埋立処分や資源として再利用するといった適正処分が行われる。逆に、卒業判定でＰＣＢ濃度が基準値をクリアしていない場合は、再度プラズマ処理が行われる。なお、詰替容器ＣをＰＣＢ処理施設Ｚへ搬入する車両は、密閉室Ｙを有する車両であっても良いし、詰替容器Ｃを別の運搬車両に移動させてからＰＣＢ処理施設Ｚへ搬入しても良い。   Next, in the PCB processing facility Z, the refilling container C in which the condenser area 2A is packed with the basicity adjusting agent is plasma-treated by the plasma melting furnace 1. At this time, since the refilling container C is configured to be able to be charged into the plasma melting furnace 1, there is no need to refill it again in the PCB processing facility Z, and the convenience is high. The slag S generated by the plasma processing is subjected to a graduation determination as to whether or not the PCB concentration is below the reference value, and those that are determined to be harmless are properly disposed of, such as landfill disposal and reutilization as resources. Conversely, when the PCB concentration does not clear the reference value in the graduation determination, the plasma processing is performed again. The vehicle for carrying the refill container C into the PCB processing facility Z may be a vehicle having a closed chamber Y, or is transferred to the PCB processing facility Z after moving the refill container C to another transport vehicle. You may.

一方、切断工程で切断された変圧部領域２ＢはＰＣＢ濃度が小さく、本来であればＰＣＢ処理施設Ｚで処理する必要はないが、コンデンサ２２から漏れ出したＰＣＢが含まれている場合があるので、判定工程において臭気判定処理が実行される。上述したように、ＰＣＢは絶縁油であり、甘い特有の臭気がある。そこで、本実施形態では、油の臭気成分に感応して臭気強度を数値で表す油臭センサを用いて、臭気判定処理を実行する。この油臭センサは、上山智嗣他１名、「水晶振動子式高感度油臭センサによる河川油汚染モニタリング」、学会誌ＥＩＣＡ、第８巻、第３号、２００３、ｐ１６−２０に記載のように、目的とする物質に特異的に吸着する感応膜を有している。ここで、臭気判定における変圧部領域２ＢのＰＣＢ濃度は、無害化処理認定施設で焼却処理可能な基準値（5,000mg/kg以下）を臭気強度に換算した基準濃度と比較して判定する。   On the other hand, the transformer area 2B cut in the cutting step has a low concentration of PCB, and it is not necessary to treat it in the PCB processing facility Z in principle, but it may contain PCB leaking from the capacitor 22. The odor determination process is performed in the determination process. As mentioned above, the PCB is an insulating oil and has a sweet specific odor. Therefore, in the present embodiment, the odor determination process is performed using an oil odor sensor that responds to the odor component of oil and expresses the odor intensity as a numerical value. This oil odor sensor is described in Tomoya Ueyama et al., “River oil contamination monitoring with quartz oscillator type high sensitivity oil odor sensor”, Journal of academic journal EICA, Vol. 8, No. 3, 2003, p16-20 In addition, it has a sensitive membrane that adsorbs specifically to the target substance. Here, the PCB concentration of the transformation part region 2B in the odor determination is determined by comparing a reference value (5,000 mg / kg or less) that can be incinerated at the detoxifying treatment certified facility with a reference concentration converted to odor intensity.

臭気判定により、変圧部領域２ＢのＰＣＢ濃度が基準濃度を超過していれば、変圧部領域２Ｂをコンデンサ領域２Ａと共に詰替容器Ｃに詰替える。その後の工程は、上述したコンデンサ領域２Ａの工程と同じであるので、詳細な説明を省略する。一方、変圧部領域２ＢのＰＣＢ濃度が基準濃度以下であれば、変圧部領域２Ｂを焼却処理する。これによって、ＰＣＢが漏れ出ている変圧部領域２Ｂを判定することが可能となるので、高濃度のＰＣＢを含む変圧部領域２Ｂを誤って焼却処理してしまうおそれが無く、適正にプラズマ処理することができる。また、安定器２のうちＰＣＢ処理施設Ｚで処理すべき領域が臭気判定により速やかに判定されるので、安定器２の減容化処理効率を高めることができる。   If the PCB concentration in the transformer region 2B exceeds the reference concentration in the odor determination, the transformer region 2B is refilled into the refill container C together with the capacitor region 2A. The subsequent steps are the same as the steps of the above-described capacitor region 2A, so detailed description will be omitted. On the other hand, if the PCB concentration in the transformer region 2B is lower than the reference concentration, the transformer region 2B is incinerated. Since this makes it possible to determine the transformer area 2B where the PCB leaks out, there is no risk of accidentally incinerating the transformer area 2B including the PCB with high concentration, and the plasma process is properly performed. be able to. Moreover, since the area | region which should be processed in the PCB processing facility Z among the ballasts 2 is determined rapidly by odor determination, the volume reduction processing efficiency of the ballasts 2 can be raised.

［第一実施形態の変形例１］
図４に示すように、臭気判定によってＰＣＢ濃度が基準値（5,000mg/kg）以下であると判定された変圧部領域２ＢのＰＣＢ濃度を再分析する再分析工程をさらに備えていても良い。具体的には、上述の臭気判定処理において、ＰＣＢ濃度が基準濃度以下であると判定された変圧部領域２Ｂを、密閉室Ｙとは異なる分析場所に搬出する。次いで、再分析工程において、変圧部領域２Ｂの分析値が基準濃度以下か否かを判定する。ここで、再分析工程は、「低濃度ＰＣＢ含有廃棄物に関する測定方法（第２版）」（環境省大臣官房廃棄物・リサイクル対策部産業廃棄物課、平成２６年９月）に記載された含有量試験、表面拭き取り試験、および表面抽出試験の何れか１つ、又は併用によって実行される。 [Modification 1 of the First Embodiment]
As shown in FIG. 4, a re-analysis step may be provided to re-analyze the PCB concentration of the transformer region 2 </ b> B in which the odor concentration has determined that the PCB concentration is below the reference value (5,000 mg / kg). Specifically, the transformer area 2B determined to have the PCB concentration equal to or lower than the reference concentration in the above-described odor determination process is carried out to an analysis site different from the closed chamber Y. Next, in the re-analysis step, it is determined whether or not the analysis value of the transformer region 2B is less than or equal to the reference concentration. Here, the re-analysis process was described in “Measuring method for low-concentration PCB-containing waste (second edition)” (Ministry of Environment Minister's Secretariat, Office of Waste and Recycling Measures, Industrial Waste Division, September 2014) It is performed by any one of the content test, the surface wiping test, and the surface extraction test, or a combination thereof.

変圧部領域２Ｂの分析値が基準値以下であれば、焼却処理する。一方、変圧部領域２Ｂの分析値が基準値を超過していれば、詰替容器Ｃに詰替える。この詰替容器Ｃは、上述したコンデンサ領域２Ａが詰替えられた詰替容器Ｃと同じ容器であっても良いし、異なる詰替容器Ｃに変圧部領域２Ｂを塩基度調整剤と共に、又は変圧部領域２Ｂのみを詰替えても良い。次いで、ＰＣＢ濃度の高い変圧部領域２Ｂが塩基度調整剤と共に詰込まれた詰替容器ＣをＰＣＢ処理施設Ｚへ搬入し、プラズマ溶融炉１でプラズマ処理する。本変形例では、再分析工程を備えることで、高濃度のＰＣＢを漏洩させるおそれを確実に無くし、適正にプラズマ処理することができる。しかも、臭気で基準濃度以下であると判定された変圧部領域２Ｂのみ再分析するので、減容化処理効率の低下を抑制することができる。その他の作用効果は第一実施形態と同様であるので、詳細な説明を省略する。   If the analysis value of transformer area 2B is less than or equal to the reference value, incineration is performed. On the other hand, if the analysis value of the transformer area 2B exceeds the reference value, the container is refilled with the refill container C. The refilling container C may be the same container as the refilling container C in which the above-described capacitor area 2A is refilled, or the transformer portion area 2B may be combined with a basicity adjusting agent in a different refilling container C, or Only the part area 2B may be refilled. Next, the refill container C packed with the PCB concentration high transformation part region 2B together with the basicity adjusting agent is carried into the PCB processing facility Z, and is plasma treated in the plasma melting furnace 1. In this modification, by providing the re-analysis step, it is possible to reliably eliminate the risk of leaking high concentration PCBs and to perform plasma processing properly. In addition, since only the transformer area 2B determined to have the odor or less as the reference concentration or less is reanalyzed, it is possible to suppress a decrease in the volume reduction processing efficiency. The other effects and advantages are the same as in the first embodiment, and thus detailed description will be omitted.

［第一実施形態の変形例２］
図５に示すように、臭気判定によってＰＣＢ濃度が基準濃度以下であると判定された変圧部領域２Ｂを破砕する破砕工程と、破砕後の変圧部領域２Ｂを磁選する磁選工程とをさらに備えていても良い。具体的には、ＰＣＢ濃度が基準濃度以下であると判定された変圧部領域を搬送し、破砕機（不図示）を用いて破砕する。次いで、磁力によって磁性物を分離する磁選機（不図示）で、磁性物（鉄等）と非磁性物（樹脂、アルミ、アスファルト等）とを選別する。選別された磁性物は、炭化水素系の溶剤等で洗浄処理される。磁性物はＰＣＢ濃度が比較的低いので、洗浄処理によって無害化することができる。次いで、ＰＣＢ濃度が基準値以下か否かの卒業判定が実行され、無害であると判定されたものは資源として再利用するといった適正処分が行われる。逆に、卒業判定でＰＣＢ濃度が基準値をクリアしていない場合は、再度洗浄処理が行われる。このとき、洗浄工程で用いた溶剤は、系内で蒸留することで再利用される。なお、洗浄方法は、超音波洗浄、浸漬洗浄、撹拌洗浄、真空加熱分離などを単独または適宜組み合わせて実行する。 Modification 2 of the First Embodiment
As shown in FIG. 5, it further comprises a crushing step of crushing the transformer portion region 2B determined to have a PCB concentration below the reference concentration by odor determination, and a magnetic separation step of magnetically separating the transformer portion region 2B after crushing. It is good. Specifically, the transformer area in which the PCB concentration is determined to be equal to or lower than the reference concentration is transported and crushed using a crusher (not shown). Next, the magnetic material (iron, etc.) and the non-magnetic material (resin, aluminum, asphalt, etc.) are separated by a magnetic separator (not shown) that separates the magnetic material by magnetic force. The separated magnetic substances are washed with a hydrocarbon solvent or the like. Since the magnetic substance has a relatively low concentration of PCB, it can be detoxified by the cleaning process. Next, a graduation determination as to whether or not the PCB concentration is less than or equal to the reference value is performed, and appropriate disposal is performed such that those determined to be harmless are reused as resources. Conversely, if the PCB concentration does not clear the reference value in the graduation determination, the cleaning process is performed again. At this time, the solvent used in the washing step is reused by distillation in the system. As the cleaning method, ultrasonic cleaning, immersion cleaning, agitation cleaning, vacuum heating and separation, etc. are performed singly or in combination as appropriate.

一方、選別された非磁性物は、ＰＣＢ濃度が比較的高いので、珪砂（ＳｉＯ２）、生石灰（ＣａＯ）、炭酸カルシウム（ＣａＣＯ３）などの塩基度調整剤と共に、又は非磁性物のみを詰替容器Ｃに詰替え、この詰替容器Ｃをプラズマ溶融炉１でプラズマ処理を実行する。本変形例２によれば、切断工程によって分離された変圧部領域２Ｂに含まれる磁性物の容量分だけプラズマ処理されるＰＣＢ汚染物が減量される。安定器２は磁性物の容量比が半分以上であるので、１回のプラズマ処理で無害化される安定器２の処理効率が約２倍となる。また、プラズマ処理される鉄分を磁選工程で減少させているので、塩基度調整剤の添加量を節約することができる。その他の作用効果は第一実施形態と同様であるので、詳細な説明を省略する。なお、破砕工程の前に、変形例１の再分析工程を実行しても良く、特に限定されない。 On the other hand, the sorted nonmagnetic substances have a relatively high concentration of PCB, so they can be packed with only nonmagnetic substances together with a basicity adjusting agent such as silica sand (SiO 2 ), quick lime (CaO), calcium carbonate (CaCO 3 ) The refill container C is refilled, and the refill container C is subjected to plasma processing in the plasma melting furnace 1. According to the second modification, PCB contamination to be plasma-treated is reduced by the volume of the magnetic substance contained in the transformer area 2B separated by the cutting process. Since the capacity ratio of the magnetic substance of the ballast 2 is half or more, the processing efficiency of the ballast 2 to be detoxified by one plasma processing is approximately doubled. Further, since the iron to be plasma-treated is reduced in the magnetic separation step, the amount of addition of the basicity regulator can be saved. The other effects and advantages are the same as in the first embodiment, and thus detailed description will be omitted. In addition, the re-analysis process of the modification 1 may be performed before a crushing process, and it is not specifically limited.

図示しないが、ＰＣＢ汚染物の減容化方法は、磁選工程で磁選された磁性物に付着している樹脂やアスファルトといった不純物を除去する除去工程をさらに備えても良い。この除去工程において、洗浄、篩、風力選別、比重選別、光学選別などが考えられる。また、磁性物に珪砂を接触させて不純物を除去することが考えられる。具体的には、磁性物と珪砂とを所定の容器に収容して、この容器に振動を与えたり、磁性物に珪砂を吹付けたりして、磁性物に付着している不純物を剥離させる。このとき、洗浄、篩、風力選別、比重選別、光学選別などを併用しても良い。また、除去工程で使用した珪砂を塩基度調整剤として再利用しても良い。なお、除去工程は、珪砂を用いずに他の粒子で磁性物をサンドブラストしても良いし、化学処理で不純物を除去しても良く、特に限定されない。   Although not shown in the drawings, the method for reducing the volume of PCB contamination may further include a removal step of removing impurities such as resin and asphalt adhering to the magnetic substance magnetically separated in the magnetic separation step. In this removal step, washing, sieving, wind sorting, specific gravity sorting, optical sorting, etc. can be considered. Further, it is conceivable to remove the impurities by bringing silica sand into contact with the magnetic substance. Specifically, the magnetic substance and the silica sand are accommodated in a predetermined container, and the container is vibrated or the silicon sand is sprayed to the magnetic substance to separate the impurities attached to the magnetic substance. At this time, washing, sieving, wind force sorting, specific gravity sorting, optical sorting, etc. may be used in combination. In addition, the silica sand used in the removal step may be reused as a basicity regulator. In the removal step, the magnetic substance may be sandblasted with other particles without using silica sand, or impurities may be removed by chemical treatment, and it is not particularly limited.

［第一実施形態の変形例３］
図６に示すように、安定器２を切断する前に、安定器２のＰＣＢ濃度を臭気で判定する事前判定工程をさらに備えていても良い。この事前判定工程は、保管容器Ｈから取り出された安定器２について臭気判定を実行し、ＰＣＢの漏洩可能性が高い安定器２とＰＣＢの漏洩可能性が低い安定器２とに分類する工程である。具体的には、上述した油臭センサを用いて、安定器２のＰＣＢ濃度を事前判定基準濃度（基準濃度の一例）と比較して判定する。この事前判定基準濃度は、上述したような焼却処理可能な基準値（5,000mg/kg以下）を臭気強度に換算した基準濃度であっても良いし、基準濃度に安全率（例えば１．２）を乗算した値としても良い。 [Modification 3 of the first embodiment]
As shown in FIG. 6, it may further include a predetermination step of determining the PCB concentration of the ballast 2 by the odor before the ballast 2 is cut. This pre-judging step is a step of executing odor judgment on the ballast 2 taken out of the storage container H and classifying it into the ballast 2 where the possibility of leakage of the PCB is high and the ballast 2 where the possibility of leakage of the PCB is low. is there. Specifically, the above-described oil odor sensor is used to determine the PCB concentration of the ballast 2 in comparison with the prior determination reference concentration (an example of the reference concentration). This prior determination reference concentration may be a reference concentration obtained by converting the above-mentioned incinerated standard value (5,000 mg / kg or less) into odor intensity, or a safety factor (e.g. 1.2) at the reference concentration. It may be a value multiplied by.

事前判定工程により、安定器２のＰＣＢ濃度が事前判定基準濃度を超過していれば、変圧部領域２Ｂまで汚染が拡がっている可能性が高いため、安定器２を詰替容器Ｃに詰替えてＰＣＢ処理施設Ｚに搬入する。これによって、不必要な切断工程を省略することができると共に、ＰＣＢの汚染拡大を招く切断工程を回避することができる。一方、安定器２のＰＣＢ濃度が事前判定基準濃度以下であれば、上述した切断工程に移行する。以降の工程や作用効果は第一実施形態と同様であるので、詳細な説明を省略する。   If the PCB concentration of the ballast 2 exceeds the prior criterion concentration in the pre-judging process, there is a high possibility that the contamination has spread to the transformer area 2B, so the ballast 2 is refilled with the refill container C To the PCB processing facility Z. This makes it possible to eliminate unnecessary cutting steps and to avoid cutting steps that lead to increased contamination of the PCB. On the other hand, if the PCB concentration of the ballast 2 is equal to or less than the prior determination reference concentration, the process proceeds to the above-described cutting step. The subsequent steps and effects are the same as in the first embodiment, and thus detailed description will be omitted.

［第二実施形態］
図７に示すように、本実施形態におけるＰＣＢ汚染物の減容化方法は、保管所Ｘ（保管事業所）およびＰＣＢ処理施設Ｚとは異なる場所に設けられた密閉室Ｙの内部で安定器２を切断し、ＰＣＢを含有したコンデンサ２２が含まれるコンデンサ領域２Ａと変圧部２１が含まれる変圧部領域２Ｂ（コンデンサ領域２Ａ以外の領域）とに分離する切断工程と、ＰＣＢ処理施設Ｚに搬入する前に、切断工程で分離されたコンデンサ領域２Ａを、詰替容器Ｃに詰替える詰替工程と、を備えている。また、変圧部領域２Ｂを洗浄する洗浄工程と、変圧部領域２ＢのＰＣＢ濃度を分析する分析工程とを備えている。なお、切断工程と詰替工程とは、上述した第一実施形態と同様であるので詳細な説明は省略する。 Second Embodiment
As shown in FIG. 7, in the method for reducing the volume of PCB contaminants in the present embodiment, a stabilizer is provided inside the enclosed room Y provided at a location different from the storage location X (storage location) and the PCB processing facility Z. Cutting into 2 and cutting into the capacitor area 2A including the capacitor 22 containing the PCB and the transformer area 2B (area other than the capacitor area 2A) including the transformer 21 and carrying into the PCB processing facility Z And a re-filling step for re-filling the condenser area 2A separated in the cutting step into the re-filling container C. Moreover, the cleaning process which wash | cleans transformation part area | region 2B, and the analysis process which analyzes PCB density | concentration of transformation part area | region 2B are provided. In addition, since a cutting process and a refilling process are the same as that of a first embodiment mentioned above, detailed explanation is omitted.

洗浄工程では、変圧部領域２Ｂを炭化水素系の溶剤等で洗浄処理する。洗浄方法は、超音波洗浄、浸漬洗浄、撹拌洗浄、真空加熱分離などを単独または適宜組み合わせて実行する。なお、洗浄工程で用いた溶剤は、系内で蒸留することで再利用しても良い。次いで、洗浄された変圧部領域２Ｂを密閉室Ｙとは異なる分析場所に搬出する。そして、分析工程において、変圧部領域２Ｂの分析値が基準値（5,000mg/kg）以下か否かを判定する。この分析工程は、上述した第一実施形態の変形例１の再分析工程と同様の方法であるので、詳細な説明を省略する。本実施形態では臭気による判定工程を省略しているので迅速性に欠けるが、安定器２を安価に減容化できる点で有益である。   In the cleaning step, the transformer area 2B is cleaned with a hydrocarbon solvent or the like. As the cleaning method, ultrasonic cleaning, immersion cleaning, agitation cleaning, vacuum heating separation, etc. are carried out alone or in combination. The solvent used in the washing step may be reused by distillation in the system. Then, the cleaned transformer area 2B is carried out to an analysis site different from the closed chamber Y. Then, in the analysis step, it is determined whether or not the analysis value of the transformer area 2B is less than or equal to the reference value (5,000 mg / kg). Since this analysis step is the same method as the re-analysis step of the first modification of the first embodiment described above, detailed description will be omitted. In the present embodiment, since the determination process based on the odor is omitted, it lacks in quickness, but it is advantageous in that the volume of the ballast 2 can be reduced at low cost.

［その他の実施形態］
（１）上述した実施形態における各工程は、適宜組み合わせたり、省略したりしても良い。例えば、臭気による判定工程（事前判定工程を含む）や再分析工程を省略しても良いし、第二実施形態における分析工程の後に破砕工程や磁選工程を備えていても良い。
（２）上述した実施形態では、保管容器Ｈを保管所Ｘから搬出して密閉室Ｙに移動させたが、保管所Ｘで保管容器Ｈから安定器２を取り出して、所定の安全対策を施した上で安定器２自体を密閉室Ｙに移動させても良い。
（３）臭気による判定工程や事前判定工程では、油臭センサを用いて変圧部領域２Ｂの臭気判定をしたが、他の装置を用いて臭気判定しても良いし、所定の安全対策を施した上で目視または嗅覚にて臭気判定を行っても良く、臭気判定の方法は特に限定されない。
（４）切断工程に代えて安定器２を工具等で解体することによりコンデンサ２２とその他の領域に選別しても良い。 Other Embodiments
(1) The steps in the above-described embodiment may be appropriately combined or omitted. For example, the determination step based on odor (including the prior determination step) and the re-analysis step may be omitted, or the crushing step or the magnetic separation step may be provided after the analysis step in the second embodiment.
(2) In the embodiment described above, the storage container H is carried out of the storage location X and moved to the closed chamber Y. However, the storage container H is taken out of the storage container H at the storage location X and predetermined safety measures are taken. Then, the ballast 2 itself may be moved to the closed chamber Y.
(3) In the judgment process based on odor and the prior judgment process, the odor of the transformer area 2B was determined using an oil odor sensor, but the odor may be determined using another device, and a predetermined safety measure is taken. Then, the odor may be determined visually or by olfactory sense, and the method of odor determination is not particularly limited.
(4) Instead of the cutting step, the ballast 2 may be separated into the capacitor 22 and other regions by disassembling the ballast 2 with a tool or the like.

本発明に係るＰＣＢ汚染物の減容化方法は、安定器をプラズマ処理する際の前処理方法として利用可能である。   The method for reducing PCB contamination according to the present invention can be used as a pretreatment method in plasma treatment of a ballast.

２ 安定器
２Ａ コンデンサ領域
２Ｂ 変圧部領域
２１ 変圧部
２２ コンデンサ
Ｃ 詰替容器
Ｈ 保管容器
Ｘ 保管所
Ｙ 密閉室
Ｚ ＰＣＢ処理施設 2 Ballast 2A Capacitor area 2B Transformation area 21 Transformation area 22 Condenser C Refilling container H Storage container X Storage Y Y closed chamber Z PCB processing facility

Claims (6)

保管所で保管容器に保管されているＰＣＢで汚染された安定器をＰＣＢ処理施設に搬入する前に減容化する方法であって、
前記保管所および前記ＰＣＢ処理施設とは異なる場所に設けられた密閉室の内部で前記安定器を切断し、ＰＣＢを含有したコンデンサが含まれるコンデンサ領域と変圧部が含まれる変圧部領域とに分離する切断工程と、
前記ＰＣＢ処理施設に搬入する前に、前記切断工程で分離された前記コンデンサ領域を、詰替容器に詰替える詰替工程と、を備えたＰＣＢ汚染物の減容化方法。 A method of reducing the volume of a PCB-contaminated ballast stored in a storage container at a storage location prior to loading into a PCB processing facility,
The ballast is cut off inside a closed chamber provided at a location different from the storage area and the PCB processing facility, and separated into a capacitor area including a capacitor containing a PCB and a transformer area including a transformer. Cutting process,
A refilling step of refilling the capacitor area separated in the cutting step into a refill container before being carried into the PCB processing facility. 前記密閉室は、前記保管所の外部に配置された車両に備えられている請求項１に記載のＰＣＢ汚染物の減容化方法。   The method for reducing PCB contamination according to claim 1, wherein the closed chamber is provided in a vehicle disposed outside the storage. 前記詰替容器は、塩基度調整剤が投入されており、前記ＰＣＢ処理施設のプラズマ溶融炉に投入可能な形状で構成されている請求項１又は２に記載のＰＣＢ汚染物の減容化方法。   The method for reducing the volume of PCB contamination according to claim 1 or 2, wherein the refilling container is charged with a basicity adjusting agent, and is configured to be able to be charged into a plasma melting furnace of the PCB processing facility. . 前記安定器または前記変圧部領域のＰＣＢ濃度を臭気で判定する判定工程をさらに備えた請求項１〜３の何れか一項に記載のＰＣＢ汚染物の減容化方法。   The method for reducing the volume of a PCB contaminant according to any one of claims 1 to 3, further comprising a determination step of determining the PCB concentration of the stabilizer or the transformer region by odor. 前記判定工程でＰＣＢ濃度が基準濃度を超過すると判定された前記安定器または前記変圧部領域を前記詰替容器に投入する請求項４に記載のＰＣＢ汚染物の減容化方法。   The method for reducing the volume of PCB contaminants according to claim 4, wherein the ballast or the transformer area in which the PCB concentration is determined to exceed the reference concentration in the determination step is introduced into the refill container. 前記判定工程でＰＣＢ濃度が基準濃度以下であると判定された前記変圧部領域のＰＣＢ濃度を再分析する再分析工程をさらに備え、
前記再分析工程においてＰＣＢ濃度が基準値を超過した前記変圧部領域を前記詰替容器に投入する請求項４又は５に記載のＰＣＢ汚染物の減容化方法。 The method further comprises a re-analysis step of re-analyzing the PCB concentration of the transformer area in which the PCB concentration is determined to be lower than the reference concentration in the determination step.
The method for reducing the volume of a PCB contaminant according to claim 4 or 5, wherein the transformer area in which the PCB concentration exceeds a reference value in the reanalysis step is introduced into the refill container.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009006301A (en) * 2007-06-29 2009-01-15 Nippon Steel Engineering Co Ltd Plasma melting decomposition treatment method for bushing containing polychlorinated biphenyl
JP2010179239A (en) * 2009-02-05 2010-08-19 Nippon Steel Engineering Co Ltd Pretreatment method and pretreatment equipment in plasma melting decomposition treatment of material to be treated
JP2012139669A (en) * 2011-01-06 2012-07-26 Kawasaki Heavy Ind Ltd Method and facility for treating pcb waste
JP2017006850A (en) * 2015-06-19 2017-01-12 株式会社神鋼環境ソリューション Pcb treatment method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009006301A (en) * 2007-06-29 2009-01-15 Nippon Steel Engineering Co Ltd Plasma melting decomposition treatment method for bushing containing polychlorinated biphenyl
JP2010179239A (en) * 2009-02-05 2010-08-19 Nippon Steel Engineering Co Ltd Pretreatment method and pretreatment equipment in plasma melting decomposition treatment of material to be treated
JP2012139669A (en) * 2011-01-06 2012-07-26 Kawasaki Heavy Ind Ltd Method and facility for treating pcb waste
JP2017006850A (en) * 2015-06-19 2017-01-12 株式会社神鋼環境ソリューション Pcb treatment method

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