JP2018120897A - 現像液の濃度監視装置、及び現像液管理装置 - Google Patents

現像液の濃度監視装置、及び現像液管理装置 Download PDF

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Publication number
JP2018120897A
JP2018120897A JP2017009834A JP2017009834A JP2018120897A JP 2018120897 A JP2018120897 A JP 2018120897A JP 2017009834 A JP2017009834 A JP 2017009834A JP 2017009834 A JP2017009834 A JP 2017009834A JP 2018120897 A JP2018120897 A JP 2018120897A
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Japan
Prior art keywords
developer
carbon dioxide
concentration
density
absorbed carbon
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Ceased
Application number
JP2017009834A
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English (en)
Japanese (ja)
Inventor
中川　俊元
Toshimoto Nakagawa
俊元 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hirama Rika Kenkyusho Ltd
Original Assignee
Hirama Rika Kenkyusho Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirama Rika Kenkyusho Ltd filed Critical Hirama Rika Kenkyusho Ltd
Priority to JP2017009834A priority Critical patent/JP2018120897A/ja
Priority to KR1020170161407A priority patent/KR20180087122A/ko
Priority to CN201711232885.8A priority patent/CN108345185A/zh
Priority to TW106141773A priority patent/TW201841080A/zh
Publication of JP2018120897A publication Critical patent/JP2018120897A/ja
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3071—Process control means, e.g. for replenishing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03D—APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS; ACCESSORIES THEREFOR
    • G03D3/00—Liquid processing apparatus involving immersion; Washing apparatus involving immersion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
    • G03F7/0022—Devices or apparatus
    • G03F7/0025—Devices or apparatus characterised by means for coating the developer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017009834A 2017-01-23 2017-01-23 現像液の濃度監視装置、及び現像液管理装置 Ceased JP2018120897A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017009834A JP2018120897A (ja) 2017-01-23 2017-01-23 現像液の濃度監視装置、及び現像液管理装置
KR1020170161407A KR20180087122A (ko) 2017-01-23 2017-11-29 현상액의 농도 감시 장치, 및 현상액 관리 장치
CN201711232885.8A CN108345185A (zh) 2017-01-23 2017-11-29 显影液的浓度监视装置及显影液管理装置
TW106141773A TW201841080A (zh) 2017-01-23 2017-11-30 顯影液的濃度監視裝置及顯影液管理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017009834A JP2018120897A (ja) 2017-01-23 2017-01-23 現像液の濃度監視装置、及び現像液管理装置

Publications (1)

Publication Number Publication Date
JP2018120897A true JP2018120897A (ja) 2018-08-02

Family

ID=62962053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017009834A Ceased JP2018120897A (ja) 2017-01-23 2017-01-23 現像液の濃度監視装置、及び現像液管理装置

Country Status (4)

Country Link
JP (1) JP2018120897A (ko)
KR (1) KR20180087122A (ko)
CN (1) CN108345185A (ko)
TW (1) TW201841080A (ko)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0996910A (ja) * 1995-09-29 1997-04-08 Fuji Photo Film Co Ltd 感光性平版印刷版の自動現像装置
JP2005070351A (ja) * 2003-08-22 2005-03-17 Nagase & Co Ltd 現像液供給方法及び装置
JP2006268023A (ja) * 2005-02-23 2006-10-05 Fuji Photo Film Co Ltd 感光性平版印刷版自動現像装置の現像制御方法及びその自動現像装置
JP2012225709A (ja) * 2011-04-18 2012-11-15 Toshiba Corp 二酸化炭素濃度測定装置、二酸化炭素濃度測定方法、及び二酸化炭素回収システム
JP6712415B2 (ja) * 2017-01-23 2020-06-24 株式会社平間理化研究所 現像液管理装置
JP6713658B2 (ja) * 2015-07-22 2020-06-24 株式会社平間理化研究所 現像液の成分濃度測定装置、成分濃度測定方法、現像液管理装置、及び現像液管理方法
JP6763608B2 (ja) * 2017-01-23 2020-09-30 株式会社平間理化研究所 現像液の二酸化炭素濃度表示装置、及び現像液管理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2561578B2 (ja) 1991-08-07 1996-12-11 株式会社平間理化研究所 現像液管理装置
US20020137219A1 (en) * 2001-01-19 2002-09-26 Owens Robert Austin Titration method for aqueous base developer solution
KR101446619B1 (ko) 2006-11-30 2014-10-01 미츠비시 가가쿠 엔지니어링 가부시키가이샤 현상액의 농도 조절 방법과 제조 장치 및 현상액
JP2011128455A (ja) 2009-12-18 2011-06-30 Nagase & Co Ltd 炭酸系塩類濃度測定装置、アルカリ現像液管理システム、及び、炭酸系塩類濃度測定方法
CN106094897B (zh) * 2016-06-24 2019-01-22 重庆广播电视大学 一种基于计算机的二氧化碳浓度监控***

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0996910A (ja) * 1995-09-29 1997-04-08 Fuji Photo Film Co Ltd 感光性平版印刷版の自動現像装置
JP2005070351A (ja) * 2003-08-22 2005-03-17 Nagase & Co Ltd 現像液供給方法及び装置
JP2006268023A (ja) * 2005-02-23 2006-10-05 Fuji Photo Film Co Ltd 感光性平版印刷版自動現像装置の現像制御方法及びその自動現像装置
JP2012225709A (ja) * 2011-04-18 2012-11-15 Toshiba Corp 二酸化炭素濃度測定装置、二酸化炭素濃度測定方法、及び二酸化炭素回収システム
JP6713658B2 (ja) * 2015-07-22 2020-06-24 株式会社平間理化研究所 現像液の成分濃度測定装置、成分濃度測定方法、現像液管理装置、及び現像液管理方法
JP6712415B2 (ja) * 2017-01-23 2020-06-24 株式会社平間理化研究所 現像液管理装置
JP6763608B2 (ja) * 2017-01-23 2020-09-30 株式会社平間理化研究所 現像液の二酸化炭素濃度表示装置、及び現像液管理装置

Also Published As

Publication number Publication date
TW201841080A (zh) 2018-11-16
KR20180087122A (ko) 2018-08-01
CN108345185A (zh) 2018-07-31

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