JP2017515126A - 電子デバイステスト装置用極端温度プローブカード - Google Patents
電子デバイステスト装置用極端温度プローブカード Download PDFInfo
- Publication number
- JP2017515126A JP2017515126A JP2016572932A JP2016572932A JP2017515126A JP 2017515126 A JP2017515126 A JP 2017515126A JP 2016572932 A JP2016572932 A JP 2016572932A JP 2016572932 A JP2016572932 A JP 2016572932A JP 2017515126 A JP2017515126 A JP 2017515126A
- Authority
- JP
- Japan
- Prior art keywords
- support
- contact
- probe card
- probe
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 222
- 238000012360 testing method Methods 0.000 title claims abstract description 174
- 238000005516 engineering process Methods 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000007769 metal material Substances 0.000 claims abstract description 6
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 30
- 230000002787 reinforcement Effects 0.000 claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- 229910010293 ceramic material Inorganic materials 0.000 claims description 5
- 239000011368 organic material Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910045601 alloy Inorganic materials 0.000 description 12
- 239000000956 alloy Substances 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 10
- 238000003825 pressing Methods 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000009466 transformation Effects 0.000 description 6
- 239000003351 stiffener Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000011990 functional testing Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 230000000452 restraining effect Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
本発明の別の態様によれば、この支持体は中間支持体に接着固定されてもよい。
上記のプローブカードに対して、特定の必要性及び仕様に合わせる目的で当業者が多くの修正及び変形をすることは可能であり、それらは以下の特許請求の範囲において規定される本発明の保護範囲にすべて含まれるということを理解されたい。
米国特許出願第2002/0109514号明細書には、中間プレートがMLC空間変換器とPCBの間に配置され、MLC空間変換器とPCBとの間の電気接続がファズボタン(登録商標)で実現され、PCBは電気接続を保ったままMLCとは異なる膨張率で自由に熱膨張できる、プローブカードアセンブリが開示されている。
さらに、米国特許出願第2008/0157790号明細書には、中間プレートに連結される、内側部材と外側部材から成る補強材アセンブリが開示され、そこでは複数の位置合わせ機構によって外側部材に対する内側部材の調節が可能であり、そのアセンブリの部品間での熱移動を低減できる。
Claims (10)
- 電子デバイスのテスト装置用のプローブカード(20、20’)であって、
複数の接触プローブ(22)を収容し、各接触プローブ(22)が被検デバイス(25)の接触パッドへの当接に適合された少なくとも1つの接触端を有する、少なくとも1つのテストヘッド(21)と、
補強材(24)及び中間支持体(26、33)に連結された、前記テストヘッド(21)の支持プレート(23)であって、前記中間支持体は、前記支持プレート(23)に結合されて中間支持体の両面に形成された接触パッド間の距離の空間的変換を行うように構成されている、支持プレートと、
を備え、
前記プローブカードは、前記中間支持体(26、33)と一体化された支持体(28)を備え、
前記中間支持体(26、33)は、プリント回路技術との適合性があって熱膨張係数が10×10−6より大きい材料で形成されており、
前記支持体(28)は、熱膨張係数が6×10−6より小さい金属材料で形成されていることを特徴とする、プローブカード。 - 両面に形成された接触パッド間の距離をさらに空間変換するように構成され、かつ接続要素(34)によって前記中間支持体(33)に連結された、更なる中間支持体(35)を備え、前記支持体(28)は前記中間支持体(33)と連結され、前記テストヘッド(21)の前記接触プローブ(22)は前記更なる中間支持体(35)に接触していることを特徴とする、請求項1に記載のプローブカード(20’)。
- 前記中間支持体(26、33)は、熱膨張係数が10×10−6から14×10−6との間にあり、好ましくは約12×10−6とであることを特徴とする、請求項1又は請求項2に記載のプローブカード(20、20’)。
- 前記中間支持体(26、33)は、熱膨張係数が10×10−6より大きいセラミック材料または有機材料で形成されていることを特徴とする、請求項3に記載のプローブカード(20、20’)。
- 前記更なる中間支持体(35)は、熱膨張係数が約4×10−6であるシリコンで形成されていることを特徴とする、請求項2〜請求項4のいずれか1項に記載のプローブカード(20’)。
- 前記支持体(28)は、ニッケル濃度が30%より大きいニッケル−鉄合金で形成されていることを特徴とする、請求項1〜請求項5のいずれか1項に記載のプローブカード(20、20’)。
- 前記支持体(28)は前記中間支持体(26、33)に接着固定されていることを特徴とする、請求項1〜請求項6のいずれか1項に記載のプローブカード(20、20’)。
- 前記補強材(24)を前記支持体(28)に連結させて前記支持体(28)を好適に傾斜させるように構成された調節システム(30)をさらに備えることを特徴とする、請求項1〜請求項7のいずれか1項に記載のプローブカード(20、20’)。
- 前記制御システム(30)は、前記支持体(28)の面上に分散され、前記支持体(28)と前記補強材(24)の間にねじ止めされた、複数のねじ(31、32)を備えることを特徴とする、請求項8に記載のプローブカード(20)。
- 前記制御システム(30)は、実質的に平行六面体の形状を有する前記支持体(28)のコーナに配置された調整ねじ(31)と、前記支持体(28)の実質的に中心にあるピンとして作用する少なくとも1つの支持ねじ(32)とを備えることを特徴とする、請求項9に記載のプローブカード(20、20’)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI2014A000350 | 2014-03-06 | ||
ITMI20140350 | 2014-03-06 | ||
PCT/IB2015/051606 WO2015132748A1 (en) | 2014-03-06 | 2015-03-05 | Probe card for a testing apparatus of electronic devices, particularly for extreme temperature applications |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017515126A true JP2017515126A (ja) | 2017-06-08 |
JP2017515126A5 JP2017515126A5 (ja) | 2017-07-20 |
JP6637909B2 JP6637909B2 (ja) | 2020-01-29 |
Family
ID=50733156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016572932A Active JP6637909B2 (ja) | 2014-03-06 | 2015-03-05 | 電子デバイステスト装置用極端温度プローブカード |
Country Status (10)
Country | Link |
---|---|
US (1) | US10509056B2 (ja) |
EP (1) | EP3114489B1 (ja) |
JP (1) | JP6637909B2 (ja) |
KR (1) | KR102251299B1 (ja) |
CN (1) | CN107533100B (ja) |
MY (1) | MY177187A (ja) |
PH (1) | PH12016501753A1 (ja) |
SG (1) | SG11201607219PA (ja) |
TW (1) | TWI655438B (ja) |
WO (1) | WO2015132748A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210121555A (ko) * | 2020-03-30 | 2021-10-08 | (주)포인트엔지니어링 | 프로브 헤드 및 이를 구비하는 프로브 카드 |
KR20220034529A (ko) * | 2020-09-11 | 2022-03-18 | 스테코 주식회사 | 프로브 카드 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102205429B1 (ko) * | 2014-03-06 | 2021-01-21 | 테크노프로브 에스.피.에이. | 전기 소자를 위한 테스트 기기용 고-평면성 프로브 카드 |
TWI783074B (zh) * | 2017-11-09 | 2022-11-11 | 義大利商探針科技公司 | 用於測試高頻裝置的測試頭的接觸探針 |
JP7129261B2 (ja) * | 2018-07-27 | 2022-09-01 | キオクシア株式会社 | 試験装置 |
TWI679427B (zh) * | 2018-10-01 | 2019-12-11 | 巨擘科技股份有限公司 | 探針卡裝置 |
WO2020191295A1 (en) * | 2019-03-20 | 2020-09-24 | Celadon Systems, Inc. | Portable probe card assembly |
DE102019002342A1 (de) * | 2019-03-29 | 2020-10-01 | Yamaichi Electronics Deutschland Gmbh | Testvorrichtung und Verwendung der Testvorrichtung |
WO2020220012A1 (en) * | 2019-04-26 | 2020-10-29 | Formfactor, Inc. | Probe on carrier architecture for vertical probe arrays |
TWI750552B (zh) * | 2019-12-16 | 2021-12-21 | 旺矽科技股份有限公司 | 可定位之探針卡及其製作方法 |
KR102210841B1 (ko) * | 2020-10-27 | 2021-02-02 | (주)샘씨엔에스 | 저 열팽창 특성을 가지는 프로브 카드용 세라믹 기판 |
CN116811040B (zh) * | 2023-08-26 | 2023-11-10 | 江苏鹏利芝达恩半导体有限公司 | 用于制造立式探针卡的陶瓷棒制造方法、设备及存储介质 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001159643A (ja) * | 1999-12-02 | 2001-06-12 | Hitachi Ltd | 接続装置および検査システム |
JP2005010052A (ja) * | 2003-06-19 | 2005-01-13 | Japan Electronic Materials Corp | プローブカード |
JP2005345443A (ja) * | 2004-06-07 | 2005-12-15 | Japan Electronic Materials Corp | プローブカード用接続ピンおよびそれを用いたプローブカード |
WO2007142204A1 (ja) * | 2006-06-08 | 2007-12-13 | Nhk Spring Co., Ltd. | プローブカード |
US20100237887A1 (en) * | 2009-02-19 | 2010-09-23 | Touchdown Technologies, Inc. | Microelectronic contactor assembly, structures thereof, and methods of constructing same |
JP2010541275A (ja) * | 2007-10-08 | 2010-12-24 | アムスト カンパニー, リミテッド | ウエハーテスト方法及びこのためのプローブカード |
JP2012047674A (ja) * | 2010-08-30 | 2012-03-08 | Advantest Corp | 試験用個片基板、プローブ、及び半導体ウェハ試験装置 |
JP2012093328A (ja) * | 2010-10-22 | 2012-05-17 | Isao Kimoto | プローブカード |
JP2013219299A (ja) * | 2012-04-12 | 2013-10-24 | Advantest Corp | 半導体ウェハの試験方法、半導体ウェハ試験装置、及びウェハトレイ |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6756797B2 (en) * | 2001-01-31 | 2004-06-29 | Wentworth Laboratories Inc. | Planarizing interposer for thermal compensation of a probe card |
US6677771B2 (en) * | 2001-06-20 | 2004-01-13 | Advantest Corp. | Probe contact system having planarity adjustment mechanism |
US7640651B2 (en) * | 2003-12-31 | 2010-01-05 | Microfabrica Inc. | Fabrication process for co-fabricating multilayer probe array and a space transformer |
US7285968B2 (en) * | 2005-04-19 | 2007-10-23 | Formfactor, Inc. | Apparatus and method for managing thermally induced motion of a probe card assembly |
US7471078B2 (en) * | 2006-12-29 | 2008-12-30 | Formfactor, Inc. | Stiffener assembly for use with testing devices |
KR100806736B1 (ko) * | 2007-05-11 | 2008-02-27 | 주식회사 에이엠에스티 | 프로브 카드 및 그 제조방법 |
DE102008034918B4 (de) * | 2008-07-26 | 2012-09-27 | Feinmetall Gmbh | Elektrische Prüfeinrichtung für die Prüfung eines elektrischen Prüflings sowie elektrisches Prüfverfahren |
-
2015
- 2015-03-05 EP EP15714643.2A patent/EP3114489B1/en active Active
- 2015-03-05 MY MYPI2016703207A patent/MY177187A/en unknown
- 2015-03-05 WO PCT/IB2015/051606 patent/WO2015132748A1/en active Application Filing
- 2015-03-05 JP JP2016572932A patent/JP6637909B2/ja active Active
- 2015-03-05 KR KR1020167027650A patent/KR102251299B1/ko active IP Right Grant
- 2015-03-05 CN CN201580011931.4A patent/CN107533100B/zh active Active
- 2015-03-05 SG SG11201607219PA patent/SG11201607219PA/en unknown
- 2015-03-06 TW TW104107166A patent/TWI655438B/zh active
-
2016
- 2016-09-06 PH PH12016501753A patent/PH12016501753A1/en unknown
- 2016-09-06 US US15/257,443 patent/US10509056B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001159643A (ja) * | 1999-12-02 | 2001-06-12 | Hitachi Ltd | 接続装置および検査システム |
JP2005010052A (ja) * | 2003-06-19 | 2005-01-13 | Japan Electronic Materials Corp | プローブカード |
JP2005345443A (ja) * | 2004-06-07 | 2005-12-15 | Japan Electronic Materials Corp | プローブカード用接続ピンおよびそれを用いたプローブカード |
WO2007142204A1 (ja) * | 2006-06-08 | 2007-12-13 | Nhk Spring Co., Ltd. | プローブカード |
JP2010541275A (ja) * | 2007-10-08 | 2010-12-24 | アムスト カンパニー, リミテッド | ウエハーテスト方法及びこのためのプローブカード |
US20100237887A1 (en) * | 2009-02-19 | 2010-09-23 | Touchdown Technologies, Inc. | Microelectronic contactor assembly, structures thereof, and methods of constructing same |
JP2012047674A (ja) * | 2010-08-30 | 2012-03-08 | Advantest Corp | 試験用個片基板、プローブ、及び半導体ウェハ試験装置 |
JP2012093328A (ja) * | 2010-10-22 | 2012-05-17 | Isao Kimoto | プローブカード |
JP2013219299A (ja) * | 2012-04-12 | 2013-10-24 | Advantest Corp | 半導体ウェハの試験方法、半導体ウェハ試験装置、及びウェハトレイ |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210121555A (ko) * | 2020-03-30 | 2021-10-08 | (주)포인트엔지니어링 | 프로브 헤드 및 이를 구비하는 프로브 카드 |
KR102342806B1 (ko) * | 2020-03-30 | 2021-12-23 | (주)포인트엔지니어링 | 프로브 헤드 및 이를 구비하는 프로브 카드 |
KR20220034529A (ko) * | 2020-09-11 | 2022-03-18 | 스테코 주식회사 | 프로브 카드 |
KR102393600B1 (ko) | 2020-09-11 | 2022-05-03 | 스테코 주식회사 | 프로브 카드 |
Also Published As
Publication number | Publication date |
---|---|
EP3114489A1 (en) | 2017-01-11 |
TWI655438B (zh) | 2019-04-01 |
US20160377656A1 (en) | 2016-12-29 |
WO2015132748A1 (en) | 2015-09-11 |
TW201534931A (zh) | 2015-09-16 |
JP6637909B2 (ja) | 2020-01-29 |
EP3114489B1 (en) | 2018-08-01 |
PH12016501753B1 (en) | 2016-11-07 |
MY177187A (en) | 2020-09-09 |
US10509056B2 (en) | 2019-12-17 |
KR20160130464A (ko) | 2016-11-11 |
PH12016501753A1 (en) | 2016-11-07 |
CN107533100A (zh) | 2018-01-02 |
CN107533100B (zh) | 2021-01-22 |
SG11201607219PA (en) | 2016-09-29 |
KR102251299B1 (ko) | 2021-05-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6637909B2 (ja) | 電子デバイステスト装置用極端温度プローブカード | |
JP6590840B2 (ja) | 電子デバイステスト装置用高平坦度プローブカード | |
JP5427536B2 (ja) | プローブカード | |
US20060091510A1 (en) | Probe card interposer | |
EP1879035A1 (en) | Probe Card | |
KR20090120513A (ko) | 접속용 보드, 프로브 카드 및 이를 구비한 전자부품 시험장치 | |
JP2010210600A (ja) | プローブカード | |
JP2009002845A (ja) | 接触子及び接続装置 | |
US20090189620A1 (en) | Compliant membrane probe | |
JP4397960B2 (ja) | 半導体ウェハのテスト装置及び半導体ウェハ用プローブカード | |
JP5643476B2 (ja) | 二重弾性機構プローブカード | |
JP7302011B2 (ja) | 垂直プローブアレイ用のキャリア構造上のプローブ | |
KR100911661B1 (ko) | 평탄화 수단을 구비한 프로브 카드 | |
JP4962929B2 (ja) | プローバ装置及びこれに用いるプローブ組立体 | |
US9128122B2 (en) | Stiffener plate for a probecard and method | |
KR100852514B1 (ko) | 반도체 검사용 수직형 프로브 및 이 프로브를 구비한프로브 카드 및 그 제조방법 | |
JP2006317294A (ja) | プローブカード | |
JP2009288109A (ja) | 二重弾性機構プローブカード | |
KR100446551B1 (ko) | 화산형 프로브, 이의 제조방법 및 이를 구비한프로브카드 | |
JP2007051906A (ja) | プローブカード | |
JP2010008335A (ja) | プローブカード |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160905 |
|
A529 | Written submission of copy of amendment under article 34 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A529 Effective date: 20160905 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180223 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20181220 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190108 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20190405 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190708 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190820 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191115 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191203 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20191223 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6637909 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |