JP6590840B2 - 電子デバイステスト装置用高平坦度プローブカード - Google Patents
電子デバイステスト装置用高平坦度プローブカード Download PDFInfo
- Publication number
- JP6590840B2 JP6590840B2 JP2016572931A JP2016572931A JP6590840B2 JP 6590840 B2 JP6590840 B2 JP 6590840B2 JP 2016572931 A JP2016572931 A JP 2016572931A JP 2016572931 A JP2016572931 A JP 2016572931A JP 6590840 B2 JP6590840 B2 JP 6590840B2
- Authority
- JP
- Japan
- Prior art keywords
- support element
- probe card
- support
- contact
- adjustment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Description
Claims (8)
- 電子デバイスのテスト装置用のプローブカード(20)であって、
複数の接触プローブ(22)を収容し、各接触プローブ(22)が被検デバイス(25)の接触パッドへの当接に適した少なくとも1つの接触先端を有する、少なくとも1つのテストヘッド(21)と、
補強材(24)の一部に連結された、前記テストヘッド(21)の支持プレート(23)と、
前記支持プレート(23)に結合されている中間支持体(26)であって、前記中間支持体(26)の対向する面上に形成された接触パッド間の距離を空間的に変換する中間支持体(26)と、
前記中間支持体(26)よりも高剛性の材料によって実現された支持要素(28)であって、前記補強材(24)の前記支持プレート(23)に連結されていない他の一部と前記中間支持体(26)との間に挟まれた支持要素(28)と、
を備え、
前記プローブカードは、前記補強材(24)と前記支持要素(28)を連結する調整システム(30)を備え、
前記調整システム(30)は、押すことにより作用する第1の調節ねじ(31)と、引くことにより作用する第2の調節ねじ(32)とを備え、前記第1の調節ねじ(31)は、前記補強材(24)内に形成された第1の座部(33)内に収容されて前記補強材(24)と前記支持要素(28)との間に配置されたヘッド(31C)を有し、
前記第1と第2の調節ねじ(31、32)は前記支持要素(28)の面上に分布されており、
前記調整システム(30)は、前記補強材(24)に対して前記支持要素(28)を押す及び/又は引く局所的な力を前記支持要素(28)に印加可能であり、
前記中間支持体(26)は、前記局所的な力が前記中間支持体(26)に伝達されて前記中間支持体(26)の局所的微小修正を実現するように、前記支持要素(28)に接続されていることを特徴とする、プローブカード(20)。 - 前記支持要素(28)は前記中間支持体(26)に接着固定されていることを特徴とする、請求項1に記載のプローブカード(20)。
- 前記支持要素(28)は金属プラグであることを特徴とする、請求項1または請求項2に記載のプローブカード(20)。
- 前記第1の調節ねじ(31)のそれぞれが、
前記支持要素(28)内に収容された本体(31D)を有し、
前記ヘッド(31C)は、前記支持要素(28)上に載った少なくとも1つのアンダカット面(31B)と前記アンダカット面(31B)の反対側にあって、前記第1の調節ねじ(31)の調節のために各第1の座部(33)を介してアクセス可能な平面(31A)とを有し、
前記第1の調節ねじ(31)は前記支持要素(28)を押すことによって作用するようになっていることを特徴とする、請求項1に記載のプローブカード(20)。 - 前記第2の調節ねじ(32)は、前記補強材(24)内に形成された第2の座部(34)内に収容され、
前記第2の調節ねじ(32)のそれぞれが、
前記支持要素(28)内に収容された本体(32D)と、
前記補強材(24)上に載った少なくとも1つのアンダカット面(32B)と、前記アンダカット面(32B)の反対側にあって、前記第2の調節ねじ(32)の調節のために各第2の座部(34)を介してアクセス可能な平面(32A)とを有するヘッド(32C)と、
を有し、
前記第2の調節ねじ(32)は、前記補強材(24)に向かって押すのとは対照的に、前記支持要素(28)を引くことによって作用するようになっていることを特徴とする、請求項4に記載のプローブカード(20)。 - 前記第1と第2の調節ねじ(31、32)は管状の要素によって実現され、2mm〜4mmの間の直径を有する本体(31D、32D)と4mm〜7mmの間の直径を有するヘッド(31C、32C)とを有し、これらの値は前記プローブカード(20)の正常な動作条件、すなわち前記プローブカードの機械的応力及び/又は熱膨張がない場合において意図される値であることを特徴とする、請求項5に記載のプローブカード(20)。
- 前記第1と第2の調節ねじ(31、32)の前記第1と第2の座部(33、34)は、管状の要素で実現され、前記第1と第2の調節ねじ(31、32)の前記ヘッド(31C、32C)に対して共役的かつ相補的な形状を有する少なくとも1つの収納部(33C、34C)と、延在する通路(33D、34D)とを備えることを特徴とする、請求項6に記載のプローブカード(20)。
- 前記調整システム(30)は、前記支持要素(28)の中央部分とコーナ部分とに位置する支持ねじ(35、36)であって、前記支持要素(28)を傾斜させるのに使用される支持ねじ(35、36)をさらに備えることを特徴とする、請求項1〜請求項7のいずれか1項に記載のプローブカード(20)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI20140349 | 2014-03-06 | ||
ITMI2014A000349 | 2014-03-06 | ||
PCT/IB2015/051605 WO2015132747A1 (en) | 2014-03-06 | 2015-03-05 | High-planarity probe card for a testing apparatus for electronic devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017513014A JP2017513014A (ja) | 2017-05-25 |
JP6590840B2 true JP6590840B2 (ja) | 2019-10-16 |
Family
ID=50733155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016572931A Active JP6590840B2 (ja) | 2014-03-06 | 2015-03-05 | 電子デバイステスト装置用高平坦度プローブカード |
Country Status (10)
Country | Link |
---|---|
US (1) | US10151775B2 (ja) |
EP (1) | EP3114488B1 (ja) |
JP (1) | JP6590840B2 (ja) |
KR (1) | KR102205429B1 (ja) |
CN (1) | CN106104280B (ja) |
MY (1) | MY179750A (ja) |
PH (1) | PH12016501754B1 (ja) |
SG (1) | SG11201607222RA (ja) |
TW (1) | TWI655437B (ja) |
WO (1) | WO2015132747A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI610080B (zh) * | 2016-05-12 | 2018-01-01 | 中華精測科技股份有限公司 | 探針卡總成 |
JP6855185B2 (ja) * | 2016-07-27 | 2021-04-07 | 株式会社日本マイクロニクス | 電気的接続装置 |
IT201700046645A1 (it) * | 2017-04-28 | 2018-10-28 | Technoprobe Spa | Scheda di misura per un’apparecchiatura di test di dispositivi elettronici |
US10345136B2 (en) | 2017-07-14 | 2019-07-09 | International Business Machines Corporation | Adjustable load transmitter |
TWI639834B (zh) * | 2017-07-14 | 2018-11-01 | 中華精測科技股份有限公司 | 探針卡支撐裝置及探針卡總成 |
US10527649B2 (en) | 2017-07-14 | 2020-01-07 | International Business Machines Corporation | Probe card alignment |
IT201700100522A1 (it) * | 2017-09-07 | 2019-03-07 | Technoprobe Spa | Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione |
TWI632373B (zh) * | 2017-10-27 | 2018-08-11 | 和碩聯合科技股份有限公司 | 治具平台 |
KR102163321B1 (ko) * | 2019-02-08 | 2020-10-21 | 화인인스트루먼트 (주) | 프로브 카드 및 그 제조 방법 |
JP7198127B2 (ja) * | 2019-03-20 | 2022-12-28 | 株式会社アドバンテスト | インタポーザ、ソケット、ソケット組立体、及び、配線板組立体 |
KR102484329B1 (ko) * | 2022-08-12 | 2023-01-03 | 주식회사 비이링크 | 인터포저 |
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JP4504541B2 (ja) * | 2000-09-08 | 2010-07-14 | 株式会社ヨコオ | プローブ装置 |
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JP3621938B2 (ja) * | 2002-08-09 | 2005-02-23 | 日本電子材料株式会社 | プローブカード |
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KR100862887B1 (ko) * | 2007-02-13 | 2008-10-13 | 주식회사 파이컴 | 평탄도 조절 어셈블리와 이를 포함하는 전기 검사 장치 및이를 이용한 평탄도 조절 방법 |
KR101242004B1 (ko) * | 2007-03-19 | 2013-03-11 | (주) 미코티엔 | 프로브 카드 |
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JP5138615B2 (ja) * | 2008-02-15 | 2013-02-06 | シャープ株式会社 | 半導体機能試験電気接続装置 |
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KR101674135B1 (ko) * | 2010-01-13 | 2016-11-09 | (주)엠투엔 | 프로브 카드 |
JP2012093328A (ja) * | 2010-10-22 | 2012-05-17 | Isao Kimoto | プローブカード |
JP5863168B2 (ja) * | 2011-11-10 | 2016-02-16 | 株式会社日本マイクロニクス | プローブカード及びその製造方法 |
JP5991823B2 (ja) * | 2012-02-14 | 2016-09-14 | 株式会社日本マイクロニクス | 電気的接続装置及びその組立方法 |
SG11201607219PA (en) * | 2014-03-06 | 2016-09-29 | Technoprobe Spa | Probe card for a testing apparatus of electronic devices, particularly for extreme temperature applications |
-
2015
- 2015-03-05 WO PCT/IB2015/051605 patent/WO2015132747A1/en active Application Filing
- 2015-03-05 MY MYPI2016703212A patent/MY179750A/en unknown
- 2015-03-05 KR KR1020167027490A patent/KR102205429B1/ko active IP Right Grant
- 2015-03-05 JP JP2016572931A patent/JP6590840B2/ja active Active
- 2015-03-05 CN CN201580012043.4A patent/CN106104280B/zh active Active
- 2015-03-05 SG SG11201607222RA patent/SG11201607222RA/en unknown
- 2015-03-05 EP EP15714642.4A patent/EP3114488B1/en active Active
- 2015-03-06 TW TW104107114A patent/TWI655437B/zh active
-
2016
- 2016-09-06 US US15/257,424 patent/US10151775B2/en active Active
- 2016-09-06 PH PH12016501754A patent/PH12016501754B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
MY179750A (en) | 2020-11-12 |
US10151775B2 (en) | 2018-12-11 |
EP3114488A1 (en) | 2017-01-11 |
CN106104280A (zh) | 2016-11-09 |
PH12016501754A1 (en) | 2016-11-07 |
TWI655437B (zh) | 2019-04-01 |
PH12016501754B1 (en) | 2016-11-07 |
JP2017513014A (ja) | 2017-05-25 |
US20160377655A1 (en) | 2016-12-29 |
SG11201607222RA (en) | 2016-09-29 |
KR102205429B1 (ko) | 2021-01-21 |
WO2015132747A1 (en) | 2015-09-11 |
TW201534926A (zh) | 2015-09-16 |
EP3114488B1 (en) | 2018-08-01 |
CN106104280B (zh) | 2019-08-06 |
KR20160130448A (ko) | 2016-11-11 |
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