JP2017199870A - 樹脂封止装置および樹脂封止方法 - Google Patents
樹脂封止装置および樹脂封止方法 Download PDFInfo
- Publication number
- JP2017199870A JP2017199870A JP2016091457A JP2016091457A JP2017199870A JP 2017199870 A JP2017199870 A JP 2017199870A JP 2016091457 A JP2016091457 A JP 2016091457A JP 2016091457 A JP2016091457 A JP 2016091457A JP 2017199870 A JP2017199870 A JP 2017199870A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- mold
- resin sealing
- claw portion
- lower mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 74
- 229920005989 resin Polymers 0.000 title claims abstract description 74
- 238000007789 sealing Methods 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 224
- 210000000078 claw Anatomy 0.000 claims abstract description 92
- 230000007246 mechanism Effects 0.000 claims abstract description 68
- 238000000465 moulding Methods 0.000 claims abstract description 27
- 230000007723 transport mechanism Effects 0.000 claims description 29
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 230000004048 modification Effects 0.000 description 10
- 238000012986 modification Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7841—Holding or clamping means for handling purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7858—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined
- B29C65/7888—Means for handling of moving sheets or webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/024—Thermal pre-treatments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
本実施の形態に係る樹脂封止装置は、典型的には以下の構成を備えるものである。
1 上下動可能な爪部を有する基板搬送機構
2 基板および基板を保持する爪部を加熱するプレヒータ(加熱機構)
3 基板を爪部から離すためのピン等の部材を有する成形型の下型
4 下型に載置された基板の端面寄せを行う基板位置調整機構(位置決め機構)
5 成形型の上型及び下型を型締する型締機構
図14から図16は、各々、基板の短手方向(幅方向)の位置決めの第1から第3工程を示す図である。図14から図16において、(a)は幅方向から見た側面図、(b)は上方向から見た上面図である。
Claims (12)
- 上下方向および水平方向に移動可能な爪部と、前記爪部上に載置された基板を保持可能な基板保持部とを含む基板搬送機構と、
上型および下型を含む成形型であって、キャビティが前記上型および前記下型の少なくとも一方に形成され、前記爪部上に保持された前記基板が前記爪部とともに水平方向に沿って前記上型および前記下型の間に挿入され、前記爪部を水平方向に沿って前記上型および前記下型の間から抜き出すときに前記基板を支持可能な支持部とを含む成形型と、
前記基板を前記下型上に載置した状態で前記上型および前記下型を型締して前記キャビティ内において前記基板を樹脂封止する型締機構とを備えた、樹脂封止装置。 - 前記支持部は、前記爪部を水平方向に沿って前記上型および前記下型の間から抜き出すときに、前記基板に接触して前記基板を止めることができる部材を含む、請求項1に記載の樹脂封止装置。
- 前記支持部は、前記爪部が前記上型および前記下型の間から抜き出された状態で、前記上型および前記下型の間の位置にて前記基板を支持可能な部材を含む、請求項1または請求項2に記載の樹脂封止装置。
- 前記上型および前記下型の間に挿入された前記基板の位置決めを行なう位置決め機構をさらに備えた、請求項1から請求項3のいずれか1項に記載の樹脂封止装置。
- 前記成形型は、前記基板を前記下型上に固定可能な固定機構をさらに含む、請求項1から請求項4のいずれか1項に記載の樹脂封止装置。
- 前記上型および前記下型の間に挿入される前の前記基板が載置される基板載置部をさらに備え、
前記基板載置部は、前記基板の幅方向両端部を支持可能な第1部分と、前記基板の幅方向内側部を支持可能な第2部分とを含む、請求項1から請求項5のいずれか1項に記載の樹脂封止装置。 - 前記樹脂封止される前の前記基板を加熱する加熱機構をさらに備えた、請求項1から請求項6のいずれか1項に記載の樹脂封止装置。
- 前記加熱機構は、前記爪部の形状に対応する凹部が上面に形成されている、請求項7に記載の樹脂封止装置。
- 基板搬送機構の爪部上に基板を保持する工程と、
上型および下型を含み、キャビティが前記上型および前記下型の少なくとも一方に形成された成形型を準備する工程と、
前記爪部上に保持された前記基板を前記爪部とともに水平方向に沿って前記上型および前記下型の間に挿入する工程と、
前記上型と前記下型との間において前記基板を支持した状態で前記爪部を水平方向に沿って前記上型および前記下型の間から抜き出す工程と、
前記基板を前記下型上に載置した状態で前記上型および前記下型を型締して前記キャビティ内において前記基板を樹脂封止する工程とを備えた、樹脂封止方法。 - 前記爪部は、前記基板の挿入の方向に沿って互いに略平行に延在する第1爪および第2爪を含む、請求項9に記載の樹脂封止方法。
- 前記樹脂封止される前の前記基板を加熱する工程をさらに備えた、請求項9または請求項10に記載の樹脂封止方法。
- 前記上型および前記下型の間において前記樹脂封止される前の前記基板の位置決めが行なわれる、請求項9から請求項11のいずれか1項に記載の樹脂封止方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016091457A JP6320448B2 (ja) | 2016-04-28 | 2016-04-28 | 樹脂封止装置および樹脂封止方法 |
TW106107755A TWI666104B (zh) | 2016-04-28 | 2017-03-09 | Resin sealing device and resin sealing method |
KR1020170044090A KR20170123231A (ko) | 2016-04-28 | 2017-04-05 | 수지 밀봉 장치 및 수지 밀봉 방법 |
CN201710281198.9A CN107379381A (zh) | 2016-04-28 | 2017-04-26 | 树脂密封装置和树脂密封方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016091457A JP6320448B2 (ja) | 2016-04-28 | 2016-04-28 | 樹脂封止装置および樹脂封止方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017199870A true JP2017199870A (ja) | 2017-11-02 |
JP6320448B2 JP6320448B2 (ja) | 2018-05-09 |
Family
ID=60238282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016091457A Active JP6320448B2 (ja) | 2016-04-28 | 2016-04-28 | 樹脂封止装置および樹脂封止方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6320448B2 (ja) |
KR (1) | KR20170123231A (ja) |
CN (1) | CN107379381A (ja) |
TW (1) | TWI666104B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021184442A (ja) * | 2020-05-22 | 2021-12-02 | アピックヤマダ株式会社 | 樹脂モールド装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10630538B2 (en) | 2016-10-07 | 2020-04-21 | Hyundai Motor Company | Software update method and apparatus for vehicle |
JP7068094B2 (ja) * | 2018-08-10 | 2022-05-16 | アピックヤマダ株式会社 | ワーク搬送装置、樹脂搬送装置及び樹脂モールド方法 |
JP7002679B2 (ja) * | 2018-12-28 | 2022-01-20 | 本田技研工業株式会社 | 樹脂成形システム及び樹脂成形方法 |
CN110310915B (zh) * | 2019-06-03 | 2023-03-24 | 通富微电子股份有限公司 | 一种顶出机构及塑封装置 |
CN112864029B (zh) * | 2021-01-04 | 2022-10-21 | 深圳市铨天科技有限公司 | 一种用于储存芯片的模压夹具加工设备 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0241916U (ja) * | 1988-09-16 | 1990-03-22 | ||
JP2005026267A (ja) * | 2003-06-30 | 2005-01-27 | Daiichi Seiko Kk | 樹脂封止装置 |
JP2007095804A (ja) * | 2005-09-27 | 2007-04-12 | Towa Corp | 電子部品の樹脂封止成形方法及び装置 |
JP2008166367A (ja) * | 2006-12-27 | 2008-07-17 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2008198884A (ja) * | 2007-02-15 | 2008-08-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2010182906A (ja) * | 2009-02-06 | 2010-08-19 | Tokyo Electron Ltd | 基板処理装置 |
JP2011068104A (ja) * | 2009-09-28 | 2011-04-07 | Sumitomo Heavy Ind Ltd | 封止装置及び封止方法 |
JP2012044139A (ja) * | 2010-08-16 | 2012-03-01 | Taiwan Semiconductor Manufacturing Co Ltd | 半導体装置を封止するシステム及び方法 |
JP2013009007A (ja) * | 2012-09-27 | 2013-01-10 | Dainippon Screen Mfg Co Ltd | 基板処理装置における基板搬送方法 |
JP2015008334A (ja) * | 2010-02-17 | 2015-01-15 | 株式会社ニコン | 搬送装置、搬送方法、露光装置、及びデバイス製造方法 |
JP2015088733A (ja) * | 2013-09-26 | 2015-05-07 | セイコーインスツル株式会社 | 半導体製造装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11191563A (ja) * | 1997-12-26 | 1999-07-13 | Hitachi Ltd | モールド方法および装置 |
JP2007281364A (ja) * | 2006-04-11 | 2007-10-25 | Towa Corp | 電子部品の樹脂封止成形方法及び装置 |
JP5312897B2 (ja) * | 2008-10-20 | 2013-10-09 | Towa株式会社 | 圧縮成形装置 |
US9199396B2 (en) * | 2010-07-15 | 2015-12-01 | Asm Technology Singapore Pte Ltd | Substrate carrier for molding electronic devices |
JP2012104518A (ja) * | 2010-11-05 | 2012-05-31 | Sumitomo Heavy Ind Ltd | 封止装置の基板受け渡し機構及び封止装置の基板受け渡し方法 |
KR102455987B1 (ko) * | 2014-07-22 | 2022-10-18 | 아피쿠 야마다 가부시키가이샤 | 성형 금형, 성형 장치, 성형품의 제조 방법 및 수지 몰드 방법 |
-
2016
- 2016-04-28 JP JP2016091457A patent/JP6320448B2/ja active Active
-
2017
- 2017-03-09 TW TW106107755A patent/TWI666104B/zh active
- 2017-04-05 KR KR1020170044090A patent/KR20170123231A/ko active Search and Examination
- 2017-04-26 CN CN201710281198.9A patent/CN107379381A/zh active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0241916U (ja) * | 1988-09-16 | 1990-03-22 | ||
JP2005026267A (ja) * | 2003-06-30 | 2005-01-27 | Daiichi Seiko Kk | 樹脂封止装置 |
JP2007095804A (ja) * | 2005-09-27 | 2007-04-12 | Towa Corp | 電子部品の樹脂封止成形方法及び装置 |
JP2008166367A (ja) * | 2006-12-27 | 2008-07-17 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2008198884A (ja) * | 2007-02-15 | 2008-08-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2010182906A (ja) * | 2009-02-06 | 2010-08-19 | Tokyo Electron Ltd | 基板処理装置 |
JP2011068104A (ja) * | 2009-09-28 | 2011-04-07 | Sumitomo Heavy Ind Ltd | 封止装置及び封止方法 |
JP2015008334A (ja) * | 2010-02-17 | 2015-01-15 | 株式会社ニコン | 搬送装置、搬送方法、露光装置、及びデバイス製造方法 |
JP2012044139A (ja) * | 2010-08-16 | 2012-03-01 | Taiwan Semiconductor Manufacturing Co Ltd | 半導体装置を封止するシステム及び方法 |
JP2013009007A (ja) * | 2012-09-27 | 2013-01-10 | Dainippon Screen Mfg Co Ltd | 基板処理装置における基板搬送方法 |
JP2015088733A (ja) * | 2013-09-26 | 2015-05-07 | セイコーインスツル株式会社 | 半導体製造装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021184442A (ja) * | 2020-05-22 | 2021-12-02 | アピックヤマダ株式会社 | 樹脂モールド装置 |
JP7323937B2 (ja) | 2020-05-22 | 2023-08-09 | アピックヤマダ株式会社 | 樹脂モールド装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20170123231A (ko) | 2017-11-07 |
CN107379381A (zh) | 2017-11-24 |
TW201801882A (zh) | 2018-01-16 |
TWI666104B (zh) | 2019-07-21 |
JP6320448B2 (ja) | 2018-05-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6320448B2 (ja) | 樹脂封止装置および樹脂封止方法 | |
JP6655148B1 (ja) | 搬送装置、樹脂成形装置、搬送方法、及び樹脂成形品の製造方法 | |
US20210370565A1 (en) | Conveying apparatus, resin molding apparatus, conveying method, and resin molded product manufacturing method | |
CN113597365B (zh) | 树脂成形品的制造方法 | |
TWI750369B (zh) | 樹脂模製模具及樹脂模製裝置 | |
JP6693798B2 (ja) | 樹脂モールド装置及び樹脂モールド方法 | |
TW202000417A (zh) | 樹脂成形裝置及樹脂成形品的製造方法 | |
CN112889139B (zh) | 柱塞的更换方法、柱塞单元及树脂成形装置 | |
KR102408581B1 (ko) | 수지 몰딩 장치 및 수지 몰딩 방법 | |
JP4153769B2 (ja) | 樹脂封止装置 | |
JP7360369B2 (ja) | 樹脂成形装置、及び樹脂成形品の製造方法 | |
JP2009148934A (ja) | 樹脂封止金型および当該樹脂封止金型の使用方法 | |
WO2023144856A1 (ja) | 樹脂封止装置、封止金型、及び樹脂封止方法 | |
JP7068144B2 (ja) | 樹脂モールドプレス装置及び樹脂モールド装置 | |
TWI847304B (zh) | 樹脂密封裝置、密封模具以及樹脂密封方法 | |
JP4150658B2 (ja) | 樹脂封止装置 | |
KR20220055406A (ko) | 수지 밀봉 장치 및 워크 반송 방법 | |
KR0137069B1 (ko) | 반도체용 몰딩프레스의 리드프레임 로더(lead frame loader) 장치 | |
JP2022039710A (ja) | 樹脂成形装置、及び樹脂成形品の製造方法 | |
JPH0546897Y2 (ja) | ||
JP2022039810A (ja) | 成形型、樹脂成形装置、及び樹脂成形品の製造方法 | |
CN118103190A (zh) | 树脂密封装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170808 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170926 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180306 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180403 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6320448 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |