JP2017156525A - Exposure device for printed circuit board - Google Patents

Exposure device for printed circuit board Download PDF

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JP2017156525A
JP2017156525A JP2016039453A JP2016039453A JP2017156525A JP 2017156525 A JP2017156525 A JP 2017156525A JP 2016039453 A JP2016039453 A JP 2016039453A JP 2016039453 A JP2016039453 A JP 2016039453A JP 2017156525 A JP2017156525 A JP 2017156525A
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substrate
frame
frame body
printed circuit
exposure apparatus
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JP6663252B2 (en
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貴之 原
Takayuki Hara
貴之 原
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Ushio Denki KK
Ushio Inc
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Ushio Denki KK
Ushio Inc
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Priority to JP2016039453A priority Critical patent/JP6663252B2/en
Priority to TW106104924A priority patent/TWI694540B/en
Priority to KR1020170025603A priority patent/KR102126456B1/en
Priority to CN201710117232.9A priority patent/CN107148152B/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PROBLEM TO BE SOLVED: To enable pushing a peripheral part of a substrate to a table without using vacuum suction force sucking the substrate to the table or exposing the same to vacuum and easily coping with a substrate with different thickness.SOLUTION: A pair of peripheral encapsulation members 62 arranged on a flame body 61 with a shape without screening an exposed light contacts a table 1 when a substrate S is sucked to the table 1 by a vacuum suction mechanism 3, the flame body 61 is pressed to the table 1 by discharging gas from a formed closed space via an exhaust hole for the flame body 13. Thereby the peripheral part of the substrate S is pressed to the table 1 and the substrate S is exposed to a light by an exposure system 2 with a state that deformation of the substrate S is reformed.SELECTED DRAWING: Figure 1

Description

本願の発明は、プリント基板製造用の露光装置に関するものであり、特に基板の変形を矯正しつつ露光する機能を備えた露光装置に関するものである。   The present invention relates to an exposure apparatus for manufacturing a printed circuit board, and more particularly to an exposure apparatus having a function of performing exposure while correcting deformation of the substrate.

プリント基板は、携帯電話やパーソナルコンピュータ等の電子機器に搭載されている。これらの電子機器は、小型軽量化を行うために、基板上に形成されたパターンの集積度を高めることが要求されており、回路要素やパターンの微細化が進んでいる。
プリント基板へのパターンの形成を行うフォトリソグラフィには、基板に塗布されたレジストに対して回路パターン等の所定のパターンを形成するための露光工程が存在しており、露光装置が使用される。露光装置では、基板の所定の位置に回路パターン等の所定のパターンの転写を行うため、露光を行う光学系に対して正しい位置に基板を配置する必要がある。このため、光学系に対して設置されたテーブル上の所定の位置に基板を載置するとともに、露光中にこの位置を保持するよう基板をテーブルに真空吸着する機構が採用されている。 The printed circuit board is mounted on an electronic device such as a mobile phone or a personal computer. In order to reduce the size and weight of these electronic devices, it is required to increase the degree of integration of patterns formed on a substrate, and circuit elements and patterns are being miniaturized.
In photolithography for forming a pattern on a printed board, there is an exposure process for forming a predetermined pattern such as a circuit pattern on a resist applied to the board, and an exposure apparatus is used. In the exposure apparatus, since a predetermined pattern such as a circuit pattern is transferred to a predetermined position on the substrate, it is necessary to place the substrate at a correct position with respect to the optical system for performing exposure. For this reason, a mechanism is employed in which the substrate is placed at a predetermined position on a table installed with respect to the optical system, and the substrate is vacuum-sucked to the table so as to hold this position during exposure.

特開２００９−１０９５５３号公報JP 2009-109553 A 特開２０１１−８１１５６号公報JP 2011-81156 A 特許４５８９１９８号公報Japanese Patent No. 4589198

上記のような基板をテーブルに真空吸着する機構を採用したプリント基板用露光装置において、反りや歪みといった変形が生じている基板に対しても正確に露光を行うことが要求されている。基板の反りや歪みといった変形は、幾つかの要因で発生する。一つには、電子機器の小型軽量化のため、非常に薄い基板が採用されるようになってきていることが挙げられる。ポリイミドやポリエステル等で形成された薄いフレキシブル基板は、前工程での熱処理の影響を受けやすく、横から見ると湾曲していたり、波打つように湾曲していたりする場合がある。また、ガラスエポキシのようなリジッド基板の場合でも、基板が多層構造の場合は、素材間の熱膨張係数の違いなどから、積層のための処理を繰り返すにしたがって基板の周辺部に反りや歪みが発生し易い。   In an exposure apparatus for a printed circuit board that employs a mechanism for vacuum-sucking a substrate as described above, it is required to accurately expose a substrate that has undergone deformation such as warping or distortion. Deformation such as substrate warpage or distortion occurs due to several factors. One is that very thin substrates have been adopted to reduce the size and weight of electronic devices. A thin flexible substrate formed of polyimide, polyester, or the like is easily affected by the heat treatment in the previous process, and may be curved when viewed from the side or may be curved like a wave. Even in the case of a rigid substrate such as glass epoxy, if the substrate has a multilayer structure, warpage or distortion will occur in the peripheral portion of the substrate as the process for lamination is repeated due to differences in the thermal expansion coefficient between materials. It is easy to generate.

露光装置を使用するユーザにおいては、このように変形が生じている基板でも、回路パターンなどの所定のパターンを露光したいという要望がある。
上記のような変形した基板に対する露光において問題となるのは、真空吸着のエラーである。これは、変形した基板をテーブルに載置して真空吸着を行おうとした場合、変形した箇所で真空が漏れるため、十分に吸着できなくなるエラーである。吸着エラーが生じると、露光中に基板が位置ずれを起こす場合があるので、通常は装置の動作が停止し、露光処理が中断される。 A user who uses an exposure apparatus has a desire to expose a predetermined pattern such as a circuit pattern even on a substrate that is deformed in this way.
A problem in the exposure of the deformed substrate as described above is a vacuum adsorption error. This is an error in which, when a deformed substrate is placed on a table and vacuum suction is performed, a vacuum leaks at the deformed portion, so that the suction cannot be sufficiently performed. If a suction error occurs, the substrate may be displaced during exposure, so that the operation of the apparatus normally stops and the exposure process is interrupted.

このため、真空吸着の際、基板をテーブルに押し付ける技術が幾つか提案されている。このうち、特許文献１は、基板が真空吸着される際、基板を取り囲むようにしてパッキンが配置される状態とし、パッキンにより密閉空間として密閉空間内が真空引きされる構造を開示している。この構造では、基板をテーブルに押し付ける機構が、露光時には取り除かれるので、反りの弾性の強い基板では、露光時に真空吸着エラーが発生する場合がある。また、基板が真空に直接晒されるため、基板の表面に保護フィルムが設けられている場合、それが剥がれたり、保護フィルムの内側に気泡が生じたりすることも考えられる。   For this reason, several techniques for pressing the substrate against the table during vacuum suction have been proposed. Among these, Patent Document 1 discloses a structure in which when a substrate is vacuum-sucked, a packing is disposed so as to surround the substrate, and the inside of the sealed space is evacuated as a sealed space by the packing. In this structure, since the mechanism for pressing the substrate against the table is removed during exposure, a vacuum suction error may occur during exposure for a substrate with strong warping elasticity. Further, since the substrate is directly exposed to vacuum, when a protective film is provided on the surface of the substrate, it may be peeled off or bubbles may be generated inside the protective film.

また、特許文献２には、真空吸着される基板の周辺部を覆った状態で基板固定シート（マイラーシート）を配置し、基板の真空吸着の際の吸引力によって当該シートを弾性変形させる技術が開示されている。この構造では、基板の形状に合わせてクランプ機構を設計する必要があり、多様な基板サイズに対応させるためには、露光テーブルに個別にクランプ機構を設計する必要があり、コストアップになる。また、基板のサイズが異なる場合、シートの交換が必要であるが、特許文献２のシートは機械的にクランプされているため、交換が容易ではない。
さらに、基板が真空に晒されるため、上記と同様の問題が生じることも考えられる。 Patent Document 2 discloses a technique in which a substrate fixing sheet (mylar sheet) is disposed in a state of covering a peripheral portion of a substrate to be vacuum-sucked, and the sheet is elastically deformed by a suction force when the substrate is vacuum-sucked. It is disclosed. In this structure, it is necessary to design the clamp mechanism in accordance with the shape of the substrate. In order to cope with various substrate sizes, it is necessary to design the clamp mechanism individually on the exposure table, which increases the cost. Moreover, when the board | substrate size differs, replacement | exchange of a sheet | seat is required, However, since the sheet | seat of patent document 2 is clamped mechanically, replacement | exchange is not easy.
Furthermore, since the substrate is exposed to vacuum, the same problem as described above may occur.

また、特許文献３では、弾性部材を有する額縁状の固定治具で基板の周辺部を押さえる技術が開示されている。この構造では、固定治具の押し付けのための吸引は、基板をテーブルに吸着する吸引と全く同じ系統である。そのため、基板をテーブルに吸着するための真空に大きなリークが生じた場合、固定治具が基板の周辺をテーブルに押し付ける力が弱まり、基板をテーブルに吸着できないことがある。特に、剛性の高い基板に変形が生じている場合には変形を矯正することが難しい。   Patent Document 3 discloses a technique for pressing the peripheral portion of the substrate with a frame-shaped fixing jig having an elastic member. In this structure, the suction for pressing the fixing jig is the same system as the suction for attracting the substrate to the table. Therefore, when a large leak occurs in the vacuum for adsorbing the substrate to the table, the force with which the fixing jig presses the periphery of the substrate against the table is weakened, and the substrate may not be adsorbed to the table. In particular, it is difficult to correct the deformation when the substrate having high rigidity is deformed.

本願の発明は、上記のような各課題を解決するために為されたものであり、プリント基板用露光装置において、基板をテーブルに真空吸着する力を利用したり、真空に基板の周辺部を晒したりすることなく、露光中に周辺部をテーブルに押し付けることが可能であり、また厚さの異なる基板に対しても容易に対応できるようにすることを目的としている。   The invention of the present application has been made to solve the above-described problems. In the exposure apparatus for a printed circuit board, a force for vacuum-adsorbing the substrate to the table is used, or the periphery of the substrate is evacuated. An object of the present invention is to allow the peripheral portion to be pressed against the table during exposure without being exposed, and to easily cope with substrates having different thicknesses.

上記課題を解決するため、本願の請求項１記載の発明は、
基板が載置されるテーブルと、
テーブルに載置された基板に所定のパターンを形成する露光光を照射する露光系とを備えたプリント基板用露光装置であって、
基板をテーブルに真空吸着する真空吸着機構と、
テーブルに載置された基板の周辺部をテーブルに押し付ける押し付け機構と
が設けられており、
押し付け機構は、基板に対する所定のパターンを形成する露光光を遮蔽しない形状の枠体と、間に基板の周辺部が挟み込まれた状態で枠体をテーブルに向けて押圧することで基板の周辺部をテーブルに押し付ける駆動部とを備えており、
枠体は、基板を外れた位置で閉空間を形成する構造を有しており、基板に対して所定のパターンを形成する露光光の照射を行うに際して駆動部は当該閉空間を真空引きすることで基板の周辺部をテーブルに押し付けるものであり、
露光系及び押し付け機構を制御する制御部が設けられており、
制御部は、所定のパターンを形成する露光光の照射を基板に行っている間も押し付け機構の駆動部を動作させる制御を行うものであるという構成を有する。
また、上記課題を解決するため、請求項２記載の発明は、前記請求項１の構成において、前記テーブルに向けて押圧される前記枠体の前記テーブルの側を向いた面には、弾性を有する周状封止部材が設けられており、周状封止部材は、前記基板を外れた位置で前記テーブルに当接して前記閉空間を形成する形状であるという構成を有する。
また、上記課題を解決するため、請求項３記載の発明は、前記請求項１の構成において、前記テーブルの前記押圧される枠体を臨む面には、弾性を有する周状封止部材が設けられており、周状封止部材は、前記基板を外れた位置で前記枠体に当接して前記閉空間を形成する形状であるという構成を有する。
また、上記課題を解決するため、請求項４記載の発明は、前記請求項２又は３の構成において、前記周状封止部材はチューブ状であるという構成を有する。
また、上記課題を解決するため、請求項５記載の発明は、前記請求項１乃至４いずれかの構成において、前記基板の前記テーブルへの搬入及び前記テーブルからの前記基板の搬出の際に前記枠体が位置する待機位置が設定されており、
前記枠体を、前記基板の周辺部を挟み込んだ状態でテーブルに押し付ける位置である動作位置と、待機位置との間で繰り返し移動させる枠体移動機構が設けられているという構成を有する。
また、上記課題を解決するため、請求項６記載の発明は、前記請求項５の構成において、前記枠体移動機構には、前記基板の搬送機構が兼用されているという構成を有する。
また、上記課題を解決するため、請求項７記載の発明は、前記請求項５又は６の構成において、前記枠体移動機構は、前記枠体を真空吸着して保持しながら移動させる機構であるという構成を有する。
また、上記課題を解決するため、請求項８記載の発明は、前記請求項６又は７の構成において、前記基板の搬送機構は、前記基板を吸着して保持する基板用吸着パッドを備えており、
前記枠体は、この基板用吸着パッドが挿通される切り欠きを有しているという構成を有する。 In order to solve the above problems, the invention according to claim 1 of the present application is
A table on which a substrate is placed;
An exposure apparatus for a printed circuit board comprising an exposure system for irradiating exposure light for forming a predetermined pattern on a substrate placed on a table,
A vacuum suction mechanism for vacuum suction of the substrate to the table;
There is a pressing mechanism that presses the periphery of the substrate placed on the table against the table,
The pressing mechanism is a frame body that does not block exposure light that forms a predetermined pattern on the substrate, and a peripheral portion of the substrate by pressing the frame body toward the table with the peripheral portion of the substrate sandwiched therebetween. And a drive unit that presses against the table,
The frame has a structure that forms a closed space at a position away from the substrate, and the drive unit evacuates the closed space when irradiating the substrate with exposure light that forms a predetermined pattern. Is to press the periphery of the board against the table,
A control unit for controlling the exposure system and the pressing mechanism is provided,
The control unit is configured to perform control to operate the driving unit of the pressing mechanism while the substrate is irradiated with exposure light that forms a predetermined pattern.
In order to solve the above problem, the invention according to claim 2 is characterized in that, in the configuration of claim 1, the surface of the frame body that is pressed toward the table is elastic on the surface facing the table. A circumferential sealing member is provided, and the circumferential sealing member has a configuration in which the closed space is formed by contacting the table at a position away from the substrate.
In order to solve the above-mentioned problem, the invention according to claim 3 is the configuration of claim 1, wherein a surface of the table facing the pressed frame body is provided with a circumferential sealing member having elasticity. The circumferential sealing member has a configuration in which the closed space is formed by contacting the frame body at a position away from the substrate.
In order to solve the above problem, the invention according to claim 4 has a configuration in which the circumferential sealing member is tube-shaped in the configuration of claim 2 or 3.
In order to solve the above-mentioned problem, the invention according to claim 5 is the configuration according to any one of claims 1 to 4, wherein the substrate is loaded into the table and unloaded from the table. The standby position where the frame is located is set,
A configuration is provided in which a frame body moving mechanism is provided that repeatedly moves the frame body between an operation position that is a position to press the frame body against the table with the peripheral portion of the substrate being sandwiched therebetween and a standby position.
In order to solve the above-mentioned problem, the invention according to claim 6 has a structure in which the substrate moving mechanism is also used as the frame body moving mechanism in the structure of claim 5.
In order to solve the above problem, the invention according to claim 7 is the mechanism according to claim 5 or 6, wherein the frame body moving mechanism is a mechanism for moving the frame body while holding the frame by vacuum suction. It has the structure of.
In order to solve the above-mentioned problem, according to an eighth aspect of the present invention, in the configuration of the sixth or seventh aspect, the substrate transport mechanism includes a substrate suction pad that sucks and holds the substrate. ,
The frame has a configuration in which a notch through which the substrate suction pad is inserted is provided.

以下に説明する通り、本願の請求項１記載の発明によれば、露光の際、基板はテーブルに真空吸着されるとともに基板の周辺部は枠体によってテーブルに押し付けられる。この際、枠体には、形成される閉空間の真空圧力によりテーブルに向かう力が加えられる。この真空圧力は、基板をテーブルに吸着するための系統とは別の系統により供給することができるので、基板とテーブルとの間でリークが発生しても、枠体に強い押圧力をかけることができる。これにより、剛性の高い基板に変形が生じている場合であっても、露光中に基板をテーブルに確実に保持することができる。また、閉空間は基板を外れた位置に形成されるため、ここでの真空圧力が基板に直接作用することはない。
また、請求項２又は３記載の発明によれば、上記効果に加え、弾性を有する周状封止部材で閉空間が形成されるので、押圧力が柔軟に作用する。
また、請求項４記載の発明によれば、上記効果に加え、周状封止部材がチューブ状であるので、押圧の際の圧力の調整が容易になり、また厚さの異なる基板に対しても容易に押圧できる。
また、請求項５記載の発明によれば、上記効果に加え、枠体移動機構が設けられているので、テーブルへの基板の載置やテーブルからの基板の取り去りの際に枠体を退避させることができ、テーブルを大がかりに移動させる必要がないので、この点で機構的に簡略化される。
また、請求項６記載の発明によれば、上記効果に加え、基板の搬送機構によって枠体移動機構が兼用されているので、この点で装置の構造や動作が簡略化される。
また、請求項７記載の発明によれば、上記効果に加え、搬送ハンドが枠体を吸着保持しながら移動させるものであるので、基板の露光の際には搬送ハンドが枠体を切り離して退避するのが容易になったり、枠体の交換が容易になったりする効果がある。
また、請求項８記載の発明によれば、上記効果に加え、枠体が、基板用吸着パッドが挿通される切り欠きを有しているので、構造を複雑化させずに十分な吸着力で基板の保持ができるという効果がある。 As described below, according to the first aspect of the present invention, during exposure, the substrate is vacuum-sucked to the table and the periphery of the substrate is pressed against the table by the frame. At this time, a force directed to the table is applied to the frame body by the vacuum pressure of the formed closed space. Since this vacuum pressure can be supplied by a system different from the system for adsorbing the substrate to the table, even if a leak occurs between the substrate and the table, a strong pressing force is applied to the frame. Can do. Thus, even when the rigid substrate is deformed, the substrate can be reliably held on the table during exposure. Further, since the closed space is formed at a position away from the substrate, the vacuum pressure here does not directly act on the substrate.
According to the invention of claim 2 or 3, in addition to the above effect, the closed space is formed by the elastic circumferential sealing member, so that the pressing force acts flexibly.
According to the invention described in claim 4, in addition to the above effect, since the circumferential sealing member is tube-shaped, it is easy to adjust the pressure at the time of pressing, and for substrates having different thicknesses. Can be easily pressed.
According to the fifth aspect of the invention, in addition to the above effects, the frame body moving mechanism is provided, so that the frame body is retracted when the substrate is placed on the table or the substrate is removed from the table. This is mechanically simplified in this respect since it is not necessary to move the table extensively.
According to the sixth aspect of the invention, in addition to the above effect, the frame moving mechanism is also used by the substrate transfer mechanism, so that the structure and operation of the apparatus are simplified in this respect.
According to the seventh aspect of the invention, in addition to the above effect, the transfer hand moves the frame while adsorbing and holding the frame. Therefore, the transfer hand separates and retracts the frame when the substrate is exposed. This has the effect of facilitating the replacement of the frame body.
According to the invention described in claim 8, in addition to the above effect, the frame body has a notch through which the suction pad for substrate is inserted, so that the suction force is sufficient without complicating the structure. There is an effect that the substrate can be held.

実施形態のプリント基板用露光装置の正面断面概略図である。It is a front section schematic diagram of the exposure apparatus for printed circuit boards of an embodiment. 図１の露光装置の主要部の平面概略図である。FIG. 2 is a schematic plan view of the main part of the exposure apparatus in FIG. 1. 枠体の斜視概略図である。It is a perspective schematic diagram of a frame. 実施形態のプリント基板用露光装置の動作について示した正面断面概略図である。It is the front sectional schematic diagram shown about operation of the exposure apparatus for printed circuit boards of an embodiment. 実施形態のプリント基板用露光装置の動作について示した正面断面概略図である。It is the front sectional schematic diagram shown about operation of the exposure apparatus for printed circuit boards of an embodiment. 実施形態のプリント基板用露光装置の動作について示した正面断面概略図である。It is the front sectional schematic diagram shown about operation of the exposure apparatus for printed circuit boards of an embodiment. 基板のサイズに合わせて用意される各枠体の一例について示した斜視概略図である。It is the isometric view schematic shown about an example of each frame prepared according to the size of a board | substrate.

次に、本願発明を実施するための形態（以下、実施形態）について説明する。
図１は、実施形態のプリント基板用露光装置の正面断面概略図、図２に示すプリント基板用露光装置の主要部の平面概略図である。実施形態のプリント基板用露光装置は、基板Ｓが載置されるテーブル１と、テーブル１に載置された基板Ｓに回路等のパターンを形成するための露光光を照射する露光系２とを備えている。図２は、基板Ｓが載置された状態のテーブル１の平面概略図となっている。
テーブル１は、図２に示すように平面視方形の台状の部材である。テーブル１の水平な上面が基板Ｓの載置面となっており、載置面には、吸着孔１１が均等間隔に多数設けられている。そして、各吸着孔１１を通して真空引きすることで基板Ｓをテーブル１に吸着する真空吸着機構３が設けられている。テーブル１には、排気管（以下、基板用排気管）３１が接続されており、基板用排気管３１は、テーブル１内に設けられた基板用排気路１２によって各吸着孔１１に連通している。基板用排気管３１上には、開閉バルブ３２や圧力調整バルブ３３が設けられている。 Next, modes for carrying out the present invention (hereinafter referred to as embodiments) will be described.
FIG. 1 is a schematic front sectional view of an exposure apparatus for a printed circuit board according to an embodiment, and a schematic plan view of a main part of the exposure apparatus for a printed circuit board shown in FIG. The printed circuit board exposure apparatus according to the embodiment includes a table 1 on which a substrate S is placed, and an exposure system 2 that irradiates exposure light for forming a pattern such as a circuit on the substrate S placed on the table 1. I have. FIG. 2 is a schematic plan view of the table 1 on which the substrate S is placed.
As shown in FIG. 2, the table 1 is a trapezoidal member having a square shape in plan view. The horizontal upper surface of the table 1 is a mounting surface for the substrate S, and a large number of suction holes 11 are provided at equal intervals on the mounting surface. A vacuum suction mechanism 3 that sucks the substrate S onto the table 1 by vacuuming through the suction holes 11 is provided. An exhaust pipe (hereinafter referred to as a substrate exhaust pipe) 31 is connected to the table 1, and the substrate exhaust pipe 31 communicates with each suction hole 11 by a substrate exhaust path 12 provided in the table 1. Yes. An open / close valve 32 and a pressure adjustment valve 33 are provided on the substrate exhaust pipe 31.

テーブル１の両側には、搬送コンベア４１，４２が設けられている。搬送コンベア４１，４２は、テーブル１に対する基板Ｓの搬入、搬出用であり、いずれの側を搬入用、搬出用としても良い。以下、説明の都合上、右側の搬送コンベア４１を第一搬送コンベアとし、左側の搬送コンベア４２を第二搬送コンベアとする。
各搬送コンベア４１，４２に協働して動作するものとして、テーブル１の両側には搬送ハンド５１，５２が設けられている。搬送ハンド５１，５２についても、いずれを搬入側、いずれを搬出側とすることができる。以下、説明の都合上、右側の搬送ハンド５１を第一搬送ハンドとし、左側の搬送ハンド５２を第二搬送ハンドとする。 Conveyors 41 and 42 are provided on both sides of the table 1. The conveyors 41 and 42 are for carrying in and carrying out the substrate S from the table 1, and either side may be used for carrying in or carrying out. Hereinafter, for convenience of explanation, the right conveyor 41 is the first conveyor, and the left conveyor 42 is the second conveyor.
Conveying hands 51 and 52 are provided on both sides of the table 1 so as to operate in cooperation with the conveying conveyors 41 and 42. Also about the conveyance hands 51 and 52, any can be made into a carrying-in side and any can be taken out. Hereinafter, for convenience of explanation, the right transport hand 51 is a first transport hand, and the left transport hand 52 is a second transport hand.

各搬送ハンド５１，５２は、フレーム５１１，５２１と、フレーム５１１，５２１に取り付けられた基板用吸着パッド５１２，５２２とを備えている。各フレーム５１１，５２１には、搬送駆動機構５１３，５２３が設けられている。搬送駆動機構５１３，５２３の詳細は図示を省略するが、フレーム５１１，５２１を搬送方向（図１の紙面上左右方向）に直線移動させて所定位置に位置させるとともに上下方向に移動させることができる機構となっている。装置は不図示の制御部を備えており、各搬送駆動機構５１３，５２３は、不図示の制御部によって制御される。
基板用吸着パッド５１２，５２２は、基板Ｓの周縁に沿って多数設けられている。各基板用吸着パッド５１２，５２２には、不図示の基板用吸引源が接続されている。基板用吸引源のオンオフも、同様に不図示の制御部によって制御される。 Each transport hand 51, 52 includes frames 511, 521 and substrate suction pads 512, 522 attached to the frames 511, 521. Each frame 511, 521 is provided with a transport drive mechanism 513, 523. Although details of the transport drive mechanisms 513 and 523 are not shown, the frames 511 and 521 can be linearly moved in the transport direction (left and right on the paper surface in FIG. 1) to be positioned at a predetermined position and moved in the vertical direction. It is a mechanism. The apparatus includes a control unit (not shown), and the transport drive mechanisms 513 and 523 are controlled by a control unit (not shown).
A large number of substrate suction pads 512 and 522 are provided along the periphery of the substrate S. A substrate suction source (not shown) is connected to each of the substrate suction pads 512 and 522. The on / off of the substrate suction source is similarly controlled by a control unit (not shown).

露光系２は、テーブル１の上方に配置されている。実施形態の露光装置は、特に露光の方式を選ばないものであり、投影露光、コンタクト又はプロキシミティ露光、さらにはＤＩ（ダイレクトイメージング）露光のいずれの方式を採用し得る。例えば投影露光の場合、露光系２は、光源と、光源からの光が照射されるマスクと、マスクの像をテーブル１上の投影する投影レンズ等から構成される。ＤＩ露光の場合には、レーザー光源と、レーザー光源からの光を空間変調してパターンを形成するＤＭＤ(Digital Mirror Device)のような空間変調素子とを備えた露光ユニットが複数設けられた構成が採用される。   The exposure system 2 is disposed above the table 1. The exposure apparatus of the embodiment does not particularly select an exposure method, and any of a projection exposure method, a contact or proximity exposure method, and a DI (direct imaging) exposure method can be adopted. For example, in the case of projection exposure, the exposure system 2 includes a light source, a mask irradiated with light from the light source, a projection lens that projects an image of the mask on the table 1, and the like. In the case of DI exposure, a configuration in which a plurality of exposure units each including a laser light source and a spatial modulation element such as a DMD (Digital Mirror Device) that spatially modulates light from the laser light source to form a pattern is provided. Adopted.

このような実施形態のプリント基板用露光装置は、真空吸着機構による基板Ｓの吸着を確実にするため、テーブル１に載置された基板Ｓの周辺部をテーブル１に押し付ける押し付け機構６を備えている。押し付け機構６は、枠体６１と、間に基板Ｓの周辺部が挟み込まれた状態で枠体６１をテーブル１に向けて押圧することで基板Ｓの周辺部をテーブル１に押し付ける駆動部とを備えている。また、枠体６１を、基板Ｓの周辺部を挟み込んだ状態でテーブル１に押し付ける位置である動作位置と、所定の待機位置との間で繰り返し移動させる枠体移動機構が設けられている。枠体移動機構には、この実施形態では、基板Ｓの搬入搬出用の第一搬送ハンド５１とその搬送駆動機構５１３が兼用されている。   The printed circuit board exposure apparatus of such an embodiment includes a pressing mechanism 6 that presses the peripheral portion of the substrate S placed on the table 1 against the table 1 in order to ensure the suction of the substrate S by the vacuum suction mechanism. Yes. The pressing mechanism 6 includes a frame 61 and a drive unit that presses the peripheral portion of the substrate S against the table 1 by pressing the frame 61 toward the table 1 with the peripheral portion of the substrate S sandwiched therebetween. I have. In addition, a frame body moving mechanism is provided that repeatedly moves the frame body 61 between an operation position, which is a position where the frame body 61 is pressed against the table 1 with the peripheral portion of the substrate S interposed therebetween, and a predetermined standby position. In this embodiment, the frame body moving mechanism also serves as the first transport hand 51 for loading and unloading the substrate S and the transport driving mechanism 513.

図３を参照して、枠体６１についてより具体的に説明する。図３は、枠体６１の斜視概略図である。図３に示すように、枠体６１は、方形の額縁状である。枠体６１の内縁のサイズは、基板Ｓの輪郭よりも少し小さい。内縁の向かい合う辺には、ほぼ半円状の切り欠き６１１が多数設けけられている。この切り欠き６１１は、基板用吸着パッド５１２との干渉を避けるための形状である。
図１に示すように、第一搬送ハンド５１には、複数の枠体用吸着パッド５１４が設けられている。各枠体用吸着パッド５１４は、枠体６１を外縁よりの位置で吸着する位置に設けられている。各枠体用吸着パッド５１４には、不図示の枠体用吸着源が接続されている。 The frame 61 will be described more specifically with reference to FIG. FIG. 3 is a schematic perspective view of the frame 61. As shown in FIG. 3, the frame 61 has a rectangular frame shape. The size of the inner edge of the frame 61 is slightly smaller than the outline of the substrate S. A number of substantially semicircular cutouts 611 are provided on opposite sides of the inner edge. The notch 611 has a shape for avoiding interference with the substrate suction pad 512.
As shown in FIG. 1, the first transfer hand 51 is provided with a plurality of frame suction pads 514. Each frame suction pad 514 is provided at a position for sucking the frame 61 at a position closer to the outer edge. Each frame suction pad 514 is connected to a frame suction source (not shown).

枠体６１は、テーブル１に載置された基板Ｓを外れた位置で閉空間を形成する構造を有している。具体的に説明すると、枠体６１の下面（テーブル１の側を向いた面）には、弾性を有する周状封止部材６２が設けられている。周状封止部材６２は、基板Ｓを外れた位置でテーブル１に当接する位置に設けられている。
周状封止部材６２は、本実施形態では、チューブ状のものとなっており、材質としてはシリコーンゴムのような樹脂製となっている。図２に示すように、周状封止部材６２は、ほぼ方形となっており、サイズの小さいもの大きいものとが同心上に設けられている。各周状封止部材６２の形状は、枠体６１の内縁の形状とほぼ相似形であり、基板Ｓの輪郭とほぼ相似形である。 The frame body 61 has a structure that forms a closed space at a position away from the substrate S placed on the table 1. More specifically, a circumferential sealing member 62 having elasticity is provided on the lower surface of the frame body 61 (the surface facing the table 1 side). The circumferential sealing member 62 is provided at a position where it comes into contact with the table 1 at a position away from the substrate S.
In this embodiment, the circumferential sealing member 62 has a tubular shape and is made of a resin such as silicone rubber. As shown in FIG. 2, the circumferential sealing member 62 has a substantially rectangular shape, and a small size and a large size are provided concentrically. The shape of each circumferential sealing member 62 is substantially similar to the shape of the inner edge of the frame body 61, and is substantially similar to the outline of the substrate S.

このような大小一対の周状封止部材６２は、互いの間の空間が閉空間となり、真空圧力とされるようになっている。即ち、枠体６１は、後述するようにテーブル１に対して基板Ｓを挟み込んだ状態で押圧される。図１に示すように、テーブル１のうち、枠体６１を臨む箇所には、枠体用排気孔１３が形成されている。枠体６１の駆動部は、この枠体用排気孔１３から真空吸引する手段となっている。枠体用排気孔１３は、基板用の吸着孔１１とは別系統の枠体用排気路１４で排気されるようになっており、一対の周状封止部材６２と、枠体６１と、テーブル１とで形成された閉空間が真空に排気される。閉空間とは、吸引用の開口を除いて閉じた空間という意味である。尚、枠体用排気路１４に接続された枠体用排気管６３は、最終的には基板用排気管３１と一緒になって不図示の真空ポンプに接続されているが、そこまでは別々の排気管となっており、枠体用排気管６３にも開閉バルブ６４及び圧力調整バルブ６５が設けられている。   In such a pair of large and small circumferential sealing members 62, the space between them is a closed space, and is set to a vacuum pressure. That is, the frame body 61 is pressed in a state where the substrate S is sandwiched with respect to the table 1 as will be described later. As shown in FIG. 1, a frame body exhaust hole 13 is formed in a portion of the table 1 facing the frame body 61. The drive part of the frame 61 serves as means for vacuum suction from the frame exhaust hole 13. The frame exhaust holes 13 are adapted to be exhausted by a frame exhaust path 14 of a different system from the substrate suction holes 11, and include a pair of circumferential sealing members 62, a frame 61, The closed space formed with the table 1 is evacuated to vacuum. The closed space means a closed space except for the suction opening. The frame exhaust pipe 63 connected to the frame exhaust path 14 is finally connected to the vacuum pump (not shown) together with the substrate exhaust pipe 31, but until that point, it is separated. The frame exhaust pipe 63 is also provided with an open / close valve 64 and a pressure adjusting valve 65.

また、テーブル１には、昇降機構１００が設けられている。昇降機構１００は、基板Ｓの受け渡しの際に駆動される他、露光系２に対する基板Ｓの距離の調節の目的でも使用される。昇降機構１００は、サーボモータを含む直動機構で構成されており、制御部によって制御される。   The table 1 is provided with a lifting mechanism 100. The elevating mechanism 100 is used for adjusting the distance of the substrate S relative to the exposure system 2 as well as being driven when the substrate S is transferred. The lifting mechanism 100 is composed of a linear motion mechanism including a servo motor, and is controlled by a control unit.

次に、このような実施形態のプリント基板用露光装置の動作について、図４〜図７を参照して説明する。図４〜図６は、実施形態のプリント基板用露光装置の動作について示した正面断面概略図である。
以下の説明では、一例として、第一搬送コンベア４１及び第一搬送ハンド５１が搬入用、第二搬送コンベア４２及び第二搬送ハンド５２が搬出用であるとする。また、一例として、枠体６１の移動には第一搬送ハンド５１が兼用されるものとする。
図４（１）に示すように、第一搬送ハンド５１は、枠体６１を保持した状態で第一搬送コンベア４１の上の所定の待機位置で待機している。また、第二搬送ハンド５２は、第二搬送コンベア４２の上の所定の待機位置で待機している。 Next, the operation of the exposure apparatus for printed circuit boards of such an embodiment will be described with reference to FIGS. 4 to 6 are schematic front sectional views showing the operation of the exposure apparatus for a printed circuit board according to the embodiment.
In the following description, as an example, it is assumed that the first transport conveyor 41 and the first transport hand 51 are for loading, and the second transport conveyor 42 and the second transport hand 52 are for unloading. As an example, the first transport hand 51 is also used for the movement of the frame body 61.
As shown in FIG. 4A, the first transport hand 51 stands by at a predetermined standby position on the first transport conveyor 41 while holding the frame body 61. The second transport hand 52 stands by at a predetermined standby position on the second transport conveyor 42.

まず、第一搬送ハンド５１が基板Ｓの搬入動作を行う。即ち、図４（２）に示すように、第一搬送ハンド５１が下降する。この際の下降距離は、各基板用吸着パッド５１２が基板Ｓに当接する位置である。下降が完了すると、第一搬送ハンド５１の基板用吸引源が動作し、第一搬送コンベア４１上の基板Ｓが第一搬送ハンド５１に吸着保持される。この状態で、図４（３）に示すように搬送駆動機構５１３が第一搬送ハンド５１を上昇させる。第一搬送ハンド５１は、基板Ｓ及び枠体６１を保持した状態で所定の上昇位置で停止する。
そして、図４（４）に示すように、搬送駆動機構５１３が第一搬送ハンド５１を水平移動させ、テーブル１の上方の所定位置に位置させる。そして、昇降機構１００が動作し、テーブル１が所定距離上昇する。この距離は、図５（１）に示すように、基板Ｓがテーブル１の上面（載置面）に当接し、枠体６１の各周状封止部材６２もテーブル１に当接する距離である。 First, the first transport hand 51 carries in the substrate S. That is, as shown in FIG. 4B, the first transport hand 51 is lowered. The descending distance at this time is a position where each of the substrate suction pads 512 comes into contact with the substrate S. When the lowering is completed, the substrate suction source of the first transport hand 51 operates, and the substrate S on the first transport conveyor 41 is sucked and held by the first transport hand 51. In this state, the transport driving mechanism 513 raises the first transport hand 51 as shown in FIG. The first transport hand 51 stops at a predetermined raised position while holding the substrate S and the frame body 61.
Then, as shown in FIG. 4 (4), the transport driving mechanism 513 moves the first transport hand 51 horizontally and positions it at a predetermined position above the table 1. And the raising / lowering mechanism 100 operate | moves and the table 1 raises a predetermined distance. As shown in FIG. 5 (1), this distance is a distance at which the substrate S contacts the upper surface (mounting surface) of the table 1 and each circumferential sealing member 62 of the frame body 61 also contacts the table 1. .

その後、制御部は、第一搬送ハンド５１における基板用吸着源５１２及び枠体用吸着源に制御信号を送り、各々動作を停止させる。その上で、制御部は、真空吸着機構３における基板用排気管３１上の開閉バルブ３２、枠体用排気管６３上の開閉バルブ６４に制御信号を送り、それぞれ開状態にする。この結果、基板用吸着孔１１からの真空引きによって基板Ｓが真空吸着される。また、一対の周状封止部材６２で形成される閉空間は、枠体用排気孔１３からの真空引きによって真空圧力となる。この結果、枠体６１が間に基板Ｓの周辺部を挟み込んだ状態でテーブル１に向けて押圧される。即ち、枠体６１は、内側の縁が下方に折れ曲がった断面形状となっており、この折れ曲がった部分の先端が基板Ｓの周辺部に当接し、当該周辺部をテーブル１に押し付ける状態となる。また、この際、弾性体である周状封止部材６２は、少し押し潰されたような状態となる。   Thereafter, the control unit sends a control signal to the substrate suction source 512 and the frame suction source in the first transport hand 51 to stop the operations. Then, the control unit sends control signals to the open / close valve 32 on the substrate exhaust pipe 31 and the open / close valve 64 on the frame exhaust pipe 63 in the vacuum suction mechanism 3 to make them open. As a result, the substrate S is vacuum-sucked by evacuation from the substrate suction hole 11. Further, the closed space formed by the pair of circumferential sealing members 62 becomes a vacuum pressure by evacuation from the frame exhaust hole 13. As a result, the frame body 61 is pressed toward the table 1 with the peripheral portion of the substrate S sandwiched therebetween. That is, the frame body 61 has a cross-sectional shape in which the inner edge is bent downward, and the tip of the bent portion comes into contact with the peripheral portion of the substrate S, and the peripheral portion is pressed against the table 1. At this time, the circumferential sealing member 62, which is an elastic body, is in a state of being slightly crushed.

制御部は、上記各吸着パッドによる吸着の解除、基板Ｓの真空吸着及び枠体６１の吸引と同時に、昇降機構１００に制御信号を送って所定距離下降させる。この結果、テーブル１は、図５（２）に示すように当初の高さに戻る。この高さは、設定された露光距離となる高さである。尚、搬送駆動機構５１３は、第一搬送ハンド５１を当初の待機位置まで戻す。この状態で、図５（３）に示すように、露光系２が動作し、テーブル１上の基板Ｓに対して所定のパターンの光が照射されて露光が行われる。
所定時間の露光が終了すると、図５（４）に示すように、制御部は、搬送駆動機構５１３に制御信号を送り、待機位置にあった第一搬送ハンド５１をテーブル１の上方の所定位置まで移動させた後、所定距離下降させ、第一搬送ハンド５１の枠体用吸着パッド５１４が枠体６１に当接した状態とする。 The controller sends a control signal to the lifting mechanism 100 and lowers it by a predetermined distance simultaneously with the release of the suction by each suction pad, the vacuum suction of the substrate S and the suction of the frame body 61. As a result, the table 1 returns to the original height as shown in FIG. This height is a height corresponding to a set exposure distance. The transport driving mechanism 513 returns the first transport hand 51 to the initial standby position. In this state, as shown in FIG. 5 (3), the exposure system 2 operates, and the substrate S on the table 1 is irradiated with light of a predetermined pattern to perform exposure.
When the exposure for a predetermined time is completed, as shown in FIG. 5 (4), the control unit sends a control signal to the transport drive mechanism 513 to place the first transport hand 51 in the standby position at a predetermined position above the table 1. After that, the frame suction pad 514 of the first transport hand 51 is brought into contact with the frame 61.

第一搬送ハンド５１がこの位置まで下降した後、制御部は、第一搬送ハンド５１の枠体用吸着源を動作させる。基板用吸着源が動作されず、基板Ｓは第一搬送ハンド５１には吸着されない。枠体用吸着源の動作と同時に、制御部は、枠体用排気管６３上の開閉バルブ６４を閉じ、不図示の大気開放弁を開く。この結果、一対の周状封止部材６２による閉空間内の圧力が大気圧に戻り、枠体６１による基板Ｓの周辺部への押し付けは解除される。尚、基板用排気管３１の開閉バルブ３２が開いたままであり、基板Ｓの真空吸着は解除されない。   After the first transport hand 51 is lowered to this position, the control unit operates the frame body suction source of the first transport hand 51. The substrate suction source is not operated, and the substrate S is not attracted to the first transport hand 51. Simultaneously with the operation of the frame body adsorption source, the control unit closes the open / close valve 64 on the frame body exhaust pipe 63 and opens an air release valve (not shown). As a result, the pressure in the closed space by the pair of circumferential sealing members 62 returns to the atmospheric pressure, and the pressing of the frame body 61 on the peripheral portion of the substrate S is released. The open / close valve 32 of the substrate exhaust pipe 31 remains open, and the vacuum suction of the substrate S is not released.

この状態で、制御部は、搬送駆動機構５１３に制御信号を送り、第一搬送ハンド５１を上昇させ、その後、水平移動させ、図６（１）に示すように当初の待機位置に戻す。第一搬送ハンド５１は、待機位置において、枠体６１を吸着保持した状態を保つ。
その後、制御部は、搬送駆動機構５２３に制御信号を送り、第二搬送ハンド５２をテーブル１の上方の所定位置まで移動させた後に所定距離下降させ、図６（２）に示すように、第二搬送ハンド５２の基板用吸着パッド５２２が基板Ｓに当接した状態とする。この状態で、制御部は、第二搬送ハンド５２の基板用吸着源を動作させて基板Ｓを吸着させる。そして、制御部は、基板用排気管３１の開閉バルブ３２を閉じて吸着孔１１を大気に解放し、テーブル１上での基板Ｓの真空吸着を解除する。これにより、基板Ｓの真空吸着は、テーブル１から第二搬送ハンド５２に切り替えられる。この際、基板用排気管３１を通して吸着孔１１に瞬間的に正圧を与えて真空圧力からの大気圧復帰を促進することもある。そして、搬送駆動機構５２３は、第二搬送ハンド５２を上昇させた後、水平移動させ、図６（３）に示すように、当初の待機位置に戻す。その後、搬送駆動機構５２３は、第二搬送ハンド５２を所定距離下降させ、図６（４）に示すように基板Ｓが第二搬送コンベア４２に載った状態とする。そして、制御部は、第二搬送ハンド５２の基板用吸着源の動作を停止させた後、第二搬送ハンド５２を上昇させて待機位置に戻す。 In this state, the control unit sends a control signal to the transport driving mechanism 513 to raise the first transport hand 51 and then horizontally move it back to the initial standby position as shown in FIG. The first transport hand 51 maintains the state in which the frame body 61 is sucked and held at the standby position.
After that, the control unit sends a control signal to the transport driving mechanism 523, moves the second transport hand 52 to a predetermined position above the table 1, and then lowers it by a predetermined distance. As shown in FIG. The substrate suction pad 522 of the second transport hand 52 is in contact with the substrate S. In this state, the control unit operates the substrate suction source of the second transport hand 52 to suck the substrate S. Then, the control unit closes the opening / closing valve 32 of the substrate exhaust pipe 31 to release the suction hole 11 to the atmosphere, and releases the vacuum suction of the substrate S on the table 1. Thereby, the vacuum suction of the substrate S is switched from the table 1 to the second transport hand 52. At this time, a positive pressure may be instantaneously applied to the suction hole 11 through the substrate exhaust pipe 31 to promote the return to the atmospheric pressure from the vacuum pressure. Then, the transport driving mechanism 523 raises the second transport hand 52, horizontally moves it, and returns it to the initial standby position as shown in FIG. 6 (3). Thereafter, the transport driving mechanism 523 lowers the second transport hand 52 by a predetermined distance so that the substrate S is placed on the second transport conveyor 42 as shown in FIG. Then, the control unit stops the operation of the substrate suction source of the second transport hand 52 and then raises the second transport hand 52 and returns it to the standby position.

これにより、一枚の基板Ｓに対する一連の処理が終了した状態となる。第二搬送コンベア４２は、処理済みの基板Ｓを次の工程に搬送する動作を行うとともに、第一搬送コンベア４１には、次の基板Ｓが搬入されてくる。そして、次の基板Ｓに対して同様の動作が繰り返される。尚、上記説明から解るように、枠体６１は、第一搬送ハンド５１の待機位置と、テーブル１上で基板Ｓの周辺部をテーブル１に押し付ける位置との間で往復移動を行いながら、繰り返し基板Ｓの露光処理に利用される。   Thereby, a series of processes for one substrate S is completed. The second transport conveyor 42 performs an operation of transporting the processed substrate S to the next step, and the next substrate S is carried into the first transport conveyor 41. Then, the same operation is repeated for the next substrate S. As can be understood from the above description, the frame 61 repeats while reciprocating between the standby position of the first transport hand 51 and the position where the peripheral portion of the substrate S is pressed against the table 1 on the table 1. This is used for the exposure processing of the substrate S.

上記説明から解るように、実施形態のプリント基板用露光装置によれば、露光の際、基板Ｓはテーブル１に真空吸着されるとともに、基板Ｓの周辺部は枠体６１によってテーブル１に押し付けられる。この際、枠体６１は、一対の周状封止部材６２によって形成される閉空間の真空圧力によりテーブル１に向かう力が加えられる。このため、押圧力の調整が容易である。即ち、枠体用排気管６３に設けられた圧力調整バルブ６５により適宜の圧力とすることが容易である。場合によっては、制御部により圧力を自動制御することもできる。   As can be seen from the above description, according to the printed circuit board exposure apparatus of the embodiment, during exposure, the substrate S is vacuum-sucked to the table 1 and the peripheral portion of the substrate S is pressed against the table 1 by the frame 61. . At this time, a force directed toward the table 1 is applied to the frame body 61 by the vacuum pressure in the closed space formed by the pair of circumferential sealing members 62. For this reason, it is easy to adjust the pressing force. That is, it is easy to set an appropriate pressure by the pressure adjusting valve 65 provided in the frame exhaust pipe 63. In some cases, the pressure can be automatically controlled by the control unit.

また、図１等に示すように、枠体６１のテーブル１に向けての押圧のための真空圧力の空間は、基板Ｓが位置する空間から隔絶された空間であり、ここでの真空圧力に基板Ｓが直接晒されることはない。したがって、基板Ｓの保護フィルムの剥離や気泡発生といった問題は、この実施形態では生じない。
また、弾性を有する周状封止部材６２で閉空間が形成されるので、基板Ｓに対する押圧力の作用の仕方が柔軟になる。弾性部材ではないもので閉空間を形成して真空排気する構造であっても、枠体６１を押し付ける程度の圧力を生じさせることはできるが、実施形態の構造では、押圧力をソフトに加えることができる。 Further, as shown in FIG. 1 and the like, the space of the vacuum pressure for pressing the frame body 61 toward the table 1 is a space isolated from the space where the substrate S is located. The substrate S is not directly exposed. Therefore, problems such as peeling of the protective film of the substrate S and generation of bubbles do not occur in this embodiment.
Further, since the closed space is formed by the circumferential sealing member 62 having elasticity, the manner in which the pressing force acts on the substrate S becomes flexible. Even if it is a structure that is not an elastic member and forms a closed space and is evacuated, pressure can be generated to the extent that the frame 61 is pressed, but in the structure of the embodiment, the pressing force is softly applied. Can do.

また、この実施形態では、一対の周状封止部材６２はチューブ状となっている。この点は、押圧の際の圧力の調整を容易にする意義があり、また厚さの異なる基板Ｓに対しても容易に押圧できるようにする意義がある。周状封止部材６２としては、線状又は紐状の弾性体でチューブ状でないもの（中身が詰まったもの）であっても良い。例えば、ゴム紐状のものやスポンジ状のものを使用することもできる。しかし、上記のように、周状封止部材６２は、真空排気によって圧縮されながら封止状態を保つとともに、真空圧力による枠体６１の基板Ｓへの押し付け圧力に抗して弾性を作用させて押し付け圧力を調節する機能を有する。基板Ｓの厚さが厚くなると、周状封止部材６２の断面積の大きな（断面の高さの高い）ものを用いることになるが、逆に薄い基板Ｓについて押圧を行おうとすると、枠体６１が基板Ｓの周辺部に当接するためにはかなりの圧縮をしなければならなくなり、枠体６１が基板Ｓの周辺部に当接できなかったり、当接できても弾性による反発力が過剰になってしまったりする問題が生じる。このため、基板Ｓの厚さに応じて周状封止部材６２を付け替える必要が生じる。一方、チューブ状のものであれば、厚い基板Ｓに応じた口径としておいても、厚い基板Ｓから薄い基板Ｓまで比較的均一な反発力を作用させながら圧縮される。このため、厚さの異なる基板Ｓに対しても交換の必要なく使用することができる。
尚、周状封止部材６２は、一対のものでない場合もあり得る。例えば、断面が凹状のものとなっていて周状に連なっている形状のもの１個を使用しても同様のことが行える。 Moreover, in this embodiment, a pair of circumferential sealing member 62 is tube shape. This point has the significance of facilitating the adjustment of the pressure during pressing, and also has the significance of allowing easy pressing against the substrates S having different thicknesses. The circumferential sealing member 62 may be a linear or string-like elastic body that is not tube-shaped (stuffed inside). For example, a rubber string or sponge can be used. However, as described above, the circumferential sealing member 62 maintains a sealed state while being compressed by vacuum evacuation, and exerts elasticity against the pressing force of the frame body 61 against the substrate S due to the vacuum pressure. It has a function to adjust the pressing pressure. When the thickness of the substrate S is increased, the circumferential sealing member 62 having a large cross-sectional area (high cross-sectional height) is used. Conversely, when the thin substrate S is pressed, the frame body is used. In order for 61 to come into contact with the peripheral portion of the substrate S, considerable compression has to be performed. The problem of becoming will arise. For this reason, it is necessary to replace the circumferential sealing member 62 according to the thickness of the substrate S. On the other hand, if it is a tube-shaped thing, even if it sets it as the aperture | diameter according to the thick board | substrate S, it compresses, applying the comparatively uniform repulsive force from the thick board | substrate S to the thin board | substrate S. FIG. For this reason, it is possible to use the substrates S having different thicknesses without replacement.
In addition, the circumferential sealing member 62 may not be a pair. For example, the same can be achieved by using one piece having a concave cross-section and a circumferential shape.

また、枠体移動機構が設けられているので、テーブル１への基板Ｓの載置やテーブル１からの基板Ｓの取り去りの際に枠体６１を退避させることができる。枠体６１の位置が固定の場合には、テーブル１をいったん下方に移動させてから横方向に移動させるといった大がかりなテーブル１の移動機構が必要になるが、実施形態の構成ではこのようなことは必要ないので、機構的に簡略化されている。   Further, since the frame body moving mechanism is provided, the frame body 61 can be retracted when the substrate S is placed on the table 1 or when the substrate S is removed from the table 1. When the position of the frame 61 is fixed, a large table 1 moving mechanism is required in which the table 1 is moved downward and then moved in the horizontal direction. Is not necessary, so it is mechanically simplified.

尚、上記説明から解るように、基板Ｓを吸着保持して搬送動作を行うハンドが同時に枠体６１を吸着保持する機能も備えており、基板Ｓの搬送機構によって枠体移動機構が兼用されている。この点も、装置の構造や動作を簡略化する意義がある。本願発明の実施に際しては、基板Ｓを吸着保持するハンドとは別のハンドで枠体６１を吸着保持して当該別のハンドを移動機構で移動させても良い。但し、このようにすると構造や動作が複雑になり、装置コストが上昇したり動作時間が長くかかったりする問題がある。基板用のハンドを兼用して枠体６１の吸着保持を行う構成であると、このような問題はない。   As will be understood from the above description, the hand that holds and holds the substrate S and performs the transfer operation also has a function of holding the frame 61 at the same time, and the frame body moving mechanism is also used by the transfer mechanism of the substrate S. Yes. This point also has the significance of simplifying the structure and operation of the apparatus. In carrying out the present invention, the frame body 61 may be sucked and held by a hand different from the hand holding the substrate S by suction, and the other hand may be moved by a moving mechanism. However, if this is done, the structure and operation become complicated, and there is a problem that the apparatus cost increases and the operation time is long. Such a problem does not occur when the frame 61 is sucked and held also by using the substrate hand.

また、搬送ハンドが枠体６１を吸着保持しながら移動させるものである点は、基板Ｓの露光の際には搬送ハンドが枠体６１を切り離して退避するのを容易にする意義がある。本願発明の実施に際しては、枠体６１が搬送ハンドに対して着脱されるものではなく、固定のものであっても良い。但しこの場合は、そのような搬送ハンドやその移動機構が基板Ｓの露光中のテーブル１の付近に位置することになるので、露光を遮蔽しないようにする必要があり、構造的に複雑になる。一方、搬送ハンドが枠体６１を吸着保持する構造では、搬送ハンドは吸着を解除して任意の位置に退避できるので、構造的に簡略になる。   In addition, the fact that the transport hand moves the frame body 61 while sucking and holding it has the significance of facilitating the transport hand to separate and retract the frame body 61 when the substrate S is exposed. In carrying out the present invention, the frame body 61 may not be attached to and detached from the transport hand but may be fixed. However, in this case, since such a transport hand and its moving mechanism are located in the vicinity of the table 1 during the exposure of the substrate S, it is necessary to prevent the exposure from being shielded, which is structurally complicated. . On the other hand, in the structure in which the transport hand sucks and holds the frame body 61, the transport hand can release the suction and retreat to an arbitrary position, so that the structure is simplified.

上述した実施形態のプリント基板用露光装置において、枠体６１は、処理する基板Ｓのサイズに合わせて適宜交換される。以下、この点について図７を参照して説明する。図７は、基板Ｓのサイズに合わせて用意される各枠体６１の一例について示した斜視概略図である。
図７に示すように、この実施形態では、基板Ｓの各サイズに合わせて異なる枠体６１が用意されるが、各枠体６１は、外側の輪郭は同じ寸法形状である。そして、開口の寸法形状が異なるものとなっている。即ち、開口は、処理する基板Ｓより少し小さい寸法形状となっている。そして、各枠体６１において、開口の向かい合う縁には、同様に切り欠き６１１が多数設けられている。切り欠き６１１は、基板用吸着パッド５１２，５２２との干渉を避けるための切り欠き６１１である。 In the printed circuit board exposure apparatus of the above-described embodiment, the frame body 61 is appropriately replaced according to the size of the substrate S to be processed. Hereinafter, this point will be described with reference to FIG. FIG. 7 is a schematic perspective view showing an example of each frame body 61 prepared in accordance with the size of the substrate S. FIG.
As shown in FIG. 7, in this embodiment, different frame bodies 61 are prepared in accordance with the sizes of the substrates S, but the outer contours of the frame bodies 61 have the same dimensional shape. And the dimension shape of an opening differs. That is, the opening has a slightly smaller dimension than the substrate S to be processed. And in each frame 61, many notches 611 are similarly provided in the edge which opening faces. The notch 611 is a notch 611 for avoiding interference with the substrate suction pads 512 and 522.

サイズの異なる基板Ｓを処理する場合、それまで使用していた枠体６１を保持している第一搬送ハンド５１を所定距離下降させ、枠体６１を第一搬送コンベア４１の上に置いてから、枠体用吸着源をオフにする。そして、第一搬送コンベア４１を上方に退避させてから枠体６１を取り除き、サイズの異なる基板用の枠体６１を第一搬送コンベア４１の上に載置する。そして、第一搬送ハンド５１を下降させ、枠体用吸着パッド５１４を枠体６１に当接させてから枠体用吸着源を動作させて吸着させる。その上で、第一搬送ハンド５１を上昇させ、待機位置で待機させる。   When processing substrates S of different sizes, the first transport hand 51 holding the frame body 61 used so far is lowered by a predetermined distance, and the frame body 61 is placed on the first transport conveyor 41. Turn off the suction source for the frame. Then, the first transport conveyor 41 is retracted upward, the frame body 61 is removed, and the substrate frame body 61 having a different size is placed on the first transport conveyor 41. Then, the first transport hand 51 is lowered and the frame body suction pad 514 is brought into contact with the frame body 61, and then the frame body suction source is operated for suction. Then, the first transport hand 51 is raised and waited at the standby position.

尚、上記枠体６１の交換の際、枠体６１の吸着保持位置の位置合わせが適宜行われる。例えば、各枠体用吸着パッド５１４の吸着位置を示すマークを枠体６１の上面に設けておき、このマークを目印にして位置合わせをする方法が考えられる。
また、上記のように異なるサイズの基板Ｓを処理する場合、各基板用吸着パッド５１２，５２２は異なる位置で基板Ｓを吸着保持することになるから、各基板用吸着パッド５１２，５２２は交換ないし位置変更させられる。例えば、各基板用吸着パッド５１２，５２２はホルダーに取り付けられており、ホルダーごと交換する構造が考えられる。ホルダーとホルダーに固定された各基板用吸着パッド５１２，５２２がユニットになっており、このユニットを各搬送ハンドに対して交換する構造が採用され得る。 When the frame body 61 is replaced, the suction holding position of the frame body 61 is appropriately adjusted. For example, a method may be considered in which a mark indicating the suction position of each frame suction pad 514 is provided on the upper surface of the frame body 61, and alignment is performed using this mark as a mark.
Further, when processing substrates S of different sizes as described above, the suction pads 512 and 522 for the substrates suction and hold the substrate S at different positions, so that the suction pads 512 and 522 for the substrates are not exchanged. The position is changed. For example, each of the substrate suction pads 512 and 522 is attached to a holder, and a structure in which the holder is replaced is conceivable. A holder and each of the substrate suction pads 512 and 522 fixed to the holder form a unit, and a structure in which this unit is exchanged for each transport hand can be adopted.

尚、枠体６１の移動に基板用の搬送ハンドが兼用されている点は、前述したように構造を簡略化する意義があるが、この際、図３や図７に示す切り欠き６１１も、構造を複雑化させずに十分な吸着力で基板Ｓの保持ができるようにした意義がある。即ち、枠体６１は基板Ｓの周辺部を押さえ付けるものであるから、開口の縁は基板Ｓの周辺部よりも内側の位置となる。この際、基板用吸着パッド５１２，５２２を枠体６１の移動に兼用する構成では、搬送ハンドが枠体６１を吸着保持している状態で基板用吸着パッド５１２，５２２が基板Ｓを吸着保持する動作がどうしても生じ、基板用吸着パッド５１２，５２２は、枠体６１の開口を通して延びて基板Ｓを吸着する構造とならざるを得ない。この場合、基板Ｓの回路形成部分において吸着保持を行うことはできず、周辺のマージン部分を吸着保持するから、切り欠き６１１がないと、非常に小さな吸着パッドを多数設けて基板Ｓを吸着保持する構造にならざるを得ない。しかしながら、この構造は非実用的であり、吸着力も十分に確保できない。切り欠き６１１があると、ある程度の大きさの吸着パッドを使用して基板Ｓの吸着ができる一方、枠体６１による基板Ｓの押し付け作用のある部分をある程度の面積で確保することができる。 In addition, the point that the conveyance hand for the substrate is also used for the movement of the frame 61 has the significance of simplifying the structure as described above, but in this case, the notch 611 shown in FIG. 3 and FIG. There is a significance that the substrate S can be held with a sufficient adsorption force without complicating the structure. That is, since the frame body 61 presses the peripheral portion of the substrate S, the edge of the opening is positioned inside the peripheral portion of the substrate S. At this time, in the configuration in which the substrate suction pads 512 and 522 are also used for the movement of the frame body 61, the substrate suction pads 512 and 522 suction and hold the substrate S in a state where the transport hand holds the frame body 61 by suction. The operation is inevitably caused, and the substrate suction pads 512 and 522 have a structure that extends through the opening of the frame body 61 and sucks the substrate S. In this case, suction holding cannot be performed in the circuit formation portion of the substrate S, and the peripheral margin portion is sucked and held. Therefore, if there is no notch 611, a large number of very small suction pads are provided and the substrate S is sucked and held. It must be a structure to do. However, this structure is impractical and sufficient adsorption power cannot be ensured. When the notch 611 is provided, the substrate S can be sucked using a suction pad of a certain size, while a portion where the frame S 61 has a pressing action of the substrate S can be secured in a certain area.

尚、上記実施形態では、基板用吸着パッド５１２，５２２は、基板Ｓの周縁のうち、向かい合う一対の辺の周縁において基板Ｓを吸着する位置に設けられたが、四つの辺の周縁において基板Ｓを吸着する位置に設けられる場合もある。この方が、基板Ｓの吸着保持を確実にする点では好ましい。一対の辺の周縁で基板Ｓを吸着保持する場合、各基板用吸着パッド５１２，５２２を保持したフレーム５１１，５２１は板状になるが、四つの辺の周縁で基板Ｓを保持する場合、フレーム５１１，５２１は方形の枠状となる。   In the above embodiment, the substrate suction pads 512 and 522 are provided at positions where the substrate S is sucked at the peripheral edge of the pair of sides facing each other among the peripheral edges of the substrate S. In some cases, it is provided at a position for adsorbing water. This is preferable in terms of ensuring the suction holding of the substrate S. When the substrate S is sucked and held at the periphery of a pair of sides, the frames 511 and 521 holding the suction pads 512 and 522 for the respective substrates are plate-like, but when the substrate S is held at the periphery of the four sides, the frame 511 and 521 have a rectangular frame shape.

上記実施形態において、第一搬送ハンド５１、第一搬送コンベア４１が搬入用、第二搬送ハンド５２、第二搬送コンベア４２が搬出用であったが、この関係は逆であっても良く、それぞれを搬入搬出の双方に使用することもできる。即ち、第一搬送ハンド５１が基板Ｓの搬入動作を行って露光をしている最中に第二搬送ハンド５２が別の基板Ｓを保持して待機しており、最初の基板Ｓの露光終了後に第一搬送ハンド５１が基板Ｓを搬出した後、第二搬送ハンド５２が別の基板Ｓを搬入するようにする。このようにして交互に各搬送ハンドが基板Ｓの搬入搬出を行うようにしても良い。この場合、枠体６１は、それぞれの搬送ハンドについて設けられ、各搬送ハンドは枠体６１を吸着保持しながら基板Ｓの搬入搬出動作を行う。   In the said embodiment, although the 1st conveyance hand 51 and the 1st conveyance conveyor 41 were for carrying in, the 2nd conveyance hand 52 and the 2nd conveyance conveyor 42 were for carrying out, this relationship may be reverse, Can be used for both loading and unloading. That is, while the first transport hand 51 performs the exposure operation by carrying in the substrate S, the second transport hand 52 holds and waits for another substrate S, and the exposure of the first substrate S is completed. After the first transport hand 51 carries out the substrate S later, the second transport hand 52 carries in another substrate S. In this way, each transfer hand may alternately carry in and out the substrate S. In this case, the frame body 61 is provided for each transport hand, and each transport hand performs the loading / unloading operation of the substrate S while adsorbing and holding the frame body 61.

また、本願発明の実施に際しては、搬送ハンドは一個のみでも足りる。枠体６１を吸着保持した一つの搬送ハンドが第一搬送コンベア４１から基板Ｓをピックアップしてテーブル１に載置し、露光終了後に枠体６１とともに基板Ｓをテーブル１からピックアップして第二搬送コンベア４２に搬出する構成もあり得る。この場合では、片側にのみコンベアがある構成も採用し得る。
尚、テーブル１は昇降機構１００を備えていて基板Ｓの載置の際にテーブル１が昇降する構成であったが、ハンドの昇降によってこれを行っても良く、テーブル１は昇降機構１００を備えていなくても良い。また、テーブル１が昇降機構１００を備えている他、各コンベアが昇降機構を備えていれば、搬送駆動機構５１３，５２３は各搬送ハンド５１，５２を昇降させる機能を有する必要はない。 In carrying out the present invention, only one transport hand is sufficient. One transport hand holding the frame body 61 picks up the substrate S from the first transport conveyor 41 and places it on the table 1, and after the exposure, picks up the substrate S together with the frame body 61 from the table 1 to carry the second transport. There may be a configuration of carrying out to the conveyor 42. In this case, a configuration in which the conveyor is provided only on one side may be employed.
Although the table 1 includes the lifting mechanism 100 and the table 1 moves up and down when the substrate S is placed, this may be performed by lifting and lowering the hand. The table 1 includes the lifting mechanism 100. It does not have to be. Further, in addition to the table 1 having the lifting mechanism 100, if each conveyor has a lifting mechanism, the transport driving mechanisms 513 and 523 need not have a function of lifting the transport hands 51 and 52.

上記実施形態では、周状封止部材６２は枠体６１に取り付けられていたが、テーブル１の側に取り付けられていても良い。即ち、テーブル１の上面のうち、押圧のために向かってくる枠体６１を臨む箇所に周状封止部材を設けても同様に閉空間が形成でき、同様に動作させることができる。
また、真空吸着機構３の基板用排気管３１は、枠体用排気管６３と最終的には一緒になっていたが、完全に別系統の（独立した）排気路であって別々のポンプで排気される構造であっても良い。尚、枠体６１によって形成される閉空間内を排気する枠体用排気孔１３は、上記実施形態ではテーブル１に形成されていたが、枠体６１に形成されていても良い。但し、この構造では、枠体６１が排気用のフレキシブルチューブを引き回すことになるので、煩雑であり構造的に複雑になる。テーブル１に枠体用排気孔１３がある場合、そのような問題はない。
枠体６１は、一部が基板Ｓの周辺部に当接して基板Ｓをテーブル１に押し付ける必要があるが、閉空間を形成する部分はテーブル１を臨む部分でなくとも良い。即ち、テーブル１の周辺に枠状の別の部材があり、周状封止部材６２はこの別の部材に当接して閉空間を形成していても良い。 In the above embodiment, the circumferential sealing member 62 is attached to the frame body 61, but may be attached to the table 1 side. That is, even if a circumferential sealing member is provided at a position on the upper surface of the table 1 facing the frame body 61 that is directed toward pressing, a closed space can be similarly formed and operated in the same manner.
Further, the exhaust pipe 31 for the substrate of the vacuum suction mechanism 3 is finally combined with the exhaust pipe 63 for the frame body, but it is a completely separate (independent) exhaust path and is provided by a separate pump. A structure for exhausting air may be used. The frame exhaust holes 13 for exhausting the closed space formed by the frame body 61 are formed in the table 1 in the above embodiment, but may be formed in the frame body 61. However, in this structure, since the frame body 61 draws the flexible tube for exhaust, it is complicated and structurally complicated. When the table 1 has the frame exhaust holes 13, there is no such problem.
A part of the frame 61 needs to be in contact with the peripheral portion of the substrate S and press the substrate S against the table 1, but the portion forming the closed space may not be the portion facing the table 1. That is, there may be another frame-shaped member around the table 1, and the circumferential sealing member 62 may be in contact with this other member to form a closed space.

１ テーブル
１００ 昇降機構
１１ 吸着孔
１２ 基板用排気路
１３ 枠体用排気孔
１４ 枠体用排気路
２ 露光系
３ 真空吸着機構
４１ 第一搬送コンベア
４２ 第二搬送コンベア
５１ 第一搬送ハンド
５１２ 基板用吸着パッド
５１４ 枠体用吸着パッド
５２ 第二搬送ハンド
５２２ 基板用吸着パッド
６ 押し付け機構
６１ 枠体
６１１ 切り欠き
６２ 周状封止部材
６３ 枠体用排気管
６５ 圧力調整バルブ DESCRIPTION OF SYMBOLS 1 Table 100 Lifting mechanism 11 Suction hole 12 Substrate exhaust path 13 Frame exhaust hole 14 Frame exhaust path 2 Exposure system 3 Vacuum suction mechanism 41 First transport conveyor 42 Second transport conveyor 51 First transport hand 512 For substrate Suction pad 514 Frame suction pad 52 Second transport hand 522 Substrate suction pad 6 Pressing mechanism 61 Frame 611 Notch 62 Circumferential sealing member 63 Frame exhaust pipe 65 Pressure adjusting valve

Claims (8)

基板が載置されるテーブルと、
テーブルに載置された基板に所定のパターンを形成する露光光を照射する露光系とを備えたプリント基板用露光装置であって、
基板をテーブルに真空吸着する真空吸着機構と、
テーブルに載置された基板の周辺部をテーブルに押し付ける押し付け機構と
が設けられており、
押し付け機構は、基板に対する所定のパターンを形成する露光光を遮蔽しない形状の枠体と、間に基板の周辺部が挟み込まれた状態で枠体をテーブルに向けて押圧することで基板の周辺部をテーブルに押し付ける駆動部とを備えており、
枠体は、基板を外れた位置で閉空間を形成する構造を有しており、基板に対して所定のパターンを形成する露光光の照射を行うに際して駆動部は当該閉空間を真空引きすることで基板の周辺部をテーブルに押し付けるものであり、
露光系及び押し付け機構を制御する制御部が設けられており、
制御部は、所定のパターンを形成する露光光の照射を基板に行っている間も押し付け機構の駆動部を動作させる制御を行うものであることを特徴とするプリント基板用露光装置。 A table on which a substrate is placed;
An exposure apparatus for a printed circuit board comprising an exposure system for irradiating exposure light for forming a predetermined pattern on a substrate placed on a table,
A vacuum suction mechanism for vacuum suction of the substrate to the table;
There is a pressing mechanism that presses the periphery of the substrate placed on the table against the table,
The pressing mechanism is a frame body that does not block exposure light that forms a predetermined pattern on the substrate, and a peripheral portion of the substrate by pressing the frame body toward the table with the peripheral portion of the substrate sandwiched therebetween. And a drive unit that presses against the table,
The frame has a structure that forms a closed space at a position away from the substrate, and the drive unit evacuates the closed space when irradiating the substrate with exposure light that forms a predetermined pattern. Is to press the periphery of the board against the table,
A control unit for controlling the exposure system and the pressing mechanism is provided,
The printed circuit board exposure apparatus, wherein the control unit performs control to operate the driving unit of the pressing mechanism while the substrate is irradiated with exposure light for forming a predetermined pattern. 前記テーブルに向けて押圧される前記枠体の前記テーブルの側を向いた面には、弾性を有する周状封止部材が設けられており、周状封止部材は、前記基板を外れた位置で前記テーブルに当接して前記閉空間を形成する形状であることを特徴とする請求項１記載のプリント基板用露光装置。   A circumferential sealing member having elasticity is provided on the surface of the frame body that is pressed toward the table and faces the table, and the circumferential sealing member is located at a position off the substrate. 2. The exposure apparatus for a printed circuit board according to claim 1, wherein the closed space is formed in contact with the table. 前記テーブルの前記押圧される枠体を臨む面には、弾性を有する周状封止部材が設けられており、周状封止部材は、前記基板を外れた位置で前記枠体に当接して前記閉空間を形成する形状であることを特徴とする請求項１記載のプリント基板用露光装置。   An elastic circumferential sealing member is provided on the surface of the table that faces the pressed frame, and the circumferential sealing member abuts the frame at a position away from the substrate. 2. The exposure apparatus for a printed circuit board according to claim 1, wherein the exposure apparatus has a shape forming the closed space. 前記周状封止部材はチューブ状であることを特徴とする請求項２又は３記載のプリント基板用露光装置。   4. The printed circuit board exposure apparatus according to claim 2, wherein the circumferential sealing member has a tube shape. 前記基板の前記テーブルへの搬入及び前記テーブルからの前記基板の搬出の際に前記枠体が位置する待機位置が設定されており、
前記枠体を、前記基板の周辺部を挟み込んだ状態でテーブルに押し付ける位置である動作位置と、待機位置との間で繰り返し移動させる枠体移動機構が設けられていることを特徴とする請求項１乃至４記載のプリント基板用露光装置。 A standby position is set where the frame is positioned when the substrate is carried into and out of the table.
The frame body moving mechanism is provided, which repeatedly moves the frame body between an operation position that is a position to press against the table with a peripheral portion of the substrate being sandwiched, and a standby position. The exposure apparatus for printed circuit boards of 1-4. 前記枠体移動機構には、前記基板の搬送機構が兼用されていることを特徴とする請求項５記載のプリント基板用露光装置。   6. The printed circuit board exposure apparatus according to claim 5, wherein the frame body moving mechanism is also used as a transport mechanism for the substrate. 前記枠体移動機構は、前記枠体を真空吸着して保持しながら移動させる機構であることを特徴する請求項５又は６記載のプリント基板用露光装置。   7. The printed circuit board exposure apparatus according to claim 5, wherein the frame body moving mechanism is a mechanism that moves the frame body while holding the frame by vacuum suction. 前記基板の搬送機構は、前記基板を吸着して保持する基板用吸着パッドを備えており、
前記枠体は、この基板用吸着パッドが挿通される切り欠きを有していることを特徴とする請求項６又は７記載のプリント基板用露光装置。 The substrate transport mechanism includes a substrate suction pad that sucks and holds the substrate,
8. The printed circuit board exposure apparatus according to claim 6, wherein the frame has a notch through which the suction pad for the substrate is inserted.
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TWI694540B (en) 2020-05-21
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