TW201250392A - Work stage and exposure device using the same - Google Patents

Work stage and exposure device using the same Download PDF

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Publication number
TW201250392A
TW201250392A TW100139365A TW100139365A TW201250392A TW 201250392 A TW201250392 A TW 201250392A TW 100139365 A TW100139365 A TW 100139365A TW 100139365 A TW100139365 A TW 100139365A TW 201250392 A TW201250392 A TW 201250392A
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Taiwan
Prior art keywords
workpiece
pin
hole
cover member
vacuum
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TW100139365A
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Chinese (zh)
Inventor
Naoki Ota
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Ushio Electric Inc
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Publication of TW201250392A publication Critical patent/TW201250392A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

To provide a work stage for holding a workpiece by vacuum suction that allows, even when the workpiece is deformed with a convex warp in the center, the workpiece to be entirely sucked held with the warpage corrected. When a workpiece (W) is conveyed, pins (5a) are raised to receive the workpiece (W) and then lowered, and the workpiece (W) is thus placed on a work stage (4). Collar members (7) are lowered along with the pins (5a), and bottom surfaces of the collar members (7) are tightly coupled with top surfaces of lid members (6). The tight coupling between the collar members (7) and the lid members (6) closes up the through-holes (4c) of the work stage (4). When the vacuum suction holes (4b) are subjected to vacuum, space pressure between the workpiece (W) and the work stage (4) is reduced, and the workpiece (W) is thus sucked held by the work stage (4). When the pins (5a) are lowered, the through-holes (4c) are closed by the collar members (7) and the lid members (6) so as to prevent flow of air through the through-holes (4c). Thus, the workpiece (W) is sucked held reliably even when the workpiece (W) is deformed like an inverted bowl.

Description

201250392 六、發明說明： 【發明所屬之技術領域】 本發明是關於曝光等加工處理之保持基板的工作台及 使用該工作台的曝光裝置，尤其是關於可吸附保持產生翹 曲的晶圓等基板（工件）的工作台及使用該工作台之曝光裝 置。 【先前技術】 在製造半導體、印刷基板、液晶基板等（以下皆稱爲 工件）的過程中，進行曝光等的加工處理時，爲了使工件 不造成偏位而使用吸附保持工件的工作台。 第6圖是表示具備如上述工作台之曝光裝置的槪略構 成。 曝光裝置1 0，係由：射出紫外線的光照射部1 ;形成 有圖案的光罩M;保持該光罩Μ的光罩台2;保持塗佈著 抗蝕劑的晶圓或印刷基板等工件W的工作台4 ;及對保持 在工作台4上的工件W上投影光罩Μ的圖案像的投影透 鏡3等所構成。 此外，曝光裝置中，也有不具備投影透鏡。 光照射部1，具備：放射出含紫外線的光的燈1 a，及 反射來自燈la的光的鏡子lb等。 工作台4的表面形成有真空吸附槽4a，並設置與此真 空吸附槽連通的複數真空吸附孔4b。在工作台4連接配管 11，從該配管11透過真空吸附孔4b在真空吸附槽4a保 -5- 201250392 持工件W時賦予真空，並在將工件W從工作台4卸下時 供給空氣。 簡單說明曝光裝置的動作。 (i) 藉著未圖示的搬運手段，將印刷基板等的工件W放置 在曝光裝置10的工作台4上。在工件W的表面（形成有圖 案側）塗佈抗蝕劑。透過工作台4的真空吸附孔4b對真空 吸附槽4a賦予真空，將工件W吸附保持在工作台4上。 (ii) 對工作台4之真空的賦予是在曝光處理中，持續著使 工件W不致移動。 (iii)曝光處理結束時，切換閥12，停止對真空吸附孔4b ( 真空吸附槽4a)之真空的賦予並解除工件W的吸附保持， 將空氣供給真空吸附孔4b。藉此，從真空吸附槽4a噴出 空氣，使得工件W從工作台4脫離，而藉著未圖示的搬運 手段搬運到曝光裝置1 〇外。 接著，針對工作台部份的詳細構造與動作說明如下。 第7圖、第8圖爲工作台部份的剖視圖，表示從工件 的搬運手段承接工件後加以真空吸附爲止的動作的圖。 如同圖表示，工作台4形成有從工件搬運手段20承 接工件W用之銷5a出入用的貫穿孔4c。銷5a爲複數（3 支以上），貫穿孔4c僅設置如銷的數量。 工作台4的內面側設有銷上下驅動手段（例如汽缸）5 ’ 藉此銷上下驅動手段5使複數的銷5a透過貫穿孔4c同步 地上下。 銷5a上升時，銷5a的前端是形成比工作台4的表面 -6- 201250392 更上方’下降時，銷5a的前端是形成比工作台4的表面 還下方。 藉第7圖、第8圖針對工作台的動作說明如下。 如第7(a)圖表示，工件W是被保持在工件搬運手段 12〇的臂121上，而搬運到工作台4上。如第7(b)圖表示 ’藉著銷上下驅動手段5使銷5a上升，使得銷5a從臂21 承接工件W。 如第8(c)圖表示，工件搬運手段20的臂21退避到圖 面右方’藉著銷上下驅動手段5使得銷5a下降。將工件 W放置在工作台4上。對真空吸附孔4b賦予真空，將工 件W吸附保持在工作台4上。 再者，使用複數的銷進行搬運臂與工作台間之晶圓交 接的先前例有例如專利文獻1。 [先前技術文獻] [專利文獻] [專利文獻1]日本特開昭63 - 1 4 1 3 42號公報 【發明內容】 [發明所欲解決之課題] 最近，作爲工件有逐漸使用黏貼膨脹率不同的2片基 板的工件（例如在玻璃基板黏貼矽晶圓的工件）或與基板形 成膨脹率不同層的工件（例如在藍寶石基板上形成氮化鎵 層的工件）等。如以上的工件的場合，在前一過程重複進 行加熱冷卻時，會因上下材質的熱膨脹率不同而產生翹曲 201250392 或變形》 例如’ LED的製造中，使用在圓型的藍寶石基板上形 成氮化鎵層的工件。如以上的工件的場合，會因前一過程 的加熱冷卻處理重複地進行，使得基板朝向膨脹係數大的 材質側翹曲。 例如，在500μιη程度的藍寶石基板上形成氮化鎵層的 工件的場合，以大約800°C使得氮化鎵的結晶層成長於藍 寶石基板上。此時工件雖是成平坦，但隨著冷卻膨脹係數 大的藍寶石基板較氮化鎵的結晶層形成大的捲縮，而使得 工件朝向藍寶石基板側翹曲（藍寶石基板側形成凹面側）。 工件的直徑爲φ 100mm程度的場合，大約會產生200μπχ〜 250μηι程度的翹曲。 如上述相對於變形的工件，有使用曝光裝置在氮化鎵 層形成有圖案。爲此，工件使藍寶石基板位於下側放置在 曝光裝置的工作台上。但是，如此一來放置在工作台的工 件變形爲中央部***成凸形的倒扣碗狀時，會產生工作台 不能吸附保持工件的問題》使用第9圖進行以下說明。 第9圖是將中央部變形成凸形有如碗倒扣的工件W 放置在第7圖、第8圖所表示工作台4的狀態的圖。 在此狀態下，對工作台4的真空吸附孔4b賦予真空 時，將工作台4與工件W之間（工件W的下側）的大氣排 出，來矯正工件W的變形，應即可吸附保持於工作台4。 但是，工作台4是如上述，形成有將工件W和搬運 手段20交接用的銷5a貫穿的貫穿孔4c。爲此，對真空吸 -8 - 201250392 附孔4b賦予真空時’如第9圖表示，大氣會由此貫穿孔 4c等流入。因此’工作台4與工件W間的空間不會減壓 而不能將工件W吸附保持於工作台4。因此不能進行曝光 處理。 如以上’習知的工作台爲黏貼膨脹率不同的2片基板 的工件或形成與基板膨脹率不同的層的工件等，在以前過 程的加熱冷卻處理，將形成有如碗狀之大翹曲的工件吸附 暨保持於工作台時，大氣不能流入工作台與工件間的空間 而加以吸附暨保持，會產生不能進行曝光處理的場合》 本發明係可解決上述問題，本發明的目的爲藉真空吸 附來吸附保持基板（工件）的工作台中，即使是中央部變形 成凸形有如碗倒扣的工件時，.仍可矯正其翹曲而可以全面 來吸附保持。 [解決課題用的手段] 如以上，在工作台設有工件交接用的銷，並形成有該 銷通過的貫穿孔。因此，工件翹曲成朝著上側呈凸形的碗 狀時，大氣從該貫穿孔流入至工作台表面，而有使得工件 與工作台之間的空間不能減壓的場合。 爲此，本發明是設置在吸附工件予以保持時，不會造 成上述銷移動上的阻礙，可封閉上述貫穿孔的機構。 具體而言，在工作台的貫穿孔的下側開口設置形成比 在貫穿孔內上下移動的銷的直徑大，但比貫穿孔的直徑小 的開口的蓋構件，並在上述銷設置比上述貫穿孔的直徑小 -9 - 201250392 但比上述蓋構件的開口直徑大的套環構件。並且，上 下降時’使套環構件的下面密接於蓋構件的上面，封 述貫穿孔。在此狀態下’對工作台的真空吸附孔賦予 ’使大氣不致從貫穿孔流入而可進行工作台與工件之 氣的排氣’即使工件呈碗狀的大的翹曲，仍可將工件 保持在工作台上。 根據上述，本發明中，可藉著下述來解決課題。 (1) 具備：表面形成有賦予真空的真空吸附孔，並 下方向形成有貫穿孔的工作台；在上述貫穿孔內上下 的銷；及銷上下移動機構的工作台裝置中，在工作台 穿孔的下側開口，設置比在貫穿孔內上下移動的銷的 大，但比貫穿孔直徑小的開口的蓋構件。並密接於上 ，在上述銷下降時，將比上述貫穿孔直徑小但比上述 件的開口直徑大的套環構件，安裝在套環構件的下面 於蓋構件的上面的位置。 (2) 曝光裝置，具備：射出光的光射出部；保持著 有圖案的光罩的光罩台；及保持著轉印有形成於上述 的圖案之工件的工作台，使用上述（1)的工作台作爲上 作台。 [發明效果] 本發明中，銷下降時，藉著安裝於銷的套環構件 設置在工作台下面的蓋構件’封閉形成在工作台的銷 用的貫穿孔的一端’因此在將工件吸附保持於工作台 述銷 閉上 真空 間大 吸附 在上 移動 的貫 直徑 述銷 蓋構 密接 形成 光罩 述工 ，及 通過 時， -10- 201250392 構成可封閉銷通過用貫穿孔的一端。藉此，即使變形成有 如碗倒扣狀的工件，仍矯正其變形而可以全面吸附保持於 工作台^ 【實施方式】 第1圖、第2圖爲本發明實施例之工作台部份的剖視 圖，第1(a)圖-第2(c)圖是表示以工件搬運手段將工件一 邊搬運至工作台，並吸附保持於工作台爲止的過程。 同圖中，對與上述第7圖、第8圖表示的相同物賦予 相同的符號，並在工作台4的表面形成有真空吸附槽4a， 並設置與此真空吸附槽4a連通的複數真空吸附孔4b。並 且，形成有從工件搬運手段20的臂21承接工件W，或將 工件W傳遞到臂21用的銷5a出入用的貫穿孔4c。 工作台4的內面側設有銷上下驅動手段5，銷5a爲複 數至少設置3支以上。銷上下驅動手段5具有汽缸5d與 安裝在汽缸5d的軸5c的台5b。 複數的銷5a全部皆安裝於該台5b。藉著汽缸的軸5c 的上下使台5b上下，而使得複數的銷5a也同步上下》 工作台4的貫穿孔4c下側的各開口設有複數蓋構件6 。蓋構件6具有銷5a通過用的開口 6a。 蓋構件6的開口 6a是比銷5a的直徑大，在銷5a與 蓋構件6之間具有間隙。但是，該開口 6a的直徑是比貫 穿孔4c的直徑小》蓋構件6的材質是以柔軟的樹脂’例 如橡膠爲佳。 -11 - 201250392 蓋構件6在本實施形態中’藉著安裝於銷上下驅動手 段5的台5b的彈簧8，按壓密接於工作台4的下面。藉以 使工作台4下面與蓋構件6之間不形成間隙。 另一方面’在各銷5a的周圍安裝圓柱形的套環構件7 。套環構件7例如是含氟樹脂。套環構件7具有和銷5 a 的粗細度相同直徑的貫穿孔，將銷5a***其貫穿孔。在 銷5a與套環構件7之間塗佈黏著劑。黏著劑可將套環構 件7固定於銷5 a，並埋沒銷5 a與套環構件7的間隙。 套環構件7是被固定在銷5 a的前端到蓋構件6之間 ，即銷5a的下降時銷5a隱藏在貫穿孔4c內的部份。該 套環構件7是被設置在銷5a下降時使套環構件7的下面 密接於蓋構件6的上面。套環構件7的直徑是比貫穿孔4c 的直徑小但比蓋構件6的開口 6 a的直徑大。 第3圖爲具備上述工作台之曝光裝置的槪略構成。對 與上述第6圖表示的相同物賦予相同的符號。 如第3圖表示，曝光裝置1 〇具備光照射部1，光照射 部1具備燈la，及反射來自燈la的光的鏡子lb等，射出 含紫外線的光。並具備：形成有圖案的光罩M;保持該光 罩Μ的光罩台2 ;保持著塗佈有抗蝕劑的晶圓或印刷基板 等的工件W的工作台4;及在保持於工作台4上的工件W 上投影光罩Μ之圖案像的投影透鏡3等。 工作台4的表面設有真空吸附槽4a，並設有與此真空 吸附槽4a連通的真空吸附孔4b。又如第1圖、第2圖表 示設置貫穿孔4a，使得銷5a藉著上下驅動手段5驅動而 -12- 201250392 在貫穿孔4c內上下移動。在銷5a安裝有套環構件7，並 將蓋構件6按壓於上述貫穿孔4c的下側開口。 又如上述’在工作台4連接配管11，透過該配管11 對真空吸附孔4b或真空吸附槽4a，在保持工件W時賦予 真空，或從工作台4卸下工件時供應空氣。 曝光裝置的動作是和第6圖表示的相同，工作台4上 ’藉著搬運手段（未圖示），在表面（上面）放置塗佈著抗蝕 劑的工件W。 工件W是如上述黏貼膨脹率不同的2片基板，或在 基板上形成熱膨脹率不同的層等，由上下材質的熱膨脹係 數不同而產生翹曲或變形的工件。 例如，在藍寶石基板上形成氮化鎵層的場合，工件W 會朝著藍寶石基板側翹曲，中央部***成有如碗倒扣的凸 形。如上述，工件W的一方的面與另一方的面的熱膨脹 率不同，設熱膨脹率小的一方的面（藍寶石基板側）爲下側 而放置在工作台4上。 如上述，變形後的工件W，藉著對工作台4的真空吸 附槽4a賦予真空，而吸附於工作台4，如第3圖表示以形 成平坦的狀態被保持著。 在此狀態下，從光照射部1透過光罩Μ、投影透鏡3 照射曝光光至工件W，進行曝光處理。對工作台4賦予真 空是在工件W的曝光處理中持續著使工件W不致移動。 一旦曝光處理結束時，如上述，停止對真空吸附孔 4b(真空吸附槽4a)之真空的賦予以解除工件W的吸附保持 -13- 201250392 ，並對真空吸附孔4b供應空氣》藉此，將工件w從工作 台4卸下，藉著未圖示的搬運手段，搬運到曝光裝置10 外。 使用第1圖 '第2圖，說明本發明中，從工件的搬運 手段承接工件到真空吸附保持爲止的動作。 如第1(a)圖表示，將工件W保持在工件搬運手段20 的臂21上，並搬運至工作台4上。 蓋構件6是藉著安裝在銷上下驅動機構5的彈簧8， 按壓於工作台4之貫穿孔4c的部份的下面。並使銷5a下 降’使得銷5a的套環構件7的下面與蓋構件6的上面密 接。 如第1(b)圖表示，藉著銷上下驅動手段5使得銷5a 上升’讓銷5a從臂21來承接工件W。並使得將蓋構件6 按壓於工作台4下面的彈簧8也捲縮。與銷5a —起使得 套環構件7也上升，讓套環構件7與蓋構件6分離。 第4圖是蓋構件6、銷5a、套環構件7的放大表示圖 。同圖（a)是表示銷5a上升，使得套環構件7與蓋構件6 分離狀態的假想圖。 如第1(c)圖表示，工件搬運手段20的臂21朝著圖面 右方退避，藉著銷上下驅動手段5使得銷5a下降。將工 件W放置在工作台4。和銷5a-起使套環構件7也下降 ，使得套環構件7的下面密接於按壓在工作台4設有貫穿 孔4c部份的下面之蓋構件6的上面。第4(b)圖是表示套 環構件7與蓋構件6密接狀態的假想圖。 -14- 201250392 以橡膠形成蓋構件6，在銷5a下降時，套環構件7稍 微壓入蓋構件6時，蓋構件6與銷1 2a的間隙是以套環構 件7大致完全地封閉。 藉套環構件7與蓋構件6的密接，封閉工作台4的貫 穿孔。又，蓋構件6是藉著彈簧8被按壓於工作台4，因 此也使得工作台4與蓋構件6也密接，使兩者之間的間隙 也大致完全地封閉。 在此狀態下，對真空吸附孔4b賦予真空時，空氣不 會從貫穿孔4c流入，如第2(c)圖表示，即使工件W變形 成有如碗倒扣狀時，工件W與工作台間的空間可藉著賦 予真空吸附孔4b的真空確實地減壓。藉此，使工件w爲 大氣壓所按壓以矯正其變形，並按壓吸附保持於工作台4 。即’可強制性矯正工件W的翹曲，如上述第3圖所示 ，使工件W呈平坦，將工件W的全面密接於工作台4。 因此，在此狀態下，可對工件W進行曝光處理。 本實施例是構成將蓋構件6透過彈簧8安裝在使得銷 5a朝上下方向驅動用的銷上下驅動機構5的台5b上，當 銷5a上升時，蓋構件6藉著彈簧8，按壓於工作台4的下 面。 爲此，銷5a的位置（銷上下驅動機構5的位置）朝著圖 面左右即使有多少偏移時，仍可對應使蓋構件6也移動， 而不會改變套環構件7與蓋構件6的相對位置。因此，爲 防止大氣的流入而形成蓋構件6的小的開口 6 a的直徑， 即使在套環構件7與蓋構件6間不容易產生間隙，但也不 -15- 201250392 致有因銷5a與蓋構件6的摩擦而造成銷5移動上的阻礙 ’或因摩擦導致擦屑的產生等問題。 第5圖是表示在彈簧8的外側設置限制彈簧8左右方 向的移動之框構件9a、9b的場合的構成例的圖。如上述 的構成，更可以保持使其不改變銷5 a與蓋構件6的位置 關係。 此外，並可精度良好地進行銷上下驅動機構5與工作 台4的組裝，構成不改變銷上下驅動機構5與工作台4的 相對位置，可以使銷5a在工作台4的貫穿孔4c內的中心 部份朝著上下方向精度良好移動的場合，也可藉著黏著劑 等將蓋構件6安裝於工作台4的下面。 【圖式簡單說明】 第1圖爲本發明實施例之工作台部份的剖視圖（1)。 第2圖爲本發明實施例之工作台部份的剖視圖（2)。 第3圖是表示具備本發明實施例的工作台之曝光裝置 的槪略構成圖。 第4圖是蓋構件、銷、套環構件放大表示的圖。 第5圖是表示在彈簧的外側設置框構件的場合的構成 例的圖。 第6圖是表示曝光裝置的槪略構成的圖。 第7圖是表示習知工作台的部份之剖視圖（1 )的圖。 第8圖是表示習知工作台的部份之剖視圖（2)的圖。 第9圖是表示將中央部變形成凸形的工件W放置在 -16- 201250392 第7圖、第8圖之工作台的狀態的圖 【主要元件符號說明】 1 :光照射部 1 a :燈 1 b :鏡子 2 :光罩台 3 :投影透鏡 4 :工作台 4a :真空吸附槽 4b :真空吸附孔 4 c :貫穿孔 5 :銷上下驅動手段 5a :銷 5 b :台 5 c :軸 6 :蓋構件 6a :開口 7 :套環構件 8 :彈簧 9 a、9 b :框構件 1 0 :曝光裝置 20 :工件搬運手段 21 :臂 -17- 201250392 Μ ： W ： 光罩 工件 -18-201250392 6. TECHNOLOGICAL FIELD OF THE INVENTION The present invention relates to a table for holding a substrate subjected to processing such as exposure, and an exposure apparatus using the same, and more particularly to a substrate such as a wafer capable of adsorbing and maintaining warpage. A table (workpiece) and an exposure device using the table. [Prior Art] When manufacturing a semiconductor, a printed circuit board, a liquid crystal substrate, or the like (hereinafter referred to as a workpiece), when performing processing such as exposure, a table for adsorbing and holding the workpiece is used in order to prevent the workpiece from being displaced. Fig. 6 is a schematic view showing the configuration of an exposure apparatus having the above-described table. The exposure device 10 is composed of a light irradiation unit 1 that emits ultraviolet rays, a mask M in which a pattern is formed, a mask table 2 that holds the mask, and a workpiece such as a wafer or a printed substrate on which a resist is applied. A table 4 of W; and a projection lens 3 for projecting a pattern image of the mask 保持 on the workpiece W held on the table 4, and the like. Further, in the exposure apparatus, there is no projection lens. The light-irradiating portion 1 includes a lamp 1a that emits light containing ultraviolet rays, and a mirror lb that reflects light from the lamp 1a. The surface of the table 4 is formed with a vacuum suction groove 4a, and a plurality of vacuum suction holes 4b communicating with the vacuum adsorption groove are provided. The pipe 11 is connected to the table 4, and the vacuum is applied from the pipe 11 through the vacuum suction hole 4b to hold the workpiece W in the vacuum suction groove 4a, and the air is supplied when the workpiece W is detached from the table 4. Briefly explain the action of the exposure device. (i) A workpiece W such as a printed board is placed on the table 4 of the exposure apparatus 10 by a transport means (not shown). A resist is applied on the surface (formed side of the pattern) of the workpiece W. Vacuum is applied to the vacuum adsorption tank 4a through the vacuum suction hole 4b of the table 4, and the workpiece W is adsorbed and held on the table 4. (ii) The vacuum of the table 4 is imparted so that the workpiece W does not move during the exposure process. (iii) At the end of the exposure process, the valve 12 is switched, the vacuum of the vacuum suction hole 4b (vacuum adsorption tank 4a) is stopped, and the suction holding of the workpiece W is released, and the air is supplied to the vacuum suction hole 4b. Thereby, air is ejected from the vacuum suction tank 4a, and the workpiece W is detached from the table 4, and is transported to the outside of the exposure apparatus 1 by a transport means (not shown). Next, the detailed structure and operation of the table portion will be described below. Fig. 7 and Fig. 8 are cross-sectional views showing the operation of the workpiece, and the operation of vacuuming the workpiece after receiving the workpiece from the conveyance means of the workpiece. As shown in the figure, the table 4 is formed with a through hole 4c for receiving and receiving the pin 5a for receiving the workpiece W from the workpiece conveying means 20. The pin 5a is plural (three or more), and the through hole 4c is provided only in the number of pins. The pin upper and lower driving means (e.g., cylinder) 5' is provided on the inner surface side of the table 4, whereby the pin up/down driving means 5 causes the plurality of pins 5a to pass up and down in synchronization with the through holes 4c. When the pin 5a is raised, the front end of the pin 5a is formed to be lower than the surface -6-201250392 of the table 4, and the front end of the pin 5a is formed below the surface of the table 4. The operation of the table will be described below with reference to Figs. 7 and 8. As shown in Fig. 7(a), the workpiece W is held on the arm 121 of the workpiece conveying means 12A and transported to the table 4. As shown in Fig. 7(b), the pin 5a is raised by the pin up/down driving means 5 so that the pin 5a receives the workpiece W from the arm 21. As shown in Fig. 8(c), the arm 21 of the workpiece transporting means 20 is retracted to the right of the drawing. The pin 5a is lowered by the pin up/down driving means 5. The workpiece W is placed on the table 4. Vacuum is applied to the vacuum suction holes 4b to hold and hold the workpiece W on the table 4. Further, a conventional example in which a plurality of pins are used to transfer a wafer between a transfer arm and a table is disclosed, for example, in Patent Document 1. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. SHO-63-1-4 A workpiece of two substrates (for example, a workpiece bonded to a wafer on a glass substrate) or a workpiece having a different expansion ratio from a substrate (for example, a workpiece on which a gallium nitride layer is formed on a sapphire substrate). In the case of the above workpiece, when the heating and cooling are repeated in the previous process, warpage 201250392 or deformation occurs due to the difference in thermal expansion coefficient of the upper and lower materials. For example, in the manufacture of LEDs, nitrogen is formed on a circular sapphire substrate. The workpiece of the gallium layer. In the case of the above workpiece, the heating and cooling treatment in the previous process is repeatedly performed, so that the substrate is warped toward the material side having a large expansion coefficient. For example, in the case of forming a workpiece of a gallium nitride layer on a sapphire substrate of about 500 μm, a crystal layer of gallium nitride is grown on a sapphire substrate at about 800 °C. At this time, although the workpiece is flat, the sapphire substrate having a large cooling expansion coefficient is greatly curled compared with the crystal layer of gallium nitride, and the workpiece is warped toward the sapphire substrate side (the sapphire substrate side is formed on the concave side). When the diameter of the workpiece is about φ 100 mm, warpage of about 200 μπχ to 250 μη is generated. As described above, with respect to the deformed workpiece, a pattern is formed on the gallium nitride layer using an exposure apparatus. To this end, the workpiece is placed on the lower side of the sapphire substrate on the stage of the exposure apparatus. However, when the workpiece placed on the table is deformed into an inverted bowl shape in which the center portion is convexly convex, there is a problem that the table cannot be sucked and held by the table. The following description will be made using Fig. 9. Fig. 9 is a view showing a state in which the center portion is deformed into a convex shape such as a bowl-backed workpiece W placed on the table 4 shown in Figs. 7 and 8. In this state, when vacuum is applied to the vacuum suction hole 4b of the table 4, the atmosphere between the table 4 and the workpiece W (the lower side of the workpiece W) is discharged to correct the deformation of the workpiece W, and it is possible to adsorb and hold. On the workbench 4. However, as described above, the table 4 is formed with a through hole 4c through which the pin 5a for transferring the workpiece W and the conveying means 20 is inserted. For this reason, when vacuum is applied to the vacuum -8 - 201250392 attached hole 4b, as shown in Fig. 9, the atmosphere flows in through the hole 4c or the like. Therefore, the space between the table 4 and the workpiece W is not decompressed, and the workpiece W cannot be adsorbed and held on the table 4. Therefore, exposure processing cannot be performed. As described above, the conventional workbench is a workpiece of two substrates having different adhesion expansion rates or a workpiece forming a layer having a different expansion ratio from the substrate, and the like, in the heating and cooling process of the previous process, a large warp like a bowl is formed. When the workpiece is adsorbed and held on the table, the atmosphere cannot flow into the space between the table and the workpiece to be adsorbed and held, and the exposure process cannot be performed. The present invention solves the above problems, and the object of the present invention is to absorb the vacuum. In the table for adsorbing and holding the substrate (workpiece), even if the central portion is deformed into a convex shape such as a bowl-backed workpiece, the warpage can be corrected and the adsorption can be maintained comprehensively. [Means for Solving the Problem] As described above, a pin for workpiece transfer is provided on the table, and a through hole through which the pin passes is formed. Therefore, when the workpiece is warped into a bowl shape which is convex toward the upper side, the atmosphere flows from the through hole to the surface of the table, and there is a case where the space between the workpiece and the table cannot be decompressed. Therefore, the present invention is a mechanism for closing the through hole without providing an obstacle to the movement of the pin when the workpiece is held by the suction. Specifically, a cover member having a larger opening than the diameter of the pin that moves up and down in the through hole but having a smaller diameter than the diameter of the through hole is provided in the lower opening of the through hole of the table, and the pin is disposed more than the above. The diameter of the hole is small -9 - 201250392 but a collar member having a larger opening diameter than the above-mentioned cover member. Further, when the upper portion is lowered, the lower surface of the collar member is in close contact with the upper surface of the lid member, and the through hole is sealed. In this state, 'the vacuum suction hole of the table is given 'to allow the atmosphere to flow from the through hole, and the exhaust of the table and the workpiece can be performed.' Even if the workpiece is in a bowl-like large warpage, the workpiece can be held. On the workbench. According to the above, in the present invention, the problem can be solved by the following. (1) A table in which a vacuum suction hole for applying a vacuum is formed on the surface and a through hole is formed in a downward direction; a pin in the upper and lower through holes; and a table device in which the pin moves up and down is perforated in the table The lower side opening is provided with a cover member that is larger than the pin that moves up and down in the through hole but has a smaller diameter than the through hole. Further, when the pin is lowered, the collar member having a smaller diameter than the through hole but larger than the opening diameter of the member is attached to the upper surface of the collar member at the upper surface of the cover member. (2) The exposure apparatus includes: a light emitting portion that emits light; a mask table that holds the mask of the pattern; and a table that holds the workpiece formed on the pattern, and uses the above (1) The workbench serves as the upper stage. [Effect of the Invention] In the present invention, when the pin is lowered, the cover member provided on the lower surface of the table by the collar member attached to the pin is closed at one end of the through hole for the pin of the table. When the workbench is closed, the vacuum is greatly absorbed, and the diameter of the pin is fixed to the upper cover to form a mask. When passing, -10-201250392 constitutes one end of the through hole through which the pin can be closed. Thereby, even if a workpiece such as a bowl-back button shape is formed, the deformation can be corrected to be fully adsorbed and held on the table. [Embodiment] Figs. 1 and 2 are cross-sectional views of a table portion according to an embodiment of the present invention. Fig. 1(a) to Fig. 2(c) show the process of transporting the workpiece to the table by the workpiece transport means and sucking and holding it on the table. In the same drawing, the same reference numerals are given to the same elements as those in the seventh and eighth drawings, and a vacuum suction groove 4a is formed on the surface of the table 4, and a plurality of vacuum adsorptions are provided in communication with the vacuum adsorption groove 4a. Hole 4b. Further, a through hole 4c for receiving the workpiece W from the arm 21 of the workpiece transporting means 20 or transferring the workpiece W to the pin 5a for the arm 21 is formed. The pin upper and lower driving means 5 is provided on the inner surface side of the table 4, and the pin 5a is provided in plural at least three or more. The pin up/down driving means 5 has a cylinder 5d and a table 5b attached to the shaft 5c of the cylinder 5d. A plurality of pins 5a are all mounted on the table 5b. The upper and lower sides of the shaft 5c of the cylinder 5c are vertically moved, so that the plurality of pins 5a are also synchronized with each other. The respective openings on the lower side of the through hole 4c of the table 4 are provided with a plurality of cover members 6. The cover member 6 has an opening 6a through which the pin 5a passes. The opening 6a of the cover member 6 is larger than the diameter of the pin 5a, and has a gap between the pin 5a and the cover member 6. However, the diameter of the opening 6a is smaller than the diameter of the through hole 4c. The material of the cover member 6 is preferably a soft resin such as rubber. -11 - 201250392 In the present embodiment, the cover member 6 is pressed and adhered to the lower surface of the table 4 by the spring 8 attached to the table 5b of the pin up/down driving means 5. Thereby, no gap is formed between the lower surface of the table 4 and the cover member 6. On the other hand, a cylindrical collar member 7 is attached around each pin 5a. The collar member 7 is, for example, a fluorine-containing resin. The collar member 7 has a through hole having the same diameter as the thickness of the pin 5a, and the pin 5a is inserted into the through hole. An adhesive is applied between the pin 5a and the collar member 7. The adhesive can fix the collar member 7 to the pin 5a and bury the gap between the pin 5a and the collar member 7. The collar member 7 is fixed between the front end of the pin 5a and the cover member 6, that is, the portion where the pin 5a is hidden in the through hole 4c when the pin 5a is lowered. The collar member 7 is disposed such that the lower surface of the collar member 7 is in close contact with the upper surface of the cover member 6 when the pin 5a is lowered. The diameter of the collar member 7 is smaller than the diameter of the through hole 4c but larger than the diameter of the opening 6a of the cover member 6. Fig. 3 is a schematic diagram showing the configuration of an exposure apparatus having the above-described table. The same symbols are given to the same elements as those shown in Fig. 6 above. As shown in Fig. 3, the exposure apparatus 1 includes a light irradiation unit 1, and the light irradiation unit 1 includes a lamp la and a mirror lb that reflects light from the lamp 1a, and emits ultraviolet light. And a mask M having a pattern formed thereon; a mask stage 2 holding the mask ;; a table 4 holding a workpiece W such as a resist wafer or a printed substrate; and being kept at work A projection lens 3 or the like for projecting a pattern image of the mask 上 on the workpiece W on the stage 4. The surface of the table 4 is provided with a vacuum suction groove 4a, and a vacuum suction hole 4b communicating with the vacuum adsorption groove 4a is provided. Further, as shown in Fig. 1 and Fig. 2, the through hole 4a is provided so that the pin 5a is driven by the vertical driving means 5 and -12-201250392 is moved up and down in the through hole 4c. The collar member 7 is attached to the pin 5a, and the cover member 6 is pressed against the lower opening of the through hole 4c. Further, as described above, the pipe 11 is connected to the table 4, and the vacuum suction hole 4b or the vacuum suction groove 4a is supplied through the pipe 11, and when the workpiece W is held while the workpiece W is being held, or when the workpiece is detached from the table 4, air is supplied. The operation of the exposure apparatus is the same as that shown in Fig. 6, and the workpiece W on which the resist is applied is placed on the surface (upper surface) by means of a transport means (not shown). The workpiece W is a workpiece in which two sheets of substrates having different adhesion expansion ratios are formed, or a layer having a different coefficient of thermal expansion is formed on the substrate, and the thermal expansion coefficient of the upper and lower materials is different to cause warpage or deformation. For example, when a gallium nitride layer is formed on a sapphire substrate, the workpiece W is warped toward the sapphire substrate side, and the central portion is raised to have a convex shape such as a bowl inverted. As described above, the thermal expansion coefficient of one surface of the workpiece W is different from that of the other surface, and the surface (the sapphire substrate side) having a small thermal expansion coefficient is placed on the table 4 as the lower side. As described above, the deformed workpiece W is adsorbed to the table 4 by applying a vacuum to the vacuum suction groove 4a of the table 4, and is held in a flat state as shown in Fig. 3. In this state, the exposure light is irradiated from the light irradiation unit 1 through the mask Μ and the projection lens 3 to the workpiece W, and exposure processing is performed. The vacuum is given to the table 4 so that the workpiece W does not move during the exposure processing of the workpiece W. When the exposure processing is completed, as described above, the vacuum of the vacuum suction hole 4b (vacuum adsorption tank 4a) is stopped to release the adsorption holding of the workpiece W-13-201250392, and the vacuum adsorption hole 4b is supplied with air. The workpiece w is detached from the table 4 and transported to the outside of the exposure apparatus 10 by a transport means (not shown). In the present invention, the operation of receiving the workpiece from the conveyance means of the workpiece to the vacuum suction holding will be described with reference to Fig. 2'. As shown in Fig. 1(a), the workpiece W is held by the arm 21 of the workpiece transporting means 20 and transported to the table 4. The cover member 6 is pressed against the lower surface of the portion of the through hole 4c of the table 4 by the spring 8 attached to the pin vertical drive mechanism 5. The pin 5a is lowered so that the lower surface of the collar member 7 of the pin 5a is in close contact with the upper surface of the cover member 6. As shown in Fig. 1(b), the pin 5a is raised by the pin upper and lower driving means 5, and the pin 5a receives the workpiece W from the arm 21. The spring 8 that presses the cover member 6 against the underside of the table 4 is also crimped. Together with the pin 5a, the collar member 7 also rises, separating the collar member 7 from the cover member 6. Fig. 4 is an enlarged view showing the cover member 6, the pin 5a, and the collar member 7. The same figure (a) is an imaginary view showing that the pin 5a is raised to separate the collar member 7 from the cover member 6. As shown in Fig. 1(c), the arm 21 of the workpiece transporting means 20 is retracted to the right in the drawing, and the pin 5a is lowered by the pin up/down driving means 5. The workpiece W is placed on the table 4. The pin member 7a is also lowered so that the lower side of the collar member 7 is in close contact with the upper surface of the cover member 6 which is pressed against the portion of the table 4 where the through hole 4c is provided. Fig. 4(b) is a schematic view showing a state in which the collar member 7 and the lid member 6 are in close contact with each other. -14- 201250392 The cover member 6 is formed of rubber, and when the collar member 7 is slightly pressed into the cover member 6 when the pin 5a is lowered, the gap between the cover member 6 and the pin 12a is substantially completely closed by the collar member 7. The perforation of the table 4 is closed by the close contact of the collar member 7 with the cover member 6. Further, the lid member 6 is pressed against the table 4 by the spring 8, so that the table 4 and the lid member 6 are also in close contact with each other, and the gap between the two is also substantially completely closed. In this state, when vacuum is applied to the vacuum suction hole 4b, air does not flow in from the through hole 4c, as shown in Fig. 2(c), even when the workpiece W is deformed like a bowl inverted shape, between the workpiece W and the table The space can be surely decompressed by the vacuum given to the vacuum suction holes 4b. Thereby, the workpiece w is pressed by the atmospheric pressure to correct the deformation thereof, and the suction is held by the table 4 by suction. That is, the warpage of the workpiece W can be forcibly corrected, and as shown in Fig. 3 described above, the workpiece W is flattened, and the entire surface of the workpiece W is adhered to the table 4. Therefore, in this state, the workpiece W can be subjected to exposure processing. In the present embodiment, the cover member 6 is attached to the table 5b of the pin up-and-down driving mechanism 5 for driving the pin 5a in the vertical direction through the spring 8, and when the pin 5a is raised, the cover member 6 is pressed by the spring 8 to work. Below the table 4. For this reason, the position of the pin 5a (the position of the pin upper and lower drive mechanism 5), even if there is a slight offset to the left and right of the drawing, the cover member 6 can be moved correspondingly without changing the collar member 7 and the cover member 6. Relative position. Therefore, in order to prevent the inflow of the atmosphere, the diameter of the small opening 6a of the cover member 6 is formed, and even if a gap is not easily generated between the collar member 7 and the cover member 6, it is not -15-201250392. The friction of the cover member 6 causes an obstacle in the movement of the pin 5 or a generation of rubbing due to friction. Fig. 5 is a view showing a configuration example in which the frame members 9a and 9b for restricting the movement of the spring 8 in the left-right direction are provided outside the spring 8. According to the above configuration, it is possible to keep it from changing the positional relationship between the pin 5a and the cover member 6. Further, the pin up-and-down drive mechanism 5 and the table 4 can be assembled with high precision, and the position of the pin up-and-down drive mechanism 5 and the table 4 can be changed without changing the pin 5a in the through hole 4c of the table 4. When the center portion is moved with high precision in the vertical direction, the cover member 6 may be attached to the lower surface of the table 4 by an adhesive or the like. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view (1) of a table portion of an embodiment of the present invention. Fig. 2 is a cross-sectional view (2) of a portion of a table according to an embodiment of the present invention. Fig. 3 is a schematic block diagram showing an exposure apparatus including a table according to an embodiment of the present invention. Fig. 4 is an enlarged view of a cover member, a pin, and a collar member. Fig. 5 is a view showing an example of a configuration in which a frame member is provided outside the spring. Fig. 6 is a view showing a schematic configuration of an exposure apparatus. Figure 7 is a diagram showing a cross-sectional view (1) of a portion of a conventional workbench. Figure 8 is a view showing a cross-sectional view (2) of a portion of a conventional workbench. Fig. 9 is a view showing a state in which the workpiece W which has been deformed into a convex shape at the center portion is placed on the table of Figs. 7 and 8 of Fig. 16-201250392 [Description of main components] 1 : Light irradiation section 1 a : Lamp 1 b : Mirror 2 : reticle stage 3 : projection lens 4 : table 4a : vacuum suction groove 4 b : vacuum suction hole 4 c : through hole 5 : pin up and down driving means 5a : pin 5 b : stage 5 c : axis 6 : cover member 6a : opening 7 : collar member 8 : spring 9 a, 9 b : frame member 10 : exposure device 20 : workpiece handling means 21 : arm -17 - 201250392 Μ : W : mask workpiece -18 -

Claims (1)

201250392 七、申請專利範圍： 1. 一種工作台裝置，具備：在表面形成有賦予真空的 真空吸附孔，並在上下方向形成有貫穿孔的工作台；在上 述貫穿孔內上下移動的銷；及銷上下移動機構的工作台裝 置，其特徵爲： 在工作台的貫穿孔的下側開口，設置比在貫穿孔內上 下移動的銷的直徑大，但比貫穿孔直徑小的開口的蓋構件 > 密接於上述銷，在上述銷下降時，將比上述貫穿孔直 徑小但比上述蓋構件的開口直徑大的套環構件，安裝在套 環構件的下面密接於蓋構件的上面的位置。 2·—種曝光裝置，具備： 射出光的光射出部； 保持著形成有圖案的光罩的光罩台；及 保持著轉印有形成於上述光罩的圖案之工件的工作台 ，其特徵爲： 上述工作台爲申請專利範圍第1項記載的工作台》 -19-201250392 VII. Patent application scope: 1. A workbench device comprising: a vacuum suction hole for forming a vacuum on a surface thereof; a work table having a through hole formed in an up-and-down direction; and a pin moving up and down in the through hole; The table device of the pin up-and-down moving mechanism is characterized in that: a cover member that is larger than a diameter of a pin that moves up and down in the through hole, but has an opening smaller than a diameter of the through hole, is provided in a lower side of the through hole of the table. When the pin is lowered, the collar member having a diameter smaller than the diameter of the through hole but larger than the opening diameter of the cover member is attached to a position where the lower surface of the collar member is in close contact with the upper surface of the cover member. An exposure apparatus comprising: a light emitting portion that emits light; a mask table that holds a mask formed with a pattern; and a table that holds a workpiece on which a pattern formed in the mask is transferred, and is characterized by For: The above workbench is the workbench recorded in the first paragraph of the patent application scope -19-
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