JP2017124484A - Grinding-polishing composite processing device, and polishing device - Google Patents

Grinding-polishing composite processing device, and polishing device Download PDF

Info

Publication number
JP2017124484A
JP2017124484A JP2016232807A JP2016232807A JP2017124484A JP 2017124484 A JP2017124484 A JP 2017124484A JP 2016232807 A JP2016232807 A JP 2016232807A JP 2016232807 A JP2016232807 A JP 2016232807A JP 2017124484 A JP2017124484 A JP 2017124484A
Authority
JP
Japan
Prior art keywords
polishing
grinding
workpiece
tape
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016232807A
Other languages
Japanese (ja)
Other versions
JP6851068B2 (en
Inventor
高志 宮本
Takashi Miyamoto
高志 宮本
比宇麻 岩瀬
Hiuma Iwase
比宇麻 岩瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nakamura Tome Precision Industry Co Ltd
Original Assignee
Nakamura Tome Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nakamura Tome Precision Industry Co Ltd filed Critical Nakamura Tome Precision Industry Co Ltd
Priority to CN201720030271.0U priority Critical patent/CN206455519U/en
Priority to KR1020170005369A priority patent/KR102637724B1/en
Publication of JP2017124484A publication Critical patent/JP2017124484A/en
Application granted granted Critical
Publication of JP6851068B2 publication Critical patent/JP6851068B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/12—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a contact wheel or roller pressing the belt against the work
    • B24B21/14—Contact wheels; Contact rollers; Belt supporting rolls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B24B21/20—Accessories for controlling or adjusting the tracking or the tension of the grinding belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B24B21/22—Accessories for producing a reciprocation of the grinding belt normal to its direction of movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a grinding-polishing composite processing device capable of performing a grinding processing and a polishing processing of a work-piece by a single processing device, and simple in a polishing mechanism and excellent in a polishing quality, and to provide a polishing device excellent in polishing efficiency and quality.SOLUTION: A polishing device comprises: a grinding stage for grinding a work-piece; a polishing stage for a polishing treatment; and work transportation means from said grinding stage to said polishing treatment, and said polishing stage is characterized by comprising tape polishing means using a polishing tape.SELECTED DRAWING: Figure 1

Description

本発明は、研削加工とその後の研磨加工とを連続的に行うことができる複合加工装置に関する。
また、テープ研磨による研磨装置に関する。 The present invention relates to a composite processing apparatus capable of continuously performing a grinding process and a subsequent polishing process.
The present invention also relates to a polishing apparatus using tape polishing.

各種デバイスに使用される各種基板等の分野においては、外形を研削加工にて成形後にさらに鏡面状に研磨加工が施されている。
ここで研削加工は、高速回転する砥石にてワークの表面，外形等を削り成形する工法であり、表面の平滑度に応じて粗研削，中研削，仕上げ研削等が行われている。
研磨加工は、微細な砥粒を用いて表面を鏡面状に磨くことをいう。
研磨方法としては、従来から研磨液中に遊離砥粒を分散させたものや、エッチングと称される化学反応による表面加工が採用されていたが、近年環境保全，クリーン作業性の観点から、また素材によってはエッチング加工ができない等の理由から、微細な砥粒をテープ状のフイルムに塗布及び固定化した研磨テープ（ラッピングテープ，ラッピングフイルム等とも称されている。）を用いることが行われている。 In the field of various substrates used for various devices, the outer shape is further polished by mirror processing after being molded by grinding.
Here, the grinding is a method in which the surface, outer shape, and the like of a workpiece are formed by grinding with a high-speed rotating grindstone, and rough grinding, intermediate grinding, finish grinding, and the like are performed according to the smoothness of the surface.
Polishing means polishing the surface into a mirror surface using fine abrasive grains.
As a polishing method, conventionally, a method in which loose abrasive grains are dispersed in a polishing liquid or a surface treatment by a chemical reaction called etching has been adopted, but in recent years, from the viewpoint of environmental conservation and clean workability, For reasons such as etching not being possible depending on the material, use is made of a polishing tape (also referred to as a wrapping tape, wrapping film, etc.) in which fine abrasive grains are applied and fixed to a tape-like film. Yes.

これらの加工装置は、これまで研削装置、研磨装置としてそれぞれ別々の加工装置となっていたために、これらを複数種配列したり、その加工機の間にワーク搬送装置を設けることが必要になり、各装置の設置基準出し等大変であり、コスト的にも高価となった。
そこで、本発明者らは研削手段とテープによる研磨手段との位置決めが容易であり、クーラント循環系統等の付帯設備の共通化を検討した結果、本発明に至った。 Since these processing devices have become separate processing devices as grinding devices and polishing devices so far, it is necessary to arrange a plurality of them, or to provide a work transfer device between the processing machines, It was difficult to determine the installation standards for each device, and it was expensive.
Therefore, the inventors of the present invention easily positioned the grinding means and the polishing means using the tape, and as a result of studying the common use of auxiliary equipment such as a coolant circulation system, the present invention has been achieved.

また、従来の研磨テープによる研磨装置は、例えば特許文献１に示すように一対のテープリール間に研磨テープを掛け渡し、この研磨テープを回転する被加工物に圧接するための圧接機構を有するものであった。
このような圧接機構は、弾性体の弾力性の調整、選定が非常に難しい。
例えば、図１３に示すように基板の研削した研削面の成形形状は、用途によりさまざまな角度に成形する必要があり複雑であることから、この形状に合せて圧接機構を移動制御するには複雑な旋回ユニットや多数軸からなる制御機構が必要とするだけでなく、被研磨面との間に隙間が発生しやすく研磨が難しかった。 Further, a conventional polishing apparatus using a polishing tape has, for example, a pressure contact mechanism for passing a polishing tape between a pair of tape reels and pressing the polishing tape against a workpiece to be rotated, as shown in Patent Document 1, for example. Met.
Such a pressure contact mechanism is very difficult to adjust and select the elasticity of the elastic body.
For example, as shown in FIG. 13, the molded shape of the ground surface of the substrate must be molded at various angles depending on the application, and is complicated, so it is complicated to control the movement of the pressure contact mechanism according to this shape. In addition to the need for a simple swiveling unit and a control mechanism consisting of multiple axes, a gap is easily generated between the surface to be polished and polishing is difficult.

特開２０１１−４５９５７号公報JP 2011-45957 A

本発明は、一台の加工装置でワークの研削加工及び研磨加工ができるとともに、研磨機構がシンプルで研磨品質に優れた研削・研磨複合加工装置の提供を目的とする。
また、研磨効率及び品質に優れた研磨装置の提供を目的とする。 An object of the present invention is to provide a combined grinding and polishing apparatus capable of grinding and polishing a workpiece with a single processing apparatus and having a simple polishing mechanism and excellent polishing quality.
It is another object of the present invention to provide a polishing apparatus excellent in polishing efficiency and quality.

本発明に係る研削・研磨複合加工装置は、ワークを研削加工するための研削ステージと、研磨加工するための研磨ステージと、前記研削ステージから研磨ステージへのワーク搬送手段とを備え、前記研磨ステージは研磨テープを用いたテープ研磨手段を有することを特徴とする。
このように、研削加工機と研磨加工機とを一台に複合化したので、ワークの位置決めが容易で付帯設備の共通化が可能になったため、低コストな装置となる。
ここで、研削ステージと研磨ステージは、ワークの回転保持手段を有している。
また、テープ研磨手段となっているので、従来の遊離砥粒を用いたものに比較して環境保全性に優れる。 The combined grinding and polishing apparatus according to the present invention includes a grinding stage for grinding a workpiece, a polishing stage for polishing, and a workpiece transfer means from the grinding stage to the polishing stage, and the polishing stage Has a tape polishing means using an abrasive tape.
As described above, since the grinding machine and the polishing machine are combined into one unit, the positioning of the workpiece is easy and the incidental facilities can be shared, so that the apparatus is low in cost.
Here, the grinding stage and the polishing stage have a work rotation holding means.
Moreover, since it is a tape grinding | polishing means, it is excellent in environmental conservation compared with what used the conventional loose abrasive.

本発明において、テープ研磨手段は、研磨テープを掛架した一対の支持ロールと、前記一対の支持ロールに掛架した研磨テープをワークの被研磨面に沿って倣うように当該一対の支持ロールを旋回させるための旋回手段を有するようにしてもよい。
このように一対の支持ロールの間に研磨テープを掛け渡し張設したので、ワークと、一対の支持ロールの旋回手段との間を近接及び離間制御することで、複雑な形状の被研磨面に沿って研磨テープを倣わすように旋回できる。
この際に一対の支持ロールに張設，掛架した研磨テープとワークとの接触位置を、例えば一対の支持ロール間の中央部等、所定の位置になるように制御しながら旋回させることで、均一な接触圧を確保するのが容易である。
また、研磨テープとワークとの接触位置を旋回する一対の支持ロール間の中央部からずらすと、ワークに圧接するテープ面の砥粒がこの研磨テープの旋回によってもワークの接触面に沿って移動するので、研磨量の調整機能を有する。
研磨テープの送り速度の速さや一時停止等の制御が容易で、水等の冷却潤滑液を研磨部に供給するためにワークとの接触部を一時的に離間制御することも容易である。
本発明にて研磨テープの送りは、ワークの回転と同期，非同期に関わらずに作用できる。 In the present invention, the tape polishing means includes a pair of support rolls on which the polishing tape is hung, and the pair of support rolls so as to follow the polishing tape hung on the pair of support rolls along the surface to be polished of the workpiece. You may make it have a turning means for making it turn.
In this way, the polishing tape is stretched between the pair of support rolls, and therefore, by controlling the proximity and separation between the workpiece and the turning means of the pair of support rolls, the surface to be polished has a complicated shape. Can be swung so as to follow the polishing tape.
At this time, the contact position between the polishing tape and the work that is stretched and hung on the pair of support rolls, for example, the center portion between the pair of support rolls, and the like, is swung while being controlled to be a predetermined position, It is easy to ensure a uniform contact pressure.
In addition, when the contact position between the polishing tape and the workpiece is shifted from the center between the pair of supporting rolls that rotate, the abrasive particles on the tape surface that is in pressure contact with the workpiece move along the contact surface of the workpiece even when the polishing tape rotates. Therefore, it has a function of adjusting the polishing amount.
It is easy to control the speed at which the polishing tape is fed, temporarily stop, and the like, and it is also easy to temporarily control the contact portion with the workpiece in order to supply a cooling lubricant such as water to the polishing portion.
In the present invention, the polishing tape can be fed regardless of whether it is synchronous or asynchronous with the rotation of the workpiece.

研磨テープをワークの被研磨形状に沿って倣わせる方法として、テープ研磨手段は、研磨テープを掛架した第１及び第２ロールからなる一対の支持ロールと、前記一対の支持ロールに掛架した研磨テープをワークの研削面に沿って倣うように前記第１ロールと第２ロールをワークに向けて前進及び後退方向に相対移動させるための移動制御手段を有するようにしてもよい。
これにより、一対の支持ロール間に掛架した研磨テープを旋回させるのと同様の移動制御が可能である。
ここで、一対の支持ロールをワークに向けて相対移動させる場合に、サーボモータによる旋回機構にリンク機構を組み合せ、一対のリンクにそれぞれ支持ロールを設けてもよい。
また、第１及び第２ロールは、研磨テープの送り速度を変化させたり、停止することもでき、また第１，第２ロールを同期化又は非同期により制御することができる。 As a method of copying the polishing tape along the shape of the workpiece to be polished, the tape polishing means includes a pair of support rolls including a first roll and a second roll on which the polishing tape is hung, and a hung on the pair of support rolls. You may make it have a movement control means for moving the said 1st roll and 2nd roll toward a workpiece | work forward and backward direction so that the polishing tape which followed the grinding | polishing surface of the workpiece | work may be followed.
Thereby, the same movement control as rotating the polishing tape hung between the pair of support rolls is possible.
Here, when the pair of support rolls are relatively moved toward the work, a link mechanism may be combined with a turning mechanism using a servo motor, and the support rolls may be provided on the pair of links, respectively.
The first and second rolls can also change or stop the feed speed of the polishing tape, and can control the first and second rolls synchronously or asynchronously.

本発明において、一対の支持ロールは研磨テープの研磨面がワークの被研磨面に対して左右方向斜めに当接するように傾斜させるための傾斜制限手段を有するようにしてもよい。
ここで左右方向に傾斜させるとは、例えば回転保持したワークを水平に配置した場合に、研磨テープの上下垂直方向の張設に対して右廻り、あるいは左廻りに斜めにしたことをいう。
これにより、ワークに形成されたノッチ部に研磨テープが入りやすくなったり、ワークの被研磨面に接触する面積を増大させ、研磨効率を向上させたりすることができ、研磨時の冷却潤滑液の供給もしやすくなる。
本発明において、一対の支持ロールに掛架した研磨テープを当該研磨テープの裏面側からワークに向けて押圧するバックアップ手段を有するようにしてもよい。
このようにすると、ワークの被研磨部の形状に合せて研磨テープが裏面側からバックアップされる。
このように本発明は、テープ研磨手段そのものにも特徴があることから、このような研磨機構を用いた単独の研磨装置としてもよい。 In the present invention, the pair of support rolls may have tilt limiting means for tilting the polishing surface of the polishing tape so that the polishing surface of the workpiece is in contact with the surface to be polished obliquely in the left-right direction.
The term “inclined in the left-right direction” means that, for example, when the rotated and held work is horizontally disposed, the work is inclined clockwise or counterclockwise with respect to the vertical tension of the polishing tape.
This makes it easier for the polishing tape to enter the notch portion formed in the workpiece, increases the area in contact with the surface to be polished of the workpiece, and improves the polishing efficiency. Easy to supply.
In this invention, you may make it have a backup means which presses the polishing tape hung on a pair of support roll toward the workpiece | work from the back surface side of the said polishing tape.
In this way, the polishing tape is backed up from the back side according to the shape of the part to be polished of the workpiece.
As described above, the present invention is also characterized by the tape polishing means itself, and therefore may be a single polishing apparatus using such a polishing mechanism.

本発明に係る研削・研磨複合加工装置は、研削ステージと研磨ステージとをワークの搬送手段とともに一体化したので、これらの複数の加工を一台の装置で可能になる。
研磨手段として、研磨テープを掛架した一対の支持ロールを旋回あるいは、この一対の支持ロールの第１及び第２ロールをワークに対して、それぞれ前進，後退移動制御したので、ワークの被研磨面の形状に倣うように研磨できるので、従来のコンタクト部品等が不要で、シンプルな構造で有りながら研磨の均一性に優れる。 In the combined grinding / polishing apparatus according to the present invention, the grinding stage and the polishing stage are integrated with the workpiece transfer means, so that a plurality of these processes can be performed with one apparatus.
As a polishing means, a pair of support rolls around which a polishing tape is hung are swiveled or the first and second rolls of the pair of support rolls are controlled to move forward and backward with respect to the work, respectively. Since it can be polished so as to follow the shape of the above, conventional contact parts or the like are unnecessary, and the polishing uniformity is excellent while having a simple structure.

本発明に係る研削・研磨複合加工装置の構成例を示す。1 shows a configuration example of a combined grinding and polishing apparatus according to the present invention. （ａ）は研削ステージに設けた研削手段の例を示す。（ｂ），（ｃ）は研削加工により成形した基板の端面形状例を示す。(A) shows the example of the grinding means provided in the grinding stage. (B), (c) shows the example of the end surface shape of the board | substrate shape | molded by the grinding process. 研磨ステージに設けた一対の支持ロールの旋回手段の動きの例を（ａ）〜（ｃ）に示す。Examples of the movement of the swivel means of the pair of support rolls provided on the polishing stage are shown in (a) to (c). 旋回機構（旋回手段）をワークから後退させた状態を示す。The state which turned the turning mechanism (turning means) from the workpiece | work is shown. 旋回手段の動きを図３（ａ）〜（ｃ）に対応させて拡大した拡大図を示す。The enlarged view which expanded the motion of the turning means corresponding to Fig.3 (a)-(c) is shown. 一対の支持ロールの移動制御の例を（ａ）〜（ｃ）に示す。Examples of movement control of the pair of support rolls are shown in (a) to (c). （ａ）は研磨テープの接触部位を中心からずらした例、（ｂ）はテンションローラにて押圧する例を示す。(A) shows the example which shifted the contact site | part of the polishing tape from the center, (b) shows the example pressed with a tension roller. （ａ）研磨テープをワークに対して上下方向に配置した例、（ｂ）は左右方向に傾斜させた例を示す。(A) The example which has arrange | positioned the polishing tape up and down with respect to the workpiece | work, (b) shows the example inclined in the left-right direction. ワークのノッチ部を研磨する例を示し、（ａ）は研磨テープを斜めに動かした例、（ｂ）はバックアップした例を示す。An example in which the notch portion of the workpiece is polished is shown, (a) shows an example in which the polishing tape is moved obliquely, and (b) shows an example in which backup is performed. （ａ），（ｂ）は旋回機構とリンク機構とを組み合せた例を示す。(A), (b) shows the example which combined the turning mechanism and the link mechanism. バックアップローラーを備えた例を示す。An example with a backup roller is shown. （ａ）は方形基板の研削例を示し、（ｂ）は外形形状例を示す。(A) shows an example of grinding a rectangular substrate, and (b) shows an example of an outer shape. 従来のテープ研磨の例を示す。An example of conventional tape polishing will be described.

本発明に係る研削・研磨複合加工装置（以下、本装置と称する。）１００の構成例を図１に示す。
本装置１００は、ワークを研削加工するための研削ステージ１０と、研磨加工するための研磨ステージ２０と、研削ステージ１０から研磨ステージ２０にワークを搬送するための搬送システム３０とを備える。
本実施例に係る搬送システム３０は、ワークをハンドリングする例えば、吸着パッド等を備えた第１ハンド３３ａ，第２ハンド３３ｂを有し、第１ハンド３３ａは図１にて上下方向に移動制御する第１Ｘレール３１ａと、左右方向に移動制御する第１Ｙレール３２ａを有する。
第２ハンド３３ｂも同様に第２Ｘレール３１ｂと、第２Ｙレール３２ｂにより、Ｘ−Ｙ方向が移動制御されている。
基板等のワークは、原材料ストックヤード（第１ストックヤード）３４に外部から供給され、第１ハンド３３ａによりワークを研削ステージ１０に搬送し、研削加工後に第２ストックヤード３５に搬送される。
第２ストックヤード３５のワークは、第１ハンド３３ａ又は第２ハンド３３ｂにてハンドリングされ、第３ストックヤード３６に移送される。
第２ハンド３３ｂは、第３ストックヤード３６から研削済みのワークを引き取り、研磨ステージ２０にて研磨し、研磨加工後の完成品ストックヤード（第４ストックヤード）３７に搬送され、次工程に搬出される。
本実施例は、Ｘ−Ｙレールによりワーク搬送を行う例になっているが、本発明において搬送システムに制限がなく、例えばロボットハンドを用いてもよい。
このように、研削ステージと研磨ステージとを複合化したことによりワークの搬送及び位置決めが容易になるだけでなく、研削、研磨時に使用するクーラント系統の共通化が可能である。 FIG. 1 shows an example of the configuration of a grinding / polishing composite processing apparatus (hereinafter referred to as the present apparatus) 100 according to the present invention.
The apparatus 100 includes a grinding stage 10 for grinding a workpiece, a polishing stage 20 for grinding, and a conveyance system 30 for conveying the workpiece from the grinding stage 10 to the polishing stage 20.
The transport system 30 according to the present embodiment includes, for example, a first hand 33a and a second hand 33b provided with suction pads and the like for handling a workpiece, and the first hand 33a is controlled to move up and down in FIG. It has the 1st X rail 31a and the 1st Y rail 32a which carries out movement control in the left-right direction.
Similarly, the movement of the second hand 33b in the XY direction is controlled by the second X rail 31b and the second Y rail 32b.
A workpiece such as a substrate is supplied to the raw material stock yard (first stock yard) 34 from the outside, and the workpiece is conveyed to the grinding stage 10 by the first hand 33a, and is conveyed to the second stock yard 35 after grinding.
The work in the second stock yard 35 is handled by the first hand 33 a or the second hand 33 b and transferred to the third stock yard 36.
The second hand 33b picks up the ground workpiece from the third stock yard 36, polishes it on the polishing stage 20, transports it to the finished product stock yard (fourth stock yard) 37 after polishing, and carries it out to the next process. Is done.
The present embodiment is an example in which the workpiece is transferred by the XY rail, but in the present invention, the transfer system is not limited, and for example, a robot hand may be used.
Thus, by combining the grinding stage and the polishing stage, not only can the workpiece be conveyed and positioned easily, but also the coolant system used during grinding and polishing can be shared.

図２は、研削ステージ１０に備えた研削手段の例を示す。
ワーク１を回転保持する回転テーブル１１と、ワークを研削する砥石１２とを有する。
回転テーブル１１は、吸引孔等のワーク１の保持手段を有し、駆動部１１ａにて回転制御されている。
砥石１２は、砥石軸１３により駆動系に連結され、高速回転制御されている。
また、砥石１２はワークに対する前進・後退、上下方向及び傾きが制御されている。
また、砥石は取り替え又は複数備えることで粗研削，中研削，仕上げ研削等の切り替えができる。
図２（ｂ），（ｃ）にワーク（基板）１の端面の面取り研削の例を示す。
基板の用途，要求品質等により、（ｂ）のように端面１ｃに対するＣ面取り部１ａ，１ｂが同程度のものの他に、（ｃ）に示すようにＣ面取り部の大きさが１ａと１ｂとで相異するものもある。
また、ワーク１の端部にＶノッチ等のノッチ部を形成することもある。
本発明に係る研磨手段を用いると、このような複雑な形状に研削成形した部分の研磨も可能である。 FIG. 2 shows an example of grinding means provided in the grinding stage 10.
A rotary table 11 that rotates and holds the workpiece 1 and a grindstone 12 that grinds the workpiece are provided.
The turntable 11 has a holding means for the work 1 such as a suction hole, and the rotation of the turntable 11 is controlled by a drive unit 11a.
The grindstone 12 is connected to a drive system by a grindstone shaft 13 and is controlled to rotate at high speed.
Further, the grindstone 12 is controlled to advance / retreat, the vertical direction, and the inclination with respect to the workpiece.
In addition, by replacing or providing a plurality of grindstones, switching between rough grinding, intermediate grinding, finish grinding, and the like can be performed.
2B and 2C show examples of chamfering grinding of the end surface of the workpiece (substrate) 1. FIG.
Depending on the use and required quality of the substrate, the C chamfered portions 1a and 1b with respect to the end surface 1c are similar in size as shown in (b), and the size of the C chamfered portions is 1a and 1b as shown in (c). Some are different.
Further, a notch portion such as a V notch may be formed at the end of the work 1.
When the polishing means according to the present invention is used, it is possible to polish a portion that has been ground and formed into such a complicated shape.

図３〜図５に、研磨ステージ２０に備えた研磨手段の第１の実施例を示す。
ターンテーブル２１が駆動部２１ａにて回転制御され、ターンテーブル上にワーク１を吸着保持する。
このワーク１に対して、近接及び離間制御された基部２９と、これに連結した旋回アーム２２を有する。
旋回アーム２２は、要部のみを模式的に表してあり、基部２９から図示を省略した支持部材等にてサーボモータ等の駆動部を取り付け、旋回中心Ｏ廻りに旋回制御されている。
旋回アーム２２の両端部には、第１支持ロール２３と第２支持ロール２４とからなる一対の支持ロールを有する。
研磨テープ２は、リール２６から送りロール２５で送り出し、この一対の支持ロール２３，２４に掛け渡し、引きロール２７を介してリール２８側に戻される。
この際に、送りロール２５と引きロール２７の調整により、研磨テープ２に所定の張力がかかるように張設されている。
図３（ａ）〜（ｃ）に対応させて、拡大図を図５（ａ）〜（ｃ）に示した。
これにより、旋回アーム２２を研磨テープ２が研削面に倣うように旋回させることで基板の端面の研削形状に合せて研磨できる。
旋回速度は、サーボモータにより制御されており、端面の形状や部位により研磨時間を調整できる。
研磨テープは、１０μｍ以下の微粒子をポリエステル・ウレタン樹脂等と混合し、テープ基材上に塗布した固定砥粒研磨材である。
砥粒には、ホワイトアルミナ，グリーンカーボンランダム，ダイヤモンド等、各種材料が提案され、基板（ワーク）の材質により選定される。
研磨テープ２は、一対の支持ロール間に張設されているが、図３（ａ）〜（ｃ）にて旋回アーム２２が旋回される際に均一の接触圧がワーク１に加わるのが好ましい。
そこで、ワーク１の端面の上下中央部を旋回中心Ｏの位置に対応させてもよい。
また、図７に示すように研磨テープ２のワーク１に接触する位置を旋回中心よりも上部側、あるいは下部側にずらしてもよい。
このようにすると、研磨テープ２の旋回中にテープ面の砥粒がワーク１の接触面に沿って移動しながら研磨することになり、研磨量が増す。 3 to 5 show a first embodiment of the polishing means provided in the polishing stage 20.
The turntable 21 is rotationally controlled by the drive unit 21a, and holds the workpiece 1 by suction on the turntable.
The workpiece 1 has a base 29 that is controlled to approach and separate from the workpiece 1 and a swivel arm 22 connected thereto.
Only the main part of the turning arm 22 is schematically shown, and a drive part such as a servo motor is attached from the base 29 by a support member (not shown) and the turn is controlled around the turning center O.
At both ends of the turning arm 22, a pair of support rolls including a first support roll 23 and a second support roll 24 are provided.
The polishing tape 2 is fed from the reel 26 by the feed roll 25, is passed over the pair of support rolls 23 and 24, and is returned to the reel 28 side through the pull roll 27.
At this time, the polishing tape 2 is stretched so that a predetermined tension is applied by adjusting the feeding roll 25 and the pulling roll 27.
Corresponding to FIGS. 3A to 3C, enlarged views are shown in FIGS. 5A to 5C.
Thereby, it can grind | polish according to the grinding shape of the end surface of a board | substrate by turning the turning arm 22 so that the polishing tape 2 may follow a grinding surface.
The turning speed is controlled by a servo motor, and the polishing time can be adjusted by the shape and part of the end face.
The abrasive tape is a fixed abrasive abrasive in which fine particles of 10 μm or less are mixed with a polyester / urethane resin or the like and applied onto a tape substrate.
Various materials such as white alumina, green carbon random, and diamond have been proposed for the abrasive grains, and are selected according to the material of the substrate (workpiece).
Although the polishing tape 2 is stretched between a pair of support rolls, it is preferable that a uniform contact pressure is applied to the workpiece 1 when the turning arm 22 is turned in FIGS. .
Therefore, the upper and lower central portions of the end surface of the work 1 may correspond to the position of the turning center O.
Further, as shown in FIG. 7, the position of the polishing tape 2 that contacts the workpiece 1 may be shifted to the upper side or the lower side from the turning center.
If it does in this way, it will grind | polish, while the abrasive grain of a tape surface moves along the contact surface of the workpiece | work 1 during rotation of the polishing tape 2, and a grinding | polishing amount increases.

このように研磨テープ２を張設したので、研磨テープ２の送り速度の調整や、一時停止等が容易である。
また、図４に示すように、一旦ワーク１から後退させることも容易である。 Since the polishing tape 2 is stretched in this way, it is easy to adjust the feed speed of the polishing tape 2 or to temporarily stop it.
Further, as shown in FIG. 4, it is easy to retract the workpiece 1 once.

図６に研磨手段の第２の実施例を示し、旋回アームを用いることなく、第１支持ロール１２３と第２支持ロール１２４とをそれぞれ独立して前進及び後退制御してもよい。
この場合も図６（ａ）に示すように、第１支持ロール１２３と第２支持ロール１２４間の研磨テープ２にかかる張力を調整しながら、（ａ）では第１支持ロール１２３を第２支持ロール１２４より相対的に前進させ、上側の研削面１ａを研磨し、その後に連続的に（ｂ），（ｃ）に示すように第１支持ロール１２３を後退させながら第２支持ロール１２４を前進させることで、順次基板の端面を倣うようにして研磨できる。
図７（ｂ）には、第１支持ロール２２３と第２支持ロール２２４とを固定し、テンションロール２２３ａを前進，後退移動することで、第１，第２支持ロールの相対移動と同様にすることもできる。
また、図１０に示すように駆動盤４１と従動盤４２にて、一対の第１リンク４３と第２リンク４４とを保持した例を示す。
第１リンク４３の後部側と第２リンク４４の後部側とをそれぞれ旋回制御された駆動盤４１に対向して軸部４１ｂ，４１ｃにて軸着し、第１リンク４３及び第２リンク４４の途中を従動盤４２に対向した軸部４２ｂ，４２ｃにて軸着してある。
一対のリンクの先端側には、一対の支持ローラ４３ａ，４４ａが取り付けられている。
駆動盤４１は、サーボモータと軸連結４１ａしてあり、サーボモータの旋回制御により一対の支持ローラ４３ａ，４４ａが相互に前進，後退移動する。
研磨テープ２は、一対のリンクの先の一対の支持ローラ４３ａ，４４ａ及び補助ローラ４３ｂ，４４ｂ及びテンションローラ２５ａにて張設されている。
本実施例は、旋回機構とリンク機構を組み合せることで、駆動部品とワークとの距離を長くすることができ、ワークの旋回時に駆動部品との干渉を避けることができる。 FIG. 6 shows a second embodiment of the polishing means, and the first support roll 123 and the second support roll 124 may be independently advanced and retracted without using a pivot arm.
Also in this case, as shown in FIG. 6A, while adjusting the tension applied to the polishing tape 2 between the first support roll 123 and the second support roll 124, in FIG. Relatively move forward from the roll 124, polish the upper grinding surface 1a, and then advance the second support roll 124 while continuously retracting the first support roll 123 as shown in (b) and (c). By doing so, polishing can be performed so as to follow the end face of the substrate sequentially.
In FIG. 7B, the first support roll 223 and the second support roll 224 are fixed, and the tension roll 223a is moved forward and backward so that the relative movement of the first and second support rolls is achieved. You can also.
Further, as shown in FIG. 10, an example in which a pair of first links 43 and second links 44 are held by a drive panel 41 and a driven panel 42 is shown.
The rear side of the first link 43 and the rear side of the second link 44 are respectively mounted on the shaft portions 41 b and 41 c so as to face the drive panel 41 controlled to turn, and the first link 43 and the second link 44 are connected to each other. Along the way, shafts 42b, 42c facing the driven board 42 are attached.
A pair of support rollers 43a and 44a are attached to the distal ends of the pair of links.
The drive board 41 has a shaft connection 41a with the servo motor, and the pair of support rollers 43a and 44a move forward and backward relative to each other by turning control of the servo motor.
The polishing tape 2 is stretched by a pair of support rollers 43a and 44a, auxiliary rollers 43b and 44b, and a tension roller 25a at the end of a pair of links.
In this embodiment, by combining the turning mechanism and the link mechanism, the distance between the drive component and the workpiece can be increased, and interference with the drive component can be avoided when the workpiece is turned.

本発明においては、図８に示すように研磨テープ２を（ａ）から（ｂ）の傾斜させた状態に回転させる傾斜制御手段を設けてもよい。
（ｂ）に示したように、研磨テープを傾斜させると接触面積が増し、研磨効率が向上する。
また、図９に示すように研磨テープ２を斜めに旋回すると、ワーク１に形成されたＶノッチ等のノッチ部１ｄの内部に研磨テープ２が折れ曲がるように入り込みやすくなる。 In the present invention, as shown in FIG. 8, an inclination control means for rotating the polishing tape 2 from (a) to (b) may be provided.
As shown in (b), when the polishing tape is tilted, the contact area is increased and the polishing efficiency is improved.
In addition, when the polishing tape 2 is turned obliquely as shown in FIG. 9, the polishing tape 2 is likely to be bent into the notch portion 1 d such as a V notch formed in the workpiece 1.

本発明においては、研磨テープの接触圧を一対の支持ロール間の張設力にて調整したが、例えばエアーを注入した袋体等の弾力材を用いて研磨テープの裏面側からバックアップしてもよい。
また、図９（ｂ）に示すように自在に回転するバックアップローラ５０の外周部に弾性体５１を装着し、研磨テープ２の裏面からワークに向けて押圧（バックアップ）すると、ワーク１のノッチ部１ｄの研磨もしやすくなる。
図１１には、バックアップローラー５０のバックアップ力をスプリング等のバックアップ弾性手段５２にて調整可能にした例を示す。 In the present invention, the contact pressure of the polishing tape is adjusted by the tension between the pair of support rolls. However, for example, a backing material such as a bag body into which air is injected may be used to back up from the back side of the polishing tape.
Further, as shown in FIG. 9B, when the elastic body 51 is attached to the outer periphery of the backup roller 50 that freely rotates and pressed (backed up) from the back surface of the polishing tape 2 toward the workpiece, the notch portion of the workpiece 1 It becomes easy to polish 1d.
FIG. 11 shows an example in which the backup force of the backup roller 50 can be adjusted by the backup elastic means 52 such as a spring.

本発明の対象となるワーク形状も円形のみならず、図１２に示した方形基板等、各種形状のワークに対しても極座標制御することで対応ができる。   The workpiece shape that is the subject of the present invention is not limited to a circular shape, but can also cope with workpieces of various shapes such as a rectangular substrate shown in FIG. 12 by controlling the polar coordinates.

１０ 研削ステージ
１１ 回転テーブル（回転保持手段）
１２ 砥石
１３ 砥石軸
２０ 研磨ステージ
２２ 旋回アーム
２３ 第１支持ロール
２４ 第２支持ロール
２９ 基部
３０ 搬送システム
４１ 駆動盤
４２ 従動盤
４３ 第１リンク
４４ 第２リンク
１００ 研削・研磨複合加工装置 10 Grinding stage 11 Rotary table (Rotation holding means)
12 grinding wheel 13 grinding wheel shaft 20 grinding stage 22 revolving arm 23 first support roll 24 second support roll 29 base 30 transport system 41 drive board 42 driven board 43 first link 44 second link 100

Claims (7)

ワークを研削加工するための研削ステージと、研磨加工するための研磨ステージと、前記研削ステージから研磨ステージへのワーク搬送手段とを備え、
前記研磨ステージは研磨テープを用いたテープ研磨手段を有することを特徴とする研削・研磨複合加工装置。 A grinding stage for grinding the workpiece, a polishing stage for grinding, and a workpiece transfer means from the grinding stage to the polishing stage,
The grinding / polishing composite processing apparatus, wherein the polishing stage has a tape polishing means using a polishing tape. 前記テープ研磨手段は、研磨テープを掛架した一対の支持ロールと、前記一対の支持ロールに掛架した研磨テープをワークの被研磨面に沿って倣うように前記一対の支持ロールを旋回させるための旋回手段又は前記一対の支持ロールをワークに向けて相対移動させるための移動制御手段を有することを特徴とする請求項１記載の研削・研磨複合加工装置。   The tape polishing means rotates the pair of support rolls so that the pair of support rolls on which the polishing tape is hung and the polishing tape hung on the pair of support rolls follow the surface to be polished of the workpiece. 2. The combined grinding / polishing apparatus according to claim 1, further comprising movement control means for relatively moving the swiveling means or the pair of support rolls toward the workpiece. 前記一対の支持ロールは研磨テープの研磨面がワークの被研磨面に対して左右方向斜めに当接するように傾斜させるための傾斜制限手段を有することを特徴とする請求項２記載の研削・研磨複合加工装置。   3. The grinding / polishing according to claim 2, wherein the pair of support rolls have inclination limiting means for inclining the polishing surface of the polishing tape so that the polishing surface of the workpiece is in contact with the surface to be polished obliquely in the horizontal direction. Compound processing equipment. 前記一対の支持ロールに掛架した研磨テープを当該研磨テープの裏面側からワークに向けて押圧するバックアップ手段を有することを特徴とする請求項２記載の研削・研磨複合加工装置。   3. The combined grinding and polishing apparatus according to claim 2, further comprising backup means for pressing the polishing tape hung on the pair of support rolls toward the workpiece from the back side of the polishing tape. 研磨テープを掛架した一対の支持ロールと、前記一対の支持ロールに掛架した研磨テープをワークの被研磨面に沿って倣うように前記一対の支持ロールを旋回させるための旋回手段又は前記一対の支持ロールをワークに向けて相対移動させるための移動制御手段を有することを特徴とする研磨装置。   A pair of support rolls on which a polishing tape is hung and swiveling means for swiveling the pair of support rolls so as to follow the polishing tape hung on the pair of support rolls along the surface to be polished of the workpiece or the pair A polishing apparatus comprising a movement control means for relatively moving the support roll toward the workpiece. 前記一対の支持ロールは研磨テープの研磨面がワークの被研磨面に対して左右方向斜めに当接するように傾斜させるための傾斜制限手段を有することを特徴とする請求項５記載の研磨装置。   6. The polishing apparatus according to claim 5, wherein the pair of support rolls have inclination limiting means for inclining the polishing surface of the polishing tape so that the polishing surface of the workpiece is in contact with the surface to be polished obliquely in the left-right direction. 前記一対の支持ロールに掛架した研磨テープを当該研磨テープの裏面側からワークに向けて押圧するバックアップ手段を有することを特徴とする請求項５記載の研磨装置。   6. The polishing apparatus according to claim 5, further comprising backup means for pressing the polishing tape hung on the pair of support rolls toward the workpiece from the back side of the polishing tape.
JP2016232807A 2016-01-12 2016-11-30 Grinding / polishing combined processing equipment and polishing equipment Active JP6851068B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201720030271.0U CN206455519U (en) 2016-01-12 2017-01-11 Grinding/grinding complex machining device and lapping device
KR1020170005369A KR102637724B1 (en) 2016-01-12 2017-01-12 Grinding·polishing combined apparatus, and polishing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016003893 2016-01-12
JP2016003893 2016-01-12

Publications (2)

Publication Number Publication Date
JP2017124484A true JP2017124484A (en) 2017-07-20
JP6851068B2 JP6851068B2 (en) 2021-03-31

Family

ID=59365240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016232807A Active JP6851068B2 (en) 2016-01-12 2016-11-30 Grinding / polishing combined processing equipment and polishing equipment

Country Status (4)

Country Link
JP (1) JP6851068B2 (en)
KR (1) KR102637724B1 (en)
CN (1) CN206455519U (en)
TW (1) TWM546882U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022036498A (en) * 2020-08-24 2022-03-08 株式会社サンシン Polishing robot device
CN114523362A (en) * 2022-03-02 2022-05-24 安徽省久久门窗有限公司 Intelligence aluminum alloy window frame processing is with cutting port grinding device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114589570B (en) * 2022-03-29 2023-08-25 南通海峰家居用品有限公司 A corner grinding device for metal door and window production
CN115771183B (en) * 2022-11-24 2023-05-26 江西麦丹永明木业有限公司 Cutting device and method for ecological furniture board production

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6243832B2 (en) * 1981-02-03 1987-09-17 Shibayama Kikai Kk
JP2009039853A (en) * 2007-07-18 2009-02-26 Ebara Corp Polishing device
JP2010023119A (en) * 2008-07-15 2010-02-04 Okamoto Machine Tool Works Ltd Flattening device and flattening method for semiconductor substrate
JP2012045629A (en) * 2010-08-24 2012-03-08 Kakihara Kogyo Kk Apparatus for polishing part line of resin molding and method of polishing the same
JP2012111012A (en) * 2010-11-26 2012-06-14 Ebara Corp Method of polishing substrate using polishing tape having fixed abrasive

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59129654A (en) * 1983-01-06 1984-07-26 Takegawa Tekko Kk Both side surface type grinding belt sander
JP5379607B2 (en) 2009-08-27 2013-12-25 株式会社サンシン Polishing method and apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6243832B2 (en) * 1981-02-03 1987-09-17 Shibayama Kikai Kk
JP2009039853A (en) * 2007-07-18 2009-02-26 Ebara Corp Polishing device
JP2010023119A (en) * 2008-07-15 2010-02-04 Okamoto Machine Tool Works Ltd Flattening device and flattening method for semiconductor substrate
JP2012045629A (en) * 2010-08-24 2012-03-08 Kakihara Kogyo Kk Apparatus for polishing part line of resin molding and method of polishing the same
JP2012111012A (en) * 2010-11-26 2012-06-14 Ebara Corp Method of polishing substrate using polishing tape having fixed abrasive

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022036498A (en) * 2020-08-24 2022-03-08 株式会社サンシン Polishing robot device
CN114178949A (en) * 2020-08-24 2022-03-15 株式会社三信 Grinding robot device
JP7111778B2 (en) 2020-08-24 2022-08-02 株式会社サンシン Polishing robot device
CN114178949B (en) * 2020-08-24 2024-02-06 株式会社三信 Grinding robot device
CN114523362A (en) * 2022-03-02 2022-05-24 安徽省久久门窗有限公司 Intelligence aluminum alloy window frame processing is with cutting port grinding device

Also Published As

Publication number Publication date
KR102637724B1 (en) 2024-02-15
CN206455519U (en) 2017-09-01
KR20170084704A (en) 2017-07-20
JP6851068B2 (en) 2021-03-31
TWM546882U (en) 2017-08-11

Similar Documents

Publication Publication Date Title
JP6459524B2 (en) Composite grinding machine and grinding method
US7238087B1 (en) Planarizing device and a planarization method for semiconductor substrates
US6685539B1 (en) Processing tool, method of producing tool, processing method and processing apparatus
TWI585838B (en) Method of polishing back surface of substrate and substrate processing apparatus
KR20230016590A (en) Method of grinding hard wafer
JP6851068B2 (en) Grinding / polishing combined processing equipment and polishing equipment
JP2015150642A (en) Grinding and polishing device
KR20000076987A (en) Method and apparatus for grinding a workpiece
JP4487353B2 (en) Polishing apparatus and polishing method
JP5898982B2 (en) Grinding equipment
JP2010042453A (en) Dicing device and blade distal end shape forming method
WO2021117324A1 (en) Processing unit and substrate processing device
JP3323435B2 (en) Grinding method for double-sided grinding of thin workpiece
JP2022095979A (en) Polishing unit
JPH1148107A (en) Method and device for grinding both side
JP2001138230A (en) Method for grinding face side and reverse side of substrate, and grinding apparatus used therefor
JP5231107B2 (en) Wafer grinding method
JP4477974B2 (en) Polishing equipment
CN210115769U (en) Chamfer grinding device
JP5484172B2 (en) Method for forming tapered surface of polishing pad
JPH06246624A (en) Both side polishing device
JPH11320395A (en) Grinding system
JP2001038588A (en) Method and device for grinding work
JP7154690B2 (en) Grinding wheel dressing method
JP2001150311A (en) Circumference processing method and processing device for thin disc

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20191003

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20201007

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20201109

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210106

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210224

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210302

R150 Certificate of patent or registration of utility model

Ref document number: 6851068

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250