CN114178949B - Grinding robot device - Google Patents
Grinding robot device Download PDFInfo
- Publication number
- CN114178949B CN114178949B CN202110743545.1A CN202110743545A CN114178949B CN 114178949 B CN114178949 B CN 114178949B CN 202110743545 A CN202110743545 A CN 202110743545A CN 114178949 B CN114178949 B CN 114178949B
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- China
- Prior art keywords
- polishing
- belt
- workpiece
- holding
- unit
- Prior art date
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- 238000005498 polishing Methods 0.000 claims abstract description 233
- 238000004804 winding Methods 0.000 claims 3
- 239000012636 effector Substances 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 description 20
- 239000006061 abrasive grain Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 11
- 238000007517 polishing process Methods 0.000 description 11
- 238000002788 crimping Methods 0.000 description 7
- 239000004744 fabric Substances 0.000 description 7
- 239000000314 lubricant Substances 0.000 description 6
- 239000002131 composite material Substances 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 210000000707 wrist Anatomy 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
- B24B21/22—Accessories for producing a reciprocation of the grinding belt normal to its direction of movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/005—Manipulators for mechanical processing tasks
- B25J11/0065—Polishing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Manipulator (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The present invention relates to a polishing robot device. The end effector of the articulated robot is configured to use a polishing unit, which can cope with various types and has a higher versatility than a dedicated machine, and can ensure flexibility and expansion of use, and the polishing unit is provided with a belt conveying mechanism and a pressure bonding mechanism, so that the workpiece can be polished by pressure bonding of the polishing surface of the polishing belt to the workpiece. The device is provided with: a multi-joint robot; a polishing unit which is mounted on the front end of the multi-joint robot and polishes the polished surface of the workpiece; and a synchronization control unit that synchronously controls the multi-joint robot and the polishing unit, wherein the polishing unit includes: a polishing belt for polishing a surface to be polished of the workpiece; a belt conveying mechanism for continuously or intermittently conveying the abrasive belt; and a pressure-bonding mechanism for pressure-bonding the polishing surface of the polishing belt to the surface to be polished of the workpiece.
Description
Technical Field
The present invention relates to a polishing robot device used for polishing the surface of a plate-like member such as a liquid crystal panel, a glass plate, a lens, a semiconductor wafer, a copper plate, a printed board, a filter, or a stainless steel plate, and chamfering the corner edges.
Background
Conventionally, as a device for polishing a workpiece such as a glass plate or a semiconductor wafer, for example, a special machine having the following structure is known: a polishing tape obtained by bonding fixed abrasive grains having a predetermined particle size such as alumina to a base material such as a polyester film is used.
Prior art literature
Patent literature
Patent document 1: japanese patent No. 6673965
Patent document 2: japanese patent laid-open No. 11-99458
Patent document 3: japanese patent laid-open No. 11-99459
Disclosure of Invention
Technical problem to be solved by the invention
However, in the case of the above-described existing structure, there are, for example, the following drawbacks: the flexibility of application and the expansion cannot be ensured because the type and the specifications of various processed objects such as semiconductor wafers, liquid crystal panels, glass plates, lenses, copper plates, printed boards, optical filters, stainless steel plates and the like cannot be flexibly dealt with.
Solution for solving the technical problems
The present invention aims to overcome the above-described drawbacks, and in the present invention, the first aspect of the invention is characterized by comprising: a multi-joint robot; a polishing unit which is attached to the front end of the articulated robot and polishes a surface to be polished of a workpiece; and a synchronization control unit that performs synchronization control of the articulated robot and the polishing unit, the polishing unit including: a polishing belt for polishing a surface to be polished of the workpiece; a belt conveying mechanism for continuously or intermittently conveying the abrasive belt; and a pressure-bonding mechanism for pressure-bonding the polishing surface of the polishing belt to the surface to be polished of the workpiece.
The invention according to the second aspect is characterized in that the articulated robot is a vertical articulated robot, and the invention according to the third aspect is characterized by comprising a swinging mechanism that swings the polishing belt in a belt width direction orthogonal to a belt conveying direction, and the invention according to the fourth aspect is characterized in that the pressure bonding mechanism comprises a pressure bonding member capable of guiding the polishing belt to turn back, and in that the polishing structure of the polishing unit is a dry structure or a wet structure.
The sixth aspect of the present invention is characterized by comprising: a holding unit configured to hold and release the workpiece; and a synchronization control unit that synchronously controls the multi-joint robot, the polishing unit, and the holding unit.
In the seventh aspect of the invention, the holding portion includes: a holding member configured to hold the workpiece; and a holding mechanism capable of holding and releasing the workpiece, wherein the negative pressure suction mechanism is used as the holding mechanism, and wherein the holding member is horizontally rotatably provided, a mounting surface capable of mounting the workpiece is provided on an upper surface of the holding member, and a horizontal rotation mechanism for continuously or intermittently rotating the holding member is provided in the present invention.
Effects of the invention
As described above, according to the first aspect of the present invention, a polishing unit for polishing a surface to be polished of a workpiece is attached to a front end of a multi-joint robot, and the multi-joint robot and the polishing unit can be synchronously controlled by a synchronous control unit, and the surface to be polished of the workpiece can be polished by the polishing unit, the polishing unit comprising: a polishing belt for polishing a surface to be polished of the workpiece; a belt conveying mechanism for continuously or intermittently conveying the abrasive belt; and a pressure-bonding structure for pressing the polishing surface of the polishing belt against the surface to be polished of the object to be polished, whereby the object to be polished can be polished by controlling the posture and position of the polishing means at the front end of the multi-joint robot, by conveying the polishing belt by the belt conveying means, and by pressing the polishing surface of the polishing belt against the surface to be polished by the pressure-bonding means, and by configuring the end effector of the multi-joint robot to be a structure of the polishing means, various types and specifications of the object to be polished can be flexibly handled, and versatility can be higher than that of a dedicated machine, flexibility and expansion of application can be ensured, and the polishing means is provided with the belt conveying means and the pressure-bonding means, whereby the object to be polished can be polished by pressing the polishing surface of the polishing belt against the surface to be polished, whereby the polishing accuracy and the surface roughness of the polishing surface can be improved by the interaction between the conveying of the polishing belt and the pressure bonding of the belt, and good polishing can be performed.
In the second aspect of the invention, since the articulated robot is a vertical articulated robot, the front end of the robot can be moved widely in the vertical plane by a structure having a plurality of joints (shafts) and the joints and links being connected in series vertically, and the workability and flexibility of polishing can be improved, and in the third aspect of the invention, since the swing mechanism for swinging the polishing belt in the belt width direction orthogonal to the belt conveying direction is provided, the polishing belt can be swung in the belt width direction, and thus, the polishing precision and the surface roughness of the polishing surface can be further improved by the interaction between the conveying of the polishing belt, the pressing of the polishing belt, and the swinging action, and the polishing can be performed well, in the fourth aspect of the invention, since the pressure-bonding mechanism is provided with the pressure-bonding member capable of guiding the polishing belt to turn back, the polishing surface of the polishing belt can be reliably pressed against the surface to be polished of the workpiece, and smooth and satisfactory polishing can be performed, and in the fifth aspect of the invention, since the polishing structure of the polishing means is a dry structure or a wet structure, it is possible to select, according to the material of the workpiece or the specification of the polishing, a dry polishing structure using a polishing belt having a structure in which fixed abrasive grains are fixed to a base material and no lubricant is used, a wet polishing structure using a polishing belt having a structure in which fixed abrasive grains are fixed to a base material and polishing is performed while supplying a lubricant, or a woven cloth, a nonwoven fabric, a foam film, a film, or the like, in which fixed abrasive grains are not fixed to the base material, the flocked cloth is used as a polishing belt and is supplied with a wet polishing structure containing polishing agent containing free abrasive grains, so that the flexibility of polishing processing can be improved, and accordingly, good polishing processing can be performed.
In the sixth aspect of the present invention, there is provided: a holding unit configured to hold and release the workpiece; and a synchronization control unit that performs synchronization control of the multi-joint robot, the polishing unit, and the holding unit, whereby the workpiece can be reliably held and released by the holding unit, and the multi-joint robot, the polishing unit, and the holding unit can be synchronously controlled by the synchronization control unit, thereby enabling good polishing.
In the seventh aspect of the invention, the holding portion includes: a holding member configured to hold the workpiece; and a holding mechanism capable of holding and releasing the workpiece, whereby the workpiece can be held and released reliably by the holding member, and the workpiece can be held and released reliably by the holding mechanism to the holding member, and in the eighth aspect of the invention, since the negative pressure suction mechanism is used as the holding mechanism, the workpiece can be held reliably by the holding member, and the holding mechanism can be simplified in structure, and in the ninth aspect of the invention, the holding member is rotatably provided horizontally, the holding member is provided on the upper surface thereof with a mounting surface on which the workpiece can be mounted, and in the invention, a horizontal turning mechanism for continuously or intermittently turning the holding member is provided, and in addition to various operations of the multi-joint robot, the flexibility of the grinding of the workpiece can be improved by the continuous or intermittent turning operation of the holding member formed by the horizontal turning mechanism, and the variety of the various workpiece can be flexibly handled or various kinds of the special-purpose and the flexibility can be ensured, and the flexibility can be increased compared with the machine and the specifications can be increased.
Drawings
Fig. 1 is an exploded perspective view of an embodiment of the present invention.
Fig. 2 is a partial side cross-sectional view of an embodiment example of the present invention.
Fig. 3 is a partial front cross-sectional view of an embodiment example of the present invention.
Fig. 4 is a partial side cross-sectional view of an embodiment example of the present invention.
Fig. 5 is a partial side cross-sectional view of an embodiment example of the present invention.
Fig. 6 is a partial front cross-sectional view of an embodiment example of the present invention.
Fig. 7 is a partial top cross-sectional view of an embodiment example of the present invention.
Fig. 8 is a partial top cross-sectional view of an embodiment example of the present invention.
Fig. 9 is a partial perspective view of an embodiment example of the present invention.
Fig. 10 is a side cross-sectional view of a processed state of an embodiment example of the present invention.
Fig. 11 is a side cross-sectional view of a processed state of an embodiment example of the present invention.
Fig. 12 is a side cross-sectional view of a processed state of an embodiment example of the present invention.
Fig. 13 is a front cross-sectional view of a processing state of an embodiment example of the present invention.
Fig. 14 is a front cross-sectional view of a processing state of an embodiment example of the present invention.
Fig. 15 is a front cross-sectional view of a processing state of an embodiment example of the present invention.
Fig. 16 is a front cross-sectional view of a processing state of an embodiment example of the present invention.
Description of the reference numerals
W … work; w (W) 1 … ground surface; t … abrasive tape; t (T) 1 … abrasive surface; t (T) 2 … belt transfer; a … multi-joint robot; a B … grinding unit; b (B) 1 … belt transfer mechanism; b (B) 2 … crimping mechanism; b (B) 3 … crimp members; a C … holder; d … synchronization control unit; e … oscillating mechanism; f … crimping; h … oscillating action; 32 … holding member; 32a … mounting surface; 33 … retaining mechanism; 33a … negative pressure adsorption mechanism; 34 … horizontal turning mechanism.
Detailed Description
Fig. 1 to 16 show an example of the embodiment of the present invention, and in this case, as shown in fig. 1 and 10, the polishing apparatus generally includes an articulated robot a and a surface W to be polished which is attached to the tip of the articulated robot a and polishes a workpiece W 1 The polishing unit B of (C) further includes a holding unit C capable of holding and releasing the workpiece W, and a synchronization control unit D for controlling synchronization of the multi-joint robot a, the polishing unit B, and the holding unit C. In this case, the articulated robot a and the holding unit C are disposed to face the machine 1.
In this case, as shown in fig. 2, 4, 9, and 10, the polishing unit B includes: a polishing belt T for polishing a surface W to be polished of the workpiece W 1 The method comprises the steps of carrying out a first treatment on the surface of the Belt conveying mechanism B 1 Continuously or intermittently conveying the abrasive belt T; crimping mechanism B 2 Which makes the polishing surface T of the polishing belt T 1 Pressing F against the surface W to be polished of the workpiece W 1 And (3) upper part.
In this case, the polishing tape T is formed by applying or bonding fixed abrasive grains having a predetermined particle size, such as alumina, chromia, silicon carbide, and diamond, to a substrate such as a polyester film, a metal, a woven fabric, a foam film, and a flocked fabric. Furthermore, it is possible to employ: since a dry polishing structure in which a polishing belt having a structure in which fixed abrasive grains are fixed to a base material and no lubricant is used, a wet polishing structure in which a polishing belt having a structure in which fixed abrasive grains are fixed to a base material and a lubricant is supplied and polishing is performed, or a wet polishing structure in which a woven cloth, a nonwoven fabric, a foam film, or a flocked cloth to which fixed abrasive grains are not fixed is used as a polishing belt and a polishing agent containing free abrasive grains is supplied are used, the polishing belt T herein includes a polishing belt having a structure in which fixed abrasive grains are fixed and a polishing belt having no structure in which fixed abrasive grains are fixed.
In this case, the articulated robot a is a vertical articulated robot. That is, as shown in fig. 1, the turning part 2 turns around the axis J1 with respect to the main body part 3, the lower arm part 4 turns around the axis J2, the upper arm part 5 turns around the axis J3 with respect to the lower arm part 4, and the wrist part 6 turns around the axes J4, J5, and J6 with respect to the upper arm part 5, and the turning of the turning part 2 and the turning of the lower arm part 4, the upper arm part 5, and the wrist part 6 are performed by a plurality of servomotors, which are not shown, to form a so-called 6-axis vertical articulated robot.
In this case, as shown in fig. 3, 4, 6 and 7, the polishing belt T is wound around and conveyed by a belt conveyor T 2 A swinging mechanism E configured to perform a swinging motion H in a width direction orthogonal to the direction of the belt, and the pressure bonding mechanism B as shown in FIGS. 3 and 4 2 Comprises a pressing member B capable of guiding the polishing tape T to turn back 3 And is constituted by the following components.
In this case, the belt conveying mechanism B 1 As shown in fig. 3, 4 and 5, the mounting member 7 of the polishing unit B is mounted on the wrist portion 6 of the articulated robot a, the reel-out shaft 8 and the reel-in shaft 9 are rotatably disposed on the mounting member 7, the full reel 10 is mounted on the reel-out shaft 8, the empty reel 11 is mounted on the reel-in shaft 9, the polishing tape T drawn out from the full reel 10 is wound around the empty reel 11, as shown in fig. 3 and 5, the mounting plate 7a is provided with the mounting plate 7a, the reel-in shaft 9 and the empty reel 11 are rotated by the reel-in motor 12 mounted on the mounting plate 7a via the gear mechanism 13, the reel-in shaft 7 is provided with the cover 13a of the gear mechanism 13, the gear mechanism 13 is constituted by the gears 13B and the gears 13c engaged with each other, as shown in fig. 8, the reel-out shaft 8 and the full reel 10 are rotated via the polishing tape T by the reel-in rotation of the reel-in shaft 9, and the transfer of the polishing tape T from the full reel 10 to the empty reel 11 is carried in the arrow direction of the tape T in the direction of the reel 11 by the rotation of the reel-in the reel motor 12, as shown in fig. 3 and 5 2 The direction is continuously or intermittently transferred, and the unwinding shaft 8 is applied with a rotational resistance by an idle rotation preventing means 14, and in this case, the idle rotation preventing means 14 is configured to: the friction member 15 is mounted on the unreeling shaft 8, the cylindrical member 16 is mounted on the mounting member 7, the spherical friction body 17, the spring 18 and the stop screw 19 are built in the cylindrical member 16, the spring 18 presses the friction body 17 against the surface of the friction member 15 to apply rotation resistance to the friction member 15, so that the loosening phenomenon caused by unexpected unreeling rotation of the abrasive belt T is prevented, and a proper tension is applied to the abrasive belt T to improve the conveying T of the abrasive belt T 2 Smooth and transfer T of (C) 2 Is stable in (2)And (5) qualitative property.
In this case, the swing mechanism E is configured as shown in fig. 3, 4, 6, and 7, as follows: a holding and mounting member 20 is mounted on the mounting member 7, and the swinging member 21 is set to be wound around the belt by a slide table 22 and a guide 23 on the holding and mounting member 20 2 The swing motion H is freely performed in the width direction orthogonal to the direction of the belt, a swing motor 24 is mounted on the upper portion of the holding and mounting member 20, a drive shaft 25 is rotatably provided, a main shaft of the swing motor 24 and the drive shaft 25 are connected by a joint 26, an eccentric wheel mechanism 27 is interposed between the drive shaft 25 and the swing member 21, in this case, an eccentric shaft portion 25a is formed on the drive shaft 25, and the eccentric shaft portion 25a has a rotation axis O with an eccentric amount ε with respect to a rotation axis O of the drive shaft 25 1 An eccentric wheel 28 is rotatably provided on the eccentric shaft portion 25a, a fitting recess 21a is formed in the swinging member 21, a pair of contact surfaces 21b/21b facing each other are formed in the fitting recess 21a so as to be in contact with the outer peripheral surface of the eccentric wheel 28, and the swinging member 21 swings in the belt width direction H by eccentric rotation of the eccentric wheel 28 by the swinging motor 24.
In this case, the pressure bonding mechanism B is 2 As shown in fig. 3, 4 and 10, the structure is as follows: two cylinder portions 29/29 are arranged in parallel with the swinging member 21, a driving and reversing member 30 is provided at the lower end portions of the two plungers 29a/29a of the cylinder portions 29/29, and a pressure-bonding member B is provided at the driving and reversing member 30 3 The press-fit part B 3 A pair of front and rear belt guides 31/31 for guiding both side end surfaces of the polishing belt T are rotatably mounted on the left and right of the advancing and retreating member 30 so as to guide the polishing belt T while being folded back around the rotation axis P, and the plungers 29a/29a of the cylinder portions 29/29 sandwich the pressure-bonding member B 3 A polishing surface T of the polishing belt T 1 A polished surface W pressed against a workpiece W 1 And (3) upper part.
In this case, as shown in fig. 1 and 2, the holding portion C is configured to include a holding member 32 capable of holding the workpiece W and a holding mechanism 33 capable of holding and releasing the workpiece W, and in this case, a negative pressure suction mechanism 33a is used as the holding mechanism 33, and in this case, the holding member 32 is horizontally rotatably provided, a mounting surface 32a capable of mounting the workpiece W is provided on an upper surface of the holding member 32, and a horizontal rotation mechanism 34 for continuously or intermittently rotating the holding member 32 is provided.
That is, as the horizontal pivoting mechanism 34, in this case, as shown in fig. 1 and 2, the following configuration is adopted: the machine 1 is provided with a holding mount 35, a rotary shaft 36 is rotatably provided on the holding mount 35 via a bearing 37, a driven pulley 38 is provided at a lower portion of the rotary shaft 36, a rotation motor 39 is mounted on the holding mount 35, a drive pulley (not shown) is mounted on a main shaft of the rotation motor 39, a drive belt 40 is wound between the drive pulley and the driven pulley 38, the holding member 32 is mounted on the rotary shaft 36, the holding member 32 is continuously or intermittently rotated by the rotation motor 39 via the drive belt 40, and the negative pressure suction mechanism 33a is configured as follows: the annular member 41 is fitted to the outer peripheral surface of the holding member 32, the annular member 41 is provided with a suction port 41a connected to a negative pressure source, not shown, and a suction path 32b for communicating the suction port 41a forming the annular member 41 with the holding member 32 is provided so as to be capable of holding and releasing the workpiece W placed on the placement surface 32a of the holding member 32 by suction or negative pressure release. In the above embodiment, the holding mechanism 33 is a negative pressure suction mechanism 33a using negative pressure, and instead, a so-called mechanical and mechanical holding mechanism such as a clamping mechanism or a pressing mechanism may be used.
In this case, as shown in fig. 1, the synchronization control unit D is configured to perform synchronization control of the articulated robot a, the polishing unit B, and the holding unit C. The synchronization control is configured, for example, in the following manner: the polishing apparatus includes a control circuit for synchronizing operation control or feedback control of the multi-joint robot a, the polishing unit B, and the holding unit C, and for example, a computer having CPU, ROM, RAM, HDD and an input/output port or various circuits, and processes a program for setting an operation path such as a posture and a position of a TCP (tool center point) of the multi-joint robot a to control a time of continuous or intermittent conveyance of the polishing belt T of the polishing unit B and a conveyance speed of the polishing belt T, and to synchronize and control a program for setting a movement time, a movement speed, an interval time of intermittent rotation of rotation and stop of rotation of the holding unit C, a rotation speed of the workpiece W, and the like, respectively.
Since this embodiment example has the above-described structure, as shown in fig. 1, 2, and 3, a surface W to be polished for a workpiece W is attached to the tip of the articulated robot a 1 A polishing unit B for polishing, which is configured to manually or automatically transfer the workpiece W to the holding unit C, and which is configured to control the multi-joint robot a, the polishing unit B, and the holding unit C in synchronization by the synchronization control unit D, and to polish the surface W to be polished of the workpiece W by the polishing unit B 1 The polishing unit B includes a surface W to be polished for polishing the workpiece W 1 A belt conveying mechanism B for continuously or intermittently conveying the polishing belt T 1 And a polishing surface T for polishing the belt T 1 A polished surface W pressed against a workpiece W 1 Pressure welding mechanism B 2 Therefore, the belt conveying mechanism B can be controlled by controlling the posture and position of the polishing unit B at the front end of the articulated robot a 1 Transfer T of the grinding belt T 2 And pass through crimping mechanism B 2 The polishing surface T of the polishing tape T 1 A surface W to be polished against a workpiece W 1 For example, as shown in fig. 10, the pressure welding mechanism B can be used to polish the surface of the workpiece W during polishing of the surface of the workpiece W 2 The polishing surface T of the polishing belt T 1 Pressing F against the surface W to be polished of the workpiece W 1 On, by conveying T of the abrasive belt T 2 The composite motion of the pressing F of the polishing tape T and the moving motion of the tip of the articulated robot a uses the polishing surface T of the polishing tape T 1 A surface W to be polished of a workpiece W 1 Performing grinding processingAs shown in fig. 11, in chamfering and polishing of the C surface of the corner edge of the workpiece W, the pressing mechanism B can be used 2 The polishing surface T of the polishing belt T 1 Pressing F against the surface W to be polished of the workpiece W in an inclined state of approximately 45 DEG 1 On, by conveying T of the abrasive belt T 2 The composite motion of the pressing F of the polishing tape T and the moving motion of the tip of the articulated robot a uses the polishing surface T of the polishing tape T 1 A surface W to be polished of a workpiece W 1 The polishing process is performed, and as shown in fig. 12, in chamfering and polishing of the R surface of the corner edge of the workpiece W, the pressing mechanism B can be used 2 The polishing surface T of the polishing belt T 1 Pressing F against the surface W to be polished of the workpiece W in an inclined state of approximately 45 DEG 1 In this way, the front end of the articulated robot a is oscillated Y, and the polishing belt T is transported 2 The pressing F of the polishing tape T and the compound operation of the swinging and moving operation of the front end of the articulated robot A, the polishing surface T of the polishing tape T is utilized 1 A surface W to be polished of a workpiece W 1 The polishing process is performed, and as shown in fig. 13, the end face of the workpiece W can be polished by the press-bonding mechanism B 2 The polishing surface T of the polishing belt T 1 Pressing F against the surface W to be polished of the workpiece W 1 On, by conveying T of the abrasive belt T 2 The composite motion of the pressing F of the polishing tape T and the moving motion of the tip of the articulated robot a uses the polishing surface T of the polishing tape T 1 A surface W to be polished of a workpiece W 1 The polishing process is performed, and as shown in fig. 14, in chamfering and polishing of the C surface of the corner edge of the workpiece W, the pressing mechanism B can be used 2 The polishing surface T of the polishing belt T 1 Pressing F against the surface W to be polished of the workpiece W in an inclined state of approximately 45 DEG 1 On, by conveying T of the abrasive belt T 2 The composite motion of the pressing F of the polishing tape T and the motion of the articulated robot a uses the polishing surface T of the polishing tape T 1 A surface W to be polished of a workpiece W 1 The polishing process is performed, and as shown in fig. 15, in chamfering and polishing of the R surface of the corner edge of the workpiece W, the pressing mechanism B can be used 2 The polishing surface T of the polishing belt T 1 Pressing F against the surface W to be polished of the workpiece W 1 On, by conveying T of the abrasive belt T 2 The pressing F of the polishing tape T and the combined action of the swinging action Y and the moving action of the front end of the articulated robot A, and the polishing surface T of the polishing tape T is utilized 1 A surface W to be polished of a workpiece W 1 The polishing process is performed, and as shown in fig. 16, in chamfering and polishing of the end face of the workpiece W and the R faces of both corner edges, the pressing mechanism B can be used 2 The polishing surface T of the polishing belt T 1 Pressing F against the surface W to be polished of the workpiece W 1 On, by conveying T of the abrasive belt T 2 The pressing F of the polishing tape T and the combined action of the swinging action Y and the moving action of the front end of the articulated robot A, and the polishing surface T of the polishing tape T is utilized 1 A surface W to be polished of a workpiece W 1 In addition to polishing, various polishing specifications can be selected, and therefore, the end effector of the articulated robot a is configured to employ the polishing unit B, which can flexibly cope with various types or specifications of the workpiece W, which can cope with various types and has a higher versatility than a dedicated machine, which can ensure flexibility and expansion of use, and which is provided with the belt conveying mechanism B 1 Crimping mechanism B 2 Therefore, the polishing surface T of the polishing belt T can pass 1 A surface W to be polished against a workpiece W 1 The workpiece W is polished by the press-bonding F of the polishing belt T 2 And the pressure contact F of the polishing tape T, thereby improving the polishing precision and the polishing surface T 1 Thereby enabling a good polishing process.
In this case, as shown in fig. 1, since the multi-joint robot a is a vertical multi-joint robot, the front end of the robot can be moved widely in the vertical plane by a structure having a plurality of joints (axes) and the joints and links are vertically connected in series, and workability and flexibility of polishing can be improved, and in this case, since the polishing belt T is wound around the belt conveyor T 2 Fang XiangzhengSince the swinging mechanism E swings the polishing tape T in the tape width direction in addition to the processing state shown in fig. 10 to 16, the swinging mechanism E swings the polishing tape T in the tape width direction, and the polishing tape T can be transported by the swinging mechanism E 2 The interaction between the pressing F and swinging H actions of the polishing belt T further improves the polishing precision and the polishing surface T 1 In this case, as shown in fig. 3, the pressure contact mechanism B is configured to perform a good polishing process 2 Comprises a pressing member B capable of guiding the polishing tape T to turn back 3 Therefore, the polishing surface T of the polishing tape T can be made 1 Reliably press-contact F with the surface W to be polished of the workpiece W 1 In this case, since the polishing structure of the polishing means B is a dry structure or a wet structure, the polishing flexibility of the polishing process can be improved, and accordingly, the polishing process can be performed well by selecting a dry polishing structure in which the polishing belt T having the structure in which the fixed abrasive grains are fixed to the base material and no lubricant is used, a wet polishing structure in which the polishing belt T having the structure in which the fixed abrasive grains are fixed to the base material and the lubricant is supplied, or a wet polishing structure in which the woven cloth, the nonwoven fabric, the foam film, or the flocked cloth to which the fixed abrasive grains are not fixed is used as the polishing belt T and the abrasive containing the free abrasive grains is supplied, depending on the material of the workpiece W or the specification of the polishing process.
In this case, as shown in fig. 1 and 2, since the holding unit C that can hold and release the workpiece W and the synchronization control unit D that synchronously controls the articulated robot a, the polishing unit B, and the holding unit C are provided, the workpiece W can be reliably held and released by the holding unit C, and the articulated robot a, the polishing unit B, and the holding unit C can be synchronously controlled by the synchronization control unit D, so that a satisfactory polishing process can be performed.
In this case, since the holding portion C includes the holding member 32 capable of holding the workpiece W and the holding mechanism 33 capable of holding and releasing the workpiece W as shown in fig. 1 and 2, the workpiece W can be reliably held by the holding member 32, and the workpiece W can be reliably held and released by the holding mechanism 33 on the holding member 32, so that good polishing can be performed, and in this case, since the negative pressure suction mechanism 33a is used as the holding mechanism 33 as shown in fig. 2, the workpiece W can be reliably held on the holding member 32, and the structure of the holding mechanism 33 can be simplified, and in this case, since the holding member 32 is horizontally rotatably provided, the upper surface of the holding member 32 is provided with the mounting surface 32a capable of mounting the workpiece W, and the horizontal rotation mechanism 34 for continuously or intermittently rotating the holding member 32 is provided, as shown in fig. 2, the workpiece W can be formed by various types of machines, and the flexibility of the polishing can be improved, and the variety of the polishing can be applied to various types of the workpiece W can be applied to various types of machines, and the various types of the polishing can be applied to the various types of the workpiece W can be flexibly and the various types of the workpiece can be applied to the various types of the polishing, and the machine can be used in addition to the various types of the flexible types of the various types of the can be used.
The present invention is not limited to the above embodiment, but is also applicable to an articulated robot a, a polishing unit B, and a belt conveying mechanism B 1 Crimping mechanism B 2 Crimping part B 3 The structures of the holding unit C, the synchronization control unit D, the swinging mechanism E, the holding member 32, the mounting surface 32a, the holding mechanism 33, the negative pressure suction mechanism 33a, the horizontal turning mechanism 34, and the like, and the material, structure, and the like of the polishing belt T may be appropriately changed and designed.
In summary, the intended object can be sufficiently achieved.
Claims (9)
1. A polishing robot device is characterized by comprising:
a multi-joint robot;
a polishing unit mounted on the front end of the multi-joint robot for polishing a surface to be polished of a workpiece; and
a synchronization control unit for performing synchronization control on the multi-joint robot and the polishing unit,
the polishing unit is provided with:
a polishing belt for polishing a surface to be polished of the workpiece;
a belt conveying mechanism for continuously or intermittently conveying the abrasive belt; and
a pressure-bonding mechanism for pressure-bonding the polishing surface of the polishing belt to the surface to be polished of the workpiece,
the belt conveying mechanism is configured to:
a reel-up shaft and a reel-up shaft rotatably disposed on a mounting member of the polishing unit, wherein the reel-up shaft is provided with a full reel on which the polishing tape is wound, the reel-up shaft is provided with an empty reel on which the polishing tape drawn out from the full reel is wound,
a winding motor is arranged for winding and rotating the winding shaft and the empty reel,
the unreeling shaft and the full reel are unreeled and rotated by the reeling rotation of the reeling shaft and the empty reel via the abrasive belt,
an idle rotation preventing mechanism is provided for applying a rotational resistance to the unreeling shaft.
2. The polishing robot device according to claim 1, wherein,
the articulated robot is a vertical articulated robot.
3. The polishing robot device according to claim 1, wherein,
the polishing robot device includes a swinging mechanism that swings the polishing belt in a belt width direction orthogonal to a belt conveying direction.
4. The polishing robot device according to claim 1, wherein,
the pressure-bonding mechanism is provided with a pressure-bonding member capable of guiding the polishing belt to turn back.
5. The polishing robot device according to claim 1, wherein,
the polishing structure of the polishing unit is a dry structure or a wet structure.
6. The polishing robot apparatus according to claim 1, characterized in that the polishing robot apparatus comprises:
a holding unit configured to hold and release the workpiece; and
and a synchronization control unit that performs synchronization control of the multi-joint robot, the polishing unit, and the holding unit.
7. The polishing robot device according to claim 6, wherein,
the holding portion includes:
a holding member capable of holding the workpiece; and
and a holding mechanism capable of holding and releasing the workpiece.
8. The polishing robot device according to claim 7, wherein,
a negative pressure suction mechanism is used as the holding mechanism.
9. The polishing robot device according to claim 7, wherein,
the holding member is rotatably provided horizontally, a mounting surface capable of mounting the workpiece is provided on an upper surface of the holding member, and a horizontal rotation mechanism for continuously or intermittently rotating the holding member is provided in the polishing robot apparatus.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-140736 | 2020-08-24 | ||
| JP2020140736A JP7111778B2 (en) | 2020-08-24 | 2020-08-24 | Polishing robot device |
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| CN114178949A CN114178949A (en) | 2022-03-15 |
| CN114178949B true CN114178949B (en) | 2024-02-06 |
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| CN114670110A (en) * | 2022-04-13 | 2022-06-28 | 蓝思智能机器人(长沙)有限公司 | Polishing wheel assembly and polishing machine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09248752A (en) * | 1996-03-11 | 1997-09-22 | Sanshin:Kk | Polishing method for flattening device wafer surface, and device therefor |
| JP2004314200A (en) * | 2003-04-11 | 2004-11-11 | Yaskawa Electric Corp | Automated polishing apparatus |
| JP2017124484A (en) * | 2016-01-12 | 2017-07-20 | 中村留精密工業株式会社 | Grinding-polishing composite processing device, and polishing device |
| WO2018211736A1 (en) * | 2017-05-15 | 2018-11-22 | 株式会社 荏原製作所 | Polishing apparatus and polishing method |
| CN110091237A (en) * | 2018-01-31 | 2019-08-06 | 株式会社三信 | Worm screw grinding method and worm screw grinding device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58196962A (en) * | 1982-05-11 | 1983-11-16 | Matsushita Electric Ind Co Ltd | Device for grinding the surface of thin plate |
| JP5508979B2 (en) * | 2010-07-29 | 2014-06-04 | 本田技研工業株式会社 | Grinding equipment |
| JP6914078B2 (en) * | 2017-03-31 | 2021-08-04 | 株式会社荏原製作所 | Vacuum suction pad and substrate holding device |
| JP2019000913A (en) * | 2017-06-12 | 2019-01-10 | 日本省力機械株式会社 | Grinding device |
| JP2020021863A (en) * | 2018-08-02 | 2020-02-06 | 株式会社荏原製作所 | Substrate processing method and substrate processing apparatus |
-
2020
- 2020-08-24 JP JP2020140736A patent/JP7111778B2/en active Active
-
2021
- 2021-06-30 CN CN202110743545.1A patent/CN114178949B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09248752A (en) * | 1996-03-11 | 1997-09-22 | Sanshin:Kk | Polishing method for flattening device wafer surface, and device therefor |
| JP2004314200A (en) * | 2003-04-11 | 2004-11-11 | Yaskawa Electric Corp | Automated polishing apparatus |
| JP2017124484A (en) * | 2016-01-12 | 2017-07-20 | 中村留精密工業株式会社 | Grinding-polishing composite processing device, and polishing device |
| WO2018211736A1 (en) * | 2017-05-15 | 2018-11-22 | 株式会社 荏原製作所 | Polishing apparatus and polishing method |
| CN110091237A (en) * | 2018-01-31 | 2019-08-06 | 株式会社三信 | Worm screw grinding method and worm screw grinding device |
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|---|---|
| CN114178949A (en) | 2022-03-15 |
| JP2022036498A (en) | 2022-03-08 |
| JP7111778B2 (en) | 2022-08-02 |
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