JP2016178218A - 光送信モジュール - Google Patents
光送信モジュール Download PDFInfo
- Publication number
- JP2016178218A JP2016178218A JP2015057797A JP2015057797A JP2016178218A JP 2016178218 A JP2016178218 A JP 2016178218A JP 2015057797 A JP2015057797 A JP 2015057797A JP 2015057797 A JP2015057797 A JP 2015057797A JP 2016178218 A JP2016178218 A JP 2016178218A
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- Prior art keywords
- light
- optical transmission
- light emitting
- transmission module
- light receiving
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4286—Optical modules with optical power monitoring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/0222—Gas-filled housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
Abstract
Description
はじめに、本発明の第1実施形態に係る光送信モジュールの概略について、図1、2を参照して説明する。
以下に、本発明の第2実施形態に係る光送信モジュール20の概略について、図3、4を参照して説明する。なお、図1、2における第1実施形態に係る光送信モジュール10の構成と同一の機能を有するものは、図3、4において同一の符号が付されている。
Claims (4)
- 電気信号を光信号に変換して出力する光送信モジュールであって、
パッケージと、
前記パッケージの内部で光をそれぞれ出射する複数の発光素子と、
前記複数の発光素子の光出力をそれぞれモニタリングするために、前記パッケージの内部で前記光の一部が入射する受光面をそれぞれ有する複数の受光素子と、
前記複数の受光素子にそれぞれ前記受光面を避けて設けられた遮光性部材と、を備える、
ことを特徴とする光送信モジュール。 - 前記遮光性部材のうちの少なくとも一部は遮光性の樹脂で形成されている、
ことを特徴とする請求項1に記載の光送信モジュール。 - 前記複数の発光素子からそれぞれ出射する前記光を分岐するビームスプリッタをさらに有し、
前記複数の受光素子のそれぞれは、前記ビームスプリッタ上に配置され、
前記複数の受光素子のそれぞれの受光面は、前記ビームスプリッタと対向する側に備えられる、
ことを特徴とする請求項1又は2に記載の光送信モジュール。 - 前記複数の発光素子は、それぞれ、光伝送に用いられる光信号を出力する第一発光面と、前記第一発光面と逆の面である第二発光面を有し、
前記複数の受光素子は、前記第二発光面側に配置され、前記第二発光面からの出力光が入射される、
ことを特徴とする請求項1又は2に記載の光送信モジュール。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015057797A JP2016178218A (ja) | 2015-03-20 | 2015-03-20 | 光送信モジュール |
US15/067,617 US10001590B2 (en) | 2015-03-20 | 2016-03-11 | Optical transmission module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015057797A JP2016178218A (ja) | 2015-03-20 | 2015-03-20 | 光送信モジュール |
Publications (1)
Publication Number | Publication Date |
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JP2016178218A true JP2016178218A (ja) | 2016-10-06 |
Family
ID=56925699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015057797A Pending JP2016178218A (ja) | 2015-03-20 | 2015-03-20 | 光送信モジュール |
Country Status (2)
Country | Link |
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US (1) | US10001590B2 (ja) |
JP (1) | JP2016178218A (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018066888A (ja) * | 2016-10-20 | 2018-04-26 | 住友電気工業株式会社 | 光モジュール |
US20180172933A1 (en) | 2016-12-20 | 2018-06-21 | Oclaro Japan, Inc. | Optical module and optical transmission equipment |
WO2019160001A1 (ja) * | 2018-02-14 | 2019-08-22 | 古河電気工業株式会社 | 光モジュール |
JP2019204890A (ja) * | 2018-05-24 | 2019-11-28 | 日本ルメンタム株式会社 | 光サブアセンブリ |
US11112571B2 (en) | 2019-08-13 | 2021-09-07 | Lumentum Japan, Inc. | Optical subassembly |
WO2022269805A1 (ja) * | 2021-06-23 | 2022-12-29 | 日本電信電話株式会社 | 多チャネル光モジュール |
US11670733B2 (en) | 2020-09-14 | 2023-06-06 | Nichia Corporation | Light emitting device |
US11990728B2 (en) | 2020-05-26 | 2024-05-21 | Nichia Corporation | Light emitting device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7090572B2 (ja) * | 2019-03-08 | 2022-06-24 | 株式会社堀場製作所 | 半導体レーザ装置、及び分析装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01155676A (ja) * | 1987-12-14 | 1989-06-19 | Canon Inc | 半導体レーザー装置 |
JPH06152069A (ja) * | 1992-11-12 | 1994-05-31 | Nec Corp | 半導体レーザアレイモジュール |
JPH11248978A (ja) * | 1998-03-06 | 1999-09-17 | Matsushita Electric Ind Co Ltd | 双方向光半導体装置 |
JP2001060735A (ja) * | 1999-08-19 | 2001-03-06 | Kyocera Corp | 光半導体素子収納用パッケージ |
JP2001174675A (ja) * | 1999-12-21 | 2001-06-29 | Nec Corp | 光導波路型モジュール |
JP2004101997A (ja) * | 2002-09-11 | 2004-04-02 | Nippon Telegr & Teleph Corp <Ntt> | 多チャネル光通信モジュール |
JP2013148825A (ja) * | 2012-01-23 | 2013-08-01 | Japan Oclaro Inc | 光モジュール |
JP2014149494A (ja) * | 2013-02-04 | 2014-08-21 | Sumitomo Electric Ind Ltd | 光送信モジュールの製造方法 |
US20140314422A1 (en) * | 2013-04-19 | 2014-10-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Bidirectional parallel optical transceiver module and a method for bidirectionally communicating optical signals over an optical link |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3461653B2 (ja) * | 1995-10-19 | 2003-10-27 | 富士ゼロックス株式会社 | 光ファイバ伝送と自由空間伝送に共用可能な光送受信器および光通信ネットワーク |
US6369924B1 (en) * | 1998-04-20 | 2002-04-09 | Stratos Lightwave, Inc. | Optical transceiver with enhanced shielding and related methods |
JP2000141769A (ja) * | 1998-09-10 | 2000-05-23 | Fuji Xerox Co Ltd | 画像形成装置 |
JP2000171671A (ja) * | 1998-12-09 | 2000-06-23 | Matsushita Electric Ind Co Ltd | 光通信用モジュールおよびその実装方法 |
US7013088B1 (en) * | 1999-05-26 | 2006-03-14 | Jds Uniphase Corporation | Method and apparatus for parallel optical interconnection of fiber optic transmitters, receivers and transceivers |
JP4036008B2 (ja) * | 2002-02-13 | 2008-01-23 | 住友電気工業株式会社 | パラレル送受信モジュール |
WO2003077389A1 (fr) * | 2002-03-08 | 2003-09-18 | Sharp Kabushiki Kaisha | Appareil a source lumineuse et module de communication optique le comprenant |
JP3937911B2 (ja) * | 2002-05-10 | 2007-06-27 | 住友電気工業株式会社 | 光送受信モジュール及びこれを用いた光通信システム |
JP2004086137A (ja) * | 2002-07-01 | 2004-03-18 | Seiko Epson Corp | 光トランシーバ及びその製造方法 |
JP2004271921A (ja) * | 2003-03-10 | 2004-09-30 | Matsushita Electric Ind Co Ltd | 双方向光モジュール及び光伝送装置 |
JP2005019746A (ja) | 2003-06-26 | 2005-01-20 | Sumitomo Electric Ind Ltd | 半導体レーザ装置およびそれに使用される半導体パッケージ |
JP3852709B2 (ja) * | 2005-01-31 | 2006-12-06 | 日立金属株式会社 | 光パワーモニターとその製造方法 |
US7438484B2 (en) * | 2005-04-06 | 2008-10-21 | Ibiden Co., Ltd. | Electrical connector for a multi form-factor pluggable transceiver, and data communication system including the electrical connector |
US7463830B2 (en) * | 2005-07-19 | 2008-12-09 | Emcore Corporation | Modular optical transmitter for WWDM transceivers |
KR20070050216A (ko) * | 2005-11-10 | 2007-05-15 | 삼성전자주식회사 | 양방향 광 송수신기 |
JP4759380B2 (ja) * | 2005-12-12 | 2011-08-31 | 株式会社日立製作所 | 光通信用光学プリズム及び光送受信モジュール |
JP4260852B2 (ja) * | 2006-05-24 | 2009-04-30 | シャープ株式会社 | 光学式測距装置およびその製造方法 |
JP5132960B2 (ja) * | 2007-03-19 | 2013-01-30 | シチズン電子株式会社 | 発光ダイオードの製造方法及び光源 |
US8121484B2 (en) * | 2008-04-28 | 2012-02-21 | Sumitomo Electric Industries, Ltd. | Bi-direction optical module installing light-emitting device and light-receiving device in signal package |
JP2010225824A (ja) * | 2009-03-24 | 2010-10-07 | Hitachi Ltd | 光モジュール及び波長多重光モジュール |
KR101041570B1 (ko) * | 2009-08-24 | 2011-06-15 | 한국전자통신연구원 | 광통신 모듈 |
KR101270744B1 (ko) * | 2009-08-25 | 2013-06-03 | 한국전자통신연구원 | 양방향 광송수신 모듈 |
WO2011117808A1 (en) * | 2010-03-22 | 2011-09-29 | Colorchip (Israel) Ltd. | Opto -electronic transceiver having housing with small form factor |
US8821042B2 (en) * | 2011-07-04 | 2014-09-02 | Sumitomo Electic Industries, Ltd. | Optical module with lens assembly directly mounted on carrier by soldering and laser diode indirectly mounted on carrier through sub-mount |
KR101434395B1 (ko) * | 2011-09-21 | 2014-09-02 | 한국전자통신연구원 | 양방향 광 송수신 장치 |
JP5468053B2 (ja) * | 2011-11-28 | 2014-04-09 | シャープ株式会社 | 光学式測距装置およびそれを搭載した電子機器 |
JP5818673B2 (ja) * | 2011-12-21 | 2015-11-18 | 日本オクラロ株式会社 | 光モジュール |
JP2013153136A (ja) * | 2011-12-27 | 2013-08-08 | Sumitomo Electric Ind Ltd | 発光モジュール及び光トランシーバ |
JP2013164497A (ja) * | 2012-02-10 | 2013-08-22 | Enplas Corp | レンズアレイおよびこれを備えた光モジュール |
JP6201320B2 (ja) * | 2013-01-16 | 2017-09-27 | 富士通株式会社 | 光モジュールおよび光モジュールのモニタ方法 |
US9106338B2 (en) * | 2013-02-11 | 2015-08-11 | Avego Technologies General Ip (Singapore) Pte. Ltd. | Dual-wavelength bidirectional optical communication system and method for communicating optical signals |
JP6072928B2 (ja) * | 2013-09-12 | 2017-02-01 | シャープ株式会社 | 光センサおよび電子機器 |
JP2015206818A (ja) * | 2014-04-17 | 2015-11-19 | 日立金属株式会社 | 光通信モジュール |
US9325420B2 (en) * | 2014-05-16 | 2016-04-26 | Qualcomm Incorporated | Electro-optical transceiver device to enable chip-to-chip interconnection |
US9470857B2 (en) * | 2014-06-13 | 2016-10-18 | Sumitomo Electric Industries, Ltd. | Optical module with beam splitter on reflecting surface |
KR101906592B1 (ko) * | 2014-11-27 | 2018-10-12 | 한국전자통신연구원 | 광모듈 |
JP6454576B2 (ja) * | 2015-03-25 | 2019-01-16 | 日本オクラロ株式会社 | 光送信モジュール |
JP6523060B2 (ja) * | 2015-06-09 | 2019-05-29 | 日本オクラロ株式会社 | 光信号生成装置 |
-
2015
- 2015-03-20 JP JP2015057797A patent/JP2016178218A/ja active Pending
-
2016
- 2016-03-11 US US15/067,617 patent/US10001590B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01155676A (ja) * | 1987-12-14 | 1989-06-19 | Canon Inc | 半導体レーザー装置 |
JPH06152069A (ja) * | 1992-11-12 | 1994-05-31 | Nec Corp | 半導体レーザアレイモジュール |
JPH11248978A (ja) * | 1998-03-06 | 1999-09-17 | Matsushita Electric Ind Co Ltd | 双方向光半導体装置 |
JP2001060735A (ja) * | 1999-08-19 | 2001-03-06 | Kyocera Corp | 光半導体素子収納用パッケージ |
JP2001174675A (ja) * | 1999-12-21 | 2001-06-29 | Nec Corp | 光導波路型モジュール |
JP2004101997A (ja) * | 2002-09-11 | 2004-04-02 | Nippon Telegr & Teleph Corp <Ntt> | 多チャネル光通信モジュール |
JP2013148825A (ja) * | 2012-01-23 | 2013-08-01 | Japan Oclaro Inc | 光モジュール |
JP2014149494A (ja) * | 2013-02-04 | 2014-08-21 | Sumitomo Electric Ind Ltd | 光送信モジュールの製造方法 |
US20140314422A1 (en) * | 2013-04-19 | 2014-10-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Bidirectional parallel optical transceiver module and a method for bidirectionally communicating optical signals over an optical link |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018066888A (ja) * | 2016-10-20 | 2018-04-26 | 住友電気工業株式会社 | 光モジュール |
US20180172933A1 (en) | 2016-12-20 | 2018-06-21 | Oclaro Japan, Inc. | Optical module and optical transmission equipment |
US10444452B2 (en) | 2016-12-20 | 2019-10-15 | Lumentum Japan, Inc. | Optical module and optical transmission equipment |
JP7307045B2 (ja) | 2018-02-14 | 2023-07-11 | 古河電気工業株式会社 | 光モジュール |
WO2019160001A1 (ja) * | 2018-02-14 | 2019-08-22 | 古河電気工業株式会社 | 光モジュール |
JPWO2019160001A1 (ja) * | 2018-02-14 | 2021-02-04 | 古河電気工業株式会社 | 光モジュール |
US11283234B2 (en) | 2018-02-14 | 2022-03-22 | Furukawa Electric Co., Ltd. | Optical module |
JP2019204890A (ja) * | 2018-05-24 | 2019-11-28 | 日本ルメンタム株式会社 | 光サブアセンブリ |
JP7132747B2 (ja) | 2018-05-24 | 2022-09-07 | 日本ルメンタム株式会社 | 光サブアセンブリ |
US11112571B2 (en) | 2019-08-13 | 2021-09-07 | Lumentum Japan, Inc. | Optical subassembly |
US11990728B2 (en) | 2020-05-26 | 2024-05-21 | Nichia Corporation | Light emitting device |
US11670733B2 (en) | 2020-09-14 | 2023-06-06 | Nichia Corporation | Light emitting device |
WO2022269805A1 (ja) * | 2021-06-23 | 2022-12-29 | 日本電信電話株式会社 | 多チャネル光モジュール |
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US20160277116A1 (en) | 2016-09-22 |
US10001590B2 (en) | 2018-06-19 |
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