JP2016074052A - Tape for fixing polishing pad and polishing pad - Google Patents

Tape for fixing polishing pad and polishing pad Download PDF

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JP2016074052A
JP2016074052A JP2014205167A JP2014205167A JP2016074052A JP 2016074052 A JP2016074052 A JP 2016074052A JP 2014205167 A JP2014205167 A JP 2014205167A JP 2014205167 A JP2014205167 A JP 2014205167A JP 2016074052 A JP2016074052 A JP 2016074052A
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polishing pad
polishing
adhesive layer
tape
side adhesive
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JP6372662B2 (en
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智浩 岩尾
Tomohiro Iwao
智浩 岩尾
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Fujibo Holdins Inc
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Fujibo Holdins Inc
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Abstract

PROBLEM TO BE SOLVED: To provide a tape for fixing a polishing pad capable of preventing the generation of air reservoir and more strongly adhering and fixing the polishing pad, and the polishing pad including the tape for fixing the polishing pad.SOLUTION: A tape 2 for fixing a polishing pad is provided between a polishing pad 1 and a polishing device so as to adhere and fix them. The tape includes: a sheet-like tape base material 3 made of a material with elasticity; a pad side adhesion layer 4 which is provided on a front face of the tape base material 3 to be adhered to the polishing pad 1; and a device side adhesion layer 5 which is provided on a rear face of the tape base material 3. A groove 6 is formed to be continuous up to a side section in the device side adhesion layer 5. When the device side adhesion layer 5 is adhered to the polishing device, the groove 6 is eliminated and the whole of the device side adhesion layer 5 is brought into close contact with the polishing device.SELECTED DRAWING: Figure 1

Description

本発明は研磨パッド固定用テープおよび研磨パッドに関し、詳しくは研磨パッドと研磨装置との間に設けられてこれらを接着固定させる研磨パッド固定用テープおよび当該研磨パッド固定用テープを備えた研磨パッドに関する。   The present invention relates to a polishing pad fixing tape and a polishing pad, and more particularly to a polishing pad fixing tape that is provided between a polishing pad and a polishing apparatus to bond and fix them, and a polishing pad provided with the polishing pad fixing tape. .

従来、シリコンウエハなどの被研磨物を研磨する研磨装置には樹脂製の研磨パッドが設けられ、この研磨パッドは作業者の手作業によって研磨装置に装着されるようになっている。
上記研磨パッドにおける被研磨物を研磨する研磨面とは反対側の面には、上記研磨装置に接着固定するための研磨パッド固定用テープが設けられ、このような研磨パッド固定用テープとして、弾力性を有する素材によって構成されたシート状のテープ基材と、当該テープ基材の表面に形成されて研磨パッドと接着されるパッド側接着層と、テープ基材の裏面に形成されて研磨装置と接着される装置側接着層とを有したものが知られている（特許文献１、２）。
上記研磨パッドは研磨パッド固定用テープが予め接着固定された状態で研磨装置に装着されるようになっており、その際作業者は上記装置側接着層の端部より気泡が入り込まないように研磨装置に密着させる必要がある。
しかしながら、上記研磨パッドと研磨装置との接触面積は広く、上記気泡による空気溜まりを発生させずに研磨パッドを研磨装置に装着するのは困難となっている。
そこで上記特許文献１の研磨パッド固定用テープは、その表面および裏面に溝を備え、また特許文献２の研磨パッド固定用テープでは上記テープ基材から装置側接着層に貫通する貫通孔を備えており、これらによって上記空気溜まりの発生を防止するようにしている。 2. Description of the Related Art Conventionally, a polishing apparatus for polishing an object to be polished such as a silicon wafer has been provided with a resin polishing pad, and this polishing pad is attached to the polishing apparatus manually by an operator.
A polishing pad fixing tape for adhering and fixing to the polishing apparatus is provided on the surface of the polishing pad opposite to the polishing surface for polishing an object to be polished. As such a polishing pad fixing tape, elasticity is provided. A sheet-like tape base material made of a material having a property, a pad side adhesive layer formed on the surface of the tape base material and bonded to the polishing pad, and a polishing device formed on the back surface of the tape base material A device having a device-side adhesive layer to be bonded is known (Patent Documents 1 and 2).
The polishing pad is attached to the polishing apparatus with the polishing pad fixing tape pre-adhered and fixed. At this time, the worker polishes the bubbles so that air bubbles do not enter from the end of the apparatus-side adhesive layer. It is necessary to adhere to the device.
However, the contact area between the polishing pad and the polishing apparatus is wide, and it is difficult to attach the polishing pad to the polishing apparatus without generating air pockets due to the bubbles.
Therefore, the polishing pad fixing tape of Patent Document 1 has grooves on the front surface and the back surface thereof, and the polishing pad fixing tape of Patent Document 2 has a through-hole penetrating from the tape base material to the device-side adhesive layer. Thus, the occurrence of the air pool is prevented.

特開平８−１００１５５号公報JP-A-8-1000015 特許第５２１３２０４号公報Japanese Patent No. 5213204

しかしながら、上記特許文献１にかかる研磨パッド固定用テープの場合、上記パッド側接着層側にも溝が形成されているため、パッド側接着層における研磨パッドとの接着面積が少なく、研磨作業中に研磨パッドがパッド側接着層より剥離してしまう恐れがある。
一方、特許文献２にかかる研磨パッド固定用テープの場合、装置側接着層の貫通孔によって研磨装置との接着面積が少なくなってしまい、研磨作業中に装置側接着層が研磨装置から剥離してしまう恐れがある。
このような問題に鑑み、本発明は空気溜まりの発生を防止しつつ、研磨パッドをより強固に研磨装置に接着固定することが可能な研磨パッド固定用テープおよび当該研磨パッド固定用テープを備えた研磨パッドを提供するものである。 However, in the case of the polishing pad fixing tape according to Patent Document 1, since the groove is formed also on the pad side adhesive layer side, the adhesive area with the polishing pad in the pad side adhesive layer is small, and during the polishing operation. There is a possibility that the polishing pad may be peeled off from the pad side adhesive layer.
On the other hand, in the case of the polishing pad fixing tape according to Patent Document 2, the bonding area with the polishing apparatus is reduced by the through-hole of the apparatus side adhesive layer, and the apparatus side adhesive layer is peeled off from the polishing apparatus during the polishing operation. There is a risk.
In view of such problems, the present invention includes a polishing pad fixing tape and a polishing pad fixing tape capable of bonding and fixing a polishing pad to a polishing apparatus more firmly while preventing occurrence of air pockets. A polishing pad is provided.

すなわち、請求項１の発明にかかる研磨パッド固定用テープは、研磨パッドと研磨装置との間に設けられてこれらを接着固定する研磨パッド固定用テープであって、
弾力性を有する素材によって構成されたシート状のテープ基材と、当該テープ基材の表面に設けられて研磨パッドに接着されるパッド側接着層と、テープ基材の裏面に設けられて研磨装置に接着される装置側接着層とを有する研磨パッド固定用テープにおいて、
上記装置側接着層に上記当該装置側接着層の側部まで連続する溝を形成し、
上記装置側接着層を上記研磨装置に接着すると、上記溝が解消されて当該装置側接着層全体が研磨装置に密着することを特徴としている。
また請求項６の発明にかかる研磨パッドは、被研磨物を研磨する研磨面とは反対側の面に研磨パッド固定用テープが装着された研磨パッドにおいて、
上記請求項１ないし請求項５のいずれかに記載された研磨パッド固定用テープを備えることを特徴としている。 That is, the polishing pad fixing tape according to the invention of claim 1 is a polishing pad fixing tape that is provided between the polishing pad and the polishing apparatus and bonds and fixes them.
A sheet-like tape base material composed of a material having elasticity, a pad side adhesive layer provided on the surface of the tape base material and bonded to the polishing pad, and a polishing device provided on the back surface of the tape base material In a polishing pad fixing tape having a device side adhesive layer to be bonded to
Forming a continuous groove in the device side adhesive layer to the side of the device side adhesive layer;
When the apparatus-side adhesive layer is bonded to the polishing apparatus, the groove is eliminated and the entire apparatus-side adhesive layer is in close contact with the polishing apparatus.
The polishing pad according to the invention of claim 6 is a polishing pad in which a polishing pad fixing tape is mounted on a surface opposite to a polishing surface for polishing an object to be polished.
The polishing pad fixing tape according to any one of claims 1 to 5 is provided.

上記請求項１の発明によれば、上記研磨パッド固定用テープの上記装置側接着層を上記研磨装置に接着すると、当該装置側接着層に形成された溝が解消されるため、装置側接着層全体が研磨装置に密着するため、空気溜まりの発生を防止しつつ接着面積を確保することができ、一方ではパッド側接着層が研磨パッドに密着するため、研磨パッドの剥離を防止することができる。
また請求項６の発明によれば、上記請求項１ないし請求項５のいずれかに記載された研磨パッド固定用テープを備えているため、空気溜まりの発生を防止しつつ接着面積を確保することができる。 According to the first aspect of the invention, when the device side adhesive layer of the polishing pad fixing tape is bonded to the polishing device, the grooves formed in the device side adhesive layer are eliminated. Since the whole is in close contact with the polishing apparatus, it is possible to secure an adhesion area while preventing the occurrence of air accumulation, and on the other hand, since the pad side adhesive layer is in close contact with the polishing pad, peeling of the polishing pad can be prevented. .
According to the invention of claim 6, since the polishing pad fixing tape according to any one of claims 1 to 5 is provided, an adhesion area is secured while preventing the occurrence of air pockets. Can do.

本実施例にかかる研磨パッドおよび研磨パッド固定用テープの断面図。Sectional drawing of the polishing pad concerning this example, and the tape for polishing pad fixing. 研磨パッド固定用テープを装置側接着層側より見た底面図。The bottom view which looked at the tape for polishing pad fixation from the apparatus side adhesive layer side. 図１に示す研磨パッドおよび研磨パッド固定用テープを研磨定盤に装着した状態を示した断面図。Sectional drawing which showed the state which mounted | wore the polishing surface plate with the polishing pad and tape for fixing a polishing pad shown in FIG.

以下図示実施例について説明すると、図１は半導体基板等の被研磨物の表面を研磨する研磨装置に装着される研磨パッド１を示し、当該研磨パッド１は研磨装置に固定するための研磨パッド固定用テープ２を備えている。
上記研磨パッド固定用テープ２は研磨パッド１における被研磨物を研磨する研磨面とは反対側の面に接着されており、上記研磨装置を使用する際には上記研磨パッド固定用テープ２が研磨装置に接着固定されるようになっている。
上記研磨パッド１は例えば直径５００ｍｍ程度の円盤状を有した樹脂製の部材であって、従来公知のものを使用可能であることから詳細な説明については省略する。 FIG. 1 shows a polishing pad 1 attached to a polishing apparatus for polishing the surface of an object to be polished such as a semiconductor substrate. The polishing pad 1 is fixed to a polishing pad for fixing to the polishing apparatus. The tape 2 is provided.
The polishing pad fixing tape 2 is bonded to the surface of the polishing pad 1 opposite to the polishing surface for polishing an object to be polished. When the polishing apparatus is used, the polishing pad fixing tape 2 is polished. It is designed to be bonded and fixed to the device.
The polishing pad 1 is, for example, a resin member having a disk shape with a diameter of about 500 mm, and a conventionally known one can be used, and detailed description thereof will be omitted.

上記研磨パッド固定用テープ２は上記研磨パッド１と同径に形成された円盤状を有しており、弾力性を有する素材によって構成されたシート状のテープ基材３と、当該テープ基材３の表面に設けられて研磨パッド１に接着されるパッド側接着層４と、テープ基材３の裏面に設けられて研磨装置に接着される装置側接着層５とから構成されている。
上記テープ基材３は柔軟性を有する軟質ウレタンによって構成されており、特開２０１１−５１０７４号公報に記載されるような無数の気泡３ａが形成された微多孔構造を有する軟質ウレタンシートを利用することが望ましく、さらにはＡ硬度を１０〜５０、厚みを５０〜５００μｍの範囲で設定することがより好ましい。なお、本明細書中において、Ａ硬度は、ＪＩＳ Ｋ ７３１１に記載の方法に準じて測定した値を用いており、厚みは、ＪＩＳ Ｋ ６５５０に記載の方法に準じて測定した値を用いている。
上記公報に記載された素材からなるテープ基材３の内部では、上記気泡３ａが厚み方向に縦長に形成され、テープ基材３を厚さ方向に圧縮変形させた場合に、元の形状に復帰する際の戻り幅を大きくすることができる。
なお上記テープ基材３として上記軟質ウレタンを例示したが、適度な弾力性を有していればポリエステルやポリエチレン等を用いることも可能である。ただし、適度な弾力性を考慮すれば、湿式凝固法により形成される、厚み方向に延びる無数の縦長気泡が形成された発泡構造を有することが好ましい。 The polishing pad fixing tape 2 has a disk shape having the same diameter as that of the polishing pad 1, and is a sheet-like tape base material 3 made of an elastic material, and the tape base material 3. The pad-side adhesive layer 4 provided on the surface of the tape substrate 3 is bonded to the polishing pad 1, and the device-side adhesive layer 5 provided on the back surface of the tape substrate 3 and bonded to the polishing apparatus.
The tape base material 3 is made of soft urethane having flexibility, and uses a soft urethane sheet having a microporous structure in which countless bubbles 3a are formed as described in JP 2011-51074 A. More preferably, the A hardness is more preferably set in the range of 10 to 50 and the thickness in the range of 50 to 500 μm. In this specification, A hardness is a value measured according to the method described in JIS K 7311, and thickness is a value measured according to the method described in JIS K 6550. .
Inside the tape base material 3 made of the material described in the above publication, the bubbles 3a are formed vertically in the thickness direction, and when the tape base material 3 is compressed and deformed in the thickness direction, the original shape is restored. It is possible to increase the return width when doing.
In addition, although the said soft urethane was illustrated as the said tape base material 3, if it has moderate elasticity, it is also possible to use polyester, polyethylene, etc. However, in view of moderate elasticity, it is preferable to have a foamed structure formed by a wet coagulation method and innumerable vertically long cells extending in the thickness direction.

本実施例におけるパッド側接着層４および装置側接着層５はいずれも両面テープによって構成され、これらパッド側接着層４および装置側接着層５の厚みを２５〜６０μｍの範囲とすることが好ましい。
本実施例のパッド側接着層４は、ポリエチレンテレフタレート（ＰＥＴ）からなる芯材１１の表面および裏面に、それぞれアクリル系粘着剤等の感圧型の粘着剤１２が形成されたものとなっており、上記装置側接着層５は芯材を用いない両面テープとなっている。
そして上記研磨パッド固定用テープ２を製造する際、上記テープ基材３に上記パッド側接着層４および装置側接着層５を構成する両面テープを貼り合わせる作業は、機械によって行われるようになっており、これらの間にいわゆる空気溜まりは形成されないようになっている。
またパッド側接着層４および装置側接着層５における上記テープ基材３とは反対側の粘着剤１２は剥離紙で覆われており、上記研磨パッド１や研磨装置に接着される際に除去されるようになっている。
なお、本実施例のパッド側接着層４は、上記機械による貼り合わせ作業に用いやすくするため、ＰＥＴ製の芯材１１を有する両面テープとし、装置側接着層５はテープ基材３に追従しやすく、後述する溝６の成形が施しやすい芯材を用いない両面テープとしているが、その他の構成を有したものであってもよい。
例えば、上記芯材１１として不織布を用いた両面テープを使用することも可能である。また、パッド側接着層４を芯材を用いない両面テープとすることや、装置側接着層５をＰＥＴ製の芯材１１を有する両面テープとしてもよい。 The pad-side adhesive layer 4 and the device-side adhesive layer 5 in the present embodiment are both made of double-sided tape, and the thickness of the pad-side adhesive layer 4 and the device-side adhesive layer 5 is preferably in the range of 25 to 60 μm.
The pad-side adhesive layer 4 of this example has a pressure-sensitive adhesive 12 such as an acrylic adhesive formed on the front and back surfaces of a core 11 made of polyethylene terephthalate (PET). The device-side adhesive layer 5 is a double-sided tape that does not use a core material.
And when manufacturing the said polishing pad fixing tape 2, the operation | work which bonds the double-sided tape which comprises the said pad side adhesive layer 4 and the apparatus side adhesive layer 5 to the said tape base material 3 comes to be performed by a machine. A so-called air pocket is not formed between them.
Further, the adhesive 12 on the side opposite to the tape substrate 3 in the pad side adhesive layer 4 and the device side adhesive layer 5 is covered with release paper, and is removed when bonded to the polishing pad 1 or the polishing apparatus. It has become so.
In addition, in order to make it easy to use the pad side adhesive layer 4 of a present Example for the bonding operation by the said machine, it is set as the double-sided tape which has the core material 11 made from PET, and the apparatus side adhesive layer 5 follows the tape base material 3. Although the double-sided tape does not use a core material that is easy to form the groove 6 to be described later, it may have other configurations.
For example, a double-sided tape using a nonwoven fabric can be used as the core material 11. Alternatively, the pad-side adhesive layer 4 may be a double-sided tape that does not use a core material, and the device-side adhesive layer 5 may be a double-sided tape having a PET core material 11.

そして、本実施例にかかる研磨パッド固定用テープ２は、上記テープ基材３に形成した上記装置側接着層５に、当該装置側接着層５の側部にまで連続する溝６を形成したものとなっている。
上記溝６は後述するようにエンボス加工によって装置側接着層５ごと上記テープ基材３を変形させることによって形成され、これによりテープ基材３における装置側接着層５側の面にも溝が形成されるようになっている。
また上記溝６の平面形状は、図２（ａ）に示す放射状のものや、（ｂ）に示す格子状のものとすることができ、そのほかにも上記溝６の端部が装置側接着層５の側部まで連続して形成されていれば、他のパターンを有していてもよい。
そして上記溝６は、深さを２０〜１００μｍの範囲、幅を１００〜５００μｍの範囲で形成するのが好ましく、さらに溝６を格子状に形成する場合、各溝６のピッチを１〜１０ｍｍの範囲で形成するのが好ましい。 The polishing pad fixing tape 2 according to the present example is formed by forming grooves 6 continuous to the side of the device side adhesive layer 5 in the device side adhesive layer 5 formed on the tape base material 3. It has become.
The groove 6 is formed by deforming the tape base material 3 together with the device-side adhesive layer 5 by embossing as will be described later, thereby forming a groove on the surface of the tape base material 3 on the device-side adhesive layer 5 side. It has come to be.
Further, the planar shape of the groove 6 may be a radial shape shown in FIG. 2A or a lattice shape shown in FIG. 2B. In addition, the end of the groove 6 is a device-side adhesive layer. Other patterns may be provided as long as they are continuously formed up to 5 side portions.
The groove 6 is preferably formed with a depth in the range of 20 to 100 μm and a width in the range of 100 to 500 μm. Further, when the grooves 6 are formed in a lattice shape, the pitch of each groove 6 is 1 to 10 mm. It is preferable to form in a range.

本実施例の溝６はエンボス加工によって成形することができ、上記テープ基材３に上記パッド側接着層４及び装置側接着層５としての両面テープを装着した状態で、上記装置側接着層５側の面を上記溝６のパターンが凸状に形成された治具に密着させる。
その状態で、平坦な押圧部材を上記パッド側接着層４側から所定の圧力で押圧し、これにより上記装置側接着層５と一体的に上記テープ基材３における装置側接着層５側の面を圧縮変形させ、上記溝６を形成する。
このとき、上記テープ基材３におけるパッド側接着層４側の面は、上記押圧部材が平坦であることから、押圧しても平坦を維持するようになっている。 The groove 6 of the present embodiment can be formed by embossing, and the device side adhesive layer 5 is mounted on the tape base material 3 with the double sided tape as the pad side adhesive layer 4 and the device side adhesive layer 5 attached thereto. The side surface is brought into close contact with a jig in which the pattern of the groove 6 is formed in a convex shape.
In this state, the flat pressing member is pressed with a predetermined pressure from the pad side adhesive layer 4 side, whereby the device side adhesive layer 5 side surface of the tape substrate 3 is integrated with the device side adhesive layer 5. Is compressed and deformed to form the groove 6.
At this time, since the pressing member is flat, the surface of the tape base material 3 on the pad side adhesive layer 4 side is maintained flat even when pressed.

このようにして上記溝６の形成された上記研磨パッド固定用テープ２は、上記パッド側接着層４によって上記研磨パッド１に接着され、その際上記研磨パッド１と研磨パッド固定用テープ２とは機械によって厚さ方向に圧縮されながら端部より接着されるようになっており、これらの間に空気溜まりが形成されないようになっている。
一方、研磨パッド固定用テープ２の装着された研磨パッド１は、作業者の手作業によって研磨装置の研磨定盤１３（図３参照）に装着されるようになっており、研磨パッド固定用テープ２の装置側接着層５を、その端部から徐々に研磨装置の研磨定盤に接着させる。
その際、作業者は研磨パッド１を研磨定盤１３に押し当てて、研磨パッド固定用テープ２と研磨定盤１３との間の空気を排出しながら接着させ、これにより上記空気が上記装置側接着層５の側部まで連続して形成された上記溝６より排出され、空気溜まりの発生が可及的に防止されるようになっている。 The polishing pad fixing tape 2 in which the grooves 6 are formed in this way is bonded to the polishing pad 1 by the pad side adhesive layer 4. At this time, the polishing pad 1 and the polishing pad fixing tape 2 are separated from each other. While being compressed in the thickness direction by a machine, it is bonded from the end portion, and an air pocket is not formed between them.
On the other hand, the polishing pad 1 on which the polishing pad fixing tape 2 is mounted is mounted on the polishing surface plate 13 (see FIG. 3) of the polishing apparatus by an operator's manual operation. The apparatus side adhesive layer 5 of 2 is gradually adhered to the polishing surface plate of the polishing apparatus from its end.
At that time, the operator presses the polishing pad 1 against the polishing surface plate 13 and adheres it while discharging the air between the polishing pad fixing tape 2 and the polishing surface plate 13. It is discharged from the groove 6 that is continuously formed up to the side of the adhesive layer 5, and the occurrence of air pockets is prevented as much as possible.

一方、研磨パッド固定用テープ２を研磨定盤１３に押し当てることで、研磨パッド固定用テープ２が厚さ方向に圧縮されて変形し、特に上記テープ基材３と装置側接着層５とに形成された溝６の周囲が変形することにより当該溝６の底部だった部分が上記研磨定盤１３に接触し、当該溝６が解消される。
その後、作業者からの圧力が解消されることでテープ基材３は元の形状に復帰しようとするが、上記装置側接着層５における溝６の形成されていた部分が研磨定盤１３に接着された状態を維持しようとするため、上記溝６が解消された状態が維持されることとなる。
具体的には、上記テープ基材３における上記溝６の形成されていた部分では、上記テープ基材３を構成する素材が溝６の形状を復元させようとする力と、上記装置側接着層５が研磨定盤１３に接着した状態を維持しようとする力とが作用し、上記溝６の形成されていた部分には厚さ方向に引っ張り応力が発生する。
特に本実施例のテープ基材３は厚さ方向に延びる気泡３ａを多数備えており、上記溝６の形成された部分における気泡３ａは上記エンボス加工によって厚さ方向に圧縮されていることから厚さ方向に伸びやすく、上記溝６が良好に解消されるようになっている。
そして、このように上記研磨パッド固定用テープ２に形成した溝６が解消されることにより、図３に示すように研磨パッド固定用テープ２と研磨定盤１３との間に空気溜まりを発生させることなく、その全面を上記研磨定盤１３に密着させることが可能となっている。 On the other hand, by pressing the polishing pad fixing tape 2 against the polishing surface plate 13, the polishing pad fixing tape 2 is compressed and deformed in the thickness direction, and in particular, the tape base material 3 and the apparatus-side adhesive layer 5 are deformed. When the periphery of the formed groove 6 is deformed, the portion that was the bottom of the groove 6 comes into contact with the polishing surface plate 13, and the groove 6 is eliminated.
Thereafter, the pressure from the operator is released, so that the tape base material 3 tries to return to its original shape, but the portion where the groove 6 is formed in the apparatus side adhesive layer 5 is adhered to the polishing surface plate 13. In order to maintain this state, the state in which the groove 6 is eliminated is maintained.
Specifically, in the portion where the groove 6 is formed in the tape base material 3, the force that causes the material constituting the tape base material 3 to restore the shape of the groove 6 and the device-side adhesive layer 5 is applied to the polishing surface plate 13, and a tensile stress is generated in the thickness direction in the portion where the groove 6 is formed.
In particular, the tape base material 3 of the present embodiment has a large number of bubbles 3a extending in the thickness direction, and the bubbles 3a in the portion where the groove 6 is formed are compressed in the thickness direction by the embossing. It is easy to extend in the vertical direction so that the groove 6 can be satisfactorily eliminated.
Then, by eliminating the groove 6 formed in the polishing pad fixing tape 2 as described above, an air pocket is generated between the polishing pad fixing tape 2 and the polishing surface plate 13 as shown in FIG. The entire surface can be brought into close contact with the polishing surface plate 13 without any problem.

上記構成を有する研磨パッド固定用テープ２、もしくは当該研磨パッド固定用テープ２が装着された研磨パッド１によれば、上記パッド側接着層４および装置側接着層５の全面が研磨パッド１および研磨装置に密着するため、接着面積を広く確保して強固に接着固定することができる。
これに対し、上記特許文献１、２の研磨パッド固定用テープでは、研磨パッドとの接着面や研磨装置との接着面に溝や貫通孔が形成されているため、空気溜まりの発生を防止することができるものの、接着面積が狭くなるため、研磨作業中に研磨パッド固定用テープから研磨パッドが剥離したり、研磨パッド固定用テープごと研磨パッドが研磨装置から脱落する恐れがあった。 According to the polishing pad fixing tape 2 having the above configuration or the polishing pad 1 to which the polishing pad fixing tape 2 is attached, the entire surface of the pad side adhesive layer 4 and the device side adhesive layer 5 is polished with the polishing pad 1 and the polishing pad 1. Since it is in close contact with the apparatus, it is possible to secure a wide adhesive area and firmly fix it.
On the other hand, in the polishing pad fixing tapes of Patent Documents 1 and 2, grooves and through holes are formed on the bonding surface with the polishing pad and the bonding surface with the polishing apparatus, thereby preventing the occurrence of air pockets. However, since the bonding area is reduced, the polishing pad may be peeled off from the polishing pad fixing tape during the polishing operation, or the polishing pad may be removed from the polishing apparatus together with the polishing pad fixing tape.

なお、上記実施例における溝６はエンボス加工によって形成したものとなっているが、上記溝形状を形成できるものであれば加工方法は問わない。
また、予めテープ基材３に切削等によって溝を形成し、当該溝に沿って上記装置側接着層５を装着することによっても上記溝６を形成することができる。このような構成とした場合であっても、上記装置側接着層５を研磨装置に接着することにより、当該研磨装置に密着した装置側接着層５によってテープ基材３が厚さ方向に伸び、上記溝６を解消することができる。 In addition, although the groove | channel 6 in the said Example is formed by the embossing, the processing method will not be ask | required if the said groove | channel shape can be formed.
The groove 6 can also be formed by previously forming a groove in the tape base material 3 by cutting or the like and mounting the device-side adhesive layer 5 along the groove. Even in the case of such a configuration, by adhering the apparatus-side adhesive layer 5 to the polishing apparatus, the tape base material 3 extends in the thickness direction by the apparatus-side adhesive layer 5 in close contact with the polishing apparatus, The groove 6 can be eliminated.

１ 研磨パッド ２ 研磨パッド固定用テープ
３ テープ基材 ３ａ 気泡
４ パッド側接着層 ５ 装置側接着層
６ 溝 DESCRIPTION OF SYMBOLS 1 Polishing pad 2 Polishing pad fixing tape 3 Tape base material 3a Bubble 4 Pad side adhesive layer 5 Device side adhesive layer 6 Groove

Claims (6)

研磨パッドと研磨装置との間に設けられてこれらを接着固定する研磨パッド固定用テープであって、
弾力性を有する素材によって構成されたシート状のテープ基材と、当該テープ基材の表面に設けられて研磨パッドに接着されるパッド側接着層と、テープ基材の裏面に設けられて研磨装置に接着される装置側接着層とを有する研磨パッド固定用テープにおいて、
上記装置側接着層に上記当該装置側接着層の側部まで連続する溝を形成し、
上記装置側接着層を上記研磨装置に接着すると、上記溝が解消されて当該装置側接着層全体が研磨装置に密着することを特徴とする研磨パッド固定用テープ。 A polishing pad fixing tape which is provided between a polishing pad and a polishing apparatus and bonds and fixes them,
A sheet-like tape base material composed of a material having elasticity, a pad side adhesive layer provided on the surface of the tape base material and bonded to the polishing pad, and a polishing device provided on the back surface of the tape base material In a polishing pad fixing tape having a device side adhesive layer to be bonded to
Forming a continuous groove in the device side adhesive layer to the side of the device side adhesive layer;
A polishing pad fixing tape, wherein when the apparatus-side adhesive layer is bonded to the polishing apparatus, the groove is eliminated and the entire apparatus-side adhesive layer is in close contact with the polishing apparatus. 上記テープ基材における上記装置側接着層側の面に、上記装置側接着層の溝と同じ位置に溝を設け、
上記装置側接着層を上記研磨装置に接着すると、上記テープ基材が変形して上記溝が解消されることを特徴とする請求項１に記載の研磨パッド固定用テープ。 On the surface of the tape substrate on the device-side adhesive layer side, a groove is provided at the same position as the groove on the device-side adhesive layer,
2. The polishing pad fixing tape according to claim 1, wherein when the apparatus-side adhesive layer is bonded to the polishing apparatus, the tape base material is deformed and the groove is eliminated. 上記テープ基材は、内部に厚み方向に延びる無数の縦長気泡が形成された発泡構造を有する軟質ポリウレタンからなり、
上記装置側接着層を上記研磨装置に接着すると、上記気泡が研磨装置側に伸びて上記テープ基材の変形を許容することを特徴とする請求項２に記載の研磨パッド固定用テープ。 The tape base material is composed of a soft polyurethane having a foam structure in which innumerable vertically long cells extending in the thickness direction are formed inside,
3. The polishing pad fixing tape according to claim 2, wherein when the device-side adhesive layer is bonded to the polishing device, the bubbles extend toward the polishing device to allow deformation of the tape base material. 上記テープ基材は、湿式凝固法により得られた軟質ポリウレタンであることを特徴とする請求項３に記載の研磨パッド固定用テープ。   4. The polishing pad fixing tape according to claim 3, wherein the tape base material is a soft polyurethane obtained by a wet coagulation method. 上記溝がエンボス加工によって形成されていることを特徴とする請求項１ないし請求項４のいずれかに記載の研磨パッド固定用テープ。   The polishing pad fixing tape according to any one of claims 1 to 4, wherein the groove is formed by embossing. 被研磨物を研磨する研磨面とは反対側の面に研磨パッド固定用テープが装着された研磨パッドにおいて、
上記請求項１ないし請求項５のいずれかに記載された研磨パッド固定用テープを備えることを特徴とする研磨パッド。 In a polishing pad in which a polishing pad fixing tape is mounted on the surface opposite to the polishing surface for polishing an object to be polished,
A polishing pad comprising the polishing pad fixing tape according to any one of claims 1 to 5.
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CN111230760A (en) * 2018-11-29 2020-06-05 东泰高科装备科技有限公司 Method for utilizing polishing pad tailing
CN113382824A (en) * 2019-03-20 2021-09-10 丸石产业株式会社 Polishing apparatus platen, polishing apparatus, and polishing method
CN115194643A (en) * 2021-04-01 2022-10-18 智胜科技股份有限公司 Polishing pad and polishing method
TWI831397B (en) * 2022-09-29 2024-02-01 中國砂輪企業股份有限公司 polishing pad

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US7549914B2 (en) * 2005-09-28 2009-06-23 Diamex International Corporation Polishing system

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JPH08203849A (en) * 1995-01-30 1996-08-09 Rodel Nitta Kk Wafer retention member for polishing and method for fitting wafer retention member to surface plate
JP2000306870A (en) * 1999-04-22 2000-11-02 Sumitomo Metal Ind Ltd Polishing pad, sample suction pad, and sample polishing apparatus and method
US20020002027A1 (en) * 2000-05-23 2002-01-03 Eppert Stanley E. Eliminating air pockets under a polishing pad
US7549914B2 (en) * 2005-09-28 2009-06-23 Diamex International Corporation Polishing system

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111230760A (en) * 2018-11-29 2020-06-05 东泰高科装备科技有限公司 Method for utilizing polishing pad tailing
CN113382824A (en) * 2019-03-20 2021-09-10 丸石产业株式会社 Polishing apparatus platen, polishing apparatus, and polishing method
CN115194643A (en) * 2021-04-01 2022-10-18 智胜科技股份有限公司 Polishing pad and polishing method
TWI831397B (en) * 2022-09-29 2024-02-01 中國砂輪企業股份有限公司 polishing pad

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