JP2016117108A - Abrasive pad - Google Patents

Abrasive pad Download PDF

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JP2016117108A
JP2016117108A JP2014256312A JP2014256312A JP2016117108A JP 2016117108 A JP2016117108 A JP 2016117108A JP 2014256312 A JP2014256312 A JP 2014256312A JP 2014256312 A JP2014256312 A JP 2014256312A JP 2016117108 A JP2016117108 A JP 2016117108A
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adhesive layer
polishing
release film
polishing pad
layer
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中村　賢治
Kenji Nakamura
賢治 中村
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Toyo Tire Corp
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Toyo Tire and Rubber Co Ltd
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Priority to JP2014256312A priority Critical patent/JP2016117108A/en
Priority to PCT/JP2015/082006 priority patent/WO2016098501A1/en
Priority to TW104140336A priority patent/TW201628783A/en
Publication of JP2016117108A publication Critical patent/JP2016117108A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polyurethanes Or Polyureas (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an easily-manufacturable abrasive pad capable of releasing easily a release film on the surface of an adhesive layer provided on the abrasive pad, when mounting the abrasive pad on an abrasive surface plate.SOLUTION: An abrasive pad has at least a polishing layer, an adhesive layer for sticking an abrasive surface plate, and a release film provided on the adhesive layer surface. A tag member is provided so as to expose the end on one side, between the adhesive layer and the release film.SELECTED DRAWING: Figure 2

Description

本発明はレンズ、反射ミラー等の光学材料、シリコンウエハ、アルミ基板、及び一般的な金属研磨加工等の高度の表面平坦性を要求される材料の平坦化加工を安定、かつ高い研磨効率で行うことが可能な研磨パッドに関するものである。本発明の研磨パッドは、特にシリコンウエハ並びにその上に酸化物層、金属層等が形成されたデバイスを、さらにこれらの酸化物層や金属層を積層・形成する前に平坦化する工程に好適に使用される。   The present invention performs stable and high polishing efficiency on optical materials such as lenses and reflecting mirrors, silicon wafers, aluminum substrates, and materials that require high surface flatness such as general metal polishing. It is related with the polishing pad which can be performed. The polishing pad of the present invention is particularly suitable for a step of planarizing a silicon wafer and a device having an oxide layer, a metal layer, etc. formed thereon, before further laminating and forming these oxide layers and metal layers. Used for.

半導体装置を製造する際には、ウエハ表面に導電性膜を形成し、フォトリソグラフィー、エッチング等をすることにより配線層を形成する工程や、配線層の上に層間絶縁膜を形成する工程等が行われ、これらの工程によってウエハ表面に金属等の導電体や絶縁体からなる凹凸が生じる。近年、半導体集積回路の高密度化を目的として配線の微細化や多層配線化が進んでいるが、これに伴い、ウエハ表面の凹凸を平坦化する技術が重要となってきた。   When manufacturing a semiconductor device, a process of forming a conductive film on the wafer surface and forming a wiring layer by photolithography, etching, or the like, a process of forming an interlayer insulating film on the wiring layer, etc. These steps are performed, and irregularities made of a conductor such as metal or an insulator are generated on the wafer surface. In recent years, miniaturization of wiring and multilayer wiring have been advanced for the purpose of increasing the density of semiconductor integrated circuits, and along with this, technology for flattening the irregularities on the wafer surface has become important.

ウエハ表面の凹凸を平坦化する方法としては、一般的にケミカルメカニカルポリシング（以下、ＣＭＰという）が採用されている。ＣＭＰは、ウエハの被研磨面を研磨パッドの研磨面に押し付けた状態で、砥粒が分散されたスラリー状の研磨剤（以下、スラリーという）を用いて研磨する技術である。ＣＭＰで一般的に使用する研磨装置は、例えば、図１に示すように、研磨パッド１を支持する研磨定盤２と、被研磨材（半導体ウエハ）４を支持する支持台（ポリシングヘッド）５とウエハの均一加圧を行うためのバッキング材と、スラリーの供給機構を備えている。研磨パッド１は、例えば、両面テープで貼り付けることにより、研磨定盤２に装着される。研磨定盤２と支持台５とは、それぞれに支持された研磨パッド１と被研磨材４が対向するように配置され、それぞれに回転軸６、７を備えている。また、支持台５側には、被研磨材４を研磨パッド１に押し付けるための加圧機構が設けてある。   As a method for flattening the irregularities on the wafer surface, chemical mechanical polishing (hereinafter referred to as CMP) is generally employed. CMP is a technique of polishing using a slurry-like abrasive (hereinafter referred to as slurry) in which abrasive grains are dispersed in a state where the surface to be polished of a wafer is pressed against the polishing surface of a polishing pad. As shown in FIG. 1, for example, a polishing apparatus generally used in CMP includes a polishing surface plate 2 that supports a polishing pad 1 and a support base (polishing head) 5 that supports a material to be polished (semiconductor wafer) 4. And a backing material for uniformly pressing the wafer, and a slurry supply mechanism. The polishing pad 1 is attached to the polishing surface plate 2 by attaching it with a double-sided tape, for example. The polishing surface plate 2 and the support base 5 are disposed so that the polishing pad 1 and the material to be polished 4 supported by each of the polishing surface plate 2 and the support base 5 are opposed to each other, and are provided with rotating shafts 6 and 7 respectively. Further, a pressurizing mechanism for pressing the workpiece 4 against the polishing pad 1 is provided on the support base 5 side.

通常、研磨パッドには、研磨定盤に貼り付けるための粘着剤層が設けられており、当該粘着剤層表面には剥離フィルムが設けられている。そして、研磨パッドを研磨定盤に装着する際には、粘着剤層表面の剥離フィルムを剥離し、粘着剤層を研磨定盤に貼り合せる。   Usually, the polishing pad is provided with an adhesive layer for adhering to a polishing surface plate, and a release film is provided on the surface of the adhesive layer. When the polishing pad is attached to the polishing surface plate, the release film on the surface of the pressure-sensitive adhesive layer is peeled off, and the pressure-sensitive adhesive layer is bonded to the polishing surface plate.

しかし、剥離フィルムは薄く、粘着剤層の表面に密着しているため、粘着剤層の表面から剥がし難いという問題があった。   However, since the release film is thin and is in close contact with the surface of the pressure-sensitive adhesive layer, there is a problem that it is difficult to peel off from the surface of the pressure-sensitive adhesive layer.

当該問題を解決するために、特許文献１では、少なくとも研磨層、両面テープ層、および剥離層が順次積層されてなり、剥離層が耳部を有することを特徴とする、化学機械研磨パッドが提案されている。   In order to solve the problem, Patent Document 1 proposes a chemical mechanical polishing pad in which at least a polishing layer, a double-sided tape layer, and a release layer are sequentially laminated, and the release layer has an ear portion. Has been.

しかし、特許文献１の発明では、耳部を有する剥離層を特別に作製しなければならないため、研磨パッドの製造が煩雑になったり、コスト高となる問題がある。   However, in the invention of Patent Document 1, since a release layer having an ear part must be specially produced, there is a problem that the manufacture of the polishing pad becomes complicated and the cost increases.

実用新案登録第３１２４０４６号公報Utility Model Registration No. 3124046

本発明は、研磨パッドを研磨定盤に装着する際に、研磨パッドに設けられた粘着剤層表面の剥離フィルムを容易に剥離することができ、しかも製造が容易な研磨パッドを提供することを目的とする。   The present invention provides a polishing pad that can easily peel off the release film on the surface of the pressure-sensitive adhesive layer provided on the polishing pad when the polishing pad is mounted on a polishing surface plate, and is easy to manufacture. Objective.

本発明者らは、前記課題を解決すべく鋭意検討を重ねた結果、以下に示す研磨パッドにより上記目的を達成できることを見出し、本発明を完成するに至った。   As a result of intensive studies to solve the above problems, the present inventors have found that the above object can be achieved by the polishing pad described below, and have completed the present invention.

すなわち、本発明は、少なくとも研磨層、研磨定盤貼り付け用粘着剤層、及び前記粘着剤層表面に設けられた剥離フィルムを有する研磨パッドであって、
前記粘着剤層と前記剥離フィルムとの間に、片方の端部が露出するようにタグ部材が設けられていることを特徴とする研磨パッド、に関する。 That is, the present invention is a polishing pad having at least a polishing layer, an adhesive layer for attaching a polishing surface plate, and a release film provided on the surface of the adhesive layer,
The present invention relates to a polishing pad, wherein a tag member is provided between the pressure-sensitive adhesive layer and the release film so that one end is exposed.

本発明の研磨パッドは、粘着剤層と剥離フィルムとの間に、片方の端部が露出するようにタグ部材が設けられている。そのため、当該研磨パッドを研磨定盤に装着する際には、タグ部材の露出している片方の端部を掴み、タグ部材を粘着剤層から引き剥がすことにより、粘着剤層と剥離フィルムとの間に隙間ができ、剥離フィルムを粘着剤層から容易に剥離することができる。   In the polishing pad of the present invention, a tag member is provided between the pressure-sensitive adhesive layer and the release film so that one end is exposed. Therefore, when mounting the polishing pad on the polishing surface plate, by grasping one end of the exposed tag member and peeling the tag member from the adhesive layer, the adhesive layer and the release film There is a gap between them, and the release film can be easily peeled from the pressure-sensitive adhesive layer.

前記タグ部材は、片面粘着テープであることが好ましい。タグ部材として片面粘着テープを用いることにより、粘着剤層と剥離フィルムとの間にタグ部材を設ける際に、片面粘着テープの粘着層を剥離フィルムの内表面に貼り付けることができる。それにより、片面粘着テープを粘着剤層から引き剥がす際に、片面粘着テープの粘着層に粘着している剥離フィルムも同時に粘着剤層から引き剥がすことができ、剥離フィルムを粘着剤層からさらに容易に剥離することができる。   The tag member is preferably a single-sided adhesive tape. By using a single-sided adhesive tape as the tag member, the adhesive layer of the single-sided adhesive tape can be attached to the inner surface of the release film when the tag member is provided between the adhesive layer and the release film. As a result, when peeling the single-sided adhesive tape from the adhesive layer, the release film sticking to the adhesive layer of the single-sided adhesive tape can be peeled from the adhesive layer at the same time, making the release film easier from the adhesive layer. Can be peeled off.

前記片面粘着テープの露出している片方の端部は、曲げられて剥離フィルムの外表面に貼り付けられていることが好ましい。それにより、片面粘着テープの粘着層を剥離フィルムの両面に貼り付けることができるため、片面粘着テープを粘着剤層から引き剥がす際に、片面粘着テープが剥離フィルムから剥がれることを確実に防止することができる。また、片面粘着テープの粘着層が手や物に触れることがないという利点もある。   The exposed one end of the single-sided adhesive tape is preferably bent and attached to the outer surface of the release film. As a result, the adhesive layer of the single-sided adhesive tape can be attached to both sides of the release film, so that when the single-sided adhesive tape is peeled from the adhesive layer, the single-sided adhesive tape is reliably prevented from peeling off from the release film. Can do. In addition, there is an advantage that the adhesive layer of the single-sided adhesive tape does not touch a hand or an object.

前記タグ部材の粘着剤層と接触する表面は、剥離処理が施されていることが好ましい。それにより、タグ部材を粘着剤層から引き剥がしやすくなる。   The surface of the tag member that contacts the pressure-sensitive adhesive layer is preferably subjected to a peeling treatment. Thereby, it becomes easy to peel off the tag member from the adhesive layer.

本発明の研磨パッドは、粘着剤層と剥離フィルムとの間に、片方の端部が露出するようにタグ部材が設けられているため、当該研磨パッドを研磨定盤に装着する際に、タグ部材を引き剥がすことにより剥離フィルムを粘着剤層から容易に剥離することができる。特に、ＣＭＰを行うクリーンルームにおいては無塵手袋を装着した状態で剥離フィルムを除去する必要があるため、従来は剥離フィルムの除去作業が非常に煩雑であった。しかし、本発明の研磨パッドを用いることにより、無塵手袋を装着した状態であっても剥離フィルムを粘着剤層から容易に剥離することができるため、クリーンルーム内で研磨パッドを研磨定盤に装着する際の作業効率が格段に向上する。また、本発明の研磨パッドは、製造に際して特別に作製した部材や特別な道具を必要とせず、製造が非常に容易である。   In the polishing pad of the present invention, since the tag member is provided between the pressure-sensitive adhesive layer and the release film so that one end is exposed, the tag is attached when the polishing pad is mounted on the polishing surface plate. By peeling off the member, the release film can be easily peeled from the pressure-sensitive adhesive layer. In particular, in a clean room where CMP is performed, it is necessary to remove the release film while wearing dust-free gloves. Therefore, conventionally, the removal operation of the release film has been very complicated. However, by using the polishing pad of the present invention, the release film can be easily peeled off from the adhesive layer even when wearing dust-free gloves, so the polishing pad is attached to the polishing surface plate in a clean room. The working efficiency when doing so is greatly improved. In addition, the polishing pad of the present invention does not require any specially prepared members or special tools for manufacturing, and is very easy to manufacture.

ＣＭＰ研磨で使用する研磨装置の一例を示す概略構成図である。It is a schematic block diagram which shows an example of the grinding | polishing apparatus used by CMP grinding | polishing. 本発明の研磨パッドの一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the polishing pad of this invention. 本発明の研磨パッドの他の一例を示す概略断面図である。It is a schematic sectional drawing which shows another example of the polishing pad of this invention.

以下、本発明の研磨パッドの具体的な構成を図２及び３を参照しつつ説明する。   Hereinafter, a specific configuration of the polishing pad of the present invention will be described with reference to FIGS.

図２は、本発明の研磨パッドの一例を示す概略断面図である。詳しくは、研磨パッド１は、研磨層８、研磨定盤貼り付け用粘着剤層９、及び前記粘着剤層表面に設けられた剥離フィルム１０が積層された構造を有する。そして、粘着剤層９と剥離フィルム１０との間には、片方の端部が露出するようにタグ部材１１が設けられている。   FIG. 2 is a schematic cross-sectional view showing an example of the polishing pad of the present invention. Specifically, the polishing pad 1 has a structure in which a polishing layer 8, an adhesive layer 9 for attaching a polishing surface plate, and a release film 10 provided on the surface of the adhesive layer are laminated. And between the adhesive layer 9 and the peeling film 10, the tag member 11 is provided so that one edge part may be exposed.

研磨層８の材料は特に限定されず、例えば、ポリウレタン樹脂、ポリエステル樹脂、ポリアミド樹脂、アクリル樹脂、ポリカーボネート樹脂、ハロゲン系樹脂（ポリ塩化ビニル、ポリテトラフルオロエチレン、ポリフッ化ビニリデンなど）、ポリスチレン、オレフィン系樹脂（ポリエチレン、ポリプロピレンなど）、エポキシ樹脂、及び感光性樹脂などが挙げられる。ポリウレタン樹脂は、耐摩耗性に優れ、原料組成を種々変えることにより所望の物性になるように調整できるため、研磨層８の材料として好ましい。   The material of the polishing layer 8 is not particularly limited. For example, polyurethane resin, polyester resin, polyamide resin, acrylic resin, polycarbonate resin, halogen resin (polyvinyl chloride, polytetrafluoroethylene, polyvinylidene fluoride, etc.), polystyrene, olefin Resin (polyethylene, polypropylene, etc.), epoxy resin, and photosensitive resin. Polyurethane resin is preferable as a material for the polishing layer 8 because it is excellent in abrasion resistance and can be adjusted to have desired physical properties by variously changing the raw material composition.

研磨層８は、発泡体であってもよく、無発泡体であってもよいが、ポリウレタン樹脂発泡体により形成されていることが好ましい。   The polishing layer 8 may be a foam or a non-foam, but is preferably formed of a polyurethane resin foam.

ポリウレタン樹脂発泡体の製造方法としては、中空ビーズを添加させる方法、機械的発泡法、化学的発泡法などが挙げられる。   Examples of the method for producing a polyurethane resin foam include a method of adding hollow beads, a mechanical foaming method, and a chemical foaming method.

研磨層８の形状及び大きさは特に限定されないが、円形の場合には、通常直径３０〜１００ｃｍ程度である。   The shape and size of the polishing layer 8 are not particularly limited, but in the case of a circular shape, the diameter is usually about 30 to 100 cm.

研磨層８には、光学終点検出用の窓（光透過領域）が設けられていてもよい。   The polishing layer 8 may be provided with an optical end point detection window (light transmission region).

研磨定盤貼り付け用粘着剤層９は、単層又は複層であってもよく、不織布やフィルム等の基材の両面に粘着剤層を有する両面粘着テープであってもよい。粘着剤層の組成は特に限定されず、例えば、ゴム系粘着剤、アクリル系粘着剤などが挙げられる。両面粘着テープの２つの粘着剤層の組成を異なるものとし、２つの粘着剤層の粘着力を適正化してもよい。その場合、研磨定盤貼り付け側の粘着剤層の粘着力は、他方の粘着剤層の粘着力に比べて低いことが好ましい。それにより、使用済みの研磨パッドを研磨定盤から引き剥がす際に、糊残りなく引き剥がすことができる。   The pressure-sensitive adhesive layer 9 for attaching the polishing surface plate may be a single layer or multiple layers, and may be a double-sided pressure-sensitive adhesive tape having pressure-sensitive adhesive layers on both surfaces of a substrate such as a nonwoven fabric or a film. The composition of the pressure-sensitive adhesive layer is not particularly limited, and examples thereof include rubber-based pressure-sensitive adhesives and acrylic pressure-sensitive adhesives. The composition of the two pressure-sensitive adhesive layers of the double-sided pressure-sensitive adhesive tape may be different, and the adhesive strength of the two pressure-sensitive adhesive layers may be optimized. In that case, it is preferable that the adhesive force of the adhesive layer on the polishing platen attachment side is lower than the adhesive force of the other adhesive layer. Accordingly, when the used polishing pad is peeled off from the polishing surface plate, it can be peeled off without any adhesive residue.

剥離フィルム１０は、研磨パッド１を研磨定盤２に貼り付ける時まで粘着剤層９の表面を保護するために設けられる。剥離フィルム１０の材料は特に限定されず、一般的な紙や樹脂フィルムが用いられる。   The release film 10 is provided to protect the surface of the pressure-sensitive adhesive layer 9 until the polishing pad 1 is attached to the polishing surface plate 2. The material of the release film 10 is not particularly limited, and general paper or resin film is used.

研磨層８と粘着剤層９とは、直接積層されていてもよく、研磨層８と粘着剤層９との間には、例えば、クッション層、剛性層、支持フィルム、及び接着剤層（両面接着テープ）などが、必要に応じて１つ以上積層されていてもよい。   The polishing layer 8 and the pressure-sensitive adhesive layer 9 may be directly laminated. For example, a cushion layer, a rigid layer, a support film, and an adhesive layer (both surfaces) are provided between the polishing layer 8 and the pressure-sensitive adhesive layer 9. 1 or more may be laminated | stacked as needed.

タグ部材１１の材料は特に限定されず、例えば、紙、樹脂フィルム、及び金属箔などが挙げられる。タグ部材１１の形状及び大きさは特に限定されないが、通常、形状は短冊状であり、大きさは長さ０．５〜１０ｃｍ、幅０．５〜５ｃｍ程度である。   The material of the tag member 11 is not particularly limited, and examples thereof include paper, resin film, and metal foil. Although the shape and size of the tag member 11 are not particularly limited, the shape is usually a strip shape, and the size is about 0.5 to 10 cm in length and about 0.5 to 5 cm in width.

タグ部材１１の粘着剤層９と接触する表面は、剥離処理が施されていることが好ましい。剥離処理の方法は公知の方法を採用すればよい。   The surface of the tag member 11 that comes into contact with the pressure-sensitive adhesive layer 9 is preferably subjected to a peeling treatment. A known method may be adopted as the peeling treatment method.

タグ部材１１は、粘着剤層９と剥離フィルム１０との間に挿入することにより設けてもよく、粘着剤層９、タグ部材１１、及び剥離フィルム１０を順次積層することにより設けてもよい。   The tag member 11 may be provided by being inserted between the pressure-sensitive adhesive layer 9 and the release film 10, or may be provided by sequentially laminating the pressure-sensitive adhesive layer 9, the tag member 11, and the release film 10.

タグ部材１１としては、図３に示すような片面粘着テープ１２を用いることが好ましい。片面粘着テープ１２は、不織布やフィルム等の基材１２ａの片面に粘着層１２ｂを有するものである。粘着層１２ｂの組成は特に限定されず、例えば、ゴム系粘着剤、アクリル系粘着剤などが挙げられる。   As the tag member 11, it is preferable to use a single-sided adhesive tape 12 as shown in FIG. The single-sided adhesive tape 12 has an adhesive layer 12b on one side of a substrate 12a such as a nonwoven fabric or a film. The composition of the adhesive layer 12b is not particularly limited, and examples thereof include a rubber adhesive and an acrylic adhesive.

片面粘着テープ１２を粘着剤層９と剥離フィルム１０との間に設ける際には、粘着層１２ｂを剥離フィルム１０の内表面に貼り付ける。基材１２ａの粘着剤層９と接触する表面は、剥離処理が施されていることが好ましい。剥離処理の方法は公知の方法を採用すればよい。   When providing the single-sided adhesive tape 12 between the adhesive layer 9 and the release film 10, the adhesive layer 12 b is attached to the inner surface of the release film 10. It is preferable that the surface which contacts the adhesive layer 9 of the base material 12a has been subjected to a peeling treatment. A known method may be adopted as the peeling treatment method.

片面粘着テープ１２の露出している片方の端部は、図２のタグ部材１１のように固定されていなくてもよいが、図３に示すように、曲げられて剥離フィルム１０の外表面に貼り付けられていることが好ましい。   The exposed one end of the single-sided adhesive tape 12 may not be fixed as in the tag member 11 of FIG. 2, but is bent to the outer surface of the release film 10 as shown in FIG. 3. It is preferable that it is affixed.

本発明の研磨パッド１を研磨定盤２に装着する際には、例えば、タグ部材１１の端部を手で掴み、タグ部材１１を粘着剤層９から引き剥がす。それにより、粘着剤層９と剥離フィルム１０との間に隙間ができるため、その後、剥離フィルム１０を粘着剤層９から容易に剥離することができる。そして、露出した粘着剤層９を研磨定盤２に貼り付けることにより、研磨パッド１を研磨定盤２に装着する。   When the polishing pad 1 of the present invention is mounted on the polishing surface plate 2, for example, the end of the tag member 11 is grasped by hand, and the tag member 11 is peeled off from the adhesive layer 9. Thereby, since a gap is formed between the pressure-sensitive adhesive layer 9 and the release film 10, the release film 10 can be easily peeled from the pressure-sensitive adhesive layer 9 thereafter. Then, the polishing pad 1 is mounted on the polishing surface plate 2 by attaching the exposed adhesive layer 9 to the polishing surface plate 2.

一方、片面粘着テープ１２を用いた場合には、片面粘着テープ１２を粘着剤層９から引き剥がす際に、粘着層１２ｂに粘着している剥離フィルム１０も同時に粘着剤層９から引き剥がすことができる。そのため、剥離フィルム１０を粘着剤層９からさらに容易に剥離することができるだけでなく、作業効率も格段に向上する。   On the other hand, when the single-sided pressure-sensitive adhesive tape 12 is used, when the single-sided pressure-sensitive adhesive tape 12 is peeled off from the pressure-sensitive adhesive layer 9, the release film 10 adhered to the pressure-sensitive adhesive layer 12 b can be peeled off from the pressure-sensitive adhesive layer 9 at the same time. it can. Therefore, not only can the peeling film 10 be peeled from the pressure-sensitive adhesive layer 9 more easily, but also the working efficiency is remarkably improved.

本発明の研磨パッドはレンズ、反射ミラー等の光学材料やシリコンウエハ、アルミ基板、及び一般的な金属研磨加工等の高度の表面平坦性を要求される材料の平坦化加工を安定、かつ高い研磨効率で行うことができる。本発明の研磨パッドは、特にシリコンウエハ並びにその上に酸化物層、金属層等が形成されたデバイスを、さらにこれらの酸化物層や金属層を積層・形成する前に平坦化する工程に好適に使用できる。   The polishing pad of the present invention provides stable and high leveling of flattening of optical materials such as lenses and reflecting mirrors, silicon wafers, aluminum substrates, and materials requiring high surface flatness such as general metal polishing. Can be done with efficiency. The polishing pad of the present invention is particularly suitable for a step of planarizing a silicon wafer and a device having an oxide layer, a metal layer, etc. formed thereon, before further laminating and forming these oxide layers and metal layers. Can be used for

１：研磨パッド
２：研磨定盤
３：研磨剤（スラリー）
４：被研磨材（半導体ウエハ）
５：支持台（ポリシングヘッド）
６、７：回転軸
８：研磨層
９：研磨定盤貼り付け用粘着剤層
１０：剥離フィルム
１１：タグ部材
１２：片面粘着テープ
１２ａ：基材
１２ｂ：粘着層 1: Polishing pad 2: Polishing surface plate 3: Abrasive (slurry)
4: Material to be polished (semiconductor wafer)
5: Support base (polishing head)
6, 7: Rotating shaft 8: Polishing layer 9: Adhesive layer 10 for attaching the polishing surface plate 10: Release film 11: Tag member 12: Single-sided adhesive tape 12a: Base material 12b: Adhesive layer

Claims (4)

少なくとも研磨層、研磨定盤貼り付け用粘着剤層、及び前記粘着剤層表面に設けられた剥離フィルムを有する研磨パッドであって、
前記粘着剤層と前記剥離フィルムとの間に、片方の端部が露出するようにタグ部材が設けられていることを特徴とする研磨パッド。 A polishing pad having at least a polishing layer, an adhesive layer for attaching a polishing surface plate, and a release film provided on the surface of the adhesive layer,
A polishing pad, wherein a tag member is provided between the pressure-sensitive adhesive layer and the release film so that one end is exposed. 前記タグ部材は、片面粘着テープである請求項１記載の研磨パッド。 The polishing pad according to claim 1, wherein the tag member is a single-sided adhesive tape. 前記片面粘着テープの露出している片方の端部は、曲げられて前記剥離フィルムの外表面に貼り付けられている請求項２記載の研磨パッド。 The polishing pad according to claim 2, wherein one end of the single-sided adhesive tape exposed is bent and attached to the outer surface of the release film. 前記タグ部材の前記粘着剤層と接触する表面は、剥離処理が施されている請求項１〜３のいずれかに記載の研磨パッド。 The polishing pad according to claim 1, wherein a surface of the tag member that contacts the pressure-sensitive adhesive layer is subjected to a peeling treatment.
JP2014256312A 2014-12-18 2014-12-18 Abrasive pad Pending JP2016117108A (en)

Priority Applications (3)

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JP2014256312A JP2016117108A (en) 2014-12-18 2014-12-18 Abrasive pad
PCT/JP2015/082006 WO2016098501A1 (en) 2014-12-18 2015-11-13 Polishing pad
TW104140336A TW201628783A (en) 2014-12-18 2015-12-02 Polishing pad

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Publication number Priority date Publication date Assignee Title
JP2020001162A (en) * 2018-06-28 2020-01-09 株式会社荏原製作所 Polishing pad laminate, polishing pad positioning jig, and method of applying polishing pad to polishing table
US20230090077A1 (en) * 2021-09-17 2023-03-23 Cmc Materials, Inc. Chemical mechanical planarization pad with a release liner comprising a pull tab

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KR20210143726A (en) * 2019-03-20 2021-11-29 마루이시 산교 가부시키가이샤 Polishing plate, polishing apparatus and polishing method

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US5170595A (en) * 1990-12-19 1992-12-15 Wiand Ronald C Pull tab for velcro backed marble grinding pad and method for removal
US20010039176A1 (en) * 2000-05-03 2001-11-08 Feeley George F. Polishing pad release liner system
JP2003043934A (en) * 2001-07-23 2003-02-14 Three M Innovative Properties Co Optical filter and double-faced adhesive tape with tab
DE102012024899A1 (en) * 2012-04-16 2013-10-17 Tormaxx Gmbh Protective film for application to a display and set for applying a protective film to a display

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020001162A (en) * 2018-06-28 2020-01-09 株式会社荏原製作所 Polishing pad laminate, polishing pad positioning jig, and method of applying polishing pad to polishing table
US11642753B2 (en) 2018-06-28 2023-05-09 Ebara Corporation Polishing-pad laminated structure, polishing-pad positioning instrument, and method of attaching a polishing pad to a polishing table
US20230090077A1 (en) * 2021-09-17 2023-03-23 Cmc Materials, Inc. Chemical mechanical planarization pad with a release liner comprising a pull tab

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