JP2016035881A - Short-circuit element - Google Patents

Short-circuit element Download PDF

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JP2016035881A
JP2016035881A JP2014159098A JP2014159098A JP2016035881A JP 2016035881 A JP2016035881 A JP 2016035881A JP 2014159098 A JP2014159098 A JP 2014159098A JP 2014159098 A JP2014159098 A JP 2014159098A JP 2016035881 A JP2016035881 A JP 2016035881A
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electrode
short
heating element
soluble conductor
circuit
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JP6343201B2 (en
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吉弘 米田
Yoshihiro Yoneda
吉弘 米田
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Dexerials Corp
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Dexerials Corp
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Priority to TW104125051A priority patent/TWI685870B/en
Priority to KR1020150109954A priority patent/KR102527559B1/en
Priority to CN201510469767.3A priority patent/CN105336995B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/44—Methods for charging or discharging
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Abstract

PROBLEM TO BE SOLVED: To provide a short-circuit element in which melting of a fusible conductor reliably causes a short circuit between short-circuit electrodes.SOLUTION: A short-circuit element includes: a first electrode 11; a second electrode 12 which is provided adjacent to the first electrode 11; a first fusible conductor 13 which is supported by the first electrode 11, and which, by being melted, aggregates across the interval between the first and second electrodes 11, 12, causing a short circuit between the first and second electrodes 11, 12; and a heating element 14 which heats the first fusible conductor 13. The first fusible conductor 13 projects toward the side opposite to the second electrode 12 to be supported.SELECTED DRAWING: Figure 1

Description

本発明は、開放状態の電源ラインや信号ラインを電気信号により物理的且つ電気的に短絡させる短絡素子に関する。   The present invention relates to a short-circuit element that physically and electrically shorts an open power supply line and signal line with an electrical signal.

充電して繰り返し利用することのできる二次電池の多くは、バッテリパックに加工されてユーザに提供される。特に重量エネルギー密度の高いリチウムイオン二次電池においては、ユーザ及び電子機器の安全を確保するために、一般的に、過充電保護、過放電保護等のいくつもの保護回路をバッテリパックに内蔵し、所定の場合にバッテリパックの出力を遮断する機能を有している。   Many secondary batteries that can be charged and used repeatedly are processed into battery packs and provided to users. Particularly in lithium ion secondary batteries with high weight energy density, in order to ensure the safety of users and electronic devices, in general, a battery pack incorporates a number of protection circuits such as overcharge protection and overdischarge protection, It has a function of shutting off the output of the battery pack in a predetermined case.

この種の保護素子には、バッテリパックに内蔵されたＦＥＴスイッチを用いて出力のＯＮ／ＯＦＦを行うことにより、バッテリパックの過充電保護又は過放電保護動作を行うものがある。しかしながら、何らかの原因でＦＥＴスイッチが短絡破壊した場合、雷サージ等が印加されて瞬間的な大電流が流れた場合、あるいはバッテリセルの寿命によって出力電圧が異常に低下したり、逆に過大な異常電圧を出力したり、バッテリセルの各々の電圧ばらつきが大きくなったりした場合であっても、バッテリパックや電子機器は、発火等の事故から保護されなければならない。そこで、このような想定し得るいかなる異常状態においても、バッテリセルの出力を安全に遮断するために、外部からの信号によって電流経路を遮断する機能を有するヒューズ素子からなる保護素子が用いられている。   This type of protection element includes an overcharge protection or overdischarge protection operation of the battery pack by turning on / off the output using an FET switch built in the battery pack. However, when the FET switch is short-circuited for some reason, a lightning surge or the like is applied and an instantaneous large current flows, or the output voltage drops abnormally due to the life of the battery cell, or excessively abnormal Even when the voltage is output or the voltage variation of each battery cell increases, the battery pack and the electronic device must be protected from accidents such as ignition. Therefore, in order to safely shut off the output of the battery cell in any possible abnormal state, a protection element made of a fuse element having a function of cutting off the current path by an external signal is used. .

リチウムイオン二次電池等向けの保護回路の保護素子としては、特許文献１に記載されているように、電流経路上の第１の電極，発熱体引出電極，第２の電極間に亘って可溶導体を接続して電流経路の一部をなし、この電流経路上の可溶導体を、過電流による自己発熱、あるいは保護素子内部に設けた発熱体によって溶断するものがある。このような保護素子では、溶融した液体状の可溶導体を発熱体に繋がる導体層上に集めることにより第１、第２の電極間を分離し電流経路を遮断する。   As a protection element of a protection circuit for a lithium ion secondary battery or the like, as described in Patent Document 1, it can be extended between the first electrode, the heating element extraction electrode, and the second electrode on the current path. There is a type in which a molten conductor is connected to form a part of a current path, and the fusible conductor on the current path is melted by a self-heating due to an overcurrent or a heating element provided inside the protective element. In such a protective element, the melted liquid soluble conductor is collected on the conductor layer connected to the heating element to separate the first and second electrodes and cut off the current path.

特開２０１０−００３６６５号公報JP 2010-003665 A 特開２００４−１８５９６０号公報JP 2004-185960 A 特開２０１２−００３８７８号公報JP 2012-003878 A

ところで、近年、バッテリとモーターを使用したＨＥＶ（Hybrid Electric Vehicle）やＥＶ（Electric Vehicle）が急速に普及している。ＨＥＶやＥＶの動力源としては、エネルギー密度と出力特性からリチウムイオン二次電池が使用されるようになってきている。例えば自動車用途では、高電圧、大電流が必要とされる。このため、高電圧、大電流に耐えられる専用セルが開発されているが、製造コスト上の問題から多くの場合、複数のバッテリセルを直列、並列に接続することで、汎用セルを用いて必要な電圧電流を確保している。   By the way, in recent years, HEV (Hybrid Electric Vehicle) and EV (Electric Vehicle) using a battery and a motor are rapidly spreading. As a power source for HEV and EV, a lithium ion secondary battery has been used from the viewpoint of energy density and output characteristics. For example, in automobile applications, a high voltage and a large current are required. For this reason, dedicated cells that can withstand high voltages and large currents have been developed, but in many cases due to manufacturing cost problems, it is necessary to connect multiple battery cells in series and in parallel to use general-purpose cells. Secures the correct voltage and current.

ここで、高速移動中の自動車等では、急激な駆動力の低下や急停止は却って危険な場合があり、非常時を想定したバッテリ管理が求められている。例えば、走行中にバッテリシステムの異常が起きた際にも、修理工場もしくは安全な場所まで移動するための駆動力、あるいはハザードランプやエアコン用の駆動力を供給できることが、危険回避上、好ましい。   Here, in a car or the like that is moving at high speed, sudden reduction in driving force or sudden stop may be dangerous, and battery management that assumes an emergency is required. For example, when a battery system abnormality occurs during traveling, it is preferable to supply a driving force for moving to a repair shop or a safe place, or a driving force for a hazard lamp or an air conditioner.

しかし、特許文献１のような複数のバッテリセルが直列に接続されたバッテリパックにおいては、充放電経路上にのみ保護素子を設けたような場合、バッテリセルの一部に異常が発生し保護素子を作動させると、バッテリパック全体の充放電経路が遮断されてしまい、これ以上、電力を供給することができない。   However, in a battery pack in which a plurality of battery cells as in Patent Document 1 are connected in series, when a protection element is provided only on the charge / discharge path, an abnormality occurs in a part of the battery cell, and the protection element When is operated, the charging / discharging path of the entire battery pack is interrupted, and no more power can be supplied.

そこで、複数セルで構成されたバッテリパック内の異常なバッテリセルのみを排除し、正常なバッテリセルを有効に活用するために、異常なバッテリセルのみをバイパスするバイパス経路を形成することができる短絡素子が提案されている。   Therefore, in order to eliminate only abnormal battery cells in a battery pack composed of a plurality of cells and effectively use normal battery cells, a short circuit that can bypass only abnormal battery cells can be formed. Devices have been proposed.

図２９に短絡素子の一構成例を示し、図３０に短絡素子を適用したバッテリ回路の回路図を示す。この短絡素子１００は、図２９及び図３０に示すように、充放電経路上においてバッテリセル１０１と並列に接続され、正常時には開放されている第１、第２の短絡電極１０２，１０３と、溶融することにより第１、第２の短絡電極１０２，１０３間を短絡させる２つの可溶導体１０４ａ，１０４ｂと、可溶導体１０４ａと直列に接続され、可溶導体１０４ａ，１０４ｂを溶融させる発熱体１０５を有する。   FIG. 29 shows a configuration example of a short-circuit element, and FIG. 30 shows a circuit diagram of a battery circuit to which the short-circuit element is applied. 29 and 30, the short-circuit element 100 is connected in parallel with the battery cell 101 on the charge / discharge path, and is melted with the first and second short-circuit electrodes 102 and 103 that are normally opened. Thus, the two soluble conductors 104a and 104b that short-circuit the first and second short-circuit electrodes 102 and 103, and the heating element 105 that is connected in series with the soluble conductor 104a and melts the soluble conductors 104a and 104b. Have

短絡素子１００は、セラミック基板等の絶縁基板１１０上に、発熱体１０５及び発熱体１０５の一端と接続された外部接続電極１１１が形成されている。また、短絡素子１００は、発熱体１０５上に、ガラス等の絶縁層１１２を介して、発熱体１０５の他端と接続された発熱体電極１１３、第１、第２の短絡電極１０２，１０３、及び第１、第２の短絡電極１０２，１０３とともに可溶導体１０４ａ，１０４ｂを支持する第１、第２の支持電極１１４，１１５が形成されている。   In the short-circuit element 100, a heating element 105 and an external connection electrode 111 connected to one end of the heating element 105 are formed on an insulating substrate 110 such as a ceramic substrate. In addition, the short-circuit element 100 includes a heating element electrode 113 connected to the other end of the heating element 105 on the heating element 105 via an insulating layer 112 such as glass, first and second short-circuit electrodes 102 and 103, The first and second support electrodes 114 and 115 that support the soluble conductors 104a and 104b are formed together with the first and second short-circuit electrodes 102 and 103.

第１の支持電極１１４は、絶縁層１１２上に露出されている発熱体電極１１３と接続され、また、第１の短絡電極１０２と隣接されている。第１の支持電極１１４は、第１の短絡電極１０２とともに一方の可溶導体１０４ａの両側を支持している。同様に、第２の支持電極１１５は、第２の短絡電極１０３と隣接され、第２の短絡電極１０３とともに他方の可溶導体１０４ｂの両側を支持している。   The first support electrode 114 is connected to the heating element electrode 113 exposed on the insulating layer 112 and is adjacent to the first short-circuit electrode 102. The first support electrode 114 supports both sides of one soluble conductor 104 a together with the first short-circuit electrode 102. Similarly, the second support electrode 115 is adjacent to the second short-circuit electrode 103, and supports both sides of the other soluble conductor 104 b together with the second short-circuit electrode 103.

短絡素子１００は、外部接続電極１１１から、発熱体１０５、発熱体電極１１３、可溶導体１０４ａを経て、第１の短絡電極１０２に至る、発熱体１０５への給電経路が構成される。   The short-circuit element 100 forms a power supply path from the external connection electrode 111 to the first short-circuit electrode 102 through the heat-generating body 105, the heat-generating body electrode 113, and the soluble conductor 104a.

発熱体１０５は、この給電経路を介して電流が流れることにより自己発熱し、この熱（ジュール熱）によって可溶導体１０４ａ，１０４ｂを溶融させる。図３０に示すように、発熱体１０５は、外部接続電極１１１を介してＦＥＴ等の電流制御素子１０６と接続されている。電流制御素子１０６は、バッテリセル１０１の正常時には発熱体１０５への給電を規制し、異常時に充放電経路を介して発熱体１０５へ電流が流れるように制御する。   The heating element 105 self-heats when current flows through the power supply path, and melts the soluble conductors 104a and 104b by this heat (Joule heat). As shown in FIG. 30, the heating element 105 is connected to a current control element 106 such as an FET via an external connection electrode 111. The current control element 106 regulates power supply to the heating element 105 when the battery cell 101 is normal, and controls the current to flow to the heating element 105 via the charge / discharge path when the battery cell 101 is abnormal.

短絡素子１００が用いられたバッテリ回路は、バッテリセル１０１に異常電圧等が検出されると、保護素子１０７によって当該バッテリセル１０１を充放電経路上から遮断するとともに、電流制御素子１０６を作動させ、発熱体１０５へ電流を流す。これにより、発熱体１０５の熱により可溶導体１０４ａ，１０４ｂが溶融する。可溶導体１０４ａ，１０４ｂは、相対的に広面積の第１、第２の短絡電極１０２，１０３側に偏倚した後溶融し、溶融導体が二つの短絡電極１０２，１０３間に亘って凝集、結合する。したがって、短絡電極１０２，１０３は可溶導体１０４ａ，１０４ｂの溶融導体によって短絡され、これにより、バッテリセル１０１をバイパスする電流経路を形成することができる。   When an abnormal voltage or the like is detected in the battery cell 101, the battery circuit using the short-circuit element 100 shuts off the battery cell 101 from the charge / discharge path by the protection element 107 and activates the current control element 106. A current is passed through the heating element 105. Thereby, the soluble conductors 104a and 104b are melted by the heat of the heating element 105. The fusible conductors 104a and 104b are melted after being biased toward the first and second short-circuit electrodes 102 and 103 having a relatively large area, and the molten conductor is aggregated and bonded between the two short-circuit electrodes 102 and 103. To do. Therefore, the short-circuit electrodes 102 and 103 are short-circuited by the molten conductors of the fusible conductors 104 a and 104 b, thereby forming a current path that bypasses the battery cell 101.

また、短絡素子１００は、可溶導体１０４ａが第１の短絡電極１０２側に移動するとともに溶融することにより、第１の支持電極１１４と第１の短絡電極１０２間が開放され、これにより発熱体１０５への給電経路が遮断されるため、発熱体１０５の発熱が停止する。   Further, in the short-circuit element 100, the fusible conductor 104a moves to the first short-circuit electrode 102 side and melts, whereby the space between the first support electrode 114 and the first short-circuit electrode 102 is opened, thereby the heating element. Since the power supply path to 105 is interrupted, the heat generation of the heating element 105 stops.

ここで、この種の短絡素子１００においては、可溶導体１０４ａ，１０４ｂの溶融によって短絡電極１０２，１０３間を確実に短絡させることが求められる。すなわち、短絡素子１００は、可溶導体１０４ａ，１０４ｂの溶融導体が短絡電極１０２，１０３間に亘って凝集することによって短絡電極１０２，１０３を短絡させるものであり、より多くの溶融導体を短絡電極１０２，１０３上に凝集させることが求められる。   Here, in this type of short-circuit element 100, it is required to reliably short-circuit the short-circuit electrodes 102 and 103 by melting the fusible conductors 104a and 104b. That is, the short-circuit element 100 short-circuits the short-circuit electrodes 102 and 103 by agglomeration of the melted conductors of the soluble conductors 104a and 104b across the short-circuit electrodes 102 and 103. Aggregation on 102,103 is required.

しかし、短絡電極１０２，１０３上に多くの溶融導体を凝集させるために、相対的に短絡電極１０２，１０３を第１、第２の支持電極１１４，１１５よりも広面積とすると、例えば短絡素子１００のリフロー実装時等において、可溶導体１０４ａ，１０４ｂが第１、第２の支持電極１１４，１１５から離間し短絡電極１０２，１０３上に移動する恐れがある。このため、短絡素子１００は、作動前に発熱体１０５への給電経路が遮断されるとともに、短絡電極１０２，１０３間が短絡される初期短絡のリスクがある。   However, if the short-circuit electrodes 102 and 103 have a relatively larger area than the first and second support electrodes 114 and 115 in order to agglomerate many molten conductors on the short-circuit electrodes 102 and 103, for example, the short-circuit element 100 During reflow mounting, the fusible conductors 104a and 104b may move away from the first and second support electrodes 114 and 115 and move onto the short-circuit electrodes 102 and 103. For this reason, the short-circuit element 100 has a risk of an initial short circuit in which the power supply path to the heating element 105 is interrupted before the operation and the short-circuit electrodes 102 and 103 are short-circuited.

また、初期短絡リスクを低減させるために短絡電極１０２，１０３の面積を狭くすると、可溶導体１０４ａ，１０４ｂの溶融導体が短絡電極１０２，１０３間にわたって凝集せず、短絡電極１０２，１０３間を短絡させることができないリスクもある。   Further, if the area of the short-circuit electrodes 102 and 103 is reduced in order to reduce the risk of initial short-circuit, the melted conductors of the soluble conductors 104a and 104b do not aggregate between the short-circuit electrodes 102 and 103, and the short-circuit electrodes 102 and 103 are short-circuited. There are risks that cannot be made.

そのため、バッテリ回路等の各種回路においては、可溶導体の溶融によって確実に短絡電極間を短絡させバイパス電流経路を形成することができる短絡素子が望まれている。   Therefore, in various circuits such as a battery circuit, a short-circuit element that can reliably short-circuit between short-circuit electrodes by melting a fusible conductor to form a bypass current path is desired.

上述した課題を解決するために、本発明に係る短絡素子は、第１の電極と、上記第１の電極と隣接して設けられた第２の電極と、上記第１の電極に支持され、溶融することにより、上記第１、第２の電極間にわたって凝集し、上記第１、第２の電極を短絡させる第１の可溶導体と、上記第１の可溶導体を加熱する発熱体とを備え、上記第１の可溶導体は、上記第２の電極と反対側に突出して支持されているものである。   In order to solve the above-described problem, a short-circuit element according to the present invention is supported by a first electrode, a second electrode provided adjacent to the first electrode, and the first electrode. A first soluble conductor that aggregates between the first and second electrodes by melting and short-circuits the first and second electrodes; and a heating element that heats the first soluble conductor; The first soluble conductor is supported so as to protrude to the opposite side of the second electrode.

本発明によれば、第１の可溶導体は実装温度よりも融点が高く、第２の電極と反対側に突出して支持されているため、リフロー実装時等において加熱されても、第２の電極との接触による初期短絡を防止することができる。また、第１の可溶導体は、発熱体が第１の可溶導体の融点以上の温度に発熱されると溶融し、溶融導体が第１の電極の周囲に凝集することにより、第１の電極に隣接して配置された第２の電極とも接触し、第１、第２の電極間を短絡させることができる。   According to the present invention, the first fusible conductor has a melting point higher than the mounting temperature and is supported so as to protrude to the opposite side of the second electrode. An initial short circuit due to contact with the electrode can be prevented. In addition, the first soluble conductor melts when the heating element generates heat at a temperature equal to or higher than the melting point of the first soluble conductor, and the molten conductor aggregates around the first electrode. The second electrode disposed adjacent to the electrode is also in contact with the first electrode and the second electrode can be short-circuited.

図１は、本発明が適用された短絡素子を示す図であり、（Ａ）は平面図、（Ｂ）はＡ−Ａ’断面図である。1A and 1B are diagrams showing a short-circuit element to which the present invention is applied, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along line A-A ′. 図２は、本発明が適用された短絡素子が作動した状態を示す図であり、（Ａ）は平面図、（Ｂ）はＡ−Ａ’断面図である。2A and 2B are diagrams illustrating a state in which the short-circuit element to which the present invention is applied is activated, in which FIG. 2A is a plan view and FIG. 2B is a cross-sectional view taken along line A-A ′. 図３は、本発明が適用された他の短絡素子を示す図であり、（Ａ）は平面図、（Ｂ）はＡ−Ａ’断面図である。3A and 3B are diagrams showing another short-circuit element to which the present invention is applied, in which FIG. 3A is a plan view and FIG. 3B is a cross-sectional view taken along line A-A ′. 図４は、本発明が適用された短絡素子を示す回路構成図である。FIG. 4 is a circuit configuration diagram showing a short-circuit element to which the present invention is applied. 図５は、本発明が適用された短絡素子が作動した状態を示す回路構成図である。FIG. 5 is a circuit configuration diagram showing a state in which the short-circuit element to which the present invention is applied operates. 図６は、補助可溶導体を備えた短絡素子を示す図であり、（Ａ）は平面図、（Ｂ）はＡ−Ａ’断面図である。6A and 6B are diagrams illustrating a short-circuit element including an auxiliary fusible conductor, where FIG. 6A is a plan view and FIG. 6B is a cross-sectional view taken along line A-A ′. 図７は、本発明が適用された短絡素子を示す回路図であり、（Ａ）は発熱体の給電経路と第１の可溶導体を電気的に接続した短絡素子、（Ｂ）は発熱体の給電経路と第１の可溶導体を電気的に独立した短絡素子、（Ｃ）は第２の可溶導体を備え、給電経路を自動的に遮断する短絡素子を示す。FIG. 7 is a circuit diagram showing a short-circuit element to which the present invention is applied, in which (A) is a short-circuit element in which a power feeding path of the heating element and a first soluble conductor are electrically connected, and (B) is a heating element. (C) shows a short-circuit element that includes a second soluble conductor and automatically shuts off the power-feed path. 図８は、補助可溶導体を備えた短絡素子が作動した状態を示す図であり、（Ａ）は平面図、（Ｂ）はＡ−Ａ’断面図である。FIGS. 8A and 8B are diagrams illustrating a state where the short-circuit element including the auxiliary fusible conductor is operated, in which FIG. 8A is a plan view and FIG. 8B is a cross-sectional view taken along line A-A ′. 図９は、表面実装型の短絡素子を示す図であり、（Ａ）は平面図、（Ｂ）はＡ−Ａ’断面図である。9A and 9B are diagrams illustrating a surface-mounting type short-circuit element, where FIG. 9A is a plan view and FIG. 9B is a cross-sectional view taken along line A-A ′. 図１０は、発熱体が発熱中の表面実装型の短絡素子を示す図であり、（Ａ）は平面図、（Ｂ）はＡ−Ａ’断面図である。10A and 10B are diagrams showing a surface-mounting short-circuit element whose heating element is generating heat, where FIG. 10A is a plan view and FIG. 10B is a cross-sectional view taken along line A-A ′. 図１１は、発熱体の発熱が停止された表面実装型の短絡素子を示す図であり、（Ａ）は平面図、（Ｂ）はＡ−Ａ’断面図である。11A and 11B are diagrams showing a surface-mount type short-circuit element in which heat generation of the heating element is stopped, where FIG. 11A is a plan view and FIG. 11B is a cross-sectional view taken along line A-A ′. 図１２は、発熱体への給電経路が第１、第２の電極と電気的に独立している短絡素子を示す図であり、（Ａ）は平面図、（Ｂ）はＡ−Ａ’断面図である。12A and 12B are diagrams showing a short-circuit element in which a power feeding path to a heating element is electrically independent from the first and second electrodes, where FIG. 12A is a plan view and FIG. 12B is a cross-sectional view taken along line AA ′. FIG. 図１３（Ａ）（Ｂ）は、発熱体への給電経路が第１、第２の電極と電気的に独立している短絡素子の回路構成を示す図である。FIGS. 13A and 13B are diagrams illustrating a circuit configuration of a short-circuit element in which a power feeding path to the heating element is electrically independent from the first and second electrodes. 図１４は、発熱体への給電経路が第１、第２の電極と電気的に独立している短絡素子が適用された短絡回路の一例を示す図である。FIG. 14 is a diagram illustrating an example of a short circuit to which a short circuit element in which a power supply path to the heating element is electrically independent from the first and second electrodes is applied. 図１５は、補助可溶導体を備えた短絡素子を示す図であり、（Ａ）は平面図、（Ｂ）はＡ−Ａ’断面図である。15A and 15B are diagrams showing a short-circuit element including an auxiliary fusible conductor, where FIG. 15A is a plan view and FIG. 15B is a cross-sectional view taken along line A-A ′. 図１６は、発熱体への給電経路上に第２の可溶導体を備えた短絡素子を示す図であり、（Ａ）は平面図、（Ｂ）はＡ−Ａ’断面図である。16A and 16B are diagrams showing a short-circuit element having a second soluble conductor on a power supply path to a heating element, where FIG. 16A is a plan view and FIG. 16B is a cross-sectional view taken along line A-A ′. 図１７は、第２の可溶導体を備えた短絡素子が作動した状態を示す図であり、（Ａ）は平面図、（Ｂ）はＡ−Ａ’断面図である。FIG. 17 is a diagram illustrating a state in which the short-circuit element including the second fusible conductor is activated, in which (A) is a plan view and (B) is a cross-sectional view taken along line A-A ′. 図１８は、第２の可溶導体及び補助可溶導体を備えた短絡素子を示す図であり、（Ａ）は平面図、（Ｂ）はＡ−Ａ’断面図である。18A and 18B are diagrams showing a short-circuit element including a second soluble conductor and an auxiliary soluble conductor, where FIG. 18A is a plan view and FIG. 18B is a cross-sectional view taken along line A-A ′. 図１９（Ａ）は発熱体を絶縁基板の裏面側に設けた短絡素子を示す断面図であり、図１９（Ｂ）は発熱体を絶縁基板の内部に設けた短絡素子を示す断面図である。19A is a cross-sectional view showing a short-circuit element in which a heating element is provided on the back side of the insulating substrate, and FIG. 19B is a cross-sectional view showing a short-circuit element in which the heating element is provided inside the insulating substrate. . 図２０は、高融点金属層と低融点金属層を有し、被覆構造を備える可溶導体を示す斜視図であり、（Ａ）は高融点金属層を内層とし低融点金属層で被覆した構造を示し、（Ｂ）は低融点金属層を内層とし高融点金属層で被覆した構造を示す。FIG. 20 is a perspective view showing a soluble conductor having a high-melting-point metal layer and a low-melting-point metal layer and having a coating structure, and (A) is a structure in which the high-melting-point metal layer is an inner layer and is covered with a low-melting-point metal layer. (B) shows a structure in which a low melting point metal layer is used as an inner layer and is covered with a high melting point metal layer. 図２１は、高融点金属層と低融点金属層の積層構造を備える可溶導体を示す斜視図であり、（Ａ）は上下２層構造、（Ｂ）は内層及び外層の３層構造を示す。FIG. 21 is a perspective view showing a soluble conductor having a laminated structure of a high-melting point metal layer and a low-melting point metal layer, where (A) shows a two-layer structure of upper and lower layers, and (B) shows a three-layer structure of an inner layer and an outer layer. . 図２２は、高融点金属層と低融点金属層の多層構造を備える可溶導体を示す断面図である。FIG. 22 is a cross-sectional view showing a soluble conductor having a multilayer structure of a high melting point metal layer and a low melting point metal layer. 図２３は、高融点金属層の表面に線状の開口部が形成され低融点金属層が露出されている可溶導体を示す平面図であり、（Ａ）は長手方向に沿って開口部が形成されたもの、（Ｂ）は幅方向に沿って開口部が形成されたものである。FIG. 23 is a plan view showing a fusible conductor in which a linear opening is formed on the surface of the refractory metal layer and the low melting point metal layer is exposed. FIG. 23A shows the opening along the longitudinal direction. The formed part (B) has an opening formed in the width direction. 図２４は、高融点金属層の表面に円形の開口部が形成され低融点金属層が露出されている可溶導体を示す平面図である。FIG. 24 is a plan view showing a soluble conductor in which a circular opening is formed on the surface of the refractory metal layer and the low melting point metal layer is exposed. 図２５は、高融点金属層に円形の開口部が形成され、内部に低融点金属が充填された可溶導体を示す平面図である。FIG. 25 is a plan view showing a soluble conductor in which a circular opening is formed in a refractory metal layer and a low melting point metal is filled therein. 図２６は、高融点金属によって囲まれた低融点金属が露出された可溶導体を示す斜視図である。FIG. 26 is a perspective view showing the soluble conductor in which the low melting point metal surrounded by the high melting point metal is exposed. 図２７は、図２６に示す可溶導体を用いた短絡素子の動作前の状態を示す図であり、（Ａ）は平面図、（Ｂ）はＡ−Ａ’断面図である。27 is a diagram showing a state before the operation of the short-circuit element using the fusible conductor shown in FIG. 26, (A) is a plan view, and (B) is an A-A ′ sectional view. 図２８は、図２６に示す可溶導体を用いた短絡素子の動作前の状態を示す図であり、（Ａ）は平面図、（Ｂ）はＡ−Ａ’断面図である。FIG. 28 is a diagram showing a state before the operation of the short-circuit element using the fusible conductor shown in FIG. 26, (A) is a plan view, and (B) is an A-A ′ sectional view. 図２９は、参考例に係る短絡素子を示す平面図である。FIG. 29 is a plan view showing a short-circuit element according to a reference example. 図３０は、参考例に係る短絡素子を用いたバッテリ回路構成を示す図である。FIG. 30 is a diagram illustrating a battery circuit configuration using the short-circuit element according to the reference example.

以下、本発明が適用された短絡素子について、図面を参照しながら詳細に説明する。なお、本発明は、以下の実施形態のみに限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々の変更が可能であることは勿論である。また、図面は模式的なものであり、各寸法の比率等は現実のものとは異なることがある。具体的な寸法等は以下の説明を参酌して判断すべきものである。また、図面相互間においても互いの寸法の関係や比率が異なる部分が含まれていることは勿論である。   Hereinafter, a short circuit element to which the present invention is applied will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention. Further, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

［短絡素子１］
本発明が適用された短絡素子１は、図１（Ａ）（Ｂ）に示すように、第１の電極１１と、第１の電極１１と隣接して設けられた第２の電極１２と、第１の電極１１に支持され、溶融することにより、第１、第２の電極１１，１２間にわたって凝集し、第１、第２の電極１１，１２を短絡させる第１の可溶導体１３と、第１の可溶導体１３を加熱する発熱体１４とを備える。 [Short-circuit element 1]
As shown in FIGS. 1A and 1B, the short-circuit element 1 to which the present invention is applied includes a first electrode 11, a second electrode 12 provided adjacent to the first electrode 11, A first soluble conductor 13 that is supported by the first electrode 11 and melts to agglomerate between the first and second electrodes 11 and 12 and short-circuit the first and second electrodes 11 and 12. And a heating element 14 for heating the first soluble conductor 13.

これら第１、第２の電極１１，１２や発熱体１４は、例えばアルミナ等の絶縁基板上に高融点金属ペーストの印刷・焼成等により、同一平面上に形成される。また、第１、第２の電極１１，１２や発熱体１４は、高融点金属からなる線材や板材等の機構部品を用い、所定の位置に支持すること等によって形成してもよい。   The first and second electrodes 11 and 12 and the heating element 14 are formed on the same plane by printing and baking a refractory metal paste on an insulating substrate such as alumina. The first and second electrodes 11 and 12 and the heating element 14 may be formed by using a mechanical part such as a wire or plate made of a refractory metal and supporting it at a predetermined position.

第１、第２の電極１１，１２は、近接配置されるとともに開放され、短絡素子１が作動することにより、図２（Ａ）（Ｂ）に示すように、後述する第１の可溶導体１３の溶融導体１３ａが凝集、結合し、この溶融導体１３ａを介して短絡されるスイッチ２を構成する。第１、第２の電極１１，１２は、それぞれ、一端に外部接続端子１１ａ，１２ａが設けられている。第１、第２の電極１１，１２は、これら外部接続端子１１ａ，１２ａを介して電源回路やデジタル信号回路等の外部回路と接続され、短絡素子１が動作することにより、当該外部回路のバイパス電流経路、あるいは機能回路への給電経路となる。   The first and second electrodes 11 and 12 are arranged close to each other and opened, and the short-circuit element 1 is operated, whereby the first soluble conductor described later is shown in FIGS. 2A and 2B. The thirteen molten conductors 13a are agglomerated and combined to constitute a switch 2 that is short-circuited via the molten conductor 13a. The first and second electrodes 11 and 12 are respectively provided with external connection terminals 11a and 12a at one end. The first and second electrodes 11 and 12 are connected to an external circuit such as a power supply circuit and a digital signal circuit through the external connection terminals 11a and 12a, and the short circuit element 1 operates to bypass the external circuit. It becomes a current path or a power supply path to the functional circuit.

なお、機構部品で構成された第１、第２の電極１１，１２の一部が支持体によって支持されている場合、当該支持体は、熱伝導率が１０Ｗ／ｍ・Ｋ以下の絶縁材料とすることが好ましい。短絡素子１は、第１、第２の電極１１，１２の一部を支持する支持体が、例えば熱伝導率が２５Ｗ／ｍ・Ｋと高いアルミナセラミックケースに収められている場合、第１、第２の電極１１，１２の熱が当該支持体を介してアルミナセラミックケースに放熱され、加熱しにくい状況となる。   In addition, when a part of 1st, 2nd electrodes 11 and 12 comprised by the mechanism components are supported by the support body, the said support body is made from the insulating material whose heat conductivity is 10 W / m * K or less, and It is preferable to do. When the support body that supports a part of the first and second electrodes 11 and 12 is housed in an alumina ceramic case having a high thermal conductivity of 25 W / m · K, for example, The heat of the second electrodes 11 and 12 is radiated to the alumina ceramic case through the support, and it becomes difficult to heat.

そこで、熱伝導率が１０Ｗ／ｍ・Ｋ以下の絶縁材料からなる支持体によって第１、第２の電極１１，１２を支持することにより、短絡素子１は、第１、第２の電極１１，１２に伝わった発熱体１４の熱が支持体を介して汎用的なアルミナセラミック等の外筐体に放熱されることを防止し、速やかに第１の可溶導体１３を加熱、溶融させることができる。なお、支持体の熱伝導率は、外筐体よりも低くすることにより外筐体への放熱を抑制でき、熱伝導率が１０Ｗ／ｍ・Ｋ以下とすることで、汎用的なアルミナセラミックの外筐体への放熱を十分に抑制することができ、さらに支持体材料として最大熱伝導率が２Ｗ／ｍ・Ｋ以下のプラスチックやガラスを用いることが放熱抑制上好ましい。   Therefore, the first and second electrodes 11 and 12 are supported by a support made of an insulating material having a thermal conductivity of 10 W / m · K or less, whereby the short-circuit element 1 has the first and second electrodes 11 and 12. The heat of the heating element 14 transmitted to 12 can be prevented from being radiated to the outer casing such as a general-purpose alumina ceramic through the support, and the first soluble conductor 13 can be quickly heated and melted. it can. In addition, the heat conductivity of the support body can be suppressed to be lower than that of the outer case, thereby suppressing the heat radiation to the outer case, and the heat conductivity is 10 W / m · K or less, so that a general-purpose alumina ceramic can be used. Heat dissipation to the outer casing can be sufficiently suppressed, and it is preferable to use plastic or glass having a maximum thermal conductivity of 2 W / m · K or less as the support material.

第１の可溶導体１３は、発熱体１４の発熱により速やかに溶融されるいずれの金属を用いることができ、例えば、Ｓｎ又はＳｎを主成分とするＰｂフリーハンダ等の低融点金属を好適に用いることができる。   As the first soluble conductor 13, any metal that can be quickly melted by the heat generated by the heating element 14 can be used. For example, a low-melting-point metal such as Pb-free solder mainly containing Sn or Sn is preferably used. Can be used.

また、第１の可溶導体１３は、低融点金属と高融点金属とを含有してもよい。低融点金属としては、Ｓｎ又はＳｎを主成分とするＰｂフリーハンダなどのハンダを用いることが好ましく、高融点金属としては、Ａｇ、Ｃｕ又はこれらを主成分とする合金などを用いることが好ましい。高融点金属と低融点金属とを含有することによって、短絡素子１をリフロー実装する場合に、リフロー温度が低融点金属の溶融温度を超えて、低融点金属が溶融しても、低融点金属の外部への流出を抑制し、第１の可溶導体１３の形状を維持することができる。また、溶断時も、低融点金属が溶融することにより、高融点金属を溶食（ハンダ食われ）することで、高融点金属の融点以下の温度で速やかに溶断することができる。なお、第１の可溶導体１３は、後に説明するように、様々な構成によって形成することができる。   The first soluble conductor 13 may contain a low melting point metal and a high melting point metal. As the low melting point metal, it is preferable to use solder such as Sn or Pb-free solder containing Sn as a main component, and as the high melting point metal, it is preferable to use Ag, Cu or an alloy containing these as main components. By including the high melting point metal and the low melting point metal, even when the reflow temperature exceeds the melting temperature of the low melting point metal and the low melting point metal melts when the short circuit element 1 is reflow mounted, Outflow to the outside can be suppressed and the shape of the first soluble conductor 13 can be maintained. In addition, even when fusing, the low melting point metal melts, and the high melting point metal is eroded (soldered), so that the fusing can be quickly performed at a temperature lower than the melting point of the high melting point metal. In addition, the 1st soluble conductor 13 can be formed by various structures so that it may demonstrate later.

第１の可溶導体１３は、略矩形板状に形成され、第１の電極１１上に、接続用ハンダ等の接合材１５等を介して接続されている。ここで、本発明に係る短絡素子１は、第１の可溶導体１３が、第２の電極１２と反対側に突出して支持されている。第１の可溶導体１３は、短絡素子１の作動前においては、第２の電極１２と離間して支持されている。そして、第１の可溶導体１３は、発熱体１４が発熱されると発熱体１４の熱によって溶融し、溶融導体１３ａが第１の電極１１の周囲に凝集することにより、第１の電極１１に隣接して配置された第２の電極１２とも接触し、第１、第２の電極１１，１２間を短絡させる。   The first soluble conductor 13 is formed in a substantially rectangular plate shape, and is connected to the first electrode 11 via a bonding material 15 such as a connection solder. Here, in the short-circuit element 1 according to the present invention, the first fusible conductor 13 protrudes on the side opposite to the second electrode 12 and is supported. The first fusible conductor 13 is supported separately from the second electrode 12 before the operation of the short-circuit element 1. The first fusible conductor 13 is melted by the heat of the heating element 14 when the heating element 14 generates heat, and the molten conductor 13a aggregates around the first electrode 11, thereby causing the first electrode 11 to melt. Is also in contact with the second electrode 12 disposed adjacent to the first and second electrodes 11, 12.

第１の可溶導体１３は、図１（Ｂ）に示すように、第２の電極１２と反対側に突出して支持されることにより、加熱実装等において接合材１５が溶融した場合にも、第２の電極１２との接触が確実に防止され、発熱体１４の発熱前における予期しない初期短絡を防止することができる。   As shown in FIG. 1 (B), the first fusible conductor 13 protrudes and is supported on the opposite side of the second electrode 12, so that the bonding material 15 can be melted in heat mounting or the like. Contact with the second electrode 12 is reliably prevented, and an unexpected initial short circuit before the heat generating element 14 generates heat can be prevented.

なお、第１の可溶導体１３は、酸化防止、濡れ性の向上等のため、フラックス２４（図９参照）が塗布されている。また、第１の可溶導体１３は、第２の電極１２が設けられた側と反対側に突出していればよく、必ずしも第２の電極１２と正反対の方向に突出されている必要はない。   The first soluble conductor 13 is coated with a flux 24 (see FIG. 9) to prevent oxidation and improve wettability. Moreover, the 1st soluble conductor 13 should just protrude to the opposite side to the side in which the 2nd electrode 12 was provided, and does not necessarily need to protrude in the direction opposite to the 2nd electrode 12. FIG.

［発熱体］
第１の可溶導体１３を加熱、溶融させる発熱体１４は、通電すると発熱する導電性を有する部材であって、たとえばニクロム、Ｗ、Ｍｏ、Ｒｕ等又はこれらを含む材料からなる。発熱体１４を絶縁基板上に設ける場合、これらの合金あるいは組成物、化合物の粉状体を樹脂バインダ等と混合して、ペースト状にしたものをスクリーン印刷技術を用いてパターン形成して、焼成する等によって形成する。 [Heating element]
The heating element 14 that heats and melts the first soluble conductor 13 is a conductive member that generates heat when energized, and is made of, for example, nichrome, W, Mo, Ru, or a material containing these. When the heating element 14 is provided on an insulating substrate, a powdery body of these alloys, compositions, or compounds is mixed with a resin binder or the like, and a paste is formed into a pattern using a screen printing technique and fired. And so on.

［絶縁層］
発熱体１４は、絶縁層１７を介して第１の可溶導体１３を支持する第１の電極１１と連続され、絶縁層１７を介して第１の電極１１を加熱することができる。絶縁層１７は、発熱体１４の保護及び絶縁を図るとともに、発熱体１４の熱を効率よく第１の電極１１へ伝えるために設けられ、例えばガラス層からなる。第１の電極１１は、発熱体１４によって加熱されることにより、第１の可溶導体１３を溶融させるとともに、溶融導体１３ａを凝集しやすくすることができる。 [Insulation layer]
The heating element 14 is continuous with the first electrode 11 that supports the first soluble conductor 13 via the insulating layer 17, and can heat the first electrode 11 via the insulating layer 17. The insulating layer 17 is provided in order to protect and insulate the heating element 14 and to transfer the heat of the heating element 14 to the first electrode 11 efficiently, and is made of, for example, a glass layer. The first electrode 11 is heated by the heating element 14 so that the first soluble conductor 13 can be melted and the molten conductor 13a can be easily aggregated.

また、発熱体１４は、一端が発熱体引出電極１８と接続され、他端が発熱体電極１９と接続されている。発熱体引出電極１８、及び発熱体電極１９は、発熱体１４を通電させる外部回路との接続電極であり、発熱体１４は、外部回路によって発熱体引出電極１８と発熱体電極１９間にわたる通電が制御される。   The heating element 14 has one end connected to the heating element extraction electrode 18 and the other end connected to the heating element electrode 19. The heating element extraction electrode 18 and the heating element electrode 19 are connection electrodes to an external circuit for energizing the heating element 14, and the heating element 14 is energized between the heating element extraction electrode 18 and the heating element electrode 19 by the external circuit. Be controlled.

短絡素子１は、発熱体引出電極１８に第１の可溶導体１３の一端を支持させてもよい。第１の可溶導体１３が第１の電極１１と発熱体引出電極１８とに支持されることにより、短絡素子１は、第１の電極１１及び第１の可溶導体１３が発熱体１４への通電経路の一部を構成する。したがって、短絡素子１は、第１の可溶導体１３が溶融し、第１、第２の電極１１，１２間が短絡すると、第１の電極１１と発熱体引出電極１８との間が溶断され、発熱体１４への通電経路が遮断されるため、発熱を停止させることができる。なお、発熱体引出電極１８は、より多くの溶融導体１３ａを第１の電極１１に凝集させるために、第１の電極１１よりも幅狭に形成されることが好ましい。   In the short-circuit element 1, one end of the first soluble conductor 13 may be supported by the heating element extraction electrode 18. Since the first soluble conductor 13 is supported by the first electrode 11 and the heating element extraction electrode 18, the first electrode 11 and the first soluble conductor 13 are connected to the heating element 14 in the short-circuit element 1. Part of the current-carrying path. Therefore, in the short-circuit element 1, when the first soluble conductor 13 is melted and the first and second electrodes 11 and 12 are short-circuited, the first electrode 11 and the heating element extraction electrode 18 are fused. Since the energization path to the heating element 14 is interrupted, the heat generation can be stopped. The heating element extraction electrode 18 is preferably formed to be narrower than the first electrode 11 in order to agglomerate more molten conductors 13a into the first electrode 11.

［大径部］
また、第１の電極１１は、部分的に断面積の大きな大径部１６を形成してもよい。大径部１６は、発熱体引出電極１８や第１の電極１１の他の部分よりも表面積が広く、これにより第１の可溶導体１３の溶融導体１３ａを保持する許容量が多くなる。また、大径部１６は第２の電極１２と隣接されるとともに、第１の電極１１の他の部分よりも第２の電極１２との距離も短い。したがって、大径部１６を設けることにより、より多くの第１の可溶導体１３の溶融導体１３ａを大径部１６に凝集させるとともに、溶融導体１３ａを第２の電極１２と接触させやすくなり、確実に第１、第２の電極１１，１２間を短絡させることができる。 [Large diameter part]
Further, the first electrode 11 may partially form a large diameter portion 16 having a large cross-sectional area. The large-diameter portion 16 has a larger surface area than the heating element extraction electrode 18 and other portions of the first electrode 11, thereby increasing an allowable amount for holding the molten conductor 13 a of the first soluble conductor 13. The large-diameter portion 16 is adjacent to the second electrode 12, and the distance from the second electrode 12 is shorter than other portions of the first electrode 11. Therefore, by providing the large diameter portion 16, more molten conductors 13a of the first soluble conductor 13 are aggregated into the large diameter portion 16, and the molten conductor 13a is easily brought into contact with the second electrode 12, The first and second electrodes 11 and 12 can be reliably short-circuited.

なお、第１、第２の電極１１，１２の間隔は、第１、第２の電極間隔の延長線上における大径部１６の幅以下とすることが好ましい。例えば、図１に示すように、短絡素子１は、第１、第２の電極１１，１２の間隔Ｗ1は、第１、第２の電極間隔の延長線上における大径部１６の幅Ｗ2以下とすることが好ましい。これにより、第１、第２の電極１１，１２がより近接した位置に配置されることとなり、より確実に、第１の可溶導体１３の溶融導体１３ａが大径部１６の周囲に凝集する際に第２の電極１２にも接触し、第１、第２の電極１１，１２間にわたって溶融導体１３ａを凝集させることができる。 In addition, it is preferable that the space | interval of the 1st, 2nd electrodes 11 and 12 shall be below the width | variety of the large diameter part 16 on the extension line | wire of the 1st, 2nd electrode space | interval. For example, as shown in FIG. 1, in the short-circuit element 1, the interval W 1 between the first and second electrodes 11, 12 is the width W 2 of the large-diameter portion 16 on the extension line of the first and second electrode intervals. The following is preferable. Thereby, the first and second electrodes 11 and 12 are arranged closer to each other, and the molten conductor 13a of the first soluble conductor 13 is more reliably aggregated around the large-diameter portion 16. At this time, the molten conductor 13a can be agglomerated between the first and second electrodes 11 and 12 by contacting the second electrode 12 as well.

［絶縁被覆］
また、短絡素子１は、第１の電極１１と連続する第１の配線１１ｂを設けるとともに、第２の電極１２と連続する第２の配線１２ｂを設け、第１、第２の配線１１ｂ，１２ｂの表面を絶縁部材２３によって被覆してもよい。短絡素子１は、第１、第２の電極１１，１２と連続する第１、第２の配線１１ｂ，１２ｂを絶縁被覆することにより、可溶導体１３の溶融導体１３ａの凝集位置が、溶融導体１３ａに対する濡れ性を有しない絶縁部材２３によって規制される。これにより、短絡素子１は、溶融導体１３ａが外部接続端子１１ａ，１２ａ側に流出することを防止するとともに、溶融導体１３ａを第１、第２の電極１１，１２間にわたって凝集させることができ、確実に第１、第２の電極１１，１２間を短絡させることができる。 [Insulation coating]
In addition, the short-circuit element 1 is provided with a first wiring 11 b continuous with the first electrode 11 and a second wiring 12 b continuous with the second electrode 12, and the first and second wirings 11 b and 12 b are provided. The surface may be covered with an insulating member 23. The short-circuit element 1 is formed by insulatingly covering the first and second wirings 11b and 12b that are continuous with the first and second electrodes 11 and 12, so that the fusion conductor 13a of the fusible conductor 13 has an agglomerated position. It is regulated by the insulating member 23 having no wettability with respect to 13a. Thereby, the short-circuit element 1 can prevent the molten conductor 13a from flowing out to the external connection terminals 11a and 12a side, and can aggregate the molten conductor 13a between the first and second electrodes 11 and 12, The first and second electrodes 11 and 12 can be reliably short-circuited.

［第１の可溶導体の体積限定］
また、短絡素子１は、図１（Ｂ）に示すように、第１の可溶導体１３の体積が、少なくとも、第１の電極１１の第２の電極１２と対峙する側面の面積と、第１、第２の電極１１，１２間距離Ｗ1との積以上とすることが好ましい。これにより、第１の可溶導体１３が第１、第２の電極１１，１２間の空間を埋めるのに必要な体積を備え、溶融導体１３ａによって第１、第２の電極１１，１２間を短絡させることができる。 [Volume limitation of first soluble conductor]
In addition, as shown in FIG. 1B, the short-circuit element 1 has a volume of the first soluble conductor 13 that is at least an area of a side surface facing the second electrode 12 of the first electrode 11, It is preferable that the product is equal to or more than the product of the distance W 1 between the first and second electrodes 11 and 12. As a result, the first soluble conductor 13 has a volume necessary for filling the space between the first and second electrodes 11 and 12, and the gap between the first and second electrodes 11 and 12 is provided by the molten conductor 13a. Can be short-circuited.

なお、短絡素子１は、図３に示すように、第１、第２の電極１１，１２を断面略矩形状に形成してもよい。図３に示す場合も、第１の可溶導体１３の体積は、第１の電極１１の側面の面積と、第１、第２の電極１１，１２間距離Ｗとの積以上とすることが好ましい。   In addition, as shown in FIG. 3, the short circuit element 1 may form the 1st, 2nd electrodes 11 and 12 in cross-sectional substantially rectangular shape. Also in the case shown in FIG. 3, the volume of the first fusible conductor 13 should be not less than the product of the area of the side surface of the first electrode 11 and the distance W between the first and second electrodes 11 and 12. preferable.

［回路構成］
短絡素子１は、図４に示す回路構成を有する。すなわち、短絡素子１は、動作前の状態において、第１の電極１１と第２の電極１２とが近接されるとともに離間されることにより絶縁され、第１の可溶導体１３が溶融することにより短絡するスイッチ２を構成する。第１、第２の電極１１，１２は、短絡素子１が実装される回路基板の電流経路上に直列接続されることにより、電源回路等の各種外部回路２８Ａ，２８Ｂ間に組み込まれる。 [Circuit configuration]
The short-circuit element 1 has a circuit configuration shown in FIG. That is, in the state before the operation, the short-circuit element 1 is insulated when the first electrode 11 and the second electrode 12 are brought close to each other and separated from each other, and the first soluble conductor 13 is melted. A short-circuiting switch 2 is configured. The first and second electrodes 11 and 12 are incorporated between various external circuits 28A and 28B such as a power supply circuit by being connected in series on the current path of the circuit board on which the short-circuit element 1 is mounted.

また、短絡素子１は、第１の電極１１から第１の可溶導体１３、発熱体引出電極１８を介して発熱体１４が連続し、さらに発熱体電極１９へ至る給電経路３が形成される。   Further, in the short-circuit element 1, the heating element 14 continues from the first electrode 11 via the first soluble conductor 13 and the heating element extraction electrode 18, and the power supply path 3 leading to the heating element electrode 19 is formed. .

短絡素子１は、通常においては、発熱体電極１９を介して接続されている電流制御素子３２によって給電経路３への通電が制御されている。電流制御素子３２は、給電経路３の通電を制御するスイッチ素子であり、例えばＦＥＴにより構成され、短絡素子１が組み込まれる外部回路の物理的な短絡の要否を検出する検出素子３５と接続されている。検出素子３５は、短絡素子１が組み込まれた各種外部回路２８Ａ，２８Ｂ間を通電する必要が生じたかを検出する回路であり、例えばバッテリパックの異常電圧時におけるバイパス電流経路の構築、ネットワーク通信機器におけるハッキングやクラッキングに対してデータサーバを迂回するバイパス信号経路の構築、あるいはデバイスやソフトウェアのアクティベーション等、第１、第２の電極１１，１２の短絡により物理的、不可逆的に外部回路２８Ａ，２８Ｂ間の電流経路を短絡させる必要が生じた場合に電流制御素子３２を動作させる。   In the short-circuit element 1, energization to the power feeding path 3 is normally controlled by a current control element 32 connected via the heating element electrode 19. The current control element 32 is a switch element that controls energization of the power supply path 3, and is configured by, for example, an FET, and is connected to a detection element 35 that detects the necessity of a physical short circuit of an external circuit in which the short circuit element 1 is incorporated. ing. The detection element 35 is a circuit that detects whether it is necessary to energize between the various external circuits 28A and 28B in which the short-circuit element 1 is incorporated. For example, the construction of a bypass current path when the battery pack has an abnormal voltage, network communication equipment The external circuit 28A, physically or irreversibly by the short circuit of the first and second electrodes 11 and 12, such as the construction of a bypass signal path that bypasses the data server for hacking or cracking in the case of, When it is necessary to short-circuit the current path between 28B, the current control element 32 is operated.

これにより、短絡素子１は、電流制御素子３２によって給電経路３が通電され、発熱体１４が発熱される。給電経路３を介して発熱体１４に電気が通電されると、図２（Ａ）（Ｂ）に示すように、第１の可溶導体１３が発熱体１４によって加熱、溶融され溶融導体１３ａが第１の電極１１の周囲に凝集するとともに、隣接配置された第２の電極１２とも接触する。これにより、短絡素子１は、絶縁されていた第１、第２の電極１１，１２が溶融導体１３ａを介して短絡され、外部回路２８Ａ，２８Ｂが接続される。   As a result, in the short-circuit element 1, the power supply path 3 is energized by the current control element 32, and the heating element 14 generates heat. When electricity is supplied to the heating element 14 via the power supply path 3, the first soluble conductor 13 is heated and melted by the heating element 14 as shown in FIGS. The agglomerates around the first electrode 11 and also comes into contact with the adjacent second electrode 12. Thus, in the short-circuit element 1, the insulated first and second electrodes 11 and 12 are short-circuited via the molten conductor 13a, and the external circuits 28A and 28B are connected.

このとき、短絡素子１は、第１の可溶導体１３が発熱体１４の熱により溶融すると、溶融導体１３ａが第１の電極の周囲に凝集する過程で張力によって第２の電極１２へ接触し、確実に第１、第２の電極１１，１２間を短絡させることができる。   At this time, when the first fusible conductor 13 is melted by the heat of the heating element 14, the short-circuit element 1 comes into contact with the second electrode 12 by tension in the process in which the molten conductor 13 a aggregates around the first electrode. The first and second electrodes 11 and 12 can be reliably short-circuited.

また、短絡素子１は、第１の可溶導体１３を、第２の電極１２と反対側に突出して支持し、好ましくは発熱体引出電極１８とともに支持しているため、例えば短絡素子１を外部回路にリフロー実装する場合に接合材１５が溶融し、第１の可溶導体１３が第２の電極１２側に偏倚して短絡されてしまう初期短絡を防止することができる。   Further, since the short-circuit element 1 supports the first fusible conductor 13 so as to protrude to the opposite side of the second electrode 12, and preferably supports the heating element extraction electrode 18, the short-circuit element 1 is externally provided, for example. When reflow mounting is performed on the circuit, it is possible to prevent an initial short circuit in which the bonding material 15 is melted and the first fusible conductor 13 is biased toward the second electrode 12 and short-circuited.

また、短絡素子１は、第１、第２の電極１１，１２間が短絡した後、第１の電極１１と発熱体引出電極１８との間を接続していた第１の可溶導体１３が溶断する。これにより、短絡素子１は、第１の可溶導体１３を介して接続されていた第１の電極１１と発熱体引出電極１８との間が開放され、発熱体１４への給電経路３が遮断される。したがって、発熱体１４への給電が止まり、発熱体１４の発熱が停止される。短絡素子１の動作時の回路構成を図５に示す。   In addition, the short-circuit element 1 includes the first soluble conductor 13 that has connected the first electrode 11 and the heating element lead electrode 18 after the first and second electrodes 11 and 12 are short-circuited. Fusing. As a result, the short-circuit element 1 opens between the first electrode 11 and the heating element extraction electrode 18 connected via the first soluble conductor 13, and the power supply path 3 to the heating element 14 is blocked. Is done. Therefore, the power supply to the heating element 14 is stopped, and the heating of the heating element 14 is stopped. A circuit configuration during operation of the short-circuit element 1 is shown in FIG.

［溶断順序］
ここで、短絡素子１は、第１、第２の電極１１，１２間が短絡した後に、第１の電極１１と発熱体引出電極１８との間を接続していた第１の可溶導体１３が溶断するように形成されている。第１の可溶導体１３を介して接続された第１の電極１１と発熱体引出電極１８とは、発熱体１４への給電経路３を構成するため、第１、第２の電極１１，１２の短絡より先に第１の電極１１と発熱体引出電極１８との間が溶断すると、発熱体１４への給電が停止され、第１、第２の電極１１，１２間を短絡させることができない恐れがあるからである。 [Fusing order]
Here, the short-circuit element 1 includes the first soluble conductor 13 that has connected the first electrode 11 and the heating element extraction electrode 18 after the first and second electrodes 11 and 12 are short-circuited. Is formed so as to melt. The first electrode 11 and the heating element extraction electrode 18 connected via the first fusible conductor 13 constitute the power supply path 3 to the heating element 14, and therefore the first and second electrodes 11, 12. If the gap between the first electrode 11 and the heating element extraction electrode 18 is melted prior to the short circuit, the power supply to the heating element 14 is stopped and the first and second electrodes 11 and 12 cannot be short-circuited. Because there is a fear.

そこで、短絡素子１は、発熱体１４が発熱すると、第１の電極１１と発熱体引出電極１８との間の遮断よりも先に、第１、第２の電極１１，１２間が短絡するように形成されている。具体的に、短絡素子１は、第１の電極１１が絶縁層１７を介して発熱体１４と連続されるとともに、発熱体引出電極１８が第１、第２の電極１１，１２よりも発熱体１４と離間した位置に配設されている。これにより、短絡素子１は、発熱体１４が発熱すると、絶縁層１７を介して第１の電極１１が発熱体引出電極１８よりも早く熱が伝わる。したがって、第１の電極１１によって第１の可溶導体１３を溶融させると、速やかに溶融導体１３ａが第１の電極１１の周囲に凝集するとともに、溶融導体１３ａが第１、第２の電極１１，１２間を短絡させ、その後、発熱体引出電極１８を遮断することができる。   Therefore, when the heating element 14 generates heat, the short-circuit element 1 causes the first and second electrodes 11 and 12 to be short-circuited before the interruption between the first electrode 11 and the heating element extraction electrode 18. Is formed. Specifically, in the short-circuit element 1, the first electrode 11 is continuous with the heating element 14 via the insulating layer 17, and the heating element extraction electrode 18 is more heating element than the first and second electrodes 11 and 12. 14 is disposed at a position separated from 14. Thereby, in the short-circuit element 1, when the heating element 14 generates heat, the heat is transmitted to the first electrode 11 faster than the heating element extraction electrode 18 through the insulating layer 17. Therefore, when the first soluble conductor 13 is melted by the first electrode 11, the molten conductor 13 a quickly aggregates around the first electrode 11, and the molten conductor 13 a becomes the first and second electrodes 11. , 12 can be short-circuited, and then the heating element extraction electrode 18 can be shut off.

［補助可溶導体］
また、短絡素子１は、図６、図７（Ａ）に示すように、第２の電極１２に補助可溶導体２１を接続させるとともに、発熱体１４が絶縁層１７を介して第１、第２の電極１１，１２と連続させてもよい。 [Auxiliary soluble conductor]
Further, as shown in FIG. 6 and FIG. 7A, the short-circuit element 1 connects the auxiliary soluble conductor 21 to the second electrode 12, and the heating element 14 is connected to the first and first elements via the insulating layer 17. The two electrodes 11 and 12 may be continuous.

第２の電極１２にも補助可溶導体２１を設けることにより、図８に示すように、短絡素子１は、第１の可溶導体１３及び補助可溶導体２１の各溶融導体１３ａ，２１ａによって、第１、第２の電極１１，１２間にわたって凝集する溶融導体の量を増大させ、確実に短絡させることができる。補助可溶導体２１は、第１の可溶導体１３と同じ材料を用いて形成することができる。また、補助可溶導体２１も、後に説明するように、様々な構成によって形成することができる。また、補助可溶導体２１は、第１の可溶導体１３と同様に接合ハンダ等の接合材１５によって第２の電極１２に接合されている。   By providing the auxiliary soluble conductor 21 also on the second electrode 12, as shown in FIG. 8, the short-circuit element 1 is formed by the molten conductors 13a and 21a of the first soluble conductor 13 and the auxiliary soluble conductor 21, respectively. The amount of the molten conductor that aggregates between the first and second electrodes 11 and 12 can be increased, and a short circuit can be reliably achieved. The auxiliary soluble conductor 21 can be formed using the same material as the first soluble conductor 13. The auxiliary soluble conductor 21 can also be formed by various configurations as will be described later. The auxiliary soluble conductor 21 is bonded to the second electrode 12 by a bonding material 15 such as bonding solder, similarly to the first soluble conductor 13.

なお、補助可溶導体２１は、第２の電極１２から第１の電極１１側に突出して設けられ、第１の電極１１と離間しつつ重畳する位置まで突出することが好ましい。また、補助可溶導体２１は、第１の可溶導体１３とも重畳するように支持することにより、補助可溶導体２１の溶融導体２１ａと第１の可溶導体１３の溶融導体１３ａとが凝集しやすく、第１、第２の電極１１，１２間の短絡に寄与することができる。   The auxiliary fusible conductor 21 is preferably provided so as to protrude from the second electrode 12 toward the first electrode 11, and protrudes to a position where it overlaps while being separated from the first electrode 11. Further, the auxiliary soluble conductor 21 is supported so as to overlap with the first soluble conductor 13, so that the molten conductor 21a of the auxiliary soluble conductor 21 and the molten conductor 13a of the first soluble conductor 13 are aggregated. This can easily contribute to a short circuit between the first and second electrodes 11 and 12.

なお、補助可溶導体２１は、第２の電極１２から第１の電極１１と反対側に突出して設けてもよい。これにより、補助可溶導体２１は、第１の可溶導体１３と同様に、加熱実装時等において接合材１５が溶融し第１、第２の電極１１，１２間が短絡する初期短絡を防止することができる。   The auxiliary soluble conductor 21 may be provided so as to protrude from the second electrode 12 to the opposite side of the first electrode 11. As a result, the auxiliary fusible conductor 21 prevents the initial short circuit in which the bonding material 15 is melted and short-circuited between the first and second electrodes 11 and 12 at the time of heat mounting or the like, similar to the first fusible conductor 13. can do.

補助可溶導体２１が接合された第２の電極１２は、第１の電極１１と同様に、絶縁層１７を介して発熱体１４と連続されている。これにより、第２の電極１２は、絶縁層１７を介して発熱体１４の熱が効率よく伝わり、補助可溶導体２１を速やかに溶融させることができる。   Similar to the first electrode 11, the second electrode 12 to which the auxiliary fusible conductor 21 is joined is connected to the heating element 14 via the insulating layer 17. Thereby, the heat of the heat generating body 14 is efficiently transmitted to the second electrode 12 through the insulating layer 17, and the auxiliary soluble conductor 21 can be rapidly melted.

更に、第２の電極１２の中空構造による熱容量低下，材料の低比熱化，材料の高熱伝導率化などにより昇温速度を上げる事により、補助可溶導体２１の溶融を早め、第１の電極１１と第２の電極１２との間の短絡を第１の可溶導体１３の溶融よりも早くする事で、確実に第１の電極１１と発熱体引出電極１８との間の遮断よりも先に、第１、第２の電極１１，１２間を短絡させる事ができる。   Furthermore, the melting of the auxiliary soluble conductor 21 is accelerated by increasing the temperature rising rate by reducing the heat capacity due to the hollow structure of the second electrode 12, reducing the specific heat of the material, increasing the thermal conductivity of the material, etc. By making the short circuit between the first electrode 11 and the second electrode 12 faster than the melting of the first fusible conductor 13, it is ensured that the first electrode 11 and the heating element extraction electrode 18 are interrupted. In addition, the first and second electrodes 11 and 12 can be short-circuited.

［表面実装タイプ］
また、本発明が適用された短絡素子は、外部回路基板に表面実装可能に形成することができる。表面実装用に形成された短絡素子１は、図９〜１１に示すように、絶縁基板１０の表面１０ａに発熱体１４と、発熱体引出電極１８と、発熱体電極１９とが形成され、絶縁層１７を介して発熱体１４上に第１、第２の電極１１，１２が積層されている。第１の可溶導体１３は、第１の電極１１に支持され第２の電極１２と反対側に突出されると共に、発熱体引出電極１８と接続されている。なお、図９は短絡素子１の発熱体１４の発熱前の状態を示す図であり、図１０は短絡素子１の発熱体１４の発熱中の状態を示す図であり、図１１は短絡素子１の発熱体１４の発熱停止後の状態を示す図である。 [Surface mount type]
Moreover, the short-circuit element to which the present invention is applied can be formed on the external circuit board so as to be surface-mounted. As shown in FIGS. 9 to 11, the short-circuit element 1 formed for surface mounting has a heating element 14, a heating element extraction electrode 18, and a heating element electrode 19 formed on the surface 10 a of the insulating substrate 10. The first and second electrodes 11 and 12 are stacked on the heating element 14 via the layer 17. The first soluble conductor 13 is supported by the first electrode 11 and protrudes to the opposite side of the second electrode 12, and is connected to the heating element extraction electrode 18. 9 is a diagram showing a state before the heat generating element 14 of the short-circuit element 1 is heated, FIG. 10 is a diagram showing a state during the heat generation of the heat generating element 14 of the short-circuit element 1, and FIG. It is a figure which shows the state after the heat_generation | fever 14 stops the heat_generation | fever.

絶縁基板１０は、たとえば、アルミナ、ガラスセラミックス、ムライト、ジルコニアなどの絶縁性を有する部材を用いて略方形状に形成されている。絶縁基板１０は、その他にも、ガラスエポキシ基板、フェノール基板等のプリント配線基板に用いられる材料を用いてもよいが、第１の可溶導体１３の溶断時の温度に留意する必要がある。   The insulating substrate 10 is formed in a substantially square shape using an insulating member such as alumina, glass ceramics, mullite, zirconia, and the like. In addition, the insulating substrate 10 may be made of a material used for a printed wiring board such as a glass epoxy board or a phenol board, but it is necessary to pay attention to the temperature at which the first soluble conductor 13 is melted.

発熱体１４は、たとえばＷ、Ｍｏ、Ｒｕ等の合金あるいは組成物、化合物の粉状体を樹脂バインダ等と混合して、ペースト状にしたものをスクリーン印刷技術を用いて絶縁基板１０の表面１０ａ上にパターン形成して、焼成する等によって形成することができる。また、発熱体引出電極１８及び発熱体電極１９は、Ａｇ等の高融点金属ペーストをスクリーン印刷技術を用いて絶縁基板１０の表面１０ａ上にパターン形成して、焼成する等によって形成することができる。   The heating element 14 is made of, for example, an alloy or composition such as W, Mo, or Ru, or a powdery substance mixed with a resin binder and the like, and is formed into a paste form by using a screen printing technique. It can be formed by patterning on top and firing. Further, the heating element extraction electrode 18 and the heating element electrode 19 can be formed by patterning a high melting point metal paste such as Ag on the surface 10a of the insulating substrate 10 using a screen printing technique, and baking the pattern. .

また、発熱体１４は、一端が発熱体引出電極１８と接続され、他端が発熱体電極１９と接続されている。発熱体引出電極１８は、絶縁基板１０の表面１０ａに形成され発熱体１４と接続される下層部１８ａと、下層部１８ａ上に積層され第１の可溶導体１３と接続される上層部１８ｂとを有する。発熱体引出電極１８の上層部１８ｂは、下層部１８ａから絶縁層１７上にかけて形成され、接合材１５を介して第１の可溶導体１３が接続されている。発熱体電極１９は、絶縁基板１０の裏面１０ｂに形成された外部接続端子１９ａと接続されている。発熱体１４は、この外部接続端子１９ａを介して外部回路と接続される。   The heating element 14 has one end connected to the heating element extraction electrode 18 and the other end connected to the heating element electrode 19. The heating element extraction electrode 18 is formed on the surface 10a of the insulating substrate 10 and is connected to the heating element 14, and the upper layer part 18b is stacked on the lower layer part 18a and connected to the first soluble conductor 13. Have The upper layer portion 18 b of the heating element extraction electrode 18 is formed from the lower layer portion 18 a to the insulating layer 17, and the first soluble conductor 13 is connected through the bonding material 15. The heating element electrode 19 is connected to an external connection terminal 19 a formed on the back surface 10 b of the insulating substrate 10. The heating element 14 is connected to an external circuit through the external connection terminal 19a.

発熱体１４は、絶縁基板１０の表面１０ａ上において絶縁層１７に被覆されている。絶縁層１７は、発熱体１４の保護及び絶縁を図るとともに、発熱体１４の熱を効率よく第１、第２の電極１１，１２へ伝えるために設けられ、例えばガラス層からなる。絶縁層１７上には、発熱体１４と重畳するように第１、第２の電極１１，１２が隣接して形成され、発熱体１４から離間して発熱体引出電極１８が形成されている。第１、第２の電極１１，１２は、発熱体１４によって加熱されることにより、第１の可溶導体１３の溶融導体１３ａを凝集しやすくすることができる。   The heating element 14 is covered with an insulating layer 17 on the surface 10 a of the insulating substrate 10. The insulating layer 17 is provided to protect and insulate the heating element 14 and efficiently transmit the heat of the heating element 14 to the first and second electrodes 11 and 12, and is made of, for example, a glass layer. On the insulating layer 17, first and second electrodes 11 and 12 are formed adjacent to each other so as to overlap the heating element 14, and a heating element extraction electrode 18 is formed apart from the heating element 14. The first and second electrodes 11 and 12 can be made to easily aggregate the molten conductor 13 a of the first soluble conductor 13 by being heated by the heating element 14.

なお、絶縁層１７は、絶縁基板１０と発熱体１４との間にも形成してもよい。すなわち、短絡素子１は、発熱体１４を絶縁基板１０の表面１０ａに形成された絶縁層１７の内部に形成してもよい。   The insulating layer 17 may also be formed between the insulating substrate 10 and the heating element 14. That is, in the short-circuit element 1, the heating element 14 may be formed inside the insulating layer 17 formed on the surface 10 a of the insulating substrate 10.

第１、第２の電極１１，１２は、絶縁基板１０の表面１０ａから絶縁層１７上にかけて形成される。また、第１、第２の電極１１，１２は、絶縁基板１０の裏面１０ｂに形成された外部接続端子１１ａ，１２ａと接続されている。短絡素子１は、この外部接続端子１１ａ，１２ａを介して電源回路等の各種外部回路に組み込まれる。   The first and second electrodes 11 and 12 are formed from the surface 10 a of the insulating substrate 10 to the insulating layer 17. The first and second electrodes 11 and 12 are connected to external connection terminals 11 a and 12 a formed on the back surface 10 b of the insulating substrate 10. The short-circuit element 1 is incorporated into various external circuits such as a power supply circuit via the external connection terminals 11a and 12a.

第１の電極１１と発熱体引出電極１８との間には、板状に形成された第１の可溶導体１３が接続される。第１の可溶導体１３は、第１の電極１１及び発熱体引出電極１８に設けられた接合ハンダ等の接合材１５によって第１の電極１１及び発熱体引出電極１８に導通可能に支持されている。これにより、短絡素子１は、第１の電極１１、第１の可溶導体１３、発熱体引出電極１８、発熱体１４、発熱体電極１９に至る発熱体１４への給電経路３が形成される。   A plate-like first soluble conductor 13 is connected between the first electrode 11 and the heating element extraction electrode 18. The first fusible conductor 13 is supported by the first electrode 11 and the heating element extraction electrode 18 so as to be conductive by a bonding material 15 such as bonding solder provided on the first electrode 11 and the heating element extraction electrode 18. Yes. As a result, in the short-circuit element 1, the power supply path 3 to the heating element 14 that reaches the first electrode 11, the first soluble conductor 13, the heating element extraction electrode 18, the heating element 14, and the heating element electrode 19 is formed. .

また、短絡素子１は、隣接して設けられた第１、第２の電極１１，１２の対向する一部を除いて絶縁部材２３が形成されている。絶縁部材２３は、ガラス等の溶融導体１３ａに対する濡れ性を有しない材料が用いられる。第１、第２の電極１１，１２は、相対向する側縁を除き絶縁部材２３が設けられることにより、溶融導体１３ａが絶縁部材２３の設けられていない第１、第２の電極１１，１２間にわたって凝集されるため、確実に短絡させることができる。   In addition, the short-circuit element 1 is formed with an insulating member 23 except for a part of the first and second electrodes 11 and 12 that are provided adjacent to each other. The insulating member 23 is made of a material having no wettability with respect to the molten conductor 13a such as glass. The first and second electrodes 11 and 12 are provided with an insulating member 23 except for opposite side edges, so that the molten conductor 13a is not provided with the insulating member 23, and the first and second electrodes 11 and 12 are not provided. Since it is aggregated over time, it can be short-circuited reliably.

更に、絶縁部材２３に覆われた第１、第２の電極１１，１２は、重畳する発熱体１４とほぼ同じエリアに拡大することにより、発熱体１４からの熱を効率良く集めて第１の可溶導体１３をより短時間に溶融させることができる。また、第２の電極１１の上に、補助可溶導体２１や接合材１５をあらかじめ設置しておくことで、加熱時の短絡動作がより確実とすることができる。   Further, the first and second electrodes 11 and 12 covered with the insulating member 23 are expanded to substantially the same area as the overlapping heating element 14, thereby efficiently collecting heat from the heating element 14 to the first electrode. The soluble conductor 13 can be melted in a shorter time. Moreover, the short circuiting operation at the time of heating can be made more reliable by installing the auxiliary soluble conductor 21 and the bonding material 15 in advance on the second electrode 11.

なお、短絡素子１は、発熱体引出電極１８にも絶縁層２３が形成され、接続用ハンダ等の接合材１５や溶融導体１３ａの流出を防止している。さらに、第１の可溶導体１３は、酸化防止、濡れ性の向上等のため、フラックス２４が塗布されている。また、短絡素子１は、絶縁基板１０の表面１０ａ上がカバー部材（図示せず）によって覆われている。   In the short-circuit element 1, an insulating layer 23 is also formed on the heating element extraction electrode 18 to prevent the bonding material 15 such as connecting solder and the molten conductor 13 a from flowing out. Further, the first soluble conductor 13 is coated with a flux 24 for preventing oxidation, improving wettability, and the like. Further, in the short-circuit element 1, the surface 10a of the insulating substrate 10 is covered with a cover member (not shown).

短絡素子１は、発熱体１４が発熱すると、図１０（Ａ）（Ｂ）に示すように、絶縁層１７及び第１、第２の電極１１，１２を介して第１の可溶導体１３が加熱され、溶融導体１３ａが第１、第２の電極１１，１２間に凝集し、短絡させる。このとき、短絡素子１は、第１、第２の電極１１，１２上に設けた絶縁部材２３によって溶融導体１３ａを第１、第２の電極１１，１２間に留めることで、第１、第２の電極１１，１２間を短絡させやすくするとともに、溶融導体１３ａが外部接続端子１１ａ，１２ａ側へ流出し、外部回路との接続状態に影響を与える事態を防止することができる。   When the heating element 14 generates heat, the short-circuiting element 1 has the first soluble conductor 13 via the insulating layer 17 and the first and second electrodes 11 and 12 as shown in FIGS. When heated, the molten conductor 13a agglomerates between the first and second electrodes 11 and 12 to cause a short circuit. At this time, the short-circuit element 1 holds the molten conductor 13 a between the first and second electrodes 11 and 12 by the insulating member 23 provided on the first and second electrodes 11 and 12, thereby The two electrodes 11 and 12 can be easily short-circuited, and the molten conductor 13a can be prevented from flowing out to the external connection terminals 11a and 12a and affecting the connection state with the external circuit.

次いで、図１１（Ａ）（Ｂ）に示すように、短絡素子１は、第１の可溶導体１３が第１の電極１１と発熱体引出電極１８との間で溶断し、発熱体１４への給電経路３が遮断され発熱が停止する。   Next, as shown in FIGS. 11A and 11B, in the short-circuit element 1, the first soluble conductor 13 is melted between the first electrode 11 and the heating element extraction electrode 18, and the heating element 14 is reached. Is interrupted and heat generation stops.

ここで、短絡素子１は、第１、第２の電極１１，１２が発熱体１４と重畳し、発熱体引出電極１８が発熱体１４から離間した位置に設けられているため、発熱体１４が発熱すると、第１の電極１１と発熱体引出電極１８との間の給電経路３の遮断よりも先に、第１、第２の電極１１，１２間を短絡させることができる。   Here, in the short-circuit element 1, the first and second electrodes 11 and 12 are overlapped with the heating element 14, and the heating element extraction electrode 18 is provided at a position separated from the heating element 14. When heat is generated, the first and second electrodes 11 and 12 can be short-circuited before the power supply path 3 between the first electrode 11 and the heating element extraction electrode 18 is interrupted.

［短絡素子５０］
また、本発明が適用された短絡素子は、発熱体１４への給電経路３と、第１の可溶導体１３によって短絡される第１、第２の電極１１，１２とが電気的に独立していてもよい。この短絡素子５０は、図１２（Ａ）（Ｂ）に示すように、発熱体１４の一端に発熱体引出電極１８が接続され、発熱体１４の他端に発熱体電極１９が形成され、発熱体１４への給電経路３を形成するとともに、第１の可溶導体１３が発熱体引出電極１８と接続されることなく第１の電極１１に支持されているものである。なお、短絡素子５０の説明において、上述した短絡素子１と同じ部材については同じ符号を付してその詳細を省略する。 [Short-circuit element 50]
In the short-circuit element to which the present invention is applied, the power supply path 3 to the heating element 14 and the first and second electrodes 11 and 12 short-circuited by the first soluble conductor 13 are electrically independent. It may be. As shown in FIGS. 12A and 12B, this short-circuit element 50 has a heating element extraction electrode 18 connected to one end of the heating element 14 and a heating element electrode 19 formed on the other end of the heating element 14 to generate heat. The power supply path 3 to the body 14 is formed, and the first soluble conductor 13 is supported by the first electrode 11 without being connected to the heating element extraction electrode 18. In the description of the short-circuit element 50, the same members as those of the short-circuit element 1 described above are denoted by the same reference numerals and the details thereof are omitted.

短絡素子５０は、第１の可溶導体１３を支持する第１の電極１１が、絶縁層１７を介して発熱体１４と連続され、発熱体１４の熱が効率よく伝わることで、第１の可溶導体１３を溶融させることができる。すなわち、短絡素子５０は、発熱体１４と第１の電極１１及び第１の可溶導体１３とが電気的に独立し、熱的に接続されたものである。   In the short-circuit element 50, the first electrode 11 that supports the first soluble conductor 13 is connected to the heating element 14 via the insulating layer 17, and the heat of the heating element 14 is efficiently transmitted, so that the first electrode 11 is supported. The soluble conductor 13 can be melted. That is, the short circuit element 50 is one in which the heating element 14, the first electrode 11, and the first soluble conductor 13 are electrically independent and thermally connected.

また、短絡素子５０は、給電経路３が発熱体引出電極１８に設けられた外部接続端子１８ａを介して外部回路に形成された電源と接続される。   In addition, the short-circuit element 50 is connected to a power source formed in an external circuit through the external connection terminal 18 a in which the power supply path 3 is provided in the heating element extraction electrode 18.

そして、短絡素子５０は、第１の可溶導体１３が第１の電極１１によって第２の電極１２と反対側に突出して支持され、発熱体１４からの加熱により第１の可溶導体１３を溶融させると、溶融導体１３ａが第１の電極１１の周囲に凝集することにより第２の電極１２に接触し、これにより第１、第２の電極１１，１２間を短絡させる。   In the short-circuit element 50, the first soluble conductor 13 is supported by the first electrode 11 so as to protrude to the opposite side of the second electrode 12, and the first soluble conductor 13 is heated by the heating element 14. When melted, the molten conductor 13 a agglomerates around the first electrode 11 to contact the second electrode 12, thereby short-circuiting the first and second electrodes 11, 12.

短絡素子５０は、外部回路に組み込まれる第１、第２の電極１１，１２間にわたる電流経路と、第１の可溶導体１３を溶断させる発熱体１４への給電経路３とが、電気的に独立しているため、外部回路の種類によらず、給電経路３の電源電圧を高く設定でき、低定格電流の発熱体１４を用いても、第１の可溶導体１３を溶融させるのに十分な発熱量を得る電力を供給することができる。したがって、短絡素子５０によれば、第１、第２の電極１１，１２を介して短絡させる外部回路として、電源回路の他、微弱な電流を流すデジタル信号回路にも適用することができる。   In the short-circuit element 50, a current path extending between the first and second electrodes 11 and 12 incorporated in an external circuit and a power supply path 3 to the heating element 14 for fusing the first soluble conductor 13 are electrically connected. Since it is independent, the power supply voltage of the power supply path 3 can be set high regardless of the type of external circuit, and even if the heating element 14 with a low rated current is used, it is sufficient to melt the first soluble conductor 13. It is possible to supply electric power to obtain a sufficient amount of heat generation. Therefore, the short-circuit element 50 can be applied to a digital signal circuit that allows a weak current to flow as well as a power supply circuit as an external circuit that is short-circuited via the first and second electrodes 11 and 12.

また、短絡素子５０によれば、外部回路に組み込まれる第１、第２の電極１１，１２間にわたる電流経路と電気的に独立して発熱体１４への給電経路３を形成しているため、発熱体１４への給電を制御する電流制御素子３２を、外部回路の電流定格に関わらず、発熱体１４の定格に応じて選択することができ、低定格電流の発熱体１４（例えば１Ａ）を制御する電流制御素子３２を用いることで、より安価に製造することができる。   In addition, according to the short-circuit element 50, the power supply path 3 to the heating element 14 is formed electrically independent of the current path between the first and second electrodes 11 and 12 incorporated in the external circuit. The current control element 32 that controls power supply to the heating element 14 can be selected according to the rating of the heating element 14 regardless of the current rating of the external circuit, and the heating element 14 (for example, 1A) having a low rated current can be selected. By using the current control element 32 to be controlled, it can be manufactured at a lower cost.

なお、短絡素子５０は、第１の可溶導体１３を第１の電極１１のみによって片持ち支持してもよく、あるいは第１の可溶導体１３の一側縁を第１の電極１１で支持し、他側縁を図示しない支持電極によって支持してもよい。   The short-circuit element 50 may support the first soluble conductor 13 by cantilevering only by the first electrode 11 or support one side edge of the first soluble conductor 13 by the first electrode 11. The other side edge may be supported by a support electrode (not shown).

［回路構成］
次いで、短絡素子５０の回路構成について説明する。図１３（Ａ）に短絡素子５０の回路図を示す。図１４に、短絡素子５０が適用された短絡回路６０の一例を示す。 [Circuit configuration]
Next, the circuit configuration of the short-circuit element 50 will be described. FIG. 13A shows a circuit diagram of the short-circuit element 50. FIG. 14 shows an example of a short circuit 60 to which the short element 50 is applied.

短絡素子５０は、第１の電極１１及び第２の電極１２が、初期状態において互いに開放されるとともに、第１の可溶導体１３が溶融することにより短絡するスイッチ２を構成し、当該スイッチ２によって第１の電極１１と第２の電極１２とが接続される第１の回路５１を有する。第１の回路５１は、短絡素子５０が組み込まれる電源回路やデジタル信号回路等の各種外部回路２８Ａ，２８Ｂ間に直列接続される。   The short-circuit element 50 constitutes the switch 2 that is short-circuited when the first electrode 11 and the second electrode 12 are opened from each other in the initial state and the first soluble conductor 13 is melted. 1 has a first circuit 51 to which the first electrode 11 and the second electrode 12 are connected. The first circuit 51 is connected in series between various external circuits 28A and 28B such as a power supply circuit and a digital signal circuit in which the short-circuit element 50 is incorporated.

また、短絡素子５０は、発熱体引出電極１８、発熱体１４、及び発熱体電極１９が、初期状態において発熱体１４への給電経路３を構成する。給電経路３は、第１の回路５１と電気的に独立し、発熱体１４の熱によって第１の可溶導体１３を溶融させることから、第１の回路５１と熱的に接続されている。発熱体１４は、一端が発熱体引出電極１８を介して、給電を制御する電流制御素子３２に接続されている。また、発熱体１４は、他端が、発熱体電極１９を介して発熱体１４に給電する外部電源５３と接続されている。   In the short-circuit element 50, the heating element extraction electrode 18, the heating element 14, and the heating element electrode 19 constitute the power supply path 3 to the heating element 14 in the initial state. The power supply path 3 is electrically independent of the first circuit 51 and melts the first fusible conductor 13 by the heat of the heating element 14, and is thus thermally connected to the first circuit 51. One end of the heating element 14 is connected to a current control element 32 that controls power feeding via the heating element extraction electrode 18. The other end of the heating element 14 is connected to an external power supply 53 that supplies power to the heating element 14 via the heating element electrode 19.

電流制御素子３２は、給電経路３への給電を制御するスイッチ素子であり、例えばＦＥＴにより構成され、第１の回路５１の物理的な短絡の要否を検出する検出素子３５と接続されている。検出素子３５は、短絡素子５０の第１の回路５１が組み込まれた各種外部回路２８Ａ，２８Ｂ間を通電する必要が生じたかを検出する回路であり、例えばバッテリパックの異常電圧時におけるバイパス電流経路の構築、ネットワーク通信機器におけるハッキングやクラッキングに対してデータサーバを迂回するバイパス信号経路の構築、あるいはデバイスやソフトウェアのアクティベーション等、第１の回路５１の短絡により物理的、不可逆的に外部回路２８Ａ，２８Ｂ間の電流経路を短絡させる必要が生じた場合に電流制御素子３２を動作させる。   The current control element 32 is a switch element that controls power supply to the power supply path 3. The current control element 32 is configured by, for example, an FET, and is connected to a detection element 35 that detects the necessity of a physical short circuit of the first circuit 51. . The detection element 35 is a circuit that detects whether it is necessary to energize between the various external circuits 28A and 28B in which the first circuit 51 of the short-circuit element 50 is incorporated. For example, a bypass current path when the battery pack has an abnormal voltage The external circuit 28A physically or irreversibly due to the short circuit of the first circuit 51, such as the construction of a bypass signal path that bypasses the data server for hacking or cracking in network communication equipment, or the activation of a device or software , 28B, the current control element 32 is operated when it is necessary to short-circuit the current path.

これにより、給電経路３に外部電源５３の電力が供給され、発熱体１４が発熱することにより、第１の可溶導体１３が溶融され、溶融導体１３ａが第１、第２の電極１１，１２間にわたって凝集する。これにより、溶融導体１３ａを介して第１の電極１１と第２の電極１２とが短絡され、外部回路２８Ａ，２８Ｂが接続される。   Thereby, the electric power of the external power supply 53 is supplied to the power supply path 3 and the heating element 14 generates heat, so that the first soluble conductor 13 is melted, and the molten conductor 13a becomes the first and second electrodes 11 and 12. Aggregates over time. Thereby, the 1st electrode 11 and the 2nd electrode 12 are short-circuited via the molten conductor 13a, and the external circuits 28A and 28B are connected.

このとき、短絡素子５０は、発熱体１４への給電経路３が、第１の回路５１と電気的に独立して形成されているため、第１、第２の電極１１，１２が短絡するまで発熱体１４に給電させることができる。   At this time, since the power supply path 3 to the heating element 14 is electrically independent from the first circuit 51, the short-circuit element 50 is until the first and second electrodes 11 and 12 are short-circuited. Power can be supplied to the heating element 14.

［補助可溶導体］
また、短絡素子５０は、図１５、図７（Ｂ）に示すように、第２の電極１２に補助可溶導体２１を接続させるとともに、発熱体１４が絶縁層１７を介して第１、第２の電極１１，１２と連続させてもよい。これにより、短絡素子５０は、第１の可溶導体１３及び補助可溶導体２１の各溶融導体１３ａ，２１ａによって、第１、第２の電極１１，１２間にわたって凝集する溶融導体の量を増大させ、確実に短絡させることができる。 [Auxiliary soluble conductor]
In addition, as shown in FIGS. 15 and 7B, the short-circuit element 50 connects the auxiliary soluble conductor 21 to the second electrode 12, and the heating element 14 is connected to the first and first elements via the insulating layer 17. The two electrodes 11 and 12 may be continuous. As a result, the short-circuit element 50 increases the amount of molten conductor aggregated between the first and second electrodes 11 and 12 by the molten conductors 13 a and 21 a of the first soluble conductor 13 and the auxiliary soluble conductor 21. Can be short-circuited reliably.

なお、短絡素子５０においても、補助可溶導体２１は、第２の電極１２から第１の電極１１側に突出して設けられ、第１の電極１１と離間しつつ重畳する位置まで突出することが好ましい。また、補助可溶導体２１は、第１の可溶導体１３とも重畳するように支持することにより、補助可溶導体２１の溶融導体２１ａと第１の可溶導体１３の溶融導体１３ａとが凝集しやすく、第１、第２の電極１１，１２間の短絡に寄与することができる。   In addition, also in the short circuit element 50, the auxiliary soluble conductor 21 is provided so as to protrude from the second electrode 12 to the first electrode 11 side, and protrudes to a position where it overlaps while being separated from the first electrode 11. preferable. Further, the auxiliary soluble conductor 21 is supported so as to overlap with the first soluble conductor 13, so that the molten conductor 21a of the auxiliary soluble conductor 21 and the molten conductor 13a of the first soluble conductor 13 are aggregated. This can easily contribute to a short circuit between the first and second electrodes 11 and 12.

また、補助可溶導体２１は、第２の電極１２から第１の電極１１と反対側に突出して設けてもよい。これにより、補助可溶導体２１は、第１の可溶導体１３と同様に、加熱実装時における加熱により接合材１５が溶融し第１、第２の電極１１，１２間が短絡する初期短絡を防止することができる。   Further, the auxiliary soluble conductor 21 may be provided so as to protrude from the second electrode 12 to the opposite side to the first electrode 11. Accordingly, the auxiliary fusible conductor 21 is subjected to an initial short circuit in which the bonding material 15 is melted by heating at the time of heat mounting and the first and second electrodes 11 and 12 are short-circuited, similarly to the first fusible conductor 13. Can be prevented.

［短絡素子７０］
また、本発明が適用された短絡素子は、図１６に示すように、発熱体１４への給電経路３上に第２の可溶導体７２を介在させてもよい。この短絡素子７０は、発熱体引出電極１８と隣接して設けられた発熱体給電電極７１と、発熱体引出電極１８及び発熱体給電電極７１間に亘って搭載された第２の可溶導体７２とを有する。なお、短絡素子７０において、上述した短絡素子１と同じ部材については同じ符号を付してその詳細を省略する。図１３（Ｂ）に短絡素子７０の回路図を示す。 [Short-circuit element 70]
In the short-circuit element to which the present invention is applied, a second soluble conductor 72 may be interposed on the power supply path 3 to the heating element 14 as shown in FIG. The short-circuit element 70 includes a heating element feeding electrode 71 provided adjacent to the heating element extraction electrode 18, and a second soluble conductor 72 mounted between the heating element extraction electrode 18 and the heating element supply electrode 71. And have. In addition, in the short circuit element 70, about the same member as the short circuit element 1 mentioned above, the same code | symbol is attached | subjected and the detail is abbreviate | omitted. FIG. 13B shows a circuit diagram of the short-circuit element 70.

発熱体給電電極７１は、発熱体引出電極１８と隣接して設けられるとともに、第２の可溶導体７２を介して発熱体引出電極１８と接続され、これにより発熱体１４への給電経路３を構成する。また、発熱体給電電極７１は、外部回路との接続端子となる外部接続端子７１ａと接続されている。発熱体給電電極７１は、発熱体引出電極１８と同じ材料を用いて発熱体引出電極１８の形成時に同時に形成することができる。   The heating element power supply electrode 71 is provided adjacent to the heating element extraction electrode 18 and is connected to the heating element extraction electrode 18 via the second soluble conductor 72, thereby providing a power supply path 3 to the heating element 14. Configure. The heating element power supply electrode 71 is connected to an external connection terminal 71a that is a connection terminal with an external circuit. The heating element feeding electrode 71 can be formed at the same time as the heating element extraction electrode 18 by using the same material as the heating element extraction electrode 18.

第２の可溶導体７２は、隣接して設けられている発熱体引出電極１８と発熱体給電電極７１との間にわたって搭載され、短絡素子７０の作動前においては発熱体１４への給電経路３の一部を構成する。第２の可溶導体７２は、第１の可溶導体１３と同じ材料を用いて形成することができる。また、第２の可溶導体７２も、後に説明するように、様々な構成によって形成することができる。   The second fusible conductor 72 is mounted between the heating element extraction electrode 18 and the heating element power supply electrode 71 provided adjacent to each other, and before the operation of the short-circuit element 70, the power supply path 3 to the heating element 14. Part of The second soluble conductor 72 can be formed using the same material as the first soluble conductor 13. Moreover, the 2nd soluble conductor 72 can also be formed by various structures so that it may demonstrate later.

図１７に示すように、短絡素子７０は、給電経路３に第２の可溶導体７２を設けることにより、発熱体１４が発熱すると第２の可溶導体７２が溶断し、溶融導体７２ａが発熱体引出電極１８と発熱体給電電極７１とに分かれて凝集することにより、給電経路３を遮断して発熱体１４の発熱を自動的に停止することができる。このとき、短絡素子７０は、第２の可溶導体７２が第１の可溶導体１３よりも先に溶断しないように形成されている。   As shown in FIG. 17, the short-circuit element 70 is provided with the second soluble conductor 72 in the power supply path 3, so that when the heating element 14 generates heat, the second soluble conductor 72 is melted and the molten conductor 72 a generates heat. By separating and aggregating the body extraction electrode 18 and the heating element feeding electrode 71, the feeding path 3 can be cut off and the heating of the heating element 14 can be automatically stopped. At this time, the short-circuit element 70 is formed so that the second fusible conductor 72 does not melt before the first fusible conductor 13.

［溶断順序］
すなわち、短絡素子７０は、第２の可溶導体７２を介して接続された発熱体給電電極７１と発熱体引出電極１８とが、発熱体１４への給電経路３を構成するため、第１、第２の電極１１，１２の短絡より先に発熱体給電電極７１と発熱体引出電極１８との間が溶断すると、発熱体１４への給電が停止され、第１、第２の電極１１，１２間を短絡させることができない恐れがあるからである。 [Fusing order]
That is, since the heating element feeding electrode 71 and the heating element extraction electrode 18 connected via the second fusible conductor 72 constitute the feeding path 3 to the heating element 14 in the short-circuit element 70, When the heating element feeding electrode 71 and the heating element lead-out electrode 18 are melted before the second electrodes 11 and 12 are short-circuited, the feeding to the heating element 14 is stopped, and the first and second electrodes 11 and 12 are stopped. This is because there is a possibility that it cannot be short-circuited.

そこで、短絡素子７０は、発熱体１４が発熱すると、発熱体給電電極７１と発熱体引出電極１８との間の遮断よりも先に、第１、第２の電極１１，１２間が短絡するように形成されている。具体的に、短絡素子７０は、第１の可溶導体１３が、第２の可溶導体７２よりも発熱体１４に近接した位置に配設されている。これにより、短絡素子７０は、発熱体１４が発熱すると、第２の可溶導体７２よりも早く第１の可溶導体１３に熱が伝わる。したがって、発熱体１４が発熱されると、速やかに第１の可溶導体１３が溶融し、溶融導体１３ａが第１の電極１１の周囲に凝集するとともに、溶融導体１３ａが第１、第２の電極１１，１２間を短絡させ、その後、第２の可溶導体７２が溶融し発熱体１４への給電経路３を遮断することができる。したがって、短絡素子７０は、第１、第２の電極１１，１２間が短絡するまで、確実に発熱体１４に給電し続けることができる。   Therefore, when the heating element 14 generates heat, the short-circuit element 70 causes the first and second electrodes 11 and 12 to be short-circuited before interruption between the heating element feeding electrode 71 and the heating element extraction electrode 18. Is formed. Specifically, in the short-circuit element 70, the first fusible conductor 13 is disposed closer to the heating element 14 than the second fusible conductor 72. As a result, when the heating element 14 generates heat, the short-circuit element 70 transmits heat to the first soluble conductor 13 earlier than the second soluble conductor 72. Therefore, when the heating element 14 generates heat, the first soluble conductor 13 is quickly melted, the molten conductor 13a is aggregated around the first electrode 11, and the molten conductor 13a is first and second. The electrodes 11 and 12 are short-circuited, and then the second soluble conductor 72 is melted and the power supply path 3 to the heating element 14 can be interrupted. Therefore, the short-circuit element 70 can reliably continue to supply power to the heating element 14 until the first and second electrodes 11 and 12 are short-circuited.

また、短絡素子７０は、発熱体給電電極７１と第１の電極１１を電気的に接続する事で、短絡素子１と同様の回路構成とするとともに、第１の可溶導体１３を第１、第２の電極１１，１２間の短絡用に、第２の可溶導体７２を発熱体１４の遮断用にと機能を分離する事で、短絡素子１の回路に於いて更に短絡と遮断の序列を確実にする事ができる。   The short-circuit element 70 has a circuit configuration similar to that of the short-circuit element 1 by electrically connecting the heating element power supply electrode 71 and the first electrode 11, and the first soluble conductor 13 is the first, By separating the function of the second fusible conductor 72 for cutting off the heating element 14 for short-circuiting between the second electrodes 11, 12, a further sequence of short-circuiting and blocking in the circuit of the short-circuit element 1. Can be ensured.

また、第１、第２の可溶導体１３，７２は、断面積が狭いほど早く溶断することから、第１の可溶導体１３の断面積を第２の可溶導体７２の断面積よりも狭く形成することにより、発熱体給電電極７１と発熱体引出電極１８との間の遮断よりも先に、第１、第２の電極１１，１２間が短絡するようにしてもよい。   Moreover, since the first and second soluble conductors 13 and 72 are blown earlier as the cross-sectional area is narrower, the cross-sectional area of the first fusible conductor 13 is made larger than the cross-sectional area of the second soluble conductor 72. By forming it narrowly, the first and second electrodes 11 and 12 may be short-circuited before interruption between the heating element feeding electrode 71 and the heating element extraction electrode 18.

また、第１、第２の可溶導体１３，７２の材料を変えることで、相対的に第２の可溶導体７２の融点を第１の可溶導体１３の融点よりも高くし、発熱体給電電極７１と発熱体引出電極１８との間の遮断よりも先に、第１、第２の電極１１，１２間が短絡するようにしてもよい。例えば、第１、第２の可溶導体１３，７２を低融点金属と高融点金属の積層構造としたときに、第１の可溶導体１３では低融点金属の比率を高くして、第２の可溶導体では高融点金属の比率を高くする等により、融点差を設けることができる。   Further, by changing the material of the first and second soluble conductors 13 and 72, the melting point of the second soluble conductor 72 is made relatively higher than the melting point of the first soluble conductor 13, and the heating element. The first and second electrodes 11 and 12 may be short-circuited prior to the interruption between the feeding electrode 71 and the heating element extraction electrode 18. For example, when the first and second fusible conductors 13 and 72 have a laminated structure of a low melting point metal and a high melting point metal, the ratio of the low melting point metal is increased in the first fusible conductor 13 and the second In such a soluble conductor, the melting point difference can be provided by increasing the ratio of the refractory metal.

なお、短絡素子７０においても、第１の可溶導体１３を第１の電極１１のみによって片持ち支持してもよく、あるいは第１の可溶導体１３の一側縁を第１の電極１１で支持し、他側縁を図示しない支持電極によって支持してもよい。   In the short-circuit element 70 as well, the first soluble conductor 13 may be cantilevered only by the first electrode 11, or one side edge of the first soluble conductor 13 may be supported by the first electrode 11. The other side edge may be supported by a support electrode (not shown).

［補助可溶導体］
また、短絡素子７０は、図１８、図７（Ｃ）に示すように、第２の電極１２に補助可溶導体２１を接続させるとともに、発熱体１４が絶縁層１７を介して第１、第２の電極１１，１２と連続させてもよい。これにより、短絡素子７０は、第１の可溶導体１３及び補助可溶導体２１の各溶融導体１３ａ，２１ａによって、第１、第２の電極１１，１２間にわたって凝集する溶融導体の量を増大させ、確実に短絡させることができる。 [Auxiliary soluble conductor]
Further, as shown in FIGS. 18 and 7C, the short-circuit element 70 connects the auxiliary soluble conductor 21 to the second electrode 12, and the heating element 14 is connected to the first and first elements via the insulating layer 17. The two electrodes 11 and 12 may be continuous. As a result, the short-circuit element 70 increases the amount of molten conductor aggregated between the first and second electrodes 11 and 12 by the molten conductors 13 a and 21 a of the first soluble conductor 13 and the auxiliary soluble conductor 21. Can be short-circuited reliably.

なお、短絡素子７０においても、補助可溶導体２１は、第２の電極１２から第１の電極１１側に突出して設けられ、第１の電極１１と離間しつつ重畳する位置まで突出することが好ましい。また、補助可溶導体２１は、第１の可溶導体１３とも重畳するように支持することにより、補助可溶導体２１の溶融導体２１ａと第１の可溶導体１３の溶融導体１３ａとが凝集しやすく、第１、第２の電極１１，１２間の短絡に寄与することができる。   In the short-circuit element 70 as well, the auxiliary fusible conductor 21 is provided so as to protrude from the second electrode 12 toward the first electrode 11, and protrudes to a position where it overlaps while being separated from the first electrode 11. preferable. Further, the auxiliary soluble conductor 21 is supported so as to overlap with the first soluble conductor 13, so that the molten conductor 21a of the auxiliary soluble conductor 21 and the molten conductor 13a of the first soluble conductor 13 are aggregated. This can easily contribute to a short circuit between the first and second electrodes 11 and 12.

また、補助可溶導体２１は、第２の電極１２から第１の電極１１と反対側に突出して設けてもよい。これにより、補助可溶導体２１は、第１の可溶導体１３と同様に、加熱実装時において接合材１５が溶融し第１、第２の電極１１，１２間が短絡する初期短絡を防止することができる。   Further, the auxiliary soluble conductor 21 may be provided so as to protrude from the second electrode 12 to the opposite side to the first electrode 11. As a result, the auxiliary fusible conductor 21 prevents the initial short circuit in which the bonding material 15 is melted and short-circuited between the first and second electrodes 11 and 12 at the time of heat mounting, similarly to the first fusible conductor 13. be able to.

［その他の構成］
なお、上述した各短絡素子１，５０，７０において、板状に形成された第１の可溶導体１３は、第１の電極１１との接続面積の２倍以上の面積を有することが好ましい。これにより、第１の可溶導体１３は、第１、第２の電極１１，１２間を短絡させるのに十分な溶融導体の量を確保するとともに、端部を発熱体引出電極１８に支持されている場合にも、速やかに溶断することができる。 [Other configurations]
In each of the short-circuit elements 1, 50, 70 described above, the first soluble conductor 13 formed in a plate shape preferably has an area that is at least twice as large as the connection area with the first electrode 11. Thus, the first fusible conductor 13 secures an amount of the molten conductor sufficient for short-circuiting the first and second electrodes 11 and 12, and the end portion is supported by the heating element extraction electrode 18. Even if it is, it can be melted quickly.

また、上述した各短絡素子１，５０，７０において、第１の可溶導体１３を線材によって形成してもよく、この場合、第１の可溶導体１３は、第１の電極１１との接続長さの２倍以上の長さを有することが好ましい。これにより、第１の可溶導体１３は、第１、第２の電極１１，１２間を短絡させるのに十分な溶融導体の量を確保するとともに、端部を発熱体引出電極１８に支持されている場合にも、速やかに溶断することができる。   Further, in each of the short-circuit elements 1, 50, 70 described above, the first soluble conductor 13 may be formed of a wire, and in this case, the first soluble conductor 13 is connected to the first electrode 11. It is preferable to have a length that is at least twice the length. Thus, the first fusible conductor 13 secures an amount of the molten conductor sufficient for short-circuiting the first and second electrodes 11 and 12, and the end portion is supported by the heating element extraction electrode 18. Even if it is, it can be melted quickly.

［コーティング処理］
また、上述した各短絡素子１，５０，７０の第１、第２の電極１１，１２、発熱体引出電極１８及び発熱体給電電極７１は、ＣｕやＡｇ等の一般的な電極材料を用いて形成することができ、表面上には、Ｎｉ／Ａｕメッキ、Ｎｉ／Ｐｄメッキ、Ｎｉ／Ｐｄ／Ａｕメッキ等の被膜が、メッキ処理等の公知の手法によりコーティングされていることが好ましい。これにより、各短絡素子１，５０，７０は、第１、第２の電極１１，１２、発熱体引出電極１８及び発熱体給電電極７１の酸化を防止し、第１、第２の可溶導体１３，７２を確実に保持させることができる。また、短絡素子１，５０，７０をリフロー実装する場合に、第１、第２の可溶導体１３，７２を接続する接続用ハンダ等の接合材１５あるいは第１、第２の可溶導体１３，７２の外層を形成する低融点金属が溶融することにより第１、第２の電極１１，１２、発熱体引出電極１８及び発熱体給電電極７１が溶食（ハンダ食われ）されるのを防ぐことができる。 [Coating treatment]
Further, the first and second electrodes 11 and 12, the heating element extraction electrode 18, and the heating element feeding electrode 71 of each of the short-circuit elements 1, 50 and 70 described above are made of a general electrode material such as Cu or Ag. It is preferable to form a coating such as Ni / Au plating, Ni / Pd plating, or Ni / Pd / Au plating on the surface by a known technique such as plating. As a result, each short-circuit element 1, 50, 70 prevents oxidation of the first and second electrodes 11, 12, the heating element extraction electrode 18 and the heating element feeding electrode 71, and the first and second soluble conductors. 13 and 72 can be reliably held. When the short-circuit elements 1, 50, 70 are reflow-mounted, the bonding material 15 such as connecting solder for connecting the first and second soluble conductors 13, 72 or the first and second soluble conductors 13. , 72 prevents the first and second electrodes 11, 12, the heating element extraction electrode 18, and the heating element feeding electrode 71 from being melted (soldered) by melting the low melting point metal forming the outer layer of. be able to.

［発熱体の位置］
また、表面実装型の短絡素子１は、絶縁基板１０の表面１０ａに発熱体１４を形成する他、図１９（Ａ）に示すように、絶縁基板１０の裏面１０ｂに設けてもよい。この場合、発熱体１４は、絶縁基板１０の裏面１０ｂにおいて絶縁層１７に被覆されている。また、発熱体１４への給電経路３を構成する発熱体電極１９も同様に絶縁基板１０の裏面１０ｂに形成される。発熱体引出電極１８は、発熱体１４と接続される下層部１８ａが絶縁基板１０裏面１０ｂに形成され、第１の可溶導体１３が搭載される上層部１８ｂが絶縁基板１０の表面１０ａに形成され、下層部１８ａと上層部１８ｂとが、導電スルーホールを介して連続される。 [Location of heating element]
Further, the surface-mount type short-circuit element 1 may be provided on the back surface 10b of the insulating substrate 10 as shown in FIG. 19A in addition to forming the heating element 14 on the surface 10a of the insulating substrate 10. In this case, the heating element 14 is covered with the insulating layer 17 on the back surface 10 b of the insulating substrate 10. Similarly, the heating element electrode 19 constituting the power feeding path 3 to the heating element 14 is also formed on the back surface 10 b of the insulating substrate 10. In the heating element extraction electrode 18, a lower layer portion 18 a connected to the heating element 14 is formed on the back surface 10 b of the insulating substrate 10, and an upper layer portion 18 b on which the first soluble conductor 13 is mounted is formed on the surface 10 a of the insulating substrate 10. Then, the lower layer portion 18a and the upper layer portion 18b are continued through the conductive through hole.

また、発熱体１４は、絶縁基板１０の裏面１０ｂにおいて、第１、第２の電極１１，１２と重畳する位置に形成されることが好ましい。また、発熱体引出電極１８は、第１、第２の電極１１，１２よりも、発熱体１４と離間した位置に設けられることが好ましい。   Further, the heating element 14 is preferably formed at a position overlapping the first and second electrodes 11 and 12 on the back surface 10 b of the insulating substrate 10. In addition, the heating element extraction electrode 18 is preferably provided at a position farther from the heating element 14 than the first and second electrodes 11 and 12.

また、図１９（Ｂ）に示すように、短絡素子１は、発熱体１４を絶縁基板１０の内部に形成してもよい。この場合、発熱体１４を被覆する絶縁層１７は設ける必要がない。また、発熱体１４の一端が接続された発熱体電極１９は、発熱体１４と接続する一端部が絶縁基板１０の内部まで形成され、導電スルーホールを介して絶縁基板１０の裏面１０ｂに設けられた外部接続端子１９ａと接続される。発熱体引出電極１８は、発熱体１４と接続される下層部１８ａが絶縁基板１０の内部まで形成され、第１の可溶導体１３が搭載される上層部１８ｂと、導電スルーホールを介して連続される。   Further, as shown in FIG. 19B, the short-circuit element 1 may have the heating element 14 formed inside the insulating substrate 10. In this case, it is not necessary to provide the insulating layer 17 that covers the heating element 14. In addition, the heating element electrode 19 to which one end of the heating element 14 is connected has one end connected to the heating element 14 extending to the inside of the insulating substrate 10 and is provided on the back surface 10b of the insulating substrate 10 through a conductive through hole. The external connection terminal 19a is connected. The heating element lead-out electrode 18 has a lower layer 18a connected to the heating element 14 formed up to the inside of the insulating substrate 10, and is continuous with the upper layer 18b on which the first soluble conductor 13 is mounted via a conductive through hole. Is done.

また、発熱体１４は、絶縁基板１０の内部において、第１、第２の電極１１，１２と重畳する位置に形成されることが好ましい。また、発熱体引出電極１８は、第１、第２の電極１１，１２よりも、発熱体１７と離間した位置に設けられることが好ましい。   In addition, the heating element 14 is preferably formed at a position overlapping the first and second electrodes 11 and 12 inside the insulating substrate 10. In addition, the heating element extraction electrode 18 is preferably provided at a position farther from the heating element 17 than the first and second electrodes 11 and 12.

短絡素子１は、発熱体１４が絶縁基板１０の裏面１０ｂや絶縁基板１０の内部に形成されることにより、絶縁基板１０の表面１０ａが平坦化され、これにより、第１、第２の電極１１，１２及び発熱体引出電極１８を表面１０ａ上に形成することができる。したがって、短絡素子１は、第１、第２の電極１１，１２及び発熱体引出電極１８の製造工程を簡略化することができるとともに、低背化を図ることができる。   In the short-circuit element 1, the heating element 14 is formed on the back surface 10 b of the insulating substrate 10 or inside the insulating substrate 10, so that the surface 10 a of the insulating substrate 10 is flattened, whereby the first and second electrodes 11 are formed. , 12 and the heating element extraction electrode 18 can be formed on the surface 10a. Therefore, the short-circuit element 1 can simplify the manufacturing process of the first and second electrodes 11 and 12 and the heating element extraction electrode 18 and can reduce the height.

また、短絡素子１は、発熱体１４を絶縁基板１０の裏面１０ｂや絶縁基板１０の内部に形成した場合にも、絶縁基板１０の材料としてファインセラミック等の熱伝導性に優れた材料を用いることにより、発熱体１４によって、絶縁基板１０の表面１０ａ上に積層した場合と同等に第１の可溶導体１３を加熱、溶断することができる   In addition, the short-circuit element 1 uses a material having excellent thermal conductivity, such as fine ceramic, as the material of the insulating substrate 10 even when the heating element 14 is formed on the back surface 10b of the insulating substrate 10 or inside the insulating substrate 10. Thus, the first fusible conductor 13 can be heated and blown by the heating element 14 in the same manner as when laminated on the surface 10a of the insulating substrate 10.

［可溶導体の構成］
上述したように、第１、第２の可溶導体１３，７２及び補助可溶導体２１は、低融点金属と高融点金属とを含有してもよい。なお、以下の説明においては、特に区別する必要がある場合を除き、第１、第２の可溶導体１３，７２及び補助可溶導体２１をまとめて「可溶導体１３，７２，２１」という。低融点金属としては、Ｓｎを主成分とするＰｂフリーハンダなどのハンダを用いることが好ましく、高融点金属としては、Ａｇ、Ｃｕ又はこれらを主成分とする合金などを用いることが好ましい。このとき、可溶導体１３，７２，２１は、図２０（Ａ）に示すように、内層として高融点金属層９１が設けられ、外層として低融点金属層９２が設けられた可溶導体を用いてもよい。この場合、可溶導体１３，７２，２１は、高融点金属層９１の全面が低融点金属層９２によって被覆された構造としてもよく、相対向する一対の側面を除き被覆された構造であってもよい。高融点金属層９１や低融点金属層９２による被覆構造は、メッキ等の公知の成膜技術を用いて形成することができる。 [Configuration of soluble conductor]
As described above, the first and second soluble conductors 13 and 72 and the auxiliary soluble conductor 21 may contain a low melting point metal and a high melting point metal. In the following description, the first and second fusible conductors 13 and 72 and the auxiliary fusible conductor 21 are collectively referred to as “fusible conductors 13, 72, 21” unless otherwise required to be distinguished. . As the low melting point metal, it is preferable to use solder such as Pb-free solder containing Sn as a main component, and as the high melting point metal, it is preferable to use Ag, Cu or an alloy containing these as main components. At this time, as shown in FIG. 20A, the soluble conductors 13, 72, and 21 use a soluble conductor in which a high melting point metal layer 91 is provided as an inner layer and a low melting point metal layer 92 is provided as an outer layer. May be. In this case, the fusible conductors 13, 72, 21 may have a structure in which the entire surface of the refractory metal layer 91 is covered with the low melting point metal layer 92, except for a pair of opposite side surfaces. Also good. The covering structure with the high melting point metal layer 91 and the low melting point metal layer 92 can be formed using a known film forming technique such as plating.

また、図２０（Ｂ）に示すように、可溶導体１３，７２，２１は、内層として低融点金属層９２が設けられ、外層として高融点金属層９１が設けられた可溶導体を用いてもよい。この場合も、可溶導体１３，７２，２１は、低融点金属層９２の全面が高融点金属層９１によって被覆された構造としてもよく、相対向する一対の側面を除き被覆された構造であってもよい。   As shown in FIG. 20B, the fusible conductors 13, 72, and 21 are made of a fusible conductor in which a low melting point metal layer 92 is provided as an inner layer and a high melting point metal layer 91 is provided as an outer layer. Also good. Also in this case, the fusible conductors 13, 72, and 21 may have a structure in which the entire surface of the low melting point metal layer 92 is covered with the high melting point metal layer 91, and is covered except for a pair of opposite side surfaces. May be.

また、可溶導体１３，７２，２１は、図２１に示すように、高融点金属層９１と低融点金属層９２とが積層された積層構造としてもよい。   Further, the soluble conductors 13, 72, and 21 may have a laminated structure in which a high melting point metal layer 91 and a low melting point metal layer 92 are laminated as shown in FIG.

この場合、可溶導体１３，７２，２１は、図２１（Ａ）に示すように、第１、第２の電極１１，１２や発熱体引出電極１８等に接続される下層と、下層の上に積層される上層からなる２層構造として形成され、下層となる高融点金属層９１の上面に上層となる低融点金属層９２を積層してもよく、反対に下層となる低融点金属層９２の上面に上層となる高融点金属層９１を積層してもよい。あるいは、可溶導体１３，７２，２１は、図２１（Ｂ）に示すように、内層と内層の上下面に積層される外層とからなる３層構造として形成してもよく、内層となる高融点金属層９１の上下面に外層となる低融点金属層９２を積層してもよく、反対に内層となる低融点金属層９２の上下面に外層となる高融点金属層９１を積層してもよい。   In this case, as shown in FIG. 21 (A), the fusible conductors 13, 72, 21 are connected to the lower layer connected to the first and second electrodes 11, 12 and the heating element extraction electrode 18 and the lower layer. The lower melting point metal layer 92 may be laminated on the upper surface of the lower refractory metal layer 91, and the lower melting point metal layer 92 may be laminated. Alternatively, an upper refractory metal layer 91 may be laminated on the upper surface. Alternatively, the fusible conductors 13, 72, 21 may be formed as a three-layer structure including an inner layer and an outer layer laminated on the upper and lower surfaces of the inner layer, as shown in FIG. The low melting point metal layer 92 serving as the outer layer may be laminated on the upper and lower surfaces of the melting point metal layer 91, or the high melting point metal layer 91 serving as the outer layer may be laminated on the upper and lower surfaces of the low melting point metal layer 92 serving as the inner layer. Good.

また、可溶導体１３，７２，２１は、図２２に示すように、高融点金属層９１と低融点金属層９２とが交互に積層された４層以上の多層構造としてもよい。この場合、可溶導体１３，７２，２１は、最外層を構成する金属層によって、全面又は相対向する一対の側面を除き被覆された構造としてもよい。   Further, as shown in FIG. 22, the fusible conductors 13, 72, and 21 may have a multilayer structure of four or more layers in which high melting point metal layers 91 and low melting point metal layers 92 are alternately laminated. In this case, the fusible conductors 13, 72, 21 may have a structure in which the entire surface or a pair of opposite side surfaces are covered with a metal layer constituting the outermost layer.

また、可溶導体１３，７２，２１は、内層を構成する低融点金属層９２の表面に高融点金属層９１をストライプ状に部分的に積層させてもよい。図２３は、可溶導体１３，７２，２１の平面図である。   Further, the fusible conductors 13, 72, 21 may be formed by partially laminating the refractory metal layer 91 in a stripe shape on the surface of the low melting point metal layer 92 constituting the inner layer. FIG. 23 is a plan view of the fusible conductors 13, 72, and 21.

図２３（Ａ）に示す可溶導体１３，７２，２１は、低融点金属層９２の表面に、幅方向に所定間隔で、線状の高融点金属層９１が長手方向に複数形成されることにより、長手方向に沿って線状の開口部９３が形成され、この開口部９３から低融点金属層９２が露出されている。可溶導体１３，７２，２１は、低融点金属層９２が開口部９３より露出することにより、溶融した低融点金属と高融点金属との接触面積が増え、高融点金属層９１の浸食作用をより促進させて溶断性を向上させることができる。開口部９３は、例えば、低融点金属層９２に高融点金属層９１を構成する金属の部分メッキを施すことにより形成することができる。   In the fusible conductors 13, 72, and 21 shown in FIG. 23A, a plurality of linear refractory metal layers 91 are formed on the surface of the low melting point metal layer 92 in the longitudinal direction at predetermined intervals in the width direction. Thus, a linear opening 93 is formed along the longitudinal direction, and the low melting point metal layer 92 is exposed from the opening 93. The fusible conductors 13, 72, and 21 are exposed to the low melting point metal layer 92 from the opening 93, thereby increasing the contact area between the molten low melting point metal and the high melting point metal, and eroding the high melting point metal layer 91. It can be further promoted to improve the fusing property. The opening 93 can be formed, for example, by subjecting the low melting point metal layer 92 to partial plating of the metal constituting the high melting point metal layer 91.

また、可溶導体１３，７２，２１は、図２３（Ｂ）に示すように、低融点金属層９２の表面に、長手方向に所定間隔で、線状の高融点金属層９１を幅方向に複数形成することにより、幅方向に沿って線状の開口部９３を形成してもよい。   In addition, as shown in FIG. 23B, the fusible conductors 13, 72, and 21 have linear refractory metal layers 91 arranged in the width direction on the surface of the low melting point metal layer 92 at predetermined intervals in the longitudinal direction. By forming a plurality, the linear openings 93 may be formed along the width direction.

また、可溶導体１３，７２，２１は、図２４に示すように、低融点金属層９２の表面に高融点金属層９１を形成するとともに、高融点金属層９１の全面に亘って円形の開口部９４が形成され、この開口部９４から低融点金属層９２を露出させてもよい。開口部９４は、例えば、低融点金属層９２に高融点金属層９１を構成する金属の部分メッキを施すことにより形成することができる。   In addition, as shown in FIG. 24, the fusible conductors 13, 72, and 21 form a refractory metal layer 91 on the surface of the low melting point metal layer 92 and a circular opening over the entire surface of the refractory metal layer 91. A portion 94 may be formed, and the low melting point metal layer 92 may be exposed from the opening 94. The opening 94 can be formed, for example, by subjecting the low melting point metal layer 92 to partial plating of the metal constituting the high melting point metal layer 91.

可溶導体１３，７２，２１は、低融点金属層９２が開口部９４より露出することにより、溶融した低融点金属と高融点金属との接触面積が増え、高融点金属の浸食作用をより促進させて溶断性を向上させることができる。   The fusible conductors 13, 72, and 21 are exposed to the low melting point metal layer 92 from the opening 94, thereby increasing the contact area between the molten low melting point metal and the high melting point metal and further promoting the erosion action of the high melting point metal. The fusing property can be improved.

また、可溶導体１３，７２，２１は、図２５に示すように、内層となる高融点金属層９１に多数の開口部９５を形成し、この高融点金属層９１に、メッキ技術等を用いて低融点金属層９２を成膜し、開口部９５内に充填してもよい。これにより、可溶導体１３，７２，２１は、溶融する低融点金属が高融点金属に接する面積が増大するので、より短時間で低融点金属が高融点金属を溶食することができるようになる。   In addition, as shown in FIG. 25, the fusible conductors 13, 72, and 21 have a large number of openings 95 in the refractory metal layer 91 serving as an inner layer, and the refractory metal layer 91 is subjected to a plating technique or the like. Alternatively, the low melting point metal layer 92 may be formed and filled in the opening 95. As a result, the soluble conductors 13, 72, and 21 increase the area where the molten low melting point metal contacts the high melting point metal, so that the low melting point metal can corrode the high melting point metal in a shorter time. Become.

また、可溶導体１３，７２，２１は、低融点金属層９２の体積を、高融点金属層９１の体積よりも多く形成することが好ましい。可溶導体１３，７２，２１は、発熱体１４の発熱によって加熱され、低融点金属が溶融することにより高融点金属を溶食し、これにより速やかに溶融、溶断することができる。したがって、可溶導体１３，７２，２１は、低融点金属層９２の体積を高融点金属層９１の体積よりも多く形成することにより、この溶食作用を促進し、速やかに第１、第２の電極１１，１２間を短絡することができる。   Moreover, it is preferable that the soluble conductors 13, 72, and 21 have a volume of the low melting point metal layer 92 larger than that of the high melting point metal layer 91. The fusible conductors 13, 72, and 21 are heated by the heat generated by the heating element 14, and the low melting point metal melts, thereby eroding the high melting point metal and thereby melting and fusing quickly. Therefore, the fusible conductors 13, 72, 21 promote the corrosion action by forming the volume of the low-melting-point metal layer 92 larger than the volume of the high-melting-point metal layer 91. The electrodes 11 and 12 can be short-circuited.

また、可溶導体１３，７２，２１は、図２６に示すように、略矩形板状に形成され、外層を構成する高融点金属によって被覆され主面部１３ｂ，７２ｂ，２１ｂよりも肉厚に形成された相対向する一対の第１の側縁部１３ｃ，７２ｃ，２１ｃと、内層を構成する低融点金属が露出され第１の側縁部１３ｃ，７２ｃ，２１ｃよりも薄い厚さに形成された相対向する一対の第２の側縁部１３ｄ，７２ｄ，２１ｄとを有してもよい。   Further, as shown in FIG. 26, the fusible conductors 13, 72, and 21 are formed in a substantially rectangular plate shape, and are covered with a high melting point metal constituting the outer layer and are thicker than the main surface portions 13b, 72b, and 21b. The pair of first side edges 13c, 72c, 21c facing each other and the low melting point metal constituting the inner layer are exposed and formed to be thinner than the first side edges 13c, 72c, 21c. You may have a pair of 2nd side edge parts 13d, 72d, and 21d which oppose each other.

第１の側縁部１３ｃ，７２ｃ，２１ｃは、側面が高融点金属層９１によって被覆されるとともに、これにより可溶導体１３，７２，２１の主面部１３ｂ，７２ｂ，２１ｂよりも肉厚に形成されている。第２の側縁部１３ｄ，７２ｄ，２１ｄは、側面に、外周を高融点金属層９１によって囲繞された低融点金属層９２が露出されている。第２の側縁部１３ｄ，７２ｄ，２１ｄは、第１の側縁部１３ｃ，７２ｃ，２１ｃと隣接する両端部を除き主面部１３ｂ，７２ｂ，２１ｂと同じ厚さに形成されている。   The first side edge portions 13c, 72c, and 21c are covered with the refractory metal layer 91, and thereby formed thicker than the main surface portions 13b, 72b, and 21b of the soluble conductors 13, 72, and 21. Has been. The second side edge portions 13d, 72d, and 21d have the low melting point metal layer 92 whose outer periphery is surrounded by the high melting point metal layer 91 exposed on the side surfaces. The second side edge portions 13d, 72d, and 21d are formed to have the same thickness as the main surface portions 13b, 72b, and 21b except for both end portions adjacent to the first side edge portions 13c, 72c, and 21c.

以上のように構成された第１の可溶導体１３は、図２７に示すように、第１の側縁部１３ｃが第１の電極１１と発熱体引出電極１８との間にわたって接続され、第２の側縁部１３ｄが第１の電極１１及び発熱体引出電極１８上に沿って接続される。   As shown in FIG. 27, the first fusible conductor 13 configured as described above has a first side edge portion 13c connected between the first electrode 11 and the heating element extraction electrode 18, Two side edge portions 13 d are connected along the first electrode 11 and the heating element extraction electrode 18.

これにより、短絡素子１は、リフロー実装時等において第１の可溶導体１３の変形や、第１の可溶導体１３の溶融、溶断による給電経路３の遮断を防止することができる。また、短絡素子１は、発熱体１４の発熱後、第１の可溶導体１３を速やかに溶融させ、第１、第２の電極１１，１２上に凝集、短絡させることができる。さらに、短絡素子１は、第１、第２の電極１１，１２間を短絡させた後に、発熱体１４への給電経路を遮断させることができる。   As a result, the short-circuit element 1 can prevent the power supply path 3 from being interrupted due to deformation of the first soluble conductor 13, melting or fusing of the first soluble conductor 13 during reflow mounting or the like. In addition, the short-circuit element 1 can quickly melt the first soluble conductor 13 after the heat generating element 14 generates heat, and agglomerate and short-circuit the first soluble conductor 13 on the first and second electrodes 11 and 12. Furthermore, the short-circuit element 1 can block the power supply path to the heating element 14 after short-circuiting the first and second electrodes 11 and 12.

すなわち、第１の側縁部１３ｃは、高融点金属によって被覆され、低融点金属層９２も露出されていないために溶食作用が働きにくく、溶融するまでに多くの熱エネルギーを要する。したがって、第１の可溶導体１３は、リフロー実装時等の加熱によっても第１の電極１１と発熱体引出電極１８との間において変形や溶融が進みにくく、第１の電極１１と発熱体引出電極１８との間が溶断されることによる給電経路３の遮断を防止することができる。   That is, the first side edge portion 13c is covered with a high melting point metal, and the low melting point metal layer 92 is not exposed. Therefore, the erosion action is difficult to work, and much heat energy is required until melting. Therefore, the first fusible conductor 13 is unlikely to be deformed or melted between the first electrode 11 and the heating element extraction electrode 18 even by heating during reflow mounting or the like. It is possible to prevent the power supply path 3 from being interrupted by fusing with the electrode 18.

また、第２の側縁部１３ｄは、第１の側縁部１３ｃよりも相対的に薄肉に形成されている。また、第２の側縁部１３ｄの側面は、内層を構成する低融点金属層９２が露出されている。これにより、第２の側縁部１３ｄは、低融点金属層９２による高融点金属層９１の溶食作用が働き、かつ、溶食される高融点金属層９１の厚さも第１の側縁部１３ｃに比して薄く形成されていることにより、高融点金属層９１によって肉厚に形成されている第１の側縁部１３ｃに比して、少ない熱エネルギーで速やかに溶融させることができる。   Further, the second side edge portion 13d is formed thinner than the first side edge portion 13c. Further, the low melting point metal layer 92 constituting the inner layer is exposed on the side surface of the second side edge portion 13d. As a result, the second side edge portion 13d has the erosion action of the refractory metal layer 91 by the low melting point metal layer 92, and the thickness of the refractory metal layer 91 to be eroded is also the first side edge portion. By being formed thinner than 13c, it can be rapidly melted with less heat energy than the first side edge portion 13c formed thick by the refractory metal layer 91.

したがって、短絡素子１は、発熱体１４が発熱することにより、速やかに第２の側縁部１３ｄが溶融し、第２の側縁部１３ｄと対向されている第１の電極１１と第２の電極１２との間に跨って溶融導体が凝集する。これにより、短絡素子１は、第１、第２の電極１１，１２が短絡する。   Accordingly, in the short-circuit element 1, the second side edge 13d is quickly melted by the heat generating element 14 generating heat, and the first electrode 11 and the second electrode facing the second side edge 13d The molten conductor agglomerates between the electrodes 12. Thereby, as for the short circuit element 1, the 1st, 2nd electrodes 11 and 12 are short-circuited.

さらに、上述したように第１の側縁部１３ｃは、溶融するまでに多くの熱エネルギーを要することから、第１、第２の電極１１，１２の短絡後に第１の電極１１と発熱体引出電極１８との間が溶断される。したがって、短絡素子１は、確実に第１、第２の電極１１，１２を短絡させた後に、発熱体１４への給電経路３を遮断させることができる。   Further, as described above, since the first side edge portion 13c requires a large amount of heat energy until it is melted, the first electrode 11 and the heating element are drawn after the first and second electrodes 11 and 12 are short-circuited. The space between the electrodes 18 is melted. Therefore, the short-circuit element 1 can block the power supply path 3 to the heating element 14 after reliably short-circuiting the first and second electrodes 11 and 12.

また、以上のように構成された第２の可溶導体７２は、図２８に示すように、高融点金属によって被覆された第１の側縁部７２ｃを発熱体引出電極１８と発熱体給電電極７１との間にわたって配設することにより、溶断に相当の時間を要することから、第１の可溶導体１３が溶融して第１、第２の電極１１，１２間が短絡するまでの時間を確保し、短絡前に給電経路３が遮断される事態を防止することができる。   In addition, as shown in FIG. 28, the second soluble conductor 72 configured as described above has the first side edge portion 72c covered with the refractory metal as the heating element extraction electrode 18 and the heating element feeding electrode. Since a considerable amount of time is required for fusing by disposing it between the first and second electrodes 71, the time required for the first soluble conductor 13 to melt and the first and second electrodes 11 and 12 to be short-circuited is determined. It is possible to prevent the situation where the power supply path 3 is blocked before the short circuit.

なお、補助可溶導体２１を備えていない短絡素子１，５０，７０においても、発熱体１４を絶縁層１７を介し第１、第２の電極１１，１２に接続してもよい。例えば、図２８に示すように、短絡素子７０は、発熱体１４を第２の電極１２にも接続して加熱することにより、効率よく第１の可溶導体１３を濡らし、溶融導体を第１、第２の電極１１，１２間に凝集、短絡させることができる。   Note that the heating element 14 may be connected to the first and second electrodes 11 and 12 through the insulating layer 17 even in the short-circuit elements 1, 50, and 70 that do not include the auxiliary soluble conductor 21. For example, as shown in FIG. 28, the short-circuit element 70 efficiently heats the first fusible conductor 13 by connecting the heating element 14 to the second electrode 12 and heating it, so that the molten conductor becomes the first. The second electrodes 11 and 12 can be agglomerated and short-circuited.

このような構成を有する可溶導体１３，７２，２１は、低融点金属層９２を構成するハンダ箔等の低融点金属箔を、高融点金属層９１を構成するＡｇ等の金属で被覆することにより製造される。低融点金属層箔を高融点金属被覆する工法としては、長尺状の低融点金属箔に連続して高融点金属メッキを施すことができる電解メッキ法が、作業効率上、製造コスト上、有利となる。   The fusible conductors 13, 72, and 21 having such a configuration are obtained by coating a low melting point metal foil such as a solder foil constituting the low melting point metal layer 92 with a metal such as Ag constituting the high melting point metal layer 91. Manufactured by. As a method for coating a low melting point metal layer foil with a high melting point metal, an electrolytic plating method capable of continuously applying a high melting point metal plating to a long low melting point metal foil is advantageous in terms of work efficiency and manufacturing cost. It becomes.

電解メッキによって高融点金属メッキを施すと、長尺状の低融点金属箔のエッジ部分、すなわち、側縁部において電流密度が相対的に強まり、高融点金属層９１が厚くメッキされる（図２６参照）。これにより、側縁部が高融点金属層によって肉厚に形成された長尺状の導体リボン９６が形成される。次いで、この導体リボン９６を長手方向と直交する幅方向（図２６中Ｃ−Ｃ’方向）に、所定長さに切断することにより、可溶導体１３，７２，２１が製造される。これにより、可溶導体１３，７２，２１は、導体リボン９６の側縁部が第１の側縁部１３ｃ，７２ｃ，２１ｃとなり、導体リボン９６の切断面が第２の側縁部１３ｄ，７２ｄ，２１ｄとなる。また、第１の側縁部１３ｃ，７２ｃ，２１ｃは、高融点金属によって被覆され、第２の側縁部１３ｄ，７２ｄ，２１ｄは、端面（導体リボン９６の切断面）に外周を取り巻く高融点金属層９１と高融点金属層９１によって挟持された低融点金属層９２が外方に露出されている。   When refractory metal plating is performed by electrolytic plating, the current density is relatively increased at the edge portion of the long low melting point metal foil, that is, the side edge portion, and the refractory metal layer 91 is thickly plated (FIG. 26). reference). As a result, a long conductor ribbon 96 having side edges formed thick by the refractory metal layer is formed. Next, the conductor ribbon 96 is cut into a predetermined length in the width direction (C-C ′ direction in FIG. 26) perpendicular to the longitudinal direction, whereby the fusible conductors 13, 72, and 21 are manufactured. Thus, in the fusible conductors 13, 72, and 21, the side edges of the conductor ribbon 96 become the first side edges 13c, 72c, and 21c, and the cut surface of the conductor ribbon 96 becomes the second side edges 13d, 72d. , 21d. The first side edges 13c, 72c, and 21c are covered with a high melting point metal, and the second side edges 13d, 72d, and 21d are high melting points that surround the outer periphery of the end surface (the cut surface of the conductor ribbon 96). A low melting point metal layer 92 sandwiched between the metal layer 91 and the high melting point metal layer 91 is exposed to the outside.

１ 短絡素子、２ スイッチ、３ 給電経路、１０ 絶縁基板、１０ａ 表面、１０ｂ 裏面、１１ 第１の電極、１１ａ 外部接続端子、１２ 第２の電極、１２ａ 外部接続端子、１３ 第１の可溶導体、１３ａ 溶融導体、１４ 発熱体、１５ 接合材、１７ 絶縁層、１８ 発熱体引出電極、１８ａ 下層部、１８ｂ 上層部、１９ 発熱体電極、２１ 補助可溶導体、２３ 絶縁層、２４ フラックス、２８ 外部回路、３２ 電流制御素子、３５ 検出素子、５０ 短絡素子、５１ 第１の回路、５３ 外部電源、６０ 短絡回路、７０ 短絡素子、７１ 発熱体給電電極、７２ 第２の可溶導体、９１ 高融点金属層、９２ 低融点金属層、９３ 開口部、９４ 開口部、９５ 開口部、９６ 導体リボン DESCRIPTION OF SYMBOLS 1 Short circuit element, 2 switch, 3 Feeding path, 10 Insulating board | substrate, 10a surface, 10b back surface, 11 1st electrode, 11a External connection terminal, 12 2nd electrode, 12a External connection terminal, 13 1st soluble conductor , 13a Molten conductor, 14 Heating element, 15 Bonding material, 17 Insulating layer, 18 Heating element extraction electrode, 18a Lower layer part, 18b Upper layer part, 19 Heating element electrode, 21 Auxiliary soluble conductor, 23 Insulating layer, 24 Flux, 28 External circuit, 32 Current control element, 35 Detection element, 50 Short circuit element, 51 First circuit, 53 External power supply, 60 Short circuit, 70 Short circuit element, 71 Heating element feeding electrode, 72 Second soluble conductor, 91 High Melting point metal layer, 92 Low melting point metal layer, 93 opening, 94 opening, 95 opening, 96 conductor ribbon

Claims (24)

第１の電極と、
上記第１の電極と隣接して設けられた第２の電極と、
上記第１の電極に支持され、溶融することにより、上記第１、第２の電極間にわたって凝集し、上記第１、第２の電極を短絡させる第１の可溶導体と、
上記第１の可溶導体を加熱する発熱体とを備え、
上記第１の可溶導体は、上記第２の電極と反対側に突出して支持されている短絡素子。 A first electrode;
A second electrode provided adjacent to the first electrode;
A first soluble conductor that is supported by the first electrode and melts to agglomerate between the first and second electrodes and short-circuit the first and second electrodes;
A heating element for heating the first soluble conductor,
The first soluble conductor is a short-circuit element that protrudes and is supported on the opposite side to the second electrode. 上記第１の電極の上記第２の電極と反対側には、上記発熱体と電気的に接続された発熱体引出電極が設けられ、
上記発熱体引出電極が上記第１の可溶導体の一端を支持することにより、上記第１の電極及び上記第１の可溶導体を介して、上記発熱体へ給電する給電経路が形成される請求項１記載の短絡素子。 A heating element extraction electrode electrically connected to the heating element is provided on the opposite side of the first electrode to the second electrode,
The heating element lead-out electrode supports one end of the first soluble conductor, thereby forming a power supply path for supplying power to the heating element via the first electrode and the first soluble conductor. The short-circuit element according to claim 1. 上記第１の可溶導体の溶融導体により上記第１、第２の電極間が短絡した後、上記第１の電極と上記第１の発熱体引出電極との間が遮断される請求項２記載の短絡素子。   3. The circuit between the first electrode and the first heating element extraction electrode is interrupted after the first and second electrodes are short-circuited by the molten conductor of the first soluble conductor. Short circuit element. 上記発熱体引出電極は、上記第１、第２の電極よりも上記発熱体と離間した位置に配設されている請求項３に記載の短絡素子。   The short-circuit element according to claim 3, wherein the heating element extraction electrode is disposed at a position farther from the heating element than the first and second electrodes. 上記第２の電極の上記第１の電極と反対側、又は上記第１の電極の上記第２の電極と反対側には、上記発熱体と電気的に接続された発熱体引出電極が設けられ、
上記発熱体引出電極は、上記第１、第２の電極及び上記第１の可溶導体と電気的に独立した上記発熱体への給電経路を構成する請求項１記載の短絡素子。 A heating element extraction electrode electrically connected to the heating element is provided on the opposite side of the second electrode to the first electrode or on the opposite side of the first electrode to the second electrode. ,
2. The short-circuit element according to claim 1, wherein the heating element extraction electrode constitutes a power feeding path to the heating element that is electrically independent of the first and second electrodes and the first soluble conductor. 上記発熱体引出電極と隣接して設けられた発熱体給電電極と、
上記発熱体引出電極及び上記発熱体給電電極間に亘って搭載された第２の可溶導体とを有する請求項５記載の短絡素子。 A heating element feeding electrode provided adjacent to the heating element extraction electrode;
The short-circuit element according to claim 5, further comprising a second soluble conductor mounted between the heating element lead-out electrode and the heating element feeding electrode. 上記第１の可溶導体が溶融し、該第１の可溶導体の溶融導体により上記第１、第２の電極間が短絡した後、上記第２の可溶導体が溶融し、上記発熱体引出電極及び上記発熱体給電電極間が遮断される請求項６記載の短絡素子。   After the first soluble conductor is melted and the first and second electrodes are short-circuited by the molten conductor of the first soluble conductor, the second soluble conductor is melted, and the heating element The short-circuit element according to claim 6, wherein a space between the extraction electrode and the heating element feeding electrode is cut off. 上記第１の可溶導体は、上記第２の可溶導体よりも上記発熱体に近接する位置に配設されている請求項７記載の短絡素子。   The short circuit element according to claim 7, wherein the first soluble conductor is disposed at a position closer to the heating element than the second soluble conductor. 上記第１の可溶導体は、上記第２の可溶導体よりも断面積が狭く形成されている請求項７又は８に記載の短絡素子。   The short circuiting element according to claim 7 or 8, wherein the first soluble conductor has a cross-sectional area narrower than that of the second soluble conductor. 上記第１の可溶導体は、上記第２の可溶導体よりも融点が低い請求項７〜９のいずれか１項に記載の短絡素子。   The short circuit element according to any one of claims 7 to 9, wherein the first soluble conductor has a melting point lower than that of the second soluble conductor. 上記発熱体は絶縁層を介して上記第１の電極又は上記第１の電極及び上記第２の電極と連続されている請求項１〜１０のいずれか１項に記載の短絡素子。   11. The short-circuit element according to claim 1, wherein the heating element is connected to the first electrode or the first electrode and the second electrode via an insulating layer. 上記第２の電極に補助可溶導体が接続され、
上記発熱体は上記絶縁層を介して上記第２の電極とも連続されている請求項１１に記載の短絡素子。 An auxiliary soluble conductor is connected to the second electrode;
The short-circuit element according to claim 11, wherein the heating element is also continuous with the second electrode through the insulating layer. 上記第１及び／又は第２の電極の一部が、熱伝導率が１０Ｗ／ｍ・Ｋ以下の絶縁材料で構成された支持体に支持されている請求項１〜１２のいずれか１項に記載の短絡素子。   A part of said 1st and / or 2nd electrode is supported by the support body comprised with the insulating material whose heat conductivity is 10 W / m * K or less in any one of Claims 1-12 The short circuit element of description. 上記第１の可溶導体の体積は、少なくとも、上記第１の電極の上記第２の電極と対峙する側面の面積と、上記第１、第２の電極間距離との積以上である請求項１〜１３のいずれか１項に記載の短絡素子。   The volume of the first soluble conductor is at least the product of the area of the side surface of the first electrode facing the second electrode and the distance between the first and second electrodes. The short-circuit element according to any one of 1 to 13. 上記第１の電極と連続する第１の配線と、
上記第２の電極と連続する第２の配線とを有し、
上記第１、第２の配線は表面が絶縁被覆されている請求項１〜１４のいずれか１項に記載の短絡素子。 A first wiring continuous with the first electrode;
A second wiring continuous with the second electrode;
The short circuit element according to any one of claims 1 to 14, wherein surfaces of the first and second wirings are coated with insulation. 上記第１の電極は、部分的に断面積の大きな大径部を備え、
上記第１の可溶導体の溶融導体が上記大径部に凝集される請求項１〜１５のいずれか１項に記載の短絡素子。 The first electrode includes a large-diameter portion having a partially large cross-sectional area,
The short-circuit element according to claim 1, wherein the molten conductor of the first soluble conductor is aggregated in the large-diameter portion. 上記第１の可溶導体は、Ｓｎ若しくはＳｎを主成分とする合金、又はＰｂ若しくはＰｂを主成分とする合金である請求項１〜１６のいずれか１項に記載の短絡素子。   The short circuit element according to any one of claims 1 to 16, wherein the first soluble conductor is an alloy containing Sn or Sn as a main component, or an alloy containing Pb or Pb as a main component. 上記第１の可溶導体は、低融点金属と高融点金属を積層した複合材料である請求項１〜１６のいずれか１項に記載の短絡素子。   The short circuit element according to any one of claims 1 to 16, wherein the first soluble conductor is a composite material in which a low melting point metal and a high melting point metal are laminated. 上記第２の可溶導体は、Ｓｎ若しくはＳｎを主成分とする合金、又はＰｂ若しくはＰｂを主成分とする合金である請求項６〜１０のいずれか１項に記載の短絡素子。   The short circuit element according to any one of claims 6 to 10, wherein the second soluble conductor is an alloy containing Sn or Sn as a main component, or an alloy containing Pb or Pb as a main component. 上記第２の可溶導体は、低融点金属と高融点金属を積層した複合材料である請求項６〜１０のいずれか１項に記載の短絡素子。   The short circuit element according to any one of claims 6 to 10, wherein the second soluble conductor is a composite material in which a low melting point metal and a high melting point metal are laminated. 上記低融点金属は、Ｓｎ又はＳｎを４０％以上含む合金であり、上記高融点金属は、Ａｇ、Ｃｕ、又はＡｇ若しくはＣｕを主成分とする合金である請求項１８又は２０に記載の短絡素子。   21. The short-circuit element according to claim 18, wherein the low melting point metal is Sn or an alloy containing 40% or more of Sn, and the high melting point metal is Ag, Cu, or an alloy containing Ag or Cu as a main component. . 上記第１の可溶導体は板状に形成され、上記第１の電極との接続面積の２倍以上の面積を有する請求項１〜２１のいずれか１項に記載の短絡素子。   The short-circuit element according to any one of claims 1 to 21, wherein the first soluble conductor is formed in a plate shape and has an area that is at least twice as large as a connection area with the first electrode. 上記第１の可溶導体は線状であり、第１の電極との接続長さの２倍以上の長さを有する請求項１〜２１のいずれか１項に記載の短絡素子。   The short circuit element according to any one of claims 1 to 21, wherein the first fusible conductor is linear and has a length that is at least twice as long as a connection length with the first electrode. 上記第１、第２の電極の間隔は、上記第１、第２の電極間隔の延長線上における上記第１の電極の幅以下である請求項１〜２３のいずれか１項に記載の短絡素子。   The short-circuit element according to any one of claims 1 to 23, wherein an interval between the first and second electrodes is equal to or less than a width of the first electrode on an extension line of the first and second electrode intervals. .
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