JPH073559Y2 - Temperature sensitive switch - Google Patents
Temperature sensitive switchInfo
- Publication number
- JPH073559Y2 JPH073559Y2 JP4514489U JP4514489U JPH073559Y2 JP H073559 Y2 JPH073559 Y2 JP H073559Y2 JP 4514489 U JP4514489 U JP 4514489U JP 4514489 U JP4514489 U JP 4514489U JP H073559 Y2 JPH073559 Y2 JP H073559Y2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- electrode
- piece
- low melting
- metal piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【考案の詳細な説明】 ＜産業上の利用分野＞ 本考案は低融点可溶合金を用いた感温スイッチの改良に
関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention relates to an improvement of a temperature sensitive switch using a low melting point fusible alloy.
＜従来の技術＞ Sn−Pb系の合金は他の金属の添加によって融点を容易に
調整できる。例えば、Pb:31重量％、Sn:19重量％、Bi:5
0重量％のSn−Pb−Bi系合金の融点は98℃であり、Sn:50
重量％、Pb:32重量％、Cd:18重量％のSn−Pb−Cd系合金
の融点は145℃である。而して、感温スイッチの分野に
おいては、Sn−Pb系合金の融点を所定の感温点に設定
し、該感温点でのSn−Pb系合金の溶融を利用してスイッ
チオン作動させることが知られている。例えば、弾力性
の接触金属片をその弾性力に抗しSn−Pb系合金材を用い
て接点から離隔しておき、所定の温度にまで加熱されて
合金材が溶融すると、接触金属片をその弾性力で接点に
接触させるものが公知である。<Prior Art> The melting point of Sn-Pb based alloys can be easily adjusted by adding other metals. For example, Pb: 31 wt%, Sn: 19 wt%, Bi: 5
The melting point of 0 wt% Sn-Pb-Bi alloy is 98 ° C, and Sn: 50
The melting point of the Sn-Pb-Cd based alloy of wt%, Pb: 32 wt% and Cd: 18 wt% is 145 ° C. Thus, in the field of temperature-sensitive switches, the melting point of the Sn-Pb-based alloy is set to a predetermined temperature-sensitive point, and the switch-on operation is performed by utilizing the melting of the Sn-Pb-based alloy at the temperature-sensitive point. It is known. For example, the elastic contact metal piece is separated from the contact using a Sn-Pb alloy material against its elastic force, and when the alloy material is melted by being heated to a predetermined temperature, the contact metal piece is It is known to make contact with a contact by elastic force.
＜解決しようとする課題＞ しかしながら、低融点可溶合金を用いた従来の感温スイ
ッチは構造が複雑であり、また、常時、低融点可溶金属
片に接触金属片の弾性力が作用するから、当該合金片の
クリープ破断が懸念される。<Problems to be solved> However, the conventional temperature-sensitive switch using the low melting point fusible alloy has a complicated structure, and the elastic force of the contact metal piece always acts on the low melting point fusible metal piece. However, there is concern about creep rupture of the alloy piece.
本考案の目的は、構造が簡易で、低融点可溶金属片のク
リープ破断も排除できる感温スイッチを提供することに
ある。An object of the present invention is to provide a temperature-sensitive switch having a simple structure and capable of eliminating creep rupture of a low melting point fusible metal piece.
＜課題を解決するための手段＞ 本考案に係る感温スイッチは絶縁基板上に第１電極片を
設け、該電極片上に低融点可溶金属片を設け、該低融点
可溶金属片に対しギャップを隔てて第２電極を配設した
ことを特徴とする構成である。<Means for Solving the Problems> A temperature-sensitive switch according to the present invention is provided with a first electrode piece on an insulating substrate, a low melting point metal piece provided on the electrode piece, and a low melting point metal piece. The second electrode is arranged with a gap in between.
＜実施例の説明＞ 以下、図面により本考案の実施例を説明する。<Description of Embodiments> Hereinafter, embodiments of the present invention will be described with reference to the drawings.
第１図Ａは本考案の一実施例を示す一部欠切上面図、第
１図Ｂ並び第１図Ｃはそれぞれ第１図Ａにおけるｂ−ｂ
断面図並びにＣ−Ｃ断面図である。FIG. 1A is a partially cutaway top view showing an embodiment of the present invention, and FIG. 1B and FIG. 1C are respectively bb in FIG. 1A.
It is sectional drawing and CC sectional drawing.
第１図Ａ乃至第１図Ｃにおいて、１は絶縁基板であり、
セラミックス板、ガラス板等を用いることができる。２
は絶縁基板上に設けた第１印刷導体であり、ブリッヂ部
を介して円形の第１電極片20が形成されている。３は印
刷導体２にハンダ付けした第１リード導体である。４は
第２印刷導体である。印刷導体２・４は銀系、銅系の導
体ペイントの印刷塗布・焼付けにより、あるいは銅箔貼
付絶縁体の銅箔エッチングにより形成できる。1A to 1C, 1 is an insulating substrate,
A ceramic plate, a glass plate or the like can be used. Two
Is a first printed conductor provided on an insulating substrate, and a circular first electrode piece 20 is formed via a bridge portion. Reference numeral 3 is a first lead conductor soldered to the printed conductor 2. 4 is a second printed conductor. The printed conductors 2 and 4 can be formed by print application / baking of silver-based or copper-based conductor paint, or by copper foil etching of a copper foil stuck insulator.
５は第２リード導体であり、第２印刷導体４にハンダ付
けし、先端側を折曲して第２電極50に形成してある。６
は第１電極片20上に設けた低融点可溶金属片であり、Sn
−Pb系合金を用いることができる。この低融点可溶金属
片６の平面積は第１電極片20の平面積よりも大きくして
ある。上記の第２電極50は低融点可溶金属片６上にギャ
ップを隔てて配置してある。７はフラックスであり、第
２電極50並びに低融点可溶金属片６を包囲している。８
はモールド絶縁体であり、例えばエポキシ樹脂の滴下塗
装によって成形できる。Reference numeral 5 is a second lead conductor, which is soldered to the second printed conductor 4 and bent at the tip side to form the second electrode 50. 6
Is a low melting point soluble metal piece provided on the first electrode piece 20, Sn
-Pb-based alloy can be used. The plane area of this low melting point metal piece 6 is larger than the plane area of the first electrode piece 20. The second electrode 50 is arranged on the low melting point metal piece 6 with a gap. 7 is a flux, which surrounds the second electrode 50 and the low melting point fusible metal piece 6. 8
Is a mold insulator and can be molded by, for example, dropping coating of epoxy resin.
上記低融点可溶金属片６の融点は所定の温度に設定して
ある。而して、感温スイッチが所定の温度に加熱される
と低融点可溶金属片６が溶融する。而るに、絶縁基板１
例えばセラミック板は濡れ性が悪く溶融金属を弾いてし
まい、電極材例えば焼付け導電ペーストは溶融金属によ
く濡れるので、第２図に示すように、溶融金属60は第１
電極片20を受台として球状化していき、せいが高くなっ
て第２電極50に接触し、導通状態が確保される。The melting point of the low melting point soluble metal piece 6 is set to a predetermined temperature. When the temperature sensitive switch is heated to a predetermined temperature, the low melting point metal piece 6 melts. Therefore, the insulating substrate 1
For example, the ceramic plate has poor wettability and repels the molten metal, and the electrode material such as the baked conductive paste is well wetted by the molten metal. Therefore, as shown in FIG.
As the electrode piece 20 is used as a pedestal, it is made spherical, and its height increases to contact the second electrode 50, so that the conduction state is secured.
第３図Ａは温度ヒューズと本考案に係る感温スイッチと
を合体させた素子を示す一部切上面図、第３図Ｂは第３
図Ａにおけるｂ−ｂ断面図である。第３図Ａ並びに第３
図Ｂにおいて、１は絶縁基板、２は第１印刷導体、４は
第２印刷導体、９は第３印刷導体である。20は第１印刷
導体２においてブリッヂ部を介して形成した第１電極片
である。６は第３印刷導体９と第１電極片20との間に橋
設した低融点可溶金属片である。５はリード導体であ
り、第２印刷導体４にハンダ付けしてある。50はリード
導体５の先端側に折曲げによって形成した第２電極であ
り、第１電極片20上の低融点可溶金属片部分60の上にギ
ャップを介して配置してある。７は低融点可溶金属片６
上に設けたフラックス、31並びに32は、それぞれの印刷
導体２・９にハンダ付けしたリード導体、８はモールド
絶縁体である。FIG. 3A is a partially cutaway top view showing an element in which a thermal fuse and a temperature sensitive switch according to the present invention are combined, and FIG.
It is a bb sectional view in FIG. Figure 3A and 3
In FIG. B, 1 is an insulating substrate, 2 is a first printed conductor, 4 is a second printed conductor, and 9 is a third printed conductor. Reference numeral 20 is a first electrode piece formed on the first printed conductor 2 via a bridge portion. Reference numeral 6 is a low melting point fusible metal piece bridged between the third printed conductor 9 and the first electrode piece 20. Reference numeral 5 is a lead conductor, which is soldered to the second printed conductor 4. Reference numeral 50 denotes a second electrode formed by bending the lead conductor 5 on the front end side, and is arranged on the first electrode piece 20 and above the low melting point soluble metal piece portion 60 via a gap. 7 is a low melting point soluble metal piece 6
Fluxes 31 and 32 provided above are lead conductors soldered to the respective printed conductors 2 and 9, and 8 is a mold insulator.
上記の素子においては、常時は、リード導体31・32間が
低融点可溶金属片６を介して導通状態にある。而るに、
所定の温度に達すると低融点可溶金属片６がほぼ中央で
溶断し、各溶断部分が球状化していき、第１電極片20上
において溶融金属のせいが球状化のために高くなってそ
の球状化溶融金属が第２電極50に接触し、リード導体２
・４の間が導通される。In the above-mentioned element, the lead conductors 31 and 32 are always in conduction with each other through the low melting point fusible metal piece 6. However,
When the predetermined temperature is reached, the low melting point fusible metal piece 6 is melted and cut at approximately the center, and each of the melted parts is spheroidized. Due to the spheroidization, the molten metal becomes high on the first electrode piece 20. The spheroidized molten metal contacts the second electrode 50, and the lead conductor 2
・ Continued between 4
第４図は本考案の別実施例を示し、絶縁基板１上に第１
電極片20と第２電極片50を設け、各電極片の前方に低融
点可溶金属片６・６を設け、かつそれぞれの可溶金属片
６・６と各電極片20・50とを接触させてある。各可溶金
属片６・６の平面積は各電極片20・50の平面積よりも大
きくしてあり、電極片20・（50）と電極片50・（20）側
の可溶金属片６・（６）との間にはギャップが存在す
る。３・５は各電極20・50にハンダ付けしたリード導
体、７はフラックス、８はモールド絶縁体である。FIG. 4 shows another embodiment of the present invention.
The electrode piece 20 and the second electrode piece 50 are provided, the low melting point soluble metal piece 6.6 is provided in front of each electrode piece, and each soluble metal piece 6.6 and each electrode piece 20/50 are brought into contact with each other. I am allowed. The plane area of each of the fusible metal pieces 6 and 6 is larger than the plane area of each of the electrode pieces 20 and 50, and the fusible metal pieces 6 of the electrode pieces 20 and (50) and the electrode pieces 50 and (20) are・ There is a gap with (6). 3 and 5 are lead conductors soldered to the electrodes 20 and 50, 7 is a flux, and 8 is a mold insulator.
この別実施例においても、所定の温度で各可溶金属片が
溶融し、第５図Ａに示すように、それぞれの溶融金属60
・60が各電極片20・50を核として球状化し、両球状体が
接触して第５図Ｂに示すように両電極20・50が溶融金属
60で導通される。Also in this other embodiment, each fusible metal piece melts at a predetermined temperature, and each molten metal 60 is melted as shown in FIG. 5A.
・ 60 spheroidizes each electrode piece 20/50 as a nucleus, and both spheres come into contact and both electrodes 20/50 are molten metal as shown in Fig. 5B.
Conducted at 60.
＜考案の効果＞ 本考案に係る感温スイッチは上述した通りの構成であ
り、低融点可溶金属が溶融したのち、球状化する現象を
利用してスイッチオンさせるものであり、スイッチオン
させるために他の付加的手段を必要としないから構造が
簡単である。また、低融点可溶金属片にバネ力を作用さ
せる必要がないから、当該金属片のクリープ破断の問題
もない。<Effects of the Invention> The temperature-sensitive switch according to the present invention is configured as described above, and is used to switch on by utilizing the phenomenon that the low melting point soluble metal is melted and then spheroidized. The structure is simple because it does not require any additional means. Further, since it is not necessary to apply a spring force to the low melting point soluble metal piece, there is no problem of creep rupture of the metal piece.
第１図Ａは本考案の一実施例を示す説明図、第１図Ｂ並
びに第１図Ｃはそれぞれ第１図Ａにおけるｂ−ｂ断面図
並びにＣ−Ｃ断面図、第２図は同上実施例のスイッチオ
ン状態を示す説明図、第３図Ａは本考案の別実施例を示
す説明図、第３図Ｂは第３図Ａにおけるｂ−ｂ断面図、
第４図は本考案の他の別実施例を示す説明図、第５図Ａ
並びに第５図Ｂはそれぞれ該別実施例のスイッチオンの
直前並びに直後の状態を示す説明図である。 １……絶縁基板、20……第１電極片、50……第２電極、
６……低融点可溶金属片。FIG. 1A is an explanatory view showing an embodiment of the present invention, FIGS. 1B and 1C are sectional views taken along the line bb and CC of FIG. 1A, respectively, and FIG. FIG. 3A is an explanatory view showing a switch-on state of an example, FIG. 3A is an explanatory view showing another embodiment of the present invention, and FIG. 3B is a sectional view taken along line bb in FIG. 3A.
FIG. 4 is an explanatory view showing another embodiment of the present invention, and FIG. 5A.
And FIG. 5B is an explanatory view showing a state immediately before and immediately after the switch is turned on in the another embodiment. 1 ... Insulating substrate, 20 ... First electrode piece, 50 ... Second electrode,
6 ... A low melting point soluble metal piece.
Claims (1)
上に低融点可溶金属片を設け、該低融点可溶金属片に対
しギャップを隔てて第２電極を配設したことを特徴とす
る感温スイッチ。1. A first electrode piece is provided on an insulating substrate, a low-melting point soluble metal piece is provided on the electrode piece, and a second electrode is arranged with a gap from the low-melting point soluble metal piece. A temperature sensitive switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4514489U JPH073559Y2 (en) | 1989-04-17 | 1989-04-17 | Temperature sensitive switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4514489U JPH073559Y2 (en) | 1989-04-17 | 1989-04-17 | Temperature sensitive switch |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02136946U JPH02136946U (en) | 1990-11-15 |
| JPH073559Y2 true JPH073559Y2 (en) | 1995-01-30 |
Family
ID=31559066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4514489U Expired - Lifetime JPH073559Y2 (en) | 1989-04-17 | 1989-04-17 | Temperature sensitive switch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073559Y2 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6184238B2 (en) * | 2013-08-07 | 2017-08-23 | デクセリアルズ株式会社 | Short circuit element and short circuit |
| JP6097178B2 (en) * | 2013-08-21 | 2017-03-15 | デクセリアルズ株式会社 | Switch circuit and switch control method using the same |
| JP6173859B2 (en) * | 2013-09-26 | 2017-08-02 | デクセリアルズ株式会社 | Short circuit element |
| JP6202992B2 (en) * | 2013-11-01 | 2017-09-27 | デクセリアルズ株式会社 | Protective circuit, battery circuit, protective element, and driving method of protective element |
| JP6223142B2 (en) * | 2013-11-20 | 2017-11-01 | デクセリアルズ株式会社 | Short circuit element |
| JP6389603B2 (en) * | 2013-12-02 | 2018-09-12 | デクセリアルズ株式会社 | Switch element, switch circuit, and alarm circuit |
| JP6381975B2 (en) * | 2014-06-04 | 2018-08-29 | デクセリアルズ株式会社 | Short circuit element |
| JP6381980B2 (en) * | 2014-06-11 | 2018-08-29 | デクセリアルズ株式会社 | Switch element and switch circuit |
| JP6437221B2 (en) * | 2014-06-27 | 2018-12-12 | デクセリアルズ株式会社 | Switch element, switch circuit and alarm circuit |
| JP6411123B2 (en) * | 2014-08-04 | 2018-10-24 | デクセリアルズ株式会社 | Temperature short-circuit element, temperature switching element |
| JP6343201B2 (en) * | 2014-08-04 | 2018-06-13 | デクセリアルズ株式会社 | Short circuit element |
| JP6437253B2 (en) * | 2014-09-12 | 2018-12-12 | デクセリアルズ株式会社 | Protective element and mounting body |
-
1989
- 1989-04-17 JP JP4514489U patent/JPH073559Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02136946U (en) | 1990-11-15 |
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