JP2015118988A - プリント回路板の製造方法及びプリント回路板 - Google Patents
プリント回路板の製造方法及びプリント回路板 Download PDFInfo
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Abstract
Description
本発明におけるプリント回路板について、図1(a)、(b)に基づいて説明する。
実施例1として、本発明が適用された半導体パッケージは、LGA(Land Grid Array)構造であり、外形は10mm×10mm、とした。電極パッドの径は、0.85mm、0.6mm、0.4mm、0.25mmの4種類用意した。また、電極パッド同士の接続ピッチはそれぞれ、1.7mm、1.2mm、0.8mm、0.5mmとした。それぞれの電極パッドは、25個、49個、121個、289個設けた。なお、電極パッドの外縁部は、ソルダーレジストで覆った。
実施例2として、本発明が適用された半導体パッケージは、LGA(Land Grid Array)構造であり、外形は35mm×29mm、厚さは2.5mmとした。半導体パッケージの下面には、電気信号用の電極パッドと補強用の電極パッドを設けた。
2 第2のプリント配線板
3 第1の電極パッド(半導体パッケージの電極パッド)
4 第2の電極パッド
5 第1の領域
6 第2の領域
7 第3の領域
8 はんだペースト
9 溶融状態のはんだ
10 はんだ接合部
11 ソルダーレジスト
14 実施例2における電気信号用の電極パッド
15 実施例2における補強用の電極パッド
40 メタルマスク
41 開口
42 スキージ
43 リフロー炉
100 ピン状の接続部品
101 従来技術におけるプリント配線板
Claims (10)
- 第1の電極パッドが表面に形成された第1のプリント配線板と、第2の電極パッドが表面に形成された第2のプリント配線板とを有し、はんだにより前記第1の電極パッドと前記第2の電極パッドとを接合したプリント回路板の製造方法において、
前記第2のプリント配線板には、前記第2の電極パッド上の外縁部がソルダーレジストに覆われている第1の領域と、前記第2の電極パッド上のソルダーレジストにより覆われていない第2の領域と、前記第2の領域と隣接する前記第2の電極パッド外周領域のうち、ソルダーレジストにより覆われていない第3の領域とが形成されており、
前記はんだペーストを前記第2の領域と前記第3の領域とにまたがる領域に供給し、前記第1のプリント配線板の前記第1の電極パッドが、前記第2のプリント配線板の前記第2の電極パッドと対向するように、前記第1のプリント配線板を前記第2のプリント配線板上に搭載し、加熱により前記はんだペーストを溶融させるとともに、溶融したはんだを前記第3の領域から前記第2の領域に向けて移動させることで、前記第1の電極パッドと前記第2の電極パッドを接合することを特徴とする、プリント回路板の製造方法。 - 前記第1のプリント配線板は、半導体パッケージであることを特徴とする、請求項1に記載のプリント回路板の製造方法。
- 前記第1のプリント配線板は、前記第1の電極パッドの外縁部がソルダーレジストに覆われていることを特徴とする、請求項1または2に記載のプリント回路板の製造方法。
- 前記第2の領域の面積に対して、前記第2の領域の面積に対する、前記第2の領域の中のはんだペーストが供給されていない領域の面積の比率が20%以上95%以下であることを特徴とする、請求項1乃至3のいずれか1項に記載のプリント回路板の製造方法。
- 第1の電極パッドが表面に形成された第1のプリント配線板と、第2の電極パッドが表面に形成された第2のプリント配線板とを有し、はんだにより前記第1の電極パッドと前記第2の電極パッドとを接合したプリント回路板において、
前記第2のプリント配線板の前記第2の電極パッド上の外縁部がソルダーレジストに覆われている第1の領域と、前記第2の電極パッド上のソルダーレジストにより覆われていない第2の領域と、前記第2の領域と隣接する前記第2の電極パッド外周領域のうち、ソルダーレジストにより覆われていない第3の領域とが形成されていることを特徴とする、プリント回路板。 - 前記第1の第1のプリント配線板は、半導体パッケージであることを特徴とする、請求項5に記載のプリント回路板。
- 前記第1のプリント配線板の第1の電極パッドの外縁部はソルダーレジストに覆われており、前記第1の電極パッドと第2の電極パッドの間隔は20μm以上110μm以下であることを特徴とする、請求項5または6に記載のプリント回路板。
- 前記第2のプリント配線板には複数の第2の電極パッドが形成されており、前記第2の電極パッドに対応して形成された前記第2の領域および第3の領域は、全て対応する第2の電極パッドから同じ方向に形成されていることを特徴とする、請求項5乃至7のいずれか1項に記載のプリント回路板。
- 複数の第1の電極パッドが表面に形成された第1のプリント配線板と、複数の第2の電極パッドが表面に形成された第2のプリント配線板とを有し、はんだにより前記第1の電極パッドと前記第2の電極パッドとを接合したプリント回路板において、
前記第1の電極パッドには電気信号用の電極パッドと、該電気信号用の電極パッドの外周領域に設けられた補強用の電極パッドを含んでおり、前記第2の電極パッドには電気信号用の電極パッドと、該電気信号用の電極パッドの外周領域に設けられた補強用の電極パッドを含んでおり、
前記第2の電極パッドのうちの補強用の電極パッドには、前記補強用の電極パッド上の外縁部がソルダーレジストに覆われている第1の領域と、前記補強用の電極パッド上のソルダーレジストにより覆われていない第2の領域と、前記第2の領域と隣接する前記補強用の電極パッドの外周領域のうち、ソルダーレジストにより覆われていない第3の領域とが形成されていることを特徴とする、プリント回路板。 - 前記補強用の電極パッドの面積は、前記電気信号用の電極パッドの面積よりも大きいことを特徴とする、請求項9に記載のプリント回路板。
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