JP2014503122A - 低コストなカプセル化された発光装置 - Google Patents
低コストなカプセル化された発光装置 Download PDFInfo
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- JP2014503122A JP2014503122A JP2013548898A JP2013548898A JP2014503122A JP 2014503122 A JP2014503122 A JP 2014503122A JP 2013548898 A JP2013548898 A JP 2013548898A JP 2013548898 A JP2013548898 A JP 2013548898A JP 2014503122 A JP2014503122 A JP 2014503122A
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- 229910052751 metal Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (20)
- フィルムを供給し、
前記フィルム上に複数の発光素子を付加し、
1又は複数の前記発光素子からの光を所望の光出力方向に反射するように、前記フィルム上に複数の反射性構造を付加し、
前記反射性構造を対応する1又は複数の前記発光素子に取り付けるように、前記反射性構造内にカプセル化材料を付加し、
各反射性構造に取り付けられた1又は複数の前記発光素子を有する発光装置を供給するために、前記複数の反射性構造を単一化する、方法。 - 前記カプセル化材料を付加した後に前記フィルムを除去することを含む、請求項1記載の方法。
- 前記フィルムに取り付けられた前記反射性構造の表面から材料を除去することを含む、請求項2記載の方法。
- 平面を形成するために、前記カプセル化材料の光出力表面を成形することを含む、請求項1記載の方法。
- 非平面を形成するために、前記カプセル化材料の光出力表面を成形することを含む、請求項1記載の方法。
- 前記複数の反射性構造を前記フィルムに付加することが、前記複数の反射性構造を有するフレームを前記フィルムに取り付けることを含む、請求項1記載の方法。
- 前記複数の反射性構造を前記フィルムに付加することが、前記複数の反射性構造を前記フィルム上に形成することを含む、請求項1記載の方法。
- 前記フィルム上の前記複数の反射性構造が、前記複数の発光素子を前記フィルム上に置くための基準を供給する、請求項1記載の方法。
- 複数の波長変換素子を付加することを含む、請求項1記載の方法。
- 上面と、下面と、前記上面と前記下面との間に延在する開口と、を含む構造体と、
前記構造体の前記下面に隣接する前記開口内にある少なくとも1つの発光素子と、
前記発光素子を前記開口内に取り付ける、前記開口内のカプセル化材料と、を有し、
前記開口内の1又は複数の表面が反射性である、発光装置。 - 前記カプセル化材料は、前記発光素子から発される光のための所望の光学的特性を供給するために形成される、請求項10記載の発光装置。
- 前記カプセル化材料は、前記発光装置を光透過素子に結合するための平面を形成する、請求項10記載の発光装置。
- 前記少なくとも1つの発光素子が、複数の発光素子を含む、請求項12記載の発光装置。
- 前記構造体の前記下面に隣接する前記発光素子上に、前記発光装置の表面実装を促進するコンタクトを含む、請求項10記載の発光装置。
- フィルムと、
前記フィルム上の複数の発光素子と、
1又は複数の前記発光素子からの光を所望の光出力方向に反射するように、前記フィルム上に配置された複数の反射性構造と、
前記反射性構造を通じて延在する開口内に、対応する1又は複数の前記発光素子を取り付ける、前記反射性構造内のカプセル化材料と、を有する、構造体。 - 前記カプセル化材料の光出口表面が、平面である、請求項15記載の構造体。
- 前記カプセル化材料の光出口表面が、非平面である、請求項15記載の構造体。
- 複数の波長変換素子を含む、請求項15記載の構造体。
- 前記複数の発光素子が、前記フィルムの表面上にあるコンタクトを含む、請求項15記載の構造体。
- 前記複数の反射性構造が、前記フィルムの表面上に配置された表面層を含み、前記表面層は、前記表面層の除去を促進する材料を有する、請求項15記載の構造体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US201161433306P | 2011-01-17 | 2011-01-17 | |
US61/433,306 | 2011-01-17 | ||
PCT/IB2011/056005 WO2012101488A1 (en) | 2011-01-17 | 2011-12-29 | Led package comprising encapsulation |
Publications (3)
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JP2014503122A true JP2014503122A (ja) | 2014-02-06 |
JP2014503122A5 JP2014503122A5 (ja) | 2016-03-10 |
JP5932835B2 JP5932835B2 (ja) | 2016-06-08 |
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JP2013548898A Active JP5932835B2 (ja) | 2011-01-17 | 2011-12-29 | 低コストなカプセル化された発光装置 |
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Country | Link |
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US (1) | US8907364B2 (ja) |
EP (1) | EP2666193B1 (ja) |
JP (1) | JP5932835B2 (ja) |
KR (1) | KR101897308B1 (ja) |
CN (1) | CN103443943B (ja) |
TW (1) | TWI606615B (ja) |
WO (1) | WO2012101488A1 (ja) |
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USD780704S1 (en) * | 2014-08-27 | 2017-03-07 | Mitsubishi Electric Corporation | Light source module |
USD768584S1 (en) * | 2014-11-13 | 2016-10-11 | Mitsubishi Electric Corporation | Light source module |
CN105047793B (zh) * | 2015-08-20 | 2018-07-06 | 厦门市三安光电科技有限公司 | 发光二极管封装结构的制作方法 |
DE102016112293A1 (de) * | 2016-07-05 | 2018-01-11 | Osram Opto Semiconductors Gmbh | Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement |
CN107845717A (zh) * | 2016-09-21 | 2018-03-27 | 深圳市兆驰节能照明股份有限公司 | Csp光源及其制造方法和制造模具 |
TWI635470B (zh) * | 2017-07-04 | 2018-09-11 | 錼創科技股份有限公司 | 發光模組及顯示裝置 |
DE102018112332A1 (de) * | 2018-05-23 | 2019-11-28 | Osram Opto Semiconductors Gmbh | Bauteil und verfahren zur herstellung eines bauteils |
CN115084108A (zh) * | 2022-07-04 | 2022-09-20 | 纳欣科技有限公司 | 发光模组及其制作方法、以及显示面板和电子设备 |
CN115528161A (zh) * | 2022-10-26 | 2022-12-27 | 上海天马微电子有限公司 | 显示面板的制作方法、显示面板及显示装置 |
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- 2011-12-29 EP EP11815634.8A patent/EP2666193B1/en active Active
- 2011-12-29 JP JP2013548898A patent/JP5932835B2/ja active Active
- 2011-12-29 CN CN201180065259.9A patent/CN103443943B/zh active Active
- 2011-12-29 US US13/993,733 patent/US8907364B2/en active Active
- 2011-12-29 WO PCT/IB2011/056005 patent/WO2012101488A1/en active Application Filing
- 2011-12-29 KR KR1020137021666A patent/KR101897308B1/ko active IP Right Grant
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US8907364B2 (en) | 2014-12-09 |
CN103443943A (zh) | 2013-12-11 |
JP5932835B2 (ja) | 2016-06-08 |
WO2012101488A1 (en) | 2012-08-02 |
EP2666193A1 (en) | 2013-11-27 |
TW201238092A (en) | 2012-09-16 |
KR20140004726A (ko) | 2014-01-13 |
EP2666193B1 (en) | 2020-07-29 |
US20130285082A1 (en) | 2013-10-31 |
KR101897308B1 (ko) | 2018-09-10 |
CN103443943B (zh) | 2017-07-21 |
WO2012101488A9 (en) | 2013-09-06 |
TWI606615B (zh) | 2017-11-21 |
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