JP2014235433A - 基板脱着装置及び同装置を用いたフラットパネルディスプレイの製造方法 - Google Patents
基板脱着装置及び同装置を用いたフラットパネルディスプレイの製造方法 Download PDFInfo
- Publication number
- JP2014235433A JP2014235433A JP2014112086A JP2014112086A JP2014235433A JP 2014235433 A JP2014235433 A JP 2014235433A JP 2014112086 A JP2014112086 A JP 2014112086A JP 2014112086 A JP2014112086 A JP 2014112086A JP 2014235433 A JP2014235433 A JP 2014235433A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- mother
- auxiliary
- stage
- panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Crystallography & Structural Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Liquid Crystal (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
【解決手段】本発明の実施形態によれば、補助基板を用いて薄型パネル基板の製造工程を容易に行い、工程が完了した基板に対して、初期ギャップ形成ユニットと、羽根型Oリング(Wing type O-ring)及び複数の真空吸着ラインが形成されたステージを有する全面吸着方式脱着ユニットとから構成される基板脱着装置を用いて、パネル基板から補助基板を容易に分離することができる。
【選択図】図2
Description
101 ルーム
102 支持台
110 ビジョンアラインモジュール
120 基板位置合わせモジュール
140 プッシュピンモジュール
150 ギャップナイフモジュール
160 吸着ステージ
170 リフトピンモジュール
Claims (15)
- 補助基板とパネル基板が貼り合わせられた母基板が載置され、前記母基板に初期ギャップを形成する、初期ギャップ形成ユニットと、
前記初期ギャップが形成された前記母基板がステージ上に載置され、前記ステージ上に形成された長方形の羽根型Oリングを用いて前記補助基板を真空吸着することにより前記パネル基板から分離する、全面吸着方式脱着ユニットと、
を含む、基板脱着装置。 - 前記初期ギャップ形成ユニットは、
移送される前記母基板を載置する、吸着ステージと、
プッシュピンを制御して前記母基板の角部カットを加圧する、プッシュピンモジュールと、
前記母基板に形成された前記角部カットを撮影して前記プッシュピンを前記角部カットに対応させて配置する、ビジョンアラインモジュールと、
前記プッシュピンにより加圧された前記角部カットの基板接触部にギャップナイフを差し込んで初期ギャップを形成する、ギャップナイフモジュールと、
を含むことを特徴とする、請求項1に記載の基板脱着装置。 - 前記プッシュピンモジュールは、
前記プッシュピンにより前記母基板に印加される圧力を測定するロードセルをさらに含むことを特徴とする、請求項2に記載の基板脱着装置。 - 前記初期ギャップ形成ユニットは、
前記吸着ステージの下部に結合されて前記母基板を支持する複数のリフトピンを備える、リフトピンモジュールをさらに含むことを特徴とする、請求項2に記載の基板脱着装置。 - 前記吸着ステージは、
前記複数のリフトピンが進入する複数のリフトピンホールと、
前記吸着ステージの側面に少なくとも1つ形成され、前記プッシュピンが進入する、プッシュピンホールと、
マトリクス状に形成され、前記母基板の全領域を区画して前記母基板を1次吸着する、メイン真空吸着ラインと、
前記メイン真空吸着ラインにより区画された領域のうち、前記母基板の前記角部カットと隣接する一領域内にマトリクス状に形成され、前記母基板を2次吸着するサブ真空吸着ラインと、
を含むことを特徴とする、請求項4に記載の基板脱着装置。 - 前記全面吸着方式脱着ユニットは、
前記母基板が載置され、前記羽根型Oリングが挿入されるグルーブライン、及び前記グルーブラインの内側に位置するマトリクス状の複数の真空吸着ラインが形成される、下部ステージと、
前記下部ステージの上部に配置され、前記羽根型Oリングが挿入されるグルーブライン、及び前記グルーブラインの内側に位置するマトリクス状の複数の真空吸着ラインが形成される、上部ステージと、
前記下部ステージと前記上部ステージの間にギャップを形成する、脱着ギャップ形成モジュールと、
前記母基板に発生する静電気を除去する、ボーイング防止モジュールと、
を含むことを特徴とする請求項1に記載の基板脱着装置。 - 前記上部ステージは、
前記下部ステージ方向に前記母基板の脱着が行われた否かを感知する、脱着感知センサがさらに含まれることを特徴とする、請求項6に記載の基板脱着装置。 - 前記下部ステージは、
前記下部ステージの背面に、前記基板に熱を加えるヒーティング手段をさらに備えることを特徴とする、請求項6に記載の基板脱着装置。 - 前記羽根型Oリングは、
少なくとも2回折り曲げられた逆コ字状の断面を有するように形成され、一辺が母基板方向に折り曲げられた形態であることを特徴とする、請求項6に記載の基板脱着装置。 - 前記グルーブラインは、
折り曲げられた部分が挿入される段差が形成されることを特徴とする、請求項9に記載の基板脱着装置。 - 前記羽根型Oリングは、
表面がパリレンコーティング剤によりコーティングされていることを特徴とする、請求項6に記載の基板脱着装置。 - 第1補助基板及び第2補助基板とパネル基板を準備する段階と、
前記パネル基板に前記第1補助基板及び前記第2補助基板を付着して母基板を準備する段階と、
前記母基板に表示パネル製造工程を行う段階と、
前記母基板を初期ギャップ形成ユニットに移送して前記第1補助基板と前記パネル基板の間に初期ギャップを形成する段階と、
前記母基板を全面吸着方式脱着ユニットに移送して前記第1補助基板を分離する段階と、
前記母基板を前記初期ギャップ形成ユニットに移送して前記第2補助基板と前記パネル基板との間に初期ギャップを形成する段階と、
前記母基板を前記全面吸着方式脱着ユニットに移送して前記第2補助基板を分離する段階と、
を含む、フラットパネルディスプレイの製造方法。 - 前記母基板に表示パネル製造工程を行う段階は、
アレイ基板及びカラーフィルタ基板の2枚の基板で構成される前記パネル基板のうち、前記アレイ基板にアレイ形成工程を行う段階と、
前記カラーフィルタ基板にカラーフィルタ形成工程を行う段階と、
液晶層を介して前記アレイ基板及び前記カラーフィルタ基板を貼り合わせる段階と、
からなることを特徴とする、請求項12に記載のフラットパネルディスプレイの製造方法。 - 前記第1補助基板又は前記第2補助基板と前記パネル基板の間に初期ギャップを形成する段階は、
吸着ステージ上に前記母基板を載置する段階と、
前記母基板に形成された角部カットを撮影してプッシュピンを前記角部カットに対応させて配置する段階と、
前記プッシュピンを制御して前記母基板の角部カットを加圧する段階と、
前記プッシュピンにより加圧された角部カットの基板接触部にギャップナイフを差し込んで初期ギャップを形成する段階と、
を含むことを特徴とする、請求項12に記載のフラットパネルディスプレイの製造方法。 - 前記母基板を全面吸着方式脱着ユニットに移送して前記第1補助基板又は前記第2補助基板を分離する段階は、
下部ステージ上に前記母基板を載置し、下部ステージ上に形成された羽根型Oリングに母基板を接触させる段階と、
上部ステージを下降させ、上部ステージ上に形成された羽根型Oリングに母基板を接触させる段階と、
前記下部ステージ及び前記上部ステージに形成されたマトリクス状の複数の真空吸着ラインが真空状態となるように制御して前記第1補助基板又は前記第2補助基板を分離する段階と、
前記母基板に発生する静電気を除去する段階と、
を含むことを特徴とする、請求項12に記載のフラットパネルディスプレイの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130062906A KR102028913B1 (ko) | 2013-05-31 | 2013-05-31 | 기판 탈착 장치 및 이를 이용한 평판표시장치의 제조방법 |
KR10-2013-0062906 | 2013-05-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014235433A true JP2014235433A (ja) | 2014-12-15 |
JP6038077B2 JP6038077B2 (ja) | 2016-12-07 |
Family
ID=52099345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014112086A Active JP6038077B2 (ja) | 2013-05-31 | 2014-05-30 | 基板脱着装置及び同装置を用いたフラットパネルディスプレイの製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6038077B2 (ja) |
KR (1) | KR102028913B1 (ja) |
CN (1) | CN104217980B (ja) |
TW (1) | TWI520895B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102023453B1 (ko) * | 2018-03-28 | 2019-09-20 | 주식회사 카이테크 | 기판 분할 장치 및 기판 분할 방법 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102336572B1 (ko) * | 2015-01-23 | 2021-12-08 | 삼성디스플레이 주식회사 | 기판 탈착 장치 및 이를 이용한 표시장치의 제조 방법 |
CN105699878B (zh) * | 2016-03-01 | 2018-05-18 | 京东方科技集团股份有限公司 | 用于显示基板测试的辅助设备及显示基板的测试方法 |
CN108074796A (zh) * | 2016-11-16 | 2018-05-25 | 中芯国际集成电路制造(上海)有限公司 | 晶圆表面除污的方法、冲洗和湿法清洗工艺及机台 |
KR102418434B1 (ko) * | 2017-09-29 | 2022-07-08 | 엘지전자 주식회사 | 곡면 디스플레이 합착장치 |
KR20210079431A (ko) * | 2019-12-19 | 2021-06-30 | 삼성디스플레이 주식회사 | 표시 모듈 및 표시 장치 제조 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004170975A (ja) * | 2002-11-15 | 2004-06-17 | Lg Phillips Lcd Co Ltd | 液晶表示素子製造装置及びこれを利用した製造方法 |
JP2010177034A (ja) * | 2009-01-29 | 2010-08-12 | Sony Corp | 表示装置の製造方法および製造装置 |
WO2010090147A1 (ja) * | 2009-02-06 | 2010-08-12 | 旭硝子株式会社 | 電子デバイスの製造方法およびこれに用いる剥離装置 |
JP2013025317A (ja) * | 2011-07-21 | 2013-02-04 | Lg Display Co Ltd | 薄型ガラス基板を用いた工程基板及びその製造方法、並びにそれを用いた液晶表示装置の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100924083B1 (ko) * | 2008-03-05 | 2009-11-02 | 세메스 주식회사 | 스크라이빙 장치 및 이를 이용한 기판 절단 장치 및 방법 |
JP5062057B2 (ja) * | 2008-06-25 | 2012-10-31 | 東京エレクトロン株式会社 | 真空処理装置 |
KR20130002124A (ko) * | 2011-06-28 | 2013-01-07 | 삼성전기주식회사 | 기판 분리 장치 및 기판 분리 방법 |
JP2013052998A (ja) * | 2011-09-06 | 2013-03-21 | Asahi Glass Co Ltd | 剥離装置、及び電子デバイスの製造方法 |
-
2013
- 2013-05-31 KR KR1020130062906A patent/KR102028913B1/ko active IP Right Grant
-
2014
- 2014-05-30 TW TW103119150A patent/TWI520895B/zh active
- 2014-05-30 JP JP2014112086A patent/JP6038077B2/ja active Active
- 2014-06-03 CN CN201410242643.7A patent/CN104217980B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004170975A (ja) * | 2002-11-15 | 2004-06-17 | Lg Phillips Lcd Co Ltd | 液晶表示素子製造装置及びこれを利用した製造方法 |
JP2010177034A (ja) * | 2009-01-29 | 2010-08-12 | Sony Corp | 表示装置の製造方法および製造装置 |
WO2010090147A1 (ja) * | 2009-02-06 | 2010-08-12 | 旭硝子株式会社 | 電子デバイスの製造方法およびこれに用いる剥離装置 |
JP2013025317A (ja) * | 2011-07-21 | 2013-02-04 | Lg Display Co Ltd | 薄型ガラス基板を用いた工程基板及びその製造方法、並びにそれを用いた液晶表示装置の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102023453B1 (ko) * | 2018-03-28 | 2019-09-20 | 주식회사 카이테크 | 기판 분할 장치 및 기판 분할 방법 |
Also Published As
Publication number | Publication date |
---|---|
KR20140141298A (ko) | 2014-12-10 |
CN104217980B (zh) | 2017-05-03 |
CN104217980A (zh) | 2014-12-17 |
TW201500270A (zh) | 2015-01-01 |
TWI520895B (zh) | 2016-02-11 |
KR102028913B1 (ko) | 2019-11-08 |
JP6038077B2 (ja) | 2016-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6038077B2 (ja) | 基板脱着装置及び同装置を用いたフラットパネルディスプレイの製造方法 | |
JP4563351B2 (ja) | 液晶表示パネルの切断方法及びこれを用いた液晶表示パネルの製造方法 | |
KR20100009208A (ko) | 박리 및 안착 통합 장치와, 이를 이용한 액정표시장치의제조방법 | |
KR102082271B1 (ko) | 캐리어기판 분리 시스템 및 분리 방법 | |
US20140134913A1 (en) | Method of fabricating flexible display device | |
KR101980764B1 (ko) | 아치 형태의 드럼 패드를 구비한 탈착기 및 이를 이용한 경량 박형의 액정표시장치 제조방법 | |
JP2003270609A (ja) | 貼合せ基板製造装置及び貼合せ基板製造方法 | |
JP2007183540A (ja) | 液晶表示パネルの切断方法及びこれを用いた液晶表示パネルの製造方法 | |
KR20160073666A (ko) | 보조 기판의 박리 방법 | |
JP4338717B2 (ja) | 液晶表示パネルの移送装置、液晶表示パネルの切断方法及びこれを用いた液晶表示パネルの製造方法 | |
JP2005128536A (ja) | 液晶表示装置及びその製造方法及び液晶表示装置製造用貼り合わせ装置 | |
KR102033349B1 (ko) | 커버기판 제조방법, 캐리어기판 분리장치 및 디스플레이패널 제조방법 | |
KR100846323B1 (ko) | 편광판 부착장치 | |
KR101404057B1 (ko) | 기판 합착 장치용 라미네이팅 장치 및 방법, 및 이를 구비한 기판 합착 장치 및 방법 | |
KR20070071010A (ko) | 액정표시장치용 기판 합착장치 | |
US9229258B2 (en) | Liquid crystal mother panel and manufacturing method | |
CN108076594B (zh) | Pcb板支撑交握装置及pcb板交握方法 | |
KR20090073756A (ko) | 리지드 기판과 플라스틱 필름 부착을 위한 장치 및 이를이용한 부착방법 | |
JP4087163B2 (ja) | 液晶表示装置の製造方法 | |
KR100710154B1 (ko) | 액정 표시 장치의 제조 방법 | |
KR102111384B1 (ko) | 터치패널 제조방법, 디스플레이패널 제조방법, 및 디스플레이패널 | |
KR101308749B1 (ko) | 액정표시장치의 제조방법 | |
JP2003270649A (ja) | 電気光学装置の製造方法及び製造装置 | |
JP6134297B2 (ja) | 基板分離装置 | |
KR101837202B1 (ko) | 평판표시소자의 박형 유리기판을 이용한 공정기판 형성방법 및 이를 이용한 액정표시소자 제작방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150602 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150902 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160303 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20160603 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160707 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20161004 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20161101 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6038077 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |