JP2014110263A - Conductive film and electronic component package - Google Patents

Conductive film and electronic component package Download PDF

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JP2014110263A
JP2014110263A JP2012262678A JP2012262678A JP2014110263A JP 2014110263 A JP2014110263 A JP 2014110263A JP 2012262678 A JP2012262678 A JP 2012262678A JP 2012262678 A JP2012262678 A JP 2012262678A JP 2014110263 A JP2014110263 A JP 2014110263A
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resin
resin layer
film
conductive
conductive particles
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JP6025532B2 (en
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Akihiro Oda
晃祐 織田
Takashi Shojiguchi
隆 障子口
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Mitsui Mining and Smelting Co Ltd
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Mitsui Mining and Smelting Co Ltd
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Priority to PCT/JP2013/067864 priority patent/WO2014083875A1/en
Priority to TW102127586A priority patent/TW201422141A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PROBLEM TO BE SOLVED: To provide a novel conductive film, not only excellent in conductivity but also capable of enhancing adhesion concerning a conductive film (including an electromagnetic wave shield film).SOLUTION: A conductive film for press bonding includes a resin layer A containing rod-like conductive particles in a B-stage resin layer, and exhibits an anchor effect when tip parts of the rod-like parts of the rod-like conductive particles in the resin layer A are stuck into a mold resin in a process where the conductive film is heated, softened, and pressed, and further heated and the softened resin is cured.

Description

本発明は、導電性を有する導電性フィルム、並びに、これを用いた電子部品パッケージ及びその製造方法に関する。   The present invention relates to a conductive film having conductivity, an electronic component package using the same, and a method for manufacturing the same.

半導体チップとプリント配線基板とを実装する方法として、半導体チップの電極（パッド）と基板配線電極との間に導電性フィルムを挟み込んで熱圧着し、半導体チップとプリント配線基板の電極同士を、導電性フィルム中の導電性粒子によって導通するという、フリップチップ実装技術が知られている。   As a method of mounting a semiconductor chip and a printed wiring board, a conductive film is sandwiched between the electrodes (pads) of the semiconductor chip and the board wiring electrodes, and thermocompression bonding is performed. A flip chip mounting technique is known in which electrical conduction is made by conductive particles in a conductive film.

また、導電性フィルムとしての電磁波シールドフィルムをプリント配線板に貼着したり、プリント基板上に実装された送信系回路と受信系回路との間に電磁シールドフィルムを実装して、両者のカップリングを防止したりすることも行われている。   In addition, an electromagnetic shielding film as a conductive film is attached to a printed wiring board, or an electromagnetic shielding film is mounted between a transmission system circuit and a reception system circuit mounted on a printed circuit board to couple the two. It is also done to prevent.

この種の導電性フィルムとしては、例えば特許文献１（特開２００３−２９８２８５号公報）には、電磁波シールド性接着フィルムとして、カバーフィルムの片面に、導電性接着剤層及び必要に応じて金属薄膜層からなるシールド層を有し、他方の面に接着剤層と離型性補強フィルムとが順次積層されてなる補強シールドフィルムが開示されている。   As this type of conductive film, for example, in Patent Document 1 (Japanese Patent Laid-Open No. 2003-298285), as an electromagnetic wave shielding adhesive film, a conductive adhesive layer and, if necessary, a metal thin film on one side of a cover film There is disclosed a reinforced shield film having a shield layer composed of layers, in which an adhesive layer and a releasable reinforcing film are sequentially laminated on the other surface.

特許文献２（特開２００４−２７３５７７号公報）には、シールド層と芳香族ポリアミド樹脂からなるベースフィルムとを有するシールドフィルムが開示されていると共に、これを用いて共振回路を形成する方法として、フレキシブルプリント配線板のカバーレイにスルーホールを数カ所開けておき、グランド回路（アース回路）が露出するように加工しておき、次いで、シールドフィルムの導電性接着剤層とカバーレイを熱プレスで貼り合せた後、グランド回路と導電性接着剤層との接合部を形成して回路のグランドと銀蒸着層との間で共振回路を形成する方法が開示されている。   Patent Document 2 (Japanese Patent Application Laid-Open No. 2004-273577) discloses a shield film having a shield layer and a base film made of an aromatic polyamide resin, and a method for forming a resonance circuit using the shield film, Several through holes are opened in the cover lay of the flexible printed wiring board and processed so that the ground circuit (earth circuit) is exposed, and then the conductive adhesive layer of the shield film and the cover lay are attached by hot press. A method of forming a resonance circuit between the ground of the circuit and the silver deposition layer by forming a joint portion between the ground circuit and the conductive adhesive layer after being combined is disclosed.

特許文献３（特開２００７−１８９０９１号公報）には、離型フィルムと、導電性粒子及びバインダを含む等方導電性接着剤層とを備えた等方導電性接着シートが開示されており、その使用方法として、離型フィルム付きの接着シートを回路基板に仮止めした後、離型フィルムを剥がし、補強板を導電性接着剤層表面に重ね合わせ、プレス加工（１３０〜１９０℃、１〜４ＭＰａ）で熱圧着し、補強板と電極とを低融点金属粉を介して電気的に接続させる方法が開示されている。   Patent Document 3 (Japanese Patent Application Laid-Open No. 2007-189091) discloses an isotropic conductive adhesive sheet including a release film and an isotropic conductive adhesive layer containing conductive particles and a binder. As the usage method, after temporarily fixing the adhesive sheet with the release film to the circuit board, the release film is peeled off, the reinforcing plate is superimposed on the surface of the conductive adhesive layer, and press working (130 to 190 ° C., 1 to 4 MPa), and a method of electrically connecting the reinforcing plate and the electrode via the low melting point metal powder is disclosed.

特許文献４（特開２００９−１９１０９９号公報）には、多数の導電性粒子と、これら導電性粒子を分散したバインダとを有するフィルム状に形成された導電性接着剤層と、タック性を備えたタック性樹脂層と、を有する導電性接着シートが開示されている。   Patent Document 4 (Japanese Patent Application Laid-Open No. 2009-191099) includes a conductive adhesive layer formed in a film shape having a large number of conductive particles and a binder in which these conductive particles are dispersed, and has tackiness. A conductive adhesive sheet having a tacky resin layer is disclosed.

特許文献５（特開２００９−２８９８４０号公報）には、剥離性フィルムと、フィルム状硬化性絶縁性ポリウレタンポリウレア樹脂組成物（II）からなる絶縁性層と、硬化性導電性ポリウレタンポリウレア接着剤（Ｉ）からなる導電性接着剤層と、剥離性フィルムとが順次積層されてなる電磁波シールド性接着性フィルムが開示されている。   Patent Document 5 (Japanese Unexamined Patent Application Publication No. 2009-289840) discloses a peelable film, an insulating layer made of a film-like curable insulating polyurethane polyurea resin composition (II), and a curable conductive polyurethane polyurea adhesive ( An electromagnetic wave shielding adhesive film in which a conductive adhesive layer made of I) and a peelable film are sequentially laminated is disclosed.

特許文献６（特開２０１０−１６８５１８号公報）には、シート状に形成された熱可塑性エラストマ樹脂やアクリル系樹脂などからなる粘着性物質と、当該粘着性物質に分散されたＡｇコートＣｕ粉やＡｇコートＮｉ粉などの導電性粒子とを有する組成物で構成される導電性接着剤層を有しており、前記導電性粒子の平均粒子径に対して前記粘着性物質の厚みの平均値が０．８倍〜１．４倍の範囲にあり、前記導電性粒子の含有量が前記導電性接着剤層全体の１５〜２５重量％の範囲にある導電性粘着シートが開示されている。   Patent Document 6 (Japanese Unexamined Patent Application Publication No. 2010-168518) discloses an adhesive substance made of a thermoplastic elastomer resin, an acrylic resin, or the like formed in a sheet shape, Ag coated Cu powder dispersed in the adhesive substance, It has a conductive adhesive layer composed of a composition having conductive particles such as Ag-coated Ni powder, and the average value of the thickness of the adhesive substance with respect to the average particle diameter of the conductive particles is There is disclosed a conductive pressure-sensitive adhesive sheet that is in a range of 0.8 to 1.4 times and in which the content of the conductive particles is in a range of 15 to 25% by weight of the entire conductive adhesive layer.

特許文献７（特開２０１１−６６３２９号公報）には、外部グランド部材に接続するための金属層と導電性粒子を含む導電性接着層とを接触状態に備えた導電部材に、加熱および加圧により接続されるシールドフィルムであって、前記加熱によって軟化される樹脂により形成され、前記加熱および加圧により接続された後において、前記導電性接着層から突出した前記導電性粒子の平均突出長よりも薄い層厚みで形成されるとともに、前記導電性接着層に接着されるカバーフィルムと、前記カバーフィルムに順に積層された金属薄膜層および接着層と、を有することを特徴とするシールドフィルムが開示されていると共に、これを用いたグランド接続方法として、外部グランド部材に接続された金属層と導電性粒子を含む導電性接着層とを接触状態に備えた導電部材を、前記樹脂が軟化する温度で加熱しながら加圧して当該導電性接着層と前記カバーフィルムとを接着することにより、前記カバーフィルムの層厚みよりも長く突出した前記導電性粒子が前記金属薄膜層にまで達することでグランド接続することを特徴とするシールドフィルムのグランド接続方法が開示されている。   In Patent Document 7 (Japanese Patent Laid-Open No. 2011-66329), a conductive member provided in contact with a metal layer for connection to an external ground member and a conductive adhesive layer containing conductive particles is heated and pressurized. A shield film connected by the above, formed from the resin softened by the heating, and after being connected by the heating and pressurization, the average protruding length of the conductive particles protruding from the conductive adhesive layer A shield film comprising: a cover film formed with a thin layer thickness; and a cover film adhered to the conductive adhesive layer; and a metal thin film layer and an adhesive layer sequentially laminated on the cover film. As a ground connection method using this, a metal layer connected to an external ground member and a conductive adhesive layer containing conductive particles are connected. The conductive member provided in a state is pressurized while being heated at a temperature at which the resin is softened to bond the conductive adhesive layer and the cover film, thereby projecting the conductive material longer than the layer thickness of the cover film. A ground connection method for a shield film is disclosed, in which the conductive particles reach the metal thin film layer to be grounded.

特許文献８（特開２０１１−１６６１００号公報）には、硬化性絶縁層、導電性被膜、及び硬化性導電性接着剤層をこの順序で具備する、電磁波シールド性接着性フィルムであって、前記導電性被膜が、導電性粒子が保護物質によって被覆されてなる平均粒子径が０．００１〜０．５μｍの被覆導電性粒子を含む分散体から形成された被膜であり、前記硬化性導電性接着剤層が、硬化性絶縁性樹脂と、平均粒子径が１〜５０μｍの金属粉とを含有する、ことを特徴とする電磁波シールド性接着性フィルムが開示されている。硬化性導電性接着剤層をプリント配線基板などの被着体に重ね合わせ、加熱することにより、硬化性導電性接着剤層及び硬化性絶縁層を硬化させ、これらの硬化によって接着が確保され、被着体を電磁波から遮蔽することが可能となる。   Patent Document 8 (Japanese Patent Laid-Open No. 2011-166100) discloses an electromagnetic wave shielding adhesive film comprising a curable insulating layer, a conductive film, and a curable conductive adhesive layer in this order, The conductive coating is a coating formed from a dispersion containing coated conductive particles having an average particle diameter of 0.001 to 0.5 μm formed by coating conductive particles with a protective substance, and the curable conductive adhesive An electromagnetic wave shielding adhesive film is disclosed, wherein the agent layer contains a curable insulating resin and a metal powder having an average particle diameter of 1 to 50 μm. The curable conductive adhesive layer is superimposed on an adherend such as a printed wiring board and heated to cure the curable conductive adhesive layer and the curable insulating layer. It becomes possible to shield the adherend from electromagnetic waves.

特許文献９（特開２０１１−１８７８９５号公報）には、（Ａ）金属粉と（Ｂ）バインダ樹脂とからなる導電層に、保護層が積層されてなる電磁波シールドフィルムにおいて、導電層が（ａ）平均厚さ５０〜３００ｎｍ、平均粒径３〜１０μｍの薄片状金属粉と、（ｂ）平均粒径３〜１０μｍの針状又は樹枝状金属粉（特に銀被覆銅粉）とを含有する導電性ペーストから形成されてなるものが開示されている。   In Patent Document 9 (Japanese Patent Application Laid-Open No. 2011-187895), in an electromagnetic wave shielding film in which a protective layer is laminated on a conductive layer made of (A) metal powder and (B) a binder resin, the conductive layer is (a ) Conductivity containing flaky metal powder having an average thickness of 50 to 300 nm and an average particle diameter of 3 to 10 μm, and (b) acicular or dendritic metal powder (particularly silver-coated copper powder) having an average particle diameter of 3 to 10 μm. What is formed from an adhesive paste is disclosed.

特許文献１０（特開２０１１−１７１５２３号公報）には、硬化性を有しない絶縁フィルム、導電性被膜、及び硬化性導電性接着剤層をこの順序で具備する、電磁波シールド性接着性フィルムであって、前記導電性被膜が、導電性粒子が保護物質によって被覆されてなる平均粒子径が０．００１〜０．５μｍの被覆導電性粒子を含む分散体から形成された被膜であり、前記硬化性導電性接着剤層が、硬化性絶縁性樹脂と、平均粒子径が１〜５０μｍの金属粉とを含有することを特徴とする電磁波シールド性接着性フィルムが開示されている。   Patent Document 10 (Japanese Patent Application Laid-Open No. 2011-171523) discloses an electromagnetic wave shielding adhesive film comprising an insulating film having no curability, a conductive coating, and a curable conductive adhesive layer in this order. The conductive film is a film formed from a dispersion containing coated conductive particles having an average particle diameter of 0.001 to 0.5 μm, in which conductive particles are coated with a protective substance, and the curability is An electromagnetic wave shielding adhesive film is disclosed, wherein the conductive adhesive layer contains a curable insulating resin and a metal powder having an average particle diameter of 1 to 50 μm.

特開２００３−２９８２８５号公報JP 2003-298285 A 特開２００４−２７３５７７号公報JP 2004-273577 A 特開２００７−１８９０９１号公報JP 2007-189091 A 特開２００９−１９１０９９号公報JP 2009-191099 A 特開２００９−２８９８４０号公報JP 2009-289840 A 特開２０１０−１６８５１８号公報JP 2010-168518 A 特開２０１１−６６３２９号公報JP 2011-66329 A 特開２０１１−１６６１００号公報JP 2011-166100 A 特開２０１１−１８７８９５号公報JP 2011-187895 A 特開２０１１−１７１５２３号公報JP 2011-171523 A

上記のような用途に用いる導電性フィルム（電磁波シールドフィルムを含む）に関しては、プリント配線基板などに対するフィルムの接着性が課題の一つであった。該フィルムの接着性を高めるために、従来は、例えばプリント配線基板の被着表面を粗面化する手段などが採られていた。しかし、被着表面の粗面化だけでは、十分な接着性を得ることが難しいばかりか、更に微細化が進むと、被着表面を粗面化すること自体が困難になる可能性もあった。   Regarding the conductive film (including the electromagnetic wave shielding film) used for the above applications, the adhesiveness of the film to a printed wiring board or the like has been one of the problems. In order to improve the adhesiveness of the film, conventionally, for example, means for roughening the surface of the printed wiring board to be adhered has been adopted. However, it is difficult to obtain sufficient adhesiveness only by roughening the adherend surface, and it is possible that it will be difficult to roughen the adherend surface itself as further miniaturization progresses. .

また、電子部品パッケージの製法において、回路基板上に電子部品を実装し、該電子部品をモールド樹脂で封止した後、ハーフカットダイシングして電子部品間のモールド樹脂を除去して溝部を設け、前記モールド樹脂の上から、導電性ペーストを塗布して前記溝部内にも導電性ペーストを充填した後、当該溝部の中心部に沿ってダイシングしてパッケージ毎に分割して電子部品パッケージを作製する方法が行われている。このような電子部品パッケージの製法において、導電性ペーストを塗布する工程を、導電性フィルムを貼着する工程に置き換えることができれば、電子部品パッケージの作製工程をより簡略化することができる。但し、この場合も課題になるのは、やはり導電性フィルムとモールド樹脂との接着性であった。   Further, in the manufacturing method of the electronic component package, after mounting the electronic component on the circuit board and sealing the electronic component with a mold resin, half-cut dicing is performed to remove the mold resin between the electronic components and provide a groove portion. After applying a conductive paste on the mold resin and filling the groove portion with the conductive paste, dicing along the central portion of the groove portion and dividing into packages to produce an electronic component package The way is done. In such an electronic component package manufacturing method, if the process of applying the conductive paste can be replaced with the process of attaching the conductive film, the manufacturing process of the electronic component package can be further simplified. However, in this case as well, the problem is the adhesion between the conductive film and the mold resin.

そこで本発明は、導電性フィルム（電磁波シールドフィルムを含む）に関し、導電性に優れているばかりか、優れたプレス接着性、すなわち加熱及び加圧した際に優れた接着性を発揮することができる、新たな導電性フィルムを提供せんとするものである。   Therefore, the present invention relates to a conductive film (including an electromagnetic wave shielding film) and not only has excellent conductivity but also exhibits excellent press adhesion, that is, excellent adhesion when heated and pressurized. A new conductive film is to be provided.

本発明は、Ｂステージ状態の樹脂層中に、棒有形状を呈する導電性粒子（「棒有状導電性粒子」と称する）を含有する樹脂層Ａを備えた、プレス接着用導電性フィルムを提案する。   The present invention provides a conductive film for press bonding, comprising a resin layer A containing conductive particles having a rod shape (referred to as “bar-shaped conductive particles”) in a resin layer in a B-stage state. suggest.

本発明が提案するプレス接着用導電性フィルムは、例えば、電子部品が実装され、該電子部品がモールド樹脂で封止されてなる構成を備えたプリント配線基板、特にそのモールド樹脂上に、本発明が提案するプレス接着用導電性フィルムの樹脂層Ａ側を重ねて、樹脂層Ａの樹脂、或いは、樹脂層Ａ及びＢの樹脂、或いは、樹脂層Ａ及びＣの樹脂を加熱して軟化させて、該プレス接着用導電性フィルムを基板側にプレスし、さらに加熱して、前記で軟化させた樹脂を硬化させることで、樹脂層Ａは少なくともモールド樹脂としっかりと接着するため、電子部品パッケージを製造することができる。   The conductive film for press bonding proposed by the present invention includes, for example, a printed wiring board having a configuration in which an electronic component is mounted and the electronic component is sealed with a mold resin, particularly on the mold resin of the present invention. The resin layer A side of the conductive film for press bonding proposed is stacked, and the resin of the resin layer A, the resin of the resin layers A and B, or the resin of the resin layers A and C is softened by heating. By pressing the conductive film for press bonding to the substrate side and further heating to cure the softened resin, the resin layer A is firmly adhered to at least the mold resin. Can be manufactured.

本発明が提案するプレス接着用導電性フィルムは、優れたプレス接着性、すなわち加熱及び加圧した際に優れた接着性を発揮することができる。よって、導電性フィルムを加熱軟化させてプレスし、さらに加熱して、前記で軟化させた樹脂を硬化させる過程で、樹脂層Ａ中の棒有状導電性粒子の棒状部分先端がモールド樹脂に突き刺さってアンカー効果を発揮するため優れた接着性を発揮させることができる。このように、本発明が提案するプレス接着用導電性フィルムは、導電性に優れているばかりか、優れたプレス接着性を発揮させることができる。   The conductive film for press bonding proposed by the present invention can exhibit excellent press adhesiveness, that is, excellent adhesiveness when heated and pressed. Therefore, in the process where the conductive film is heated and softened and pressed, and further heated to cure the softened resin, the tip of the rod-like conductive particles in the resin layer A pierced the mold resin. In order to exert the anchor effect, excellent adhesiveness can be exhibited. Thus, the conductive film for press bonding proposed by the present invention is not only excellent in conductivity but also can exhibit excellent press adhesiveness.

本発明の一例に係る導電性フィルムの使用方法の一例である。It is an example of the usage method of the electroconductive film which concerns on an example of this invention. 本発明の他の一例に係る導電性フィルムの使用方法の一例である。It is an example of the usage method of the electroconductive film which concerns on another example of this invention. 温度と樹脂の溶融粘度との関係を説明する模試的なグラフである。It is a schematic graph explaining the relationship between temperature and resin melt viscosity. 導電性粒子の形状を説明するためのモデル図であり、（Ａ）はデンドライト状、（Ｂ）は針状、（Ｃ）は芋状、（Ｄ）は突起有球状、（Ｅ）は突起有芋状を示している。It is a model figure for demonstrating the shape of electroconductive particle, (A) is dendrite-like, (B) is acicular, (C) is bowl-like, (D) is a projection spherical, (E) is a projection It shows a saddle shape.

以下、本発明の実施形態について詳述する。但し、本発明の範囲が以下の実施形態に限定されるものではない。   Hereinafter, embodiments of the present invention will be described in detail. However, the scope of the present invention is not limited to the following embodiments.

＜本導電性フィルム１＞
本実施形態に係る導電性フィルム（「本導電性フィルム１」と称する）は、Ｂステージ状態の樹脂層中に、棒有状導電性粒子を含有する樹脂層Ａと、離型フィルムと、を備えた構成の導電性フィルムである。
但し、当該離型フィルムは必要に応じて備えていればよい。 <This conductive film 1>
The conductive film according to the present embodiment (referred to as “the present conductive film 1”) includes a resin layer A containing rod-like conductive particles in a B-stage resin layer, and a release film. It is the electroconductive film of the structure provided.
However, the release film may be provided as necessary.

なお、Ｂステージ状態とは、接着性乃至粘着性を有する熱硬化性樹脂の硬化中間状態を意味し、フィルム状乃至シート状を維持することができ、且つ加熱すると樹脂が軟化若しくは溶融し、さらに加熱すると硬化する状態を意味する。   The B stage state means an intermediate state of curing of the thermosetting resin having adhesiveness or tackiness, and can maintain a film shape or a sheet shape, and when heated, the resin softens or melts, It means a state of being cured when heated.

本導電性フィルム１は、前記樹脂層Ａ及び離型フィルム以外の層を一層又は二層以上備えていてもよい。   The conductive film 1 may include one or more layers other than the resin layer A and the release film.

（樹脂層Ａ）
樹脂層Ａを構成する樹脂組成物は、Ｂステージ状態となり得る樹脂組成物であればよい。通常、この種のベース樹脂は熱硬化性樹脂が一般的である。但し、熱硬化性樹脂に熱可塑性樹脂が混合したものであってもよい。 (Resin layer A)
The resin composition which comprises the resin layer A should just be a resin composition which can be in a B stage state. Usually, this type of base resin is generally a thermosetting resin. However, a thermoplastic resin mixed with a thermosetting resin may be used.

樹脂組成物をＢステージ状態とする方法としては、１）溶剤を適宜揮発させる方法、２）硬化反応を途中で強制的に停止させる方法、３）硬化領域の異なる２種類以上の硬化性樹脂を含有させる方法、４）その他公知の方法を採用することができる。   As a method for bringing the resin composition into a B-stage state, 1) a method for volatilizing a solvent as appropriate, 2) a method for forcibly stopping a curing reaction in the middle, and 3) two or more types of curable resins having different curing regions. 4) Other known methods can be employed.

Ｂステージ状態となり得る樹脂組成物を主として構成する樹脂（「ベース樹脂」と称する）としては、特に限定するものではない。例えばエポキシ樹脂、ポリジメチルシロキサン樹脂、アクリル樹脂、その他の有機官能性ポリシロキサン樹脂、ポリイミド樹脂、フッ化炭素樹脂、ベンゾシクロブテン樹脂、フッ素化ポリアリルエーテル、ポリアミド樹脂、ポリイミドアミド樹脂、フェノールクレゾール樹脂、芳香族ポリエステル樹脂、ポリフェニレンエーテル（PPE）樹脂、ビスマレイミドトリアジン樹脂、フッ素樹脂などを挙げることができ、これらのうち一種又は二種以上の混合樹脂であってもよい。
また、硬化性又は架橋性材料として、遊離基重合、原子移動、ラジカル重合、開環重合、開環メタセシス重合、アニオン重合、またはカチオン重合によって架橋可能な、エポキシ樹脂、アクリル樹脂、ポリジメチルシロキサン樹脂、またはその他の有機官能性ポリシロキサン樹脂の一つ以上を配合してもよい。 The resin mainly constituting the resin composition that can be in the B-stage state (referred to as “base resin”) is not particularly limited. For example, epoxy resin, polydimethylsiloxane resin, acrylic resin, other organic functional polysiloxane resin, polyimide resin, fluorocarbon resin, benzocyclobutene resin, fluorinated polyallyl ether, polyamide resin, polyimide amide resin, phenol cresol resin An aromatic polyester resin, a polyphenylene ether (PPE) resin, a bismaleimide triazine resin, a fluororesin, and the like can be used, and one or a mixture of two or more of these may be used.
Also, as curable or crosslinkable materials, epoxy resins, acrylic resins, polydimethylsiloxane resins that can be crosslinked by free radical polymerization, atom transfer, radical polymerization, ring opening polymerization, ring opening metathesis polymerization, anionic polymerization, or cationic polymerization. Or one or more of other organofunctional polysiloxane resins may be blended.

中でも、樹脂層Ａを構成する樹脂組成物は、１００〜１５０℃における最低溶融粘度が１００００Ｐａ・ｓ〜１００００００Ｐａ・ｓの樹脂が好ましく、中でも１０００００Ｐａ・ｓ以上の樹脂組成物であるのがより一層好ましい（例えば図３の上方の実線で示される樹脂組成物）   Among them, the resin composition constituting the resin layer A is preferably a resin having a minimum melt viscosity of 10000 Pa · s to 1000000 Pa · s at 100 to 150 ° C., and more preferably a resin composition of 100,000 Pa · s or more. (For example, the resin composition indicated by the solid line in FIG. 3)

具体的には、樹脂層Ａを構成する樹脂組成物は、エポキシ樹脂、エポキシ硬化剤、有機溶媒、シランカップリング剤、界面活性剤などから形成することができる。但し、これは一例である。
アクリル系樹脂とエポキシ樹脂のポリマーブレンドによっても、Ｂステージ状態とすることができる。
また、例えばエポキシ樹脂を樹脂層Ａのベース樹脂とする場合、溶剤を揮発させることにより、その樹脂組成物をＢステージ状態とすることができる。 Specifically, the resin composition constituting the resin layer A can be formed from an epoxy resin, an epoxy curing agent, an organic solvent, a silane coupling agent, a surfactant, and the like. However, this is an example.
A B-stage state can also be achieved by a polymer blend of an acrylic resin and an epoxy resin.
For example, when an epoxy resin is used as the base resin of the resin layer A, the resin composition can be brought into a B-stage state by volatilizing the solvent.

熱硬化のために添加される材料として、有機過酸化物やイソシアネート化合物、エポキシ化合物やアミン化合物等の熱硬化剤などを挙げることができる。   Examples of the material added for thermosetting include thermosetting agents such as organic peroxides, isocyanate compounds, epoxy compounds, and amine compounds.

（導電性粒子）
樹脂層Ａに含まれる導電性粒子は、銀粉粒子、銅粉粒子、鉄粉粒子などの導電性粒子、或いは、任意材料からなる粒子、例えば前記導電性粒子を芯材としてこれらの表面の一部又は全部を異種導電性材料、例えば金、銀、銅、ニッケル、スズなどで被覆してなる粒子などを挙げることができる。但し、これらに限定する趣旨ではなく、導電性を有する材料であれば任意に採用可能である。 (Conductive particles)
The conductive particles contained in the resin layer A are conductive particles such as silver powder particles, copper powder particles and iron powder particles, or particles made of an arbitrary material, for example, a part of these surfaces using the conductive particles as a core material. Or the particle | grains which coat | cover all with different electroconductive materials, for example, gold | metal | money, silver, copper, nickel, tin, etc. can be mentioned. However, the present invention is not limited to these, and any material having conductivity can be arbitrarily adopted.

アンカー効果を効果的に発揮させる観点から、樹脂層Ａ中の導電性粒子のうち、５０個数％以上を「棒有状導電性粒子」が占めるのが好ましく、中でも７０個数％以上、その中でも８０個数％を超える割合（１００％を含む）を棒有状導電性粒子が占めるのが好ましい。   From the viewpoint of effectively exhibiting the anchor effect, it is preferable that 50% by number or more of the conductive particles in the resin layer A is occupied by “rod-like conductive particles”, particularly 70% by number or more. It is preferable that the rod-like conductive particles occupy a ratio exceeding 100% (including 100%).

ここで、「棒有状導電性粒子」とは、針状部分及び突起状部分を包含する棒状部分を有する形状を呈する導電性粒子の意味であり、例えばデンドライト状導電性粒子（図４（Ａ）参照）、針状導電性粒子（図４（Ｂ）参照）、突起有粒状導電性粒子（図４（Ｄ）（Ｅ）参照）などを挙げることができる。
前記「針状導電性粒子」とは、棒状部分のみからなる粒子であり、「デンドライト状導電性粒子」とは、光学顕微鏡若しくは電子顕微鏡（５００〜２０、０００倍）で観察した際に、棒状部分を主軸とし、該主軸から直交方向又は斜め方向に複数の枝が分岐して、二次元的或いは三次元的に成長した形状を呈する粒子を意味する。幅広の葉が集まって松ぼっくり状を呈するものや、主軸を有さず多数の針状部が放射状に伸長してなる形状のものは、本発明においては「デンドライト状導電性粒子」には含まれない。
また、「突起有粒状導電性粒子」とは、球状、略球状、楕円粒状、略楕円球状、芋状（図４（Ｃ）参照）、角柱状などの粒状粒子の表面に突起部を備えた形状を呈する導電性粒子の意味である。 Here, the “rod-like conductive particles” mean conductive particles having a shape having a rod-like portion including a needle-like portion and a protrusion-like portion. For example, dendritic conductive particles (FIG. 4 (A )), Acicular conductive particles (see FIG. 4B), protruding conductive particles (see FIGS. 4D and 4E), and the like.
The “needle-like conductive particles” are particles composed of only rod-like portions, and the “dendritic conductive particles” are rod-shaped when observed with an optical microscope or an electron microscope (500 to 20,000 times). This means a particle that has a part as a main axis and has a shape that grows two-dimensionally or three-dimensionally by branching a plurality of branches in an orthogonal direction or oblique direction from the main axis. In the present invention, “dendritic conductive particles” include those in which wide leaves gather to form a pinecone shape, or those having a shape in which a large number of needle-like portions do not have a main shaft and extend radially. Absent.
The “protruded granular conductive particles” are provided with protrusions on the surface of granular particles such as spherical, substantially spherical, elliptical granular, substantially elliptical spherical, bowl-shaped (see FIG. 4C), and prismatic. It is the meaning of the electroconductive particle which exhibits a shape.

このような棒有状導電性粒子の中でも、アンカー効果の観点から、針状導電性粒子やデンドライト状導電性粒子などの「針有状導電性粒子」が好ましく、その中でも、電磁波シールド特性を加味すると、デンドライト状導電性粒子が特に好ましい。
前記「針有状導電性粒子」とは、針状部分を有する形状を呈する導電性粒子の意味であり、例えば針状導電性粒子やデンドライト状導電性粒子などを挙げることができる。
他方、アンカー効果と流動性の両方を備えている点から、棒有状導電性粒子の中でも、粒状粒子の表面に尖った突起部を備えた突起有粒状を呈する導電性粒子が特に好ましい。 Among these rod-like conductive particles, “needle-like conductive particles” such as needle-like conductive particles and dendrite-like conductive particles are preferable from the viewpoint of anchor effect, and among them, electromagnetic shielding properties are taken into account. Then, dendritic conductive particles are particularly preferable.
The “needle-like conductive particles” mean conductive particles having a shape having a needle-like portion, and examples thereof include needle-like conductive particles and dendrite-like conductive particles.
On the other hand, from the viewpoint of having both an anchor effect and fluidity, among the rod-like conductive particles, conductive particles exhibiting protrusion-like particles having sharp protrusions on the surface of the granular particles are particularly preferable.

これら「棒有状導電性粒子」は、平均最長径／平均円相当径の比率で示すと、１．２〜２．５の範囲に入るという特徴を有しており、中でも１．２以上或いは２．０以下が好ましく、その中でも１．４以上或いは１．９以下が特に好ましい。
ここで、「平均最長径」とは、走査型電子顕微鏡写真（ＳＥＭ写真、５００倍若しくは２０００倍）の視野中に観察される全粒子の最長径の平均値である。
「平均円相当径」とは、走査型電子顕微鏡写真（ＳＥＭ写真、５００倍若しくは２０００倍）の視野中に観察される全粒子の円相当径、すなわち各粒子の投影面積から円に近似した場合の直径の全粒子の最長径の平均値である。 These “bar-like conductive particles” have a characteristic of being in the range of 1.2 to 2.5 when expressed as a ratio of average longest diameter / average equivalent circle diameter, and more than 1.2 or 2.0 or less is preferable, and 1.4 or more or 1.9 or less is particularly preferable among them.
Here, the “average longest diameter” is the average value of the longest diameters of all particles observed in the field of view of a scanning electron micrograph (SEM photograph, 500 times or 2000 times).
“Average equivalent circle diameter” means the equivalent circle diameter of all the particles observed in the field of view of a scanning electron micrograph (SEM photograph, 500 times or 2000 times), that is, when the projected area of each particle approximates a circle It is an average value of the longest diameters of all particles having a diameter of.

他方、樹脂層Ａに含まれる棒有状導電性粒子以外の導電性粒子の形状は、特に限定するものではない。例えば球状や芋状などの粒状、或いは鱗片状などの形状を挙げることができる。   On the other hand, the shape of the conductive particles other than the rod-like conductive particles contained in the resin layer A is not particularly limited. For example, a spherical shape, a bowl-like shape, or a scale-like shape can be mentioned.

樹脂層Ａに含まれる導電性粒子の粒径が大き過ぎると、塗料中で沈降したり、薄膜化できなかったり、電磁波シールド特性が悪くなったりする可能性がある一方、小さ過ぎると、分散性が低下して塗料が増粘して塗工性が低下する可能性があるため、樹脂層Ａに含まれる導電性粒子の平均円相当径は、０．１μｍ〜３０μｍであるのが好ましく、中でも０．５μｍ〜２０μｍ、その中でも１．０μｍ以上或いは１０μｍ以下であるのがより一層好ましい。   If the particle size of the conductive particles contained in the resin layer A is too large, the particles may settle in the paint, cannot be thinned, or the electromagnetic shielding properties may be deteriorated. The coating layer may be thickened and the coating property may be reduced, so that the average equivalent circle diameter of the conductive particles contained in the resin layer A is preferably 0.1 μm to 30 μm, 0.5 μm to 20 μm, more preferably 1.0 μm or more or 10 μm or less.

樹脂層Ａにおける導電性粒子の含有量は、本導電性フィルム１の用途や、棒有状導電性粒子の割合等によって、必要量が異なるから、適宜調整するのが好ましい。例えば棒有状導電性粒子は、例えば球状導電性粒子に比べて少ない量でも導通を得ることができるため、樹脂層Ａ中の導電性粒子のうち、５０個数％以上を棒有状導電性粒子が占める場合には、樹脂層Ａにおける導電性粒子の含有量は、樹脂層Ａ全体の５０〜９５質量％、中でも６０質量％以上或いは９０質量％以下、その中でも８０質量％以上であるのが好ましい。   The content of the conductive particles in the resin layer A is preferably adjusted as appropriate because the required amount varies depending on the application of the conductive film 1 and the ratio of the rod-like conductive particles. For example, since the rod-like conductive particles can obtain conductivity even in a smaller amount than the spherical conductive particles, for example, 50% by number or more of the conductive particles in the resin layer A are rod-like conductive particles. In the resin layer A, the content of conductive particles in the resin layer A is 50 to 95% by mass, particularly 60% by mass or more and 90% by mass or less, and more preferably 80% by mass or more. preferable.

樹脂層Ａの厚さは、特に制限されるものではない。但し、厚過ぎてもアンカー効果が高まる訳ではなく材料が無駄である一方、薄過ぎると、被着面の凹凸に追従でき難くなるばかりか、樹脂層Ａで安定した導電性を確保するのが難しくなるため、樹脂層Ａの厚さは０．１μｍ〜１００μｍであるのが好ましく、中でも０．５μｍ以上或いは８０μｍ以下、中でも特に１．０μｍ以上或いは５０μｍ以下であるのがより一層好ましい。   The thickness of the resin layer A is not particularly limited. However, even if it is too thick, the anchor effect does not increase and the material is useless. On the other hand, if it is too thin, it becomes difficult to follow the unevenness of the adherend surface, and the resin layer A can ensure stable conductivity. Since it becomes difficult, the thickness of the resin layer A is preferably 0.1 μm to 100 μm, more preferably 0.5 μm or more and 80 μm or less, and particularly preferably 1.0 μm or more or 50 μm or less.

（離型フィルム）
離型フィルムとしては、例えばポリエステル系、ポリプロピレン系、ポリエチレン系或いはポリテトラフルオロエチレン系のキャストフィルムや延伸フィルムに、シリコーン樹脂を塗布して離型処理したものや、離型紙などを挙げることができる。 (Release film)
Examples of the release film include a polyester-type, polypropylene-type, polyethylene-type or polytetrafluoroethylene-type cast film or stretched film obtained by applying a silicone resin to a release treatment, or release paper. .

（作製方法）
Ｂステージ状態とすることができる樹脂組成物に導電性粒子、その他、必要に応じて硬化剤やカップリング剤、腐食抑制剤などと混合し、導電性粒子の形状を壊さずに分散させるように混練し、離型フィルムの上に塗布し、溶剤を揮発させるなどして第１次硬化させてフィルム成形するのが好ましい。
混練に際しては、導電性粒子の粒子形状が崩れないように、機械的な衝撃を導電性粒子に与える攪拌機などの使用は避けて、例えばあわとり練太郎（商標名）やプラネタリーミキサなどを使って、機械的な衝撃を与えることなく混練するのが好ましい。 (Production method)
In order to disperse the conductive particles without breaking the shape of the conductive particles by mixing them with conductive particles and other curing agents, coupling agents, corrosion inhibitors, etc., if necessary. It is preferable to knead, apply on a release film, and first cure by volatilizing the solvent to form a film.
When kneading, avoid using a stirrer that gives mechanical impact to the conductive particles so that the particle shape of the conductive particles does not collapse. For example, use Awatori Netaro (trade name) or a planetary mixer. Thus, it is preferable to knead without giving mechanical impact.

（使用方法）
本導電性フィルム１は、図１（Ａ）に示すように、樹脂層Ａを被着体の被着面に重ねて、プレス熱板等を離型フィルムの表面に当接させるなどして加熱して樹脂層Ａの樹脂を軟化させ、該離型フィルムの表面を前記プレス熱板等で押圧し、言い換えれば離型フィルムの表面を被プレス面として被着体方向にプレス（押圧）し、さらに加熱して前記で軟化させた樹脂を硬化させることにより、本導電性フィルム１を被着体に接合することができる。
このように本導電性フィルム１を熱プレスすることで、図１（Ｂ）に示すように、樹脂層Ａ中の棒有状導電性粒子の棒状部分先端が被着面に突き刺さってアンカー効果を発揮するため、剥離しないばかりか、横方向にずれることなく、強固に接着させることができる。 (how to use)
As shown in FIG. 1A, the conductive film 1 is heated by overlapping the resin layer A on the adherend surface of the adherend and bringing a press hot plate or the like into contact with the surface of the release film. Then, the resin of the resin layer A is softened, and the surface of the release film is pressed with the press hot plate or the like, in other words, the surface of the release film is pressed (pressed) in the direction of the adherend as a pressed surface, Further, the conductive film 1 can be bonded to the adherend by curing the resin softened by heating.
By hot pressing the conductive film 1 in this way, as shown in FIG. 1 (B), the rod-like portion tip of the rod-like conductive particles in the resin layer A pierces the adherend surface and has an anchor effect. Since it exhibits, it can be firmly bonded without being peeled off and not shifted laterally.

例えば電子部品が実装され、該電子部品がモールド樹脂で封止され、さらにハーフダイシングにより切込み溝が設けられてなる構成を備えたプリント配線基板において、本導電性フィルム１の樹脂層Ａ側を該モールド樹脂に重ねて、例えば熱板などを当接させるなどして加熱して樹脂層Ａの樹脂を軟化させた後、離型フィルムの表面を被プレス面として該プレス接着用導電性フィルムを基板側にプレスし、次いでさらに加熱して、前記で軟化させた樹脂を硬化させることで、樹脂層Ａの樹脂はモールド樹脂部分を被覆すると共に、前記の切込み溝内に侵入して充填するため、電子部品パッケージを製造することができる。   For example, in a printed wiring board having a configuration in which an electronic component is mounted, the electronic component is sealed with a mold resin, and a cut groove is provided by half dicing, the resin layer A side of the conductive film 1 is After superposing the mold resin, for example, by heating a heat plate or the like to heat the resin layer A, the resin of the resin layer A is softened. By pressing to the side and then further heating to cure the softened resin, the resin of the resin layer A covers the mold resin portion and enters and fills the cut groove, Electronic component packages can be manufactured.

＜本導電性フィルム２＞
本発明の第２の実施形態に係る導電性フィルム（「本導電性フィルム２」と称する）は、上記樹脂層Ａ、すなわちＢステージ状態の樹脂中に棒有状導電性粒子を含有する樹脂層Ａと、Ｂステージ状態の樹脂を含有し、且つ導電性粒子を含有しない樹脂層Ｂと、離型フィルムと、を備えた構成の導電性フィルムである。
但し、離型フィルムは必要に応じて備えていればよい。 <This conductive film 2>
The conductive film (referred to as “the present conductive film 2”) according to the second embodiment of the present invention is a resin layer containing rod-like conductive particles in the resin layer A, that is, a B-stage resin. A conductive film having a configuration including A, a resin layer B containing a B-stage resin and no conductive particles, and a release film.
However, the release film should just be provided as needed.

本導電性フィルム２は、前記樹脂層Ａ、前記樹脂層Ｂ及び離型フィルム以外の層を一層又は二層以上備えていてもよい。   The conductive film 2 may include one or more layers other than the resin layer A, the resin layer B, and the release film.

本導電性フィルム２において、樹脂層Ａ及び離型フィルムは、本導電性フィルム１と同様である。   In the conductive film 2, the resin layer A and the release film are the same as those of the conductive film 1.

樹脂層Ｂの樹脂組成物は、樹脂層Ａの樹脂組成物と同じであっても、異なる樹脂組成物であってもよい。樹脂層Ａと樹脂層Ｂの剥離し難さなどの点からすると、同じベース樹脂からなる樹脂組成物であるのが好ましい。   The resin composition of the resin layer B may be the same as or different from the resin composition of the resin layer A. From the viewpoint of difficulty in peeling between the resin layer A and the resin layer B, it is preferable that the resin composition is made of the same base resin.

樹脂層Ｂの厚さは、特に制限されるものではない。但し、厚過ぎても効果が高まる訳でなく材料が無駄である一方、薄過ぎると被着面の凹凸に追従でき難くなるため、樹脂層Ｂの厚さは５μｍ〜５００μｍであるのが好ましく、中でも２０μｍ以上或いは２００μｍ以下、中でも特に５０μｍ以上或いは１５０μｍ以下であるのがより一層好ましい。   The thickness of the resin layer B is not particularly limited. However, if the thickness is too thick, the effect is not increased and the material is useless. On the other hand, if the thickness is too thin, it becomes difficult to follow the unevenness of the adherend surface. Of these, it is more preferably 20 μm or more and 200 μm or less, and particularly preferably 50 μm or more and 150 μm or less.

樹脂層Ａは、被接着面となる層であるのが好ましい。すなわち、離型フィルム、樹脂層Ｂ、樹脂層Ａの順に積層するのが好ましい。   The resin layer A is preferably a layer that serves as an adherend surface. That is, it is preferable to laminate the release film, the resin layer B, and the resin layer A in this order.

（作製方法）
また、Ｂステージ状態とすることができる樹脂組成物に必要に応じて硬化剤やカップリング剤、腐食抑制剤などを混合し、離型フィルムの上に塗布し、溶剤を揮発させるなどして第１次硬化させて、Ｂステージ状態の樹脂層Ｂを形成するのが好ましい。
他方、Ｂステージ状態とすることができる樹脂組成物に導電性粒子、その他、必要に応じて硬化剤やカップリング剤、腐食抑制剤などと混合し、導電性粒子の形状を壊さずに分散させるように混練し、上記樹脂層Ｂ上に塗布し、溶剤を揮発させるなどして第１次硬化させてＢステージ状態の樹脂層Ａを形成し、離型フィルム、樹脂層Ｂ、樹脂層Ａの順に積層してなる本導電性フィルム２を作製するのが好ましい。 (Production method)
In addition, a curing agent, a coupling agent, a corrosion inhibitor, or the like is mixed with the resin composition that can be in a B-stage state, if necessary, applied onto a release film, and the solvent is volatilized. It is preferable that the resin layer B in the B stage state is formed by primary curing.
On the other hand, conductive particles are mixed into a resin composition that can be in a B-stage state, and mixed with a curing agent, a coupling agent, a corrosion inhibitor, etc., if necessary, and dispersed without breaking the shape of the conductive particles. Kneaded and coated on the resin layer B, and first cured by volatilizing the solvent to form the B-stage resin layer A. The release film, the resin layer B, and the resin layer A It is preferable to produce this conductive film 2 which is laminated in order.

上述のように、導電性粒子の形状を壊さずに分散させるように混練するためには、機械的な衝撃を導電性粒子に与える攪拌機などの使用は避けて、例えばあわとり練太郎（商標名）やプラネタリーミキサなどを使って、機械的な衝撃を与えることなく混練するのが好ましい。   As described above, in order to knead so as to disperse without breaking the shape of the conductive particles, avoid the use of a stirrer that gives mechanical impact to the conductive particles. ) Or a planetary mixer or the like, and preferably kneaded without giving mechanical impact.

（使用方法）
本導電性フィルム２は、樹脂層Ａを被着体の被着面に重ねて、プレス熱板等を離型フィルムの表面に当接させて加熱して樹脂層Ａ及び樹脂層Ｂの樹脂を軟化させた後、該離型フィルムの表面を前記プレス熱板等で押圧し、言い換えれば離型フィルムの表面を被プレス面としてプレス（押圧）し、次いでさらに加熱して、前記で軟化させた樹脂を硬化させることにより、本導電性フィルム２を被着体に接合することができる。
このように本導電性フィルム２を熱プレスすることで、樹脂層Ａ中の棒有状導電性粒子の棒状部分先端が被着面に突き刺さってアンカー効果を発揮するため、確実に本導電性フィルム２を被着体に接着させることができる。
他方、樹脂層Ｂは、樹脂層Ａに押される形で、樹脂層Ａを突き破って、例えばハーフダイシングにより形成された切込み溝内に流れ込んで当該切込み溝を空隙なく埋め込むことができる。
また、樹脂層Ｂを設けることによって、レーザーマークがし易くなったり、耐候性性が高まり経時的な変色を防ぐことができたりなどの利益を享受することができる。 (how to use)
The conductive film 2 has the resin layer A overlaid on the adherend surface of the adherend, and a press hot plate or the like is brought into contact with the surface of the release film to heat the resin of the resin layer A and the resin layer B. After softening, the surface of the release film is pressed with the press hot plate or the like, in other words, the surface of the release film is pressed (pressed) as a pressed surface, and then further heated to be softened as described above. By curing the resin, the conductive film 2 can be joined to the adherend.
Since the conductive film 2 is hot pressed in this way, the tip of the rod-shaped portion of the rod-like conductive particles in the resin layer A pierces the adherend surface and exhibits an anchor effect. 2 can be adhered to the adherend.
On the other hand, the resin layer B can be pushed by the resin layer A, break through the resin layer A, flow into a cut groove formed by, for example, half dicing, and bury the cut groove without a gap.
Further, by providing the resin layer B, it is possible to enjoy benefits such as easy laser marking, weather resistance and prevention of discoloration over time.

よって、例えば電子部品が実装され、該電子部品がモールド樹脂で封止され、さらにハーフダイシングにより切込み溝が設けられてなる構成を備えたプリント配線基板において、本導電性フィルム２の樹脂層Ａ側を該モールド樹脂に重ねて、例えば熱板などを当接させるなどして加熱して樹脂層Ａ及び樹脂層Ｂの樹脂を軟化させた後、離型フィルムの表面を被プレス面として該プレス接着用導電性フィルムを基板側にプレスし、次いで加熱して、前記で軟化させた樹脂を硬化させることで、樹脂層Ａの樹脂はモールド樹脂部分を被覆し、樹脂層Ｂの樹脂は樹脂層Ａを突き破って前記の切込み溝内に侵入するため、樹脂層Ａの樹脂及び樹脂層Ｂの樹脂で該切込み溝を埋め込んで充填することができ、電子部品パッケージを製造することができる。
これによって、モールド樹脂で封止された電子部品の周囲を、導電性粒子を含む被覆層で覆うことができ、しかも、当該被覆層の端部は切込み溝内などに侵入してグランドと接合しているため、導通を得ることができる。このように、本導電性フィルム２は、電磁波シールドフィルムとして好適に使用することができる。 Thus, for example, in a printed wiring board having a configuration in which an electronic component is mounted, the electronic component is sealed with a mold resin, and a cut groove is provided by half dicing, the resin layer A side of the conductive film 2 is provided. The resin layer A and the resin layer B are softened by heating, for example, by contacting a hot plate or the like on the mold resin, and then press-bonding with the surface of the release film as the pressed surface The conductive film is pressed to the substrate side and then heated to cure the softened resin, so that the resin of the resin layer A covers the mold resin portion, and the resin of the resin layer B is the resin layer A. And penetrates into the cut groove, the cut groove can be filled and filled with the resin of the resin layer A and the resin of the resin layer B, and an electronic component package can be manufactured.
As a result, the periphery of the electronic component sealed with the mold resin can be covered with a coating layer containing conductive particles, and the end of the coating layer penetrates into the cut groove and joins to the ground. Therefore, conduction can be obtained. Thus, this electroconductive film 2 can be used conveniently as an electromagnetic wave shield film.

＜本導電性フィルム３＞
本発明の第３の実施形態に係る導電性フィルム（「本導電性フィルム３」と称する）は、上記樹脂層Ａ、すなわちＢステージ状態の樹脂中に、棒有状導電性粒子を含有する樹脂層Ａと、Ｂステージ状態の樹脂中に導電性粒子を含有する樹脂層Ｃと、離型フィルムと、を備えた構成の導電性フィルムである。
但し、離型フィルムは必要に応じて備えていればよい。 <This conductive film 3>
The conductive film (referred to as “the present conductive film 3”) according to the third embodiment of the present invention is a resin containing rod-like conductive particles in the resin layer A, that is, the B-stage resin. This is a conductive film having a configuration including a layer A, a resin layer C containing conductive particles in a B-stage resin, and a release film.
However, the release film should just be provided as needed.

本導電性フィルム３は、前記樹脂層Ａ、前記樹脂層Ｃ及び離型フィルム以外の層を一層又は二層以上備えていてもよい。   The conductive film 3 may include one or more layers other than the resin layer A, the resin layer C, and the release film.

本導電性フィルム３において、樹脂層Ａ及び離型フィルムは、本導電性フィルム１と同様である。   In the present conductive film 3, the resin layer A and the release film are the same as those in the present conductive film 1.

（樹脂層Ｃに含まれる導電性粒子）
樹脂層Ｃに含まれる導電性粒子は、銀粉粒子、銅粉粒子、鉄粉粒子などの導電性粒子、或いは、任意材料からなる粒子、例えば前記導電性粒子を芯材としてこれらの表面の一部又は全部を異種導電性材料、例えば金、銀、銅、ニッケル、スズ、亜鉛などで被覆してなる粒子などを挙げることができる。但し、これらに限定する趣旨ではなく、導電性を有する材料であれば任意に採用可能である。 (Conductive particles contained in resin layer C)
The conductive particles contained in the resin layer C are conductive particles such as silver powder particles, copper powder particles, and iron powder particles, or particles made of an arbitrary material, for example, a part of these surfaces using the conductive particles as a core material. Or the particle | grains which coat | cover all with different electroconductive materials, for example, gold | metal | money, silver, copper, nickel, tin, zinc, etc. can be mentioned. However, the present invention is not limited to these, and any material having conductivity can be arbitrarily adopted.

上述した棒有状導電性粒子の中でも、針状導電性粒子やデンドライト状導電性粒子を多く含んでいると、例えば５０個数％以上を樹脂層Ｃが含んでいると、樹脂層Ｃが軟化乃至溶融しても、これらの導電性粒子によって樹脂の流動が阻害され、例えばハーフダイシングにより形成された切込み溝などへの埋め込みが阻止されてしまう。
そこで、流動性、言い換えれば埋め込み性に優れる点から、樹脂層Ｃ中の導電性粒子のうちの５０個数％以上を、粒状導電性粒子が占めるのが好ましく、中でも７０個数％以上、その中でも８０個数％を超える割合を粒状導電性粒子が占めるのが好ましい。 Among the above-mentioned rod-like conductive particles, if a large amount of needle-shaped conductive particles and dendritic conductive particles are contained, for example, if the resin layer C contains 50% by number or more, the resin layer C is softened or softened. Even when melted, the flow of the resin is hindered by these conductive particles, and the embedding into, for example, a cut groove formed by half dicing is prevented.
Therefore, from the viewpoint of excellent fluidity, in other words, embedding property, it is preferable that the granular conductive particles occupy 50% by number or more of the conductive particles in the resin layer C. It is preferable that the granular conductive particles occupy a ratio exceeding the number%.

ここで、「粒状導電性粒子」とは、例えば球状、略球状、楕円粒状、略楕円球状、芋状、角柱状などを挙げることができる。また、これら粒状粒子の表面に尖った突起部を備えた突起有粒状導電性粒子も包含する。中でも、流動性、言い換えれば溝部への埋め込み性に優れている点では、球状若しくは略球状であるのが特に好ましい。   Here, examples of the “granular conductive particles” include a spherical shape, a substantially spherical shape, an elliptical granular shape, a substantially elliptical spherical shape, a bowl shape, and a prismatic shape. Moreover, the granular conductive particle | grains with a protrusion provided with the sharp protrusion part on the surface of these granular particles are also included. Among them, a spherical shape or a substantially spherical shape is particularly preferable in terms of excellent fluidity, in other words, excellent embedding property in the groove.

このように樹脂層Ｃの流動性を確保する観点から、樹脂層Ｃにおける導電性粒子は、平均最長径／平均円相当径の比率が１．０〜２．０であるのが好ましく、中でも１．５以下、その中でも１．３以下であるのが好ましい。   Thus, from the viewpoint of ensuring the fluidity of the resin layer C, the conductive particles in the resin layer C preferably have a ratio of average longest diameter / average equivalent circle diameter of 1.0 to 2.0. .5 or less, preferably 1.3 or less.

樹脂層Ｃにおける導電性粒子の含有量は、本導電性フィルム３の用途などに応じて調整するのが好ましい。目安としては、樹脂層Ｃにおける導電性粒子の含有量は、樹脂層Ｃ全体の５０〜９５質量％、中でも６５質量％以上或いは９０質量％以下、その中でも８０質量％以上或いは９０質量％以下であるのが好ましい。   The content of the conductive particles in the resin layer C is preferably adjusted according to the use of the conductive film 3 and the like. As a guide, the content of the conductive particles in the resin layer C is 50 to 95% by mass of the entire resin layer C, especially 65% by mass or 90% by mass, particularly 80% by mass or more and 90% by mass or less. Preferably there is.

（樹脂層Ｃの樹脂）
樹脂層Ｃの樹脂組成物は、樹脂層Ａの樹脂組成物と、同じであっても、異なる樹脂組成物であってもよい。
樹脂層Ａと樹脂層Ｃの剥離し難さなどの点からすると、同じベース樹脂からなる樹脂組成物であるのが好ましい。 (Resin of resin layer C)
The resin composition of the resin layer C may be the same as or different from the resin composition of the resin layer A.
From the viewpoint of difficulty in peeling between the resin layer A and the resin layer C, a resin composition made of the same base resin is preferable.

他方、樹脂層Ａが密着性を高める役割を果たし、樹脂層Ｃが例えばハーフダイシングにより形成された切込み溝内などへ流入して埋め込む役割を果たす観点からすると、樹脂層Ｃの樹脂組成物と樹脂層Ａの樹脂組成物は異なるのが好ましく、少なくとも樹脂層Ｃの方が、１００〜１５０℃での粘弾性がより低い方が好ましい。
かかる観点から、樹脂層Ｃを構成する樹脂組成物は、１００〜１５０℃における最低溶融粘度が１０００００Ｐａ・ｓ以下である樹脂が好ましく、中でも５００００Ｐａ・ｓ以下、その中でも３００００Ｐａ・ｓ以下である樹脂がより一層好ましい（例えば図３の下方の点線で示される樹脂組成物）。 On the other hand, from the viewpoint of the resin layer A fulfilling the role of improving adhesion and the resin layer C playing and filling in a cut groove formed by, for example, half dicing, the resin composition of the resin layer C and the resin The resin composition of layer A is preferably different, and at least resin layer C preferably has lower viscoelasticity at 100 to 150 ° C.
From such a viewpoint, the resin composition constituting the resin layer C is preferably a resin having a minimum melt viscosity of 100000 Pa · s or less at 100 to 150 ° C., more preferably 50000 Pa · s or less, and more preferably 30000 Pa · s or less. Even more preferable (for example, a resin composition indicated by a dotted line below in FIG. 3).

樹脂層Ｃの厚さは、特に制限されるものではない。樹脂層Ｃは、例えばハーフダイシングにより形成された切込み溝などに流入して当該溝部を埋め込むために働くため、このような溝部などの大きさに応じて樹脂層Ｃの厚さを適宜調整するのが好ましい。   The thickness of the resin layer C is not particularly limited. For example, the resin layer C flows into a cut groove formed by half dicing and works to fill the groove portion. Therefore, the thickness of the resin layer C is appropriately adjusted according to the size of the groove portion. Is preferred.

樹脂層Ａは、被接着面となる層であるのが好ましい。すなわち、離型フィルム、樹脂層Ｃ、樹脂層Ａの順に積層するのが好ましい。   The resin layer A is preferably a layer that serves as an adherend surface. That is, the release film, the resin layer C, and the resin layer A are preferably laminated in this order.

（作製方法）
Ｂステージ状態とすることができる樹脂組成物に導電性粒子、その他、必要に応じて硬化剤やカップリング剤、腐食抑制剤などと混合し、導電性粒子の形状を壊さずに分散させるように混練し、離型フィルムの上に塗布し、溶剤を揮発させるなどして第１次硬化させて、Ｂステージ状態の樹脂層Ｃを形成するのが好ましい。
他方、Ｂステージ状態とすることができる樹脂組成物に導電性粒子、その他、必要に応じて硬化剤やカップリング剤、腐食抑制剤などと混合し、導電性粒子の形状を壊さずに分散させるように混練し、上記樹脂層Ｃ上に塗布し、溶剤を揮発させるなどして第１次硬化させてＢステージ状態の樹脂層Ａを形成し、離型フィルム、樹脂層Ｃ、樹脂層Ａの順に積層してなる本導電性フィルム３を作製するのが好ましい。 (Production method)
In order to disperse the conductive particles without breaking the shape of the conductive particles by mixing them with conductive particles and other curing agents, coupling agents, corrosion inhibitors, etc., if necessary. It is preferable that the resin layer C in the B stage state is formed by kneading, applying onto the release film, and first curing by volatilizing the solvent.
On the other hand, conductive particles are mixed into a resin composition that can be in a B-stage state, and mixed with a curing agent, a coupling agent, a corrosion inhibitor, etc., if necessary, and dispersed without breaking the shape of the conductive particles. Kneaded and coated on the resin layer C, and first cured by volatilizing the solvent to form a B-stage resin layer A. The release film, the resin layer C, and the resin layer A It is preferable to produce this conductive film 3 which is laminated in order.

上述のように、導電性粒子の形状を壊さずに分散させるように混練するためには、機械的な衝撃を導電性粒子に与える攪拌機などの使用は避けて、例えばあわとり練太郎（商標名）やプラネタリーミキサなどを使って、機械的な衝撃を与えることなく混練するのが好ましい。   As described above, in order to knead so as to disperse without breaking the shape of the conductive particles, avoid the use of a stirrer that gives mechanical impact to the conductive particles. ) Or a planetary mixer or the like, and preferably kneaded without giving mechanical impact.

（使用方法）
本導電性フィルム３は、図２（Ａ）に示すように、樹脂層Ａを被着体の被着面に重ねて、プレス熱板等を離型フィルムの表面に当接させて加熱して樹脂層Ａ及び樹脂層Ｃの樹脂を軟化させた後、該離型フィルムの表面を前記プレス熱板等で押圧し、言い換えれば離型フィルムの表面を被プレス面としてプレス（押圧）し、さらに加熱して、前記で軟化させた樹脂を硬化させることにより、本導電性フィルム３を被着体に接合することができる。
このように本導電性フィルム３を熱プレスすることで、図２（Ｂ）に示すように、樹脂層Ａ中の棒有状導電性粒子の棒状部分先端が被着面に突き刺さってアンカー効果を発揮するため、接着性を高めることができる。
また、樹脂層Ｃは、導電性粒子が流動性を阻害することがなく、流動性が高いため、樹脂層Ａを突き破ってハーフダイシングにより形成された切込み溝内に流れ込んで前記切込み溝を空隙なく埋め込むことができる。
なお、これらの効果は、樹脂層Ａが接着面側に位置している場合に特に効果的に得られる点に留意が必要である。 (how to use)
As shown in FIG. 2A, the conductive film 3 is heated by placing the resin layer A on the adherend surface and bringing a press hot plate or the like into contact with the surface of the release film. After softening the resin of the resin layer A and the resin layer C, the surface of the release film is pressed with the press hot plate or the like, in other words, the surface of the release film is pressed (pressed) as a pressed surface, The conductive film 3 can be bonded to the adherend by heating and curing the softened resin.
By hot pressing the conductive film 3 in this way, as shown in FIG. 2 (B), the rod-like portion tip of the rod-like conductive particles in the resin layer A pierces the adherend surface and has an anchor effect. In order to demonstrate, adhesiveness can be improved.
In addition, the resin layer C has high fluidity because the conductive particles do not hinder the fluidity, so that the resin layer C breaks through the resin layer A and flows into the incision groove formed by half dicing so that the incision groove has no gap. Can be embedded.
It should be noted that these effects can be obtained particularly effectively when the resin layer A is located on the bonding surface side.

よって、例えば電子部品が実装され、該電子部品がモールド樹脂で封止され、さらにハーフダイシングにより切込み溝が設けられてなる構成を備えたプリント配線基板において、図２（Ａ）に示すように、本導電性フィルム３の樹脂層Ａ側を該モールド樹脂に重ねて、例えば熱板などを当接させるなどして加熱して樹脂層Ａ及び樹脂層Ｃの樹脂を軟化させた後、離型フィルムの表面を被プレス面として該プレス接着用導電性フィルムを基板側にプレスし、次いで加熱して、前記で軟化させた樹脂を硬化させることで、図２（Ｂ）に示すように、樹脂層Ａの樹脂はモールド樹脂部分を被覆し、樹脂層Ｃの樹脂は樹脂層Ａを突き破って前記の切込み溝内に侵入するため、樹脂層Ａの樹脂及び樹脂層Ｃの樹脂で該切込み溝を埋め込んで充填することができ、電子部品パッケージを製造することができる。
これによって、モールド樹脂で封止された電子部品の周囲を、導電性粒子を含む被覆層で覆うことができ、しかも、当該被覆層の端部は、例えばハーフダイシングにより形成された切込み溝内などに侵入してグランドと接合しているため、導通を得ることができる。このように、本導電性フィルム３は、電磁波シールドフィルムとして好適に使用することができる。 Therefore, for example, in a printed wiring board having a configuration in which an electronic component is mounted, the electronic component is sealed with a mold resin, and a cut groove is provided by half dicing, as shown in FIG. After the resin layer A side of the conductive film 3 is overlaid on the mold resin and heated by, for example, contacting a hot plate or the like, the resin of the resin layer A and the resin layer C is softened, and then the release film As shown in FIG. 2 (B), the conductive film for press bonding is pressed to the substrate side with the surface of the substrate as the pressed surface, and then heated to cure the softened resin. The resin of A covers the mold resin portion, and the resin of the resin layer C breaks through the resin layer A and enters the cut groove, so that the cut groove is embedded with the resin of the resin layer A and the resin of the resin layer C. Filling with Can, it is possible to manufacture the electronic component package.
As a result, the periphery of the electronic component sealed with the mold resin can be covered with a coating layer containing conductive particles, and the end of the coating layer is, for example, in a cut groove formed by half dicing. Since it penetrates into and is joined to the ground, conduction can be obtained. Thus, this electroconductive film 3 can be used conveniently as an electromagnetic wave shield film.

＜本導電性フィルムの特徴・用途＞
本導電性フィルム１−３はいずれも、例えば電磁波抑制シート、電磁波吸収シート、電磁波シールドフィルム、回路基板と回路基板とを接続するボンディングフィルム、静電気防止フィルムなどの導電性フィルムとして利用することができる。中でも、デンドライト状導電性粒子は電磁波シールド特性に優れているため、デンドライト状導電性粒子を含有する本導電性フィルムは、電磁波シールドフィルムとして特に好ましく利用することができる。 <Characteristics and use of this conductive film>
Any of the conductive films 1-3 can be used as conductive films such as an electromagnetic wave suppressing sheet, an electromagnetic wave absorbing sheet, an electromagnetic wave shielding film, a bonding film for connecting a circuit board and a circuit board, and an antistatic film. . Among these, since the dendritic conductive particles are excellent in electromagnetic wave shielding properties, the present conductive film containing dendritic conductive particles can be particularly preferably used as an electromagnetic shielding film.

＜語句の説明＞
本明細書において「Ｘ〜Ｙ」（Ｘ，Ｙは任意の数字）と表現する場合、特にことわらない限り「Ｘ以上Ｙ以下」の意と共に、「好ましくはＸより大きい」或いは「好ましくＹより小さい」の意も包含する。
また、「Ｘ以上」（Ｘは任意の数字）と表現する場合、特にことわらない限り「好ましくはＸより大きい」の意を包含し、「Ｙ以下」（Ｙは任意の数字）と表現する場合、特にことわらない限り「好ましくＹより小さい」の意を包含する。 <Explanation of words>
In the present specification, when expressed as “X to Y” (X and Y are arbitrary numbers), “X is preferably greater than X” or “preferably more than Y” with the meaning of “X to Y” unless otherwise specified. The meaning of “small” is also included.
In addition, when expressed as “X or more” (X is an arbitrary number), it means “preferably larger than X” unless otherwise specified, and expressed as “Y or less” (Y is an arbitrary number). In the case, unless otherwise specified, the meaning of “preferably smaller than Y” is included.

以下、本発明の実施例について説明する。但し、本発明が以下の実施例に限定されるものではない。   Examples of the present invention will be described below. However, the present invention is not limited to the following examples.

＜導電性粉末＞
（１）銀被覆銅粉Ａ：Ｄ５０が１３μｍであって、且つ、電子顕微鏡（２０００倍）で観察すると８０個数％超える粒子がデンドライト状を呈する銀被覆銅粉。
（２）銀被覆銅粉Ｂ：Ｄ５０が５μｍであって、且つ、電子顕微鏡（２０００倍）で観察すると８０個数％超える粒子がデンドライト状を呈する銀被覆銅粉。
（３）銀被覆銅粉Ｃ：Ｄ５０が１２μｍであって、且つ、電子顕微鏡（２０００倍）で観察すると８０個数％超える粒子が、棒状を呈する銀被覆銅粉。
（４）銀被覆銅粉Ｄ：Ｄ５０が５μｍであって、且つ、電子顕微鏡（２０００倍）で観察すると８０個数％超える粒子が、球状粒子の表面に突起部分を有する突起有球状を呈する銀被覆銅粉。
（５）銅粉Ｅ：Ｄ５０が５μｍであって、且つ、電子顕微鏡（２０００倍）で観察すると８０個数％超える粒子が、球状粒子の表面に突起部分を有する突起有球状を呈する銅粉。
（６）銀被覆銅粉Ｆ：Ｄ５０が５．５μｍであって、且つ、電子顕微鏡（２０００倍）で観察すると８０個数％超える粒子が、球状粒子を呈する銀被覆銅粉。 <Conductive powder>
(1) Silver-coated copper powder A: A silver-coated copper powder having a D50 of 13 μm and particles having a dendrite shape exceeding 80% by number when observed with an electron microscope (2000 times).
(2) Silver-coated copper powder B: A silver-coated copper powder having a D50 of 5 μm and particles having a dendrite shape of more than 80% by number when observed with an electron microscope (2000 times).
(3) Silver-coated copper powder C: Silver-coated copper powder having a D50 of 12 μm and particles exceeding 80% by number when observed with an electron microscope (2,000 times).
(4) Silver-coated copper powder D: Silver coating having a D50 of 5 μm, and particles having a protruding portion on the surface of the spherical particles, the particles exceeding 80% by number when observed with an electron microscope (2000 times) Copper powder.
(5) Copper powder E: A copper powder having a D50 of 5 μm and particles having a protrusion-shaped sphere in which more than 80% by number of particles have a protruding portion on the surface of the spherical particle when observed with an electron microscope (2000 magnifications).
(6) Silver-coated copper powder F: Silver-coated copper powder having a D50 of 5.5 μm and more than 80% by number, when observed with an electron microscope (2000 times), exhibits spherical particles.

なお、上記Ｄ５０は次のようにして求めた値である。
導電性粉末を少量ビーカーに取り、３％トリトンＸ溶液（関東化学製）を２、３滴添加し、粉末になじませてから、０．１％ＳＮディスパーサント４１溶液(サンノプコ製)５０ｍＬを添加し、その後、超音波分散器ＴＩＰφ２０（日本精機製作所製）を用いて２分間分散処理して測定用サンプルを調製した。この測定用サンプルを、レーザー回折散乱式粒度分布測定装置ＭＴ３３００ (日機装製)を用いて体積累積基準Ｄ５０を測定した。 The above D50 is a value obtained as follows.
Take a small amount of conductive powder in a beaker, add 2 or 3 drops of 3% Triton X solution (Kanto Chemical), blend in with the powder, then add 50 mL of 0.1% SN Dispersant 41 solution (San Nopco) After that, a measurement sample was prepared by performing a dispersion treatment for 2 minutes using an ultrasonic dispersing device TIPφ20 (manufactured by Nippon Seiki Seisakusho). The volume accumulation standard D50 of this measurement sample was measured using a laser diffraction / scattering particle size distribution analyzer MT3300 (manufactured by Nikkiso).

＜樹脂＞
（１）エポキシ樹脂Ｘ：１００〜１５０℃での最低溶融粘度が１１０℃で２５０００Ｐａ・ｓ
（２）エポキシ樹脂Ｙ：１００〜１５０℃での最低溶融粘度が１１０℃で５０００００Ｐａ・ｓ <Resin>
(1) Epoxy resin X: Minimum melt viscosity at 100 to 150 ° C. is 25000 Pa · s at 110 ° C.
(2) Epoxy resin Y: minimum melt viscosity at 100 to 150 ° C. is 500,000 Pa · s at 110 ° C.

なお、樹脂の最低溶融粘度は、サンプルの厚みを５ｍｍとして、粘度測定装置（Thermo ELECTRON CORPORATION社製「HAAKE Rheo Stress 600」）を使用し、昇温速度：２℃／ｍｉｎにて、周波数（角速度）を適宜調整しながら測定した。   The minimum melt viscosity of the resin is 5 mm, and the viscosity is measured using a viscosity measuring device (“HAAKE Rheo Stress 600” manufactured by Thermo ELECTRON CORPORATION). ) Was adjusted appropriately.

＜実施例１−５及び比較例１＞
エポキシ樹脂Ｘ１１質量部に、表１に示す銀被覆銅粉Ａ〜Ｄ又は銅粉Ｅを６３質量部、有機溶剤２６質量部の割合で加えて、撹拌機（あわとり練太郎（商標名））を用いて回転速度２０００ｒｐｍで３分間混練した後、厚さ２５μｍの離型フィルム（旭硝子社製、商品名「アフレックス」）上に、アプリケータを使用して厚さ５０μｍに塗布して塗膜を形成し、オーブン中にて１５０℃、３分間加熱して、離型フィルム上にＢステージ状態の樹脂層Ａを備えた導電性フィルムを作製した。 <Example 1-5 and Comparative Example 1>
To 11 parts by mass of the epoxy resin X, the silver-coated copper powders A to D or the copper powder E shown in Table 1 are added in a proportion of 63 parts by mass and 26 parts by mass of the organic solvent, and a stirrer (Awatori Netaro (trade name)) After kneading for 3 minutes at a rotational speed of 2000 rpm, the coating film was applied on a 25 μm-thick release film (trade name “Aflex”, manufactured by Asahi Glass Co., Ltd.) using an applicator to a thickness of 50 μm. And heated in an oven at 150 ° C. for 3 minutes to produce a conductive film having the B-stage resin layer A on the release film.

上記で得られた導電性フィルムの樹脂層Ａを、モジュール基板（基板上に素子が実装され、さらにエポキシ樹脂製のモールド樹脂で封止され、ハーフダイシングにより表面が溝加工され、パッケージ基板まで切込み溝が設けられたもの）に重ねて、真空プレス機を用いて、昇温速度３℃／分で加熱して前記フィルムの樹脂を軟化させた後（１２０℃）、離型フィルムの表面を被プレス面として被着体方向に３０ｋｇｆ／ｃｍ2の圧力でプレス（押圧）し、さらに１８０℃まで加熱して前記で軟化させた樹脂を硬化させてフィルムを基板に接合し、セミオートマチックダイシングを用いてフルダイシングして個片化した。 The resin layer A of the conductive film obtained above is formed into a module substrate (an element is mounted on the substrate, further sealed with an epoxy resin mold resin, the surface is grooved by half dicing, and cut into the package substrate. The film was softened (120 ° C.) by heating at a temperature rising rate of 3 ° C./min using a vacuum press, and the surface of the release film was covered. Pressed (pressed) in the direction of the adherend as a pressing surface at a pressure of 30 kgf / cm 2 , further heated to 180 ° C. to cure the softened resin, and bonded the film to the substrate, using semi-automatic dicing And then dicing into full pieces.

＜実施例６＞
エポキシ樹脂Ｘ１１質量部に、表１に示す銀被覆銅粉Ａを６３質量部、有機溶剤２６質量部の割合で加えて、撹拌機（あわとり練太郎（商標名））を用いて回転速度２０００ｒｐｍで３分間混練した後、厚さ２５μｍの離型フィルム（旭硝子社製、商品名「アフレックス」）上に、アプリケータを使用して厚さ５０μｍに塗布して塗膜を形成した。
前記作製した塗膜上に、エポキシ樹脂Ｘをアプリケータを使用して厚さ１００μｍに塗布して塗膜を形成し、オーブン中にて１５０℃、３分間加熱して、離型フィルム上にＢステージ状態の樹脂層Ｂ及び樹脂層Ａを順次積層してなる導電性フィルムを作製した。 <Example 6>
The silver-coated copper powder A shown in Table 1 is added to 11 parts by mass of the epoxy resin X at a ratio of 63 parts by mass and 26 parts by mass of the organic solvent, and a rotational speed of 2000 rpm using a stirrer (Aritori Nertaro (trade name)). After being kneaded for 3 minutes, an applicator was used to form a coating film on a 25 μm thick release film (trade name “Aflex” manufactured by Asahi Glass Co., Ltd.) to form a coating film.
On the prepared coating film, an epoxy resin X is applied to a thickness of 100 μm using an applicator to form a coating film, heated in an oven at 150 ° C. for 3 minutes, and B on the release film. A conductive film obtained by sequentially laminating the resin layer B and the resin layer A in a stage state was produced.

上記で得られた導電性フィルムの樹脂層Ａを、モジュール基板（基板上に素子が実装され、さらにエポキシ樹脂製のモールド樹脂で封止され、ハーフダイシングにより表面が溝加工され、パッケージ基板まで切込み溝が設けられたもの）に重ねて、真空プレス機を用いて、昇温速度３℃／分で加熱して前記フィルムの樹脂を軟化させた後（１２０℃）、離型フィルムの表面を被プレス面として被着体方向に３０ｋｇｆ／ｃｍ2の圧力でプレス（押圧）し、さらに１８０℃まで加熱して前記で軟化させた樹脂を硬化させてフィルムを基板に接合し、セミオートマチックダイシングを用いてフルダイシングして個片化した。 The resin layer A of the conductive film obtained above is formed into a module substrate (an element is mounted on the substrate, further sealed with an epoxy resin mold resin, the surface is grooved by half dicing, and cut into the package substrate. The film was softened (120 ° C.) by heating at a temperature rising rate of 3 ° C./min using a vacuum press, and the surface of the release film was covered. Pressed (pressed) in the direction of the adherend as a pressing surface at a pressure of 30 kgf / cm 2 , further heated to 180 ° C. to cure the softened resin, and bonded the film to the substrate, using semi-automatic dicing And then dicing into full pieces.

＜実施例７−８＞
エポキシ樹脂Ｘ又はＹ１１質量部に、表１に示す銀被覆銅粉Ａ又はＤを６３質量部、有機溶剤２６質量部の割合で加えて、撹拌機（あわとり練太郎（商標名））を用いて回転速度２０００ｒｐｍで３分間混練した後、厚さ２５μｍの離型フィルム（旭硝子社製、商品名「アフレックス」）上に、アプリケータを使用して厚さ５０μｍに塗布して塗膜を形成した。
エポキシ樹脂Ｘ１１質量部に、表１に示す銀被覆銅粉Ｄを６３質量部、有機溶剤２６質量部の割合で加えて、撹拌機（あわとり練太郎（商標名））を用いて回転速度２０００ｒｐｍで３分間混練した後、前記作製した塗膜上に、アプリケータを使用して厚さ１００μｍに塗布して塗膜を形成し、オーブン中にて１５０℃、３分間加熱して、離型フィルム上にＢステージ状態の樹脂層Ｃ及び樹脂層Ａを順次積層してなる導電性フィルムを作製した。 <Example 7-8>
To 11 parts by mass of epoxy resin X or Y, 63 parts by mass of silver-coated copper powder A or D shown in Table 1 is added in a proportion of 26 parts by mass of organic solvent, and a stirrer (Awatori Kentaro (trade name)) is used. After kneading for 3 minutes at a rotational speed of 2000 rpm, a coating film is formed on a 25 μm-thick release film (trade name “Aflex”, manufactured by Asahi Glass Co., Ltd.) using an applicator to a thickness of 50 μm. did.
The silver-coated copper powder D shown in Table 1 is added in an amount of 63 parts by mass and 26 parts by mass of an organic solvent to 11 parts by mass of the epoxy resin X, and a rotational speed of 2000 rpm using a stirrer (Aritori Nertaro (trade name)). After kneading for 3 minutes, a coating film is formed on the prepared coating film using an applicator to a thickness of 100 μm, and heated in an oven at 150 ° C. for 3 minutes to form a release film. A conductive film was produced by sequentially laminating a resin layer C and a resin layer A in a B-stage state thereon.

上記で得られた導電性フィルムの樹脂層Ａを、モジュール基板（基板上に素子が実装され、さらにエポキシ樹脂製のモールド樹脂で封止され、ハーフダイシングにより表面が溝加工され、パッケージ基板まで切込み溝が設けられたもの）に重ねて、真空プレス機を用いて、昇温速度３℃／分で加熱して前記フィルムの樹脂を軟化させた後（１２０℃）、離型フィルムの表面を被プレス面として被着体方向に３０ｋｇｆ／ｃｍ2の圧力でプレス（押圧）し、さらに１８０℃まで加熱して前記で軟化させた樹脂を硬化させてフィルムを基板に接合し、セミオートマチックダイシングを用いてフルダイシングして個片化した。 The resin layer A of the conductive film obtained above is formed into a module substrate (an element is mounted on the substrate, further sealed with an epoxy resin mold resin, the surface is grooved by half dicing, and cut into the package substrate. The film was softened (120 ° C.) by heating at a temperature rising rate of 3 ° C./min using a vacuum press, and the surface of the release film was covered. Pressed (pressed) in the direction of the adherend as a pressing surface at a pressure of 30 kgf / cm 2 , further heated to 180 ° C. to cure the softened resin, and bonded the film to the substrate, using semi-automatic dicing And then dicing into full pieces.

（フィルム中の導電性粒子形状の観察）
実施例・比較例で得たフィルムを、光学顕微鏡（２，０００倍）を使用して、任意の１００視野において、それぞれ５００個の粒子の形状を観察し、主な粒子形状、すなわち５０個数％を超える粒子の形状を表１に示した。 (Observation of conductive particle shape in film)
Using the optical microscope (2,000 times), the films obtained in Examples and Comparative Examples were observed in the shape of 500 particles in an arbitrary 100 field of view, and the main particle shape, that is, 50% by number. Table 1 shows the particle shapes exceeding.

（フィルム中の導電性粒子の粒子径の測定）
平均円相当径は、実施例・比較例で得たフィルムを、走査型電子顕微鏡（２０００倍）を使用して観察し、その視野中に観察される全粒子の円相当径を、走査型電子顕微鏡写真から、画像解析ソフトウェア（オープンソースのフリーソフト「ImageJ」）を用いて、SetMeasurementのAeraの値より算出し、当該全粒子の平均値として平均円相当径を求めた。
他方、平均最長径は、実施例・比較例で得たフィルムを、走査型電子顕微鏡（２０００倍）を使用して観察し、その視野中に観察される全粒子の最長径を、走査型電子顕微鏡写真から、画像解析ソフトウェア（オープンソースのフリーソフト「ImageJ」）を用いて、SetMeasurementのFeret'sDiameterの値より算出し、当該全粒子の平均値として平均最長径を求めた。 (Measurement of particle size of conductive particles in film)
For the average equivalent circle diameter, the films obtained in Examples and Comparative Examples were observed using a scanning electron microscope (2000 times), and the equivalent circle diameters of all particles observed in the field of view were calculated using the scanning electron microscope. From the photomicrograph, image analysis software (open source free software “ImageJ”) was used to calculate from the Aera value of SetMeasurement, and the average equivalent circle diameter was determined as the average value of all the particles.
On the other hand, the average longest diameter was determined by observing the films obtained in Examples and Comparative Examples using a scanning electron microscope (2000 times), and determining the longest diameter of all particles observed in the field of view by using scanning electron From the micrograph, image analysis software (open source free software “ImageJ”) was used to calculate from the value of Ferret's Diameter of SetMeasurement, and the average longest diameter was obtained as the average value of all the particles.

＜シート抵抗＞
四端子法により測定を行った。具体的には、アジレントテクノロジーズ社製の半導体デバイスアナライザー「B1500A」に、同じくアジレントテクノロジーズ社製の電圧計「34420A」を接続した測定装置を使用して、１００ｍＡにて、実施例及び比較例で得たモジュールにおけるフィルムのシート抵抗を測定した。 <Sheet resistance>
Measurements were made by the four probe method. Specifically, using a measurement device in which a voltmeter “34420A” also manufactured by Agilent Technologies, Inc., is connected to a semiconductor device analyzer “B1500A” manufactured by Agilent Technologies, at 100 mA, it is obtained in Examples and Comparative Examples. The sheet resistance of the film in each module was measured.

＜密着性＞
ＪＩＳ Ｋ５６００−５−６で規定されている基盤目試験法に準拠して、実施例・比較例で得たモジュールにおけるフィルムの密着性を「０」〜「５」の６段階で評価した。
数値が小さいほど密着性が良いと評価することができ、「３」以下を「合格」、好ましくは「２」以下、中でも好ましくは「１」以下である。 <Adhesion>
Based on the basic eye test method defined in JIS K5600-5-6, the adhesion of the film in the module obtained in the example and the comparative example was evaluated in six stages of “0” to “5”.
It can be evaluated that the smaller the numerical value is, the better the adhesion is, and “3” or less is “pass”, preferably “2” or less, and particularly preferably “1” or less.

Figure 2014110263
Figure 2014110263

（考察）
表１の結果並びにこれまで行ってきた試験結果から、モジュールにおけるフィルムの密着性を高める観点からすると、少なくとも樹脂層Ａには、棒有形状を呈する導電性粒子を含有させるのが好ましいことが分かった。中でも、デンドライト状粒子が特に好ましいことが分かった。このような効果は、フィルムを熱プレスした際に、樹脂層Ａ中の棒有状導電性粒子の棒状部分先端が被着面に突き刺さるために、アンカー効果を発揮するためであると考えることができる。
これら棒有状導電性粒子の中でも、フィルムの密着性の観点から、平均最長径／平均円相当径の比率で示すと１．２〜２．５の範囲に入るものが好ましく、中でも１．２以上或いは２．０以下であるものが特に好ましく、その中でも１．４以上或いは１．９以下のものが特に好ましいことが分かった。
なお、実施例１−５においてはいずれの場合も、樹脂層Ａの樹脂はモールド樹脂部分を被覆すると共に、ハーフダイシングにより形成された切込み溝内に侵入して、当該溝内は樹脂によって充填されたことを確認することができた。 (Discussion)
From the results of Table 1 and the test results conducted so far, it is understood that it is preferable that at least the resin layer A contains conductive particles having a rod-like shape from the viewpoint of improving the adhesion of the film in the module. It was. Among these, it has been found that dendritic particles are particularly preferable. It can be considered that such an effect is due to exerting an anchor effect because the tip of the rod-like portion of the rod-like conductive particles in the resin layer A pierces the adherend surface when the film is hot pressed. it can.
Among these rod-like conductive particles, those in the range of 1.2 to 2.5 are preferable in terms of the ratio of average longest diameter / average equivalent circle diameter from the viewpoint of film adhesion. It was found that those above or 2.0 or less were particularly preferred, and among those above 1.4 or 1.9 or less were particularly preferred.
In all cases in Example 1-5, the resin of the resin layer A covers the mold resin portion and enters the cut groove formed by half dicing, and the groove is filled with the resin. I was able to confirm that.

また、実施例６のように、棒有形状を呈する導電性粒子を含有する樹脂層Ａと、導電性粒子を含有しない樹脂層Ｂとを備えた導電性フィルムであっても、樹脂層Ａからなる単層の導電性フィルムに比べて、密着性及びシート抵抗が大きく低下せず、しかも、樹脂層Ａの樹脂はモールド樹脂部分を被覆する一方、樹脂層Ｂの樹脂は樹脂層Ａを突き破って、ハーフダイシングにより形成された切込み溝内に侵入して、樹脂層Ａ及びＢの樹脂で当該溝内が充填されることを確認することができた。
これより、樹脂層Ｂを積層することで、レーザーマークがし易くなったり、耐候性性が高まり経時的な変色を防ぐことができる、導電性フィルムとして有効に利用することができるものと考えることができる。 Moreover, even if it is an electroconductive film provided with the resin layer A containing the electroconductive particle which shows a rod-shaped shape like Example 6, and the resin layer B which does not contain electroconductive particle, from the resin layer A Compared with the single-layer conductive film, the adhesion and sheet resistance are not greatly reduced, and the resin of the resin layer A covers the mold resin portion, while the resin of the resin layer B breaks through the resin layer A. It was confirmed that it entered into the cut groove formed by half dicing, and the groove was filled with the resin of the resin layers A and B.
From this, it is considered that by laminating the resin layer B, laser marking can be easily performed, weather resistance can be increased and discoloration with time can be prevented, and it can be effectively used as a conductive film. Can do.

さらに実施例７及び８のように、棒有形状を呈する導電性粒子を含有する樹脂層Ａと、デンドライト状若しくは突起有粒状を呈する導電性粒子を含有する樹脂層Ｃとを備えた導電性フィルムを使用すると、しっかりと密着させることができる上、樹脂層Ａの樹脂がモールド樹脂部分を被覆する一方、樹脂層Ｃの樹脂は、樹脂層Ａを突き破って、ハーフダイシングにより形成された切込み溝内の隅々にまで侵入して、樹脂層Ａ及びＣの樹脂によって当該溝内を隙間なく埋めて充填することができることが分かった。
このような溝部に対する埋め込み性（充填性）の観点からすると、樹脂層Ｃに含有させる導電性粒子は、デンドライト状粒子よりも、突起有粒状粒子や突起無粒状粒子などの粒状粒子の方が好ましいことが分かった。これを、平均最長径／平均円相当径の比率で示すと、１．０〜２．０である導電性粒子であるのが好ましく、中でも１．５以下、その中でも１．３以下である導電性粒子であるのがより一層好ましいことが分かった。 Further, as in Examples 7 and 8, a conductive film provided with a resin layer A containing conductive particles having a rod-shaped shape and a resin layer C containing conductive particles having a dendritic shape or a projection-shaped granular shape. Can be firmly attached, and the resin of the resin layer A covers the mold resin portion, while the resin of the resin layer C breaks through the resin layer A and is in a cut groove formed by half dicing. It has been found that the groove can be filled and filled with the resin of the resin layers A and C without gaps.
From the viewpoint of the embedding property (fillability) in the groove part, the conductive particles contained in the resin layer C are preferably granular particles such as protruding granular particles and protruding non-particle particles rather than dendritic particles. I understood that. When expressed as a ratio of average longest diameter / average equivalent circle diameter, it is preferable that the conductive particles are 1.0 to 2.0, particularly 1.5 or less, and among them, the conductivity is 1.3 or less. It has been found that it is even more preferable that the particles are conductive particles.

また、樹脂層Ａを構成する樹脂組成物は、エポキシ樹脂Ｘ（１１０℃で２５０００Ｐａ・ｓ）及びエポキシ樹脂Ｙ（１１０℃で５０００００Ｐａ・ｓ）のように、１００〜１５０℃での最低溶融粘度が１００００Ｐａ・ｓ〜１００００００Ｐａ・ｓであるのが好ましく、中でも、エポキシ樹脂Ｙ（１１０℃で５０００００Ｐａ・ｓ）のように１０００００Ｐａ・ｓ以上であるのがより一層好ましいことが分かった。
他方、樹脂層Ｂ及びＣを構成する樹脂組成物は、エポキシ樹脂Ｘ（１１０℃で２５０００Ｐａ・ｓ）のように、１００〜１５０℃における最低溶融粘度が１０００００Ｐａ・ｓ以下である樹脂が好ましく、中でも５００００Ｐａ・ｓ以下、その中でも３００００Ｐａ・ｓ以下である樹脂がより一層好ましいことが分かった。 Moreover, the resin composition which comprises the resin layer A has minimum melt viscosity in 100-150 degreeC like the epoxy resin X (25000 Pa.s at 110 degreeC) and the epoxy resin Y (500,000 Pa.s at 110 degreeC). It was found that the viscosity was preferably 10,000 Pa · s to 1,000,000 Pa · s, and above all, it was found that it is more preferably 100,000 Pa · s or more, such as epoxy resin Y (500000 Pa · s at 110 ° C.).
On the other hand, the resin composition constituting the resin layers B and C is preferably a resin having a minimum melt viscosity at 100 to 150 ° C. of 100000 Pa · s or less, such as epoxy resin X (25000 Pa · s at 110 ° C.). It was found that a resin having a viscosity of 50000 Pa · s or less, particularly 30000 Pa · s or less, is even more preferable.

Claims (11)

Ｂステージ状態の樹脂中に、棒有形状を呈する導電性粒子を含有する樹脂層Ａを備えた、プレス接着用導電性フィルム。   A conductive film for press bonding, comprising a resin layer A containing conductive particles having a rod-like shape in a B-stage resin. Ｂステージ状態の樹脂中に、棒有形状を呈する導電性粒子を含有する樹脂層Ａと、Ｂステージ状態の樹脂を含有し、且つ導電性粒子を含有しない樹脂層Ｂと、を備えたプレス接着用導電性フィルム。   Press bonding provided with a resin layer A containing conductive particles having a rod-like shape in a B-stage resin and a resin layer B containing a B-stage resin and no conductive particles Conductive film. Ｂステージ状態の樹脂中に、棒有形状を呈する導電性粒子を含有する樹脂層Ａと、Ｂステージ状態の樹脂中に、導電性粒子を含有する樹脂層Ｃと、を備えたプレス接着用導電性フィルム。   A conductive material for press bonding, comprising: a resin layer A containing conductive particles having a rod-like shape in a B-stage resin; and a resin layer C containing conductive particles in a B-stage resin. Sex film. 樹脂層Ｃは、粒状形状を呈する導電性粒子を含有することを特徴とする請求項３に記載のプレス接着用導電性フィルム。   The conductive film for press bonding according to claim 3, wherein the resin layer C contains conductive particles having a granular shape. 樹脂層Ａが、接着面側に位置することを特徴とする請求項１〜４の何れかに記載のプレス接着用導電性フィルム。   The conductive layer for press bonding according to any one of claims 1 to 4, wherein the resin layer A is located on the bonding surface side. 樹脂層Ａ中の導電性粒子のうち５０個数％以上の割合で、棒有形状を呈する導電性粒子を含有することを特徴とする請求項１〜５の何れかに記載のプレス接着用導電性フィルム。   The conductive material for press bonding according to any one of claims 1 to 5, wherein the conductive particles in the resin layer A contain conductive particles having a rod-like shape in a ratio of 50% by number or more. the film. 離型フィルムを備えることを特徴とする請求項１〜６の何れかに記載のプレス接着用導電性フィルム。   A conductive film for press bonding according to any one of claims 1 to 6, further comprising a release film. 樹脂層Ａは、厚さが０．１μｍ〜１００μｍであることを特徴とする請求項１〜７の何れかに記載のプレス接着用導電性フィルム。   The conductive layer for press bonding according to any one of claims 1 to 7, wherein the resin layer A has a thickness of 0.1 µm to 100 µm. 請求項１〜８の何れかに記載のプレス接着用導電性フィルムを用いて形成された電子部品パッケージ。   The electronic component package formed using the electroconductive film for press bonding in any one of Claims 1-8. 電子部品が実装され、該電子部品がモールド樹脂で封止されてなる構成を備えたプリント配線基板に、請求項１〜８の何れかに記載のプレス接着用導電性フィルムの樹脂層Ａ側を重ねて、樹脂層Ａの樹脂、或いは、樹脂層Ａ及びＢの樹脂、或いは、樹脂層Ａ及びＣの樹脂を加熱して軟化させて、該プレス接着用導電性フィルムを基板側にプレスし、さらに加熱して、前記で軟化させた樹脂を硬化させることを特徴とする、電子部品パッケージの製造方法。   A printed wiring board having a configuration in which an electronic component is mounted and the electronic component is sealed with a mold resin, the resin layer A side of the conductive film for press bonding according to any one of claims 1 to 8 is provided. The resin layer A, the resin layers A and B, or the resin layers A and C are heated and softened to press the conductive film for press bonding to the substrate side. A method of manufacturing an electronic component package, further comprising heating and curing the softened resin. 前記プリント配線基板が、ハーフダイシングにより切込み溝が設けられた構成を備えている場合、当該切込み溝は、樹脂層Ａの樹脂、或いは、樹脂層Ａ及びＢの樹脂、或いは、樹脂層Ａ及びＣの樹脂で充填されることを特徴とする、請求項１０に記載の電子部品パッケージの製造方法。

In the case where the printed wiring board has a configuration in which a cut groove is provided by half dicing, the cut groove is a resin of the resin layer A, a resin of the resin layers A and B, or a resin layer A and C. The method of manufacturing an electronic component package according to claim 10, wherein the electronic component package is filled with a resin.

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017102408A (en) * 2015-12-04 2017-06-08 東ソー株式会社 Fine particle arrangement film and antireflection film
WO2017160468A1 (en) * 2016-03-18 2017-09-21 Intel Corporation Systems and methods for eloectromagnetic interference shielding
WO2017172076A1 (en) * 2016-04-01 2017-10-05 Intel Corporation Semiconductor package having an emi shielding layer
JP6329314B1 (en) * 2017-09-28 2018-05-23 タツタ電線株式会社 Conductive adhesive sheet
WO2018151139A1 (en) * 2017-02-17 2018-08-23 日立化成株式会社 Adhesive film
JP2019065142A (en) * 2017-09-29 2019-04-25 東洋インキＳｃホールディングス株式会社 Adhesive sheet for heat release, laminate for heal release adhesive member, and composite member
US11242472B2 (en) * 2017-02-17 2022-02-08 Showa Denko Materials Co., Ltd. Adhesive film

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6190528B2 (en) * 2014-06-02 2017-08-30 タツタ電線株式会社 Conductive adhesive film, printed circuit board, and electronic device
JP2019029549A (en) * 2017-08-01 2019-02-21 住友ベークライト株式会社 Film set
JP6504302B1 (en) 2018-06-12 2019-04-24 東洋インキＳｃホールディングス株式会社 Electromagnetic wave shield sheet, component mounting board, and electronic device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001064807A1 (en) * 2000-02-29 2001-09-07 Matsushita Electric Industrial Co., Ltd. Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same
JP2003045229A (en) * 2001-07-27 2003-02-14 Toppan Forms Co Ltd Conductive adhesion and mounting method of ic chip using the same
JP2004079855A (en) * 2002-08-20 2004-03-11 Sumitomo Electric Printed Circuit Inc Printed circuit board
JP2005146044A (en) * 2003-11-12 2005-06-09 Sumitomo Electric Ind Ltd Anisotropic conductive adhesive
JP2010150362A (en) * 2008-12-25 2010-07-08 Sumitomo Electric Ind Ltd Film adhesive and anisotropically conductive adhesive
WO2012164925A1 (en) * 2011-05-31 2012-12-06 東洋インキＳｃホールディングス株式会社 Electrically conductive sheet and process for producing same, and electronic component

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3491595B2 (en) * 2000-02-25 2004-01-26 ソニーケミカル株式会社 Anisotropic conductive adhesive film

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001064807A1 (en) * 2000-02-29 2001-09-07 Matsushita Electric Industrial Co., Ltd. Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same
JP2003045229A (en) * 2001-07-27 2003-02-14 Toppan Forms Co Ltd Conductive adhesion and mounting method of ic chip using the same
JP2004079855A (en) * 2002-08-20 2004-03-11 Sumitomo Electric Printed Circuit Inc Printed circuit board
JP2005146044A (en) * 2003-11-12 2005-06-09 Sumitomo Electric Ind Ltd Anisotropic conductive adhesive
JP2010150362A (en) * 2008-12-25 2010-07-08 Sumitomo Electric Ind Ltd Film adhesive and anisotropically conductive adhesive
WO2012164925A1 (en) * 2011-05-31 2012-12-06 東洋インキＳｃホールディングス株式会社 Electrically conductive sheet and process for producing same, and electronic component

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017102408A (en) * 2015-12-04 2017-06-08 東ソー株式会社 Fine particle arrangement film and antireflection film
US10615128B2 (en) 2016-03-18 2020-04-07 Intel Corporation Systems and methods for electromagnetic interference shielding
WO2017160468A1 (en) * 2016-03-18 2017-09-21 Intel Corporation Systems and methods for eloectromagnetic interference shielding
US9953929B2 (en) 2016-03-18 2018-04-24 Intel Corporation Systems and methods for electromagnetic interference shielding
WO2017172076A1 (en) * 2016-04-01 2017-10-05 Intel Corporation Semiconductor package having an emi shielding layer
US9991211B2 (en) 2016-04-01 2018-06-05 Intel Corporation Semiconductor package having an EMI shielding layer
WO2018151139A1 (en) * 2017-02-17 2018-08-23 日立化成株式会社 Adhesive film
JP7347576B2 (en) 2017-02-17 2023-09-20 株式会社レゾナック adhesive film
KR102501133B1 (en) * 2017-02-17 2023-02-17 레조낙 가부시끼가이샤 adhesive film
KR20190117623A (en) * 2017-02-17 2019-10-16 히타치가세이가부시끼가이샤 Adhesive film
JPWO2018151139A1 (en) * 2017-02-17 2019-12-12 日立化成株式会社 Adhesive film
JP2022109272A (en) * 2017-02-17 2022-07-27 昭和電工マテリアルズ株式会社 adhesive film
US11242472B2 (en) * 2017-02-17 2022-02-08 Showa Denko Materials Co., Ltd. Adhesive film
JP7107231B2 (en) 2017-02-17 2022-07-27 昭和電工マテリアルズ株式会社 adhesive film
US11319466B2 (en) 2017-02-17 2022-05-03 Showa Denko Materials Co., Ltd. Adhesive film
JP6329314B1 (en) * 2017-09-28 2018-05-23 タツタ電線株式会社 Conductive adhesive sheet
JP2019065069A (en) * 2017-09-28 2019-04-25 タツタ電線株式会社 Conductive adhesive sheet
JP7031203B2 (en) 2017-09-29 2022-03-08 東洋インキＳｃホールディングス株式会社 Adhesive sheet for heat dissipation, laminate for heat dissipation adhesive member, and composite member
JP2019065142A (en) * 2017-09-29 2019-04-25 東洋インキＳｃホールディングス株式会社 Adhesive sheet for heat release, laminate for heal release adhesive member, and composite member

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