JP2013537967A - ピエゾ抵抗センサ・チップ素子を有する圧力センサ - Google Patents
ピエゾ抵抗センサ・チップ素子を有する圧力センサ Download PDFInfo
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- JP2013537967A JP2013537967A JP2013526291A JP2013526291A JP2013537967A JP 2013537967 A JP2013537967 A JP 2013537967A JP 2013526291 A JP2013526291 A JP 2013526291A JP 2013526291 A JP2013526291 A JP 2013526291A JP 2013537967 A JP2013537967 A JP 2013537967A
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- 239000000853 adhesive Substances 0.000 claims abstract description 62
- 230000001070 adhesive effect Effects 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 238000004891 communication Methods 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 description 10
- 239000012528 membrane Substances 0.000 description 9
- 238000005259 measurement Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/0038—Fluidic connecting means being part of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/0046—Fluidic connecting means using isolation membranes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
Description
2 センサ・チップ素子、素子
3 チップ
4 チップ・ベース
5 素子下面、下面
6 基板、貫通路
7 基板上面
8 接着領域
9 非接着領域
10 下面の外縁部
11 絶縁部材
12 ハウジング
13 膜
14 圧力媒体、圧力チャンバ
15 中央に位置付けられた円形領域
16 連通領域
17 センサ軸
18 円形ライン、センサ軸と同軸
19 下面のコーナー・ポイント
20 凹部、ドリルホール
21 凹部又はドリルホールの直径
22 素子下面の縁部の長さ
23 素子下面の対角線
24 接着剤物質
25 接点
26 圧力チャンバ
27 閉じたチップ・キャビティ
Claims (12)
- 圧力センサであって、前記圧力センサは、
ピエゾ抵抗センサ・チップ素子2であって、前記ピエゾ抵抗センサ・チップ素子2は、素子2の周りを流れる圧力媒体14の圧力を測定するために、閉じたチップ・キャビティ27を有し、前記素子2は、素子下面5を有する、ピエゾ抵抗センサ・チップ素子2と、
基板上面7を有する基板6であって、前記基板上面7に前記センサ・チップ素子2がその下面5で固定される、基板6とを含み、
前記下面5は、接着領域8を含み且つ外縁部10を有し、前記下面5は、前記接着領域8で前記基板上面7に接着され、下面5は、下面5が前記基板上面7に接着しない非接着領域9を有し、前記非接着領域9は、前記下面5の中央に位置付けられた、少なくとも円形領域15上に延在し、前記円形領域15は、前記素子下面5の全表面積の3分の1を占めており、前記非接着領域9は、前記円形領域15から前記下面5の縁部10までの少なくとも1つの連通領域16を含み、前記圧力媒体14の圧力が前記連通領域16を通して前記素子下面5の前記非接着領域9の下の空間内に及ぶことができるようになっている、圧力センサにおいて、
前記基板6は、前記センサ・チップ素子2の下の中央に位置付けられた凹部20を有する、ことを特徴とする圧力センサ。 - 前記凹部20がドリルホールであることを特徴とする、請求項1に記載の圧力センサ。
- 前記素子下面5が長方形であり、前記凹部20の直径が、縁部の長さ22よりも大きく前記素子下面5の対角線23よりも小さいことを特徴とする、請求項1又は2に記載の圧力センサ。
- 前記非接着領域9が、前記素子下面5に対向して位置付けられた少なくとも前記凹部20の領域を占有することを特徴とする、請求項1から3までのいずれか一項に記載の圧力センサ。
- 前記凹部20が、前記下面5の中央に位置付けられた、少なくとも円形領域15上に延在し、前記円形領域15は、前記素子下面5の全表面積の3分の1を占有しており、前記凹部20が、前記円形領域15から前記下面5の縁部10までの少なくとも1つの連通領域16を含み、前記圧力媒体14の圧力が前記連通領域16を通して前記素子下面5の前記非接着領域9の下の空間内に及ぶことができるようになっていることを特徴とする、請求項1から4までのいずれか一項に記載の圧力センサ。
- 前記接着領域8が、センサ軸17と同軸の、実質的に円形のライン18に適用されることを特徴とする、請求項1から5までのいずれか一項に記載の圧力センサ。
- 前記接着領域8が、個々に離れた点又は個々に離れたセグメントからなることを特徴とする、請求項1から6までのいずれか一項に記載の圧力センサ。
- 前記接着領域8が、前記下面5のコーナー・ポイント19に取り付けられることを特徴とする、請求項1から7までのいずれかに記載の圧力センサ。
- 前記接着領域8が、合計で前記素子下面5の20%未満、好ましくは5%未満を占有することを特徴とする、請求項1から8までのいずれか一項に記載の圧力センサ。
- 前記センサが、5.0×106N/m2(50バール)よりも高い圧力を測定するのに適切な高圧センサであることを特徴とする、請求項1から9までのいずれか一項に記載の圧力センサ。
- 前記センサ・チップ素子2が、接着剤物質24を介して前記基板6に接着されることを特徴とする、請求項1から10までのいずれか一項に記載の圧力センサ。
- 前記接着剤物質24が、少なくとも100%、好ましくは200%の線形拡張を維持することができることを特徴とする、請求項11に記載の圧力センサ。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37907210P | 2010-09-01 | 2010-09-01 | |
US61/379,072 | 2010-09-01 | ||
CH01462/10A CH703737A1 (de) | 2010-09-13 | 2010-09-13 | Drucksensor mit piezoresistivem sensorchip-element. |
CH1462/10 | 2010-09-13 | ||
PCT/CH2011/000196 WO2012027853A1 (de) | 2010-09-01 | 2011-08-29 | Drucksensor mit piezoresistivem sensorchip-element |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013537967A true JP2013537967A (ja) | 2013-10-07 |
JP2013537967A5 JP2013537967A5 (ja) | 2014-10-16 |
JP5715698B2 JP5715698B2 (ja) | 2015-05-13 |
Family
ID=43031550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013526291A Active JP5715698B2 (ja) | 2010-09-01 | 2011-08-29 | ピエゾ抵抗センサ・チップ素子を有する圧力センサ |
Country Status (6)
Country | Link |
---|---|
US (1) | US8567256B2 (ja) |
EP (1) | EP2612125B1 (ja) |
JP (1) | JP5715698B2 (ja) |
CN (1) | CN103080718B (ja) |
CH (1) | CH703737A1 (ja) |
WO (1) | WO2012027853A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016017290A1 (ja) * | 2014-07-31 | 2016-02-04 | 日立オートモティブシステムズ株式会社 | 圧力センサ |
JP2018066581A (ja) * | 2016-10-17 | 2018-04-26 | 株式会社デンソー | 半導体装置 |
US10890502B2 (en) | 2017-09-08 | 2021-01-12 | Fuji Electric Co., Ltd. | Pressure sensor device |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5974595B2 (ja) * | 2012-04-03 | 2016-08-23 | ミツミ電機株式会社 | 半導体センサ及びその製造方法 |
US20150248159A1 (en) * | 2013-06-19 | 2015-09-03 | Florida State University Research Foundation, Inc. | Piezoresistive sensors and methods |
EP2840375A1 (en) * | 2013-08-19 | 2015-02-25 | Sensirion AG | Device with a micro- or nanoscale structure |
TW201511552A (zh) * | 2013-09-05 | 2015-03-16 | Hon Hai Prec Ind Co Ltd | 相機模組及其組裝方法 |
EP2871456B1 (en) | 2013-11-06 | 2018-10-10 | Invensense, Inc. | Pressure sensor and method for manufacturing a pressure sensor |
EP2871455B1 (en) | 2013-11-06 | 2020-03-04 | Invensense, Inc. | Pressure sensor |
EP3076146B1 (en) | 2015-04-02 | 2020-05-06 | Invensense, Inc. | Pressure sensor |
PT3397702T (pt) | 2015-12-29 | 2021-11-18 | Univ Do Minho | Tinta piezorresistiva, métodos e utilizações da mesma |
JP2017134014A (ja) * | 2016-01-29 | 2017-08-03 | 株式会社鷺宮製作所 | 圧力センサ |
US10247632B2 (en) * | 2016-06-23 | 2019-04-02 | Honeywell International | Oil filled gage reference side protection |
WO2018099635A1 (de) * | 2016-11-30 | 2018-06-07 | Kistler Holding Ag | Messwertaufnehmer zum messen einer kraft |
US11225409B2 (en) | 2018-09-17 | 2022-01-18 | Invensense, Inc. | Sensor with integrated heater |
KR102584352B1 (ko) | 2019-02-27 | 2023-09-27 | 키스틀러 홀딩 아게 | 센서 |
US11354161B2 (en) | 2020-08-10 | 2022-06-07 | Bank Of America Corporation | Controlling memory utilization by a topic in a publish-subscribe environment |
US11340828B2 (en) | 2020-08-10 | 2022-05-24 | Bank Of America Corporation | Restoring messages to a memory utilized by a topic in a publish-subscribe environment |
WO2023218189A1 (en) | 2022-05-10 | 2023-11-16 | Ramsay Technologies Ltd | A sensor device and a method of forming a sensor device |
WO2023223021A1 (en) | 2022-05-16 | 2023-11-23 | Ramsay Technologies Ltd | An item of protective equipment |
CN116380330B (zh) * | 2023-05-31 | 2023-10-24 | 成都凯天电子股份有限公司 | 一种用于高温的无液体压阻式碳化硅压力传感器 |
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2010
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-
2011
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- 2011-08-29 JP JP2013526291A patent/JP5715698B2/ja active Active
- 2011-08-29 US US13/819,450 patent/US8567256B2/en active Active
- 2011-08-29 EP EP11751529.6A patent/EP2612125B1/de active Active
- 2011-08-29 CN CN201180042379.7A patent/CN103080718B/zh active Active
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WO2016017290A1 (ja) * | 2014-07-31 | 2016-02-04 | 日立オートモティブシステムズ株式会社 | 圧力センサ |
JP2016033460A (ja) * | 2014-07-31 | 2016-03-10 | 日立オートモティブシステムズ株式会社 | 圧力センサ |
JP2018066581A (ja) * | 2016-10-17 | 2018-04-26 | 株式会社デンソー | 半導体装置 |
US10890502B2 (en) | 2017-09-08 | 2021-01-12 | Fuji Electric Co., Ltd. | Pressure sensor device |
Also Published As
Publication number | Publication date |
---|---|
JP5715698B2 (ja) | 2015-05-13 |
CN103080718A (zh) | 2013-05-01 |
EP2612125A1 (de) | 2013-07-10 |
US20130167650A1 (en) | 2013-07-04 |
CN103080718B (zh) | 2015-02-11 |
CH703737A1 (de) | 2012-03-15 |
WO2012027853A1 (de) | 2012-03-08 |
EP2612125B1 (de) | 2015-01-14 |
US8567256B2 (en) | 2013-10-29 |
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