JP2013529383A - 一体型半導体処理装置 - Google Patents
一体型半導体処理装置 Download PDFInfo
- Publication number
- JP2013529383A JP2013529383A JP2013509001A JP2013509001A JP2013529383A JP 2013529383 A JP2013529383 A JP 2013529383A JP 2013509001 A JP2013509001 A JP 2013509001A JP 2013509001 A JP2013509001 A JP 2013509001A JP 2013529383 A JP2013529383 A JP 2013529383A
- Authority
- JP
- Japan
- Prior art keywords
- hoop
- space
- processing apparatus
- wafer
- integrated semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 title claims abstract description 88
- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 235000012431 wafers Nutrition 0.000 claims abstract description 107
- 238000012546 transfer Methods 0.000 claims abstract description 78
- 238000000034 method Methods 0.000 claims abstract description 54
- 238000003860 storage Methods 0.000 claims description 9
- 238000005192 partition Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【選択図】図2
Description
前記一体型半導体処理本体の第1空間に設置され、前記フープを開いて前記フープ内部のウェハーを引き出すことができるようにするロードポートモジュールと;
前記フープ内部のウェハーを引き出して前記第2空間の工程処理装置に移送する移送装置とを含むことを特徴とする。
11 第1空間
12 第2空間
20 ロードポートモジュール
30 移送装置
40 工程処理装置
50 フープ移送ロボット
Claims (9)
- 複数のウェハーを保存している複数のフープを保存する第1空間と、前記第1空間に保存されたウェハーを工程処理する工程処理装置を備えた第2空間とが形成された一体型半導体処理本体;
前記一体型半導体処理本体の第1空間に設置され、前記フープを開いて前記フープ内部のウェハーを引き出すことができるようにするロードポートモジュール;及び
前記フープ内部のウェハーを引き出して前記第2空間の工程処理装置に運送する移送装置;を含むことを特徴とする、一体型半導体処理装置。 - 前記第1空間は1個〜40個のフープを保存することを特徴とする、請求項1に記載の一体型半導体処理装置。
- 前記ロードポートモジュールは前記第1空間に複数設置され、その中で一つ以上はフープの内部に保存された未処理ウェハーを前記工程処理装置に供給し、残りは前記工程処理装置で処理されたウェハーを工程処理装置からフープに再び保存させることができるようにしたことを特徴とする、請求項1に記載の一体型半導体処理装置。
- 前記第1空間に設置され、フープを保存位置と前記ロードポートモジュールに移送することができるフープ移送ロボットをさらに含むことを特徴とする、請求項1に記載の一体型半導体処理装置。
- 前記フープ移送ロボットは、フープを持ち上げる移送アーム部;及び
前記移送アーム部を回転させるアーム回転部を含むことを特徴とする、請求項4に記載の一体型半導体処理装置。 - 前記フープ移送ロボットは、フープを持ち上げる移送アーム部を含み、
前記移送アーム部は前後側にそれぞれ備えられたことを特徴とする、請求項4に記載の一体型半導体処理装置。 - 前記工程処理装置は、ウェハーを熱処理する熱処理装置と食刻及び蒸着する装置のいずれか一つであることを特徴とする、請求項1に記載の一体型半導体処理装置。
- 前記一体型半導体処理本体内には、前記第1空間と第2空間を区分し、前記第1空間及び前記第2空間を連通して、フープの内部に保存されたウェハーを前記第1空間から前記第2空間内の前記工程処理装置内に供給することができるようにする連結通路が形成された空間区画壁部が備えられることを特徴とする、請求項1に記載の一体型半導体処理装置。
- 前記一体型半導体処理本体内には、前記連結通路を開閉することができる空間開閉ドアが備えられたことを特徴とする、請求項8に記載の一体型半導体処理装置。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100042747 | 2010-05-07 | ||
KR10-2010-0042747 | 2010-05-07 | ||
KR1020110043022A KR101152271B1 (ko) | 2010-05-07 | 2011-05-06 | 일체형 반도체 처리 장치 |
KR10-2011-0043022 | 2011-05-06 | ||
PCT/KR2011/003411 WO2011139124A2 (ko) | 2010-05-07 | 2011-05-06 | 일체형 반도체 처리 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013529383A true JP2013529383A (ja) | 2013-07-18 |
Family
ID=45393798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013509001A Pending JP2013529383A (ja) | 2010-05-07 | 2011-05-06 | 一体型半導体処理装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130055954A1 (ja) |
JP (1) | JP2013529383A (ja) |
KR (1) | KR101152271B1 (ja) |
CN (1) | CN103003916A (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101226747B1 (ko) * | 2012-02-24 | 2013-01-25 | 유정호 | 일체형 반도체 처리 장치 |
KR101461026B1 (ko) * | 2013-09-23 | 2014-11-13 | 피에스케이 주식회사 | 기판 처리 장치 |
KR102160106B1 (ko) * | 2014-07-03 | 2020-09-25 | 세메스 주식회사 | 웨이퍼 이송 장치 |
US10332770B2 (en) | 2014-09-24 | 2019-06-25 | Sandisk Technologies Llc | Wafer transfer system |
GB201701166D0 (en) * | 2017-01-24 | 2017-03-08 | Picofluidics Ltd | An apparatus for electrochemically processing semiconductor substrates |
JP1643723S (ja) * | 2018-10-31 | 2019-10-21 | ||
USD917585S1 (en) * | 2018-10-31 | 2021-04-27 | Hamamatsu Photonics K.K. | Wafer processing machine for producing semiconductors |
JP1630148S (ja) * | 2018-10-31 | 2019-04-22 | ||
JP1629892S (ja) * | 2018-10-31 | 2019-04-22 | ||
JP1629891S (ja) * | 2018-10-31 | 2019-04-22 | ||
JP1633756S (ja) * | 2018-10-31 | 2019-06-10 | ||
CN109326547B (zh) * | 2018-11-16 | 2023-11-10 | 罗博特科智能科技股份有限公司 | 花篮内循环装置 |
KR102292126B1 (ko) * | 2021-05-20 | 2021-08-19 | 김태민 | 풉이송장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06286811A (ja) * | 1992-06-04 | 1994-10-11 | Murata Mach Ltd | 移載装置 |
JPH09205125A (ja) * | 1996-01-24 | 1997-08-05 | Shinko Electric Co Ltd | 密閉コンテナの開閉システム |
JP2008053596A (ja) * | 2006-08-28 | 2008-03-06 | Shinko Electric Co Ltd | ロードポート装置 |
JP2008182255A (ja) * | 2000-04-17 | 2008-08-07 | Hitachi Kokusai Electric Inc | 基板の搬送方法、基板処理方法および半導体装置の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100265287B1 (ko) * | 1998-04-21 | 2000-10-02 | 윤종용 | 반도체소자 제조용 식각설비의 멀티챔버 시스템 |
US6790286B2 (en) * | 2001-01-18 | 2004-09-14 | Dainippon Screen Mfg. Co. Ltd. | Substrate processing apparatus |
JP4124449B2 (ja) * | 2003-03-28 | 2008-07-23 | 大日本スクリーン製造株式会社 | 基板処理装置 |
KR100578134B1 (ko) * | 2003-11-10 | 2006-05-10 | 삼성전자주식회사 | 멀티 챔버 시스템 |
KR100761576B1 (ko) * | 2004-12-24 | 2007-09-27 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판 처리장치 |
JP2006237559A (ja) * | 2005-01-28 | 2006-09-07 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
CN100413047C (zh) * | 2005-01-28 | 2008-08-20 | 大日本网目版制造株式会社 | 基板处理装置 |
KR101015225B1 (ko) * | 2008-07-07 | 2011-02-18 | 세메스 주식회사 | 기판 처리장치 및 이의 기판 이송 방법 |
-
2011
- 2011-05-06 CN CN2011800230031A patent/CN103003916A/zh active Pending
- 2011-05-06 KR KR1020110043022A patent/KR101152271B1/ko not_active IP Right Cessation
- 2011-05-06 JP JP2013509001A patent/JP2013529383A/ja active Pending
- 2011-05-06 US US13/696,529 patent/US20130055954A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06286811A (ja) * | 1992-06-04 | 1994-10-11 | Murata Mach Ltd | 移載装置 |
JPH09205125A (ja) * | 1996-01-24 | 1997-08-05 | Shinko Electric Co Ltd | 密閉コンテナの開閉システム |
JP2008182255A (ja) * | 2000-04-17 | 2008-08-07 | Hitachi Kokusai Electric Inc | 基板の搬送方法、基板処理方法および半導体装置の製造方法 |
JP2008053596A (ja) * | 2006-08-28 | 2008-03-06 | Shinko Electric Co Ltd | ロードポート装置 |
Also Published As
Publication number | Publication date |
---|---|
US20130055954A1 (en) | 2013-03-07 |
CN103003916A (zh) | 2013-03-27 |
KR101152271B1 (ko) | 2012-06-08 |
KR20110123695A (ko) | 2011-11-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2013529383A (ja) | 一体型半導体処理装置 | |
KR100285408B1 (ko) | 기판처리장치,기판반송기 및 기판반송장치 | |
TWI706051B (zh) | 用於基板載入之方法與裝備 | |
KR20100122893A (ko) | 로드락 장치 및 기판 냉각 방법 | |
JP7183635B2 (ja) | 基板搬送機構、基板処理装置及び基板搬送方法 | |
JP2011071293A (ja) | プロセスモジュール、基板処理装置、および基板搬送方法 | |
KR102244354B1 (ko) | 기판 반송 기구, 기판 처리 장치 및 기판 반송 방법 | |
JP6306813B2 (ja) | モジュール式半導体処理システム | |
KR101530024B1 (ko) | 기판 처리 모듈, 이를 포함하는 기판 처리 장치 및 기판 전달 방법 | |
WO2018016257A1 (ja) | 基板処理装置 | |
JP6212063B2 (ja) | 基板搬送ロボット及びそれを用いた基板処理装置 | |
JP5526988B2 (ja) | 基板処理装置及び基板処理システム | |
JP2015511399A (ja) | 基板処理モジュール及びそれを含む基板処理装置 | |
JP2018098387A (ja) | 基板処理装置 | |
JP2012054392A (ja) | 基板処理装置及び半導体装置の製造方法 | |
JP2014060338A (ja) | 基板処理装置 | |
KR20110123696A (ko) | 반도체 처리 장치의 카세트 이송 로봇 | |
TWI763945B (zh) | 基板處理裝置、半導體裝置的製造方法及電腦程式產品 | |
JP6031304B2 (ja) | 基板処理装置及び基板処理方法 | |
KR101226747B1 (ko) | 일체형 반도체 처리 장치 | |
JP5002050B2 (ja) | 基板処理システムおよび基板搬送方法 | |
JP2000174094A (ja) | 半導体製造装置 | |
KR20100093994A (ko) | 기판처리시스템 | |
KR101661217B1 (ko) | 로드 포트 그리고 그것을 갖는 클러스터 설비 | |
JP2013055363A (ja) | プロセスモジュール、基板処理装置、および基板搬送方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130917 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20131217 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20131225 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140114 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140415 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140711 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140718 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140805 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20150331 |