JP2013219468A - 撮像モジュール - Google Patents
撮像モジュール Download PDFInfo
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- JP2013219468A JP2013219468A JP2012086723A JP2012086723A JP2013219468A JP 2013219468 A JP2013219468 A JP 2013219468A JP 2012086723 A JP2012086723 A JP 2012086723A JP 2012086723 A JP2012086723 A JP 2012086723A JP 2013219468 A JP2013219468 A JP 2013219468A
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- 230000003287 optical effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 11
- 238000001723 curing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
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- 230000008569 process Effects 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- 239000000945 filler Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
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- 229910052751 metal Inorganic materials 0.000 description 2
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- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
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- 239000000843 powder Substances 0.000 description 1
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- 239000003566 sealing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00064—Constructional details of the endoscope body
- A61B1/0011—Manufacturing of endoscope parts
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
- A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/17—Bodies with reflectors arranged in beam forming the photographic image, e.g. for reducing dimensions of camera
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/555—Constructional details for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Endoscopes (AREA)
Abstract
【解決手段】撮像モジュール10は、撮像素子の受光部21と受光部21と接続された複数の電極22とが主面に形成された撮像チップ20と、複数の電極22のそれぞれと接合されたフライングリード31を有する配線板30と、を具備する。
【選択図】図3
Description
図2および図3に示すように、実施形態の撮像モジュール10は、撮像チップ20に、配線板30とプリズム50とが接合されている。撮像チップ20の主面20SAには、固体撮像素子の受光部21と、受光部21と内部配線24を介して接続された複数の電極22と、が形成されている。そして、複数の電極22のそれぞれは、バンプ23を介して、配線板30のフライングリード31と接合されている。なお、撮像モジュール10では、撮像チップ20の後端側の端面20Lと配線板30の先端側の端面30Lとは、オーバーラップしている。
シリコンウエハの主面20SAに、公知の半導体プロセスにより、複数の受光部21と、それぞれの受光部21と接続された複数の電極22、が形成されることで、撮像チップ基板が作製される。そして、撮像チップ基板が切断され、複数の撮像チップ20が作製される。
次に第2実施形態の撮像モジュール10Aについて説明する。撮像モジュール10Aは撮像モジュール10と類似しているので、同じ構成要素には同じ符号を付し説明は省略する。
次に第3実施形態の撮像モジュール10Bについて説明する。撮像モジュール10Bは撮像モジュール10等と類似しているので、同じ構成要素には同じ符号を付し説明は省略する。
次に第4実施形態の撮像モジュール10Cについて説明する。撮像モジュール10Cは撮像モジュール10等と類似しているので、同じ構成要素には同じ符号を付し説明は省略する。
次に第5実施形態の撮像モジュール10Dについて説明する。撮像モジュール10Dは撮像モジュール10等と類似しているので、同じ構成要素には同じ符号を付し説明は省略する。
10、10A〜10D…撮像モジュール、20…撮像チップ、20L…撮像チップの端面、20SA…撮像チップの主面、21…受光部、22…電極、23…バンプ、24…内部配線、30…配線板、30L…配線版の端面、31…フライングリード、32…電子部品、35…封止樹脂、40…接着層、50…プリズム
Claims (8)
- 撮像素子の受光部と、前記受光部と接続された複数の電極と、が主面に形成された撮像チップと、
前記複数の電極のそれぞれと接合されたフライングリードを有する配線板と、を具備することを特徴とする撮像モジュール。 - 前記撮像チップの端面と前記配線板の端面とが、重なり合っていないことを特徴とする請求項1に記載の撮像モジュール。
- 前記フライングリードの先端部に局所的にエネルギーを印加することにより、前記フライングリードが前記電極と接合されていることを特徴とする請求項1または請求項2に記載の撮像モジュール。
- 前記フライングリードを封止する封止部を具備することを特徴とする請求項1から請求項3のいずれか1項に記載の撮像モジュール。
- 前記配線板に電子部品が表面実装されており、
前記封止部が、前記光学部品と前記電子部品との間に配設された液体状樹脂の硬化により形成されていることを特徴とする請求項4に記載の撮像モジュール。 - 前記主面と平行方向からの入射光が前記受光部に入射するように、前記入射光の方向を変える光学部品を具備することを特徴とする請求項1から請求項5のいずれか1項に記載の撮像モジュール。
- 前記フライングリードが折り曲げられていることを特徴とする請求項1から請求項6のいずれか1項に記載の撮像モジュール。
- 前記撮像チップに端面からの距離が異なる電極が主面に形成されており、
前記配線板が、長さが異なるフライングリードを有することを特徴とする請求項1から請求項7のいずれか1項に記載の撮像モジュール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012086723A JP6124505B2 (ja) | 2012-04-05 | 2012-04-05 | 撮像モジュール |
PCT/JP2013/052544 WO2013150813A1 (ja) | 2012-04-05 | 2013-02-05 | 撮像モジュール |
US14/504,644 US9520434B2 (en) | 2012-04-05 | 2014-10-02 | Image pickup module |
Applications Claiming Priority (1)
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---|---|---|---|
JP2012086723A JP6124505B2 (ja) | 2012-04-05 | 2012-04-05 | 撮像モジュール |
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JP2013219468A true JP2013219468A (ja) | 2013-10-24 |
JP6124505B2 JP6124505B2 (ja) | 2017-05-10 |
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JP2012086723A Active JP6124505B2 (ja) | 2012-04-05 | 2012-04-05 | 撮像モジュール |
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US (1) | US9520434B2 (ja) |
JP (1) | JP6124505B2 (ja) |
WO (1) | WO2013150813A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017037828A1 (ja) * | 2015-08-31 | 2017-03-09 | オリンパス株式会社 | 内視鏡、電子ユニットおよび電子ユニットの製造方法 |
WO2017158722A1 (ja) * | 2016-03-15 | 2017-09-21 | オリンパス株式会社 | 撮像装置、内視鏡、及び、撮像装置の製造方法 |
US10039437B2 (en) | 2015-03-10 | 2018-08-07 | Olympus Corporation | Image pickup apparatus for endoscope |
US10484581B2 (en) | 2015-06-22 | 2019-11-19 | Olympus Corporation | Image pickup apparatus for endoscope |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105263393B (zh) * | 2013-03-15 | 2018-10-26 | 德普伊新特斯产品公司 | 与成角度的内窥镜一起使用的带有整合式棱镜的观察套管针 |
CN106031150A (zh) * | 2014-02-24 | 2016-10-12 | 奥林巴斯株式会社 | 摄像装置和摄像装置的制造方法 |
US10326919B2 (en) * | 2016-10-19 | 2019-06-18 | Olympus Corporation | Method for manufacturing endoscope image pickup module, endoscope image pickup module and endoscope |
JP6850200B2 (ja) * | 2017-05-31 | 2021-03-31 | 富士フイルム株式会社 | 内視鏡及び内視鏡装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07142690A (ja) * | 1993-11-22 | 1995-06-02 | Olympus Optical Co Ltd | 撮像装置 |
JPH08131400A (ja) * | 1994-11-09 | 1996-05-28 | Toshiba Corp | 内視鏡装置 |
JPH09146011A (ja) * | 1995-11-17 | 1997-06-06 | Olympus Optical Co Ltd | 撮像装置 |
JPH11354766A (ja) * | 1998-06-10 | 1999-12-24 | Matsushita Electron Corp | 固体撮像装置 |
JP2001017389A (ja) * | 1999-07-07 | 2001-01-23 | Olympus Optical Co Ltd | 固体撮像装置 |
JP2006055531A (ja) * | 2004-08-23 | 2006-03-02 | Olympus Corp | 内視鏡 |
JP2010268077A (ja) * | 2009-05-12 | 2010-11-25 | Olympus Medical Systems Corp | 撮像装置、撮像装置の製造方法 |
JP2011249870A (ja) * | 2010-05-21 | 2011-12-08 | Olympus Corp | 撮像装置 |
JP2012055489A (ja) * | 2010-09-08 | 2012-03-22 | Fujifilm Corp | 電子内視鏡用の撮像装置及び撮像装置の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3607160B2 (ja) * | 2000-04-07 | 2005-01-05 | 三菱電機株式会社 | 撮像装置 |
CN1185915C (zh) * | 2001-06-13 | 2005-01-19 | 佳能株式会社 | 柔性基板、半导体器件、摄像装置和放射线摄像*** |
JP2011192808A (ja) * | 2010-03-15 | 2011-09-29 | Fujifilm Corp | 撮像モジュール及びその製造方法並びに内視鏡装置 |
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2012
- 2012-04-05 JP JP2012086723A patent/JP6124505B2/ja active Active
-
2013
- 2013-02-05 WO PCT/JP2013/052544 patent/WO2013150813A1/ja active Application Filing
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2014
- 2014-10-02 US US14/504,644 patent/US9520434B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH07142690A (ja) * | 1993-11-22 | 1995-06-02 | Olympus Optical Co Ltd | 撮像装置 |
JPH08131400A (ja) * | 1994-11-09 | 1996-05-28 | Toshiba Corp | 内視鏡装置 |
JPH09146011A (ja) * | 1995-11-17 | 1997-06-06 | Olympus Optical Co Ltd | 撮像装置 |
JPH11354766A (ja) * | 1998-06-10 | 1999-12-24 | Matsushita Electron Corp | 固体撮像装置 |
JP2001017389A (ja) * | 1999-07-07 | 2001-01-23 | Olympus Optical Co Ltd | 固体撮像装置 |
JP2006055531A (ja) * | 2004-08-23 | 2006-03-02 | Olympus Corp | 内視鏡 |
JP2010268077A (ja) * | 2009-05-12 | 2010-11-25 | Olympus Medical Systems Corp | 撮像装置、撮像装置の製造方法 |
JP2011249870A (ja) * | 2010-05-21 | 2011-12-08 | Olympus Corp | 撮像装置 |
JP2012055489A (ja) * | 2010-09-08 | 2012-03-22 | Fujifilm Corp | 電子内視鏡用の撮像装置及び撮像装置の製造方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10039437B2 (en) | 2015-03-10 | 2018-08-07 | Olympus Corporation | Image pickup apparatus for endoscope |
US10484581B2 (en) | 2015-06-22 | 2019-11-19 | Olympus Corporation | Image pickup apparatus for endoscope |
WO2017037828A1 (ja) * | 2015-08-31 | 2017-03-09 | オリンパス株式会社 | 内視鏡、電子ユニットおよび電子ユニットの製造方法 |
US10356907B2 (en) | 2015-08-31 | 2019-07-16 | Olympus Corporation | Endoscope, electronic unit and method for manufacturing electronic unit |
WO2017158722A1 (ja) * | 2016-03-15 | 2017-09-21 | オリンパス株式会社 | 撮像装置、内視鏡、及び、撮像装置の製造方法 |
US11134829B2 (en) | 2016-03-15 | 2021-10-05 | Olympus Corporation | Image pickup apparatus, endoscope, and method for manufacturing image pickup apparatus |
Also Published As
Publication number | Publication date |
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JP6124505B2 (ja) | 2017-05-10 |
US9520434B2 (en) | 2016-12-13 |
WO2013150813A1 (ja) | 2013-10-10 |
US20150014805A1 (en) | 2015-01-15 |
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