JP2013146062A - Rfモジュール - Google Patents
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- JP2013146062A JP2013146062A JP2013000720A JP2013000720A JP2013146062A JP 2013146062 A JP2013146062 A JP 2013146062A JP 2013000720 A JP2013000720 A JP 2013000720A JP 2013000720 A JP2013000720 A JP 2013000720A JP 2013146062 A JP2013146062 A JP 2013146062A
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- 239000004020 conductor Substances 0.000 claims abstract description 83
- 239000000758 substrate Substances 0.000 claims abstract description 71
- 238000001914 filtration Methods 0.000 claims abstract 2
- 239000002184 metal Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 230000005540 biological transmission Effects 0.000 claims description 19
- 238000009413 insulation Methods 0.000 abstract 3
- 230000000052 comparative effect Effects 0.000 description 7
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/003—Coplanar lines
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0046—Printed inductances with a conductive path having a bridge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Waveguides (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
【解決手段】アンテナに接続される端子と、複数の絶縁層20、22、24、26と複数の導体層12、14,16,18とを積層した多層基板100における複数の導体層のうち接地配線14b、14cとして機能するコア10と、複数の導体層に含まれ、複数の絶縁層に含まれる絶縁層22を介してコア10に隣接し、アンテナで送受信される周波数の高周波信号を流すための信号配線14aと、コア10の信号配線14aと対向する領域に設けられた凹部10aと、高周波信号をフィルタリングするフィルタと、を具備し、コア10及び信号配線14aが形成するストリップラインはフィルタに接続されるRFモジュールである。
【選択図】図2
Description
Code Division Multiple Access)方式に対応するGHz帯の周波数、又はGSM(登録商標、Global System for
Mobile Communications)方式に対応する数百MHzの周波数を有するRF(Radio Frequency)信号等を含むものである。高周波信号以外の信号とは、例えば数Hz〜数十MHz程度の周波数を有する信号、又は直流信号等である。
絶縁層20の厚さt1:25μm
コア10の厚さt4:150μm
信号配線14aの線幅w:30μm
距離L1、L2、L3、L4:60μm
絶縁層20〜26各々の誘電率:3.4
コア10、導体層12〜18の材質:銅
Gain Amplifier:可変利得アンプ)62a〜62jを含む。IC60は、信号の周波数の変換を行う、ダイレクトコンバータとして機能する。
Acoustic Wave:弾性表面波)フィルタ、弾性境界波フィルタ、又はFBAR(Film Bulk Acoustic Resonator:圧電薄膜共振子)を用いたフィルタ等、弾性波フィルタとすることができる。
10a、10b 凹部
10c、10d、10e 金属板
12、14、16、18 導体層
20、22、24、26 絶縁層
12a、12b、12c、14a、14d、14e、14f、14g、15
信号配線
12d、14b、14c 接地配線
30 電子部品
40a、40b、40c、40d、40e、40f デュプレクサ
42 受信フィルタ
44 送信フィルタ
50 フィルタ回路
52 フィルタ
60 IC
100、100a、100b、200、300、400 多層基板
202 アンテナ
Claims (13)
- アンテナに接続される端子と、
複数の絶縁層と複数の導体層とを積層した多層基板における前記複数の導体層のうち接地配線として機能するコアと、
前記複数の導体層に含まれ、前記複数の絶縁層に含まれる第1絶縁層を介して前記コアに隣接し、アンテナで送受信される周波数の高周波信号を流すための第1信号配線と、
前記コアの前記第1信号配線と対向する領域に設けられた凹部と、
前記高周波信号をフィルタリングするフィルタと、を具備し、
前記コア及び前記第1信号配線が形成する伝送線路は前記フィルタに接続されることを特徴とするRFモジュール。 - 前記伝送線路は、前記フィルタと前記高周波信号を増幅する集積回路との間に設けられることを特徴とする請求項1記載のRFモジュール。
- 前記高周波信号が入力及び出力する複数のデュプレクサを具備し、
前記コア及び前記第1配線が形成する伝送線路は、前記複数のデュプレクサと接続されていることを特徴とする請求項1又は2記載のRFモジュール。 - 前記複数のデュプレクサが、前記アンテナに接続されるスイッチと接続されることを特徴とする請求項3記載のRFモジュール。
- 前記複数の導体層に含まれ、前記第1信号配線を挟んで、前記コアとは反対側に設けられた、前記コアとは別の第1接地配線を具備することを特徴とする請求項1から4いずれか一項記載のRFモジュール。
- 前記コアは、電子部品の少なくとも一部を収納することを特徴とする請求項1から5いずれか一項記載のRFモジュール。
- 前記第1接地配線は、前記複数の絶縁層に含まれ前記第1絶縁層とは別の第2絶縁層を介して前記第1信号配線と隣接することを特徴とする請求項5記載のRFモジュール。
- 前記複数の導体層のうち前記第1信号配線と同じ平面に位置する導体層に含まれ、前記第1信号配線の両側に位置する第2接地配線を具備することを特徴とする請求項1から7いずれか一項記載のRFモジュール。
- 前記第2接地配線と前記第1信号配線との距離は、前記複数の絶縁層と前記複数の導体層との積層方向に前記第1信号配線を前記コアに投影した投影領域と、前記凹部の側面との距離以上であることを特徴とする請求項8記載のRFモジュール。
- 前記複数の導体層に含まれ、前記コアを挟んで、前記第1信号配線とは反対側に設けられた、前記第1信号配線とは別の第2信号配線を具備することを特徴とする請求項1から9いずれか一項記載のRFモジュール。
- 前記第1信号配線は、スパイラルインダクタであることを特徴とする請求項1から10いずれか一項記載のRFモジュール。
- 前記コアを挟んで前記第1信号配線と反対側に設けられた、高周波信号を流すための第3信号配線を具備し、
前記コアの前記第3信号配線と対向する領域には、別の凹部が設けられていることを特徴とする請求項1から11いずれか一項記載のRFモジュール。 - 前記コアは、第1金属板と、開口部を有する第2金属板とを貼り合わせて形成されていることを特徴とする請求項1から12いずれか一項記載のRFモジュール。
Priority Applications (1)
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JP2013000720A JP5873446B2 (ja) | 2011-05-27 | 2013-01-07 | Rfモジュール |
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JP2011119512 | 2011-05-27 | ||
JP2011119512 | 2011-05-27 | ||
JP2013000720A JP5873446B2 (ja) | 2011-05-27 | 2013-01-07 | Rfモジュール |
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JP2011233277A Division JP5178899B2 (ja) | 2011-05-27 | 2011-10-24 | 多層基板 |
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JP2013146062A true JP2013146062A (ja) | 2013-07-25 |
JP5873446B2 JP5873446B2 (ja) | 2016-03-01 |
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JP2011233277A Expired - Fee Related JP5178899B2 (ja) | 2011-05-27 | 2011-10-24 | 多層基板 |
JP2013000720A Expired - Fee Related JP5873446B2 (ja) | 2011-05-27 | 2013-01-07 | Rfモジュール |
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US (2) | US8735732B2 (ja) |
JP (2) | JP5178899B2 (ja) |
KR (1) | KR101222257B1 (ja) |
CN (1) | CN102802341B (ja) |
DE (1) | DE102011121221A1 (ja) |
GB (1) | GB2491217B (ja) |
TW (1) | TWI445464B (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5306551B1 (ja) * | 2012-11-27 | 2013-10-02 | 太陽誘電株式会社 | 多層回路基板 |
JP6250934B2 (ja) * | 2013-01-25 | 2017-12-20 | 太陽誘電株式会社 | モジュール基板及びモジュール |
US9277641B2 (en) | 2013-04-04 | 2016-03-01 | Qualcomm Incorporated | Routing and shielding of signal lines to improve isolation |
US9400529B2 (en) * | 2013-09-27 | 2016-07-26 | Apple Inc. | Electronic device having housing with embedded interconnects |
US9729215B2 (en) | 2014-06-23 | 2017-08-08 | Samsung Electronics Co., Ltd. | OFDM signal compression |
US9391370B2 (en) * | 2014-06-30 | 2016-07-12 | Samsung Electronics Co., Ltd. | Antenna feed integrated on multi-layer PCB |
US20170092412A1 (en) * | 2015-09-26 | 2017-03-30 | Mathew J. Manusharow | Package integrated power inductors using lithographically defined vias |
WO2017154167A1 (ja) * | 2016-03-10 | 2017-09-14 | 三井金属鉱業株式会社 | 多層積層板及びこれを用いた多層プリント配線板の製造方法 |
US10447834B2 (en) | 2016-09-21 | 2019-10-15 | Apple Inc. | Electronic device having a composite structure |
CN107318219B (zh) * | 2017-08-21 | 2019-12-31 | Oppo广东移动通信有限公司 | 印制电路板和电子设备 |
CN107318220B (zh) * | 2017-08-21 | 2019-12-03 | Oppo广东移动通信有限公司 | 印制电路板和电子设备 |
CN107404803B (zh) * | 2017-08-21 | 2019-12-03 | Oppo广东移动通信有限公司 | 印制电路板和电子设备 |
CN107404802B (zh) * | 2017-08-21 | 2020-01-31 | Oppo广东移动通信有限公司 | 印制电路板、印制电路板的制作方法和电子设备 |
TWI696197B (zh) * | 2018-11-21 | 2020-06-11 | 貿聯國際股份有限公司 | 高頻軟性扁平排線 |
EP3855490A3 (en) | 2020-01-22 | 2021-10-13 | Delta Electronics (Shanghai) Co., Ltd. | Power module |
EP3855872A1 (en) * | 2020-01-22 | 2021-07-28 | Delta Electronics (Shanghai) Co., Ltd. | Carrier board comprising a metal block |
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- 2011-12-13 KR KR1020110133641A patent/KR101222257B1/ko active IP Right Grant
- 2011-12-14 GB GB1121453.3A patent/GB2491217B/en not_active Expired - Fee Related
- 2011-12-15 DE DE102011121221A patent/DE102011121221A1/de not_active Withdrawn
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Also Published As
Publication number | Publication date |
---|---|
DE102011121221A1 (de) | 2012-11-29 |
TW201249265A (en) | 2012-12-01 |
JP5178899B2 (ja) | 2013-04-10 |
US20120300416A1 (en) | 2012-11-29 |
JP2013012699A (ja) | 2013-01-17 |
US8735732B2 (en) | 2014-05-27 |
JP5873446B2 (ja) | 2016-03-01 |
US20140104801A1 (en) | 2014-04-17 |
KR20120132293A (ko) | 2012-12-05 |
GB201121453D0 (en) | 2012-01-25 |
CN102802341B (zh) | 2016-04-06 |
CN102802341A (zh) | 2012-11-28 |
US9107305B2 (en) | 2015-08-11 |
TWI445464B (zh) | 2014-07-11 |
GB2491217B (en) | 2015-07-08 |
GB2491217A (en) | 2012-11-28 |
KR101222257B1 (ko) | 2013-01-15 |
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