JP2013141725A - Grinding device - Google Patents

Grinding device Download PDF

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JP2013141725A
JP2013141725A JP2012003131A JP2012003131A JP2013141725A JP 2013141725 A JP2013141725 A JP 2013141725A JP 2012003131 A JP2012003131 A JP 2012003131A JP 2012003131 A JP2012003131 A JP 2012003131A JP 2013141725 A JP2013141725 A JP 2013141725A
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grinding
height
wheel
chuck table
plate
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JP5841846B2 (en
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Nobuyuki Takada
暢行 高田
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Disco Corp
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Disco Corp
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Abstract

PROBLEM TO BE SOLVED: To allow a holding face of a chuck table for holding a plate-like workpiece and a grinding surface of a grinding stone to be kept in parallel with a high degree of accuracy, in a grinding device.SOLUTION: The grinding device includes: a chuck table 2 that retains a plate-like workpiece in a retaining surface 20; a grinding wheel 32 in which a plurality of grinding stones 34 are bonded in an annular manner; and a wheel mount 31 that has a support surface 312 that detachably supports the grinding wheel 32. The wheel mount 31 includes a height measuring instrument mounting part 310 on which a height gauge 5 that measures the height position of the retaining surface 20 of the chuck table 2 corresponding to the support surface 312 that supports the grinding wheel 32, while the height gauge 5 is brought to scan on the rotational trajectory of the grinding stone 34 on the retaining surface 20 for measuring the height position of the retaining surface 20. The disposing of the height gauge 5 at a position lower than when using a jig improves the measuring accuracy, while bringing the thickness of the plate-like workpiece after grinding to be made further more uniform.

Description

本発明は、板状ワークの厚さが均一となるように研削することができる研削装置に関する。   The present invention relates to a grinding apparatus capable of grinding so that the thickness of a plate-like workpiece is uniform.

チャックテーブルに保持された半導体ウェーハ等の板状ワークの上面に回転する研削砥石の研削面を接触させて当該上面を研削する研削装置においては、板状ワークを均一な厚さに仕上げる必要があるため（例えば特許文献１参照）、チャックテーブルの保持面と研削砥石の研削面とを平行とするための調整があらかじめ行われている。   In a grinding apparatus that grinds an upper surface of a rotating grinding wheel by contacting the upper surface of a plate-shaped workpiece such as a semiconductor wafer held on a chuck table, it is necessary to finish the plate-shaped workpiece to a uniform thickness. For this reason (for example, refer to Patent Document 1), adjustment for making the holding surface of the chuck table parallel to the grinding surface of the grinding wheel is performed in advance.

かかる調整は、例えば図８及び図９に示すように、スピンドル３０に連結されたホイールマウント３１の中心に測定治具６を取り付けるとともに測定治具６に高さ測定器７を取り付け、高さ測定器７の下端をチャックテーブル２の保持面２０に接触させた状態でスピンドル３０を回転させた場合に、円運動する高さ測定器７の高さ位置が一定となるように、チャックテーブル２の回転軸２ａの傾き又はスピンドル３０の回転軸３０ａの傾きを修正することにより行われている。なお、高さ測定器７としては、てこ式ダイヤルゲージを使用している。また、チャックテーブル２の保持面２０は、吸引路２１を介して吸引源２２に連通している。   For example, as shown in FIGS. 8 and 9, the adjustment is performed by attaching the measuring jig 6 to the center of the wheel mount 31 connected to the spindle 30 and attaching the height measuring instrument 7 to the measuring jig 6. When the spindle 30 is rotated in a state where the lower end of the device 7 is in contact with the holding surface 20 of the chuck table 2, the height position of the height measuring device 7 that moves circularly becomes constant. This is done by correcting the tilt of the rotary shaft 2a or the tilt of the rotary shaft 30a of the spindle 30. A lever type dial gauge is used as the height measuring device 7. The holding surface 20 of the chuck table 2 communicates with the suction source 22 via the suction path 21.

特開２００７−２２２９８６号公報JP 2007-222986 A

しかし、上記研削前の調整は、スピンドル３０及びホイールマウント３１が実際の研削加工が行われるときの位置よりも高い位置にある状態で行われ、治具を使用するため、実際の加工時には誤差が生じ、チャックテーブル２の保持面２０と研削砥石３４の研削面３４０とが平行でなくなり、板状ワークの厚さが均一にならないことがある。そのため、研削加工後の板状ワークの厚さを測定し、その測定結果に基づき、チャックテーブルの回転軸の傾き又はスピンドルの回転軸の傾きを調整しているのが実状である。   However, the adjustment before grinding is performed in a state where the spindle 30 and the wheel mount 31 are at a position higher than the position at which actual grinding is performed, and since a jig is used, an error occurs during actual machining. As a result, the holding surface 20 of the chuck table 2 and the grinding surface 340 of the grinding wheel 34 may not be parallel, and the thickness of the plate-like workpiece may not be uniform. Therefore, the actual condition is that the thickness of the plate-like workpiece after grinding is measured, and the inclination of the rotation axis of the chuck table or the inclination of the rotation axis of the spindle is adjusted based on the measurement result.

本発明は、このような問題にかんがみなされたもので、チャックテーブルに保持された板状ワークに研削砥石を接触させて研削を行う研削装置において、チャックテーブルの保持面と研削砥石の研削面とを平行にする調整を高精度に行うことを課題とする。   The present invention has been considered in view of such problems, and in a grinding apparatus that performs grinding by bringing a grinding wheel into contact with a plate-like work held on a chuck table, the holding surface of the chuck table, the grinding surface of the grinding wheel, It is an object of the present invention to make the adjustment to make the two parallel with high accuracy.

本発明は、板状ワークを保持面において保持するチャックテーブルと、研削砥石が環状に配列されて接着された研削ホイールと、研削ホイールを着脱可能に支持する支持面を有するホイールマウントと、ホイールマウントに取り付けられた研削ホイールを回転させ研削砥石を該チャックテーブルの保持面に保持される板状ワークの上面に接触させ板状ワークの厚みを減じさせる研削送り手段とから少なくとも構成される研削装置に関し、ホイールマウントには、研削ホイールを支持する支持面に対するチャックテーブルの保持面の高さ位置を測定する高さ測定器を取り付ける高さ測定器取付け部を備え、高さ測定器取付け部に取り付けられる高さ測定器は、保持面上における研削砥石の回転軌道上を走査させて保持面の高さ位置の測定を可能としている。   The present invention relates to a chuck table that holds a plate-like workpiece on a holding surface, a grinding wheel in which grinding wheels are annularly arranged and bonded, a wheel mount having a support surface that detachably supports the grinding wheel, and a wheel mount A grinding apparatus comprising at least a grinding feed means for rotating a grinding wheel attached to the upper surface of the plate-like workpiece to bring the grinding wheel into contact with the upper surface of the plate-like workpiece held on the holding surface of the chuck table and reducing the thickness of the plate-like workpiece. The wheel mount has a height measuring device mounting portion for mounting a height measuring device for measuring the height position of the holding surface of the chuck table with respect to the support surface supporting the grinding wheel, and is attached to the height measuring device mounting portion. The height measuring instrument can measure the height position of the holding surface by scanning the rotation path of the grinding wheel on the holding surface. It is.

また、高さ測定器は、研削砥石をチャックテーブルに保持された板状ワークの上面に接触させた時の支持面と保持面との間の高さに位置した状態で、保持面の高さ位置の測定を可能とする。   In addition, the height measuring instrument is positioned at a height between the support surface and the holding surface when the grinding wheel is brought into contact with the upper surface of the plate-like work held by the chuck table. Allows position measurement.

本発明に係る研削装置では、高さ測定器を直接取り付けるための高さ測定取付け部をホイールマウントに設けたため、治具を使用することなく高さ測定器をホイールマウントに取り付けることができる。したがって、治具を使用する場合よりも、ホイールマウントを下方に位置させることができ、研削加工時のホイールマウントの高さ位置に高さ測定器を位置させた状態で、保持面上における研削砥石の回転軌道上を走査させて保持面の高さ位置の測定を行うことできる。よって、チャックテーブルの保持面の高さ位置の測定の精度が向上し、当該保持面と研削砥石の研削面との平行度の調整の精度も向上するため、研削後の板状ワークの厚さをより均一にすることが可能となる。   In the grinding apparatus according to the present invention, since the height measurement attachment portion for directly attaching the height measurement device is provided on the wheel mount, the height measurement device can be attached to the wheel mount without using a jig. Therefore, the wheel mount can be positioned lower than when using a jig, and the grinding wheel on the holding surface with the height measuring instrument positioned at the height position of the wheel mount during grinding processing. The height position of the holding surface can be measured by scanning the rotation trajectory. Therefore, the accuracy of measurement of the height position of the holding surface of the chuck table is improved, and the accuracy of adjusting the parallelism between the holding surface and the grinding surface of the grinding wheel is also improved. Can be made more uniform.

研削装置の一例を示す斜視図である。It is a perspective view which shows an example of a grinding device. 研削装置の要部の構成を略示的に示す断面図である。It is sectional drawing which shows schematically the structure of the principal part of a grinding device. 研削手段に高さ測定器を取り付けた状態を示す正面図である。It is a front view which shows the state which attached the height measuring device to the grinding means. チャックテーブルの保持面の高さを測定する状態を示す斜視図である。It is a perspective view which shows the state which measures the height of the holding surface of a chuck table. チャックテーブルの保持面の高さを測定する状態を略示的に示す断面図である。It is sectional drawing which shows schematically the state which measures the height of the holding surface of a chuck table. 板状ワークを研削する状態を示す斜視図である。It is a perspective view which shows the state which grinds a plate-shaped workpiece. 板状ワークを研削する状態を略示的に示す断面図である。It is sectional drawing which shows schematically the state which grinds a plate-shaped workpiece. 従来の方法によってチャックテーブルの保持面の高さを測定する状態を示す斜視図である。It is a perspective view which shows the state which measures the height of the holding surface of a chuck table by the conventional method. 従来の方法によってチャックテーブルの保持面の高さを測定する状態を略示的に示す断面図である。It is sectional drawing which shows schematically the state which measures the height of the holding surface of a chuck table by the conventional method.

図１に示す研削装置１は、チャックテーブル２に保持された板状ワークＷの面に対して研削加工を施す装置であり、チャックテーブル２は、上面が板状ワークＷを保持する保持面２０となっており、回転可能であるとともに、前後方向（図１における矢印Ａ方向）に移動可能となっている。   A grinding apparatus 1 shown in FIG. 1 is an apparatus that performs a grinding process on the surface of a plate-like workpiece W held on a chuck table 2. The chuck table 2 has a holding surface 20 on which the upper surface holds the plate-like workpiece W. It can rotate and can move in the front-rear direction (the direction of arrow A in FIG. 1).

研削装置１の後部側には、研削手段３が配設されている。研削手段３は、チャックテーブル２の保持面２０に対して直交すべき回転軸を有するスピンドル３０を備え、スピンドル３０の下端にはホイールマウント３１が形成されている。そして、ホイールマウント３１の下部には研削ホイール３２が取り付けられている。   A grinding means 3 is disposed on the rear side of the grinding apparatus 1. The grinding means 3 includes a spindle 30 having a rotation axis that should be orthogonal to the holding surface 20 of the chuck table 2, and a wheel mount 31 is formed at the lower end of the spindle 30. A grinding wheel 32 is attached to the lower part of the wheel mount 31.

スピンドル３０の上端部には、スピンドル３０を回転させるモータ３３が連結されている。このモータ３３は、研削ホイール３２を回転させる回転駆動手段として機能する。また、研削ホイール３２の下面には、複数の研削砥石３４が環状に配列されて接着されている。   A motor 33 that rotates the spindle 30 is connected to the upper end of the spindle 30. The motor 33 functions as a rotation driving unit that rotates the grinding wheel 32. A plurality of grinding wheels 34 are annularly arranged and bonded to the lower surface of the grinding wheel 32.

図２に示すように、ホイールマウント３１にはボルト孔３１０が形成されており、ボルト孔３１０に挿通したボルト３１１を研削ホイール３２の雌ねじ穴３２０に螺着することにより、研削ホイール３２がホイールマウント３１に取り付けられる。ホイールマウント３１の下面は、研削ホイール３２を着脱可能に支持する支持面３１２となっている。   As shown in FIG. 2, a bolt hole 310 is formed in the wheel mount 31, and the grinding wheel 32 is wheel-mounted by screwing a bolt 311 inserted through the bolt hole 310 into a female screw hole 320 of the grinding wheel 32. 31 is attached. The lower surface of the wheel mount 31 is a support surface 312 that detachably supports the grinding wheel 32.

図１に示すように、研削手段３は、研削送り手段４によって支持されて昇降する。研削送り手段４は、鉛直方向に延びるボールスクリュー４０と、ボールスクリュー４１と平行に配設された一対のガイドレール４１と、ボールスクリュー４０の上端に連結されたモータ４２とを有している。ボールスクリュー４０には昇降板４３の内部に設けたナットが螺合しており、昇降板４３の一方の面はガイドレール４１に摺接している。昇降板４３には、支持部４４が連結されており、支持部４４は、研削手段３を支持している。   As shown in FIG. 1, the grinding means 3 is supported by the grinding feed means 4 and moves up and down. The grinding feed means 4 has a ball screw 40 extending in the vertical direction, a pair of guide rails 41 arranged in parallel with the ball screw 41, and a motor 42 connected to the upper end of the ball screw 40. A nut provided inside the lifting plate 43 is screwed to the ball screw 40, and one surface of the lifting plate 43 is in sliding contact with the guide rail 41. A support portion 44 is connected to the elevating plate 43, and the support portion 44 supports the grinding means 3.

このように構成される研削送り手段４では、モータ４２がボールスクリュー４０を正逆いずれかの方向に回転させてガイドレール４１に沿って昇降板４３を上下動させることにより、研削手段３を上下動させることができる。   In the grinding feed means 4 configured in this way, the motor 42 rotates the ball screw 40 in either the forward or reverse direction to move the elevating plate 43 up and down along the guide rail 41, thereby moving the grinding means 3 up and down. Can be moved.

図２に示すように、チャックテーブル２には、保持面２０に連通する吸引路２１が形成されている。また、吸引路２１は吸引源２２に連通しており、保持面２０に吸引力を作用させることができる。   As shown in FIG. 2, the chuck table 2 is formed with a suction path 21 communicating with the holding surface 20. In addition, the suction path 21 communicates with the suction source 22 and can apply a suction force to the holding surface 20.

図２に示したボルト３１１を緩めて研削ホイール３２を取り外すと、図３に示すように、ボルト３１１が挿通されていたボルト孔３１０には、高さ測定器５を挿入して取り付けることができる。このように、ボルト孔３１０は、高さ測定器取付け部としての機能を有している。図示の例におけるボルト孔３１０は研削砥石３４の真上に位置しており、また、高さ測定器５はボルト孔３１０から真下に向けて垂下した状態で配設されているため、高さ測定器５は、研削砥石３４の回転軌道と同様の回転軌道上を移動する。   When the bolt 311 shown in FIG. 2 is loosened and the grinding wheel 32 is removed, as shown in FIG. 3, the height measuring device 5 can be inserted and attached to the bolt hole 310 into which the bolt 311 has been inserted. . As described above, the bolt hole 310 has a function as a height measuring device mounting portion. In the illustrated example, the bolt hole 310 is located directly above the grinding wheel 34, and the height measuring device 5 is disposed in a state of hanging downward from the bolt hole 310, so that the height measurement is performed. The machine 5 moves on the same rotation path as that of the grinding wheel 34.

高さ測定器５を直接取り付けるための高さ測定取付け部をホイールマウント３１に設けたため、高さ測定器５の取付けに治具は必要とされない。また、治具を使用しないことで、治具を使用する場合よりも下方の位置、すなわち実際の研削時にホイールマウント３１が位置する高さと同じ高さに高さ測定器５を配設することができる。   Since a height measurement mounting portion for directly mounting the height measuring device 5 is provided on the wheel mount 31, no jig is required for mounting the height measuring device 5. Further, by not using a jig, the height measuring device 5 can be disposed at a lower position than when a jig is used, that is, at the same height as the wheel mount 31 is positioned during actual grinding. it can.

なお、高さ測定部取付け部は、高さ測定部５の形状等に応じ、取り付けられた高さ測定部５が研削砥石３４と同一の回転軌道上を通るように適切な位置に形成されていればよく、ボルト孔３１０とは別の位置に設けてもよい。   The height measuring unit mounting part is formed at an appropriate position so that the attached height measuring unit 5 passes on the same rotation path as that of the grinding wheel 34 according to the shape of the height measuring unit 5 and the like. And may be provided at a position different from the bolt hole 310.

高さ測定器取付け部に取り付けられた高さ測定器５は、例えばダイヤルゲージであり、その上端をボルト孔３１０に固定して吊垂状態とし、下端の測定子５０をチャックテーブル２の保持面２０に接触させることにより、ホイールマウント３１の支持面３１２に対するチャックテーブル２の保持面２０の高さ位置を測定することができる。   The height measuring device 5 attached to the height measuring device attaching portion is, for example, a dial gauge, and the upper end of the height measuring device 5 is fixed to the bolt hole 310 to be suspended, and the lower end measuring member 50 is held on the holding surface of the chuck table 2. 20, the height position of the holding surface 20 of the chuck table 2 with respect to the support surface 312 of the wheel mount 31 can be measured.

図４及び図５に示すように、高さ測定器取付け部に取り付けられた高さ測定器５の測定子５０をチャックテーブル２の保持面２０に接触させた状態で、スピンドル３０を回転させてホイールマウント３１を回転させる。このとき、実際の研削時の研削砥石３４の回転軌道３４ａ上を走査し、高さ測定器５の測定子５０の上下方向の位置が変化しなければ、チャックテーブル２の回転軸がスピンドル３０の回転軸に対して高精度に平行であり、ホイールマウント３１の支持面３１２とチャックテーブル２の保持面２０とが平行であると判断することができる。   As shown in FIGS. 4 and 5, the spindle 30 is rotated while the probe 50 of the height measuring device 5 attached to the height measuring device mounting portion is in contact with the holding surface 20 of the chuck table 2. The wheel mount 31 is rotated. At this time, if the position of the probe 50 of the height measuring instrument 5 in the vertical direction is not changed by scanning the rotation path 34 a of the grinding wheel 34 during actual grinding, the rotation axis of the chuck table 2 is the spindle 30. It can be determined that the support surface 312 of the wheel mount 31 and the holding surface 20 of the chuck table 2 are parallel to the rotation axis with high accuracy.

一方、研削時の研削砥石３４の回転軌道上を走査し、高さ測定器５の測定子５０の上下方向の位置が変化した場合は、保持面２０がスピンドル３０の回転軸に対して垂直でないと判断する。この場合は、チャックテーブル２の回転軸２ａの傾き又は研削手段３を構成するスピンドル３０の回転軸３０ａの傾きを調整する。そして、ホイールマウント３１の支持面３１２とチャックテーブル２の保持面２０とが平行になるまで、同様の測定及び調整を行う。   On the other hand, when the position of the probe 50 of the height measuring instrument 5 in the vertical direction is changed by scanning the rotation path of the grinding wheel 34 during grinding, the holding surface 20 is not perpendicular to the rotation axis of the spindle 30. Judge. In this case, the inclination of the rotating shaft 2a of the chuck table 2 or the inclination of the rotating shaft 30a of the spindle 30 constituting the grinding means 3 is adjusted. The same measurement and adjustment are performed until the support surface 312 of the wheel mount 31 and the holding surface 20 of the chuck table 2 become parallel.

このようにして、スピンドル３０の回転軸とチャックテーブル２の回転軸とが平行であることが確認されると、高さ測定器取付け部であるボルト孔３１０から高さ測定器５を取り外し、図６に示すように、ボルト３１１をボルト孔３１０に挿通し、ホイールマウント３１に研削ホイール３２を取り付けて固定する。研削ホイール３２に固着された研削砥石３４の下面である研削面３４０は、支持面３１２と平行となるように予め調整されており、また、上述のように、支持面３１２とチャックテーブル２の保持面２０とが平行となるように調整されているため、研削面３４０は、保持面２０と平行となる。   Thus, when it is confirmed that the rotation axis of the spindle 30 and the rotation axis of the chuck table 2 are parallel, the height measuring device 5 is removed from the bolt hole 310 which is the height measuring device mounting portion. As shown in FIG. 6, the bolt 311 is inserted into the bolt hole 310, and the grinding wheel 32 is attached and fixed to the wheel mount 31. The grinding surface 340 which is the lower surface of the grinding wheel 34 fixed to the grinding wheel 32 is adjusted in advance so as to be parallel to the support surface 312, and as described above, the support surface 312 and the chuck table 2 are held. Since the surface 20 is adjusted to be parallel to the surface 20, the grinding surface 340 is parallel to the holding surface 20.

そして、図６及び図７に示すように、チャックテーブル２を矢印Ｂ方向に回転させるとともに、研削ホイール３１を矢印Ｃ方向に回転させ、図１に示した研削送り手段４によって研削手段３を徐々に下降させていき、回転する研削砥石３４の研削面３４０を板状ワークＷの上面Ｗ１に接触させて研削し、板状ワークＷの厚みを減じていく。そして、板状ワークＷが所定の厚さに形成されると、研削送り手段４が研削手段３を上昇させ、研削を終了する。   6 and 7, the chuck table 2 is rotated in the direction of arrow B, the grinding wheel 31 is rotated in the direction of arrow C, and the grinding means 3 is gradually moved by the grinding feed means 4 shown in FIG. Then, the grinding surface 340 of the rotating grinding wheel 34 is brought into contact with the upper surface W1 of the plate-like workpiece W for grinding, and the thickness of the plate-like workpiece W is reduced. When the plate-like workpiece W is formed to a predetermined thickness, the grinding feed means 4 raises the grinding means 3 and finishes the grinding.

研削砥石３４の研削面３４０とチャックテーブル２の保持面２０とが予め平行となるように調整されているため、上面Ｗ１が研削された板状ワークＷは、均一な厚さを有する厚さばらつきのないものに仕上がる。   Since the grinding surface 340 of the grinding wheel 34 and the holding surface 20 of the chuck table 2 are adjusted in advance in parallel, the plate-like workpiece W whose upper surface W1 is ground has a uniform thickness variation. Finished with something without.

図７に示すように、研削砥石３４の研削面３４０が板状ワークＷの上面Ｗ１に接触した時のホイールマウント３１の支持面３１２の高さ位置をＨ１とし、チャックテーブル２の保持面２０の高さ位置をＨ２とすると、図５に示した高さ測定器５は、高さ位置Ｈ１とＨ２との間の高さ位置に位置した状態で、保持面２０の高さ位置を測定することができる。すなわち、研削手段３が研削時と同じ高さ位置にある状態で、支持面３１２と保持面２０との平行度を測定することができる。したがって、研削される板状ワークの厚さをより均一にすることができる。なお、高さ測定器５を高さ位置Ｈ１とＨ２との間の高さ位置に位置させるためには、高さ測定器５の高さ方向の長さが、ホイールマウント３１の厚さと研削ホイール３２の厚さと研削砥石３４の厚さと板状ワークＷの研削前の厚さとを足した総和以下であることが必要である。   As shown in FIG. 7, the height position of the support surface 312 of the wheel mount 31 when the grinding surface 340 of the grinding wheel 34 contacts the upper surface W1 of the plate-like workpiece W is H1, and the holding surface 20 of the chuck table 2 is Assuming that the height position is H2, the height measuring device 5 shown in FIG. 5 measures the height position of the holding surface 20 in a state of being located at a height position between the height positions H1 and H2. Can do. That is, the parallelism between the support surface 312 and the holding surface 20 can be measured in a state where the grinding means 3 is at the same height position as during grinding. Therefore, the thickness of the plate workpiece to be ground can be made more uniform. In order to position the height measuring device 5 at a height position between the height positions H1 and H2, the height of the height measuring device 5 depends on the thickness of the wheel mount 31 and the grinding wheel. It is necessary to be less than or equal to the total sum of the thickness of 32, the thickness of the grinding wheel 34, and the thickness of the plate-like workpiece W before grinding.

以上のように、高さ測定器５は、保持面２０上における研削砥石３４の回転軌道上を走査させて保持面２０の高さ位置の測定を行うことできるため、チャックテーブル２の保持面２０と研削ホイール３４の研削面３４０との平行度の測定精度が向上し、研削後の板状ワークの厚さをより均一にすることが可能となる。   As described above, since the height measuring device 5 can measure the height position of the holding surface 20 by scanning the rotation trajectory of the grinding wheel 34 on the holding surface 20, the holding surface 20 of the chuck table 2. The accuracy of measuring the parallelism between the grinding wheel 34 and the grinding surface 340 of the grinding wheel 34 is improved, and the thickness of the plate-like workpiece after grinding can be made more uniform.

１：研削装置
２：チャックテーブル ２０：保持面 ２１：吸引路 ２２：吸引源 ２ａ：回転軸
３：研削手段 ３０：スピンドル ３０ａ：回転軸
３１：ホイールマウント
３１０：ボルト孔（高さ測定器取付け部） ３１１：ボルト ３１２：支持面
３２：研削ホイール ３２０：雌ねじ穴
３１２：下面（支持面）
３３：モータ（回転駆動手段）
３４：研削砥石 ３４０：研削面
４：研削送り手段
４０：ボールスクリュー ４１：ガイドレール ４２：モータ ４３：昇降板
４４：支持部
５：高さ測定部 ５０：測定子 1: Grinding device 2: Chuck table 20: Holding surface 21: Suction path 22: Suction source 2a: Rotating shaft 3: Grinding means 30: Spindle 30a: Rotating shaft 31: Wheel mount 310: Bolt hole (height measuring device mounting portion 311: Bolt 312: Support surface 32: Grinding wheel 320: Female screw hole 312: Lower surface (support surface)
33: Motor (rotation drive means)
34: Grinding wheel 340: Grinding surface 4: Grinding feed means 40: Ball screw 41: Guide rail 42: Motor 43: Elevating plate 44: Supporting part 5: Height measuring part 50: Measuring element

Claims (2)

板状ワークを保持面において保持するチャックテーブルと、研削砥石が環状に配列されて接着された研削ホイールと、該研削ホイールを着脱可能に支持する支持面を有するホイールマウントと、該ホイールマウントに取り付けられた研削ホイールを回転させ該研削砥石を該チャックテーブルの保持面に保持される板状ワークの上面に接触させ板状ワークの厚みを減じさせる研削送り手段と、から少なくとも構成される研削装置において、
該ホイールマウントには、該研削ホイールを支持する支持面に対する該チャックテーブルの保持面の高さ位置を測定する高さ測定器を取り付ける高さ測定器取付け部を備え、
該高さ測定器取付け部に取り付けられる該高さ測定器は、該保持面上における該研削砥石の回転軌道上を走査させて該保持面の高さ位置の測定を可能とする研削装置。 A chuck table for holding a plate-like workpiece on a holding surface, a grinding wheel in which grinding wheels are arranged in an annular shape and bonded, a wheel mount having a support surface for detachably supporting the grinding wheel, and attached to the wheel mount In a grinding apparatus comprising at least grinding feed means for rotating the grinding wheel so that the grinding wheel is brought into contact with the upper surface of the plate-like workpiece held on the holding surface of the chuck table to reduce the thickness of the plate-like workpiece ,
The wheel mount includes a height measuring device mounting portion for mounting a height measuring device for measuring a height position of the holding surface of the chuck table with respect to a support surface that supports the grinding wheel,
The height measuring device attached to the height measuring device attaching portion scans the rotating orbit of the grinding wheel on the holding surface and enables measurement of the height position of the holding surface. 前記高さ測定器は、前記研削砥石を前記チャックテーブルに保持された板状ワークの上面に接触させた時の前記支持面と前記保持面との間の高さに位置した状態で、該保持面の高さ位置の測定を可能とする請求項１に記載の研削装置。   The height measuring device is positioned at a height between the support surface and the holding surface when the grinding wheel is brought into contact with the upper surface of the plate-like workpiece held on the chuck table. The grinding apparatus according to claim 1, wherein the surface height position can be measured.
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JP2015205351A (en) * 2014-04-17 2015-11-19 株式会社ディスコ Grinding device
JP2017019087A (en) * 2015-07-15 2017-01-26 株式会社ディスコ Attachment jig
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KR20190016440A (en) 2017-08-08 2019-02-18 가부시기가이샤 디스코 Jig for measuring height
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JP7350429B2 (en) 2019-07-09 2023-09-26 株式会社ディスコ Grindstone protection member and wheel case
JP7503938B2 (en) 2020-06-04 2024-06-21 株式会社ディスコ How to inspect the holding surface
WO2022034808A1 (en) * 2020-08-12 2022-02-17 東京エレクトロン株式会社 Processing system, inclination adjustment method, and computer storage medium

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