TW202007479A - Origin position setting mechanism and origin position setting method for grinding device installing a grinding device with high precision without using a contact sensor - Google Patents

Origin position setting mechanism and origin position setting method for grinding device installing a grinding device with high precision without using a contact sensor Download PDF

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TW202007479A
TW202007479A TW108126586A TW108126586A TW202007479A TW 202007479 A TW202007479 A TW 202007479A TW 108126586 A TW108126586 A TW 108126586A TW 108126586 A TW108126586 A TW 108126586A TW 202007479 A TW202007479 A TW 202007479A
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Taiwan
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grinding
chuck table
grinding unit
origin position
unit
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TW108126586A
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Chinese (zh)
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木村泰一朗
原田成規
山下真司
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日商迪思科股份有限公司
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Publication of TW202007479A publication Critical patent/TW202007479A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

An object of the present invention is to install a grinding device with high precision without using a contact sensor, which is a mechanism for setting the origin position of a grindstone (641) relative to a chuck table (30) in a grinding device (1). The grinding device (1) has a grinding unit (6) having a main shaft (60) to which a grindstone (641) is mounted and a motor (62) driving the main shaft (60) to rotate; and a unit feed mechanism (7), which moves the grinding unit (6) in the vertical direction, and the mechanism (9) has: a current value detection means (90) for detecting the load current value of the motor (62); a detection means (91) that detects the position of the grinding unit (6) that is moved by the unit feed mechanism (7); and a control means (92) which sets the origin position according to the signals obtained from the current value detection means (90) and the position detection means (91). The control means (92) moves the rotating grindstone (641) vertically through the unit feed mechanism (7) to bring the grindstone grinding surface into surface contact with the trimming plate (B) held on the chuck table (30). As such, the position obtained by subtracting the thickness of the trimming plate (B) from the position detected by the position detection means (91) when the motor load current value exceeds the threshold is set as the origin position.

Description

研削裝置的原點位置設定機構以及原點位置設定方法Origin position setting mechanism and origin position setting method of grinding device

本發明係關於在研削裝置中，用於設定研削磨石相對於卡盤台之原點位置的原點位置設定機構及原點位置設定方法。The invention relates to an origin position setting mechanism and an origin position setting method for setting an origin position of a grinding stone with respect to a chuck table in a grinding device.

形成有多個IC或LSI等元件之半導體晶圓等的工件係研削其背面而形成預定厚度，藉由切割裝置等的分割裝置而分割為各個元件，並用於行動電話、電腦等的電子設備。Workpieces such as semiconductor wafers on which multiple ICs or LSIs are formed are ground on the back to form a predetermined thickness, and are divided into individual components by a dividing device such as a dicing device, and are used in electronic devices such as mobile phones and computers.

研削工件背面之研削裝置的構成係具備：卡盤台，保持工件，及研削單元，可旋轉地支撐研削磨石，該研削磨石係研削被卡盤台保持之工件，且該研削裝置可有效率地研削工件。 在此種研削裝置中，要完成將半導體晶圓等的工件背面研削並完工至預定厚度，需要進行設置（setup），該設置係高精確度地掌握從卡盤台保持面到研削磨石加工面（下表面）的相對距離。The grinding device for grinding the back of the workpiece consists of: a chuck table, holding the workpiece, and a grinding unit that rotatably supports the grinding stone. The grinding stone grinds the workpiece held by the chuck table, and the grinding device can have Grind the workpiece efficiently. In this type of grinding device, to complete grinding of the back surface of a workpiece such as a semiconductor wafer to a predetermined thickness, a setup is required, which is a high-precision grasp from the chuck table holding surface to grinding stone processing The relative distance of the surface (lower surface).

作為掌握卡盤台保持面到研削磨石加工面的相對距離之方法，以往，是將預先設定在距卡盤台保持面預定距離之上方高度位置的接觸感應器移動至研削磨石下方並使研削單元下降，在研削磨石接觸到接觸感應器的時間點，檢測研削單元的位置，並由所檢測出的該位置與該預定距離來掌握該相對距離（例如參照專利文獻1）。As a method for grasping the relative distance between the holding surface of the chuck table and the processing surface of the grinding stone, in the past, a contact sensor previously set at a height above a predetermined distance from the holding surface of the chuck table was moved below the grinding stone and the The grinding unit descends, and when the grinding stone touches the contact sensor, the position of the grinding unit is detected, and the relative distance is grasped from the detected position and the predetermined distance (for example, refer to Patent Document 1).

[先前技術文獻] [專利文獻] [專利文獻1]日本特許5815422號公報[Prior Technical Literature] [Patent Literature] [Patent Document 1] Japanese Patent No. 5815422

[發明所欲解決的課題] 然而，在上述以往的方法中，在設置接觸感應器時，每次都要移動接觸感應器至研削磨石下方，使裝置的動作機構變複雜。又，研削磨石為如擦光輪等較柔軟構件所構成時，因接觸感應器的前端形狀形成為細針狀，故接觸感應器接觸研削磨石時會咬入研削磨石、或研削磨石會凹陷，而有誤判接觸位置之虞。[Problems to be solved by the invention] However, in the above-mentioned conventional method, when the touch sensor is installed, the touch sensor must be moved under the grinding stone every time, which complicates the operation mechanism of the device. In addition, when the grinding stone is composed of a relatively soft member such as a polishing wheel, the shape of the tip of the contact sensor is formed into a thin needle, so the contact sensor will bite into the grinding stone or grinding stone when it contacts the grinding stone It will sag, and there is a risk of misjudging the contact position.

因此，在掌握卡盤台保持面至研削磨石加工面的相對距離之設置中，其課題為可不使用接觸感應器而完成，且可高精確度地設置。Therefore, in setting the relative distance between the holding surface of the chuck table and the grinding grindstone processing surface, the problem is that it can be completed without using a touch sensor and can be set with high accuracy.

[解決課題的技術手段] 為了解決上述課題，本發明為一種研削裝置的原點位置設定機構，用於設定研削磨石之相對於卡盤台的原點位置；該研削裝置係具備：卡盤台，具備保持工件之保持面；研削單元，具備主軸及使該主軸旋轉驅動的馬達，該主軸裝設有將保持於該卡盤台之工件進行研削的研削磨石；及研削單元進給機構，使該研削單元在與該卡盤台保持面垂直的方向上移動；該研削裝置的原點位置設定機構之特徵在於具備：電流值檢測手段，檢測該馬達之負載電流值；研削單元位置檢測手段，係檢測藉由該研削單元進給機構而被移動之該研削單元的位置；及控制手段，係根據從該電流值檢測手段及該研削單元位置檢測手段得到的檢測訊號而設定該原點位置；該控制手段係藉由該研削單元進給機構而使旋轉之該研削磨石在垂直方向往該卡盤台移動，使該研削磨石之研削面接觸修整板表面，該修整板具備被保持於該卡盤台保持面且用以修整該研削磨石之板狀磨石，藉此，將在該馬達之負載電流值變成為預先設定閾值以上之時間點，將從該研削單元位置檢測手段所檢測出之該研削單元之位置減去該修整板之厚度所得的位置，設定為該原點位置。[Technical means to solve the problem] In order to solve the above-mentioned problems, the present invention is an origin position setting mechanism of a grinding device for setting the origin position of a grinding stone relative to a chuck table; the grinding device is provided with: a chuck table, which is provided with a holder for holding a workpiece Grinding unit, equipped with a spindle and a motor that drives the spindle to rotate, the spindle is equipped with a grinding grindstone that grinds the workpiece held on the chuck table; and a grinding unit feed mechanism that makes the grinding unit work with The holding surface of the chuck table moves in the vertical direction; the origin position setting mechanism of the grinding device is characterized by: current value detection means, which detects the load current value of the motor; grinding unit position detection means, which detects The position of the grinding unit that is moved by the grinding unit feed mechanism; and the control means sets the origin position based on the detection signals obtained from the current value detection means and the grinding unit position detection means; the control means is borrowed The grinding unit feed mechanism moves the grinding grindstone rotating in the vertical direction to the chuck table, so that the grinding surface of the grinding grindstone contacts the surface of the dressing plate, and the dressing plate is held by the chuck table. The plate-shaped grindstone used to trim the grinding grindstone, by which the grinding current detected by the grinding unit position detection means will be changed at a time point when the load current value of the motor becomes a predetermined threshold value or more The position of the unit minus the thickness of the trimming plate is set as the origin position.

又，為了解決上述課題，本發明為一種研削裝置的原點位置設定方法，用於設定研削磨石之相對於卡盤台的原點位置；該研削裝置具備：卡盤台，具備保持工件之保持面；研削單元，具備主軸及使該主軸旋轉驅動的馬達，該主軸裝設有將保持於該卡盤台之工件進行研削的研削磨石；及研削單元進給機構，使該研削單元在與該卡盤台之保持面垂直的方向上移動；該研削裝置的原點位置設定方法之特徵在於具備：修整板保持步驟，將修整板保持於該卡盤台，該修整板具備用於實施該研削磨石之修整的板狀磨石；研削磨石接觸步驟，藉由該研削單元進給機構而將以該馬達旋轉之該研削磨石而在垂直方向往該卡盤台移動，使該研削磨石接觸該修整板表面；及位置記憶步驟，在該馬達之負載電流值變成為閾值以上之時間點，記憶該研削單元的位置；將由該位置記憶步驟所記憶之研削單元的位置減去該修整板之厚度所得的位置，設定為該原點位置。In addition, in order to solve the above-mentioned problems, the present invention is a method of setting the origin position of a grinding device for setting the origin position of a grinding stone relative to a chuck table; the grinding device is provided with: a chuck table provided with a workpiece holding Holding surface; grinding unit, equipped with a spindle and a motor that drives the spindle to rotate, the spindle is equipped with a grinding stone for grinding the workpiece held on the chuck table; and a grinding unit feed mechanism, which makes the grinding unit in It moves in the direction perpendicular to the holding surface of the chuck table; the origin position setting method of the grinding device is characterized by: a trimming plate holding step, which holds the trimming plate on the chuck table, and the trimming plate is provided for implementation The trimmed plate-shaped grindstone of the grinding grindstone; the grinding grindstone contacting step moves the grinding grindstone rotated by the motor to the chuck table in the vertical direction by the grinding unit feed mechanism, so that the Grinding grindstone contacts the surface of the dressing board; and the position memory step, at the time when the load current value of the motor becomes above the threshold value, memorize the position of the grinding unit; subtract the position of the grinding unit memorized by the position memory step The position obtained by the thickness of the trimming plate is set as the origin position.

[發明功效] 關於本發明之原點位置設定機構係藉由研削單元進給機構而將旋轉之研削磨石在垂直方向往卡盤台移動，使研削磨石之研削面接觸被保持於卡盤台保持面之修整板的表面，藉此，因為可以在馬達之負載電流值變成為預先設定閾值以上之時間點，將從研削單元位置檢測手段所檢測出研削單元之位置減去修整板之厚度所得的位置，設定為原點位置，故可不使用接觸感應器而完成，且可高精確度地設置。[Effect of invention] The origin position setting mechanism of the present invention moves the rotating grinding stone to the chuck table in the vertical direction by the grinding unit feed mechanism, so that the grinding surface contact of the grinding stone is held on the chuck table holding surface The surface of the trimming board can be used to subtract the thickness of the trimming board from the position of the grinding unit detected by the grinding unit position detection means when the load current value of the motor becomes a predetermined threshold or more The setting is the origin position, so it can be done without using a touch sensor, and can be set with high accuracy.

關於本發明之原點位置設定方法係具備：研削磨石接觸步驟，藉由研削單元進給機構而將以馬達旋轉之研削磨石在垂直方向往卡盤台移動，使研削磨石接觸修整板表面；及位置記憶步驟，在旋轉之研削磨石接觸修整板表面且馬達之負載電流值變成為閾值以上之時間點，記憶研削單元的位置；因為可以將從位置記憶步驟所記憶之研削單元的位置減去修整板之厚度所得的位置，設定為原點位置，故可不使用接觸感應器而完成，且可高精確度地設置。The origin position setting method of the present invention includes: a grinding grindstone contacting step, the grinding grindstone rotated by a motor is moved to a chuck table in a vertical direction by a grinding unit feeding mechanism, and the grinding grindstone contacts the dressing plate Surface; and position memory step, when the rotating grinding stone contacts the surface of the dressing board and the load current value of the motor becomes above the threshold, the position of the grinding unit is memorized; because the grinding unit can be memorized from the position memory step The position obtained by subtracting the thickness of the trimming plate from the position is set as the origin position, so it can be completed without using a contact sensor and can be set with high accuracy.

圖1所示之研削裝置1，係藉由研削單元6而將保持於卡盤台30上之半導體晶圓等的工件W進行研削的裝置。研削裝置1之基台10上的前方（－X方向側）成為相對於卡盤台30之裝卸工件W或修整板B的區域，基台10上的後方（+X方向側）成為藉由研削單元6而進行保持於卡盤台30上之工件W的研削或修整板B的研削（研削單元6的研削磨石641之修整）之區域。 又，在研削裝置1所進行之研削，亦包括以毛氈等之不織布所構成的研磨墊來研磨工件W。The grinding device 1 shown in FIG. 1 is a device for grinding a workpiece W such as a semiconductor wafer held on a chuck table 30 by a grinding unit 6. The front (-X direction side) on the base 10 of the grinding apparatus 1 becomes an area for loading and unloading the workpiece W or the trimming plate B with respect to the chuck table 30, and the rear (+X direction side) on the base 10 becomes by grinding The unit 6 performs an area of grinding of the workpiece W held on the chuck table 30 or grinding of the dressing plate B (dressing of the grinding stone 641 of the grinding unit 6). In addition, the grinding performed by the grinding device 1 also includes grinding the workpiece W with a polishing pad composed of a non-woven fabric such as felt.

在研削裝置1之基台10上的後方側立設有柱體17，在柱體17前面配設有研削單元進給機構7，該研削單元進給機構7係使研削單元6在與卡盤台30的保持面300a垂直之方向上（Z軸方向）移動。研削單元進給機構7係由具有Z軸方向之軸心的滾珠螺桿70、與滾珠螺桿70平行地配設之一對導軌71、與滾珠螺桿70連結並使滾珠螺桿70轉動之馬達72、使內部之螺帽螺合於滾珠螺桿70並使側部滑接於導軌71之昇降板73、及與昇降板73連結並保持研削單元6之支架74所構成，若以馬達72使滾珠螺桿70轉動，則隨著昇降板73被導軌71導引並在Z軸方向上來回移動，支撐於支架74之研削單元6亦在Z軸方向上來回移動。On the rear side of the base 10 of the grinding device 1, a column 17 is standingly arranged, and a grinding unit feeding mechanism 7 is arranged in front of the column 17, the grinding unit feeding mechanism 7 makes the grinding unit 6 collide with the chuck The holding surface 300a of the table 30 moves in a direction perpendicular to the direction (Z-axis direction). The grinding unit feed mechanism 7 is composed of a ball screw 70 having an axis center in the Z-axis direction, a pair of guide rails 71 arranged parallel to the ball screw 70, and a motor 72 connected to the ball screw 70 and rotating the ball screw 70. The inner nut is screwed to the ball screw 70 and the side is slidingly connected to the lifting plate 73 of the guide rail 71 and the bracket 74 that is connected to the lifting plate 73 and holds the grinding unit 6. If the ball screw 70 is rotated by the motor 72 Then, as the lifting plate 73 is guided by the guide rail 71 and moves back and forth in the Z-axis direction, the grinding unit 6 supported by the bracket 74 also moves back and forth in the Z-axis direction.

研削單元6係具備：主軸60，軸方向為Z軸方向；外殼61，可旋轉地支撐主軸60；馬達62，旋轉驅動主軸60；底座63，裝設於主軸60的下端；及研削輪64，可裝卸地連接於底座63。研削輪64具備：輪基台640、及研削磨石641，具備略呈長方體形狀外形且環狀配設多個於輪基台640的下表面。研削磨石641係以適當結合劑黏著並固定金剛石磨粒等而成型。Grinding unit 6 is equipped with: a main shaft 60, the axis direction of which is the Z-axis direction; a housing 61, which rotatably supports the main shaft 60; a motor 62, which rotatably drives the main shaft 60; a base 63, which is installed at the lower end of the main shaft 60; and a grinding wheel 64, The base 63 is detachably connected. The grinding wheel 64 includes a wheel base 640 and a grinding stone 641, and has a substantially rectangular parallelepiped shape and is disposed in a ring shape on the lower surface of the wheel base 640. The grinding stone 641 is formed by bonding and fixing diamond abrasive grains with an appropriate binder.

外形為圓形狀之卡盤台30係具備：吸附部300，由多孔構件等所構成且吸附工件W；及框體301，支撐吸附部300。卡盤台30之吸附部300係與未圖示的吸引源連通，該吸引源是由真空泵或噴射器等真空產生裝置所構成，以吸引源吸引所產生的吸力傳達至成為卡盤台30之保持面300a的上表面，藉此，卡盤台30為可在其保持面300a上吸取保持工件W。如圖2所示，保持面300a形成為圓錐面，該圓錐面係以卡盤台30之旋轉中心為頂點且具備極平緩的傾斜度。又，卡盤台30係藉由罩蓋39圍住其周圍，並藉由未圖示之X軸方向進給手段，而變得可在基台10上的X軸方向上來回移動，該X軸方向進給手段係配置於罩蓋39及與罩蓋39連結之蛇腹罩蓋39a下方。The chuck table 30 having a circular shape is provided with: an adsorption part 300 composed of a porous member or the like and adsorbs the workpiece W; and a frame 301 supporting the adsorption part 300. The suction part 300 of the chuck table 30 communicates with an unshown suction source, which is composed of a vacuum generating device such as a vacuum pump or an ejector, and the suction force generated by the suction of the suction source is transmitted to the chuck table 30 The upper surface of the holding surface 300a allows the chuck table 30 to suck and hold the workpiece W on the holding surface 300a. As shown in FIG. 2, the holding surface 300 a is formed as a conical surface having an extremely gentle inclination with the rotation center of the chuck table 30 as the apex. In addition, the chuck table 30 is surrounded by a cover 39 and is moved back and forth in the X-axis direction on the base 10 by means of an X-axis direction feeding means (not shown). The axial feeding means is arranged below the cover 39 and the bellows cover 39a connected to the cover 39.

如圖2所示，卡盤台30的下方配設有由馬達及旋轉軸等所構成之旋轉手段32，卡盤台30係藉由旋轉手段32而變得可繞Z軸方向之軸心旋轉。As shown in FIG. 2, a rotating means 32 composed of a motor, a rotating shaft, and the like is disposed below the chuck table 30. The chuck table 30 is rotated by the rotating means 32 around an axis in the Z-axis direction .

如圖2所示，例如卡盤台30是藉由配設於其下方之傾斜調節部35而變得可調節保持面300a的傾斜程度。傾斜調節部35是在卡盤台30底面側且在周方向隔有固定間隔處配設多個（例如3個）。傾斜調節部35具備：支撐柱35a，支撐卡盤台30；連結部35e，透過軸承等而與支持柱35a連結；螺絲部35b，螺合於連結部35e並可繞Z軸方向之軸心旋轉；及馬達35d，透過軸承等所構成的連結器35c而與螺絲部35b連結；若馬達35d使螺絲部35b轉動，則支持柱35a隨之在Z軸方向上來回移動，調節卡盤台30之保持面300a相對於水平面的傾斜程度。As shown in FIG. 2, for example, the chuck table 30 is adjusted by the inclination adjustment portion 35 provided below the inclination of the holding surface 300 a. A plurality of tilt adjustment portions 35 are arranged on the bottom surface side of the chuck table 30 and at fixed intervals in the circumferential direction (for example, three). The tilt adjusting portion 35 includes: a supporting column 35a supporting the chuck table 30; a connecting portion 35e connected to the supporting column 35a through bearings or the like; a screw portion 35b screwed to the connecting portion 35e and rotatable about the axis in the Z-axis direction ; And motor 35d, connected to the screw portion 35b through a connector 35c composed of bearings, etc.; if the motor 35d rotates the screw portion 35b, the support column 35a moves back and forth in the Z-axis direction, adjusting the chuck table 30 The degree of inclination of the holding surface 300a with respect to the horizontal plane.

如圖1所示，例如在卡盤台30之移動路徑旁配設有接觸式之一對高度測量手段（高度規），亦即測量卡盤台30之保持面300a之高度用的第1高度測量手段381、及測量被保持於卡盤台30之工件W上表面Wb之高度用的第2高度測量手段382。As shown in FIG. 1, for example, a pair of contact-type height measuring means (height gauge) is arranged beside the moving path of the chuck table 30, that is, the first height for measuring the height of the holding surface 300a of the chuck table 30 The measuring means 381, and the second height measuring means 382 for measuring the height of the upper surface Wb of the workpiece W held on the chuck table 30.

第1高度測量手段381及第2高度測量手段382是在其各前端具備接觸頭，該接觸頭係在上下方向上昇降並接觸各被測量面，在將個別接觸頭以適當力推抵至各被測量面之狀態下，進行高度測量。又，第1高度測量手段381及第2高度測量手段382並不限定於接觸式高度規，例如可為反射型光感應器，該反射型光感應器係具備投光部及受光部，且可在非接觸下測量被測量面的高度。 第1高度測量手段381及第2高度測量手段382係與後述控制手段92電性連接。控制手段92係計算出高度差並當作工件W的厚度，該高度差是指在研削加工中，第2高度測量手段382所測量的工件W上表面Wb之高度與第1高度測量手段381所測量的卡盤台30保持面300a之高度的差。The first height measuring means 381 and the second height measuring means 382 are provided with contact heads at their respective front ends. The contact heads are moved up and down in the up-down direction to contact the measured surfaces. After pushing the individual contact heads to each The height is measured in the state of the measured surface. In addition, the first height measuring means 381 and the second height measuring means 382 are not limited to contact height gauges, and may be, for example, a reflective photo sensor. The reflective photo sensor includes a light projection unit and a light receiving unit. Measure the height of the measured surface without contact. The first height measuring means 381 and the second height measuring means 382 are electrically connected to the control means 92 described later. The control means 92 calculates the height difference and regards it as the thickness of the workpiece W. The height difference means that the height of the upper surface Wb of the workpiece W measured by the second height measuring means 382 and the first height measuring means 381 during the grinding process The measured difference in height of the chuck table 30 holding surface 300a.

如圖2所示，研削裝置1係具備原點位置設定機構9，用以設定研削單元6相對於卡盤台30之原點位置。原點位置設定機構9係具備：電流值檢測手段90，檢測研削單元6之馬達62的負載電流值；研削單元位置檢測手段91，檢測藉由研削單元進給機構7而移動之研削單元6的位置；及控制手段92，根據從電流值檢測手段90及研削單元位置檢測手段91所得到的檢測訊號而設定原點位置。As shown in FIG. 2, the grinding device 1 includes an origin position setting mechanism 9 for setting the origin position of the grinding unit 6 relative to the chuck table 30. The origin position setting mechanism 9 is provided with: current value detection means 90 to detect the load current value of the motor 62 of the grinding unit 6; grinding unit position detection means 91 to detect the grinding unit 6 moved by the grinding unit feed mechanism 7 Position; and control means 92, according to the detection signal obtained from the current value detection means 90 and grinding unit position detection means 91 and set the origin position.

控制手段92係由根據控制程式進行演算處理之CPU及記憶體等的記憶元件等所構成，並藉由未圖示之配線而與研削單元進給機構7、及未圖示之X軸方向移動手段等電性連接，在控制手段92的控制下，控制研削單元6藉由研削單元進給機構7而在Z軸方向上的移動開始及移動停止、及卡盤台30藉由X軸方向移動手段的移動開始及移動停止等。The control means 92 is composed of a memory element such as a CPU and a memory that performs calculation processing according to a control program, and moves with the grinding unit feed mechanism 7 and the X-axis direction not shown by wiring not shown Electrically connected by means, under the control of the control means 92, the grinding unit 6 is controlled by the grinding unit feed mechanism 7 to start and stop movement in the Z-axis direction, and the chuck table 30 is moved by the X-axis direction The movement of the means starts and stops.

研削單元位置檢測手段91例如具備：尺標910，固定於柱體17並在研削單元6的移動方向上（Z軸方向）延伸，及讀取部911，固定於昇降板73且沿著尺標910與昇降板73一起移動並讀取尺標910之刻度。讀取部911例如為光學式，讀取形成於尺標910之刻度的反射光，檢測尺標910之刻度，並檢測研削單元6在Z軸方向中的高度位置。The grinding unit position detection means 91 includes, for example, a scale 910 fixed to the cylinder 17 and extending in the moving direction of the grinding unit 6 (Z-axis direction), and a reading unit 911 fixed to the lifting plate 73 and along the scale 910 moves with the lifting plate 73 and reads the scale of the scale 910. The reading unit 911 is, for example, an optical type, reads the reflected light formed on the scale of the scale 910, detects the scale of the scale 910, and detects the height position of the grinding unit 6 in the Z-axis direction.

研削單元位置檢測手段91並不限定於上述例。例如，上述研削單元進給機構7之馬達72為脈衝馬達，該脈衝馬達係藉由未圖示之脈衝振盪器所供給的驅動脈衝而運作。研削單元位置檢測手段91係計算供給至馬達72之驅動脈衝數，而確認研削單元6的高度位置。又，也可為以下構成：將研削單元進給機構7之馬達72作為伺服馬達，並在伺服馬達連接旋轉編碼器。旋轉編碼器係由未圖示之伺服放大器對伺服馬達供給運作訊號後，將編碼器訊號（伺服馬達轉數）對研削單元位置檢測手段91輸出。研削單元位置檢測手段91係藉由所接收之編碼器訊號而計算出研削單元6在Z軸方向中的移動量，並確認其高度位置。The grinding unit position detection means 91 is not limited to the above example. For example, the motor 72 of the grinding unit feed mechanism 7 is a pulse motor, and the pulse motor is operated by driving pulses supplied by a pulse oscillator (not shown). The grinding unit position detection means 91 calculates the number of driving pulses supplied to the motor 72 and confirms the height position of the grinding unit 6. In addition, a configuration may be adopted in which the motor 72 of the grinding unit feed mechanism 7 is used as a servo motor, and a rotary encoder is connected to the servo motor. The rotary encoder is supplied with an operation signal from a servo amplifier (not shown) to the servo motor, and then outputs the encoder signal (revolution of the servo motor) to the grinding unit position detection means 91. The grinding unit position detection means 91 calculates the movement amount of the grinding unit 6 in the Z-axis direction from the received encoder signal, and confirms its height position.

以下說明使用研削裝置1實施本發明之原點位置設定方法時的各步驟。The following describes each step when the grinding device 1 is used to implement the origin position setting method of the present invention.

（1）修整板保持步驟 圖1所示的修整板B是，例如由用以實施研削磨石641之修整（削磨）的板狀磨石B1、及保持板狀磨石B1之圓形板狀保持板B2所構成。板狀磨石B1是，例如以適當結合劑黏著並固定金剛石磨粒或CBN磨粒並形成為圓形板狀。板狀磨石B1係以接著劑接著於保持板B2的上表面。 關於該修整板B之厚度T1（參照圖2）為已知資訊，預先記憶於控制手段92。(1) Maintenance steps of trimming board The dressing plate B shown in FIG. 1 is composed of, for example, a plate-shaped grindstone B1 for performing dressing (sharpening) of the grinding grindstone 641, and a circular plate-shaped holding plate B2 that holds the plate-shaped grindstone B1. The plate-shaped grindstone B1 is formed into a circular plate shape by bonding and fixing diamond abrasive grains or CBN abrasive grains with an appropriate binder, for example. The plate-shaped grindstone B1 is adhered to the upper surface of the holding plate B2 with an adhesive. The thickness T1 (see FIG. 2) of the trimming board B is known information, and is stored in the control means 92 in advance.

首先，在圖1所示研削裝置1之裝卸區域內，藉由未圖示之搬入搬出手段，將修整板B以表面B1a（板狀磨石B1的上表面）為上側之方式載置於卡盤台30的保持面300a上。接著，將藉由未圖示之吸引源所產生的吸引力傳達至保持面300a，藉此，如圖2所示，使卡盤台30在保持面300a上吸引保持修整板B。First, in the loading and unloading area of the grinding apparatus 1 shown in FIG. 1, the dressing plate B is placed on the card with the surface B1a (the upper surface of the plate-shaped grindstone B1) as the upper side by means of unloading and unloading means (not shown) On the holding surface 300a of the table 30. Next, the suction force generated by the suction source (not shown) is transmitted to the holding surface 300a, whereby, as shown in FIG. 2, the chuck table 30 attracts and holds the trimming plate B on the holding surface 300a.

極平緩的圓錐面之保持面300a，係以與研削磨石641（參照圖2）之研削面（下表面）平行的方式，藉由圖2所示之傾斜調節部35而調節卡盤台30的傾斜程度，藉此，緊貼圓錐面之保持面300a並被吸取保持之修整板B的表面B1a變得相對於研削磨石641之研削面呈平行。The holding surface 300a of the extremely gentle conical surface is adjusted parallel to the grinding surface (lower surface) of the grinding stone 641 (refer to FIG. 2), and the chuck table 30 is adjusted by the inclination adjusting portion 35 shown in FIG. The degree of inclination of the surface B1a of the dressing plate B that is close to the conical surface 300a and sucked and held becomes parallel to the grinding surface of the grinding stone 641.

（2）研削磨石接觸步驟 如圖2所示，卡盤台30係藉由未圖示之X軸方向進給手段而往+X方向移動至研削單元6的下方，並進行研削輪64與保持於卡盤台30之修整板B的對位。 進行研削輪64與修整板B的對位後，隨著以馬達62使主軸60旋轉驅動，研削輪64亦繞Z軸方向之軸心旋轉。 又，因為卡盤台30的目的並非修整研削磨石641，故吸引保持修整板B之卡盤台30可繞Z軸方向之軸心旋轉，或也可為不旋轉之狀態。(2) Grinding stone contact steps As shown in FIG. 2, the chuck table 30 is moved to the +X direction below the grinding unit 6 by the X-axis direction feeding means (not shown), and the grinding wheel 64 and the dressing held on the chuck table 30 are trimmed. Alignment of board B. After the alignment of the grinding wheel 64 and the dressing plate B, the spindle 62 is driven to rotate by the motor 62, and the grinding wheel 64 also rotates around the axis in the Z-axis direction. In addition, since the purpose of the chuck table 30 is not to dress the grinding stone 641, the chuck table 30 that attracts and holds the dressing plate B can rotate around the axis in the Z-axis direction, or it can be in a non-rotating state.

又，研削單元進給機構7係使研削單元6以對卡盤台30之保持面300a所保持之修整板B之表面B1a呈垂直且以預定研削進給速度下降。 若藉由研削單元進給機構7而開始研削單元6往－Z方向之研削進給時，則圖2所示的電流值檢測手段90開始檢測在旋轉驅動主軸60的馬達62之流動電流值。接著，電流值檢測手段90將所檢測出的馬達62之負載電流值的資訊依序作為檢測訊號而輸送至控制手段92，控制手段92開始監視旋轉驅動主軸60的馬達62之負載電流值。In addition, the grinding unit feed mechanism 7 causes the grinding unit 6 to be perpendicular to the surface B1a of the dressing plate B held by the holding surface 300a of the chuck table 30 and to decrease at a predetermined grinding feed rate. When the grinding feed of the grinding unit 6 in the −Z direction is started by the grinding unit feed mechanism 7, the current value detection means 90 shown in FIG. 2 starts to detect the flowing current value of the motor 62 that rotationally drives the spindle 60. Next, the current value detecting means 90 sends the detected information of the load current value of the motor 62 as a detection signal to the control means 92 in sequence, and the control means 92 starts monitoring the load current value of the motor 62 that rotationally drives the spindle 60.

在研削單元6之旋轉研削磨石641為空切狀態下，電流值檢測手段90所檢測之馬達62的負載電流值是成為未滿預先記憶於控制手段92之預定閾值（電流值）。又，該閾值係對應研削磨石641之旋轉速度或修整板B之板狀磨石B1之材質等，而以實驗性、經驗性、或理論性地選擇的電流值。 又，若藉由研削單元進給機構7而開始研削單元6往－Z方向之研削進給時，則藉由研削單元位置檢測手段91依序檢測研削單元6在Z軸方向中的位置，且研削單元位置檢測手段91將檢測訊號（位置資訊）依序發送至控制手段92。When the rotating grinding stone 641 of the grinding unit 6 is in an empty cut state, the load current value of the motor 62 detected by the current value detection means 90 becomes less than a predetermined threshold (current value) stored in the control means 92 in advance. In addition, the threshold value corresponds to the current value selected experimentally, empirically, or theoretically according to the rotation speed of the grinding stone 641 or the material of the plate-shaped grinding stone B1 of the dressing plate B, and the like. In addition, when the grinding feed of the grinding unit 6 in the -Z direction is started by the grinding unit feed mechanism 7, the position of the grinding unit 6 in the Z-axis direction is sequentially detected by the grinding unit position detection means 91, and The grinding unit position detection means 91 sends the detection signal (position information) to the control means 92 in order.

接著，以預定研削進給速度下降的研削單元6之旋轉研削磨石641與修整板B的表面B1a接觸。Next, the rotating grinding stone 641 of the grinding unit 6 which is lowered at the predetermined grinding feed rate comes into contact with the surface B1a of the dressing plate B.

（3）位置記憶步驟 原本空切中的研削磨石641接觸修整板B的表面B1a，亦即切入修整板B的表面B1a，因此施加於研削磨石641之研削負荷會變大。接著，在研削輪64旋轉途中時，持續由未圖示之電源供給電力至馬達62，因為即使在研削輪往修整板B之表面B1a切入而使作用在研削磨石641之負荷變大的情況下，也會使主軸60以固定轉數旋轉的方式反饋控制馬達62，故馬達62之負載電流值會上升。亦即，電流值檢測手段90所檢測之馬達62的電流值會急速上升至閾值以上。接著，因為該負載電流值變為閾值以上，所以藉由從電流值檢測手段90所送達的檢測訊號，對旋轉驅動主軸60之馬達62的負載電流值進行監視之控制手段92，會判斷研削磨石641已切入（接觸）修整板B之表面B1a，並停止藉由研削單元進給機構7之往研削單元6的－Z方向之研削進給。(3) Location memory steps The grinding stone 641 in the original empty cutting contacts the surface B1a of the dressing board B, that is, the surface B1a cut into the dressing board B, so the grinding load applied to the grinding stone 641 becomes larger. Next, while the grinding wheel 64 is rotating, power is continuously supplied to the motor 62 from a power source (not shown), because even if the grinding wheel cuts into the surface B1a of the dressing plate B, the load acting on the grinding stone 641 becomes large Next, the main shaft 60 will be fed back to control the motor 62 at a fixed number of rotations, so the load current value of the motor 62 will increase. That is, the current value of the motor 62 detected by the current value detection means 90 will rapidly rise above the threshold. Next, because the load current value becomes more than the threshold value, the control means 92 that monitors the load current value of the motor 62 that rotationally drives the spindle 60 by the detection signal sent from the current value detection means 90 will judge the grinding The stone 641 has cut (contacted) the surface B1a of the finishing board B, and stopped the grinding feed to the grinding unit 6 by the grinding unit feed mechanism 7 in the -Z direction.

又，控制手段92記憶在馬達62負載電流值變成為閾值以上之時間點中的研削單元6的位置。亦即，控制手段92是在停止研削單元進給機構7之往研削單元6的－Z方向之研削進給的時間點中，藉由從研削單元位置檢測手段91所送達的檢測訊號，掌握並記憶該時間點中之研削單元6的位置Z1。Moreover, the control means 92 memorizes the position of the grinding unit 6 at the time when the load current value of the motor 62 becomes equal to or higher than the threshold value. That is, the control means 92 is to grasp and detect the detection signal sent from the grinding unit position detection means 91 at the time when the grinding feed to the grinding unit 6 in the -Z direction of the grinding unit feed mechanism 7 is stopped. The position Z1 of the grinding unit 6 at this time is memorized.

（4）原點位置之設定 以上述方式實施位置記憶步驟後，控制手段92係以由研削單元6的位置Z1減去修整板B厚度T1所得的位置Z2，作為研削單元6之研削磨石641相對於卡盤台30保持面300a之原點位置，亦即，作為研削磨石641接觸保持面300a時之研削單元6的高度位置，並設定（設置）於研削裝置1。例如，在研削單元進給機構7之馬達72為脈衝馬達的情況下，控制手段92係記憶作為原點位置之脈衝數0的位置。 如上述方式實施設置，該設置係確認研削磨石641之研削面（下表面）接觸卡盤台30之保持面300a時的研削單元6的高度位置，換言之，研削裝置1高精確度地掌握由卡盤台30之保持面300a至研削磨石641之研削面（下表面）的相對距離，藉此，在以圖1所示之卡盤台30保持工件W並進行研削的情況下，能夠以該高度位置Z2作為基準來決定研削單元6之研削進給位置，可對工件W進行高精確度之研削加工。(4) Setting of origin position After performing the position memory step in the above manner, the control means 92 takes the position Z2 obtained by subtracting the thickness T1 of the trimming plate B from the position Z1 of the grinding unit 6 as the grinding surface 641 of the grinding unit 6 relative to the chuck table 30 holding surface The origin position of 300a, that is, the height position of the grinding unit 6 when the grinding stone 641 contacts the holding surface 300a, is set (installed) in the grinding device 1. For example, when the motor 72 of the grinding unit feed mechanism 7 is a pulse motor, the control means 92 memorizes the position of the pulse number 0 as the origin position. The setting is carried out as described above, and this setting confirms the height position of the grinding unit 6 when the grinding surface (lower surface) of the grinding stone 641 contacts the holding surface 300a of the chuck table 30, in other words, the grinding device 1 grasps with high accuracy The relative distance between the holding surface 300a of the chuck table 30 and the grinding surface (lower surface) of the grinding stone 641, by which the workpiece W is held by the chuck table 30 shown in FIG. This height position Z2 is used as a reference to determine the grinding feed position of the grinding unit 6, and the workpiece W can be ground with high accuracy.

本發明之原點位置設定機構9係藉由研削單元進給機構7使旋轉之研削磨石641於垂直方向往卡盤台30移動，研削磨石641之研削面與保持於卡盤台30之保持面300a的修整板B之表面B1a接觸，藉此，因為能在研削單元6之馬達62之負載電流值變成為預先設定閾值以上之時間點中，將研削單元位置檢測手段91所檢測出的研削單元6之位置Z1減去修整板B之厚度T1所得的位置Z2設定作為原點位置，故可不使用接觸感應器而完成，且可高精確度地設置。The origin position setting mechanism 9 of the present invention moves the rotating grinding stone 641 to the chuck table 30 in the vertical direction by the grinding unit feed mechanism 7, and the grinding surface of the grinding stone 641 is held by the chuck table 30. The surface B1a of the trimming plate B of the holding surface 300a is in contact, whereby it is possible to detect the grinding unit position detection means 91 at a time point when the load current value of the motor 62 of the grinding unit 6 becomes a predetermined threshold value or more The position Z2 obtained by subtracting the thickness T1 of the trimming plate B from the position Z1 of the grinding unit 6 is set as the origin position, so it can be completed without using a touch sensor and can be set with high accuracy.

本發明之原點位置設定方法係具備：研削磨石接觸步驟，係藉由研削單元進給機構7而將以研削單元6之馬達62旋轉之研削磨石641於垂直方向往卡盤台30移動，並使研削磨石641接觸修整板B表面B1a；及位置記憶步驟，在旋轉之研削磨石641接觸修整板B之表面B1a且馬達62之負載電流值成為閾值以上之時間點中，記憶研削單元6的位置Z1。因為可將由位置記憶步驟所記憶之研削單元6的位置Z1減去修整板B之厚度T1所得的位置Z2設定作為原點位置，故可不使用接觸感應器而完成，且可進行高精確度地設置。The origin position setting method of the present invention includes: a grinding grindstone contacting step, which moves the grinding grindstone 641 rotated by the motor 62 of the grinding unit 6 to the chuck table 30 in the vertical direction by the grinding unit feed mechanism 7 , And make the grinding stone 641 contact the surface B1a of the dressing board B; and the position memory step, at the time point when the rotating grinding stone 641 contacts the surface B1a of the dressing board B and the load current value of the motor 62 becomes above the threshold, the memory grinding Location Z1 of unit 6. Since the position Z1 obtained by subtracting the thickness T1 of the trimming plate B from the position Z1 of the grinding unit 6 memorized by the position memory step can be set as the origin position, it can be completed without using a contact sensor and can be set with high accuracy .

又，以下表示本發明之原點位置設定機構9及原點位置設定方法的效果之具體例（與以往手動設置比較）。 以往研削裝置1所進行手動設置為：操作者以手動將研削磨石641往接近卡盤台30之方向研削進給，且檢測研削磨石641之研削面接觸卡盤台30之保持面300a的位置，並作為原點位置。或是操作者使用預定厚度的基準片（塊規），並找出在研削磨石641之研削面及卡盤台30之保持面300a之間無間隙地容納塊規之狀態，藉此進行該手動設置。並且，在手動設置中，研削磨石641之研削面（下表面）接觸卡盤台30之保持面300a時，研削單元6之高度位置之公差為約20～約25μm的程度。In addition, the following shows specific examples of the effects of the origin position setting mechanism 9 and origin position setting method of the present invention (compared to the conventional manual setting). Conventionally, the grinding device 1 is manually set such that the operator manually grinds and feeds the grinding stone 641 toward the chuck table 30, and detects that the grinding surface of the grinding stone 641 contacts the holding surface 300a of the chuck table 30. Position, and as the origin position. Or the operator uses a reference sheet (block gauge) of a predetermined thickness and finds the state where the block gauge is accommodated without gaps between the grinding surface of the grinding stone 641 and the holding surface 300a of the chuck table 30, thereby performing the manual Settings. In addition, in the manual setting, when the grinding surface (lower surface) of the grinding stone 641 contacts the holding surface 300 a of the chuck table 30, the tolerance of the height position of the grinding unit 6 is about 20 to 25 μm.

在上述所說明之（3）位置記憶步驟中，在研削磨石641接觸修整板B之表面B1a後，才呈現馬達62之電流值變為閾值以上之變化，亦即在電流值檢測手段90可檢測到該變化為止，會有些微時滯。該時滯為，例如在研削單元6以研削進給速度50μm／秒的研削進給的情況下為0.25秒，以研削進給速度1μm／秒研削進給的情況下變成為10秒，以研削進給速度0.5μm／秒研削進給的情況下變成為20秒的程度。伴隨著該時滯，在研削磨石641接觸修整板B之表面B1a後，到電流值檢測手段90可檢測到該變化為止之研削磨石641的研削量為，在研削進給速度50μm／秒的情況下為12.5μm，在研削進給速度1μm／秒的情況下變成為10μm，在研削進給速度0.5μm／秒的情況下變成為7.5μm程度。In the position memory step (3) described above, the grinding wheel 641 contacts the surface B1a of the dressing board B, and then the current value of the motor 62 changes above the threshold value, that is, the current value detection means 90 can There will be a slight time lag until the change is detected. The time lag is, for example, 0.25 seconds in the case of grinding feed at the grinding feed rate of 50 μm/sec, and becomes 10 seconds in the case of grinding feed at the grinding feed rate of 1 μm/sec. When the feed rate is 0.5 μm/sec grinding feed, it becomes about 20 seconds. With this time lag, after the grinding stone 641 contacts the surface B1a of the dressing board B, the grinding amount of the grinding stone 641 until the current value detection means 90 can detect the change is, the grinding feed rate is 50 μm/sec Is 12.5 μm, 10 μm when the grinding feed rate is 1 μm/sec, and about 7.5 μm when the grinding feed rate is 0.5 μm/sec.

又，電流值檢測手段90檢測到馬達62之電流值變成為閾值以上的變化，並將該檢測訊號傳送至控制手段92，而在接收到檢測訊號後的控制手段92停止藉由研削單元進給機構7之往研削單元6之－Z方向的研削進給為止，也會有些微時滯。因該時滯，在電流值檢測手段90檢測到馬達62之電流值變成為閾值以上之變化後，到停止往研削單元6之－Z方向的研削進給為止之研削磨石641的研削量為，在研削進給速度50μm／秒的情況下為8μm，在研削進給速度1μm／秒的情況下變成為0.16μm，在研削進給速度0.5μm／秒的情況下變成為0.08μm程度。In addition, the current value detection means 90 detects that the current value of the motor 62 becomes a threshold or more, and transmits the detection signal to the control means 92, and after receiving the detection signal, the control means 92 stops feeding by the grinding unit There will be a slight time lag between the mechanism 7 and the grinding feed of the grinding unit 6 in the -Z direction. Due to this time lag, after the current value detection means 90 detects that the current value of the motor 62 becomes a threshold value or more, the grinding amount of the grinding stone 641 until the grinding feed to the grinding unit 6 in the -Z direction is stopped is It is 8 μm when the grinding feed rate is 50 μm/sec, 0.16 μm when the grinding feed rate is 1 μm/sec, and it is about 0.08 μm when the grinding feed rate is 0.5 μm/sec.

因此，本發明之原點位置設定機構9及原點位置設定方法中，可得到研削磨石641之研削面（下表面）接觸卡盤台30之保持面300a時的研削單元6之高度位置的公差為，在研削進給速度50μm／秒的情況下為12.5μm+8μm=20.5μm，在研削進給速度1μm/秒的情況下變成為10μm+0.16μm=10.16μm，在研削進給速度0.5μm／秒的情況下變成為7.5μm+0.08μm=7.58μm。因此，因為公差最大也只有在研削進給速度50μm／秒的情況下的20.5μm，故即使與以往手動設置中的公差約20～25μm相比，本發明之原點位置設定機構9及原點位置設定方法也能夠以同等以上之精確度進行設置。Therefore, in the origin position setting mechanism 9 and the origin position setting method of the present invention, the height position of the grinding unit 6 when the grinding surface (lower surface) of the grinding stone 641 contacts the holding surface 300a of the chuck table 30 can be obtained The tolerance is 12.5μm+8μm=20.5μm at the grinding feed rate of 50μm/sec, and becomes 10μm+0.16μm=10.16μm at the grinding feed rate of 1μm/sec and 0.5 at the grinding feed rate In the case of μm/sec, it becomes 7.5 μm+0.08 μm=7.58 μm. Therefore, since the maximum tolerance is only 20.5 μm when the grinding feed rate is 50 μm/sec, the origin position setting mechanism 9 and the origin of the present invention are compared with the tolerance of about 20 to 25 μm in the conventional manual setting. The position setting method can also be set with the same accuracy or more.

本發明之原點位置設定機構9及原點位置設定方法並不限定於上述實施方式，在其技術思想範圍內可以各種不同方式實施，此係不需贅言。又，關於隨附圖面所示之研削裝置1的各構成必要條件也並不限定於此，在可發揮本發明效果的範圍內能適當變更。The origin position setting mechanism 9 and origin position setting method of the present invention are not limited to the above-mentioned embodiments, and can be implemented in various ways within the scope of the technical idea, which is needless to say. In addition, the requirements for each configuration of the grinding device 1 shown in the accompanying drawings are not limited to this, and can be appropriately changed within the range in which the effects of the present invention can be exerted.

1‧‧‧研削裝置 10‧‧‧基台 17‧‧‧柱體 30‧‧‧卡盤台 300‧‧‧吸附部 300a‧‧‧保持面 301‧‧‧框體 32‧‧‧旋轉手段 35‧‧‧傾斜調節部 381‧‧‧第1高度測量手段 382‧‧‧第2高度測量手段 39‧‧‧罩蓋 6‧‧‧研削單元 60‧‧‧主軸 61‧‧‧外殼 62‧‧‧馬達 63‧‧‧底座 64‧‧‧研削輪 640‧‧‧輪基台 641‧‧‧研削磨石 7‧‧‧研削單元進給機構 72‧‧‧馬達 9‧‧‧原點位置設定機構 90‧‧‧電流值檢測手段 91‧‧‧研削單元位置檢測手段 910‧‧‧尺標 911‧‧‧讀取部 92‧‧‧控制手段 B‧‧‧ 修整板 W‧‧‧工件1‧‧‧ Grinding device 10‧‧‧Abutment 17‧‧‧pillar 30‧‧‧Chuck table 300‧‧‧Adsorption Department 300a‧‧‧Keep 301‧‧‧frame 32‧‧‧Rotation means 35‧‧‧Tilt adjustment section 381‧‧‧The first height measurement method 382‧‧‧The second height measurement method 39‧‧‧Cover 6‧‧‧ Grinding unit 60‧‧‧spindle 61‧‧‧Housing 62‧‧‧Motor 63‧‧‧Base 64‧‧‧ Grinding wheel 640‧‧‧wheel abutment 641‧‧‧ grinding stone 7‧‧‧ Grinding unit feed mechanism 72‧‧‧Motor 9‧‧‧Origin position setting mechanism 90‧‧‧Current value detection method 91‧‧‧ Grinding unit position detection method 910‧‧‧foot scale 911‧‧‧Reading Department 92‧‧‧Control B‧‧‧ Trimming board W‧‧‧Workpiece

圖1係表示研削裝置一例之斜視圖。 圖2係說明研削裝置的原點位置設定方法之剖面圖。Fig. 1 is a perspective view showing an example of a grinding device. 2 is a cross-sectional view illustrating a method of setting the origin position of the grinding device.

1‧‧‧研削裝置 1‧‧‧ Grinding device

10‧‧‧基台 10‧‧‧Abutment

17‧‧‧柱體 17‧‧‧pillar

30‧‧‧卡盤台 30‧‧‧Chuck table

300‧‧‧吸附部 300‧‧‧Adsorption Department

300a‧‧‧保持面 300a‧‧‧Keep

301‧‧‧框體 301‧‧‧frame

32‧‧‧旋轉手段 32‧‧‧Rotation means

35‧‧‧傾斜調節部 35‧‧‧Tilt adjustment section

35a‧‧‧支持柱 35a‧‧‧support column

35b‧‧‧螺絲部 35b‧‧‧Screw part

35c‧‧‧連結器 35c‧‧‧Connector

35d‧‧‧馬達 35d‧‧‧Motor

35e‧‧‧連結部 35e‧‧‧Link

381‧‧‧第1高度測量手段 381‧‧‧The first height measurement method

382‧‧‧第2高度測量手段 382‧‧‧The second height measurement method

6‧‧‧研削單元 6‧‧‧ Grinding unit

60‧‧‧主軸 60‧‧‧spindle

61‧‧‧外殼 61‧‧‧Housing

62‧‧‧馬達 62‧‧‧Motor

63‧‧‧底座 63‧‧‧Base

64‧‧‧研削輪 64‧‧‧ Grinding wheel

640‧‧‧輪基台 640‧‧‧wheel abutment

641‧‧‧研削磨石 641‧‧‧ grinding stone

7‧‧‧研削單元進給機構 7‧‧‧ Grinding unit feed mechanism

70‧‧‧滾珠螺桿 70‧‧‧ball screw

71‧‧‧導軌 71‧‧‧rail

72‧‧‧馬達 72‧‧‧Motor

73‧‧‧昇降板 73‧‧‧ Lifting board

74‧‧‧支架 74‧‧‧Bracket

9‧‧‧原點位置設定機構 9‧‧‧Origin position setting mechanism

90‧‧‧電流值檢測手段 90‧‧‧Current value detection method

91‧‧‧研削單元位置檢測手段 91‧‧‧ Grinding unit position detection method

910‧‧‧尺標 910‧‧‧foot scale

911‧‧‧讀取部 911‧‧‧Reading Department

92‧‧‧控制手段 92‧‧‧Control

B‧‧‧修整板 B‧‧‧Finishing board

B1‧‧‧板狀磨石 B1‧‧‧Slabstone

B1a‧‧‧修整板表面 B1a‧‧‧ Finishing board surface

B2‧‧‧保持板 B2‧‧‧ keep plate

T1‧‧‧修整板之厚度 T1‧‧‧ Thickness of trimming board

Z1‧‧‧研削單元的位置 Z1‧‧‧Position of grinding unit

Z2‧‧‧研削單元位置減去修整板厚度所得的位置 Z2‧‧‧The position of grinding unit minus the thickness of trimming board

Claims (2)

一種研削裝置的原點位置設定機構，用於設定研削磨石之相對於卡盤台的原點位置；該研削裝置具備：卡盤台，具備保持工件之保持面；研削單元，具備主軸及使該主軸旋轉驅動的馬達，該主軸裝設有將保持於該卡盤台之工件進行研削的研削磨石；及研削單元進給機構，使該研削單元在與該卡盤台之保持面垂直的方向上移動；該研削裝置的原點位置設定機構之特徵在於具備： 電流值檢測手段，檢測該馬達之負載電流值； 研削單元位置檢測手段，檢測藉由該研削單元進給機構而被移動之該研削單元的位置；及 控制手段，根據從該電流值檢測手段及該研削單元位置檢測手段得到的檢測訊號而設定該原點位置； 該控制手段係藉由該研削單元進給機構而使旋轉之該研削磨石在垂直方向往該卡盤台移動，使該研削磨石之研削面接觸修整板表面，該修整板具備被保持於該卡盤台保持面且用以修整該研削磨石之板狀磨石，藉此，在該馬達之負載電流值變成為預先設定閾值以上的時間點，將從該研削單元位置檢測手段所檢測出之該研削單元之位置減去該修整板之厚度所得的位置，設定為該原點位置。An origin position setting mechanism of a grinding device for setting the origin position of a grinding stone relative to a chuck table; the grinding device includes: a chuck table with a holding surface for holding a workpiece; a grinding unit with a spindle and an A motor driven by the rotation of the main shaft, the main shaft is equipped with a grinding stone for grinding the workpiece held on the chuck table; and a feed mechanism of the grinding unit, so that the grinding unit is perpendicular to the holding surface of the chuck table Move in the direction; the origin position setting mechanism of this grinding device is characterized by: Current value detection means to detect the load current value of the motor; Grinding unit position detection means to detect the position of the grinding unit moved by the grinding unit feed mechanism; and The control means sets the origin position based on the detection signals obtained from the current value detection means and the grinding unit position detection means; The control means moves the grinding grindstone rotating in the vertical direction to the chuck table by the grinding unit feed mechanism, so that the grinding surface of the grinding grindstone contacts the surface of the dressing plate, and the dressing plate is provided with The chuck table holding surface is used for dressing the plate-shaped grindstone of the grinding grindstone, whereby, when the load current value of the motor becomes a predetermined threshold value or more, it will be detected from the grinding unit position detection means The position obtained by subtracting the thickness of the dressing plate from the position of the grinding unit is set as the origin position. 一種研削裝置的原點位置設定方法，用於設定研削磨石之相對於卡盤台的原點位置；該研削裝置具備：卡盤台，具備保持工件之保持面；研削單元，具備主軸及使該主軸旋轉驅動的馬達，該主軸裝設有將保持於該卡盤台之工件進行研削的研削磨石；及研削單元進給機構，使該研削單元在與該卡盤台之保持面垂直的方向上移動；該研削裝置的原點位置設定方法之特徵在於具備： 修整板保持步驟，將修整板保持於該卡盤台，該修整板具備用於實施該研削磨石之修整的板狀磨石； 研削磨石接觸步驟，藉由該研削單元進給機構而將以該馬達旋轉之該研削磨石在垂直方向往該卡盤台移動，使該研削磨石接觸該修整板之表面；及 位置記憶步驟，在該馬達之負載電流值變成為閾值以上之時間點，記憶該研削單元的位置； 將由該位置記憶步驟所記憶之研削單元的位置減去該修整板之厚度所得的位置，設定為該原點位置。A method for setting the origin position of a grinding device for setting the origin position of a grinding stone relative to a chuck table; the grinding device includes: a chuck table with a holding surface for holding a workpiece; a grinding unit with a spindle and an A motor driven by the rotation of the main shaft, the main shaft is equipped with a grinding stone for grinding the workpiece held on the chuck table; and a feed mechanism of the grinding unit, so that the grinding unit is perpendicular to the holding surface of the chuck table Move in the direction; the origin position setting method of this grinding device is characterized by: The dressing plate holding step is to hold the dressing plate on the chuck table, and the dressing plate is provided with a plate-shaped grindstone for carrying out the dressing of the grinding stone; A grinding grindstone contacting step, the grinding grindstone rotated by the motor is moved to the chuck table in a vertical direction by the grinding unit feeding mechanism, so that the grinding grindstone contacts the surface of the dressing plate; and In the position memory step, when the load current value of the motor becomes above the threshold, the position of the grinding unit is memorized; The position obtained by subtracting the thickness of the dressing plate from the position of the grinding unit memorized in the position memory step is set as the origin position.
TW108126586A 2018-07-31 2019-07-26 Origin position setting mechanism and origin position setting method for grinding device installing a grinding device with high precision without using a contact sensor TW202007479A (en)

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