JP2013133469A - Hddモータ用接着樹脂組成物及びそれを用いたhdd用モータ - Google Patents
Hddモータ用接着樹脂組成物及びそれを用いたhdd用モータ Download PDFInfo
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- JP2013133469A JP2013133469A JP2012043035A JP2012043035A JP2013133469A JP 2013133469 A JP2013133469 A JP 2013133469A JP 2012043035 A JP2012043035 A JP 2012043035A JP 2012043035 A JP2012043035 A JP 2012043035A JP 2013133469 A JP2013133469 A JP 2013133469A
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B19/00—Driving, starting, stopping record carriers not specifically of filamentary or web form, or of supports therefor; Control thereof; Control of operating function ; Driving both disc and head
- G11B19/20—Driving; Starting; Stopping; Control thereof
- G11B19/2009—Turntables, hubs and motors for disk drives; Mounting of motors in the drive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B19/00—Driving, starting, stopping record carriers not specifically of filamentary or web form, or of supports therefor; Control thereof; Control of operating function ; Driving both disc and head
- G11B19/20—Driving; Starting; Stopping; Control thereof
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Permanent Field Magnets Of Synchronous Machinery (AREA)
- Epoxy Resins (AREA)
Abstract
【解決手段】本発明によるHDDモータ用接着樹脂組成物は、ビスフェノールEエポキシ樹脂(Bisphenol E−Epoxy Resin)25から35重量部と、エポキシ樹脂(Epoxy Resin)10から25重量部と、メルカプタン(Mercaptan)10から20重量部と、イミダゾール(Imidazole)5から15重量部と、を含む。
【選択図】図1
Description
100 モータ用ベースアセンブリ
110 ベース
112 突出部
114 本体部
120 プーリングプレート
170 接着樹脂組成物
210 シャフト
220 スリーブ
230 コイル
240 コア
250 ハブ
260 マグネット
Claims (10)
- ビスフェノールEエポキシ樹脂(Bisphenol E−Epoxy Resin)25から35重量部と、エポキシ樹脂(Epoxy Resin)10から25重量部と、メルカプタン(Mercaptan)10から20重量部と、イミダゾール(Imidazole)5から15重量部と、を含む、HDDモータ用接着樹脂組成物。
- 前記接着樹脂組成物は、シリカ(Silica)1から10重量部をさらに含む、請求項1に記載のHDDモータ用接着樹脂組成物。
- 前記接着樹脂組成物は、安定剤(Stabilizer)1から3重量部をさらに含む、請求項1に記載のHDDモータ用接着樹脂組成物。
- 前記エポキシ樹脂(Epoxy Resin)は、ビスフェノールA型、ビスフェノールF型、ビスフェノールS型、ビスフェノールAF型、ビフェニル(Biphenyl)型、ナフタレン(Naphthalene)型、フルオレン(Fluorene)型、ノボラック(Novolac)型及びグリシジルエーテル(Glycidyl Ether)型エポキシからなる群より選択された一つ以上である、請求項1に記載のHDDモータ用接着樹脂組成物。
- 前記接着樹脂組成物は、前記HDDモータのベース(Base)とコア(Core)、ベース(Base)とプーリングプレート(Pulling−Plate)、ハブ(Hub)とマグネット(Magnet)からなる群より選択された一つ以上を接着する、請求項1に記載のHDDモータ用接着樹脂組成物。
- ビスフェノールEエポキシ樹脂(Bisphenol E−Epoxy Resin)25から35重量部と、エポキシ樹脂(Epoxy Resin)10から25重量部と、メルカプタン(Mercaptan)10から20重量部と、イミダゾール(Imidazole)5から15重量部と、を含む接着樹脂組成物を含む、HDD用モータ。
- 前記接着樹脂組成物は、シリカ(Silica)1から10重量部をさらに含む、請求項6に記載のHDD用モータ。
- 前記接着樹脂組成物は、安定剤(Stabilizer)1から3重量部をさらに含む、請求項6に記載のHDD用モータ。
- 前記エポキシ樹脂(Epoxy Resin)は、ビスフェノールA型、ビスフェノールF型、ビスフェノールS型、ビスフェノールAF型、ビフェニル(Biphenyl)型、ナフタレン(Naphthalene)型、フルオレン(Fluorene)型、ノボラック(Novolac)型及びグリシジルエーテル(Glycidyl Ether)型エポキシからなる群より選択された一つ以上である、請求項6に記載のHDD用モータ。
- 前記接着樹脂組成物は、前記HDDモータのベース(Base)とコア(Core)、ベース(Base)とプーリングプレート(Pulling−Plate)、ハブ(Hub)とマグネット(Magnet)からなる群より選択された一つ以上を接着する、請求項6に記載のHDD用モータ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110140028A KR101328297B1 (ko) | 2011-12-22 | 2011-12-22 | Hdd 모터용 접착수지 조성물 및 이를 이용한 hdd용 모터 |
KR10-2011-0140028 | 2011-12-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013133469A true JP2013133469A (ja) | 2013-07-08 |
JP5551194B2 JP5551194B2 (ja) | 2014-07-16 |
Family
ID=48633383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012043035A Expired - Fee Related JP5551194B2 (ja) | 2011-12-22 | 2012-02-29 | Hddモータ用接着樹脂組成物及びそれを用いたhdd用モータ |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130165551A1 (ja) |
JP (1) | JP5551194B2 (ja) |
KR (1) | KR101328297B1 (ja) |
CN (1) | CN103173174B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104774584A (zh) * | 2014-12-29 | 2015-07-15 | 北京海斯迪克新材料有限公司 | 一种用于led背光模组lens粘接的单组份环氧胶粘剂 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11199842A (ja) * | 1998-01-08 | 1999-07-27 | Matsushita Electric Ind Co Ltd | 電子部品実装用接着剤および電子部品の実装方法 |
JPH11199651A (ja) * | 1998-01-12 | 1999-07-27 | Sumitomo Bakelite Co Ltd | デバイス中空パッケージ封止用紫外線硬化型接着剤樹脂組成物 |
JP2001002893A (ja) * | 1999-06-17 | 2001-01-09 | Sumitomo Metal Mining Co Ltd | 一液熱硬化型樹脂組成物 |
JP2002069413A (ja) * | 2000-08-25 | 2002-03-08 | Three Bond Co Ltd | Hdd用接着剤組成物 |
JP2002206019A (ja) * | 2000-09-12 | 2002-07-26 | Mitsui Chemicals Inc | リン含有エポキシ樹脂、該樹脂を用いた難燃性高耐熱エポキシ樹脂組成物及び積層板 |
JP2003138244A (ja) * | 2001-11-05 | 2003-05-14 | Sumitomo Bakelite Co Ltd | 半導体用樹脂ペースト及び半導体装置 |
JP2003147317A (ja) * | 2001-11-16 | 2003-05-21 | Hitachi Chem Co Ltd | 接着用樹脂ペースト組成物及びこれを用いた半導体装置 |
JP2006124531A (ja) * | 2004-10-29 | 2006-05-18 | Shin Etsu Chem Co Ltd | 異方導電性接着剤 |
JP2010013493A (ja) * | 2008-07-01 | 2010-01-21 | Three Bond Co Ltd | エポキシ樹脂組成物 |
JP2010165421A (ja) * | 2009-01-16 | 2010-07-29 | Nippon Densan Corp | スピンドルモータ、それを用いたディスク駆動装置、及びスピンドルモータの製造方法 |
JP2010248380A (ja) * | 2009-04-16 | 2010-11-04 | Shin-Etsu Chemical Co Ltd | 接着剤組成物、並びにそれを用いた接着シート及びカバーレイフィルム |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999036484A1 (en) * | 1998-01-16 | 1999-07-22 | Loctite (R & D) Limited | Curable epoxy-based compositions |
US6153719A (en) * | 1998-02-04 | 2000-11-28 | Lord Corporation | Thiol-cured epoxy composition |
JP2000239638A (ja) * | 1999-02-25 | 2000-09-05 | Sumitomo Bakelite Co Ltd | 半導体用ダイアタッチペースト |
US6872762B2 (en) * | 2000-07-13 | 2005-03-29 | Loctite (R&D) Limited | Epoxy resin composition with solid organic acid |
JP4899479B2 (ja) * | 2004-01-22 | 2012-03-21 | 味の素株式会社 | 一液性エポキシ樹脂組成物 |
JP2007091899A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
CN103189412A (zh) * | 2010-11-05 | 2013-07-03 | 汉高爱尔兰有限公司 | 具有改善的稳定性的环氧-硫醇组合物 |
-
2011
- 2011-12-22 KR KR1020110140028A patent/KR101328297B1/ko active IP Right Grant
-
2012
- 2012-02-23 US US13/403,426 patent/US20130165551A1/en not_active Abandoned
- 2012-02-29 JP JP2012043035A patent/JP5551194B2/ja not_active Expired - Fee Related
- 2012-03-02 CN CN201210054243.4A patent/CN103173174B/zh not_active Expired - Fee Related
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11199842A (ja) * | 1998-01-08 | 1999-07-27 | Matsushita Electric Ind Co Ltd | 電子部品実装用接着剤および電子部品の実装方法 |
JPH11199651A (ja) * | 1998-01-12 | 1999-07-27 | Sumitomo Bakelite Co Ltd | デバイス中空パッケージ封止用紫外線硬化型接着剤樹脂組成物 |
JP2001002893A (ja) * | 1999-06-17 | 2001-01-09 | Sumitomo Metal Mining Co Ltd | 一液熱硬化型樹脂組成物 |
JP2002069413A (ja) * | 2000-08-25 | 2002-03-08 | Three Bond Co Ltd | Hdd用接着剤組成物 |
JP2002206019A (ja) * | 2000-09-12 | 2002-07-26 | Mitsui Chemicals Inc | リン含有エポキシ樹脂、該樹脂を用いた難燃性高耐熱エポキシ樹脂組成物及び積層板 |
JP2003138244A (ja) * | 2001-11-05 | 2003-05-14 | Sumitomo Bakelite Co Ltd | 半導体用樹脂ペースト及び半導体装置 |
JP2003147317A (ja) * | 2001-11-16 | 2003-05-21 | Hitachi Chem Co Ltd | 接着用樹脂ペースト組成物及びこれを用いた半導体装置 |
JP2006124531A (ja) * | 2004-10-29 | 2006-05-18 | Shin Etsu Chem Co Ltd | 異方導電性接着剤 |
JP2010013493A (ja) * | 2008-07-01 | 2010-01-21 | Three Bond Co Ltd | エポキシ樹脂組成物 |
JP2010165421A (ja) * | 2009-01-16 | 2010-07-29 | Nippon Densan Corp | スピンドルモータ、それを用いたディスク駆動装置、及びスピンドルモータの製造方法 |
JP2010248380A (ja) * | 2009-04-16 | 2010-11-04 | Shin-Etsu Chemical Co Ltd | 接着剤組成物、並びにそれを用いた接着シート及びカバーレイフィルム |
Also Published As
Publication number | Publication date |
---|---|
CN103173174B (zh) | 2015-05-27 |
US20130165551A1 (en) | 2013-06-27 |
JP5551194B2 (ja) | 2014-07-16 |
KR101328297B1 (ko) | 2013-11-14 |
CN103173174A (zh) | 2013-06-26 |
KR20130072550A (ko) | 2013-07-02 |
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