JP2013019746A5 - - Google Patents
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- JP2013019746A5 JP2013019746A5 JP2011152732A JP2011152732A JP2013019746A5 JP 2013019746 A5 JP2013019746 A5 JP 2013019746A5 JP 2011152732 A JP2011152732 A JP 2011152732A JP 2011152732 A JP2011152732 A JP 2011152732A JP 2013019746 A5 JP2013019746 A5 JP 2013019746A5
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- Prior art keywords
- substrate
- electronic device
- pedestal
- electronic
- recess
- Prior art date
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Description
このような目的は、下記の本発明により達成される。
本発明の電子デバイスは、第１の電子部品を備えた第１の基板を搭載した台座と、第２の電子部品を備えた第２の基板を搭載し、且つ前記台座に固定された蓋部材と、を備え、前記第１の基板と前記第２の基板とは、接続部材で互いに接続されていることを特徴とする。また、前記接続部材は、可撓性を有する部材であることを特徴とする。また、前記第１の基板には、第３の電子部品を有した第３の基板が接続されており、前記第３の基板は、前記台座に搭載されていることを特徴とする。また、前記第１の電子部品および前記第２の電子部品の少なくとも一つはセンサー部品であることを特徴とする。
これにより、小型化を図りつつ、電子部品の位置決めを簡単かつ正確に行うことができる電子デバイスを提供することができる。
Such an object is achieved by the present invention described below.
An electronic device according to the present invention includes a pedestal on which a first substrate having a first electronic component is mounted, and a lid member on which a second substrate having a second electronic component is mounted and fixed to the pedestal. The first substrate and the second substrate are connected to each other by a connecting member. The connecting member is a member having flexibility. In addition, a third substrate having a third electronic component is connected to the first substrate, and the third substrate is mounted on the pedestal. Further, at least one of the first electronic component and the second electronic component is a sensor component.
Accordingly, it is possible to provide an electronic device capable of easily and accurately positioning an electronic component while reducing the size.
本発明の電子デバイスでは、前記台座の主面には、凹部が設けられ、前記第１の基板は、前記凹部の周縁に固定されていることを特徴とする。また、前記第１の電子部品は、前記第１の基板の前記凹部がある面側に配置されていることを特徴とする。
これにより、電子デバイスの小型化をさらに図ることができる。
In the electronic device of the present invention , a concave portion is provided on the main surface of the pedestal, and the first substrate is fixed to a peripheral edge of the concave portion. Further, the first electronic component is arranged on a surface side of the first substrate where the concave portion is present.
Thereby, the electronic device can be further reduced in size.
本発明の電子デバイスでは、前記凹部には、充填剤が充填されていることが好ましい。
これにより、第１の基板に不要な振動が発生するのを効果的に防止することができるため、電子デバイスの精度が向上する。
本発明の電子デバイスでは、前記第１の基板と前記第２の基板とは、平面視で互いに少なくとも一部が重なっていることを特徴とする。
これにより、電子デバイスの小型化をさらに図ることができる。
In the electronic device of the present invention, the concave portion is preferably filled with a filler.
Accordingly, unnecessary vibration can be effectively prevented from occurring on the first substrate , so that the accuracy of the electronic device is improved.
In the electronic device of the present invention, the first substrate and the second substrate are at least partially overlapped with each other in plan view .
Thereby, the electronic device can be further reduced in size.
本発明の電子デバイスでは、前記蓋部材は、凹部を有し、前記凹部には、前記第２の基板が収容されることが好ましい。
これにより、電子デバイスの小型化をさらに図ることができる。
本発明の電子デバイスでは、前記第１の基板および前記第２の基板の一方の基板には、アナログ回路が設けられ、他方の基板には、デジタル回路が設けられていることが好ましい。
これにより、アナログ回路からデジタル回路へのノイズの伝達をより効果的に防止することができ、電子デバイスの特性が向上する。
In the electronic device of the present invention, it is preferable that the lid member has a recess, and the second substrate is accommodated in the recess.
Thereby, the electronic device can be further reduced in size.
In the electronic device of the present invention, it is preferable that an analog circuit is provided on one of the first substrate and the second substrate, and a digital circuit is provided on the other substrate.
Thereby, transmission of noise from the analog circuit to the digital circuit can be more effectively prevented, and the characteristics of the electronic device are improved.
本発明の電子デバイスでは、前記台座または前記蓋部材には、出力用コネクターが設けられていることが好ましい。
これにより、信号の出力が容易となる。
In the electronic device of the present invention, it is preferable that an output connector is provided on the pedestal or the lid member .
This facilitates signal output.
Claims (12)
第２の電子部品を備えた第２の基板を搭載し、且つ前記台座に固定された蓋部材と、を備え、Mounting a second substrate including a second electronic component, and a lid member fixed to the pedestal,
前記第１の基板と前記第２の基板とは、接続部材で互いに接続されていることを特徴とする電子デバイス。The electronic device, wherein the first substrate and the second substrate are connected to each other by a connecting member.
前記第３の基板は、前記台座に搭載されていることを特徴とする請求項１または２に記載の電子デバイス。 The electronic device according to claim 1, wherein the third substrate is mounted on the pedestal.
前記第１の基板は、前記凹部の周縁に固定されていることを特徴とする請求項１ないし４のいずれか一項に記載の電子デバイス。 Major surface of the pedestal has a recess,
The electronic device according to claim 1, wherein the first substrate is fixed to a peripheral edge of the recess .
前記凹部には、前記第２の基板が収容される請求項１ないし８のいずれか一項に記載の電子デバイス。 The lid member has a recess,
The electronic device according to claim 1, wherein the second substrate is accommodated in the recess .
他方の基板には、デジタル回路が設けられている請求項１ないし９のいずれか一項に記載の電子デバイス。 One of the first substrate and the second substrate is provided with an analog circuit,
The electronic device according to claim 1, wherein a digital circuit is provided on the other substrate .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011152732A JP5919662B2 (en) | 2011-07-11 | 2011-07-11 | Electronic devices and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011152732A JP5919662B2 (en) | 2011-07-11 | 2011-07-11 | Electronic devices and electronic equipment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013019746A JP2013019746A (en) | 2013-01-31 |
| JP2013019746A5 true JP2013019746A5 (en) | 2014-08-21 |
| JP5919662B2 JP5919662B2 (en) | 2016-05-18 |
Family
ID=47691327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011152732A Expired - Fee Related JP5919662B2 (en) | 2011-07-11 | 2011-07-11 | Electronic devices and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5919662B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6136402B2 (en) * | 2013-03-15 | 2017-05-31 | セイコーエプソン株式会社 | Sensor unit, electronic device, and moving object |
| EP3171131A4 (en) | 2014-07-16 | 2018-03-07 | Seiko Epson Corporation | Sensor unit, electronic apparatus, and mobile body |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2582856Y2 (en) * | 1992-04-09 | 1998-10-15 | 株式会社ユニシアジェックス | Acceleration sensor |
| JPH07306047A (en) * | 1994-05-10 | 1995-11-21 | Murata Mfg Co Ltd | Multi-axial detection type vibration gyro |
| JP3605877B2 (en) * | 1995-03-30 | 2004-12-22 | アイシン精機株式会社 | Angular velocity sensor unit |
| JP2000258450A (en) * | 1999-03-09 | 2000-09-22 | Matsushita Electric Ind Co Ltd | Acceleration sensor |
| JP3896787B2 (en) * | 2000-11-10 | 2007-03-22 | 松下電工株式会社 | Lighting control device |
| JP2003028892A (en) * | 2001-07-16 | 2003-01-29 | Matsushita Electric Works Ltd | Acceleration sensor |
| JP4033058B2 (en) * | 2003-06-30 | 2008-01-16 | 松下電工株式会社 | Acceleration sensor |
| JP2008082812A (en) * | 2006-09-27 | 2008-04-10 | Denso Corp | Sensor device and its manufacturing method |
| US8100010B2 (en) * | 2008-04-14 | 2012-01-24 | Honeywell International Inc. | Method and system for forming an electronic assembly having inertial sensors mounted thereto |
| JP2010220791A (en) * | 2009-03-24 | 2010-10-07 | Fujifilm Corp | Ultrasonic probe and ultrasonic diagnostic apparatus |
| US8703543B2 (en) * | 2009-07-14 | 2014-04-22 | Honeywell International Inc. | Vertical sensor assembly method |
-
2011
- 2011-07-11 JP JP2011152732A patent/JP5919662B2/en not_active Expired - Fee Related
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