JP2012229484A - 薄膜蒸着用のマスクフレームアセンブリー - Google Patents
薄膜蒸着用のマスクフレームアセンブリー Download PDFInfo
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- 238000000427 thin-film deposition Methods 0.000 title claims abstract description 28
- 238000007740 vapor deposition Methods 0.000 claims abstract description 82
- 238000000151 deposition Methods 0.000 claims abstract description 67
- 230000008021 deposition Effects 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 238000005530 etching Methods 0.000 claims description 21
- 230000002265 prevention Effects 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 30
- 239000010408 film Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 16
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000011218 segmentation Effects 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 4
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Inorganic materials [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000000844 transformation Methods 0.000 description 2
- YOZHUJDVYMRYDM-UHFFFAOYSA-N 4-(4-anilinophenyl)-3-naphthalen-1-yl-n-phenylaniline Chemical compound C=1C=C(C=2C(=CC(NC=3C=CC=CC=3)=CC=2)C=2C3=CC=CC=C3C=CC=2)C=CC=1NC1=CC=CC=C1 YOZHUJDVYMRYDM-UHFFFAOYSA-N 0.000 description 1
- MBPCKEZNJVJYTC-UHFFFAOYSA-N 4-[4-(n-phenylanilino)phenyl]aniline Chemical compound C1=CC(N)=CC=C1C1=CC=C(N(C=2C=CC=CC=2)C=2C=CC=CC=2)C=C1 MBPCKEZNJVJYTC-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- -1 acryl Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- 238000005323 electroforming Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
- B05C21/005—Masking devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
- C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
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- Chemical Kinetics & Catalysis (AREA)
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- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
【解決手段】蒸着用基板に蒸着しようとする素材を蒸着するためのものであって、開口部が形成され、開口部を取り囲む複数のフレームが互いに連結されたマスクフレーム;マスクフレーム上に結合されるマスク;を備えるが、マスクの少なくとも一領域には変形防止部が形成されたものであって、マスクの蒸着用パターン部の周辺部に変形防止部が形成されることで、マスクの垂直方向の変形を低減させることができる。これにより、基板へのマスクの密着不良を最小化する。
【選択図】図1
Description
さらに詳細に説明すれば、次の通りである。
図3は、図2の分割マスク120の一変形例を示したものである。
図4は、図2の分割マスクの他の変形例を示したものである。
図10は、図7の分割マスク710の変形例を示したものである。
前記画素電極1213は、透明電極または反射型電極として備えられる。
前記対向電極1215も、透明電極または反射型電極として備えられる。
前記有機膜1214は、低分子または高分子有機膜が使われる。
111 第1フレーム
112 第2フレーム
113 第3フレーム
114 第4フレーム
115 開口部
120 分割マスク
130 マスク
140 基板
Claims (17)
- 開口部が形成され、前記開口部を取り囲むマスクフレームと、
前記マスクフレーム上に結合されるマスクと
を備え、
前記マスクの少なくとも一領域には変形防止部が形成された薄膜蒸着用のマスクフレームアセンブリー。 - 前記マスクには、長手方向に沿って蒸着用パターン部が離隔して形成され、隣接する蒸着用パターン部の間には、これらを互いに連結させるリブが形成され、
前記変形防止部は、前記リブに形成される第1ダミーパターン部である請求項1に記載の薄膜蒸着用のマスクフレームアセンブリー。 - 前記マスクには、前記蒸着用パターン部の幅方向の両エッジに第2ダミーパターン部がさらに形成された請求項2に記載の薄膜蒸着用のマスクフレームアセンブリー。
- 前記蒸着用パターン部、第1ダミーパターン部、及び第2ダミーパターン部は、ドット型のスリットパターンであるか、またはストリップ型のスリットパターンである請求項3に記載の薄膜蒸着用のマスクフレームアセンブリー。
- 前記マスクには、前記蒸着用パターン部の幅方向の両エッジにハーフエッチング部がさらに形成された請求項2に記載の薄膜蒸着用のマスクフレームアセンブリー。
- 前記ハーフエッチング部は、基板と対向するマスクの第1面と反対の第2面から、前記マスクの厚さを他の部分より薄く形成した請求項5に記載の薄膜蒸着用のマスクフレームアセンブリー。
- 前記第1面は、パターニングしようとする蒸着用基板への接触面である請求項6に記載の薄膜蒸着用のマスクフレームアセンブリー。
- 前記マスクには、長手方向に沿って蒸着用パターン部が離隔して形成され、隣接する蒸着用パターン部の間には、これらを互いに連結させるリブが形成され、
前記変形防止部は、前記リブに形成される第1ハーフエッチング部である請求項1に記載の薄膜蒸着用のマスクフレームアセンブリー。 - 前記第1ハーフエッチング部は、前記リブの両側から前記マスクのエッジに延びた請求項8に記載の薄膜蒸着用のマスクフレームアセンブリー。
- 前記第1ハーフエッチング部は、基板と対向するマスクの第1面と反対の第2面から、前記マスクの厚さを他の部分より薄く形成した請求項9に記載の薄膜蒸着用のマスクフレームアセンブリー。
- 前記マスクには、前記蒸着用パターン部の幅方向の両エッジに第2ハーフエッチング部がさらに形成された請求項8に記載の薄膜蒸着用のマスクフレームアセンブリー。
- 前記第1ハーフエッチング部と、第2ハーフエッチング部とは、基板と対向するマスクの第1面と反対の第2面から、前記マスクの厚さを他の部分より薄く形成した請求項11に記載の薄膜蒸着用のマスクフレームアセンブリー。
- 前記第1面は、パターニングしようとする蒸着用基板への接触面である請求項12に記載の薄膜蒸着用のマスクフレームアセンブリー。
- 前記マスクの両端は、引張力が印加された状態で対向して配されたフレームに溶接された請求項1に記載の薄膜蒸着用のマスクフレームアセンブリー。
- 前記マスクフレームは、一方向に互いに対向して配された複数の第1フレームと、他方向に互いに対向して配された複数の第2フレームとを備え、
前記複数の第1フレームと複数の第2フレームとは互いに連結されて、開口部を取り囲むように形成された請求項1に記載の薄膜蒸着用のマスクフレームアセンブリー。 - 前記マスクは、複数の第1フレームと平行な方向に固設され、複数の第2フレームに連続的に配列された請求項14に記載の薄膜蒸着用のマスクフレームアセンブリー。
- 前記マスクは、前記マスクフレームの開口部を横切って一方向に配された少なくとも一つの分割マスクを備える請求項1に記載の薄膜蒸着用のマスクフレームアセンブリー。
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KR10-2011-0038438 | 2011-04-25 | ||
KR1020110038438A KR101820020B1 (ko) | 2011-04-25 | 2011-04-25 | 박막 증착용 마스크 프레임 어셈블리 |
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Cited By (11)
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JP2014133934A (ja) * | 2013-01-11 | 2014-07-24 | Dainippon Printing Co Ltd | 蒸着マスクの製造方法および蒸着マスク |
JP2015010263A (ja) * | 2013-06-28 | 2015-01-19 | 大日本印刷株式会社 | 金属フレーム付き蒸着マスクの製造方法、有機半導体素子の製造方法 |
JP2015127441A (ja) * | 2013-12-27 | 2015-07-09 | 大日本印刷株式会社 | 蒸着マスク装置の製造方法 |
WO2018051443A1 (ja) * | 2016-09-14 | 2018-03-22 | シャープ株式会社 | マスクシート、蒸着マスク、表示パネルの製造方法 |
JP2019504360A (ja) * | 2016-02-03 | 2019-02-14 | 昆山工研院新型平板顕示技術中心有限公司Kunshan New Flat Panel Display Technology Center Co., Ltd. | 画素配列構造、蒸着マスク及びプロファイル表示画面 |
KR20190046536A (ko) * | 2017-10-26 | 2019-05-07 | 주식회사 엘지화학 | 연배열 인쇄회로 기판 및 금속 마스크 |
WO2019167115A1 (ja) * | 2018-02-27 | 2019-09-06 | シャープ株式会社 | 成膜用マスク及びそれを用いた表示装置の製造方法 |
WO2019180846A1 (ja) * | 2018-03-20 | 2019-09-26 | シャープ株式会社 | 成膜用マスクおよびそれを用いた表示装置の製造方法 |
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JP2019529707A (ja) * | 2016-09-13 | 2019-10-17 | エルジー イノテック カンパニー リミテッド | 蒸着マスク用金属板、蒸着マスク及びその製造方法 |
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JP2019504360A (ja) * | 2016-02-03 | 2019-02-14 | 昆山工研院新型平板顕示技術中心有限公司Kunshan New Flat Panel Display Technology Center Co., Ltd. | 画素配列構造、蒸着マスク及びプロファイル表示画面 |
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Also Published As
Publication number | Publication date |
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JP6154572B2 (ja) | 2017-06-28 |
KR101820020B1 (ko) | 2018-01-19 |
CN102760842B (zh) | 2016-08-03 |
US20120266813A1 (en) | 2012-10-25 |
CN102760842A (zh) | 2012-10-31 |
US20150027367A1 (en) | 2015-01-29 |
US8881676B2 (en) | 2014-11-11 |
KR20120120703A (ko) | 2012-11-02 |
US9192959B2 (en) | 2015-11-24 |
TW201304233A (zh) | 2013-01-16 |
TWI546996B (zh) | 2016-08-21 |
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